High-temperature-resistant and corrosion-resistant epoxy structural adhesive capable of being cured at low temperature as well as preparation method and application of epoxy structural adhesive

Abstract

The invention relates to the technical field of epoxy structural adhesives, in particular to a low-temperature-curable, high-temperature-resistant and corrosion-resistant epoxy structural adhesive as well as a preparation method and application of the low-temperature-curable, high-temperature-resistant and corrosion-resistant epoxy structural adhesive. The component A is prepared by mixing the following components in parts by weight: 30-40 parts of alicyclic epoxy resin, 20-30 parts of biphenyl epoxy resin, 10-15 parts of a CTBN epoxy pre-reactant, 5-8 parts of a core-shell rubber toughening agent and 2-5 parts of fumed silica; and the component B is prepared by mixing 25-30 parts by weight of a modified DETDA curing agent, 10-15 parts by weight of microencapsulated anhydride, 25-35 parts by weight of a corrosion-resistant filler, 2-3 parts by weight of a coupling agent and 1-2 parts by weight of polyamide wax. According to the invention, the contradiction between the curing temperature and the heat resistance in semiconductor packaging is solved, and the excellent performance of low-temperature curing and high-temperature / corrosion resistance is realized.

Description

Technical Field

[0001] The present invention relates to the technical field of epoxy structural adhesives, and in particular to an epoxy structural adhesive that can be cured at low temperatures and is resistant to high temperatures and corrosion, as well as a preparation method and application thereof. Background Art

[0002] Plastic packaging is the primary technology used in microelectronics packaging and dominates chip packaging. Its advantages include low cost, simplicity, and the ability to achieve high-density integration. However, it also has significant disadvantages, including poor airtightness and moisture resistance, as well as susceptibility to ions and electromagnetic interference, which significantly impacts reliability. Therefore, the future trend in chip packaging is to gradually phase out plastic packaging in favor of ceramics and other materials for high-reliability applications. Ceramic packaging will inevitably place higher demands on other packaging materials in terms of high-temperature resistance, corrosion resistance, and low CTE matching. Currently, the industry's proprietary adhesives used for chip packaging, such as acid- and alkali-resistant epoxy adhesives, can only withstand temperatures around 300°C and face degradation and carbonization at 400°C. Epoxy adhesives, which can withstand temperatures of 500-700°C, face challenges with acid, alkali, and solvent resistance. Furthermore, to protect components like capacitors during the packaging process, proprietary adhesives can only be cured at temperatures below 100°C, creating a technical conflict with their high-temperature resistance and storage stability. Therefore, there is an urgent need for a structural adhesive that can cure at low temperatures, withstand extremely high temperatures, withstand acid, alkali and solvent corrosion, and has excellent adhesion to ceramic substrates to match the rapidly developing chip packaging technology. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide an epoxy structural adhesive that can be cured at low temperature and is resistant to high temperature and corrosion, as well as its preparation method and application, which solves the contradiction between curing temperature and heat resistance in semiconductor packaging and achieves excellent performance of low temperature curing and high temperature / corrosion resistance.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0005] An epoxy structural adhesive that can be cured at low temperature and is resistant to high temperature and corrosion, comprising component A and component B;

[0006] The component A is prepared by mixing 30 to 40 parts by weight of alicyclic epoxy resin, 20 to 30 parts of biphenyl epoxy resin, 10 to 15 parts of CTBN epoxy pre-reactant, 5 to 8 parts of core-shell rubber toughening agent and 2 to 5 parts of fumed silica;

[0007] The component B is prepared by mixing 25 to 30 parts by weight of a modified DETDA curing agent, 10 to 15 parts by weight of a microencapsulated acid anhydride, 25 to 35 parts by weight of a corrosion-resistant filler, 2 to 3 parts by weight of a coupling agent, and 1 to 2 parts by weight of a polyamide wax.

[0008] Preferably, the alicyclic epoxy resin is TTA21, the biphenyl epoxy resin is YX4000H, and the usage ratio of the alicyclic epoxy resin to the biphenyl epoxy resin is 1-2:1.

[0009] Preferably, the microencapsulated acid anhydride is microencapsulated methylhexahydrophthalic anhydride, with a core material content of ≥85% and a particle size D90 ≤50 μm.

[0010] Preferably, the corrosion-resistant filler comprises 15 to 20 parts of h-BN and 5 to 10 parts of ZrO2.

[0011] The method for preparing the epoxy structural adhesive that can be cured at low temperature and is resistant to high temperature and corrosion as described in any one of the above items comprises the following steps:

[0012] S1, resin matrix premixing: add alicyclic epoxy resin and biphenyl epoxy resin according to the formula amount into the reactor, stir at 500 rpm at 60°C for 30 minutes, add CTBN epoxy pre-reactant, raise the temperature to 80°C and continue stirring for 1 hour to obtain the resin matrix;

[0013] S2, Toughener Dispersion: Premix the core-shell rubber toughener and fumed silica according to the formula amount, disperse in a high-shear emulsifier at 10,000 rpm for 10 minutes to form a stable suspension with a particle size of ≤200 nm. Slowly add the suspension to the resin matrix obtained in step S1, maintain at 60°C and vacuum at -0.08 MPa, mix for 1 hour, eliminate bubbles, and store in aliquots to obtain component A.

[0014] S3, Synthesis of Modified DETDA: Diethyltoluenediamine and propylene oxide phenyl ether were reacted in a molar ratio of 1:0.3 at 80°C under nitrogen for 4 hours to produce an amine curing agent with a flexible chain segment, wherein the amine value was ≥400 mg KOH / g.

[0015] S4, preparation of microencapsulated anhydride;

[0016] S5, preparation of compound filler;

[0017] S6, mixing and dispersing: The amine curing agent prepared in step S3 and the microcapsule anhydride prepared in step S4 are mixed to form a curing agent system, and the composite filler prepared in step S5 is premixed with polyamide wax. The curing agent system is added in three times using a double planetary mixer at 2000 rpm and 60° C., with an interval of 5 minutes between each addition to ensure that the D90 particle size is ≤3 μm. The component B is then packaged and stored.

[0018] Preferably, the specific method for preparing the microencapsulated acid anhydride in step S4 is: using an in-situ polymerization method, methylhexahydrophthalic anhydride is mixed with a polyurea-formaldehyde resin wall material, and reacted at pH = 3.5 and 60° C. for 6 hours to form microcapsules; wherein the polyurea-formaldehyde resin wall material is obtained by mixing urea and formaldehyde in a molar ratio of 1:1.5.

[0019] Preferably, the specific method of compounding the filler in step S5 includes the following steps:

[0020] S51, h-BN modification: h-BN powder was immersed in 5% KH-560 ethanol solution, ultrasonicated for 40 min, and dried at 80°C to obtain a hydrophilic filler with a contact angle ≤30°;

[0021] S52, ZrO2 activation: ZrO2 powder was treated with Ar plasma at 200W for 10 minutes to increase the surface hydroxyl density to ≥8.2 / nm², thereby obtaining plasma-activated ZrO2; wherein, the ZrO2 powder D50 = 1.2μm;

[0022] S53, compounding: compound the h-BN hydrophilic filler obtained in step S51 and the ion-activated ZrO2 according to the ratio, first add the h-BN hydrophilic filler, pre-disperse it in a double planetary mixer at a low speed of 200 rpm for 10 minutes, then add the activated ZrO2, switch to a high speed of 800 rpm and mix for 20 minutes to obtain the compound filler.

[0023] Preferably, the premixing ratio of the composite filler and the polyamide wax in step S6 is 16-20:1.

[0024] The application of any of the above-mentioned epoxy structural adhesives that can be cured at low temperatures and are resistant to high temperatures and corrosion, wherein the structural adhesive is applied to ceramic packaging chip technology, and the specific method of using the adhesive comprises the following steps:

[0025] Step 1: Mix component A and component B under vacuum at 60°C with a stirring speed of 2000 rpm for 30 min to obtain a two-component mixed colloid;

[0026] Step 2: The two-component mixed colloid mixed in step S1 is dispersed by three-roll milling, with the roller gap gradient set to 20 μm → 10 μm → 5 μm, and the number of cycles is ≥ 3 times;

[0027] In step 3, the colloid dispersed in step 2 is pre-cured at 80°C for 90 minutes, then heated to 150°C and cured for 30 minutes to complete the packaging operation.

[0028] Beneficial effects of the present invention:

[0029] 1. The present invention first optimizes the resin matrix and adopts a synergistic mechanism. The alicyclic epoxy resin (TTA21) contains a six-membered oxygen heterocycle and has high curing activity (epoxy equivalent weight 130-145 g / eq). It quickly ring-opens with amine curing agents at 60-80°C, imparting low-temperature curing ability. The biphenyl-type epoxy resin (YX4000H) has a rigid biphenyl skeleton (epoxy equivalent weight 185-200 g / eq), forms a high cross-linking density network at high temperatures (Tg can reach 230°C), and is resistant to thermal oxidative aging (weight loss <5% at 400°C / 100h).

[0030] 2. This invention achieves synergistic ultra-low-temperature curing and high-temperature resistance through an "amine-anhydride" dual-cure mechanism. DETDA (diethyltoluenediamine) is pre-reacted with propylene oxide phenyl ether (PGE) to reduce amine volatility, improve compatibility with epoxy resin, and lower the curing temperature to 80°C (compared to 120°C for conventional DETDA). Methylhexahydrophthalic anhydride is microencapsulated, and the anhydride is encapsulated in a polyurea wall material (core material ≥ 85%). The trigger temperature is 150°C (the wall material ruptures to release the anhydride). The anhydride then reacts with the residual hydroxyl groups in the epoxy resin to form ester crosslinks, reducing the thermal decomposition rate by 30% at 500°C. The modified DETDA completes its primary reaction at 80°C, while the microencapsulated anhydride is subsequently released during high-temperature service. The anhydride reacts with residual epoxy groups to form a crosslinked network, significantly improving the temperature resistance to 700°C (the TGA 5% weight loss temperature is > 650°C).

[0031] 3. The present invention has strong corrosion resistance. It uses nano h-BN / ZrO2 composite filler, boron nitride (h-BN) nanosheets for surface modification, KH-560 silane treatment, grafting epoxy groups (functionalization rate > 90%), forming an h-BN layered structure to block acid and alkali penetration (resistance to 10% HCl / NaOH solution immersion for 30 days, mass loss < 2%); zirconium dioxide (ZrO2) nanoparticles, Ar plasma activation, monoclinic phase (CTE 4.5×10 -6 / ℃) and ceramic substrate (Al2O3, CTE 7.2×10 -6 / ℃) gradient matching to reduce interface stress.

[0032] 4. The present invention uses a core-shell rubber toughening agent with a specific structural design of polybutadiene rubber core (particle size 200 nm) + PMMA shell (thickness 20 nm). The crack growth energy (GIC) is increased to 450 J / m². The PMMA shell is covalently bonded to the epoxy resin to avoid rubber phase degradation at high temperatures (>300°C). DETAILED DESCRIPTION

[0033] In order to facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the embodiments. The contents mentioned in the embodiments are not intended to limit the present invention.

[0034] Preparation process:

[0035] Component A:

[0036] 1. Premixing the resin matrix: Add alicyclic epoxy resin (TTA21) and biphenyl epoxy resin (YX4000H) into the reactor according to the ratio, stir at 500 rpm at 60°C for 30 minutes, add CTBN, raise the temperature to 80°C and continue stirring for 1 hour;

[0037] 2. Toughener Dispersion: Premix the core-shell rubber toughener (MX-451) and fumed silica in appropriate proportions. Disperse the mixture in a high-shear emulsifier (10,000 rpm) for 10 minutes to form a stable suspension with a particle size of ≤200 nm. Slowly add the suspension to the resin matrix and mix at 60°C under vacuum (-0.08 MPa) for 1 hour to eliminate bubbles. Dispense the mixture to obtain component A.

[0038] Component B:

[0039] 1. Modified DETDA curing agent: DETDA (diethyltoluenediamine) and propylene oxide phenyl ether (PGE) were reacted in a molar ratio of 1:0.3 and reacted at 80°C under nitrogen for 4 hours to generate an amine curing agent with a flexible chain segment (amine value ≥400mg KOH / g).

[0040] 2. Microencapsulated anhydride: Methylhexahydrophthalic anhydride (MHHPA) was mixed with polyurea-formaldehyde resin wall material (urea-formaldehyde molar ratio 1:1.5), and reacted at pH = 3.5 and 60°C for 6 hours to form microcapsules with a core material content ≥ 85% and a particle size D90 ≤ 50 μm.

[0041] 3. Compound filler:

[0042] h-BN modification: Nano-boron nitride (h-BN) powder (5μm particle size) was immersed in a 5% KH-560 ethanol solution (5-10% of the h-BN mass), ultrasonically treated for 40 minutes, and dried at 80°C to obtain a hydrophilic filler with a contact angle ≤30°. The Si-O-B bonds of KH-560 stabilized the h-BN surface through hydrolysis and condensation, while the epoxy groups of KH-560 ring-opened and cross-linked with the epoxy resin, significantly improving the dispersibility and functional compatibility of h-BN in the epoxy system. The modified h-BN increased the thermal conductivity of the epoxy resin from 0.2 W / m·K to over 1.8 W / m·K, reducing the interfacial thermal resistance by 40%.

[0043] ZrO2 activation: ZrO2 powder (D50 = 1.2 μm) was treated with Ar plasma (200 W, 10 minutes) to increase the surface hydroxyl density to ≥8.2 / nm².

[0044] The obtained h-BN hydrophilic filler and ion-activated ZrO2 are compounded according to a ratio. The h-BN hydrophilic filler is first added and pre-dispersed in a double planetary mixer at a low speed of 200 rpm for 10 minutes. Then the activated ZrO2 is added and the high speed is switched to 800 rpm for 20 minutes to obtain a compound filler.

[0045] 5. Mixing and dispersion: Mix the prepared amine curing agent and microencapsulated acid anhydride to form a curing agent system, then premix the prepared composite filler with polyamide wax, and add the curing agent system three times using a double planetary mixer at 2000 rpm and 60°C, with an interval of 5 minutes each time to ensure that the D90 particle size is ≤3μm. Package and store to obtain component B.

[0046] Material ratio:

[0047] Component A: 30~40g alicyclic epoxy resin TTA21, 20~30g biphenyl epoxy resin YX4000H, 10~15g CTBN (carboxyl-terminated nitrile rubber, epoxy equivalent 280-320g / eq), 5~8g core-shell rubber toughening agent MX-451 and 2~5g fumed silica.

[0048] Component B: 25-30g modified DETDA curing agent, 10-15g microencapsulated anhydride, 15-20g h-BN, 5-10g plasma-activated ZrO2, 2-3g coupling agent KH-560 and 1-2g polyamide wax.

[0049] Example

[0050] According to the above preparation process, the components were prepared according to the following ratios to obtain the structural adhesives of some Examples 1-6. The amount (g) of each component is shown in Table 1.

[0051] Table 1 Amount of raw materials for each component (unit: g)

[0052]

[0053] Comparative Example 1

[0054] The specific implementation of this comparative example is basically the same as that of Example 1, except that: 70g of epoxy resin matrix is ​​TTA21, 12g of CTBN (carboxyl-terminated nitrile rubber, epoxy equivalent 280-320g / eq), 8g of core-shell rubber toughener MX-451 and 2.1g of fumed silica.

[0055] Comparative Example 2

[0056] The specific implementation of this comparative example is basically the same as that of Example 1, except that: component A: 50g alicyclic epoxy resin TTA21, 15g biphenyl type epoxy resin YX4000H, 12g CTBN (carboxyl-terminated nitrile rubber, epoxy equivalent 280-320g / eq), 8g core-shell rubber toughener MX-451 and 2.1g fumed silica.

[0057] Comparative Example 3

[0058] The specific implementation of this comparative example is basically the same as that of Example 1, except that: component A: 20g alicyclic epoxy resin TTA21, 40g biphenyl epoxy resin YX4000H, 12g CTBN (carboxyl-terminated nitrile rubber, epoxy equivalent 280-320g / eq), 8g core-shell rubber toughener MX-451 and 2.1g fumed silica.

[0059] Comparative Example 4

[0060] The specific implementation of this comparative example is basically the same as that of Example 1, except that: component A: 36g alicyclic epoxy resin TTA21, 24g biphenyl type epoxy resin YX4000H, 12g CTBN (carboxyl-terminated nitrile rubber, epoxy equivalent 280-320g / eq), 8g core-shell rubber toughener MX-139 and 2.1g fumed silica.

[0061] Comparative Example 5

[0062] The specific implementation of this comparative example is basically the same as that of Example 1, except that the formula of component A is 70g of bisphenol A epoxy resin (E-51), 10g of flexible epoxy diluent (AGE), and 2g of silane coupling agent (KH-560). The mixture is prepared by high-speed stirring (2000 rpm) at room temperature, followed by ultrasonic dispersion (40 kHz, 10 min).

[0063] Comparative Example 6

[0064] The specific implementation of this comparative example is basically the same as that of Example 1, except that: Component B: 30 g modified DETDA curing agent, 17.5 g h-BN, 8 g plasma-activated ZrO2, 2.3 g coupling agent KH-560 and 1.5 g polyamide wax.

[0065] Comparative Example 7

[0066] The specific implementation of this comparative example is basically the same as that of Example 1, except that: 26.5 g of modified DETDA curing agent, 10 g of microencapsulated anhydride, 17.5 g of h-BN, 8 g of plasma-activated ZrO2, 2.3 g of coupling agent KH-580 and 1.5 g of polyamide wax.

[0067] Comparative Example 8

[0068] The specific implementation of this comparative example is basically the same as that of Example 1, except that: 26.5 g of modified DETDA curing agent, 10 g of microencapsulated anhydride, 17.5 g of h-BN, 8 g of nano-Al2O3, 2.3 g of coupling agent KH-560 and 1.5 g of polyamide wax.

[0069] The structural adhesive is applied to ceramic chip packaging technology, and its specific use method includes the following steps:

[0070] Step 1: Mix component A and component B under vacuum at 60°C with a stirring speed of 2000 rpm for 30 min to obtain a two-component mixed colloid;

[0071] Step 2: The two-component mixed colloid mixed in step S1 is dispersed by three-roll milling, with the roller gap gradient set to 20 μm → 10 μm → 5 μm, and the number of cycles is ≥ 3 times;

[0072] In step 3, the colloid dispersed in step 2 is pre-cured at 80°C for 90 minutes, then heated to 150°C and cured for 30 minutes to complete the packaging operation.

[0073] Test Case

[0074] The performance tests were conducted on the structural adhesives prepared in Examples 1-6 and Comparative Examples 1-8. The test results are shown in Table 2 below.

[0075] Table 2 Structural adhesive test results

[0076]

[0077] The test standards for each test are as follows:

[0078] Cure temperature: IPC TM-650 2.4.5; DSC.

[0079] Glass transition temperature: ASTM D7028; DMA (3°C / min).

[0080] Thermal decomposition temperature (Td5%): TGA (N2 atmosphere).

[0081] Acid resistance: ASTM D543; mass loss after immersion in 10% HCl / NaOH solution for 30 days.

[0082] Corrosion resistance: Volume change rate after immersion in acetone for 7 days.

[0083] Shear strength retention: MIL-STD-883H; 500°C cycle retention after 100 cycles.

[0084] Thermal conductivity: ASTM D5470.

[0085] Interface thermal resistance (AlN substrate): MIL-STD-883H.

[0086] From the above test results, it can be seen that Examples 1-6 of the present application have obvious advantages in comprehensive performance compared to Comparative Examples 1-8. This is mainly due to the simultaneous optimization and definition of the epoxy resin matrix, curing system, filler upgrade, and other matching solutions in the present application. Comparative Examples 1-8, because they did not adopt the technical solutions defined in the present application, showed obvious disadvantages in the above performance tests. This further proves the necessity of the technical solutions defined in the present application for the technical effects of the present application and for solving technical problems.

[0087] Other performance verifications of Examples 1-6:

[0088] Highly accelerated life test (HAST, 130°C / 85%RH, 96h): Insulation resistance > 1×10¹² Ω·cm;

[0089] Air tightness test (He leak detection): Leakage rate <5×10 -8 atm·cc / s, meeting the aerospace-grade MIL-STD-883 standard.

[0090] VOC emissions <50 ppm, in compliance with GB 30981-2020 standards.

[0091] ‌Process compatibility‌: The temperature resistance of the microcapsule wall material is ≥180°C, which does not conflict with the staged curing process (DSC verification).‌

[0092] All technical features in this embodiment can be modified in appearance according to actual needs.

[0093] The above embodiments are preferred implementation schemes of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious replacement without departing from the concept of the present technical solution is within the scope of protection of the present invention.

Claims

1. A low-temperature curable epoxy structural adhesive that is high-temperature and corrosion-resistant, characterized by: Comprising component A and component B; The component A is prepared by mixing 30 to 40 parts by weight of alicyclic epoxy resin, 20 to 30 parts of biphenyl epoxy resin, 10 to 15 parts of CTBN epoxy pre-reactant, 5 to 8 parts of core-shell rubber toughening agent and 2 to 5 parts of fumed silica; The component B is prepared by mixing 25 to 30 parts by weight of a modified DETDA curing agent, 10 to 15 parts by weight of a microencapsulated acid anhydride, 25 to 35 parts by weight of a corrosion-resistant filler, 2 to 3 parts by weight of a coupling agent, and 1 to 2 parts by weight of a polyamide wax.

2. The low-temperature curable, high-temperature and corrosion-resistant epoxy structural adhesive according to claim 1, characterized in that: The alicyclic epoxy resin is TTA21, the biphenyl epoxy resin is YX4000H, and the usage ratio of the alicyclic epoxy resin to the biphenyl epoxy resin is 1-2:

1.

3. The low-temperature curable, high-temperature and corrosion-resistant epoxy structural adhesive according to claim 1, characterized in that: The microencapsulated acid anhydride is specifically microencapsulated methylhexahydrophthalic anhydride, with a core material content of ≥85% and a particle size D90 ≤50 μm.

4. The low-temperature curable, high-temperature and corrosion-resistant epoxy structural adhesive according to claim 1, characterized in that: The corrosion-resistant filler comprises 15 to 20 parts of h-BN and 5 to 10 parts of ZrO2.

5. The method for preparing a low-temperature curable, high-temperature and corrosion-resistant epoxy structural adhesive according to any one of claims 1 to 4, characterized in that: The following steps are involved: S1, resin matrix premixing: add alicyclic epoxy resin and biphenyl epoxy resin according to the formula amount into the reactor, stir at 500 rpm at 60°C for 30 minutes, add CTBN epoxy pre-reactant, raise the temperature to 80°C and continue stirring for 1 hour to obtain the resin matrix; S2, Toughener Dispersion: Premix the core-shell rubber toughener and fumed silica according to the formula amount, disperse in a high-shear emulsifier at 10,000 rpm for 10 minutes to form a stable suspension with a particle size of ≤200 nm. Slowly add the suspension to the resin matrix obtained in step S1, maintain at 60°C and vacuum at -0.08 MPa, mix for 1 hour, eliminate bubbles, and store in aliquots to obtain component A. S3, Synthesis of Modified DETDA: Diethyltoluenediamine and propylene oxide phenyl ether were reacted in a molar ratio of 1:0.3 at 80°C under nitrogen for 4 hours to produce an amine curing agent with a flexible chain segment, wherein the amine value was ≥400 mg KOH / g. S4, preparation of microencapsulated anhydride; S5, preparation of compound filler; S6, mixing and dispersing: The amine curing agent prepared in step S3 and the microencapsulated acid anhydride prepared in step S4 are mixed to form a curing agent system, and the composite filler prepared in step S5 is premixed with polyamide wax. The curing agent system is added in three times using a double planetary mixer at 2000 rpm and 60° C., with an interval of 5 minutes between each addition to ensure that the D90 particle size is ≤3 μm. The component B is then packaged and stored.

6. The method for preparing a low-temperature curable, high-temperature and corrosion-resistant epoxy structural adhesive according to claim 5, characterized in that: The specific method for preparing the microencapsulated acid anhydride in step S4 is as follows: methyl hexahydrophthalic anhydride is mixed with a polyurea-formaldehyde resin wall material by an in-situ polymerization method, and the mixture is reacted at pH = 3.5 and 60°C for 6 hours to form microcapsules; wherein the polyurea-formaldehyde resin wall material is obtained by mixing urea and formaldehyde in a molar ratio of 1:1.

5.

7. The method for preparing a low-temperature curable, high-temperature and corrosion-resistant epoxy structural adhesive according to claim 5, characterized in that: The specific method of compounding the filler in step S5 comprises the following steps: S51, h-BN modification: h-BN powder was immersed in 5% KH-560 ethanol solution, ultrasonicated for 40 min, and dried at 80°C to obtain a hydrophilic filler with a contact angle ≤30°; S52, ZrO2 activation: ZrO2 powder was treated with Ar plasma at 200W for 10 minutes to increase the surface hydroxyl density to ≥8.2 / nm², thereby obtaining plasma-activated ZrO2; wherein, the ZrO2 powder D50 = 1.2μm; S53, compounding: compound the h-BN hydrophilic filler obtained in step S51 and the ion-activated ZrO2 according to the ratio, first add the h-BN hydrophilic filler, pre-disperse it in a double planetary mixer at a low speed of 200 rpm for 10 minutes, then add the activated ZrO2, switch to a high speed of 800 rpm and mix for 20 minutes to obtain the compound filler.

8. The method for preparing a low-temperature curable, high-temperature and corrosion-resistant epoxy structural adhesive according to claim 5, characterized in that: In step S6, the premixed ratio of the composite filler and the polyamide wax is 16-20:

1.

9. Use of the epoxy structural adhesive that can be cured at low temperature and is resistant to high temperature and corrosion according to any one of claims 1 to 9, characterized in that: The structural adhesive is applied to ceramic chip packaging technology, and its specific use method includes the following steps: Step 1: Mix component A and component B under vacuum at 60°C with a stirring speed of 2000 rpm for 30 min to obtain a two-component mixed colloid; Step 2: The two-component mixed colloid mixed in step S1 is dispersed by three-roll milling, with the roller gap gradient set to 20 μm → 10 μm → 5 μm, and the number of cycles is ≥ 3 times; In step 3, the colloid dispersed in step 2 is pre-cured at 80°C for 90 minutes, then heated to 150°C and cured for 30 minutes to complete the packaging operation.

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