Equipment for improving use efficiency of target material in plasma coating

Abstract

The invention belongs to the technical field of material coating, and discloses equipment for improving the use efficiency of a target material in a plasma coating, which comprises a coating furnace as a supporting structure of the whole equipment: a cathode body connected with the coating furnace; the cooling structure is connected to the coating furnace; the placing box is fixed on the coating furnace; the copper plate is connected to the placing box; the target material is connected to the placing box through the copper plate; a coil connected to the cathode body; the multi-channel time sequence power supply switching controller is connected to the coils, intermittent power-off control is carried out on the multiple coils through the multi-channel time sequence power supply switching controller, the ionization position can be flexibly changed, the limitation that the ionization position of traditional equipment is fixed is broken through, the evaporation surface area between the equipment and a target material is increased, and the evaporation efficiency is improved. Therefore, the usable area of the target material is increased, more target material surfaces participate in sputtering, and unutilized edge blind areas or bottom blind areas are reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of material coating, and in particular relates to a device for improving the utilization efficiency of a target material in a plasma coating. Background Art

[0002] Plasma coating technology plays an important role in many industrial applications, especially in the fields of electronics, aerospace and automobiles. This technology improves the performance of the substrate by placing the target material (target) in a high-energy plasma environment, transferring its atoms or molecules to the substrate to form a uniform coating.

[0003] Due to the shape of the target and the shape of the single coil on the back of the quadrangular target of the PVD coating furnace, during the sputtering process, a large number of target atoms or molecules in some areas are sputtered, while sputtering does not occur in other areas, resulting in low target utilization and thus causing the problem of target waste. Summary of the Invention

[0004] The present invention addresses the problem in the prior art that, during the sputtering process, a large amount of target atoms or molecules are sputtered in some areas, while sputtering does not occur in other areas, resulting in low target utilization and thus causing target waste. The present invention proposes the following technical solutions:

[0005] A device for improving the utilization efficiency of target materials in plasma coating, comprising: a coating furnace as a supporting structure for the entire device;

[0006] a cathode body connected to the coating furnace;

[0007] a cooling structure connected to the coating furnace;

[0008] A placement box is fixed to the coating furnace;

[0009] a copper plate connected to the placement box;

[0010] The target is connected to the placement box through the copper plate;

[0011] a coil connected to the cathode body;

[0012] A multi-channel sequential power switching controller is connected to the coil;

[0013] An AC power supply is connected to the multi-channel sequential power supply switching controller, and the AC power supply intermittently energizes / de-energizes the plurality of coils through the multi-channel sequential power supply switching controller;

[0014] The shielded heat dissipation structure includes: a mounting plate, an outer shielding cover, an inner shielding cover, a spoiler structure and a driving structure;

[0015] The mounting plate is connected to the coil, the outer shielding cover is connected to the mounting plate, the inner shielding cover is connected to the outer shielding cover, the spoiler structure is connected to the inner shielding cover, and the driving structure is connected to the mounting plate. The driving structure drives the inner shielding cover to rotate and allows the gas to flow between the inner shielding cover and the coil through the spoiler structure.

[0016] As a preferred embodiment of the above technical solution, the spoiler structure includes:

[0017] a rotating shaft connected to the inner shield;

[0018] a driving wheel connected to the rotating shaft;

[0019] The fan blades are connected to the outside of the rotating shaft and are symmetrically arranged along both sides of the driving wheel. The driving wheel drives the fan blades to rotate through the rotating shaft.

[0020] As a preferred embodiment of the above technical solution, the fan blades are symmetrically arranged along the center line of the driving wheel, and the fan blades located on both sides of the driving wheel have opposite directions.

[0021] As a preferred embodiment of the above technical solution, the driving structure includes:

[0022] a driving member connected to the mounting plate;

[0023] a magnetic member connected to the driving member;

[0024] a connecting plate connected to the magnetic member;

[0025] a round rod connected to the connecting plate;

[0026] a rotating block connected to the round rod;

[0027] The driving member drives the connecting plate to move via the magnetic member, and the connecting plate drives the rotating block to move via the round rod.

[0028] As a preferred embodiment of the above technical solution, the driving structure further includes:

[0029] A reset member, with two ends respectively connected to the connecting plate and the mounting plate;

[0030] The mounting cover is connected to the mounting plate, and the driving member is connected to the mounting plate through the mounting cover.

[0031] As a preferred embodiment of the above technical solution, the magnetic member is a permanent magnet, the driving member is an electromagnet, and the switching on and off of the electromagnet realizes the reciprocating movement of the connecting plate.

[0032] As a preferred embodiment of the above technical solution, the cooling structure includes a coolant circulation pipe, heat dissipation fins and a box body. The coolant circulation pipe and the heat dissipation fins are located inside the box body. The box body is fixed to the coating furnace. The coolant circulation pipe is S-shaped. The heat dissipation fins are arranged on the outside of the coolant circulation pipe. Connecting joints that pass through the coating furnace are respectively installed at both ends of the coolant circulation pipe.

[0033] As a preferred embodiment of the above technical solution, an inclined groove is provided inside the rotating block, the round rod is located inside the inclined groove, and the rotating block is driven to rotate through the inclined groove when the round rod is raised or lowered.

[0034] As a preferred embodiment of the above technical solution, the mounting plate is composed of a concave shielding plate and a convex cover plate, the concave shielding plate and the convex cover plate are fixed by screws, and the driving structure is located between the concave shielding plate and the convex cover plate.

[0035] The beneficial effects of the present invention are:

[0036] (1) By intermittently powering off multiple coils through a multi-channel sequential power switching controller, the ionization position can be flexibly changed, breaking the limitation of the fixed ionization position of traditional equipment, and increasing the evaporation surface area between the target material, thereby increasing the target material's usable area, allowing more target material surface to participate in sputtering, and reducing the unused "edge blind area" or "bottom blind area";

[0037] (2) Compared with the existing single electromagnetic shielding area, it can not only shield electromagnetic interference more comprehensively and effectively, but also achieve synchronous heat dissipation through the heat dissipation structure driven by the rotation of the inner shielding cover. The existing electromagnetic shielding area often only focuses on the shielding function and ignores the impact of the heat generated during the operation of the equipment on the performance, resulting in performance degradation or even failure of the equipment due to overheating after long-term operation. While this device can shield electromagnetic interference, it can dissipate the heat generated by the coil in time, ensuring the stable operation of the equipment and extending the service life of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 The figure shows a schematic structural diagram of a device for improving the utilization efficiency of target materials in plasma coating in Example 1;

[0039] Figure 2 The figure shows a schematic diagram of the installation structure of the multi-channel sequential power switching controller in Example 1;

[0040] Figure 3 The figure shows the installation structure diagram of the coil in Example 1;

[0041] Figure 4 The figure shows a schematic diagram of the installation structure of the rotating shaft in Example 1;

[0042] Figure 5 Shown is a cross-sectional view of the outer shielding cover in Example 1;

[0043] Figure 6 FIG. 1 shows a schematic diagram of the installation structure of the inner shielding cover in Example 1;

[0044] Figure 7 Shown is Figure 6 Schematic diagram of the structure of area A;

[0045] Figure 8 The figure shows the installation structure diagram of the reset member in Example 1.

[0046] In the figure: 1. Coating furnace; 2. Cathode body; 3. Cooling structure; 4. Placement box; 5. Copper plate; 6. Target material; 7. Coil; 8. Protective cover; 9. Multi-channel timing power switching controller; 10. AC power supply; 111. Mounting plate; 112. Outer shielding cover; 113. Inner shielding cover; 114. Rotating shaft; 115. Driving wheel; 116. Fan blade; 117. Groove; 118. Mounting cover; 119. Driving part; 120. Magnetic part; 121. Connecting plate; 122. Reset part; 123. Round rod; 124. Rotating block. DETAILED DESCRIPTION

[0047] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0048] Example 1

[0049] The present invention provides a device for improving the utilization efficiency of target materials in plasma coating, such as Figures 1 to 8As shown, it includes: a coating furnace 1, a cathode body 2, a cooling structure 3, a placement box 4, a copper plate 5, a target material 6, a coil 7, a multi-channel sequential power supply switching controller 9, an AC power supply 10 and a shielded heat dissipation structure; the coating furnace 1 serves as the supporting structure of the entire equipment: the cathode body 2 is connected to the coating furnace 1; the cooling structure 3 is connected to the coating furnace 1; the placement box 4 is fixed to the coating furnace 1; the copper plate 5 is connected to the placement box 4; the target material 6 is connected to the placement box 4 through the copper plate 5; the coil 7 is connected to the cathode body 2; the multi-channel sequential power supply switching controller 9 is connected to the coil 7; the AC power supply 10 is connected to the multi-channel sequential power supply switching controller 9. The AC power supply 10 intermittently powers on / off the multiple coils 7 through the multi-channel timing power switching controller 9; the shielding and heat dissipation structure includes: a mounting plate 111, an outer shielding cover 112, an inner shielding cover 113, a spoiler structure and a driving structure; the mounting plate 111 is connected to the coil 7, the outer shielding cover 112 is connected to the mounting plate 111, the inner shielding cover 113 is connected to the outer shielding cover 112, the spoiler structure is connected to the inner shielding cover 113, and the driving structure is connected to the mounting plate 111. The driving structure drives the inner shielding cover 113 to rotate and causes the gas to flow between the inner shielding cover 113 and the coil 7 through the spoiler structure.

[0050] Due to the shape of the target material 6 and the shape of the single coil 7 on the back, during the sputtering process, atoms or molecules of the target material 6 in some areas are sputtered in large quantities, while sputtering does not occur in other areas, resulting in low utilization of the target material 6, thereby causing the problem of waste of the target material 6 (the utilization rate of the target material 6 of a single coil 7 is 7% to 12%). For this reason, multiple coils 7 are set up, and the evaporation surface area between the multiple coils 7 and the target material 6 is increased, thereby increasing the use area of ​​the target material 6, allowing more target material 6 surface to participate in sputtering, and reducing the unused "edge blind area" or "Bottom blind area" (the utilization rate of the target material 6 of multiple coils 7 is 15% to 18%), and because multiple coils 7 are prone to arc generation of ions outside the target material 6 when used at the same time, the AC power supply 10 intermittently cuts off the power to the multiple coils 7 in sequence through the multi-channel timing power switching controller 9 (for example, the first coil 7 is energized, the remaining coils 7 are de-energized, and then the second is energized, the remaining coils 7 are de-energized, and so on), thereby making the ionization position irregular, thereby preventing the arc from generating ions outside the target material 6, and being able to induce uniform ionization over a large area.

[0051] During use, the target material 6 is installed and fixed in the placement box 4 and corresponds to the copper plate 5. Then the interior of the coating furnace 1 is vacuumed to remove impurity gases such as air, create a high vacuum environment, and prevent gas molecules from interfering with the sputtering process and the quality of the film. Then, an appropriate amount of inert gas such as argon is introduced into the coating furnace 1 as a working gas to provide necessary conditions for the sputtering process. The AC power supply 10 supplies power to the coil 7 through the multi-channel timing power switching controller 9. The coil 7 generates a magnetic field. Under the principle of magnetron sputtering, the magnetic field and the electric field interact to constrain the electron motion trajectory, causing the electrons to perform spiral motion near the surface of the target material 6, increasing the probability of collision between the electrons and the working gas argon atoms. The collision between the electrons and the argon atoms ionizes the argon atoms to produce argon ions Ar. + And secondary electrons, argon ions are accelerated under the action of the electric field and bombard the surface of the target material 6 at high speed. Due to the momentum transfer, the atoms or molecules on the surface of the target material 6 gain energy and are sputtered from the surface of the target material 6 to become sputtered particles. The sputtered target material 6 atoms or molecules move in all directions in a vacuum environment. Some particles will reach the surface of the workpiece to be coated, and deposit, condense and crystallize on the surface of the workpiece to gradually form the required coating. In the magnetron sputtering device, the target material 6 is connected to the cathode body 2 and together constitutes the cathode, which is the core area of ​​the entire sputtering process. The cathode body 2 conducts current to establish an electric field around the target material 6, and cooperates with the magnetic field generated by the coil 7 to achieve the charged particles such as The confinement and acceleration of electrons, argon ions, etc. under the action of the electric field, the copper plate 5 can ensure the stable conduction of current in the entire cathode system, reduce resistance loss, maintain the stability of the electric field, and provide a good electrical environment for the sputtering process. In addition, during the sputtering process, the heat generated by the target material 6 can be transferred away, playing a role in auxiliary heat dissipation. The cooling structure 3 takes away the heat generated by the target material 6 during the sputtering process through the circulating cooling water, so that the temperature of the target material 6 is maintained within a reasonable range. When the predetermined coating thickness or process time is reached, the power supply of the coil 7 is stopped, the working gas supply is turned off, the pressure in the coating furnace 1 is restored to normal pressure, the workpiece is taken out, and a coating preparation process is completed;

[0052] At that time, since the coil 7 generates an electromagnetic field when it is energized, it is necessary to shield the electromagnetic field. However, when the shielding cover is used for shielding, the shielding cover blocks the heat dissipation channel, making it difficult for the coil 7 to dissipate heat. Long-term operation will cause the coil 7 to overheat, which not only reduces the performance of the coil 7 and shortens its service life, but may also cause insulation layer damage, short circuit and other faults due to overheating, affecting the normal operation of the entire sputtering equipment, making the sputtering process stability worse, and affecting the sputtering uniformity of the target material 6, thereby reducing product quality. For this reason, a shielding layer is formed between the mounting plate 111, the outer shielding cover 112 and the inner shielding cover 113. During the power-on process, the driving structure is energized. When the driving structure is energized, it drives the inner shielding cover 113 to rotate, so that the holes on the outside of the inner shielding cover 113 and the outer shielding cover 112 correspond, causing external gas to enter the outside of the coil 7, and when the inner shielding cover 113 rotates, it drives the spoiler structure to operate. When the spoiler structure operates, the gas outside the coil 7 is stirred, so that the gas forms convection, which not only accelerates the heat dissipation process, but also allows the internal gas to exchange with the external gas.

[0053] Specifically, a cathode body 2 is installed inside the coating furnace 1, and a cooling structure 3 is installed at one end of the coating furnace 1. The cooling structure 3 includes a cooling liquid circulation pipe, heat dissipation fins and a box body. The cooling liquid circulation pipe and the heat dissipation fins are located inside the box body, and the box body is fixed to the coating furnace 1. The cooling liquid circulation pipe is S-shaped and located inside the box body. The heat dissipation fins are arranged on the outside of the cooling liquid circulation pipe. Connecting joints that penetrate the coating furnace 1 are respectively installed at both ends of the cooling liquid circulation pipe for connecting to an external water source so that water flows along the inside of the cooling liquid circulation pipe. A placement box 4 is fixedly installed at one end of the coating furnace 1, and a copper plate 5 is clamped and installed inside the placement box 4. A target material 6 is clamped and installed at one end of the copper plate 5. A protective cover 8 is installed at the other end of the coating furnace 1, and a plurality of coils 7 are installed inside the protective cover 8 (the number of coils 7 is set to four in this application), and a multi-channel timing power switching controller 9 is installed at the end of the protective cover 8 away from the coating furnace 1. The channel sequential power switching controller 9 is connected to the coil 7 through a wire, and one end of the multi-channel sequential power switching controller 9 is connected to the AC power supply 10 through a wire. A mounting plate 111 is installed inside the protective cover 8 at one end of the coil 7. An outer shielding cover 112 is installed at one end of the mounting plate 111 at the outer side of the coil 7. An inner shielding cover 113 is rotatably connected to one end of the mounting plate 111 at the inner position of the outer shielding cover 112. A convex ring is welded to one end of the inner shielding cover 113. A slide groove is provided inside the mounting plate 111 at the outer side of the convex ring. The convex ring is located inside the slide groove. The shape of the inner shielding cover 113 is concave. A spoiler structure is installed inside the inner shielding cover 113. A driving structure is installed inside the mounting plate 111. Multiple holes are provided inside the outer shielding cover 112 and the inner shielding cover 113 for gas flow. The maximum outer diameter of the mounting plate 111 is larger than the maximum outer diameter of the outer shielding cover 112 for gas flow.

[0054] like Figures 5 to 7 As shown, the driving structure includes: a mounting cover 118, a driving member 119, a magnetic member 120, a connecting plate 121, a reset member 122, a round rod 123 and a rotating block 124; the driving member 119 is connected to the mounting plate 111; the magnetic member 120 is connected to the driving member 119; the connecting plate 121 is connected to the magnetic member 120; the round rod 123 is connected to the connecting plate 121; the rotating block 124 is connected to the round rod 123; the driving member 119 drives the connecting plate 121 to move through the magnetic member 120, and the connecting plate 121 drives the rotating block 124 to move through the round rod 123; the two ends of the reset member 122 are respectively connected to the connecting plate 121 and the mounting plate 111; the mounting cover 118 is connected to the mounting plate 111, and the driving member 119 is connected to the mounting plate 111 through the mounting cover 118.

[0055] Since the driving structure is used to rotate the inner shielding cover 113, the inner shielding cover 113 needs to be reset after rotation. For this purpose, a reset member 122 is provided. The inner shielding cover 113 is reset under the action of the reset member 122, so that the inner shielding cover 113 and the outer shielding cover 112 are in an alternating open and closed state, so that when the coil 7 is energized, the inner shielding cover 113 and the outer shielding cover 112 are closed to shield the magnetic field outside the coil 7, and when the coil 7 is de-energized, the inner shielding cover 113 and the outer shielding cover 112 are opened and closed to allow external gas to enter the outside of the coil 7.

[0056] During use, the multi-channel sequential power switching controller 9 supplies power to the driving member 119, causing the driving member 119 to generate magnetism. When the driving member 119 generates magnetism, the magnetic poles of the opposite surfaces of the magnetic member 120 are opposite (N / N or S / S). At this time, the magnetic member 120 is driven to move under the action of the repulsive force of the same charges. When the magnetic member 120 moves, it drives the connecting plate 121 to move. When the connecting plate 121 moves, it drives the round rod 123 to move. When the round rod 123 moves, it drives the rotating block 124 to move through the inclined groove. Since the rotating block 124 is connected to the inner shielding cover 113, the inner shielding cover 113 and the mounting plate 111 are rotationally connected. As the round rod 123 rises along the inside of the inclined groove, it drives the inner shielding cover 113 to rotate through the rotating block 124, so that the holes of the inner shielding cover 113 and the outer shielding cover 112 coincide with each other. At the same time, the connecting plate 121 drives the reset member 122 to stretch.

[0057] When the power is off, the reset member 122 is reset, and the reset member 122 drives the connecting plate 121 to reset. At this time, the above process is reversed, so that the holes of the inner shielding cover 113 and the outer shielding cover 112 are staggered, and then the outside air enters the outside of the coil 7, thereby achieving the purpose of heat dissipation of the coil 7.

[0058] Specifically, the mounting plate 111 is composed of a concave shielding plate and a convex cover plate, the concave shielding plate and the convex cover plate are fixed by screws, the driving structure is located between the concave shielding plate and the convex cover plate, a mounting cover 118 is welded on the top of the convex cover plate of the mounting plate 111, a driving member 119 is fixedly installed inside the mounting cover 118, a magnetic member 120 is slidably connected to the top position of the driving member 119 inside the mounting cover 118, a connecting plate 121 is clamped and installed on the top of the magnetic member 120, and the bottom of the outer surface of the connecting plate 121 is connected to the convex cover plate. Four reset parts 122 are clamped and installed between the top of the shaped cover plates, and multiple round rods 123 are embedded and installed on the outside of the connecting plate 121. A rotating block 124 is sleeved on the outside of the round rod 123. An inclined groove is provided inside the rotating block 124. The round rod 123 is located inside the inclined groove. When the round rod 123 is raised or lowered, the rotating block 124 is driven to rotate through the inclined groove. A groove 117 is provided inside the mounting plate 111 at a position corresponding to the outer side of the round rod 123. The groove 117 limits the round rod 123 so that the round rod 123 can only move up and down.

[0059] In this application, the magnetic part 120 is a permanent magnet, the driving part 119 is an electromagnet, and the on and off of the electromagnet realizes the reciprocating movement of the connecting plate 121. The reset part 122 is an elastic telescopic structure, specifically a spring telescopic rod and an electromagnetic shielding coating is provided on the outside, and the electromagnetic shielding coating is specifically a powdered electromagnetic shielding coating.

[0060] like Figures 4 to 8 As shown, the spoiler structure includes: a rotating shaft 114, a driving wheel 115 and fan blades 116; the rotating shaft 114 is connected to the inner shielding cover 113; the driving wheel 115 is connected to the rotating shaft 114; the fan blades 116 are connected to the outside of the rotating shaft 114 and are symmetrically arranged along both sides of the driving wheel 115, and the driving wheel 115 drives the fan blades 116 to rotate through the rotating shaft 114.

[0061] During use, the rotation of the inner shielding cover 113 drives the rotating shaft 114 to move. At this time, the driving wheel 115 and the outer side of the coil 7 are in contact, and the driving wheel 115 drives the rotating shaft 114 to rotate through friction. When the rotating shaft 114 rotates, it drives the fan blades 116 to rotate. Since the fan blades 116 on both sides of the driving wheel 115 have opposite directions of blades, although the rotation directions of the fan blades 116 on both sides are the same (both clockwise), due to the opposite bending directions of the blades, the pushing directions of the fluid by the fan blades 116 on both sides are also opposite. When the fan blades 116 on both sides rotate in the same direction, they will generate fluid forces in opposite directions (relative flow / opposite flow), thereby accelerating the heat dissipation of the outside of the coil 7.

[0062] Specifically, the rotating shaft 114 is rotatably connected to the inside of the inner shielding cover 113 through a bearing, and a driving wheel 115 is installed in the middle of the outer surface of the rotating shaft 114 through a key clamp. Fan blades 116 are symmetrically installed on both sides of the outer surface of the rotating shaft 114. The fan blades 116 are symmetrically arranged along the center line of the driving wheel 115. The blades 116 located on both sides of the driving wheel 115 have opposite directions, so that the gases flow towards each other or flow in opposite directions.

[0063] Working Principle: In the plasma coating process, the target utilization efficiency equipment works as follows: First, the target 6 is firmly fixed in the placement box 4 and precisely aligned with the copper plate 5. Then, the interior of the coating furnace 1 is evacuated to remove impurities such as air, thereby creating a high vacuum environment. This prevents gas molecules from interfering with the sputtering process and ensures that the film quality is not affected. Next, an appropriate amount of inert gas (such as argon) is introduced into the coating furnace 1 as the working gas to provide the necessary conditions for the sputtering process.

[0064] At this time, the AC power supply 10 supplies power to the coil 7 through the multi-channel timing power switching controller 9. The coil 7 generates a magnetic field. Under the principle of magnetron sputtering, the magnetic field and the electric field interact with each other, effectively constraining the electron motion trajectory, causing the electrons to do spiral motion near the surface of the target material 6, significantly increasing the probability of collision between the electrons and the working gas argon atoms. After the electrons collide with the argon atoms, the argon atoms are ionized to produce argon ions Ar. + The secondary electrons and argon ions are accelerated under the action of the electric field and bombard the surface of the target material 6 at high speed. Through momentum transfer, the atoms or molecules on the surface of the target material 6 obtain enough energy and are sputtered from the surface of the target material 6 to become sputtered particles. The sputtered atoms or molecules of the target material 6 move in all directions in a vacuum environment. Some particles will reach the surface of the workpiece to be coated, and deposit, condense, and crystallize on the surface of the workpiece to gradually form the desired coating.

[0065] During the power-on process, the multi-channel sequential power switching controller 9 supplies power to the driving member 119, causing the driving member 119 to generate magnetism. When the driving member 119 generates magnetism, its opposite magnetic poles are the same as those of the magnetic member 120 (N / N or S / S). Under the action of the repulsive force of like poles, the magnetic member 120 is driven to move. When the magnetic member 120 moves, it drives the connecting plate 121 to move. When the connecting plate 121 moves, it drives the round rod 123 to move. When the round rod 123 moves, it drives the rotating block 124 to move through the inclined groove. Since the rotating block 124 is connected to the inner shielding cover 113, and the inner shielding cover 113 and the mounting plate 111 are rotatably connected, when the round rod 123 rises along the inside of the inclined groove, it drives the inner shielding cover 113 to rotate through the rotating block 124, so that the holes of the inner shielding cover 113 and the outer shielding cover 112 overlap, forming a shielding structure.

[0066] In addition, when the inner shield 113 rotates, it drives the rotating shaft 114 to move. At this time, the driving wheel 115 is in contact with the outer side of the coil 7. Through the friction force, the driving wheel 115 drives the rotating shaft 114 to rotate. When the rotating shaft 114 rotates, it drives the fan blades 116 to rotate. Since the blades 116 on both sides of the driving wheel 115 have opposite directions, although the rotation directions of the fan blades 116 on both sides are the same (both clockwise), due to the opposite bending directions of the blades, the pushing directions of the fluid by the fan blades 116 on both sides are also opposite. Therefore, when the fan blades 116 on both sides rotate in the same direction, they will generate opposite directions of fluid force (relative flow). The invention can accelerate the heat dissipation outside the coil 7 by rotating the inner shielding cover 113, thereby accelerating the heat dissipation outside the coil 7. Compared with the existing single electromagnetic shielding area, it can not only shield electromagnetic interference more comprehensively and effectively, but also realize synchronous heat dissipation through the heat dissipation structure driven by the rotation of the inner shielding cover 113. The existing electromagnetic shielding area often only focuses on the shielding function and ignores the impact of the heat generated during the operation of the equipment on the performance, resulting in performance degradation or even failure of the equipment due to overheating after long-term operation. While shielding electromagnetic interference, the present device promptly dissipates the heat generated by the coil 7, ensuring the stable operation of the equipment and extending the service life of the equipment.

[0067] In view of the fact that the number of coils 7 is set to be multiple, the AC power supply 10 intermittently cuts off the power to the multiple coils 7 in sequence through the multi-channel timing power switching controller 9. For example, the first coil 7 is energized first, and the other coils 7 are de-energized. Then the second coil 7 is energized, and the other coils 7 are de-energized, and so on. Such operation can make the ionization position irregular, thereby effectively preventing the arc from generating ions outside the target material 6, and can induce large-area uniform ionization. During the power-on process of each coil 7, the corresponding driving member 119 is connected to the power supply. The intermittent power-off control of the multiple coils 7 through the multi-channel timing power switching controller 9 can make the ionization position flexibly change, breaking the limitation of the fixed ionization position of traditional equipment, and increasing the evaporation surface area between the target material 6, thereby increasing the use area of ​​the target material 6, allowing more target material 6 surfaces to participate in sputtering, and reducing unused "edge blind areas" or "bottom blind areas".

[0068] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same.

Claims

1. A device for improving the utilization efficiency of target materials in plasma coating, characterized in that: include: The coating furnace (1) serves as the supporting structure of the entire equipment: a cathode body (2) connected to the coating furnace (1); A cooling structure (3) connected to the coating furnace (1); A placement box (4) is fixed to the coating furnace (1); A copper plate (5) connected to the placement box (4); A target material (6) is connected to the placement box (4) through the copper plate (5); A coil (7) connected to the cathode body (2); A multi-channel sequential power supply switching controller (9) is connected to the coil (7); An AC power supply (10) is connected to the multi-channel sequential power supply switching controller (9), and the AC power supply (10) intermittently energizes / de-energizes the plurality of coils (7) through the multi-channel sequential power supply switching controller (9); The shielding and heat dissipation structure comprises: a mounting plate (111), an outer shielding cover (112), an inner shielding cover (113), a spoiler structure and a driving structure; The mounting plate (111) is connected to the coil (7), the outer shielding cover (112) is connected to the mounting plate (111), the inner shielding cover (113) is connected to the outer shielding cover (112), the spoiler structure is connected to the inner shielding cover (113), and the driving structure is connected to the mounting plate (111). The driving structure drives the inner shielding cover (113) to rotate and causes the gas to flow between the inner shielding cover (113) and the coil (7) through the spoiler structure.

2. The device for improving the utilization efficiency of target materials in plasma coating according to claim 1, characterized in that: The spoiler structure includes: A rotating shaft (114) connected to the inner shielding cover (113); a driving wheel (115) connected to the rotating shaft (114); The fan blades (116) are connected to the outside of the rotating shaft (114) and are symmetrically arranged along both sides of the driving wheel (115). The driving wheel (115) drives the fan blades (116) to rotate through the rotating shaft (114).

3. The device for improving the utilization efficiency of target materials in plasma coating according to claim 2, characterized in that: The fan blades (116) are symmetrically arranged along the center line of the driving wheel (115), and the blade directions of the fan blades (116) located on both sides of the driving wheel (115) are opposite.

4. The device for improving the utilization efficiency of target materials in plasma coating according to claim 1, characterized in that: The driving structure includes: A driving member (119) connected to the mounting plate (111); A magnetic member (120) connected to the driving member (119); A connecting plate (121) connected to the magnetic member (120); A round rod (123) connected to the connecting plate (121); A rotating block (124) connected to the round rod (123); The driving member (119) drives the connecting plate (121) to move via the magnetic member (120), and the connecting plate (121) drives the rotating block (124) to move via the round rod (123).

5. The device for improving the utilization efficiency of target materials in plasma coating according to claim 4, characterized in that: The driving structure further includes: A reset member (122), two ends of which are respectively connected to the connecting plate (121) and the mounting plate (111); The mounting cover (118) is connected to the mounting plate (111), and the driving member (119) is connected to the mounting plate (111) through the mounting cover (118).

6. The device for improving the utilization efficiency of target materials in plasma coating according to claim 4, characterized in that: The magnetic member (120) is a permanent magnet, and the driving member (119) is an electromagnet. The switching on and off of the electromagnet enables the reciprocating movement of the connecting plate (121).

7. The device for improving the utilization efficiency of target materials in plasma coating according to claim 1, characterized in that: The cooling structure (3) comprises a coolant circulation pipe, heat dissipation fins and a box body, wherein the coolant circulation pipe and the heat dissipation fins are located inside the box body, and the box body is fixed to the coating furnace (1). The coolant circulation pipe is S-shaped, and the heat dissipation fins are arranged outside the coolant circulation pipe. Connecting joints that pass through the coating furnace (1) are respectively installed at both ends of the coolant circulation pipe.

8. The device for improving the utilization efficiency of target materials in plasma coating according to claim 5, characterized in that: An inclined groove is provided inside the rotating block (124), and the round rod (123) is located inside the inclined groove. When the round rod (123) is lifted or lowered, it drives the rotating block (124) to rotate through the inclined groove.

9. The device for improving the utilization efficiency of target materials in plasma coating according to claim 1, characterized in that: The mounting plate (111) is composed of a concave shielding plate and a convex cover plate, the concave shielding plate and the convex cover plate are fixed by screws, and the driving structure is located between the concave shielding plate and the convex cover plate.

Images