PCB laser drilling path control method and system
By identifying and generating supplementary cleaning paths and matching laser energy parameters, the problem of material residue at sharp concave corners is resolved, ensuring the integrity and reliability of laser drilling.
CN120619640AActive Publication Date: 2025-09-12YANGZHOU LINGTU INTELLIGENT TECH CO LTD
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Patent Information
- Application Number
- CN202511099438.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-07
- Publication Date
- 2025-09-12
- Estimated Expiration
- 2045-08-07
AI Technical Summary
Technical Problem
Existing laser drilling technology is prone to causing material residue and path overlap when processing sharp concave corners, affecting hole processing quality and product reliability.
Method used
By identifying sharp concave corners in the hole profile, an independent supplementary cleaning path is generated, and the laser energy parameters are matched based on material properties and volume. The laser processing parameters are applied in stages to ensure that the main filling path and the supplementary cleaning path are spatially separated.
Benefits of technology
It effectively removes material residues at sharp concave corners, avoids material damage and repeated energy application, and ensures the integrity and quality of hole processing.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention relates to the technical field of laser processing, in particular to a PCB laser drilling path control method and system. The method comprises the steps of receiving hole geometric data; based on geometric data of the hole, identifying a sharp concave angle in the contour of the hole, and calculating the geometric shape and volume of a residual material area left due to the defect generated by the conventional path; a main filling path of the hole main body area is generated based on the hole geometric data, a supplementary cleaning path is generated for the residual material area, and the supplementary cleaning path and the main filling path are spatially separated from each other; matching laser energy parameters for the supplementary cleaning path based on material characteristics and volume of the residual material region; in the machining process, matched laser machining parameters are applied in stages corresponding to the main filling path and the supplementary cleaning path respectively. The problem of carbonization layering caused by material residues and excessive energy injection in laser drilling with sharp inner concave angles can be effectively solved, and the machining quality and the product reliability are ensured.
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