A circuit board production process management and control method and system based on a multi-layer circuit

Abstract

The application discloses a kind of based on multilayer circuit's circuit board production process management and control method and system.Method includes establishing the interlayer transmission line parameter model of multilayer circuit board, electromagnetic field distribution is calculated based on deformation telegraph equation and parallel plate resonance effect;Transmission characteristic simulation verification is carried out;Optimize production environment parameters, select the area where electric field intensity is lower than 45% maximum value as wiring preferred area;Implementation layered wiring strategy, according to transmission matrix optimization interlayer wiring path;Dynamic monitoring production data, real-time acquisition temperature, humidity, electromagnetic radiation data, combined with transmission matrix correction value adjustment processing parameter.The method accurately predicts transmission characteristics, optimizes production environment parameters, effectively reduces the influence of external environment on the performance of circuit board, improves the stability and reliability of circuit board.Through the establishment of parameter model and simulation verification, the overall management and control of multilayer circuit board production process is realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of electronic manufacturing process, and particularly to a circuit board production process management and control method and system based on multi-layer circuit. BACKGROUND

[0002] In modern electronic industry, circuit board (PCB) as the basic component of electronic equipment, its production quality directly affects the performance and reliability of the final product. With the development of electronic equipment towards miniaturization and high performance, the design of circuit board tends to be multi-layered to meet the higher integration and more complex circuit design requirements. The production process management and control of multi-layer circuit board is the key link to ensure product quality, which involves material selection, lamination, drilling, copper plating, pattern transfer, etching, surface treatment and other complex steps. The traditional production process management and control method mainly depends on manual experience judgment and simple detection equipment, which is difficult to realize accurate control and real-time monitoring of the whole production process, which limits the improvement of production efficiency and product quality to some extent.

[0003] With the development of automation and information technology, some advanced production process management and control systems have been applied in the field of circuit board manufacturing. These systems integrate sensors, actuators and computer control systems to realize automation and partial intelligence of the production process. However, the existing control systems often focus on the optimization of single production link, lack of monitoring and analysis ability of the whole production process. In addition, the complexity and variability of multi-layer circuit board production process require the control system to process a large amount of data in real time and respond quickly to abnormal situations and adjust. At present, there is a lack of a control method and system that can comprehensively consider the characteristics of each link of multi-layer circuit board production, realize dynamic monitoring and intelligent decision support of the whole process.

[0004] At present, there are few technologies related to the production and control of multi-layer circuit board. Patent application with publication number CN108377617A discloses a multi-layer circuit board size expansion and contraction control method, which is applied to the field of circuit board production, especially to the size expansion and contraction control method of multi-layer circuit board. The complete product online operation process determination process is realized through the release program and abnormal processing process, so as to effectively reduce the difficulty of printed circuit board pattern size control, improve the production quality and production efficiency. The above scheme involves the control of circuit board pattern size, but it does not involve the transmission parameters, production environment and other aspects of multi-layer circuit board. In summary, the production and control technology of multi-layer circuit board needs further research, and it is particularly urgent to develop a circuit board production process management and control method and system based on multi-layer circuit. SUMMARY

[0005] The purpose of the present application is to overcome the deficiencies of the prior art, provide a circuit board production process management and control method and system based on multi-layer circuit, aiming to solve the problems of inaccurate transmission line transmission characteristic prediction, large influence of external environment on circuit board performance and other problems existing in the production process of multi-layer circuit board through scientific and rigorous steps.

[0006] The purpose of the present application is to overcome the deficiencies of the prior art, provide a circuit board production process management and control method and system based on multi-layer circuit, aiming to solve the problems of inaccurate transmission line transmission characteristic prediction, large influence of external environment on circuit board performance and other problems existing in the production process of multi-layer circuit board through scientific and rigorous steps.

[0007] A circuit board production process management and control method based on multi-layer circuit, comprising the following contents:

[0008] S1. Establishing an interlayer transmission line parameter model of multi-layer circuit board: based on the deformation telegraph equation under the action of external electromagnetic field, combining the parallel plate resonance effect between the power layer and the ground layer, calculating the electromagnetic field distribution of transmission lines of different heights, and generating a transmission matrix containing the height item of the transmission line;

[0009] S2. Transmission characteristic simulation verification:

[0010] S3. Optimizing production environment parameters: according to the simulation results, extracting the electric field intensity distribution under the resonance frequency, selecting the area with electric field intensity lower than 45% of the maximum value as the wiring optimization area, and adjusting the environmental temperature to 20-25 DEG C, the humidity to 30-50%, and the electromagnetic shielding layer thickness to be greater than or equal to 3mm;

[0011] S4. Implementing hierarchical wiring strategy: for single line, multi-line and differential line system, optimizing the interlayer wiring path according to the transmission matrix calculation results, and ensuring that the transmission line is close to the ground layer and the port is located in the low electric field intensity area;

[0012] S5. Dynamic monitoring of production data: real-time acquisition of temperature, humidity and electromagnetic radiation data in the processing area, and dynamic adjustment of processing parameters combined with transmission matrix correction value.

[0013] As a preferred mode, the transmission matrix expression is:

[0014]

[0015] Wherein:

[0016] For n X n Unit matrix, representing the ideal transmission characteristics of the transmission line without coupling;

[0017] For n X n Zero matrix, used to represent the case of no electric field or magnetic field coupling;

[0018] , , , (called K matrix) is the parallel plate electric field coupling coefficient matrix, both n × n Matrix, representing the electric field coupling relationship between the power layer and the ground layer; : Coupling of the input electric field to the input voltage (self-coupling). : Coupling of the electric field at the input to the current at the output (cross-port coupling). : Coupling of the output electric field to the input current (cross-port coupling). : Coupling of the output electric field to the output voltage (self-coupling).

[0019] is the transfer coefficient of the output voltage to the input voltage (voltage gain when there is no coupling). is the transfer coefficient of the output current to the input voltage (including impedance characteristics). is the transfer coefficient of the output voltage to the input current (including the admittance characteristics). is the transfer coefficient of the output current to the input current (current gain when there is no coupling). The voltage-current transmission characteristics of the transmission line itself are related to the length of the transmission line. Related.

[0020] For the The height of the transmission line from the ground plane, is the thickness of the parallel plate dielectric layer. It reflects the relative position of the transmission line in the interlayer structure. increases (the transmission line is close to the power layer), the electric field coupling effect is enhanced; when The K matrix represents the electric field coupling effect between the power layer and the ground layer, where

[0021] ,

[0022] ,

[0023] ,

[0024] ,

[0025] is the diagonal matrix of transmission line height terms, i.e. diag( . For the The vertical height of the transmission line to the ground plane, is 1, 2, ..., . The thickness of the parallel-plate dielectric layer between the power layer and the ground layer.

[0026] The transmission matrix is converted into an S parameter matrix, and the calculation formula is:

[0027] Wherein: is an impedance matrix, is a port characteristic impedance, is a unit matrix.

[0028] As a preferred mode, the construction of the distortion telegraph equation in S1 includes: taking the electromagnetic field generated by the parallel plate resonance as an external excitation source, modifying the transmission line voltage definition through the Agrawal model, and combining the equivalent voltage source / current source expression of the Taylor model to derive the cascade matrix of the interlayer transmission line.

[0029] As a preferred mode, the layered wiring strategy in S4 is specifically:

[0030] For a differential transmission line system, a dense layout with a physical port spacing ≤5mm is adopted;

[0031] For a single line system, the height of the transmission line from the ground layer is set to ≤1 / 3 of the thickness of the interlayer dielectric.

[0032] As a preferred mode, the dynamic adjustment of the processing parameters in S5 includes:

[0033] When the intensity of electromagnetic radiation is monitored to exceed the threshold value, the processing speed is automatically reduced and the real-time recalculation of the transmission matrix is triggered to update the wiring path planning.

[0034] As a preferred mode, it further includes: performing physical flow test on the completed circuit board, comparing the deviation of the simulated S parameters and the measured results, and if the deviation is >15%, marking it as an abnormal batch and tracing back the processing data.

[0035] As a preferred mode, the physical flow test includes: measuring the port reflection coefficient S 11 and the transmission coefficient S 21 through a vector network analyzer, and extracting the amplitude and phase deviation data of the resonance frequency point.

[0036] A circuit board production process management system based on a multi-layer circuit, comprising:

[0037] A modeling module for constructing an interlayer transmission line parameter model, generating a transmission matrix based on a distortion telegraph equation and a parallel plate resonance field;

[0038] A simulation module connected to the modeling module, converting the transmission matrix into an S parameter matrix and performing signal integrity and electromagnetic compatibility simulation;

[0039] Environment regulation module: receiving the output data of the simulation module, dynamically adjusting the temperature and humidity, electromagnetic shielding parameters and wiring optimization area of the processing area;

[0040] Wiring optimization module: generating a hierarchical wiring scheme according to the transmission matrix calculation result, controlling the differential line port spacing and single line layer height;

[0041] Production management module: real-time monitoring of processing data and feedback to the modeling module, triggering dynamic correction of the transmission matrix.

[0042] As a preferred mode, the modeling module specifically comprises:

[0043] Electric field calculation unit for solving the TM mode electric field distribution of the parallel plate resonant cavity;

[0044] Matrix generation unit, based on the coupling equation of Agrawal model and Taylor model, generates a transmission matrix containing height term .

[0045] As a preferred mode, when the production management module dynamically corrects the transmission matrix, the parameters are updated by the following formula:

[0046]

[0047] Where the matrix with the "'" symbol is the parameter corrected according to the real-time monitoring data.

[0048] The present application has at least the following beneficial effects: the circuit board production process control method based on multi-layer circuit, by establishing the interlayer transmission line parameter model of multi-layer circuit board, and based on the telegraph equation and parallel plate resonance effect for electromagnetic field distribution calculation, the transmission characteristics of the transmission line can be accurately predicted. By optimizing the production environment parameters, such as selecting the area with electric field intensity lower than 45% of the maximum value as the wiring optimization area, adjusting the environmental temperature, humidity and electromagnetic shielding layer thickness, etc., the influence of external environment on the performance of the circuit board is effectively reduced, and the stability and reliability of the circuit board are improved. BRIEF DESCRIPTION OF DRAWINGS

[0049] In order to reveal the technical details of the embodiments of the present application, the drawings involved in the embodiments will be briefly introduced. It should be emphasized that these drawings only present several embodiments of the present application, and should not be regarded as the limitation of the scope of the invention. For those skilled in the art, other related drawings can be derived based on these drawings without creative labor.

[0050] Figure 1 The flowchart of the first embodiment of the present application;

[0051] Figure 2 The transmission matrix expression;

[0052] Figure 3 Structure diagram of a circuit board production process management system. DETAILED DESCRIPTION

[0053] The technical solutions of the present application will be described in further detail below with reference to the accompanying drawings, but the scope of protection of the present application is not limited to the following description.

[0054] In the following, the embodiments of the present disclosure are described in detail with the help of the accompanying drawings. However, it should be made clear that the present disclosure is not limited to the specific forms shown here. On the contrary, it should be understood to cover various changes, equivalent forms and / or alternatives of the embodiments of the present disclosure. In the process of describing the accompanying drawings, the same reference signs will be used to indicate similar components.

[0055] It should be noted that although detailed specific details are provided in the following description, the purpose is to help a comprehensive understanding of the example embodiments. However, those skilled in the art should know that the example embodiments can also be implemented without these specific details. For example, the system can be shown in the form of a block diagram, the purpose of which is to avoid excessive details that interfere with the clarity of the examples. In some other cases, unnecessary details of well-known processes, structures and technologies can be omitted in order to maintain the clarity of the examples.

[0056] As shown in Figure 1 A circuit board production process management method based on multi-layer circuit, including the following contents:

[0057] S1. Establish the interlayer transmission line parameter model of the multi-layer circuit board: based on the deformation telegraph equation under the action of external electromagnetic field, combined with the parallel plate resonance effect between the power layer and the ground layer, calculate the electromagnetic field distribution of transmission lines of different heights, and generate a transmission matrix containing the height item of the transmission line;

[0058] S2. Perform transmission characteristic simulation verification;

[0059] S3. Optimize the production environment parameters: according to the simulation results, extract the electric field intensity distribution at the resonance frequency, select the area with electric field intensity lower than 45% of the maximum value as the wiring optimization area, and adjust the environmental temperature to 20-25℃, humidity to 30-50%, and electromagnetic shielding layer thickness≥3mm;

[0060] S4. Implement the layered wiring strategy: for single-line, multi-line and differential line systems, optimize the interlayer wiring path according to the transmission matrix calculation results, and ensure that the transmission line is close to the ground layer and the port is located in the low electric field intensity area;

[0061] S5. Dynamic monitoring of production data: real-time acquisition of temperature, humidity and electromagnetic radiation data in the processing area, and dynamic adjustment of processing parameters combined with the transmission matrix correction value;

[0062] S6. Waste water treatment and environmental management: detect the CODcr content of production wastewater, if it exceeds the standard, trigger the recycling process, and discharge after reaching the standard. Through waste water treatment and environmental management, the CODcr content of production wastewater is detected, and recycling is triggered to ensure that the wastewater is discharged after reaching the standard, which meets the environmental protection requirements, helps to protect the environment and sustainable development.

[0063] This embodiment can accurately calculate the electromagnetic field distribution of transmission lines of different heights by establishing the interlayer transmission line parameter model of the multilayer circuit board, combining the deformation telegraph equation under the action of external electromagnetic field and the parallel plate resonance effect, and generating the transmission matrix containing the transmission line height term, providing accurate data support for the subsequent steps. Through transmission characteristic simulation verification, problems in the design can be found and solved in time, avoiding the situation of rework or scrap in the actual production process, thereby improving the production efficiency. By optimizing the production environment parameters, selecting the region with electric field intensity lower than 45% of the maximum value as the wiring optimization region, and adjusting the environmental temperature, humidity and electromagnetic shielding layer thickness, the production quality of the circuit board can be ensured, and the stability and reliability of the product can be improved.

[0064] In a preferred embodiment, the transmission matrix expression (see Figure 2 ) is:

[0065]

[0066] Wherein:

[0067] is n × n unit matrix, representing the ideal transmission characteristics of the transmission line without coupling;

[0068] is n × n zero matrix, used to represent the case without electric field or magnetic field coupling;

[0069] , , , The parallel plate electric field coupling coefficient matrix (referred to as K matrix) is n × n matrix, representing the electric field coupling relationship between the power layer and the ground layer; : coupling of input end electric field to input end voltage (self-coupling). : coupling of input end electric field to output end current (cross-port coupling). : coupling of output end electric field to input end current (cross-port coupling). : Coupling of output end electric field to output end voltage (self-coupling).

[0070] : Transfer coefficient of output end voltage to input end voltage (voltage gain without coupling). : Transfer coefficient of output end current to input end voltage (including impedance characteristic). : Transfer coefficient of output end voltage to input end current (including admittance characteristic). : Transfer coefficient of output end current to input end current (current gain without coupling). Voltage-current transfer characteristic of transmission line itself, related to transmission line length : Basic cascade matrix , , , : Still determined by transmission line length and propagation characteristic.

[0071] For single transmission line, parameters of cascade matrix (ABCD matrix) , , , are related to transmission line length as follows:

[0072] For single transmission line, expression of cascade matrix is:

[0073]

[0074] where, is propagation constant is attenuation constant, is phase constant); is characteristic impedance; where, is unit length resistance, is unit length inductance, is unit length conductance, is capacitance (unit length capacitance), is angular frequency. At low frequency, resistance and conductance dominate, signal attenuation is significant; at high frequency, inductance and capacitance dominate, skin effect and dielectric loss are enhanced. is transmission line length. , represents phase delay and attenuation of voltage and current (hyperbolic cosine function); , represents coupling effect of impedance (hyperbolic sine function).

[0075] For n transmission lines, the cascade matrix expands to a block matrix:

[0076]

[0077] Each submatrix ( ) are Matrix, the specific expression is: , , , in: is the propagation constant in matrix form;

[0078] is the characteristic impedance matrix; are the resistance, inductance, conductance, and capacitance matrices per unit length respectively.

[0079] Parallel plate coupling correction: In multilayer circuit boards, the coupling effect of the external parallel plate resonant field is adjusted by adjusting the cascade matrix through the correction matrix K:

[0080]

[0081] For the The height of the transmission line from the ground plane, is the thickness of the parallel plate dielectric layer. It reflects the relative position of the transmission line in the interlayer structure. increases (the transmission line is close to the power layer), the electric field coupling effect is enhanced; when The K matrix represents the electric field coupling effect between the power layer and the ground layer, where

[0082] ,

[0083] ,

[0084] ,

[0085] ,

[0086] is the diagonal matrix of transmission line height terms, i.e. diag( . For the The vertical height of the transmission line to the ground plane, is 1, 2, ..., . is the thickness of the parallel plate dielectric layer between the power layer and the ground layer.

[0087] The transmission matrix is converted into an S parameter matrix, with the formula being:

[0088] wherein: Z is the impedance matrix, Zo is the port characteristic impedance (usually 50 Ω, all ports are assumed to be consistent), I is the identity matrix. Zo represents the superposition of the impedance matrix and the characteristic impedance, and after inversion, is multiplied by to obtain the scattering matrix S.

[0089] In one embodiment, the transmission characteristic simulation verification is to confirm the accuracy of the theoretical model (transmission matrix and S parameter) by simulation means, and to quantify the matching degree with the actual scene. The transmission matrix derived by theoretical derivation generates the impedance matrix , and the S parameter matrix is calculated by substituting the formula; it is checked whether the conversion process meets the matrix operation rules (such as the existence of inverse matrix, the consistency of dimensions); it is verified whether the symmetry of the S parameter (such as ) is established. The electric field intensity distribution under the parallel plate resonance effect is verified, and at the resonance frequency point (such as the resonance frequency of the TM mode), the electric field distribution is calculated by the transmission matrix. The electromagnetic field simulation results of the simulation software (such as HFSS, CST) are compared to ensure the consistency of the electric field intensity peak position and amplitude. It is checked whether the area with electric field intensity lower than 45% of the maximum value is consistent with the “wiring preferred area” predicted by the theory. The amplitude and phase characteristics of the S parameter are verified. The key parameters include the reflection coefficient S 11 (verify whether the input end reflection loss matches the theory) and the transmission coefficient S 21 (verify whether the signal attenuation and time delay are reasonable), and the crosstalk coefficient (verify the crosstalk level in the multi-line system), and the frequency domain simulation results of the commercial tool (such as ADS, SIwave) are compared. The time domain response consistency is verified by measuring the reflection waveform of the actual circuit board by the time domain reflectometer (TDR). In addition, it also includes the applicability verification of different transmission line configurations: single line system: verify the characteristics when the transmission line height changes (such as whether the crosstalk is reduced). Differential line system: verify the common mode rejection ratio (CMRR) when the physical port spacing changes. Hybrid system: signal isolation degree when differential line and single-ended line coexist. The verification method includes: adjusting the transmission line parameters (height, spacing), generating multiple sets of S parameters and comparing the simulation results, and analyzing the parameter change trend at the key frequency points (such as resonance frequency, signal bandwidth). Finally, the consistency between the theoretical model and the physical test can also be verified. The S parameters (such as S 11 and S 21). Extract the amplitude and phase data of the resonance frequency points, calculate the deviation from the theoretical value (if the deviation > 15%, mark the abnormality). Analyze the processing data of the abnormal batch, locate the source of the model error (such as material parameter error, insufficient coupling coefficient correction).

[0090] In a preferred embodiment, the construction of the modified telegraph equation in S1 includes: taking the electromagnetic field generated by parallel plate resonance as an external excitation source, modifying the transmission line voltage definition through the Agrawal model, and combining the equivalent voltage source / current source expression of the Taylor model to derive the cascade matrix of the interlayer transmission line. In a multi-layer circuit board, a structure similar to an "electromagnetic resonance cavity" is formed between the power layer and the ground layer. When the transmission line passes through this structure, the electromagnetic field generated by resonance will interfere with signal transmission. S1 is constructed by combining two models (Agrawal model and Taylor model) to accurately quantify this interference. The modified telegraph equation adds a coupling term of external electromagnetic field to the traditional equation, including the following modifications, voltage modification (Agrawal model): the component of the external electric field in the vertical direction of the transmission line will change the voltage definition, introducing an equivalent voltage source. Current correction (Taylor model): the external magnetic field generates an equivalent current source through mutual inductance effect. The modified equation is: , where and are the equivalent voltage source and current source caused by the external field, respectively.

[0091] The external excitation source modeling in this embodiment considers the electromagnetic field generated by the parallel plate resonance of the power layer and the ground layer as an external excitation source, similar to "background noise". In the voltage modification (Agrawal model), the traditional transmission line voltage only considers its own signal, while the Agrawal model introduces the influence of external electric field, modifies the voltage definition, and clearly shows how the external electromagnetic field "pushes up" or "pulls down" the transmission line voltage. Then combined with the equivalent circuit conversion (Taylor model): simplify the complex electromagnetic field coupling effect into equivalent voltage source and current source in the circuit, intuitively reflect the interference path of the resonance field to the transmission line. The present invention also introduces a height term, which dynamically adjusts the model parameters by quantifying the height ratio of the transmission line to the ground layer (such as line height / dielectric thickness), to adapt to complex routing scenarios with different interlayer heights. A mathematical model is constructed that contains both the characteristics of the transmission line itself and the external resonance effect, providing a theoretical basis for optimizing routing (such as avoiding high electric field regions), thereby improving signal integrity and anti-interference ability.

[0092] In a preferred embodiment, the layered routing strategy in S4 is: for a differential transmission line system, a dense layout with a physical port spacing ≤ 5 mm is adopted; for a single line system, the height of the transmission line to the ground layer is set to ≤ 1 / 3 of the interlayer dielectric thickness.

[0093] The dense layout of the differential transmission line system, in which two signal lines transmit signals in a complementary manner (positive-negative symmetry). Controlling the physical port spacing to ≤5mm in a compact layout can effectively reduce the signal loop area, reduce the sensitivity to electromagnetic radiation and external interference. Tight arrangement can also enhance the symmetry of the differential pair, reduce the generation of common mode noise, and improve the signal anti-interference ability. This design is especially suitable for high-speed signal transmission (such as USB, HDMI), which can avoid distortion caused by signal delay mismatch. The height control of the single line system between layers, for the single line system, the height of the transmission line from the ground layer needs to be ≤1 / 3 of the thickness of the interlayer medium. Wiring close to the ground layer can significantly reduce the strength of the electric field coupling between the transmission line and the power layer, reducing signal loss and crosstalk. At the same time, the shielding effect of the ground layer can suppress external electromagnetic field interference and improve signal integrity. This strategy optimizes the electric field distribution by placing the transmission line in a low-interference area, thus balancing signal stability and wiring space utilization.

[0094] In another embodiment, in a multi-layer circuit board design, the above-mentioned layered wiring strategy mainly targets single-line and differential-line systems for preliminary constraints, but in actual engineering, it also needs to deal with the influence of multi-line systems, high-frequency scenarios, and complex environments. This embodiment further improves signal integrity (SI) and electromagnetic compatibility (EMC). Multi-line system layout rules supplement, for non-differential multi-line systems (such as parallel single-ended line groups), the spacing between adjacent transmission lines needs to be controlled ≥3 times the line width. This rule reduces the inter-line coupling capacitance and suppresses crosstalk effects. At the same time, in multi-layer boards, the transmission lines of adjacent signal layers should be arranged orthogonally (perpendicular intersection) to avoid inter-layer electric field coupling caused by parallel wiring, thereby reducing signal attenuation and noise interference.

[0095] In addition, the refinement and dynamic adjustment of the differential line strategy, the physical port spacing of the differential line system needs to be controlled in a compact layout ≤5mm to enhance symmetry and reduce common mode noise. However, near the resonance frequency point (such as the TM mode resonance frequency), if the electric field strength exceeds 45% of the maximum value, the spacing can be locally relaxed to 8mm to avoid high-interference areas. For differential lines with curved paths or asymmetric layouts, it is recommended to add common-mode chokes or termination resistors at the ports to compensate for phase differences and improve signal quality.

[0096] Extension of single-line height restriction and low-noise optimization, single-line systems need to limit the height of the transmission line from the ground layer to ≤1 / 3 of the medium thickness to reduce the electric field coupling with the power layer. For high-frequency scenarios (>5GHz), it is recommended to further compress the height to ≤1 / 4 of the medium thickness to reduce the high-frequency skin effect and TM mode resonance influence. In addition, at the resonance frequency, single lines are preferentially arranged in low-noise areas with an electric field strength <30% of the maximum value to improve anti-interference ability through electric field distribution optimization.

[0097] Dynamic parameter adjustment and high-density board adaptation, introduce environmental feedback control mechanism, real-time monitoring of the temperature and humidity (20-25℃, 30-50% RH) and electromagnetic radiation intensity in the processing area, dynamically adjust the height or spacing of the transmission line. For high-density circuit boards with more than 20 layers, use the segmented transmission matrix model, iteratively update the parameters according to the actual layer height, compatible with via effects and complex routing scenarios, ensure model accuracy and processing consistency.

[0098] Mixed system collaborative design and shielding optimization, in the mixed area where differential lines and single-ended lines coexist, set the isolation bandwidth ≥ 2 times the dielectric thickness, and densely fill the ground vias in the isolation band to block the cross-coupling path. For transmission lines between power layers and ground layers, use a grid-shaped shielding layer (thickness ≥ 3mm) to reduce parallel plate resonance effects while optimizing power integrity and thermal stability.

[0099] The optimized hierarchical routing strategy covers single-line, differential line, multi-line and mixed system, through quantitative parameter rules, introduction of dynamic feedback mechanism, and extension to high-density multi-layer board scenarios, significantly improving the stability and anti-interference ability of signal transmission.

[0100] In a preferred embodiment, the dynamic adjustment of the processing parameters in S5 includes:

[0101] When the electromagnetic radiation intensity is monitored to exceed the threshold value, the processing speed is automatically reduced and the real-time recalculation of the transmission matrix is triggered to update the routing path planning.

[0102] In the production process of multi-layer circuit boards, the system collects real-time data such as temperature, humidity, electromagnetic radiation intensity, etc. in the processing area through sensors. When the electromagnetic radiation intensity is detected to exceed the preset threshold value (such as the field intensity peak at the resonance frequency), it indicates that the current environment may cause signal interference or parallel plate resonance effect, resulting in a decrease in transmission line performance. At this time, the system immediately starts the dynamic adjustment mechanism: automatically reduces the processing speed of the mechanical arm to reduce electromagnetic noise generated by high-speed motion; at the same time, based on real-time environmental data, the transmission matrix is recalculated to update the coupling coefficient and electric field distribution model, and a new low-interference routing path is generated. The updated path avoids high electric field areas and optimizes the height ratio of the transmission line and the ground layer to ensure signal integrity. The whole process is realized through closed-loop feedback to adaptively adjust, which not only suppresses electromagnetic interference, but also guarantees processing accuracy and efficiency.

[0103] In a preferred embodiment, the calculation of CODcr content in S6 uses a multi-sensor fusion formula:

[0104]

[0105] Where: , , Respectively, the measured values of the national standard method, the tester and the spectrophotometer;

[0106] , , is a weight coefficient, and .

[0107] In the treatment of multi-layer circuit board production wastewater, the accurate detection of chemical oxygen demand (CODcr) is crucial for environmental protection. The traditional single detection method is easily limited by operation error or equipment precision, resulting in measurement deviation. Therefore, the S6 step proposes a multi-sensor fusion algorithm, which integrates the measurement values of the three detection methods by weighting to improve the reliability and stability of the detection results.

[0108] First, multi-source data collection. National standard method (HL1): based on standard chemical titration, the result is accurate but time-consuming, suitable for laboratory environment. Rapid tester (HL2): real-time measurement by electrochemical sensor, fast but easily disturbed by water quality fluctuations. Spectrophotometer (HL3): uses spectral analysis of specific wavelength absorbance, suitable for low concentration detection, but needs to be calibrated regularly. This embodiment adopts a dynamic weight allocation strategy. According to experimental data and equipment performance evaluation, each method is assigned a weight coefficient (such as k1=0.5, k2=0.3, k3=0.2), and the sum is 1. High weight (k1) is given to the national standard method to ensure the accuracy of the reference; rapid tester (k2) and spectrophotometer (k3) complement the real-time performance and anti-interference ability.

[0109] The measurement values of the three methods are superimposed according to the weight to generate a comprehensive index HL. If a single method is abnormal (such as HL2 suddenly increases), the fusion result can be automatically corrected by other methods to reduce the risk of misjudgment. When HL exceeds the standard, wastewater recycling treatment is triggered, and the discharge is discharged after retesting meets the standard. The multi-sensor fusion technology solves the problem of precision, speed and anti-interference of traditional methods through complementary advantages, reduces the influence of human operation, and provides high confidence data support for environmental protection management.

[0110] In a preferred embodiment, it also includes: performing physical flow sheet test on the completed circuit board, comparing the deviation between simulated S parameters and measured results, if the deviation is >15%, it is marked as an abnormal batch and the processing data is traced back. After the multi-layer circuit board production is completed, the system verifies the product performance through physical flow sheet test. The test core is to compare the consistency of simulated S parameters and measured S parameters to evaluate whether the signal integrity and electromagnetic compatibility meet the design requirements.

[0111] The embodiment provides a test process, including signal integrity test: using a vector network analyzer (VNA) to measure the S parameters (such as reflection coefficient S 11 , transmission coefficient S 21), covering key frequency bands (e.g. resonance frequency, signal bandwidth). Data comparison: compare the measured S-parameters with the simulation results in terms of amplitude and phase, and calculate the deviation value. If the deviation > 15%, it is determined as an abnormal batch.

[0112] In terms of deviation processing and backtracking mechanism, we use abnormal marking, the system automatically marks abnormal batches, suspends the subsequent processing flow, and triggers an alarm. Data backtracking, retrieve the production data of the abnormal batch (such as temperature and humidity, electromagnetic shielding layer thickness, wiring path), combine the transmission matrix model to analyze the deviation root cause. If the resonance frequency deviates, it may be due to insufficient correction of the parallel plate coupling matrix or fluctuation of the processing environment. Parameter correction: dynamically update the model parameters (such as coupling coefficient , height term ) according to the backtracking results, regenerate the transmission matrix and optimize the subsequent production strategy. Through the closed-loop mechanism of real-time testing, comparison and correction, the system realizes adaptive optimization, ensures that the signal performance of each batch of circuit boards is highly consistent with the simulation model, and accumulates data for process improvement, improves the overall yield and production efficiency.

[0113] In a preferred embodiment, the real flow sheet test comprises: measuring the port reflection coefficient S 11 and the transmission coefficient S 21 by a vector network analyzer, and extracting the amplitude and phase deviation data of the resonance frequency point. Real flow sheet testing is to measure the actual signal performance of the circuit board to verify its consistency with the design simulation. The test uses a vector network analyzer (VNA) to input high-frequency signals to the circuit board and detect its response, focusing on two key parameters: reflection coefficient (S 11 ) and transmission coefficient (S 21 ). The reflection coefficient (S 11 ) reflects the proportion of signals reflected at the input port. If S 11 is too high, it means that the signal has not effectively entered the circuit board, which may be due to impedance mismatch or line design defects causing energy loss. The transmission coefficient (S 21 ) measures the transmission efficiency of signals from the input port to the output port, and if S 21 is too low, it means that the signal is severely attenuated during transmission, which may be due to line loss or electromagnetic interference.

[0114] During testing, the VNA will scan the key frequency bands (such as resonance frequency) of the circuit board, record the S 11 and S 21Amplitude and phase data. Resonant frequency is the frequency point at which the circuit board resonates due to the interlayer structure. The signal characteristics at this point are particularly sensitive to electromagnetic compatibility (EMC) and signal integrity (SI). In deviation analysis and abnormal processing, the measured data is compared with the simulation results. If the deviation exceeds 15% (such as resonance frequency deviation or signal attenuation anomaly), the system automatically marks the batch as abnormal. At this time, the production data of the batch (such as temperature and humidity, shielding layer thickness, wiring path) is retrieved, and the transmission matrix model is used to analyze the root cause of the deviation. For example, the resonance frequency deviation may be due to insufficient correction of the parallel plate coupling matrix or fluctuations in the processing environment. Through closed-loop feedback of testing-comparison-correction, the system dynamically updates the model parameters (such as coupling coefficient, height term), and optimizes the subsequent production strategy. For example, adjust the height or spacing of the transmission line to avoid high interference areas, ensure that the performance of each batch of circuit boards is highly consistent with the simulation, and ultimately improve the yield and production efficiency.

[0115] In a preferred embodiment, S4 further includes: for high-density circuit boards with more than 20 layers, using a segmented transmission matrix cascade method to model the via effect as a parallel LC circuit and include it in the overall transmission matrix calculation. In high-density circuit boards with more than 20 layers, the wiring path is complex and the via effect is significant, making it difficult for traditional modeling methods to accurately describe signal transmission characteristics. Therefore, the segmented transmission matrix cascade method is used to divide the entire circuit board into multiple sub-sections (such as by layer or functional area), and a transmission matrix is independently modeled for each section. The transmission matrices of each sub-section are multiplied by cascading to obtain the overall transmission characteristics, similar to "building block assembly". This method not only reduces the computational complexity, but also allows for optimization of different interlayer structures (such as power layers, ground layers).

[0116] Modeling and compensation of via effect. Vias (metal holes that connect different layers vertically) can introduce parasitic inductance (L) and capacitance (C) in high-frequency signal transmission, causing signal reflection and delay. To solve this problem, the via is equivalent to a parallel LC circuit, and its parameters are extracted through electromagnetic simulation or measurement. The smaller the via diameter, the greater the parasitic inductance; the thinner the dielectric layer, the more significant the parasitic capacitance. By embedding the LC circuit model into the segmented transmission matrix, the impact of the via on signal integrity can be accurately quantified.

[0117] This embodiment can flexibly handle changes in different interlayer heights (such as transmission lines near power layers or ground layers) and material parameters through segmented modeling. At the resonant frequency point (such as TM mode), the LC model of the via can reveal the signal attenuation peak, guiding the optimization of via layout or the addition of ground holes to shunt interference. The segmented model supports parallel computing, significantly shortening the simulation time of high-density boards, while supporting parameter iterative optimization (such as adjusting line width, spacing).

[0118] By combining the segmented transmission matrix cascade method with the via LC model, the signal integrity analysis of high-density multi-layer boards can balance accuracy and efficiency. This method provides a systematic solution for interlayer routing, via design, and electromagnetic compatibility optimization of complex circuit boards with more than 20 layers, especially suitable for high-frequency scenarios such as 5G communication and high-performance computing.

[0119] A multi-layer circuit-based circuit board production process management system (see Figure 3 ), comprising:

[0120] Modeling module: for building an interlayer transmission line parameter model, generating a transmission matrix based on the telegraph equation and parallel plate resonant field;

[0121] Simulation module: connected to the modeling module, converting the transmission matrix to an S parameter matrix and performing signal integrity and electromagnetic compatibility simulation;

[0122] Environmental control module: receives output data from the simulation module, dynamically adjusts the temperature and humidity, electromagnetic shielding parameters, and wiring optimization area of the processing area;

[0123] Wiring optimization module: generates a layered wiring scheme based on the transmission matrix calculation results, controls the differential line port spacing and single line layer height;

[0124] Production management module: real-time monitoring of processing data and feedback to the modeling module, triggering dynamic correction of the transmission matrix;

[0125] Waste water treatment module: detects the CODcr content of waste water and controls the recycling process.

[0126] This embodiment includes multiple modules, including a modeling module: transmission line parameter modeling and matrix generation, which builds an interlayer transmission line model through the telegraph equation. The system considers the parallel plate resonant effect between the power layer and the ground layer as an external excitation source, and combines the Agrawal model to correct the voltage definition, generating a transmission matrix that includes a transmission line height term (such as the ratio of line height to dielectric thickness). This matrix quantifies the electromagnetic coupling characteristics under different interlayer heights.

[0127] Simulation module, signal integrity and electromagnetic compatibility verification. Based on the transmission matrix generated by the modeling module, the system converts it into an S parameter matrix (such as reflection coefficient S 11 , transmission coefficient S 21 ), simulates signal transmission loss, crosstalk, and electric field distribution under resonant frequency. By comparing the simulation results with the preset threshold (such as electric field intensity ≤ 45% maximum), high-risk areas are identified to provide data support for environmental control and wiring optimization.

[0128] The environmental regulation module is responsible for dynamic parameter optimization and interference suppression. This module interfaces with simulation results, automatically adjusts the temperature and humidity (20-25°C, 30-50% RH) and electromagnetic shielding layer thickness (≥3mm) of the processing area to ensure stable production environment. At the same time, according to the electric field distribution data, the wiring optimization area (low electric field intensity area) is delineated to reduce resonance interference from the physical space.

[0129] The line optimization module completes the hierarchical strategy and parameter constraint. The system performs dense layout with port spacing ≤5mm for differential line systems based on transmission matrix calculation results to suppress common mode noise; for single line systems, the transmission line distance from the ground layer height is limited to ≤1 / 3 of the medium thickness to reduce crosstalk risk. For high-density boards with more than 20 layers, the segmented transmission matrix cascade method is used to model the via effect as a parallel LC circuit to optimize complex wiring scenarios.

[0130] The production management module monitors and feedbacks in real time. Through sensors, it collects real-time data on temperature, humidity, and electromagnetic radiation in the processing area, dynamically corrects transmission matrix parameters (such as coupling coefficients K11 / K12), and updates the wiring path. If electromagnetic radiation exceeds the limit, it automatically reduces the processing speed and triggers matrix recalculation, forming a closed-loop control of monitoring-feedback-correction to ensure batch consistency.

[0131] The processing module manages and controls environmental protection and recycling purification. The system detects the CODcr content of production wastewater and uses a multi-sensor fusion algorithm (national standard method + tester + spectrophotometer weighted calculation) to improve detection accuracy. If the detection value exceeds the standard, it triggers the recycling process until it meets the discharge standard. Through cross-domain integration, the module realizes the synergy of electromagnetic compatibility design and environmental management and control.

[0132] Through modular design and data flow closed loop, the system converts theoretical models into executable engineering strategies, significantly improving signal integrity (SI), electromagnetic compatibility (EMC), and environmental compliance in multi-layer circuit board production.

[0133] In a preferred embodiment, the modeling module specifically includes: an electric field calculation unit for solving the TM mode electric field distribution of a parallel plate resonant cavity; a matrix generation unit for generating a transmission matrix containing a height term based on the coupling equations of the Agrawal model and the Taylor model The function of the electric field calculation unit is to solve the TM mode electric field distribution of a parallel plate resonant cavity. In a multi-layer circuit board, the power layer and the ground layer form a structure similar to an "electromagnetic resonant cavity". When the signal passes through the transmission line, it will excite the resonant effect between the parallel plates, generating a specific mode of electromagnetic field (such as TM mode). This electric field distribution is similar to a standing wave, and its intensity is closely related to the resonant frequency, the position of the transmission line, and the thickness of the interlayer medium. Through numerical calculation and Green's function expansion, the unit can quantify the electric field intensity around transmission lines of different heights.

[0134] The matrix generation unit constructs a transmission matrix containing a height term based on the electric field calculation results by fusing the Agrawal model and the Taylor model . Agrawal model: revises the traditional transmission line voltage definition, equivalent to the influence of the external electric field as a voltage source, quantifies the coupling effect of the signal line and the parallel plate electric field. Taylor model: simplifies the complex external electromagnetic field coupling into an equivalent current source, intuitively describes the interference path of the resonant field to the transmission line. Height term integration: by introducing the proportional term of the transmission line height and the dielectric thickness (such as ), dynamically adjust the model parameters, accurately reflect the transmission characteristics of different interlayer heights.

[0135] This embodiment calculates the electric field distribution of the parallel plate resonant cavity, identifies the high interference area (such as the electric field peak at the resonant frequency). Combined with the voltage correction of the Agrawal model and the current source equivalent of the Taylor model, the initial transmission matrix is generated. According to the actual position of the transmission line, the coupling coefficient in the matrix is corrected, and the final transmission matrix .

[0136] In a preferred embodiment, the environment regulation module includes: an electric field mapping unit that generates an electric field intensity distribution heat map at the resonant frequency; a parameter execution unit that filters low electric field areas according to the heat map and controls the temperature and humidity adjustment equipment and electromagnetic shielding device. The electric field mapping unit generates an electric field intensity distribution heat map at the resonant frequency by receiving the electric field distribution data from the simulation module. The heat map visually identifies the electric field intensity of different areas by color depth (such as red representing high electric field area and blue representing low electric field area). Based on the parallel plate resonance effect, the system automatically identifies the area where the electric field intensity exceeds the safety threshold (such as 45% of the maximum value) and marks it as a potential interference source. This process converts discrete simulation data into continuous visual heat map through spatial interpolation algorithm. The parameter execution unit filters out the low electric field area (electric field intensity ≤ 45% of the maximum value) according to the heat map, and links the production equipment to perform the following operations: temperature and humidity adjustment: control the processing area temperature to be constant at 20-25℃, humidity 30-50% RH, reduce the signal deviation caused by material thermal expansion and moisture absorption. Electromagnetic shielding control: automatically adjust the thickness of the electromagnetic shielding layer to ≥3mm to suppress the penetration of external electromagnetic interference to the high electric field area. Dynamic area locking: restrict the wiring path to the low electric field area to avoid signal attenuation caused by resonant effect.

[0137] The application receives electric field distribution data of the simulation module and real-time environmental sensor data. If the electric field intensity exceeds the threshold, an alarm is triggered and the processing in the high-risk area is suspended. The operation parameters of the air conditioner, humidifier and electromagnetic shielding material spraying equipment are adjusted by the PLC controller. The heat map is updated in real time and the shielding strategy is dynamically adjusted to ensure that the production environment is always in a low interference state. Through the cooperation of electric field mapping and parameter execution, the system effectively reduces the electromagnetic radiation at the resonance frequency (the reduction can be more than 30%), while improving the stability of signal transmission.

[0138] In a preferred embodiment, the wiring optimization module specifically includes: a differential line controller configured with a compact layout of physical port spacing ≤5mm; a single line optimizer according to the formula The transmission line height is set to be The line height is The interlayer dielectric thickness is). The differential line controller, the compact layout suppresses common mode noise. In a differential transmission line system, two signal lines transmit signals in a complementary manner (positive and negative symmetry). By controlling the physical port spacing to ≤5mm in a compact layout, the signal loop area can be significantly reduced, thereby reducing the sensitivity to electromagnetic radiation and external interference. The close arrangement enhances the symmetry of the differential pair, reduces the phase difference caused by path asymmetry, and suppresses the generation of common mode noise. As in high-speed signal transmission (such as USB, HDMI), the compact layout can avoid waveform distortion caused by signal delay mismatch, improving signal integrity (SI). The single line optimizer, the height limit reduces electric field coupling. For single line systems, the height of the transmission line from the ground layer needs to satisfy h≤1 / 3 dielectric thickness (d). By routing the transmission line close to the ground layer, the vertical electric field coupling strength between it and the power layer can be reduced, thereby reducing signal loss and crosstalk risk. The ground layer also provides shielding effect, suppressing external electromagnetic field interference. When the dielectric thickness is 0.6mm, the transmission line height is limited to 0.2mm, which can reduce the electric field coupling strength to less than 15% of the original value.

[0139] Further, in the wiring optimization module, a multi-line system controller is also included, configured with adjacent transmission line spacing ≥3 times the line width and adjacent signal layers using orthogonal wiring layout; a dynamic adjustment unit relaxes the multi-line spacing to 8mm near the resonance frequency point and enables a segmented transmission matrix model; a hybrid system isolation unit sets an isolation band ≥2 times the dielectric thickness in the differential line and single line coexistence area and fills the ground via, while configuring a grid-shaped shielding layer (thickness ≥3mm) for the transmission line between the power-ground layers. The multi-line system controller and the dynamic adjustment unit work together to dynamically optimize the wiring path by real-time monitoring of the electric field intensity, ensuring the signal integrity and electromagnetic compatibility of high-density circuit boards.

[0140] In a preferred embodiment, the wastewater treatment module comprises: a multi-sensor fusion unit that measures CODcr using the national standard method, a tester, and a spectrophotometer in parallel; a cyclic treatment controller that activates the electrolytic treatment device until the standard is met when the CODcr exceeds the standard. The multi-sensor fusion unit accurately detects the CODcr content by measuring chemical oxygen demand (CODcr) in parallel using the national standard method, a rapid tester, and a spectrophotometer. The national standard method is based on chemical titration, which is accurate but time-consuming, and is suitable for laboratory calibration; the rapid tester measures in real time through an electrochemical sensor, which is fast but easily disturbed by water quality fluctuations; the spectrophotometer uses spectral analysis to analyze specific wavelength absorbance and is suitable for low concentration detection but needs to be calibrated periodically. The system assigns dynamic weights to each method (such as national standard method weight 50%, tester 30%, and spectrophotometer 20%), generates a comprehensive CODcr value by weighted fusion, and ensures both benchmark accuracy and improved anti-interference capability.

[0141] The cyclic treatment controller intelligently purifies and provides closed-loop feedback. When the fused CODcr value exceeds the environmental threshold, the controller immediately activates the electrolytic treatment device. The electrolytic cell decomposes organic matter in wastewater through electrode reactions, while oxidizing heavy metal ions to reduce pollutant concentration. During the treatment process, the system monitors CODcr changes in real time and dynamically adjusts electrolytic current intensity and treatment duration. If the retest still exceeds the standard, start the multi-stage treatment cycle (such as adding ozone aeration or activated carbon adsorption) until the CODcr meets the standard. After meeting the standard, the electrolytic device is automatically turned off, and the data is recorded for process optimization.

[0142] Through multi-sensor fusion and closed-loop control, the system solves the problems of insufficient accuracy and slow response of traditional single detection method, while avoiding energy waste caused by excessive treatment. In addition, data is uploaded to the production management module in real time to provide traceable records for environmental compliance.

[0143] In a preferred embodiment, the production management module dynamically corrects the transmission matrix by updating the parameters using the following formula:

[0144]

[0145] Where the matrix with the "'" symbol is the parameter corrected according to real-time monitoring data.

[0146] The production management module dynamically adjusts the transmission matrix model by real-time monitoring of key parameters such as temperature, humidity, and electromagnetic radiation intensity of the processing environment, ensuring that the signal transmission characteristics of the multi-layer circuit board match the actual environment.

[0147] Real-time data collection and threshold determination: the sensor continuously collects the temperature (20-25°C), humidity (30-50% RH) and electromagnetic radiation intensity of the processing area. If the monitored parameters exceed the preset threshold (such as temperature fluctuation of ±2°C or radiation intensity exceeding 45% of the maximum value), the system determines that the current transmission matrix is ​​no longer applicable and needs to trigger dynamic correction. Transmission matrix correction: adjust the inductance (L), capacitance (C) and other parameters of the transmission matrix according to the environmental data. If the high temperature causes the medium to expand, the capacitance value increases, and the formula needs to be updated. Coupling coefficient correction: The electromagnetic field coupling effect (such as K11 and K21) generated by parallel plate resonance is significantly affected by temperature and humidity. The system dynamically adjusts the real-time electric field distribution data. (transverse coupling coefficient) and (Longitudinal Coupling Coefficient), quantifies the effect of environmental disturbances on the transmission line.

[0148] Matrix reorganization and inverse operation: Substitute the corrected parameters (A', B', C', D', K11', K12', K21', K22') into the matrix formula and reconstruct the overall transmission matrix through inverse matrix operation This step encodes the effects of environmental changes on the transmission characteristics into the new matrix, ensuring that the model accurately reflects the current physical state. The matrix is ​​sent to the routing optimization module in real time, recalculating low-interference routing paths and interlayer height limits. For example, if the resonant frequency shifts after correction, the system automatically avoids areas of high electric fields and adjusts the spacing or height of transmission lines to reduce signal attenuation and crosstalk risks. This dynamic correction mechanism allows the system to quickly respond to environmental fluctuations (such as sudden changes in workshop temperature and humidity or a surge in electromagnetic interference), keeping signal transmission errors within ±5%, significantly improving the production yield and signal integrity (SI) of high-density PCBs.

[0149] In a preferred embodiment, the S parameter matrix generated by the simulation module is used to evaluate the signal reflection and crosstalk characteristics at the resonant frequency, and the calculation formula is:

[0150]

[0151] in, is the impedance matrix, is the port characteristic impedance.

[0152] In multi-layer PCB design, the simulation module converts the impedance matrix (Z matrix) into a scattering matrix ( Parameter matrix), evaluate the reflection and crosstalk characteristics of the signal at the resonant frequency. Impedance matrix and port matching, impedance matrix ( ) describes the impedance characteristics between the ports of the circuit, reflecting the direct relationship between voltage and current. Port characteristic impedance ( , typically 50Ω, is a reference value for ideal matching. When the actual impedance matches Z0, signal reflection is minimized; if there is a difference, reflection will occur.

[0153] The parameter matrix directly characterizes the reflection of the signal by quantifying the relationship between the incident wave and the reflected wave (such as S 11 ) and transmission (such as S 21 ) characteristics. S 11 Indicates the reflection coefficient of port 1. The smaller the value, the less signal reflection. 21 This represents the transmission efficiency from port 1 to port 2. A larger value indicates lower signal loss. The conversion formula converts the impedance matrix into a scattering matrix. At the resonant frequency, the circuit's parallel plate structure forms standing waves, resulting in signal reflection or transmission anomalies at specific frequencies. The parameter matrix can quickly locate these frequency points: reflection peak (S 11 Sudden increase: Indicates that the signal is reflected in large quantities at the port due to the sudden change in impedance. Transmission valley value (S 21 Dip): Indicates that the signal is severely attenuated due to resonant coupling or dielectric loss.

[0154] Through analysis The crosstalk coefficient in the parameters (such as S 12 、S 21 ), identify high-interference areas and adjust trace spacing or layer height. Add ground vias or shielding layers at the resonant frequency to reduce electric field coupling strength and improve signal integrity. The parameter matrix quantifies reflection and transmission characteristics, converting complex impedance relationships into an intuitive "signal behavior map", providing key guidance for high-frequency circuit design. It is particularly valuable in suppressing resonant interference and reducing crosstalk.

[0155] The present invention constructs the deformed telegraph equation of the interlayer transmission line through the modeling module, combines the parallel plate resonant field to generate the transmission matrix, and the simulation module converts the matrix into S parameters to evaluate the signal reflection and transmission characteristics. The environmental control module dynamically adjusts the temperature, humidity and shielding parameters based on the electric field thermal map to optimize the low-interference wiring area; the wiring optimization module constrains the height, spacing and interlayer layout for single-line, differential line and multi-line systems respectively to suppress crosstalk and resonance. The production management module monitors the processing data in real time, triggers the dynamic correction of the transmission matrix, and ensures that the model is consistent with the process; the wastewater treatment module integrates multiple sensors to detect CODcr and links the purification cycle. Each module works together through closed-loop feedback, taking into account signal integrity, electromagnetic compatibility and environmental compliance.

[0156] While the preferred embodiments of the application have been described above, it should be understood that they have been presented by way of example only, and not limitation. Numerous changes to the preferred embodiments can be made in addition to those described and nevertheless accomplish the same objectives of the application. Accordingly, the scope of the application is intended to cover all such modifications and changes as fall within the scope of the application, together with all such equivalents.

Claims

1. A method for managing a production flow of a multilayer circuit-based circuit board, characterized by, Comprise the following contents: S1. Establish the interlayer transmission line parameter model of multi-layer circuit board: based on the deformation telegraph equation under the action of external electromagnetic field, combined with the parallel plate resonance effect between the power layer and the ground layer, calculate the electromagnetic field distribution of transmission lines of different heights, generate the transmission matrix containing the height term of the transmission line; S2. Transmission characteristic simulation verification; S3. Optimize the production environment parameters: according to the simulation results, extract the electric field intensity distribution at the resonance frequency, select the area with electric field intensity lower than 45% of the maximum value as the wiring optimization area, and adjust the environmental temperature to 20-25℃, humidity to 30-50%, electromagnetic shielding layer thickness≥3mm; S4. Implement the hierarchical wiring strategy: for single line, multi-line and differential line system, optimize the interlayer wiring path according to the transmission matrix calculation results, ensure that the transmission line is close to the ground layer and the port is located in the low electric field intensity area; S5. Dynamic monitoring of production data: real-time acquisition of temperature, humidity and electromagnetic radiation data in the processing area, and dynamic adjustment of processing parameters combined with transmission matrix correction value.

2. The method according to claim 1, wherein The transmission matrix expression is: wherein: is n x n the identity matrix; is n x n the zero matrix; , , , K matrix) is the parallel-plate electric field coupling coefficient matrix; : input end electric field to input end voltage coupling; : input end electric field to output end current coupling; : output end electric field to input end current coupling; : output end electric field to output end voltage coupling; is the transfer coefficient of output end voltage to input end voltage; is the transfer coefficient of output end current to input end voltage; is the transfer coefficient of output end voltage to input end current; is the transfer coefficient of output end current to input end current; The transmission matrix is converted into an S parameter matrix, and the calculation formula is: wherein, is an impedance matrix, is a port characteristic impedance, is a unit matrix.

3. The method of claim 1, wherein, The construction of the deformation telegraph equation in S1 includes: taking the electromagnetic field generated by the parallel plate resonance as the external excitation source, modifying the transmission line voltage definition through Agrawal model, combining the equivalent voltage source / current source expression of Taylor model, and deducing the cascade matrix of interlayer transmission line.

4. The method of claim 1, wherein, The hierarchical wiring strategy in S4 is specifically: For differential transmission line system, adopt dense layout with physical port spacing≤5mm; For single line system, set the transmission line distance from the ground layer height≤1 / 3 of the interlayer dielectric thickness.

5. The method of claim 1, wherein, The dynamic adjustment of processing parameters in S5 includes: When the electromagnetic radiation intensity exceeds the threshold value, automatically reduce the processing speed and trigger real-time recalculation of the transmission matrix, update the wiring path planning.

6. The method according to any one of claims 1 to 5, wherein, Also includes: Real object flow test is carried out on the completed circuit board, the deviation between simulation S parameter and actual measurement result is compared, if the deviation is >15%, it is marked as abnormal batch and the processing data is traced back.

7. The method of claim 6, wherein the method further comprises: The real flow sheet test includes: measuring port reflection coefficient S 11 and transmission coefficient S 21 by a vector network analyzer, and extracting amplitude and phase deviation data of resonance frequency points.

8. A circuit board production process control system based on multi-layer circuits, characterized in that: Include: Modeling module: used for constructing interlayer transmission line parameter model, generating transmission matrix based on deformation telegraph equation and parallel plate resonance field; Simulation module: connect the modeling module, convert the transmission matrix to S parameter matrix and perform signal integrity and electromagnetic compatibility simulation; Environment control module: receive the output data of the simulation module, dynamically adjust the temperature and humidity of the processing area, electromagnetic shielding parameters and wiring optimization area; Wiring optimization module: generate hierarchical wiring scheme according to the transmission matrix calculation results, control the differential line port spacing and single line interlayer height; Production management module: real-time monitoring of processing data and feedback to the modeling module, triggering dynamic correction of transmission matrix.

9. The system according to claim 8, wherein, The modeling module specifically includes: Electric field calculation unit, used for solving TM mode electric field distribution of parallel plate resonance cavity; The matrix generating unit generates a transmission matrix containing a height term based on a coupled equation of the Agrawal model and the Taylor model .

10. The system according to claim 8 or 9, wherein, When the production management module dynamically corrects the transmission matrix, update the parameters by the following formula: wherein, is n x n the identity matrix; is n x n the zero matrix; , , , K is the matrix of parallel-plate electric field coupling coefficients; : input electric field to input voltage coupling; : input electric field to output current coupling; : output electric field to input current coupling; : output electric field to output voltage coupling; is the transfer coefficient of output voltage to input voltage; is the transfer coefficient of output current to input voltage; is the transfer coefficient of output voltage to input current; is the transfer coefficient of output current to input current; the matrix with the " symbol is the parameter corrected according to real-time monitoring data.

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