FCWB copper pillar bump in-situ optical detection and laser repair integrated method and system

Abstract

The invention relates to the technical field of semiconductor packaging detection and repair, in particular to an FCWB copper column bump in-situ optical detection and laser repair integrated method and system, comprising: constructing a repair parameter database which comprises a plurality of repair parameter nodes, and the repair parameter nodes comprise fault repair parameters and reference clustering data; fault diagnosis is carried out on the initial chip to obtain a to-be-repaired chip or a first fault chip, if the initial chip is the to-be-repaired chip, fault diagnosis is carried out on the to-be-repaired chip to obtain diagnosis detection data, and after target detection parameters are retrieved in a parameter database by utilizing the diagnosis detection data, the to-be-repaired chip is subjected to fault diagnosis; and if yes, repairing the to-be-repaired chip by using a fault repairing parameter corresponding to the target detection parameter and a laser repairing unit to obtain a first repaired chip, and performing secondary diagnosis on the first repaired chip. According to the invention, the accuracy and the intelligent degree of parameter setting required by laser repair can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging detection and repair, and in particular to an integrated method and system for in-situ optical detection and laser repair of FCWB copper pillar bumps. Background Art

[0002] With the increase in chip interconnection density, copper pillar bumps have become the core interconnect structure of FCWB packaging due to their excellent electrothermal performance. However, there are still certain technical defects in the manufacturing of copper pillar bumps. Correspondingly, accurately detecting copper pillar bump failures and repairing them are of great significance to ensuring the normal and safe use of copper pillar bumps.

[0003] Currently, when using laser to repair copper pillar bumps, fixed energy parameters are often used to repair the copper pillar bumps.

[0004] While the aforementioned method can repair copper pillar bumps, it fails to consider the different fault locations and severity levels when setting laser parameters. This results in wasted energy and a chain reaction of thermal damage during the repair process. Therefore, intelligently and accurately setting laser parameters for copper pillar bump repair has become a pressing issue. Summary of the Invention

[0005] The present invention provides an integrated method for in-situ optical detection and laser repair of FCWB copper pillar bumps and a computer-readable storage medium, the main purpose of which is to improve the accuracy and intelligence of parameter setting required for laser repair.

[0006] To achieve the above objectives, the present invention provides an integrated method for in-situ optical inspection and laser repair of FCWB copper pillar bumps, comprising:

[0007] Receiving a detection and repair instruction, and determining a detection and repair environment based on the detection and repair instruction, wherein the detection and repair environment includes an initial chip set to be detected and a detection and repair system, and the detection and repair system includes a first detection unit, a second detection unit, a repair data construction unit, and a laser repair unit, wherein the initial chip set includes a plurality of initial chips, and the initial chips include a plurality of initial copper pillar bumps to be detected;

[0008] Building a repair parameter database based on the repair data building unit, wherein the repair parameter database includes a plurality of repair parameter nodes, and the repair parameter nodes include fault repair parameters and reference cluster data;

[0009] For each initial chip in the initial chip set, perform the following operations:

[0010] Performing fault diagnosis on the initial chip using the first detection unit to obtain a chip to be repaired or a first faulty chip;

[0011] If the initial chip is a chip to be repaired, the second detection unit is used to perform fault diagnosis on the chip to be repaired to obtain diagnostic detection data, which is then used to search the parameter database. After confirming that the target detection parameters are retrieved from the parameter database, the fault repair parameters corresponding to the target detection parameters and the laser repair unit are used to repair the chip to be repaired to obtain a first repaired chip.

[0012] Taking the first repair chip as the initial chip, return to the step of using the first detection unit to perform fault diagnosis on the initial chip until the first repair chip or the first fault chip is obtained, and summarize the first repair chip and the first fault chip respectively to obtain a qualified chip set and a fault chip set, thereby realizing the detection and repair of copper pillar bumps.

[0013] Optionally, constructing a repair parameter database based on the repair data construction unit includes:

[0014] Acquiring a historical repair data set based on the repair data construction unit, wherein the historical repair data set includes a plurality of historical repair data, and the historical repair data includes: a copper pillar bump fault location, copper pillar bump geometric parameters, a copper pillar bump fault type, a copper pillar bump fault range, and a fault repair method node, wherein the fault repair method node includes a fault repair method, fault repair parameters, and a fault repair result, and the fault repair result includes a repair success and a repair failure;

[0015] Summarize historical repair data in the historical repair data set according to the copper pillar bump failure location and the fault repair method to obtain one or more initial analysis data sets;

[0016] The following operations are performed on each of the one or more initial analysis data sets:

[0017] Clustering the initial analysis data in the initial analysis data set using a pre-built clustering method to obtain one or more first analysis data sets, and performing the following operations on each of the one or more first analysis data sets:

[0018] Extracting first analysis data indicating that the fault repair result is successful from the first analysis data set to obtain a second analysis data set;

[0019] Counting the number of first analysis data in the first analysis data set and the number of second analysis data in the second analysis data set to obtain a first analysis number and a second analysis number;

[0020] Calculating a ratio of the second analysis quantity to the first analysis quantity to obtain a repair qualified rate, summarizing the repair qualified rates to obtain a repair qualified rate set, and normalizing the repair qualified rate set to obtain a normalized qualified rate set;

[0021] A repair parameter database is determined based on the normalized pass rate set.

[0022] Optionally, clustering the initial analysis data in the initial analysis data set using a pre-built clustering method to obtain one or more first analysis data sets includes:

[0023] Obtain a copper pillar bump fault type-metric standard table, retrieve a target metric standard from the fault type-metric standard table based on the copper pillar bump fault type corresponding to the first analysis data set, and perform the following operations on each first analysis data in the first analysis data set:

[0024] Reference cluster data is constructed according to the target metric standard, copper pillar bump geometric parameters and copper pillar bump failure range, the reference cluster data is summarized to obtain a reference cluster data set, and the reference cluster data in the reference cluster data set is clustered to obtain one or more first analysis data sets.

[0025] Optionally, the determining of a repair parameter database based on the normalized pass rate set includes:

[0026] Using a preset normalization threshold, extracting an initial qualified rate set from the normalized qualified rate set, wherein the initial qualified rates in the initial qualified rate set are all greater than or equal to the normalization threshold;

[0027] Obtain a fault repair energy consumption set according to the fault repair parameter corresponding to the initial qualified rate in the initial qualified rate set, and perform a normalization operation on the fault repair energy consumption set to obtain a normalized repair energy consumption set;

[0028] The following operations are performed for each initial qualified rate in the initial qualified rate set:

[0029] Obtaining a comprehensive evaluation value based on an initial qualified rate and a normalized repair energy consumption corresponding to the initial qualified rate in a normalized repair energy consumption set, summarizing the comprehensive evaluation values ​​to obtain a comprehensive evaluation value set, summarizing the comprehensive evaluation value set to obtain multiple comprehensive evaluation value sets, extracting a target comprehensive evaluation value set from the multiple comprehensive evaluation value sets using the copper pillar bump fault location, and confirming target repair data based on the target comprehensive evaluation value set, wherein the target repair data is historical repair data corresponding to the largest comprehensive evaluation value in the comprehensive evaluation value set;

[0030] Summarize the target repair data to obtain the repair parameter database.

[0031] Optionally, the performing fault diagnosis on the initial chip by using the first detection unit to obtain the chip to be repaired or the first faulty chip includes:

[0032] Obtaining the reference center coordinates of each initial copper pillar bump in the initial chip, and acquiring a reference copper pillar image using a pre-built image acquisition unit and the reference center coordinates;

[0033] Acquiring a segmented image model set based on the first detection unit, and extracting a copper pillar bump image set from a reference copper pillar image using the segmented image model set, wherein the copper pillar bump image set includes a plurality of copper pillar bump images, and the copper pillar bump images correspond one-to-one to the segmented image models;

[0034] Count the number of segmentation image models in the segmentation image model set to obtain the number of segmentation models. Map each copper pillar bump image in the copper pillar bump image set to a pre-constructed image coordinate system to obtain a mapping coordinate point set. The mapping coordinate point set includes multiple mapping coordinate points. Perform the following operation on each mapping coordinate point in the mapping coordinate point set:

[0035] Counting the number of times the mapping coordinate point is mapped and the segmentation image model set corresponding to the mapping coordinate point to obtain the mapping number and the mapping image model set, obtaining mapping feasibility based on the mapping number and the mapping image model set, and comparing the mapping credibility with a preset credibility threshold;

[0036] If the mapping credibility is less than the credibility threshold, the mapping coordinate point is removed from the mapping coordinate point set;

[0037] Otherwise, the retained mapping coordinate points are summarized to obtain an updated coordinate point set, and the updated center coordinates are obtained using the updated coordinate point set;

[0038] A chip to be repaired or a first faulty chip is obtained based on the updated center coordinates and the reference center coordinates.

[0039] Optionally, obtaining mapping credibility according to the number of mappings, the number of segmentation models, and the mapping image model set includes:

[0040] Obtain the reference recognition nodes of the mapped image model in the mapped image model set to obtain a reference recognition node set, where the reference recognition nodes include the reference training number and the reference recognition number. Calculate the mapping credibility based on the mapping times, the number of segmentation models, and the reference recognition node set. The calculation formula is as follows:

[0041]

[0042] Among them, Y represents the mapping credibility, ω are all preset coefficients, s represents the number of mappings, and f represents the number of segmentation models. represents the error rate of the i-th mapping image model in the mapping image model set, b represents the reference recognition number, x represents the reference training number, x i 、x j They respectively represent the reference training quantity corresponding to the i-th mapping image model and the reference training quantity corresponding to the j-th mapping image model in the mapping image model set.

[0043] Optionally, acquiring the chip to be repaired or the first faulty chip based on the updated center coordinates and the reference center coordinates includes:

[0044] Get the coordinate difference between the updated center coordinates and the reference center coordinates;

[0045] comparing the coordinate difference value with a preset coordinate deviation threshold;

[0046] If the coordinate difference value is greater than or equal to the coordinate deviation threshold, the initial chip is confirmed to be the first faulty chip;

[0047] Otherwise, the number of coordinate difference values ​​less than the coordinate deviation threshold is counted to obtain an evaluation number, the number of initial copper pillar bumps in the initial chip is counted to obtain a reference number, and the ratio of the evaluation number to the reference number is calculated to obtain a deviation ratio;

[0048] Comparing the deviation ratio with a preset ratio threshold;

[0049] If the deviation ratio is less than the ratio threshold, the initial chip is confirmed to be a chip to be repaired;

[0050] Otherwise, the diagnosis result of the initial chip is confirmed to be the first faulty chip.

[0051] Optionally, the performing fault diagnosis on the chip to be repaired by the second detection unit to obtain diagnostic detection data includes:

[0052] The chip to be repaired is scanned and three-dimensionally reconstructed using the second detection unit to obtain a scan model, wherein the scan model includes multiple scanned copper pillar bumps, and the scanned copper pillar bumps correspond one-to-one to the initial copper pillar bumps. The following operations are performed on each of the multiple scanned copper pillar bumps:

[0053] Obtain theoretical copper pillar bumps based on initial copper pillar bumps and reference center coordinates corresponding to the scanned copper pillar bumps;

[0054] Using theoretical copper pillar bumps, the scanned copper pillar bumps are overlapped and screened to obtain the deviation copper pillar area;

[0055] Diagnostic test data is acquired based on the deviation copper pillar area.

[0056] Optionally, searching a parameter database using the diagnostic test data to confirm that the target test parameter is retrieved from the parameter database includes:

[0057] respectively obtaining the diagnostic detection part of the diagnostic detection data and the size parameters of the scanned model, and searching the restoration parameter database for an initial diagnostic database according to the diagnostic detection part and the size parameters, wherein the initial diagnostic database includes a plurality of initial parameter nodes;

[0058] For each of the multiple initial parameter nodes, perform the following operations:

[0059] Calculate the difference between the matched monitoring parameters and the diagnostic test data in the initial parameter node;

[0060] Summarizing the difference values ​​to obtain a difference value set, extracting the minimum difference value from the difference value set to obtain a target comparison value;

[0061] The target comparison value is compared with the preset target comparison threshold. If the target comparison value is less than or equal to the target comparison threshold, the fault repair parameter corresponding to the matching monitoring parameter is used as the target detection parameter.

[0062] To achieve the above objectives, the present invention further provides an integrated system for in-situ optical inspection and laser repair of FCWB copper pillar bumps, comprising:

[0063] A detection and repair environment confirmation module is used to receive a detection and repair instruction and confirm a detection and repair environment based on the detection and repair instruction, wherein the detection and repair environment includes an initial chip set to be detected and a detection and repair system, and the detection and repair system includes a first detection unit, a second detection unit, a repair data construction unit and a laser repair unit, wherein the initial chip set includes multiple initial chips, and the initial chips include multiple initial copper pillar bumps to be detected;

[0064] a laser repair parameter confirmation module, configured to construct a repair parameter database based on the repair data construction unit, wherein the repair parameter database includes a plurality of repair parameter nodes, and the repair parameter nodes include fault repair parameters and reference cluster data;

[0065] The initial chip diagnostic module is used to perform the following operations on each initial chip in the initial chip set:

[0066] Performing fault diagnosis on the initial chip using the first detection unit to obtain a chip to be repaired or a first faulty chip;

[0067] If the initial chip is a chip to be repaired, the second detection unit is used to perform fault diagnosis on the chip to be repaired to obtain diagnostic detection data, which is then used to search the parameter database. After confirming that the target detection parameters are retrieved from the parameter database, the fault repair parameters corresponding to the target detection parameters and the laser repair unit are used to repair the chip to be repaired to obtain a first repaired chip.

[0068] The repair chip detection module is used to use the first repair chip as the initial chip, return to the step of using the first detection unit to diagnose the fault of the initial chip until the first repair chip or the first fault chip is obtained, and respectively summarize the first repair chip and the first fault chip to obtain a qualified chip set and a fault chip set, thereby realizing the detection and repair of copper pillar bumps.

[0069] In order to solve the above problem, the present invention further provides an electronic device, comprising:

[0070] A memory storing at least one instruction; and a processor executing the instruction stored in the memory to implement the above-mentioned integrated method for in-situ optical inspection and laser repair of FCWB copper pillar bumps.

[0071] In order to solve the above problems, the present invention also provides a computer-readable storage medium, which stores at least one instruction, and the at least one instruction is executed by a processor in an electronic device to implement the above-mentioned FCWB copper pillar bump in-situ optical inspection and laser repair integrated method.

[0072] The present invention solves the problem described in the background technology. The present invention constructs a repair parameter database based on the repair data construction unit, wherein the repair parameter database includes multiple repair parameter nodes, and the repair parameter nodes include fault repair parameters and reference clustering data. It can be seen that the present invention obtains a historical repair data set before detecting the copper pillar bumps in the initial chip, and screens and analyzes the repair data in the historical repair data set, so that the obtained repair parameter database is more accurate. The present invention uses the first detection unit to perform fault diagnosis on the initial chip to obtain the chip to be repaired or the first faulty chip. When diagnosing the initial chip, the present invention combines the characteristics of different segmentation image models to obtain updated center coordinates, so that the obtained updated center coordinates are more accurate, so as to improve the accuracy of diagnosis of the initial chip, and when diagnosing the initial chip, it also considers local factors and overall factors, that is, coordinate difference values ​​and deviation ratios, further improving the intelligence level of diagnosis of the initial chip. If the initial chip is the chip to be repaired, the present invention uses the second detection unit to perform fault diagnosis on the chip to be repaired, obtaining diagnostic detection data. The diagnostic detection data is then used to search a parameter database. After confirming that the target detection parameters have been retrieved from the parameter database, the chip to be repaired is repaired using the fault repair parameters corresponding to the target detection parameters and the laser repair unit to obtain a first repaired chip. This shows that when retrieving the target detection parameters, the present invention also considers the fault area of ​​the chip to be repaired and the quantized parameters corresponding to the fault area. Here, the quantized parameters are the diagnostic detection data, and the fault area is the deviation copper pillar area, thereby improving the accuracy of detecting the target detection parameters. The present invention uses the first repair chip as the initial chip and returns to the step of performing fault diagnosis on the initial chip using the first detection unit until the first repair chip or the first faulty chip is obtained. The first repair chip and the first faulty chip are respectively aggregated to obtain a qualified chip set and a faulty chip set, thereby achieving copper pillar bump detection and repair. This shows that after repairing the chip to be repaired, the present invention verifies the repaired chip to improve the intelligent repair process for the chip to be repaired. Therefore, the present invention can improve the accuracy and intelligence of parameter setting required for laser repair. BRIEF DESCRIPTION OF THE DRAWINGS

[0073] Figure 1 A schematic flow chart of an integrated method for in-situ optical inspection and laser repair of FCWB copper pillar bumps provided in one embodiment of the present invention;

[0074] Figure 2 This is a functional module diagram of an integrated system for in-situ optical inspection and laser repair of FCWB copper pillar bumps provided by one embodiment of the present invention;

[0075] Figure 3A schematic structural diagram of an electronic device for implementing the integrated method of in-situ optical inspection and laser repair of FCWB copper pillar bumps provided in one embodiment of the present invention.

[0076] Description of reference numerals:

[0077] 1. Electronic device; 10. Processor; 11. Memory; 12. Bus.

[0078] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0079] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0080] The present embodiment provides an integrated method for in-situ optical inspection and laser repair of copper pillar bumps on FCWBs. The method can be performed by at least one electronic device, such as a server or terminal, that can be configured to perform the method provided in the present embodiment. In other words, the method can be performed by software or hardware installed on a terminal or server device, where the software can be a blockchain platform. The server can include, but is not limited to, a single server, a server cluster, a cloud server, or a cloud server cluster.

[0081] Reference Figure 1 FIG. 1 is a flow chart of an integrated method for in-situ optical inspection and laser repair of FCWB copper pillar bumps according to an embodiment of the present invention. In this embodiment, the integrated method for in-situ optical inspection and laser repair of FCWB copper pillar bumps includes:

[0082] S1. Receive a detection and repair instruction, and confirm a detection and repair environment based on the detection and repair instruction, wherein the detection and repair environment includes an initial chip set to be detected and a detection and repair system, and the detection and repair system includes a first detection unit, a second detection unit, a repair data construction unit and a laser repair unit, wherein the initial chip set includes multiple initial chips, and the initial chip includes multiple initial copper pillar bumps to be detected.

[0083] It needs to be explained that the inspection and repair instructions are instructions issued by the quality inspectors of the FCWB copper pillar bumps. Their purpose is to realize the inspection of the initial copper pillar bumps, classify the initial copper pillar bumps according to the inspection results of the initial copper pillar bumps, and repair the initial copper pillar bumps that can be repaired after classification, or screen out the initial chips that cannot be repaired from the initial chip set according to the inspection results, so as to realize the intelligent inspection and repair of the initial copper pillar bumps.

[0084] Furthermore, FCWB (Flexible Circuit with Bump) is a flexible circuit board packaging technology that is commonly used in the field of advanced packaging, especially in high-density interconnection and three-dimensional system-level packaging. Its key feature is the use of copper pillar bumps instead of traditional solder bumps to achieve smaller spacing, higher reliability and better thermal performance. Copper pillar bumps are usually formed on silicon vias through an electroplating process to form a high copper pillar structure and covered with a thin solder film on the top. This structure not only improves the mechanical strength, but also improves the heat dissipation performance. In addition, by adding a nickel layer between the copper pillar and the solder layer, the formation of intermetallic compounds can be effectively alleviated, thereby improving the reliability of the interconnection.

[0085] It is understood that in the embodiments of the present invention, the initial copper pillar bump is the copper pillar bump. The initial chip refers to a substrate including the initial copper pillar bump. For example, the initial copper pillar bump is made on the surface of the I / O pad of the silicon chip. The detection and repair system refers to an app or applet for detecting and repairing the initial copper pillar bump, and the detection and repair system includes a first detection unit, a second detection unit, a repair data construction unit, and a laser repair unit. Please refer to the subsequent embodiments for the specific application of the units.

[0086] Exemplarily, in order to realize the quality monitoring of the initial copper pillar bumps on each initial chip in the initial chip set, the quality inspector issues the inspection and repair instruction and confirms the inspection and repair environment. The inspection system in the inspection and repair environment can realize the classification of the initial chips in the initial chip set, wherein the initial chips in the initial chip set are divided into repairable initial chips and unrepairable initial chips, and the repairable initial chips are repaired by the inspection and repair system, and then quality inspection is performed again. When it is confirmed that the repairable initial chips are repaired, a quality diagnosis report is generated using the unrepairable initial chips. After the initial chips after the confirmed repair are transported to the pre-confirmed use area, the quality diagnosis report is sent to the initiator of the inspection and repair instruction to realize the inspection and repair of the initial copper pillar bumps.

[0087] S2. Constructing a repair parameter database based on the repair data construction unit, wherein the repair parameter database includes a plurality of repair parameter nodes, and the repair parameter nodes include fault repair parameters and reference cluster data.

[0088] It should be explained that the construction of the repair parameter database based on the repair data construction unit includes:

[0089] Acquiring a historical repair data set based on the repair data construction unit, wherein the historical repair data set includes a plurality of historical repair data, and the historical repair data includes: a copper pillar bump fault location, copper pillar bump geometric parameters, a copper pillar bump fault type, a copper pillar bump fault range, and a fault repair method node, wherein the fault repair method node includes a fault repair method, fault repair parameters, and a fault repair result, and the fault repair result includes a repair success and a repair failure;

[0090] Summarize historical repair data in the historical repair data set according to the copper pillar bump failure location and the fault repair method to obtain one or more initial analysis data sets;

[0091] The following operations are performed on each of the one or more initial analysis data sets:

[0092] Clustering the initial analysis data in the initial analysis data set using a pre-built clustering method to obtain one or more first analysis data sets, and performing the following operations on each of the one or more first analysis data sets:

[0093] Extracting first analysis data indicating that the fault repair result is successful from the first analysis data set to obtain a second analysis data set;

[0094] Counting the number of first analysis data in the first analysis data set and the number of second analysis data in the second analysis data set to obtain a first analysis number and a second analysis number;

[0095] Calculating a ratio of the second analysis quantity to the first analysis quantity to obtain a repair qualified rate, summarizing the repair qualified rates to obtain a repair qualified rate set, and normalizing the repair qualified rate set to obtain a normalized qualified rate set;

[0096] A repair parameter database is determined based on the normalized pass rate set.

[0097] It should be explained that historical repair data refers to data recorded when repairing faulty areas in copper pillar bumps. Optionally, publicly available repair datasets can be obtained by merging and deduplicating, and used as the historical repair dataset. A copper pillar bump fault location refers to the location in the copper pillar bump where the fault occurs. Examples include the copper pillar, the copper pillar and solder cap, and the solder cap and bonding interface. A copper pillar bump geometric parameter refers to the geometric parameters of the current copper pillar bump, including but not limited to the copper pillar bump's height and diameter. A copper pillar bump failure type refers to the corresponding fault type when a copper pillar bump fails. For example, by classifying different faults based on the characteristics of copper pillar bump failures, copper pillar bump failure types can be categorized into: height deviation, diameter deviation, volume deviation, position deviation, and collapse deformation in geometric dimension and shape errors; and voids, cracks, intermetallic compound anomalies, oxidation and contamination, and electroplating defects in material and metallurgical defects. A copper pillar bump failure range refers to the range of quantized values ​​of a copper pillar bump when a particular copper pillar bump failure type occurs. For example, when the fault type of the copper pillar bump is height deviation, the copper pillar bump fault type may be the absolute difference between the current height value of the copper pillar bump and the standard height value of the copper pillar bump. The fault repair method refers to the method used to repair the copper pillar bump. For example, the laser-assisted micro-dot tin method is used to repair insufficient height. The fault repair parameters refer to the parameters of the repair method used when repairing the copper pillar bump. For example, the power, heating rate, and cooling rate of the laser. A successful repair indicates that the copper pillar bump has been successfully repaired, and a failed repair indicates that the copper pillar bump has not been successfully repaired and the copper pillar bump should be remade.

[0098] Furthermore, the clustering of the initial analysis data in the initial analysis data set using a pre-built clustering method to obtain one or more first analysis data sets includes:

[0099] Obtain a copper pillar bump fault type-metric standard table, retrieve a target metric standard from the fault type-metric standard table based on the copper pillar bump fault type corresponding to the first analysis data set, and perform the following operations on each first analysis data in the first analysis data set:

[0100] Reference cluster data is constructed based on the target metric, copper pillar bump geometry parameters, and copper pillar bump failure range. The reference cluster data is as follows:

[0101] c={J,J1,F,M},M={m1,m2,…,m n}

[0102] Where c represents the reference cluster data, J represents the copper pillar bump geometric parameters, J1 represents the copper pillar bump theoretical geometric parameters, F represents the copper pillar bump failure range, M represents the copper pillar bump metric data under the target metric standard, m1 and m2 represent the first metric standard parameter and the second metric standard parameter in the metric standard data, respectively, and n represents the total number of n metric standard parameters in the metric standard data, and the metric standard data is related to the target metric standard, copper pillar bump geometric parameters, and copper pillar bump failure range.

[0103] The reference cluster data are aggregated to obtain a reference cluster data set, and the reference cluster data in the reference cluster data set are clustered to obtain one or more first analysis data sets.

[0104] It should be explained that the fault type-metric table refers to a table that stores copper pillar bump fault types and their corresponding metrics. The target metric refers to the standard for evaluating the first analysis data, with the purpose of unifying the standard for diagnosing copper pillar bumps to improve the accuracy of clustering the initial analysis data. Optionally, the fault type-metric can obtain factors that affect the copper pillar bump fault type through principal component analysis. Other methods can achieve the same effect and will not be repeated here. Here, factors can be used to convert copper pillar bump geometric parameters and copper pillar bump fault ranges into metric parameters. Generally speaking, different copper pillar bump fault types have different corresponding metrics. For example, when a copper pillar bump has lateral bending, the metric used to evaluate the copper pillar bump during lateral bending may include: the geometric coordinates where the lateral bending begins in the copper pillar bump, the angle of the lateral bending, and the copper pillar bump geometric parameters. Generally speaking, different copper pillar bump geometric parameters and different degrees of lateral bending will affect the success rate of copper pillar bump repair. Therefore, using the target metric to convert the first analysis data into reference clustering data can improve the accuracy of clustering the reference clustering data. Optionally, the DBSCAN clustering method is used as a method for clustering the reference data set. Other technologies can achieve the same effect, which will not be repeated here. Optionally, the min-max normalization method is used as a method for normalizing the repair pass rate set. Other technologies can achieve the same effect, which will not be repeated here. The theoretical geometric parameters of copper pillar bumps refer to the geometric parameters of copper pillar bumps under theoretical conditions.

[0105] It should be explained that the determination of the repair parameter database based on the normalized qualified rate set includes:

[0106] Using a preset normalization threshold, extracting an initial qualified rate set from the normalized qualified rate set, wherein the initial qualified rates in the initial qualified rate set are all greater than or equal to the normalization threshold;

[0107] Obtain a fault repair energy consumption set according to the fault repair parameter corresponding to the initial qualified rate in the initial qualified rate set, and perform a normalization operation on the fault repair energy consumption set to obtain a normalized repair energy consumption set;

[0108] The following operations are performed for each initial qualified rate in the initial qualified rate set:

[0109] Obtaining a comprehensive evaluation value based on an initial qualified rate and a normalized repair energy consumption corresponding to the initial qualified rate in a normalized repair energy consumption set, summarizing the comprehensive evaluation values ​​to obtain a comprehensive evaluation value set, summarizing the comprehensive evaluation value set to obtain multiple comprehensive evaluation value sets, extracting a target comprehensive evaluation value set from the multiple comprehensive evaluation value sets using the copper pillar bump fault location, and confirming target repair data based on the target comprehensive evaluation value set, wherein the target repair data is historical repair data corresponding to the largest comprehensive evaluation value in the comprehensive evaluation value set;

[0110] Summarize the target repair data to obtain the repair parameter database.

[0111] Furthermore, fault repair energy consumption refers to the energy consumption required to repair copper pillar bumps using fault repair parameters. Optionally, a pre-trained neural network model is used to construct an energy consumption parameter equation, and the fault repair energy consumption is obtained by substituting the fault repair parameters into the energy consumption parameter equation. The technique for constructing an energy consumption parameter equation using a neural network model is prior art and will not be further described here. The technique for normalizing the fault repair energy consumption set is the same as the technique for normalizing the repair pass rate set and will not be further described here.

[0112] It is understandable that the comprehensive evaluation value obtained based on the initial qualified rate and the normalized repair energy consumption corresponding to the initial qualified rate in the normalized repair energy consumption set includes:

[0113] The comprehensive evaluation value is calculated based on the initial qualified rate, normalized repair energy consumption, and the pre-built evaluation relationship, where the evaluation relationship is as follows:

[0114]

[0115] Among them, z represents the comprehensive evaluation value, α, β, and a are all preset coefficients, H represents the initial qualified rate, and N represents the normalized repair energy consumption.

[0116] It should be understood that the purpose of setting the coefficient a is to ensure that the denominator of the fraction containing the normalized repair energy consumption is not zero, thereby improving the accuracy of the identified target repair data.

[0117] Furthermore, the historical repair data set may include multiple historical repair data sets with the same copper pillar bump failure location, copper pillar bump geometric parameters, copper pillar bump failure type, and copper pillar bump failure range. The difference between the multiple historical repair data sets lies in the different fault repair methods and fault repair parameters corresponding to the historical repair data sets. Therefore, in an embodiment of the present invention, by analyzing the historical repair data, optimal repair parameters are determined for the same copper pillar bump failure location, copper pillar bump geometric parameters, copper pillar bump failure type, and copper pillar bump failure range. These optimal parameters are the target repair data.

[0118] S3. Perform fault diagnosis on the initial chip using the first detection unit to obtain a chip to be repaired or a first faulty chip.

[0119] It should be explained that the method of performing fault diagnosis on the initial chip using the first detection unit to obtain the chip to be repaired or the first faulty chip includes:

[0120] Obtaining the reference center coordinates of each initial copper pillar bump in the initial chip, and acquiring a reference copper pillar image using a pre-built image acquisition unit and the reference center coordinates;

[0121] Acquiring a segmented image model set based on the first detection unit, and extracting a copper pillar bump image set from a reference copper pillar image using the segmented image model set, wherein the copper pillar bump image set includes a plurality of copper pillar bump images, and the copper pillar bump images correspond one-to-one to the segmented image models;

[0122] Count the number of segmentation image models in the segmentation image model set to obtain the number of segmentation models. Map each copper pillar bump image in the copper pillar bump image set to a pre-constructed image coordinate system to obtain a mapping coordinate point set. The mapping coordinate point set includes multiple mapping coordinate points. Perform the following operation on each mapping coordinate point in the mapping coordinate point set:

[0123] Counting the number of times the mapping coordinate point is mapped and the segmentation image model set corresponding to the mapping coordinate point to obtain the mapping number and the mapping image model set, obtaining mapping feasibility based on the mapping number and the mapping image model set, and comparing the mapping credibility with a preset credibility threshold;

[0124] If the mapping credibility is less than the credibility threshold, the mapping coordinate point is removed from the mapping coordinate point set;

[0125] Otherwise, the retained mapping coordinate points are summarized to obtain an updated coordinate point set, and the updated center coordinates are obtained using the updated coordinate point set;

[0126] A chip to be repaired or a first faulty chip is obtained based on the updated center coordinates and the reference center coordinates.

[0127] It should be understood that the reference center coordinate refers to the geometric center point of the initial copper pillar bump in the circuit board. The image acquisition unit is a shooting unit that can move and point to the reference center coordinate. Optionally, a high-precision camera is used as the shooting unit. It should be noted that in the embodiment of the present invention, it is necessary to ensure that the image acquisition unit, when shooting the initial copper pillar bump, and the axis of the image acquisition unit coincide with the central axis of the initial copper pillar bump under theoretical conditions, that is, the axis of the image acquisition unit passes through the reference center coordinate.

[0128] Furthermore, the reference copper pillar image refers to an image of the initial copper pillar bump captured by the image acquisition unit, and in theory, the reference copper pillar image should be a circular image. The segmentation image model refers to a model or algorithm that can segment the required image from an image. Optionally, a pre-trained neural network model is used as the segmentation image model, and other technologies can achieve the same effect, which will not be repeated here. The copper pillar bump image refers to an image segmented from the reference copper pillar image using the segmentation image model to characterize the initial copper pillar bump. Generally speaking, in theory, the copper pillar bump image is an image that only includes the solder cap.

[0129] It is understandable that mapping each copper pillar bump image in the copper pillar bump image set to a pre-constructed image coordinate system to obtain a mapping coordinate point set means mapping the pixel points to the image coordinates according to the coordinates of each pixel point in the copper pillar bump image. For example, there are three copper pillar bump images, wherein the coordinates of the pixel points corresponding to the first copper pillar bump image include: (1, 1), (1, 2), (2, 1) and (2, 2), the coordinates of the pixel points corresponding to the second copper pillar bump image include: (1, 3), (1, 2), (2, 1) and (2, 2), and the coordinates of the pixel points corresponding to the third copper pillar bump image include: (1, 1), (1, 2), (3, 1) and (2, 2). Then, the mapping coordinate point set obtained by mapping the copper pillar bump images to the pre-constructed image coordinate system includes: (1, 1), (1, 2), (1, 3), (3, 1), (2, 1) and (2, 2).

[0130] Furthermore, obtaining mapping credibility according to the number of mappings, the number of segmentation models, and the mapping image model set includes:

[0131] Obtain the reference recognition nodes of the mapped image model in the mapped image model set to obtain a reference recognition node set, where the reference recognition nodes include the reference training number and the reference recognition number. Calculate the mapping credibility based on the mapping times, the number of segmentation models, and the reference recognition node set. The calculation formula is as follows:

[0132]

[0133] Among them, Y represents the mapping credibility, ω are all preset coefficients, s represents the number of mappings, and f represents the number of segmentation models. represents the error rate of the i-th mapping image model in the mapping image model set, b represents the reference recognition number, x represents the reference training number, x i 、x j They respectively represent the reference training quantity corresponding to the i-th mapping image model and the reference training quantity corresponding to the j-th mapping image model in the mapping image model set.

[0134] It is understood that the reference training quantity refers to the amount of training data used when training the mapping image model, and the reference recognition quantity refers to the amount of training data that the mapping image model can successfully recognize. Generally speaking, when calculating the accuracy of the mapping image model, embodiments of the present invention use a weight value calculated in conjunction with the reference training quantity, such that a mapping image model with a larger reference training quantity has a smaller weight value for the error rate, thereby improving the accuracy of the conversion of the mapping image model's accuracy.

[0135] Furthermore, the update coordinate point set refers to the set of retained mapping coordinate points. The update center coordinates refer to the coordinates of the center corresponding to multiple update coordinate points in the update coordinate point set. Optionally, the update center coordinates are calculated using the update coordinate points in the update coordinate point set in the form of taking an average. For example, if there are three update coordinate points in the update coordinate point set, and the three update coordinate points are: (1, 2), (2, 3), and (3, 4), then the average of the horizontal coordinates and the average of the vertical coordinates of the multiple update coordinate points are calculated respectively, and the update center coordinates are obtained as (2, 3).

[0136] It should be explained that the step of obtaining the chip to be repaired or the first faulty chip based on the updated center coordinates and the reference center coordinates includes:

[0137] Get the coordinate difference between the updated center coordinates and the reference center coordinates;

[0138] comparing the coordinate difference value with a preset coordinate deviation threshold;

[0139] If the coordinate difference value is greater than or equal to the coordinate deviation threshold, the initial chip is confirmed to be the first faulty chip;

[0140] Otherwise, the number of coordinate difference values ​​less than the coordinate deviation threshold is counted to obtain an evaluation number, the number of initial copper pillar bumps in the initial chip is counted to obtain a reference number, and the ratio of the evaluation number to the reference number is calculated to obtain a deviation ratio;

[0141] Comparing the deviation ratio with a preset ratio threshold;

[0142] If the deviation ratio is less than the ratio threshold, the initial chip is confirmed to be a chip to be repaired;

[0143] Otherwise, the diagnosis result of the initial chip is confirmed to be the first faulty chip.

[0144] Furthermore, the coordinate difference value refers to a numerical value used to describe the difference between the updated center coordinates and the reference center coordinates. Optionally, the Euclidean distance between the updated center coordinates and the reference center coordinates is calculated as the coordinate difference value. Generally, when the coordinate difference value is greater than or equal to a coordinate deviation threshold, it indicates that there is a significant difference between the position of the initial copper pillar bump and the position where the initial copper pillar bump should be. Repairing the initial copper pillar bump may have a significant impact on the surrounding initial copper pillar bumps. Therefore, repairing the initial copper pillar bump is not recommended. Generally, after confirming that the initial chip is the first faulty chip, the method further includes: using the coordinate difference value to identify the initial copper pillar bump to obtain a fault identification copper pillar, wherein the coordinate difference value and the coordinate difference vector are identified. The coordinate difference vector is used to describe the direction of the initial copper pillar bump when it is bent or offset. Optionally, the coordinate difference vector is constructed using the updated center coordinates as the starting point and the reference center coordinates as the end point. The purpose of identifying the initial copper pillar bump is to clearly identify the deviation value of the initial copper pillar bump to facilitate subsequent verification or repair of the diagnosis results. For example, the reference center coordinates of the initial copper pillar bump are (0, 0), the updated center coordinates are (1, 0), the coordinate difference value calculated using the Euclidean distance is 1, and the obtained coordinate difference vector is (1, 0). Then the identified initial copper pillar bump is: 1-(1, 0)-initial copper pillar bump.

[0145] It should be explained that when the deviation ratio is less than the ratio threshold, it indicates that only some of the multiple initial copper pillar bumps corresponding to the initial chip have a small degree of lateral bending or offset. Therefore, the initial copper pillar bumps in the initial chip can be repaired. Generally speaking, when the coordinate difference value corresponding to an initial copper pillar bump in the initial chip is greater than or equal to the coordinate deviation threshold, the initial chip corresponding to this initial copper pillar bump is the first faulty chip.

[0146] S4. If the initial chip is a chip to be repaired, the second detection unit is used to perform fault diagnosis on the chip to be repaired to obtain diagnostic detection data, and the diagnostic detection data is used to search in the parameter database. After confirming that the target detection parameters are retrieved in the parameter database, the fault repair parameters corresponding to the target detection parameters and the laser repair unit are used to repair the chip to be repaired to obtain a first repaired chip.

[0147] It should be explained that the use of the second detection unit to perform fault diagnosis on the chip to be repaired to obtain diagnostic detection data includes:

[0148] The chip to be repaired is scanned and three-dimensionally reconstructed using the second detection unit to obtain a scan model, wherein the scan model includes multiple scanned copper pillar bumps, and the scanned copper pillar bumps correspond one-to-one to the initial copper pillar bumps. The following operations are performed on each of the multiple scanned copper pillar bumps:

[0149] Obtain theoretical copper pillar bumps based on initial copper pillar bumps and reference center coordinates corresponding to the scanned copper pillar bumps;

[0150] Using theoretical copper pillar bumps, the scanned copper pillar bumps are overlapped and screened to obtain the deviation copper pillar area;

[0151] Diagnostic test data is acquired based on the deviation copper pillar area.

[0152] Furthermore, the second detection unit refers to a unit, mechanism or system that can scan multiple initial copper pillar bumps of the chip to be repaired. Optionally, a microfocus X-ray CT system is used as the second detection unit. The same effect can be achieved by using other technologies, which will not be repeated here. Using the second detection unit to scan and three-dimensionally reconstruct the chip to be repaired refers to reconstructing a three-dimensional model for characterizing the chip to be repaired based on the results of the second detection unit scanning the chip to be repaired. This is an existing technology, and the constructed three-dimensional model is a scanning model. The scanned copper pillar bump is a model used to characterize the initial copper pillar bump in the scanning model. The theoretical copper pillar bump refers to the model corresponding to the initial copper pillar bump under theoretical circumstances. Using the theoretical copper pillar bumps, performing overlapping screening operation on the scanned copper pillar bumps means: superimposing the theoretical copper pillar bumps and the scanned copper pillar bumps, and if there is a part in the scanned copper pillar bump that overlaps with the theoretical copper pillar bump, then the overlapping part is removed from the scanned copper pillar bump; if there is a part in the theoretical copper pillar bump that the scanned copper pillar bump does not have, then the part is retained, and the part of the scanned copper pillar bump that does not exist in the theoretical copper pillar bump and the part of the theoretical copper pillar bump that does not exist in the scanned copper pillar bump are summarized to obtain the deviation copper pillar area.

[0153] It should be understood that the method of obtaining diagnostic test data using the deviation copper pillar area is the same as the method of constructing reference cluster data based on the target metric standard, copper pillar bump geometric parameters and copper pillar bump failure range, and will not be repeated here.

[0154] Furthermore, the use of the diagnostic test data to search the parameter database and confirming that the target test parameters are retrieved from the parameter database includes:

[0155] respectively obtaining the diagnostic detection part of the diagnostic detection data and the size parameters of the scanned model, and searching the restoration parameter database for an initial diagnostic database according to the diagnostic detection part and the size parameters, wherein the initial diagnostic database includes a plurality of initial parameter nodes;

[0156] For each of the multiple initial parameter nodes, perform the following operations:

[0157] Calculate the difference between the matched monitoring parameters and the diagnostic test data in the initial parameter node;

[0158] Summarizing the difference values ​​to obtain a difference value set, extracting the minimum difference value from the difference value set to obtain a target comparison value;

[0159] The target comparison value is compared with the preset target comparison threshold. If the target comparison value is less than or equal to the target comparison threshold, the fault repair parameter corresponding to the matching monitoring parameter is used as the target detection parameter.

[0160] It should be explained that the structure of the initial copper pillar bump includes a passivation layer, a copper pillar, a barrier layer, and a solder cap. The diagnostic inspection location can be clearly identified based on the deviation copper pillar area. The diagnostic inspection location is the location where the fault in the initial copper pillar bump is diagnosed. The dimensional parameters of the scanning model refer to the current dimensional parameters of the scanning model, including but not limited to the length, width, and height of the scanning model. Generally speaking, copper pillar bumps of different sizes generally have different levels of difficulty when repairing them. Therefore, obtaining the dimensional parameters can improve the accuracy of copper pillar bump repair.

[0161] Furthermore, the difference value is a value used to characterize the difference between the matching monitoring parameter and the diagnostic test data. Optionally, the Euclidean distance between the matching monitoring parameter and the diagnostic test data is used as the difference value. Other technologies can achieve the same effect and are not described here.

[0162] It should be explained that the laser repair unit is a specialized device that utilizes a high-precision laser system to perform localized repairs on micron-scale electronic packaging structures. The laser repair unit includes a laser generator, a beam shaping system, a precision motion platform, a real-time monitoring system, and a gas protection unit, all of which are prior art and will not be further described here. Repairing the chip to be repaired using the fault repair parameters corresponding to the target detection parameters and the laser repair unit refers to setting the parameters required by the laser repair unit as the fault repair parameters and then using the laser repair unit with the set parameters to repair the initial copper pillars in the chip to be repaired.

[0163] S5. Take the first repair chip as the initial chip and return to the step of using the first detection unit to perform fault diagnosis on the initial chip until the first repair chip or the first fault chip is obtained. The first repair chip and the first fault chip are respectively summarized to obtain a qualified chip set and a fault chip set, thereby realizing the detection and repair of the copper pillar bumps.

[0164] It should be noted that in this embodiment of the present invention, the first repaired chip is used as the initial chip, and the process returns to the step of using the first detection unit to perform fault diagnosis on the initial chip, performing a secondary diagnosis on the repaired initial chip to ensure that the repaired initial chip can be put into normal use or subsequent inspection. A qualified chip refers to the first repaired chip that passes the secondary inspection without error, and a first faulty chip refers to the first repaired chip that was detected as faulty or the first repaired chip that was detected as having an object after the secondary inspection.

[0165] The present invention solves the problem described in the background technology. The present invention constructs a repair parameter database based on the repair data construction unit, wherein the repair parameter database includes multiple repair parameter nodes, and the repair parameter nodes include fault repair parameters and reference clustering data. It can be seen that the present invention obtains a historical repair data set before detecting the copper pillar bumps in the initial chip, and screens and analyzes the repair data in the historical repair data set, so that the obtained repair parameter database is more accurate. The present invention uses the first detection unit to perform fault diagnosis on the initial chip to obtain the chip to be repaired or the first faulty chip. When diagnosing the initial chip, the present invention combines the characteristics of different segmentation image models to obtain updated center coordinates, so that the obtained updated center coordinates are more accurate, so as to improve the accuracy of diagnosis of the initial chip, and when diagnosing the initial chip, it also considers local factors and overall factors, that is, coordinate difference values ​​and deviation ratios, further improving the intelligence level of diagnosis of the initial chip. If the initial chip is the chip to be repaired, the present invention uses the second detection unit to perform fault diagnosis on the chip to be repaired, obtaining diagnostic detection data. The diagnostic detection data is then used to search a parameter database. After confirming that the target detection parameters have been retrieved from the parameter database, the chip to be repaired is repaired using the fault repair parameters corresponding to the target detection parameters and the laser repair unit to obtain a first repaired chip. This shows that when retrieving the target detection parameters, the present invention also considers the fault area of ​​the chip to be repaired and the quantized parameters corresponding to the fault area. Here, the quantized parameters are the diagnostic detection data, and the fault area is the deviation copper pillar area, thereby improving the accuracy of detecting the target detection parameters. The present invention uses the first repair chip as the initial chip and returns to the step of performing fault diagnosis on the initial chip using the first detection unit until the first repair chip or the first faulty chip is obtained. The first repair chip and the first faulty chip are respectively aggregated to obtain a qualified chip set and a faulty chip set, thereby achieving copper pillar bump detection and repair. This shows that after repairing the chip to be repaired, the present invention verifies the repaired chip to improve the intelligent repair process for the chip to be repaired. Therefore, the present invention can improve the accuracy and intelligence of parameter setting required for laser repair.

[0166] like Figure 2, which is a functional module diagram of an integrated system for in-situ optical inspection and laser repair of FCWB copper pillar bumps provided by one embodiment of the present invention.

[0167] The integrated in-situ optical inspection and laser repair system 100 for FCWB copper pillar bumps described in the present invention can be installed in an electronic device. Depending on the functionality implemented, the integrated in-situ optical inspection and laser repair system 100 for FCWB copper pillar bumps can include an inspection and repair environment confirmation module 101, a laser repair parameter confirmation module 102, an initial chip diagnosis module 103, and a repaired chip detection module 104. A module, also referred to as a unit, refers to a series of computer program segments that can be executed by an electronic device processor and perform a fixed function. These modules are stored in the electronic device's memory.

[0168] The detection and repair environment confirmation module 101 is used to receive a detection and repair instruction and confirm a detection and repair environment based on the detection and repair instruction, wherein the detection and repair environment includes an initial chip set to be detected and a detection and repair system, and the detection and repair system includes a first detection unit, a second detection unit, a repair data construction unit and a laser repair unit, wherein the initial chip set includes multiple initial chips, and the initial chips include multiple initial copper pillar bumps to be detected;

[0169] The laser repair parameter confirmation module 102 is used to construct a repair parameter database based on the repair data construction unit, wherein the repair parameter database includes a plurality of repair parameter nodes, and the repair parameter nodes include fault repair parameters and reference cluster data;

[0170] The initial chip diagnosis module 103 is configured to perform the following operations on each initial chip in the initial chip set:

[0171] Performing fault diagnosis on the initial chip using the first detection unit to obtain a chip to be repaired or a first faulty chip;

[0172] If the initial chip is a chip to be repaired, the second detection unit is used to perform fault diagnosis on the chip to be repaired to obtain diagnostic detection data, which is then used to search the parameter database. After confirming that the target detection parameters are retrieved from the parameter database, the fault repair parameters corresponding to the target detection parameters and the laser repair unit are used to repair the chip to be repaired to obtain a first repaired chip.

[0173] The repair chip detection module 104 is used to use the first repair chip as the initial chip, return to the step of using the first detection unit to diagnose the fault of the initial chip until the first repair chip or the first fault chip is obtained, and summarize the first repair chip and the first fault chip respectively to obtain a qualified chip set and a fault chip set, thereby realizing the detection and repair of copper pillar bumps.

[0174] In detail, the modules in the FCWB copper pillar bump in-situ optical inspection and laser repair integrated system 100 in the embodiment of the present invention are used in the same manner as above. Figure 1 The FCWB copper pillar bump in-situ optical inspection and laser repair integrated method described in the invention are the same technical means and can produce the same technical effects, so they will not be repeated here.

[0175] like Figure 3 , which is a structural diagram of an electronic device for implementing an integrated method of in-situ optical inspection and laser repair of FCWB copper pillar bumps provided by one embodiment of the present invention.

[0176] The electronic device 1 may include a processor 10, a memory 11 and a bus 12, and may also include a computer program stored in the memory 11 and executable on the processor 10, such as an integrated method program for in-situ optical inspection and laser repair of FCWB copper pillar bumps.

[0177] Among them, the memory 11 includes at least one type of readable storage medium, and the readable storage medium includes a flash memory, a mobile hard disk, a multimedia card, a card-type memory (for example, SD or DX memory, etc.), a magnetic memory, a disk, an optical disk, etc. In some embodiments, the memory 11 can be an internal storage unit of the electronic device 1, such as a mobile hard disk of the electronic device 1. In other embodiments, the memory 11 can also be an external storage device of the electronic device 1, such as a plug-in mobile hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. equipped on the electronic device 1. Furthermore, the memory 11 also includes an internal storage unit of the electronic device 1 and an external storage device. The memory 11 can not only be used to store application software and various types of data installed in the electronic device 1, such as the code of the FCWB copper pillar bump in-situ optical detection and laser repair integrated method program, but can also be used to temporarily store data that has been output or is to be output.

[0178] In some embodiments, the processor 10 may be composed of an integrated circuit, such as a single packaged integrated circuit, or a plurality of packaged integrated circuits with the same or different functions, including one or more central processing units (CPUs), microprocessors, digital processing chips, graphics processors, and a combination of various control chips. The processor 10 is the control core (Control Unit) of the electronic device, connecting the various components of the entire electronic device using various interfaces and circuits. It executes or runs programs or modules stored in the memory 11 (such as the integrated method program for in-situ optical inspection and laser repair of FCWB copper pillar bumps), and calls data stored in the memory 11 to perform various functions of the electronic device 1 and process data.

[0179] The bus 12 may be a peripheral component interconnect (PCI) bus or an extended industry standard architecture (EISA) bus, etc. The bus 12 may be divided into an address bus, a data bus, a control bus, etc. The bus 12 is configured to enable communication between the memory 11 and at least one processor 10, etc.

[0180] Figure 3 Only the electronic device with components is shown, and it can be understood by those skilled in the art that Figure 3 The structure shown does not constitute a limitation on the electronic device 1 , and may include fewer or more components than shown in the figure, or combine certain components, or arrange the components differently.

[0181] For example, although not shown, the electronic device 1 may further include a power source (such as a battery) for supplying power to various components. Preferably, the power source may be logically connected to the at least one processor 10 via a power management system, thereby implementing functions such as charge management, discharge management, and power consumption management through the power management system. The power source may further include any components such as one or more DC or AC power sources, a recharging system, a power failure detection circuit, a power converter or inverter, a power status indicator, etc. The electronic device 1 may further include a variety of sensors, a Bluetooth module, a Wi-Fi module, etc., which will not be described in detail here.

[0182] Furthermore, the electronic device 1 may also include a network interface. Optionally, the network interface may include a wired interface and / or a wireless interface (such as a WI-FI interface, a Bluetooth interface, etc.), which is generally used to establish a communication connection between the electronic device 1 and other electronic devices.

[0183] Optionally, the electronic device 1 may further include a user interface, which may be a display or an input unit (such as a keyboard). Optionally, the user interface may also be a standard wired interface or a wireless interface. Optionally, in some embodiments, the display may be an LED display, a liquid crystal display, a touch-sensitive liquid crystal display, or an OLED (Organic Light-Emitting Diode) touch device. The display may also be appropriately referred to as a display screen or a display unit, which is used to display information processed in the electronic device 1 and to display a visual user interface.

[0184] The FCWB copper pillar bump in-situ optical inspection and laser repair integrated method program stored in the memory 11 of the electronic device 1 is a combination of multiple instructions. When executed in the processor 10, it can achieve the following:

[0185] Receiving a detection and repair instruction, and determining a detection and repair environment based on the detection and repair instruction, wherein the detection and repair environment includes an initial chip set to be detected and a detection and repair system, and the detection and repair system includes a first detection unit, a second detection unit, a repair data construction unit, and a laser repair unit, wherein the initial chip set includes a plurality of initial chips, and the initial chips include a plurality of initial copper pillar bumps to be detected;

[0186] Building a repair parameter database based on the repair data building unit, wherein the repair parameter database includes a plurality of repair parameter nodes, and the repair parameter nodes include fault repair parameters and reference cluster data;

[0187] For each initial chip in the initial chip set, perform the following operations:

[0188] Performing fault diagnosis on the initial chip using the first detection unit to obtain a chip to be repaired or a first faulty chip;

[0189] If the initial chip is a chip to be repaired, the second detection unit is used to perform fault diagnosis on the chip to be repaired to obtain diagnostic detection data, which is then used to search the parameter database. After confirming that the target detection parameters are retrieved from the parameter database, the fault repair parameters corresponding to the target detection parameters and the laser repair unit are used to repair the chip to be repaired to obtain a first repaired chip.

[0190] Taking the first repair chip as the initial chip, return to the step of using the first detection unit to perform fault diagnosis on the initial chip until the first repair chip or the first fault chip is obtained, and summarize the first repair chip and the first fault chip respectively to obtain a qualified chip set and a fault chip set, thereby realizing the detection and repair of copper pillar bumps.

[0191] Specifically, the specific implementation method of the processor 10 for the above instructions can refer to Figures 1 to 3 The description of the relevant steps in the corresponding embodiments will not be repeated here.

[0192] Furthermore, if the modules / units integrated into the electronic device 1 are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. The computer-readable storage medium can be volatile or non-volatile. For example, the computer-readable medium can include: any entity or system capable of carrying the computer program code, a recording medium, a USB flash drive, a mobile hard drive, a magnetic disk, an optical disk, a computer memory, or a read-only memory (ROM).

[0193] The present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program. When the computer program is executed by a processor of an electronic device, the computer program can implement:

[0194] Receiving a detection and repair instruction, and determining a detection and repair environment based on the detection and repair instruction, wherein the detection and repair environment includes an initial chip set to be detected and a detection and repair system, and the detection and repair system includes a first detection unit, a second detection unit, a repair data construction unit, and a laser repair unit, wherein the initial chip set includes a plurality of initial chips, and the initial chips include a plurality of initial copper pillar bumps to be detected;

[0195] Building a repair parameter database based on the repair data building unit, wherein the repair parameter database includes a plurality of repair parameter nodes, and the repair parameter nodes include fault repair parameters and reference cluster data;

[0196] For each initial chip in the initial chip set, perform the following operations:

[0197] Performing fault diagnosis on the initial chip using the first detection unit to obtain a chip to be repaired or a first faulty chip;

[0198] If the initial chip is a chip to be repaired, the second detection unit is used to perform fault diagnosis on the chip to be repaired to obtain diagnostic detection data, which is then used to search the parameter database. After confirming that the target detection parameters are retrieved from the parameter database, the fault repair parameters corresponding to the target detection parameters and the laser repair unit are used to repair the chip to be repaired to obtain a first repaired chip.

[0199] Taking the first repair chip as the initial chip, return to the step of using the first detection unit to perform fault diagnosis on the initial chip until the first repair chip or the first fault chip is obtained, and summarize the first repair chip and the first fault chip respectively to obtain a qualified chip set and a fault chip set, thereby realizing the detection and repair of copper pillar bumps.

[0200] In the several embodiments provided by the present invention, it should be understood that the disclosed devices, systems and methods can be implemented in other ways. For example, the system embodiments described above are only exemplary, and actual implementations may have other division methods.

[0201] The modules described as separate components may or may not be physically separate, and the components shown as modules may or may not be physical units, that is, they may be located in one place or distributed across multiple network elements. Some or all of the modules may be selected to achieve the purpose of the solution of this embodiment according to actual needs.

[0202] In addition, the functional modules in various embodiments of the present invention may be integrated into a single processing unit, each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or hardware plus software functional modules.

[0203] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0204] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not limiting. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. An integrated method for in-situ optical inspection and laser repair of FCWB copper pillar bumps, characterized in that: The method comprises: Receiving a detection and repair instruction, and determining a detection and repair environment based on the detection and repair instruction, wherein the detection and repair environment includes an initial chip set to be detected and a detection and repair system, and the detection and repair system includes a first detection unit, a second detection unit, a repair data construction unit, and a laser repair unit, wherein the initial chip set includes a plurality of initial chips, and the initial chips include a plurality of initial copper pillar bumps to be detected; Building a repair parameter database based on the repair data building unit, wherein the repair parameter database includes a plurality of repair parameter nodes, and the repair parameter nodes include fault repair parameters and reference cluster data; For each initial chip in the initial chip set, perform the following operations: Performing fault diagnosis on the initial chip using the first detection unit to obtain a chip to be repaired or a first faulty chip; If the initial chip is a chip to be repaired, the second detection unit is used to perform fault diagnosis on the chip to be repaired to obtain diagnostic detection data, which is then used to search the parameter database. After confirming that the target detection parameters are retrieved from the parameter database, the fault repair parameters corresponding to the target detection parameters and the laser repair unit are used to repair the chip to be repaired to obtain a first repaired chip. Taking the first repair chip as the initial chip, return to the step of using the first detection unit to perform fault diagnosis on the initial chip until the first repair chip or the first fault chip is obtained, and summarize the first repair chip and the first fault chip respectively to obtain a qualified chip set and a fault chip set, thereby realizing the detection and repair of copper pillar bumps.

2. The integrated method for in-situ optical inspection and laser repair of FCWB copper pillar bumps according to claim 1, characterized in that: The step of constructing a repair parameter database based on the repair data construction unit includes: Acquiring a historical repair data set based on the repair data construction unit, wherein the historical repair data set includes a plurality of historical repair data, and the historical repair data includes: a copper pillar bump fault location, copper pillar bump geometric parameters, a copper pillar bump fault type, a copper pillar bump fault range, and a fault repair method node, wherein the fault repair method node includes a fault repair method, fault repair parameters, and a fault repair result, and the fault repair result includes a repair success and a repair failure; Summarize historical repair data in the historical repair data set according to the copper pillar bump failure location and the fault repair method to obtain one or more initial analysis data sets; The following operations are performed on each of the one or more initial analysis data sets: Clustering the initial analysis data in the initial analysis data set using a pre-built clustering method to obtain one or more first analysis data sets, and performing the following operations on each of the one or more first analysis data sets: Extracting first analysis data indicating that the fault repair result is successful from the first analysis data set to obtain a second analysis data set; Counting the number of first analysis data in the first analysis data set and the number of second analysis data in the second analysis data set to obtain a first analysis number and a second analysis number; Calculating a ratio of the second analysis quantity to the first analysis quantity to obtain a repair qualified rate, summarizing the repair qualified rates to obtain a repair qualified rate set, and normalizing the repair qualified rate set to obtain a normalized qualified rate set; A repair parameter database is determined based on the normalized pass rate set.

3. The integrated method for in-situ optical inspection and laser repair of FCWB copper pillar bumps according to claim 2, characterized in that: The method of clustering the initial analysis data in the initial analysis data set using a pre-built clustering method to obtain one or more first analysis data sets includes: Obtain a copper pillar bump fault type-metric standard table, retrieve a target metric standard from the fault type-metric standard table based on the copper pillar bump fault type corresponding to the first analysis data set, and perform the following operations on each first analysis data in the first analysis data set: Reference cluster data is constructed according to the target metric standard, copper pillar bump geometric parameters and copper pillar bump failure range, the reference cluster data is summarized to obtain a reference cluster data set, and the reference cluster data in the reference cluster data set is clustered to obtain one or more first analysis data sets.

4. The integrated method for in-situ optical inspection and laser repair of FCWB copper pillar bumps according to claim 3, characterized in that: The method of determining a repair parameter database based on the normalized qualified rate set includes: Using a preset normalization threshold, extracting an initial qualified rate set from the normalized qualified rate set, wherein the initial qualified rates in the initial qualified rate set are all greater than or equal to the normalization threshold; Obtain a fault repair energy consumption set according to the fault repair parameter corresponding to the initial qualified rate in the initial qualified rate set, and perform a normalization operation on the fault repair energy consumption set to obtain a normalized repair energy consumption set; The following operations are performed for each initial qualified rate in the initial qualified rate set: Obtaining a comprehensive evaluation value based on an initial qualified rate and a normalized repair energy consumption corresponding to the initial qualified rate in a normalized repair energy consumption set, summarizing the comprehensive evaluation values ​​to obtain a comprehensive evaluation value set, summarizing the comprehensive evaluation value set to obtain multiple comprehensive evaluation value sets, extracting a target comprehensive evaluation value set from the multiple comprehensive evaluation value sets using the copper pillar bump fault location, and confirming target repair data based on the target comprehensive evaluation value set, wherein the target repair data is historical repair data corresponding to the largest comprehensive evaluation value in the comprehensive evaluation value set; Summarize the target repair data to obtain the repair parameter database.

5. The integrated method for in-situ optical inspection and laser repair of FCWB copper pillar bumps according to claim 4, characterized in that: The method of performing fault diagnosis on the initial chip by using the first detection unit to obtain the chip to be repaired or the first faulty chip includes: Obtaining the reference center coordinates of each initial copper pillar bump in the initial chip, and acquiring a reference copper pillar image using a pre-built image acquisition unit and the reference center coordinates; Acquiring a segmented image model set based on the first detection unit, and extracting a copper pillar bump image set from a reference copper pillar image using the segmented image model set, wherein the copper pillar bump image set includes a plurality of copper pillar bump images, and the copper pillar bump images correspond one-to-one to the segmented image models; Count the number of segmentation image models in the segmentation image model set to obtain the number of segmentation models. Map each copper pillar bump image in the copper pillar bump image set to a pre-constructed image coordinate system to obtain a mapping coordinate point set. The mapping coordinate point set includes multiple mapping coordinate points. Perform the following operation on each mapping coordinate point in the mapping coordinate point set: Counting the number of times the mapping coordinate point is mapped and the segmentation image model set corresponding to the mapping coordinate point to obtain the mapping number and the mapping image model set, obtaining mapping feasibility based on the mapping number and the mapping image model set, and comparing the mapping credibility with a preset credibility threshold; If the mapping credibility is less than the credibility threshold, the mapping coordinate point is removed from the mapping coordinate point set; Otherwise, the retained mapping coordinate points are summarized to obtain an updated coordinate point set, and the updated center coordinates are obtained using the updated coordinate point set; A chip to be repaired or a first faulty chip is obtained based on the updated center coordinates and the reference center coordinates.

6. The integrated method for in-situ optical inspection and laser repair of FCWB copper pillar bumps according to claim 5, characterized in that: The obtaining of mapping credibility according to the number of mappings, the number of segmentation models and the mapping image model set includes: Obtain the reference recognition nodes of the mapped image model in the mapped image model set to obtain a reference recognition node set, where the reference recognition nodes include the reference training number and the reference recognition number. Calculate the mapping credibility based on the mapping times, the number of segmentation models, and the reference recognition node set. The calculation formula is as follows: Among them, Y represents the mapping credibility, ω are all preset coefficients, s represents the number of mappings, and f represents the number of segmentation models. represents the error rate of the i-th mapping image model in the mapping image model set, b represents the reference recognition number, x represents the reference training number, x i 、x j They respectively represent the reference training quantity corresponding to the i-th mapping image model and the reference training quantity corresponding to the j-th mapping image model in the mapping image model set.

7. The integrated method for in-situ optical inspection and laser repair of FCWB copper pillar bumps according to claim 6, characterized in that: The step of obtaining the chip to be repaired or the first faulty chip based on the updated center coordinates and the reference center coordinates includes: Get the coordinate difference between the updated center coordinates and the reference center coordinates; comparing the coordinate difference value with a preset coordinate deviation threshold; If the coordinate difference value is greater than or equal to the coordinate deviation threshold, the initial chip is confirmed to be the first faulty chip; Otherwise, the number of coordinate difference values ​​less than the coordinate deviation threshold is counted to obtain an evaluation number, the number of initial copper pillar bumps in the initial chip is counted to obtain a reference number, and the ratio of the evaluation number to the reference number is calculated to obtain a deviation ratio; Comparing the deviation ratio with a preset ratio threshold; If the deviation ratio is less than the ratio threshold, the initial chip is confirmed to be a chip to be repaired; Otherwise, the diagnosis result of the initial chip is confirmed to be the first faulty chip.

8. The integrated method for in-situ optical inspection and laser repair of FCWB copper pillar bumps according to claim 7, characterized in that: The method of performing fault diagnosis on the chip to be repaired by using the second detection unit to obtain diagnostic detection data includes: The chip to be repaired is scanned and three-dimensionally reconstructed using the second detection unit to obtain a scan model, wherein the scan model includes multiple scanned copper pillar bumps, and the scanned copper pillar bumps correspond one-to-one to the initial copper pillar bumps. The following operations are performed on each of the multiple scanned copper pillar bumps: Obtain theoretical copper pillar bumps based on initial copper pillar bumps and reference center coordinates corresponding to the scanned copper pillar bumps; Using theoretical copper pillar bumps, the scanned copper pillar bumps are overlapped and screened to obtain the deviation copper pillar area; Diagnostic test data is acquired based on the deviation copper pillar area.

9. The integrated method for in-situ optical inspection and laser repair of FCWB copper pillar bumps according to claim 8, characterized in that: The method of searching the parameter database using the diagnostic test data to confirm that the target test parameter is retrieved from the parameter database includes: respectively obtaining the diagnostic detection part of the diagnostic detection data and the size parameters of the scanned model, and searching the restoration parameter database for an initial diagnostic database according to the diagnostic detection part and the size parameters, wherein the initial diagnostic database includes a plurality of initial parameter nodes; For each of the multiple initial parameter nodes, perform the following operations: Calculate the difference between the matched monitoring parameters and the diagnostic test data in the initial parameter node; Summarizing the difference values ​​to obtain a difference value set, extracting the minimum difference value from the difference value set to obtain a target comparison value; The target comparison value is compared with the preset target comparison threshold. If the target comparison value is less than or equal to the target comparison threshold, the fault repair parameter corresponding to the matching monitoring parameter is used as the target detection parameter.

10. An integrated system for in-situ optical inspection and laser repair of FCWB copper pillar bumps, characterized in that: The system comprises: A detection and repair environment confirmation module is used to receive a detection and repair instruction and confirm a detection and repair environment based on the detection and repair instruction, wherein the detection and repair environment includes an initial chip set to be detected and a detection and repair system, and the detection and repair system includes a first detection unit, a second detection unit, a repair data construction unit and a laser repair unit, wherein the initial chip set includes multiple initial chips, and the initial chips include multiple initial copper pillar bumps to be detected; a laser repair parameter confirmation module, configured to construct a repair parameter database based on the repair data construction unit, wherein the repair parameter database includes a plurality of repair parameter nodes, and the repair parameter nodes include fault repair parameters and reference cluster data; The initial chip diagnostic module is used to perform the following operations on each initial chip in the initial chip set: Performing fault diagnosis on the initial chip using the first detection unit to obtain a chip to be repaired or a first faulty chip; If the initial chip is a chip to be repaired, the second detection unit is used to perform fault diagnosis on the chip to be repaired to obtain diagnostic detection data, which is then used to search the parameter database. After confirming that the target detection parameters are retrieved from the parameter database, the fault repair parameters corresponding to the target detection parameters and the laser repair unit are used to repair the chip to be repaired to obtain a first repaired chip. The repair chip detection module is used to use the first repair chip as the initial chip, return to the step of using the first detection unit to diagnose the fault of the initial chip until the first repair chip or the first fault chip is obtained, and respectively summarize the first repair chip and the first fault chip to obtain a qualified chip set and a fault chip set, thereby realizing the detection and repair of copper pillar bumps.

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