Multi-layer dielectric film charge uniform distribution high-voltage environment collaborative anti-breakdown optimization design method

Abstract

The invention relates to the technical field of electrical engineering, and discloses a multi-layer dielectric film charge uniform distribution high-voltage environment collaborative anti-breakdown optimization design method, which comprises the following steps: S1, material system design: selecting a polymer with polarization intensity greater than 30mC / m < 2 > and dielectric loss less than 0.015 as a basic dielectric material, and introducing a nano filler to construct a composite dielectric layer; s2, structural design: designing an asymmetric multilayer film structure with gradient dielectric constant distribution, and regulating and controlling a charge transmission path through an interface layer; and S3, process optimization is conducted, specifically, a nanoscale interface layer is prepared through the atomic layer deposition technology, and gradient structure forming is achieved in combination with the additive manufacturing technology. According to the method, the steps of material system design, structure design and the like are integrated to form a complete collaborative optimization method, so that the problems of local electric field concentration, low breakdown threshold and difficulty in reliability evaluation caused by charge accumulation due to the fact that most of traditional high-voltage dielectric film designs adopt single-dimension optimization are solved.

Description

Technical Field

[0001] The present invention relates to the field of electrical engineering technology, and in particular to a method for optimizing the design of a multi-layer dielectric film with uniformly distributed charges and coordinated breakdown protection in a high-voltage environment. Background Art

[0002] The multi-layer dielectric film charge uniform distribution high-voltage environment refers to a composite structure composed of multiple layers of insulating dielectric materials with different dielectric constants. Under the action of a high-voltage electric field, the capacitive voltage-dividing characteristics of each layer of dielectric are used to achieve uniform distribution of charge between layers, thereby suppressing the local electric field concentration phenomenon. Through dielectric constant matching and film thickness optimization, this structure can make the charge distribution at the interface more balanced, reduce the electric field strength borne by a single dielectric layer, improve the overall insulation withstand voltage performance, and reduce the risk of local discharge and dielectric aging. This environment is widely used in high-voltage power equipment insulation systems (such as transformers, cables, capacitors, etc.). It enhances insulation reliability through a charge uniform distribution mechanism, provides guarantees for stable operation in high-voltage scenarios, and has the dual advantages of electric field optimization and long-term protection.

[0003] Traditional high-voltage dielectric film designs mostly use single-dimensional optimization. Due to the lack of multi-factor coupling analysis and real-time monitoring methods, charge accumulation causes local electric field concentration, low breakdown threshold and difficult reliability assessment. Summary of the Invention

[0004] In response to the shortcomings of the existing technology, the present invention provides a multi-layer dielectric film charge uniform distribution high-voltage environment collaborative anti-breakdown optimization design method, which solves the problem that traditional high-voltage dielectric film design mostly adopts single-dimensional optimization, lacks multi-factor coupling analysis and real-time monitoring methods, resulting in charge accumulation causing local electric field concentration, low breakdown threshold and difficult reliability assessment.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: a multi-layer dielectric film charge uniform distribution high-voltage environment collaborative breakdown protection optimization design method, comprising the following steps:

[0006] S1. Material system design: Select polarization intensity greater than 30mC / m 2 A polymer with a dielectric loss lower than 0.015 is used as the basic dielectric material, and nanofillers are introduced to construct a composite dielectric layer;

[0007] S2. Structural Design: Design asymmetric multilayer structures with gradient dielectric constant distribution to regulate charge transfer pathways through interfacial layers;

[0008] S3. Process Optimization: Atomic layer deposition (ALD) is used to prepare nanoscale interface layers, combined with additive manufacturing (AM) to achieve gradient structure formation.

[0009] S4. Multi-physics coupling simulation: Establish a fully coupled model including electric field, temperature field, and stress field to simulate the performance of multilayer films under high-voltage environments;

[0010] S5. Intelligent monitoring system integration: Embed sensors in the multilayer membrane structure to collect charge distribution, temperature and stress parameters in real time, and analyze the data through machine learning algorithms.

[0011] By adopting the above-mentioned technical solution, a complete collaborative optimization method is formed by integrating material system design, structural design, process optimization, multi-physics field coupling simulation and intelligent monitoring system, thereby realizing the systematic design of charge distribution control, electric field homogenization and breakdown risk prediction of multi-layer dielectric membranes, thereby improving the traditional high-voltage dielectric membrane design that mostly adopts single-dimensional optimization. Due to the lack of multi-factor coupling analysis and real-time monitoring methods, the problem of charge accumulation causing local electric field concentration, low breakdown threshold and difficult reliability assessment is improved.

[0012] Preferably, the basic dielectric material in S1 is a relaxor ferroelectric polymer, the nanofiller is a two-dimensional boron nitride nanosheet or a graphene nanosheet, and the volume proportion of the nanofiller is 5%-15%.

[0013] Preferably, the multilayer film structure with gradient dielectric constant distribution in S2 comprises 3-7 dielectric layers, the difference in dielectric constants between adjacent layers is 1-5, and the dielectric constants are arranged in increasing or decreasing order along the electric field direction.

[0014] Preferably, the thickness of the interface layer prepared by the atomic layer deposition technology in S3 is 1-100 nm, and the additive manufacturing technology is digital light processing 3D printing or aerosol jet printing, and the layer thickness control accuracy is ±2 μm.

[0015] Preferably, the multi-physics field coupling simulation in S4 is implemented based on finite element analysis software, and the simulation conditions include 100-800kV / mm electric field strength, -50℃-150℃ temperature range and 0-10MPa mechanical stress.

[0016] Preferably, the sensor in S5 is a fiber Bragg grating sensor or a terahertz time-domain spectroscopy detection module, with a strain monitoring accuracy of ±5με, a temperature monitoring accuracy of ±0.5°C, and a charge density detection resolution of 10 -9 C / m 2 .

[0017] Preferably, the machine learning algorithm in S5 is a Bayesian optimization algorithm, which is iteratively optimized by the following formula: a(x) = μ(x) + kσ(x) where a(x) is the acquisition function value, μ(x) is the mean of the Gaussian process prediction, σ(x) is the standard deviation of the Gaussian process prediction, and k is a hyperparameter that controls the exploration-exploitation balance.

[0018] Preferably, the optimization goal of the Bayesian optimization algorithm is to minimize dielectric loss, and the optimization variables include the component ratio, layer thickness and gradient change rate of the dielectric layer.

[0019] Preferably, the intelligent monitoring system in S5 establishes a breakdown risk prediction model through a deep learning algorithm, and the input parameters are the real-time monitored electric field strength, temperature, stress and charge density.

[0020] Preferably, the multilayer film interface layer realizes charge compensation by controlling element diffusion, and the interface defect density is controlled within 10 -3 nm -2 the following.

[0021] The present invention provides a multi-layer dielectric film charge uniform distribution high-voltage environment collaborative breakdown protection optimization design method. It has the following beneficial effects:

[0022] 1. In the present invention, by integrating material system design, structural design, process optimization, multi-physics field coupling simulation and intelligent monitoring system to form a complete collaborative optimization method, a systematic design of charge distribution control, electric field uniformity and breakdown risk prediction of multi-layer dielectric membranes is realized, thereby improving the traditional high-voltage dielectric membrane design, which mostly adopts single-dimensional optimization. Due to the lack of multi-factor coupling analysis and real-time monitoring methods, the problem of charge accumulation causing local electric field concentration, low breakdown threshold and difficult reliability assessment is improved.

[0023] 2. In the present invention, by limiting the basic dielectric material to a relaxor ferroelectric polymer with high polarization strength and introducing two-dimensional nanofillers (5%-15% by volume), and designing a 3-7-layer gradient dielectric constant asymmetric structure (the dielectric constant difference between adjacent layers is 1-5), the interface polarization effect and electric field gradient control ability of the composite dielectric layer are enhanced, thereby improving the problem that most traditional composite dielectric membranes use ordinary polymer-based materials and have uniformly distributed structures, but due to insufficient polarization response and a single interface charge transfer path, the charge migration efficiency is low under high voltage, and electric field distortion is easily formed at the interface, leading to premature breakdown.

[0024] 3. In the present invention, a 1-100nm nanoscale interface layer is prepared by atomic layer deposition technology (layer thickness control accuracy of ±2μm) and combined with wide-range multi-physics field simulation (100-800kV / mm electric field, -50℃-150℃ temperature, 0-10MPa stress), thereby achieving precise control of interface defect density and quantitative analysis of performance evolution laws under complex working conditions, thereby improving the traditional membrane preparation process that mostly relies on empirical parameters and lacks environmental adaptability verification. Due to dense interface defects, poor layer thickness uniformity and inability to predict failure modes under extreme conditions, the membrane structure is insufficiently stable and the actual service life is short. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 Schematic diagram of the method steps of the present invention. DETAILED DESCRIPTION

[0026] The following will clearly and completely describe the technical solution of the present invention in conjunction with the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] Please see the attached Figure 1 The embodiment of the present invention provides a multi-layer dielectric film charge uniform distribution high voltage environment collaborative breakdown protection optimization design method, comprising the following steps:

[0028] S1. Material system design: Select polarization intensity greater than 30mC / m 2 A polymer with a dielectric loss lower than 0.015 is used as the basic dielectric material, and nanofillers are introduced to construct a composite dielectric layer;

[0029] S2. Structural Design: Design asymmetric multilayer structures with gradient dielectric constant distribution to regulate charge transfer pathways through interfacial layers;

[0030] S3. Process Optimization: Atomic layer deposition (ALD) is used to prepare nanoscale interface layers, combined with additive manufacturing (AM) to achieve gradient structure formation.

[0031] S4. Multi-physics coupling simulation: Establish a fully coupled model including electric field, temperature field, and stress field to simulate the performance of multilayer films under high-voltage environments;

[0032] S5. Intelligent monitoring system integration: Embed sensors in the multilayer membrane structure to collect charge distribution, temperature and stress parameters in real time, and analyze the data through machine learning algorithms.

[0033] Specifically, the polarization intensity is greater than 30mC / m through the design of S1 material system. 2The polymer with dielectric loss lower than 0.015 is used as the basic dielectric material and nanofillers are introduced to construct a composite dielectric layer, which can provide high polarization ability for the multilayer dielectric film to enhance the charge response ability, while reducing energy dissipation through low dielectric loss, and combining nanofillers to improve the interface polarization characteristics and mechanical properties, thereby improving the charge uniformity and anti-puncture performance of the multilayer dielectric film under high-voltage environment; through the S2 structure design of an asymmetric multilayer film structure with gradient dielectric constant distribution and regulating the charge transfer path through the interface layer, the dielectric constant gradient can be used to guide the charge to be uniformly distributed, the asymmetric structure optimizes the electric field distribution to suppress local field strength concentration, and the interface layer enhances the charge capture and release ability by regulating the charge transfer path, thereby reducing the risk of interface charge accumulation and improving the electric field uniformity and anti-puncture reliability of the multilayer dielectric film under high-voltage environment; through the S3 process optimization, atomic layer deposition technology is used to prepare a nano-scale interface layer and combined with additive manufacturing technology to realize gradient structure forming, the atomic-level precision of the atomic layer deposition technology can be used to control the thickness and composition of the interface layer, reduce interface defects and residual stress, and at the same time, the additive manufacturing technology is used to accurately form the gradient structure to ensure The consistency of the dielectric constant gradient distribution and the interlayer bonding strength are maintained, thereby improving the structural stability of the multilayer dielectric film and the charge transfer control accuracy. Through the S4 multi-physics field coupling simulation, a fully coupled model including electric field, temperature field, and stress field is established to simulate the performance of the multilayer film under high-voltage environment. It can comprehensively analyze the impact of multi-physics field interactions on the electric field distribution, heat accumulation and mechanical stress of the multilayer film, predict the dielectric performance degradation trend and potential breakdown risk points under high-voltage environment, and provide data support for material system design, structural parameter optimization and process improvement, thereby improving the reliability and environmental adaptability of the multilayer film design. Through the integration of the S5 intelligent monitoring system, sensors are embedded in the multilayer film structure to collect charge distribution, temperature and stress parameters in real time and analyze the data through machine learning algorithms. It can obtain the multi-dimensional physical parameters of the multilayer film under working state in real time, and analyze the parameter correlation characteristics through machine learning algorithms to realize charge distribution anomaly warning, temperature field and stress field evolution trend prediction and breakdown risk assessment, thereby providing real-time data-driven decision support for the operation, maintenance and performance optimization of the multilayer film, and improving its reliability and service life under high-voltage environment.

[0034] The basic dielectric material in S1 is a relaxor ferroelectric polymer, and the nanofiller is a two-dimensional boron nitride nanosheet or graphene nanosheet, with the volume proportion of the nanofiller being 5%-15%.

[0035] Specifically, by using relaxor ferroelectric polymer as the basic dielectric material in S1, the dielectric response capability is enhanced by utilizing its high spontaneous polarization characteristics; by introducing two-dimensional boron nitride nanosheets or graphene nanosheets as nanofillers (5%-15% by volume), the charge transfer path can be optimized through the high specific surface area and interface polarization effect of the nanofillers, while improving the thermal conductivity and mechanical strength of the composite dielectric layer, thereby significantly improving the charge distribution efficiency and electrical breakdown threshold of the multilayer film while maintaining low dielectric loss.

[0036] The multilayer film structure with gradient dielectric constant distribution in S2 includes 3-7 dielectric layers, the difference in dielectric constants between adjacent layers is 1-5, and the dielectric constants are arranged in increasing or decreasing order along the direction of the electric field.

[0037] Specifically, by designing a gradient dielectric constant distribution multilayer film structure containing 3-7 dielectric layers in S2, the difference in dielectric constants of adjacent layers is controlled to be 1-5 and arranged in increasing or decreasing order along the direction of the electric field. The dielectric constant gradient can be used to guide the directional migration of charges between layers, forming a charge density gradient that matches the electric field distribution, and suppressing charge accumulation at the interface; the 3-7-layer structure balances the design complexity and electric field control accuracy, and the limited range of the dielectric constant difference between adjacent layers ensures gradient continuity, avoids electric field distortion caused by sudden changes in dielectric constants, thereby achieving dynamic homogenization of the electric field in the multilayer film under high-voltage conditions and improving the overall anti-puncture performance.

[0038] The interface layer prepared by atomic layer deposition technology in S3 has a thickness of 1-100nm, and the additive manufacturing technology is digital light processing 3D printing or aerosol jet printing, with a layer thickness control accuracy of ±2μm.

[0039] Specifically, atomic layer deposition technology is used in S3 to prepare an interface layer with a thickness of 1-100nm, and its single atomic layer growth characteristics are utilized to achieve atomic-level precise control of the interface layer composition and thickness, reducing interface nano-voids and element diffusion defects; digital light processing 3D printing or aerosol jet printing is selected as an additive manufacturing technology, combined with a layer thickness control accuracy of ±2μm, to accurately form a gradient dielectric constant structure, ensure the thickness uniformity of each dielectric layer and the interface fit, avoid the uneven electric field distribution caused by layer thickness errors in traditional processes, thereby improving the density of the multilayer film structure and the stability of the dielectric properties.

[0040] The multi-physics coupling simulation in S4 is implemented based on finite element analysis software. The simulation conditions include 100-800kV / mm electric field strength, -50℃-150℃ temperature range and 0-10MPa mechanical stress.

[0041] Specifically, by implementing multi-physics field coupling simulation based on finite element analysis software in S4, setting simulation conditions of 100-800kV / mm electric field strength, -50℃-150℃ temperature range and 0-10MPa mechanical stress, it is possible to accurately simulate the coupling process of electric field distortion, thermal stress accumulation and mechanical deformation inside the multilayer film under a wide range of high voltage, temperature and stress environments; quantitatively analyze the influence of different field parameters on dielectric strength, thermal aging rate and structural stability, identify breakdown risk areas under extreme conditions, and provide multi-dimensional data verification for optimizing multilayer film material selection, interlayer matching and structural design, thereby improving the adaptability and reliability of the design scheme to complex service environments.

[0042] The sensor in S5 is a fiber Bragg grating sensor or a terahertz time-domain spectroscopy detection module, with a strain monitoring accuracy of ±5με, a temperature monitoring accuracy of ±0.5℃, and a charge density detection resolution of 10 -9 C / m 2 .

[0043] Specifically, by using fiber Bragg grating sensors or terahertz time-domain spectroscopy detection modules in S5, combined with ±5με strain monitoring accuracy, ±0.5℃ temperature monitoring accuracy and 10- 9 C / m 2 The charge density detection resolution can perform high-sensitivity real-time monitoring of the micro-strain, temperature field distribution and charge density of multi-layer films under high-pressure environments; accurately capture potential fault signals such as early interface debonding, local overheating and abnormal charge accumulation, and achieve quantitative assessment and early warning of breakdown risks through multi-parameter fusion analysis, providing real-time, high-precision data support for the status maintenance and design iteration of multi-layer films, thereby improving their safety and service life under complex working conditions.

[0044] The machine learning algorithm in S5 is a Bayesian optimization algorithm, which is iteratively optimized using the following formula: a(x) = μ(x) + kσ(x), where a(x) is the acquisition function value, μ(x) is the mean of the Gaussian process prediction, σ(x) is the standard deviation of the Gaussian process prediction, and k is a hyperparameter that controls the exploration-exploitation balance.

[0045] Specifically, S5 adopts a Bayesian optimization algorithm and iterative optimization based on the formula a(x) = μ(x) + kσ(x). Gaussian process modeling is used to predict the mean μ(x) and standard deviation σ(x) of the multilayer film performance parameters. The hyperparameter k is balanced to explore the new parameter space and utilize the weight of the existing optimal solution. The collected function value a(x) guides the algorithm to efficiently search for the optimal design parameter combination under multi-dimensional objectives such as dielectric loss and breakdown field strength, reducing the experimental cost of the traditional trial-and-error method, and improving the optimization efficiency and global optimality of the multilayer film structural parameters (such as layer thickness and dielectric constant gradient), thereby achieving a synergistic improvement in charge distribution and anti-breakdown performance under high-voltage environment.

[0046] The optimization goal of the Bayesian optimization algorithm is to minimize the dielectric loss, and the optimization variables include the component ratio, layer thickness and gradient change rate of the dielectric layer.

[0047] Specifically, by setting the optimization goal of the Bayesian optimization algorithm to minimizing dielectric loss, and using the component ratio, layer thickness and gradient change rate of the dielectric layer as optimization variables, it is possible to automatically search for the optimal solution that takes into account both the material polarization performance and energy loss in the high-dimensional parameter space: by adjusting the component ratio, the interface coupling between the polymer and the nanofiller is optimized to reduce the polarization loss; the layer thickness and gradient change rate are precisely controlled to optimize the electric field distribution to reduce the loss caused by charge accumulation; by utilizing the global search capability of the algorithm, a systematic reduction of dielectric loss is achieved under the interaction of complex parameters, thereby improving the energy transmission efficiency and long-term stability of the multilayer film under high-voltage environment.

[0048] The intelligent monitoring system in S5 establishes a breakdown risk prediction model through a deep learning algorithm, with the input parameters being the real-time monitored electric field strength, temperature, stress and charge density.

[0049] Specifically, by establishing a breakdown risk prediction model based on a deep learning algorithm in S5 and inputting real-time monitored electric field strength, temperature, stress and charge density parameters, the nonlinear feature extraction capability of deep learning can be used to analyze the complex coupling relationship between multi-physical field parameters; by training the model to learn the breakdown precursor characteristics in historical data, the risk level assessment and remaining life prediction of the current state of the multi-layer film can be achieved; the multi-dimensional parameters input in real time can dynamically update the model prediction results, provide early warning of potential breakdown risks, and provide data-driven and precise support for operation and maintenance decisions, thereby improving the reliability and fault prevention capabilities of the multi-layer film in high-voltage environments.

[0050] The multilayer interface layer achieves charge compensation by controlling element diffusion, and the interface defect density is controlled within 10 -3 nm -2 the following.

[0051] Specifically, charge compensation is achieved by controlling the element diffusion in the multilayer interface layer, and the interface defect density is controlled within 10 -3 nm -2 The following can effectively suppress charge accumulation and trap effects at the interface: the gradient charge distribution formed by element diffusion can neutralize the opposite charges on both sides of the interface and reduce the degree of interface electric field distortion; low defect density reduces the energy loss and local electric field enhancement in the charge capture-release process, thereby improving the dielectric strength and charge transport stability of the interface area, delaying the interface aging and breakdown process caused by charge imbalance, and enhancing the long-term reliability of the multilayer film structure under high voltage, temperature and stress coupling environment.

[0052] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A multi-layer dielectric film charge uniform distribution high voltage environment collaborative breakdown protection optimization design method, characterized by: The following steps are involved: S1. Material system design: Select polarization intensity greater than 30mC / m 2 A polymer with a dielectric loss lower than 0.015 is used as the basic dielectric material, and nanofillers are introduced to construct a composite dielectric layer; S2. Structural Design: Design asymmetric multilayer structures with gradient dielectric constant distribution to regulate charge transfer pathways through interfacial layers; S3. Process Optimization: Atomic layer deposition (ALD) is used to prepare nanoscale interface layers, combined with additive manufacturing (AM) to achieve gradient structure formation. S4. Multi-physics coupling simulation: Establish a fully coupled model including electric field, temperature field, and stress field to simulate the performance of multilayer films under high-voltage environments; S5. Intelligent monitoring system integration: Embed sensors in the multilayer membrane structure to collect charge distribution, temperature and stress parameters in real time, and analyze the data through machine learning algorithms.

2. The method for optimizing design of multi-layer dielectric films for uniform charge distribution and high-voltage environment-coordinated breakdown protection according to claim 1, characterized in that: The basic dielectric material in S1 is a relaxor ferroelectric polymer, the nanofiller is a two-dimensional boron nitride nanosheet or a graphene nanosheet, and the volume proportion of the nanofiller is 5%-15%.

3. The multi-layer dielectric film charge uniform distribution high voltage environment collaborative breakdown protection optimization design method according to claim 1 is characterized by: The multilayer film structure with gradient dielectric constant distribution in S2 comprises 3-7 dielectric layers, the difference in dielectric constants between adjacent layers is 1-5, and the dielectric constants are arranged in increasing or decreasing order along the direction of the electric field.

4. The multi-layer dielectric film charge uniform distribution high voltage environment collaborative breakdown prevention optimization design method according to claim 1 is characterized in that: The thickness of the interface layer prepared by the atomic layer deposition technology in S3 is 1-100 nm, and the additive manufacturing technology is digital light processing 3D printing or aerosol jet printing, and the layer thickness control accuracy is ±2 μm.

5. The multi-layer dielectric film charge uniform distribution high voltage environment collaborative breakdown prevention optimization design method according to claim 1 is characterized in that: The multi-physics field coupling simulation in S4 is implemented based on finite element analysis software, and the simulation conditions include 100-800 kV / mm electric field strength, -50°C-150°C temperature range and 0-10 MPa mechanical stress.

6. The method for optimizing design of multi-layer dielectric films for uniform charge distribution and coordinated breakdown protection in a high-voltage environment according to claim 1, characterized in that: The sensor in S5 is a fiber Bragg grating sensor or a terahertz time-domain spectroscopy detection module, with a strain monitoring accuracy of ±5με, a temperature monitoring accuracy of ±0.5°C, and a charge density detection resolution of 10 -9 C / m 2 .

7. The method for optimizing design of multi-layer dielectric films for uniform charge distribution and high-voltage environment-coordinated breakdown protection according to claim 1, characterized in that: The machine learning algorithm in S5 is a Bayesian optimization algorithm, which is iteratively optimized by the following formula: a(x)=μ(x)+kσ(x) where, a(x) is the acquisition function value, μ(x) is the mean of the Gaussian process prediction, σ(x) is the standard deviation of the Gaussian process prediction, and k is a hyperparameter that controls the exploration-exploitation balance.

8. The method for optimizing design of multi-layer dielectric films for uniform charge distribution and coordinated breakdown protection in a high-voltage environment according to claim 7, characterized in that: The optimization goal of the Bayesian optimization algorithm is to minimize dielectric loss, and the optimization variables include the component ratio, layer thickness and gradient change rate of the dielectric layer.

9. The method for optimizing design of multi-layer dielectric films for uniform charge distribution and coordinated breakdown protection in a high-voltage environment according to claim 1, characterized in that: The intelligent monitoring system in S5 establishes a breakdown risk prediction model through a deep learning algorithm, and the input parameters are the real-time monitored electric field strength, temperature, stress and charge density.

10. The method for optimizing design of multi-layer dielectric film charge uniform distribution and high voltage environment collaborative breakdown protection according to claim 1, characterized in that: The multilayer interface layer achieves charge compensation by controlling element diffusion, and the interface defect density is controlled within 10 - 3 nm -2 the following.

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