Elastic assembly for modulating high-frequency oscillation characteristic

Abstract

The invention relates to the field of semiconductor power devices, and discloses an elastic assembly for modulating high-frequency oscillation characteristics, the elastic assembly comprises a short circuit board, a disc spring group, a transmitting polar plate and a sleeve, the surface of the transmitting polar plate is provided with a round hole, the round hole is used for installing the disc spring group, the disc spring group is installed between the short circuit board and the transmitting polar plate, and the sleeve is sleeved on the short circuit board. The sleeve is arranged at one end of the connecting position of the disc spring sets and the short-circuit board in a sleeving mode, the multiple disc spring sets are in short circuit through the short-circuit board, the chip path is optimized, the parasitic path is remarkably shortened, the parasitic inductance is reduced, and therefore high-frequency oscillation is effectively restrained. The clamping grooves and the disc spring sets are consistent in number and are designed in a staggered mode, the assembling accuracy and efficiency are improved, the space is reasonably utilized, and the stability of the disc spring sets is guaranteed. In addition, contact between the flow deflectors is avoided through staggered installation, and mutual influence is reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor power devices, in particular to an elastic component for modulating high-frequency oscillation characteristics. Background Art

[0002] Power semiconductor devices are core components of power electronics systems and are widely used in power conversion, motor drives, and high-frequency switching. Press-fit power semiconductors, in particular, have attracted considerable attention due to their high power density, low on-resistance, and excellent heat dissipation. However, in practical applications, these devices can exhibit high-frequency oscillations when operating in their amplification region, severely impacting their performance and reliability.

[0003] When operating in the amplification region, press-fit power semiconductor devices can theoretically function as inverting amplifiers. However, due to internal parasitic parameters such as Miller capacitance and stray inductance, their actual operating state is complexly affected. These parasitic parameters are particularly significant under high-frequency operating conditions, providing additional paths for the feedback signal, thereby changing the system's dynamic behavior. When the feedback signal is phase shifted, the system's amplification factor may increase rather than decrease, leading to high-frequency oscillations. This oscillation not only distorts the output signal but can also damage the device itself and even affect the normal operation of the entire power electronics system.

[0004] Further analysis of the mechanism of high-frequency oscillation reveals that its root cause lies in the physical processes within the device. The formation and expansion of the space charge region is a critical step in the operation of power semiconductor devices. Under normal circumstances, the space charge region extends to the other PN junction, enabling effective charge recombination and current conduction or cutoff. However, under certain specific conditions, the space charge region fails to fully extend to the other PN junction, resulting in a failure to achieve normal discharge. In this case, the remaining ions in the N region, not recombined within the space charge region, are converted into carriers, forming so-called tail current carriers. These carriers flow within the device, further affecting its electrical characteristics. Furthermore, when the negative differential resistance exceeds the equivalent positive resistance in the resonant circuit, the system becomes unstable, triggering high-frequency oscillation. Parasitic capacitance and stray inductance form an LC oscillating circuit with the inductance and capacitance of the external circuit, further exacerbating the oscillation phenomenon.

[0005] Currently, the electrical path between the front side of a chip and another chip is long (i.e., the side where the solder buffer layer contacts the sleeve). The path from the front side of the chip must pass through the sleeve, then the conductive sheet, then the emitter board, then the conductive sheet, then the sleeve, and finally to the front side of the other chip. This long loop path results in high parasitic inductance, which can easily cause oscillation. Research on the mechanisms of high-frequency oscillation in press-fit power semiconductor devices and methods for suppressing it remains limited. Summary of the Invention

[0006] Therefore, the technical problem to be solved by the present invention is: how to effectively suppress the high-frequency oscillation phenomenon in power semiconductor devices.

[0007] The above technical problems are solved by the following technical solutions: The present invention proposes an elastic component for modulating high-frequency oscillation characteristics, which includes a short-circuit plate, a disc spring group, an emitter plate and a sleeve. A circular hole is opened on the surface of the emitter plate, and the circular hole is used for installing the disc spring group. The disc spring group is installed between the short-circuit plate and the emitter plate. The sleeve is sleeved on one end of the connection between the disc spring group and the short-circuit plate. Multiple groups of disc spring groups are short-circuited through the short-circuit plate. Compared with the traditional two-group chip path transmission method, the chip path is shortened to pass through the sleeve, the short-circuit plate and the sleeve to reach the other group of chips, shortening the parasitic path and thereby reducing the parasitic inductance of the loop, ultimately achieving the effect of suppressing high-frequency oscillation.

[0008] In a preferred embodiment of the elastic component for modulating high-frequency oscillation characteristics of the present invention: a card slot is provided on the surface of the short-circuit board, and a through hole is provided on the inner side of the card slot, and the through hole is used for the installation of the disc spring group. The design of the card slot can effectively limit the installed disc spring group to ensure the stability of the equipment after assembly.

[0009] In a preferred embodiment of the elastic component for modulating high-frequency oscillation characteristics of the present invention: the number of the slots is the same as the number of the disc spring groups, the slots are divided into horizontal and longitudinal openings, and the slots of two adjacent groups are staggered. By having the same number of slots as the disc spring groups, it can be ensured that the two are installed in a one-to-one correspondence. At the same time, the staggered design of the slots can effectively and reasonably utilize the space of the short-circuit board, and at the same time, the disc spring group that needs to be staggered installed can be adapted and connected to ensure the stability of the disc spring group.

[0010] In a preferred embodiment of the elastic component for modulating high-frequency oscillation characteristics described in the present invention: the disc spring group includes disc springs, guide rods and guide plates, the disc springs are stacked into a cylindrical shape, and the guide plates are clamped at both ends of the disc springs stacked into a cylindrical shape. While the disc springs are subjected to pressure, the elastic coefficient absorbs the dimensional tolerance of each crimped chip after welding, and can also absorb the thermal deformation caused by the heat generation of the chip, thereby ensuring that the pressure on each chip is consistent.

[0011] In a preferred embodiment of the elastic component for modulating high-frequency oscillation characteristics of the present invention: circular holes or grooves are opened on both sides of the guide plate, and the guide rod is inserted into the interior of the disc spring and the circular holes or grooves opened in the guide plate to connect the disc spring and the guide plate in series.

[0012] In a preferred embodiment of the elastic component for modulating high-frequency oscillation characteristics of the present invention: gaskets are placed at both ends of the disc springs stacked into a cylindrical shape, and the guide plate is clamped on the outside of the two groups of gaskets. The setting of the gasket can ensure stability during the crimping process and is used for pressure equalization to avoid linear contact between the disc spring and the bottom of the guide plate.

[0013] In a preferred embodiment of the elastic component for modulating high-frequency oscillation characteristics of the present invention: the guide plates are arranged in two groups, and the two groups of guide plates are staggered and clamped on the outside of the two groups of gaskets, and the side of the guide plates that is not in contact with the gaskets protrudes towards the end away from the disc spring. By respectively contacting and clamping the two groups of guide plates with the two groups of gaskets, the stability during the crimping process can be ensured, and the protruding guide plates ensure that they bend outward when deformation occurs during crimping to avoid contact with the disc spring.

[0014] In a preferred embodiment of the elastic component for modulating high-frequency oscillation characteristics of the present invention: the guide plate of the disc spring group is clamped in the clamping slot, and the adjacent disc spring groups are staggered according to the clamping slot. The staggered installation design can ensure that the protruding guide plates will not contact each other during the crimping process, and at the same time, the adjacent guide plates can be urged to move away from each other to reduce mutual influence.

[0015] The beneficial effects of the present invention are as follows: by short-circuiting multiple disc spring groups through a short-circuit plate, the chip path is optimized, the parasitic path is significantly shortened, and the parasitic inductance is reduced, thereby effectively suppressing high-frequency oscillations. The number of slots and disc spring groups is consistent and a staggered design is adopted, which not only improves the accuracy and efficiency of assembly, but also rationally utilizes space and ensures the stability of the disc spring group. In addition, the staggered installation avoids contact between the guide vanes and reduces mutual influence. The provision of the gasket further enhances the stability during the crimping process, achieves a pressure-equalizing effect, and avoids linear contact between the disc spring and the bottom of the guide vane. At the same time, the convex design of the guide vane bends outward during crimping to avoid contact with the disc spring, reducing mutual interference between components and improving the overall performance and reliability of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings of the embodiments of the present invention. Obviously, the drawings described below only relate to some embodiments of the present invention, and are not intended to limit the present invention.

[0017] Figure 1 Shown is a schematic diagram of the overall structure of the present invention.

[0018] Figure 2 The figure shows a front view of the overall structure of the short-circuit board of the present invention.

[0019] Figure 3A schematic diagram of the overall structure of the disc spring assembly of the present invention is shown.

[0020] Figure 4 A front structural schematic diagram of the disc spring assembly of the present invention is shown.

[0021] Figure 5 Shown is a schematic diagram of the overall installation process of the present invention.

[0022] Figure 6 A schematic diagram of the test oscillation waveform of the present invention is shown.

[0023] Figure 7 A schematic diagram of the test oscillation waveform of a traditional crimping module is shown. DETAILED DESCRIPTION

[0024] In order to enable those skilled in the art to better understand the present invention, the present invention is further described in detail below with reference to specific embodiments and the accompanying drawings.

[0025] The terms used in the present invention are those commonly used in the art in view of the functions of the present invention, but these terms may vary according to the intentions of those skilled in the art, precedents, or new technologies in the art. In addition, specific terms may be selected by the applicant, and in such cases, their detailed meanings will be described in the detailed description of the present invention. Therefore, the terms used in the specification should not be understood as simple names, but rather as the meanings of the terms and the overall description of the present invention.

[0026] Reference Figures 1 to 5 This embodiment provides an elastic component for modulating high-frequency oscillation characteristics, which includes a short-circuit plate 1, a disc spring group 2, an emitter plate 3, and a sleeve 4. A circular hole is opened on the surface of the emitter plate 3, and the circular hole is used to install the disc spring group 2. The disc spring group 2 is installed between the short-circuit plate 1 and the emitter plate 3. The sleeve 4 is sleeved on one end of the connection between the disc spring group 2 and the short-circuit plate 1. Multiple groups of disc spring groups 2 are short-circuited through the short-circuit plate 1. Compared with the traditional two-group chip path transmission method, the chip path is shortened to pass through the sleeve 4, the short-circuit plate 1, and the sleeve 4 to reach the other group of chips, shortening the parasitic path and thereby reducing the parasitic inductance of the loop, ultimately achieving the effect of suppressing high-frequency oscillation.

[0027] A slot 11 and a through hole 12 are provided on the surface of the short-circuit board 1. The through hole 12 is used for installing the disc spring group 2. The design of the slot 11 can effectively limit the installed disc spring group 2 to ensure the stability of the equipment after assembly.

[0028] The disc spring group 2 includes a disc spring 21, a guide rod 22 and a guide plate 23. The disc spring 21 is stacked into a cylindrical shape, and the guide plate 23 is clamped at both ends of the disc spring 21 stacked into a cylindrical shape. When the disc spring 21 is subjected to pressure, the elastic coefficient absorbs the dimensional tolerance of each crimped chip after welding, and can also absorb the thermal deformation caused by the heat of the chip, thereby ensuring that the pressure on each chip is consistent.

[0029] Circular holes or slots are formed on both sides of the guide plate 23 , and the guide rod 22 is inserted into the disc spring 21 and the circular holes or slots formed in the guide plate 23 to connect the disc spring 21 and the guide plate 23 in series.

[0030] By short-circuiting multiple disc spring groups 2 through the short-circuit plate 1, the traditional transmission method of the two groups of chip paths is changed. The chip path is optimized to reach the other group of chips only through the sleeve 4, the short-circuit plate 1 and the sleeve 4, thereby significantly shortening the parasitic path, reducing the parasitic inductance of the loop, and effectively suppressing high-frequency oscillations. Not only that, the parasitic inductance of the conductive structure of each chip branch remains consistent under the design of the short-circuit plate 1. In addition, the design of the card slot 11 effectively limits the installed disc spring group 2 to ensure the stability of the equipment after assembly. When the disc spring 21 is subjected to pressure, it absorbs the dimensional tolerance of the chip after welding and the thermal deformation caused by the heat of the chip through its elastic coefficient, thereby ensuring that the pressure on each chip is consistent, further improving the reliability and stability of the system.

[0031] As an example provided, Figures 1 to 4 The number of the card slots 11 is the same as the number of the disc spring groups 2. The card slots 11 are divided into horizontal and vertical openings, and the card slots 11 of the two adjacent groups are staggered. By having the same number of card slots 11 as the disc spring groups 2, it can be ensured that the two are installed in a one-to-one correspondence. At the same time, the staggered design of the card slots 11 can effectively and reasonably utilize the space of the short-circuit board 1, and at the same time, the disc spring groups 2 that need to be staggered installed can be adapted and connected to ensure the stability of the disc spring groups 2.

[0032] The guide plate 23 of the disc spring group 2 is clamped in the slot 11, and the adjacent disc spring groups 2 are staggered according to the slot 11. The staggered installation design can ensure that the protruding guide plates 23 will not contact each other during the crimping process, and at the same time, it can promote the adjacent guide plates 23 to move away from each other to reduce mutual influence.

[0033] This design ensures a one-to-one installation correspondence between the number of slots 11 and disc spring assemblies 2, thereby improving assembly accuracy and efficiency. Furthermore, the staggered design of the slots 11 not only rationally utilizes the space on the short-circuit board 1, avoiding wasted space, but also accommodates disc spring assemblies 2 that require staggered installation, ensuring their stability through the snap-fit ​​action. Furthermore, the staggered installation design effectively prevents contact between the protruding guide vanes 23 during the crimping process, forcing adjacent guide vanes 23 to move away from each other, thereby reducing their mutual influence and further improving the performance and reliability of the entire system.

[0034] As an example provided, Figure 4 Gaskets 24 are placed at both ends of the disc springs 21 stacked into a cylindrical shape, and the guide plates 23 are clamped on the outside of the two sets of gaskets 24. The setting of the gaskets 24 can ensure stability during the crimping process and is used for pressure equalization to avoid line contact between the disc springs 21 and the bottom of the guide plates 23.

[0035] The guide plates 23 are arranged in two groups, and the two groups of guide plates 23 are staggered and clamped on the outside of the two groups of gaskets 24. The side of the guide plates 23 that is not in contact with the gasket 24 protrudes toward the end away from the disc spring 21. By respectively contacting and clamping the two groups of guide plates 23 with the two groups of gaskets 24, the stability during the crimping process can be ensured, and the protruding guide plates 23 ensure that they bend outward when deformation occurs during crimping to avoid contact with the disc spring 21.

[0036] By providing the gasket 24, structural stability is ensured during the crimping process, achieving a balanced pressure effect and preventing line contact between the disc spring 21 and the bottom of the guide vane 23, thereby protecting the components from excessive stress damage. Furthermore, by separately contacting and locking the two sets of guide vanes 23 with the two sets of gaskets 24, stability during the crimping process is further enhanced. Furthermore, the convex design of the guide vane 23 ensures that it bends outward when deformed during the crimping process, thereby avoiding contact with the disc spring 21 and effectively reducing mutual interference between components.

[0037] Finally, it should be pointed out that the methods and devices described in detail above are merely embodiments, and those skilled in the art can modify these embodiments in different ways without departing from the scope of the present invention.

Claims

1. An elastic component for modulating high-frequency oscillation characteristics, characterized in that: The invention comprises a short-circuit plate (1), a disc spring group (2), an emitter plate (3) and a sleeve (4); a circular hole is provided on the surface of the emitter plate (3); the circular hole is used for installing the disc spring group (2); the disc spring group (2) is installed between the short-circuit plate (1) and the emitter plate (3); and the sleeve (4) is sleeved on one end of the connection between the disc spring group (2) and the short-circuit plate (1).

2. The elastic component for modulating high-frequency oscillation characteristics according to claim 1, characterized in that: A slot (11) is provided on the surface of the short-circuit plate (1), and a through hole (12) is provided inside the slot (11). The through hole (12) is used for installing the disc spring assembly (2).

3. The elastic component for modulating high-frequency oscillation characteristics according to claim 2, characterized in that: The number of the slots (11) is the same as the number of the disc spring groups (2). The slots (11) are divided into horizontal opening and vertical opening, and the slots (11) of two adjacent groups are staggered.

4. The elastic component for modulating high-frequency oscillation characteristics according to claim 2 or 3, characterized in that: The disc spring assembly (2) comprises a disc spring (21), a guide rod (22) and a guide plate (23); the disc spring (21) is stacked into a cylindrical shape; and the guide plate (23) is clamped at both ends of the disc spring (21) stacked into a cylindrical shape.

5. The elastic component for modulating high-frequency oscillation characteristics according to claim 4, characterized in that: Circular holes or grooves are provided on both sides of the guide plate (23), and the guide rod (22) is inserted into the disc spring (21) and the circular holes or grooves provided in the guide plate (23) to connect the disc spring (21) and the guide plate (23) in series.

6. The elastic component for modulating high-frequency oscillation characteristics according to claim 5, characterized in that: Gaskets (24) are placed at both ends of the disc springs (21) stacked into a cylindrical shape, and the guide plates (23) are clamped on the outsides of the two groups of gaskets (24).

7. The elastic component for modulating high-frequency oscillation characteristics according to claim 6, characterized in that: The guide plates (23) are provided in two groups, and the two groups of guide plates (23) are staggered and clamped on the outsides of the two groups of gaskets (24), and the side of the guide plates (23) not in contact with the gaskets (24) protrudes toward the end away from the disc spring (21).

8. The elastic component for modulating high-frequency oscillation characteristics according to claim 6 or 7, characterized in that: The guide piece (23) of the disc spring group (2) is clamped in the clamping slot (11), and adjacent disc spring groups (2) are staggeredly installed according to the clamping slot (11).

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