Method for in-situ detection of damp-heat aging of underfill and detection system

Abstract

The invention provides a method for in-situ detection of damp-heat aging of an underfill and a detection system. The method comprises the following steps: (1) providing an underfill sample; (2) placing the bottom filling glue sample on a temperature and humidity control sample table, wherein the temperature and humidity control sample table is combined with a confocal microscopic Raman spectrometer; (3) adjusting the parameters of the temperature and humidity control sample table, and adjusting the parameters of the confocal microscopic Raman spectrometer; (4) performing in-situ Raman spectrum characterization on a certain site of the initial bottom filling glue sample under the conditions set in the step (3), then performing damp-heat aging on the bottom filling glue sample, and performing in-situ Raman spectrum characterization on the same test site of the bottom filling glue sample at regular intervals, and analyzing the change of the characteristic peak according to the obtained Raman spectrum information so as to determine the damp-heat aging mechanism of the underfill sample. The invention provides a method for in-situ detection of real-time chemical bond change information of underfill in a damp-heat aging process.

Description

Technical Field

[0001] The invention belongs to the technical field of packaging material testing, and relates to a method and a detection system for in-situ detection of wet-heat aging of bottom filling glue. Background Art

[0002] As high-end electronic devices such as 5G communications and artificial intelligence chips advance towards miniaturization and high density, flip-chip packaging technology has become a core solution for achieving fine-pitch interconnects. Underfill is a material widely used in electronic packaging. It fills the gap between the chip and the substrate through capillary flow, fulfilling three important functions: 1. Buffering thermomechanical stress caused by coefficient of thermal expansion (CTE) mismatch; 2. Improving material rigidity and enhancing mechanical strength; and 3. Blocking moisture to prevent solder joint corrosion. Underfill can improve package stability and product lifespan. Underfill is typically based on an uncured epoxy resin composite material containing a large amount of silica. The main material is typically epoxy resin, typically including bisphenol A and bisphenol F. Due to the presence of hydroxyl groups, ether bonds, and highly reactive epoxy groups in epoxy resins, moisture can significantly affect the material's performance. Furthermore, the epoxy material's state changes with temperature, causing changes in many of its properties. Therefore, the impact of temperature on the material cannot be ignored. However, under harsh operating conditions such as high temperature and humidity (85°C / 85% RH) and temperature cycling (-55°C to 125°C), aging behaviors such as hydrolysis of the epoxy resin matrix and debonding of the silica filler interface can cause crack propagation and ultimately functional failure. This process has become a key factor limiting the lifespan of electronic devices. Furthermore, chip design and manufacturing costs are extremely high, and underfill aging and failure can severely impact product lifespan.

[0003] Current methods for studying the damp-heat aging of underfills rely on ex-situ testing, which indirectly infers failure mechanisms through the macroscopic performance degradation or static cross-sectional morphology of aged samples. These methods are unable to capture the dynamic evolution of chemical bonds during the aging process in real time. Furthermore, data distortion can be caused by sample destruction and human interference. For example, mechanical testing requires destruction of the package structure, making repeated observations at the same location impossible and resulting in a loss of continuity. Temperature and humidity fluctuations during sampling can also cause sample conditions to deviate from actual aging conditions. Furthermore, damp-heat aging exhibits multi-stage evolutionary characteristics, and ex-situ testing can only obtain sample data at discrete time points, failing to capture information about critical transitions.

[0004] Existing technologies have disclosed technical solutions for using Raman spectroscopy to detect materials. CN118937310A discloses a high-temperature in-situ Raman spectroscopy system and method for monitoring material preparation. By building a test system and coupling it to a tubular high-temperature furnace, the composition and phase of samples during the material growth process are characterized in the absence of obvious thermal radiation background. However, it does not disclose that Raman spectroscopy can be used to characterize the aging resistance of materials.

[0005] Therefore, in the art, it is desired to develop a method for in-situ detection of the wet-heat aging of the bottom filler, in which the problem of data distortion caused by sample destruction, human interference, etc. is avoided. Summary of the Invention

[0006] To address the shortcomings of existing technologies, the present invention aims to provide a method and system for in-situ detection of underfill aging during wet-heat aging. By constructing an in-situ Raman spectroscopy system, the present invention provides a method for in-situ detection of real-time chemical bond changes in underfill during wet-heat aging. This method can be used to analyze molecular structural changes in underfill materials during wet-heat aging, providing a research method and system for studying underfill aging during wet-heat aging.

[0007] For the study of wet-heat aging of bottom filler materials, the in-situ Raman detection system can solve the problems that traditional non-in-situ detection methods cannot monitor changes in the material aging process in real time and will damage the material and cause data distortion. The present invention provides an in-situ non-destructive, real-time detection method for bottom filler material research.

[0008] In order to achieve the purpose of the invention, the present invention adopts the following technical solutions:

[0009] In a first aspect, the present invention provides a method for in-situ detection of wet-heat aging of an underfill, the method comprising the following steps:

[0010] (1) Provide bottom filler sample;

[0011] (2) placing the bottom filler sample on a temperature-controlled and humidity-controlled sample stage, wherein the temperature-controlled and humidity-controlled sample stage is coupled to a confocal Raman microscope;

[0012] (3) adjusting the parameters of the temperature-controlled and humidity-controlled sample stage and the parameters of the confocal Raman microscope to establish an in-situ moisture-heat aging detection system for the bottom filler sample;

[0013] (4) Under the conditions set in (3), an in-situ Raman spectroscopy characterization is performed on a certain site of the initial bottom filling glue sample, and then the bottom filling glue sample is subjected to wet heat aging. At regular intervals, the same test site of the bottom filling glue sample is again subjected to in-situ Raman spectroscopy characterization (i.e., during the wet heat aging process, the test site of the bottom filling glue sample is the same as the test site of the initial bottom filling glue sample). The changes in the characteristic peaks are analyzed based on the obtained Raman spectral information, thereby determining the wet heat aging mechanism of the bottom filling glue sample.

[0014] The present invention provides a method for in-situ detection of wet heat aging of bottom filler. By combining a confocal micro-Raman spectrometer with a temperature and humidity control system, an in-situ detection system for wet heat aging of bottom filler is established. This method provides a method for real-time detection of changes in chemical bonds of materials during wet heat aging of bottom filler. Moreover, during the wet heat aging process, the present invention tests the same site of a test sample, and can more accurately monitor changes in chemical bonds of the material. This method provides a theoretical basis for studying the effectiveness of bottom filler materials.

[0015] The present invention realizes real-time detection of bottom filler under wet-heat aging conditions. By analyzing the changes in the chemical bonds of the material, the connection between the macroscopic performance of the bottom filler and the changes in the microscopic molecular structure is established, providing a theoretical basis for the performance optimization and failure analysis of the bottom filler.

[0016] The following are preferred technical solutions of the present invention, but are not intended to limit the solutions of the present invention. Through the following preferred solutions, better effects of the present invention can be achieved.

[0017] Preferably, the raw materials for preparing the bottom filling glue sample include a resin matrix, a filler, and a curing agent.

[0018] Preferably, the resin matrix includes any one of bisphenol A epoxy resin, bisphenol F epoxy resin, novolac epoxy resin or alicyclic epoxy resin, or a combination of at least two thereof.

[0019] Preferably, based on the total mass of the raw materials for preparing the bottom filling glue sample as 100%, the amount of the resin matrix is ​​5% to 99%, for example, 5%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, 95%, 99%, etc.

[0020] Preferably, the filler includes any one of silicon dioxide, aluminum oxide, aluminum nitride, boron nitride or silicon micropowder, or a combination of at least two thereof.

[0021] Preferably, based on the total mass of the raw materials for preparing the bottom filling glue sample as 100%, the amount of the filler is 5% to 99%, for example, 5%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, 95%, 99%, etc.

[0022] Preferably, the curing agent includes any one of an amine curing agent, an acid anhydride curing agent or a phenolic resin curing agent, or a combination of at least two of them.

[0023] Preferably, based on the total mass of the raw materials for preparing the bottom filling glue sample as 100%, the amount of the curing agent is 1% to 99%, for example, 1%, 3%, 5%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, 95%, 99%, etc.

[0024] Preferably, the raw materials for preparing the bottom filling glue sample further include any one of a catalyst, a coupling agent, a defoaming agent, and a toughening agent, or a combination of at least two thereof.

[0025] Preferably, the catalyst comprises any one or a combination of at least two of tertiary amine catalysts, imidazole and its derivatives, Lewis acid metal complexes or phosphonium salt catalysts.

[0026] Preferably, based on the total mass of the raw materials for preparing the underfill sample being 100%, the amount of the catalyst is 1% to 10%, for example, 1%, 2%, 3%, 5%, 6%, 8%, 10%, etc.

[0027] Preferably, the coupling agent includes any one of a silane coupling agent, a titanate coupling agent or an aluminate coupling agent, or a combination of at least two thereof.

[0028] Preferably, based on the total mass of the raw materials for preparing the bottom filling glue sample as 100%, the amount of the coupling agent is 1% to 10%, for example, 1%, 2%, 3%, 5%, 6%, 8%, 10%, etc.

[0029] Preferably, the defoaming agent includes any one of an organosilicon defoaming agent, a hydrocarbon defoaming agent, a polyether defoaming agent, a polymer defoaming agent or a composite defoaming agent, or a combination of at least two thereof.

[0030] Preferably, based on the total mass of the raw materials for preparing the bottom filling glue sample as 100%, the amount of the defoaming agent is 1% to 10%, for example, 1%, 2%, 3%, 5%, 6%, 8%, 10%, etc.

[0031] Preferably, the toughening agent includes any one or a combination of at least two of a rubber elastomer toughening agent, a thermoplastic resin toughening agent, a core-shell polymer, a hyperbranched polymer or a nanoparticle toughening agent.

[0032] Preferably, based on the total mass of the raw materials for preparing the bottom filling glue sample being 100%, the amount of the toughening agent is 1% to 10%, for example, 1%, 2%, 3%, 5%, 6%, 8%, 10%, etc.

[0033] Preferably, the temperature-controlled and humidity-controlled sample stage comprises a sample stage combining a humidity generator and a temperature control system or a temperature-humidity integrated control sample stage.

[0034] Preferably, the confocal Raman microscope spectrometer includes any one of WITec-alpha300 series, Horiba Scientific-LabRA series or Renishaw-inVia series.

[0035] Preferably, the step (3) of adjusting the parameters of the temperature-controlled and humidity-controlled sample stage specifically includes: adjusting the temperature to 70°C to 250°C, for example, 70°C, 80°C, 100°C, 120°C, 140°C, 150°C, 160°C, 180°C, 200°C, 220°C, 230°C, 250°C, etc., and adjusting the humidity to 20%RH to 100%RH, for example, 20%RH, 30%RH, 40%RH, 50%RH, 60%RH, 70%RH, 80%RH, 90%RH, 100%RH, etc.

[0036] Preferably, the step (3) of adjusting the parameters of the confocal Raman microscope specifically includes:

[0037] Adjusting the laser wavelength of the confocal micro-Raman spectrometer to at least one of 488 nm, 532 nm, 633 nm, and 785 nm;

[0038] and / or adjusting the integration time of the confocal Raman microscope to 1s to 500s, for example, 1s, 2s, 3s, 5s, 8s, 10s, 20s, 30s, 40s, 50s, 60s, 70s, 80s, 90s, 100s, 120s, 140s, 160s, 180s, 200s, 220s, 240s, 260s, 280s, 300s, 320s, 340s, 360s, 380s, 400s, 420s, 440s, 460s, 480s, 500s, etc.;

[0039] and / or, adjusting the number of integration times of the confocal Raman microscope to 1 to 50 times, for example, 1, 2, 3, 5, 8, 10, 15, 20, 25, 30, 35, 40, 45, 50, etc.;

[0040] And / or, the laser intensity of the confocal Raman microscope is adjusted to 1 mW to 50 mW, for example, 1 mW, 2 mW, 3 mW, 5 mW, 8 mW, 10 mW, 12 mW, 13 mW, 15 mW, 18 mW, 20 mW, 22 mW, 23 mW, 25 mW, 28 mW, 30 mW, 32 mW, 33 mW, 35 mW, 38 mW, 40 mW, 42 mW, 43 mW, 45 mW, 48 mW, 50 mW, etc.

[0041] Preferably, the certain site in step (4) includes a certain site of any one of the resin matrix region, the filler region, and the interface region between the resin matrix and the filler of the bottom filling glue sample;

[0042] Preferably, the time for wet heat aging of the bottom filling glue sample in step (4) is 5 hours to 100 hours, for example, 5 hours, 10 hours, 15 hours, 20 hours, 25 hours, 30 hours, 35 hours, 40 hours, 45 hours, 50 hours, 55 hours, 60 hours, 65 hours, 70 hours, 75 hours, 80 hours, 85 hours, 90 hours, 95 hours, 100 hours, etc.

[0043] Preferably, the regular interval in step (4) specifically includes every 2 hours to 20 hours, such as 2 hours, 3 hours, 5 hours, 10 hours, 15 hours, 20 hours, etc.

[0044] Preferably, the Raman spectrum information in step (4) includes any one of the characteristic peaks of the resin matrix, the characteristic peaks of the filler, and the characteristic peaks of the interface between the resin matrix and the filler detected in the bottom filling glue sample.

[0045] Preferably, the change of the characteristic peak in step (4) includes at least one of the appearance of a new peak, a change in peak intensity, a displacement of the peak, and a change in peak shape.

[0046] The present invention does not specifically limit the preparation method of the underfill sample. Exemplarily, it can be prepared by the following method:

[0047] (1) mixing a resin matrix, a filler, a curing agent, an optional catalyst, an optional coupling agent, an optional defoaming agent, and an optional toughening agent to obtain a mixed glue;

[0048] (2) Curing the mixed glue solution to obtain the bottom filling glue sample.

[0049] In a second aspect, the present invention provides a detection system for in-situ detection of wet-heat aging of an underfill, the detection system comprising:

[0050] Temperature-controlled and humidity-controlled sample stage, including temperature control module and humidity control module;

[0051] A confocal Raman microscope, used in conjunction with the temperature- and humidity-controlled sample stage, for performing in-situ Raman spectroscopy characterization of the bottom filler sample;

[0052] The analysis unit is used to analyze the changes of characteristic peaks according to the obtained Raman spectrum information, so as to determine the wet heat aging mechanism of the bottom filling glue sample.

[0053] Compared with the prior art, the present invention has the following beneficial effects:

[0054] The present invention provides a method for in-situ detection of wet heat aging of bottom filler. By combining a confocal micro-Raman spectrometer with a temperature and humidity control system, an in-situ detection system for wet heat aging of bottom filler is established. This method provides a method for real-time detection of changes in chemical bonds of materials during wet heat aging of bottom filler. Moreover, during the wet heat aging process, the present invention tests the same site of a test sample, and can more accurately monitor changes in chemical bonds of the material. This method provides a theoretical basis for studying the effectiveness of bottom filler materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Figure 1 This is a flow chart of the method for in-situ detection of wet-heat aging of bottom filler provided in Example 1 of the present invention.

[0056] Figure 2 Schematic diagram of a detection device for in-situ detection of wet-heat aging of bottom filling glue provided in Example 1 of the present invention.

[0057] Figure 3 Schematic diagram of the preparation process of the bottom filling glue sample provided in Example 1 of the present invention.

[0058] Figure 4 This is a Raman spectrum diagram of the initial underfill sample and the wet heat aging process provided in Example 1 of the present invention, wherein the test site is the resin matrix.

[0059] Figure 5 This is a Raman spectrum diagram of the initial underfill sample and the wet heat aging process provided in Example 2 of the present invention, wherein the test site is the interface between the resin matrix and the filler.

[0060] Figure 6 This is a Raman spectrum diagram of the initial underfill sample and the wet heat aging process provided in Example 3 of the present invention, wherein the test site is the filler. DETAILED DESCRIPTION

[0061] The technical solution of the present invention is further described below by way of specific embodiments. It should be understood by those skilled in the art that the embodiments are merely to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0062] Example 1

[0063] In this embodiment, a method for in-situ detection of the wet heat aging of the bottom filler is provided, and the flow chart thereof is shown as follows: Figure 1 The schematic diagram of the detection device is shown in Figure 2 As shown, the method includes the following steps:

[0064] (1) Provide bottom filler sample;

[0065] Specifically, the resin matrix, filler, and curing agent are mixed (i.e., mixed) in a mass ratio of 30:60:10, and stirred at high speed to obtain a mixed glue solution; the mixed glue solution is filled in a mold and cured to obtain the bottom filling glue sample; the schematic diagram of the preparation process of the bottom filling glue sample is shown in FIG. Figure 3 As shown;

[0066] The resin matrix is ​​bisphenol A epoxy resin, brand E-51 (EP01441-310): epoxy value 0.51, low viscosity, general purpose;

[0067] The filler is silicon dioxide;

[0068] The curing agent is an acid anhydride curing agent methyl hexahydrophthalic anhydride;

[0069] The curing process is to set the program oven to increase the temperature from room temperature to 120℃ at a heating rate of 5℃ / min, keep it warm for 0.5h, then increase the temperature from 120℃ to 150℃ at a heating rate of 2℃ / min, keep it warm for 1.5h, and finally cool it from 160℃ to room temperature at a cooling rate of 5℃ / min.

[0070] (2) The bottom filling glue sample is placed on a temperature-controlled and humidity-controlled sample stage, and the temperature-controlled and humidity-controlled sample stage is combined with a confocal micro-Raman spectrometer.

[0071] (3) Adjust the parameters of the temperature-controlled and humidity-controlled sample stage. Specifically, set the temperature and humidity of the temperature-controlled and humidity-controlled sample stage to 121°C and 100% RH. Adjust the parameters of the confocal Raman microscope to obtain the best test signal. Specifically, set the following parameters: excitation wavelength: 532 nm, integration time: 30 s, number of integrations: 1 time, and laser power: 5 mW.

[0072] (4) Under the conditions set in (3), the resin matrix of the initial bottom filling glue sample is characterized by in-situ Raman spectroscopy. Then, the bottom filling glue sample is subjected to wet heat aging. The same test site of the bottom filling glue sample is again characterized by in-situ Raman spectroscopy every 10 hours. The test is conducted for a total of 50 hours. The Raman spectral data obtained by the test is displayed in the form of an image as shown below. Figure 4 As shown, the changes in characteristic peaks are analyzed according to the obtained Raman spectrum information, thereby determining the wet-heat aging mechanism of the bottom filler sample.

[0073] Specifically, in this embodiment, for Figure 4 The Raman spectral data shown in the figure show that the epoxy resin has COC stretching vibration ~1250cm -1 Benzene ring breathing mode ~ 1600 cm -1 , methylmethylene 2800~3000cm -1 With the progress of hygrothermal aging, the CH vibration region (2800-3000cm -1 ) intensity decreases, reflecting the decrease in mobility of the resin chain segments. The carbonyl region (1700-1750cm -1 ) The increase in relative intensity represents an oxidation reaction (such as ester hydrolysis or ketone formation).

[0074] Example 2

[0075] In this embodiment, a method for in-situ detection of wet-heat aging of bottom filler is provided, wherein steps (1) to (3) are the same as those in embodiment 1, and step (4) is as follows:

[0076] Under the conditions set in (3), the interface between the resin matrix and the filler of the initial bottom filling glue sample is characterized by in-situ Raman spectroscopy. Then, the bottom filling glue sample is subjected to wet heat aging. The same test site of the bottom filling glue sample is again characterized by in-situ Raman spectroscopy every 10 hours. The test is conducted for a total of 50 hours. The Raman spectral data obtained by the test is displayed in the form of an image as shown below. Figure 5 As shown, the changes in characteristic peaks are analyzed according to the obtained Raman spectrum information, thereby determining the wet-heat aging mechanism of the bottom filler sample.

[0077] Specifically, in this embodiment, for Figure 5 The Raman spectrum data shown in the figure shows that the 800-900 cm -1 The Si-O-Si (filler) or Si-OC (interface bond) represented by the graphite structure weakens in strength and undergoes peak splitting with the progress of wet-heat aging, which indicates the breakage and reconstruction of the filler-resin interface bond.

[0078] Example 3

[0079] In this embodiment, a method for in-situ detection of wet-heat aging of bottom filler is provided, wherein steps (1) to (3) are the same as those in embodiment 1, and step (4) is as follows:

[0080] Under the conditions set in (3), the filler of the initial bottom filling glue sample is characterized by in-situ Raman spectroscopy. Then, the bottom filling glue sample is subjected to wet heat aging. The same test site of the bottom filling glue sample is characterized by in-situ Raman spectroscopy again every 10 hours. The test is conducted for a total of 50 hours. The Raman spectral data obtained by the test is displayed in the form of an image as shown below. Figure 6 As shown, the changes in characteristic peaks are analyzed according to the obtained Raman spectrum information, thereby determining the wet-heat aging mechanism of the bottom filler sample.

[0081] Specifically, in this embodiment, for Figure 6 From the Raman spectrum data shown, it can be seen that the Raman spectrum of the filler is in the low frequency region (<1000cm -1 ) has a strong peak (as shown in the figure, 465cm of SiO2 *1 ), its strength is relatively stable, which means that the filler itself has not been significantly degraded during the wet-heat aging process.

[0082] In summary, after preparing the underfill sample, the present invention established an in-situ detection system for the wet-heat aging of the underfill by combining a confocal micro-Raman spectrometer with a temperature and humidity control system. This method provides a theoretical basis for studying the effectiveness of underfill materials.

[0083] The applicant states that while the present invention uses the aforementioned embodiments to illustrate the method and system for in-situ detection of underfill hygrothermal aging, the present invention is not limited to the aforementioned embodiments, nor does it necessarily rely on the aforementioned embodiments for implementation. Those skilled in the art should understand that any improvements to the present invention, equivalent substitutions for the raw materials used, additions of auxiliary components, and selection of specific methods, etc., fall within the scope of protection and disclosure of the present invention.

Claims

1. A method for in-situ detection of damp heat aging of bottom filler, characterized in that: The method comprises the following steps: (1) Provide bottom filler sample; (2) placing the bottom filler sample on a temperature-controlled and humidity-controlled sample stage, wherein the temperature-controlled and humidity-controlled sample stage is coupled to a confocal Raman microscope; (3) adjusting the parameters of the temperature and humidity control sample stage and the parameters of the confocal micro-Raman spectrometer; (4) Under the conditions set in (3), an in-situ Raman spectroscopy characterization is performed on a certain site of the initial bottom filler sample, and then the bottom filler sample is subjected to wet heat aging. The same test site of the bottom filler sample is again subjected to in-situ Raman spectroscopy characterization at regular intervals, and the changes in characteristic peaks are analyzed based on the obtained Raman spectral information to determine the wet heat aging mechanism of the bottom filler sample.

2. The method for in-situ detection of wet-heat aging of bottom filler according to claim 1, characterized in that: The raw materials for preparing the bottom filling glue sample include a resin matrix, a filler, and a curing agent.

3. The method for in-situ detection of wet-heat aging of underfill according to claim 2, characterized in that: The resin matrix includes any one or a combination of at least two of bisphenol A epoxy resin, bisphenol F epoxy resin, novolac epoxy resin or alicyclic epoxy resin; Preferably, the filler comprises any one of silicon dioxide, aluminum oxide, aluminum nitride, boron nitride or silicon micropowder, or a combination of at least two thereof; Preferably, the curing agent includes any one of an amine curing agent, an acid anhydride curing agent or a phenolic resin curing agent, or a combination of at least two of them.

4. The method for in-situ detection of damp heat aging of bottom filler according to claim 2 or 3, characterized in that: The raw materials for preparing the bottom filling glue sample further include any one or a combination of at least two of a catalyst, a coupling agent, a defoaming agent, and a toughening agent; Preferably, the catalyst comprises any one or a combination of at least two of a tertiary amine catalyst, imidazole and its derivatives, a Lewis acid metal complex or a phosphonium salt catalyst; Preferably, the coupling agent includes any one of a silane coupling agent, a titanate coupling agent or an aluminate coupling agent, or a combination of at least two thereof; Preferably, the defoaming agent comprises any one or a combination of at least two of an organosilicon defoaming agent, a hydrocarbon defoaming agent, a polyether defoaming agent, a polymer defoaming agent or a composite defoaming agent; Preferably, the toughening agent includes any one or a combination of at least two of a rubber elastomer toughening agent, a thermoplastic resin toughening agent, a core-shell polymer, a hyperbranched polymer or a nanoparticle toughening agent.

5. The method for in-situ detection of damp heat aging of underfill according to any one of claims 1 to 4, characterized in that: The temperature and humidity control sample stage includes a sample stage for combining a humidity generator with a temperature control system or a sample stage for integrated temperature and humidity control; Preferably, the confocal Raman microscope spectrometer includes any one of WITec-alpha300 series, Horiba Scientific-LabRA series or Renishaw-inVia series.

6. The method for in-situ detection of damp heat aging of underfill according to any one of claims 1 to 5, characterized in that: The step (3) of adjusting the parameters of the temperature-controlled and humidity-controlled sample stage specifically includes: adjusting the temperature to 70° C. to 250° C., and adjusting the humidity to 20% RH to 100% RH.

7. The method for in-situ detection of damp heat aging of underfill according to any one of claims 1 to 6, characterized in that: The step (3) of adjusting the parameters of the confocal Raman microscope specifically includes: Adjusting the laser wavelength of the confocal micro-Raman spectrometer to at least one of 488 nm, 532 nm, 633 nm, and 785 nm; and / or, adjusting the integration time of the confocal Raman microscope to 1 s to 500 s; and / or, adjusting the number of integration times of the confocal Raman microscope to 1 to 50 times; And / or, the laser intensity of the confocal Raman microscope is adjusted to 1 mW to 50 mW.

8. The method for in-situ detection of wet heat aging of underfill according to any one of claims 1 to 7, characterized in that: The certain site in step (4) includes a certain site of any one of the resin matrix area, the filler area, and the interface area between the resin matrix and the filler of the bottom filling glue sample; Preferably, the time for performing the wet heat aging on the bottom filling glue sample in step (4) is 5 hours to 100 hours; Preferably, the regular interval in step (4) specifically includes every 2 hours to 20 hours.

9. The method for in-situ detection of wet heat aging of underfill according to any one of claims 1 to 8, characterized in that: The Raman spectrum information in step (4) includes any one of the characteristic peaks of the resin matrix, the characteristic peak of the filler, and the characteristic peak of the interface between the resin matrix and the filler detected in the bottom filler sample; Preferably, the change of the characteristic peak in step (4) includes at least one of the appearance of a new peak, a change in peak intensity, a displacement of the peak, and a change in peak shape.

10. A system for in-situ detection of damp heat aging of bottom filler, characterized in that: The detection system comprises: Temperature-controlled and humidity-controlled sample stage, including temperature control module and humidity control module; A confocal Raman microscope, used in conjunction with the temperature- and humidity-controlled sample stage, for performing in-situ Raman spectroscopy characterization of the bottom filler sample; The analysis unit is used to analyze the changes of characteristic peaks according to the obtained Raman spectrum information, so as to determine the wet heat aging mechanism of the bottom filling glue sample.

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