Evaluation method, device and equipment of heat-conducting colloid, storage medium and program product

Abstract

The invention relates to the technical field of electronic device assembly, and discloses a heat-conducting colloid evaluation method, device and equipment, a storage medium and a program product, and the method comprises the steps: carrying out the finite element modeling of a target heat-conducting colloid after the target heat-conducting colloid is determined, and obtaining an assembly model of the target heat-conducting colloid; performing finite element analysis on the assembly model based on a preset working condition to obtain an assembly response of the target heat-conducting colloid; and determining whether the target heat-conducting colloid meets a preset design requirement or not according to the assembly response. By performing finite element simulation analysis on the heat-conducting colloid, whether the uniformity design of the heat-conducting colloid is reasonable or not can be quickly, efficiently, accurately and reliably determined in the initial stage of design, and adjustment is performed in time when the uniformity design is unreasonable, so that the optimal scheme is selected during assembly, the quality problem of later test verification is avoided, and the production efficiency is improved. And the problems of over-high temperature and serious thermal failure caused by non-uniform distribution of the heat-conducting colloid due to deformation of the heat-conducting colloid are effectively solved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic device assembly, and in particular to an evaluation method, device, equipment, storage medium and program product of a thermally conductive colloid. Background Art

[0002] With the advancement of electronic design and manufacturing technology, the power density per unit area or volume of electronic components and devices is increasing. This leads to a significant increase in the heat generated per unit volume of integrated circuit chips and a sharp increase in the heat flux per unit volume. If the large amount of accumulated heat generated by integrated circuit chips cannot be dissipated smoothly and effectively, it will seriously affect the lifespan and operational reliability of the integrated circuit chips.

[0003] Thermally conductive colloids are excellent thermally conductive materials and are widely used. They can be molded to the shape of structures, exhibit excellent fluidity, offer excellent structural adaptability and surface adhesion, and can fully fill gaps. They also possess excellent insulation, withstand voltage, and temperature stability, making them safe and reliable. However, in actual design and use, when components connected to thermally conductive colloids undergo significant deformation, this deformation can lead to uneven distribution of the thermally conductive colloid. Even when the thermally conductive colloid is in a fluid state, deformation can cause the thermally conductive colloid to be squeezed out. This loss of thermal conductive colloid can cause overheating and serious thermal failure.

[0004] Therefore, when assembling electronic devices, the performance of the thermally conductive colloid must be evaluated to ensure that the selected and designed thermally conductive colloid maintains excellent performance during use. Existing technologies determine the thermally conductive colloid to be sprayed based on the coating area and the corresponding stress conditions during assembly, thereby pre-tightening the electronic device before direct assembly. This only prevents the assembly process from applying uniform extrusion pressure to the thermally conductive colloid, thereby avoiding the impact on the thermal resistance of the thermally conductive colloid and ensuring a more balanced thermal resistance characteristic after assembly. However, relying on extrusion pressure to ensure the performance of the thermally conductive colloid results in a low accuracy of the thermally conductive colloid evaluation, making it impossible to accurately determine whether the selection and design of the thermally conductive colloid meet the design requirements. Summary of the Invention

[0005] In view of this, the present invention provides a method, device, equipment, storage medium and program product for evaluating a thermally conductive colloid to solve the problem of being unable to accurately evaluate the design of the thermally conductive colloid.

[0006] In a first aspect, the present invention provides a method for evaluating a thermally conductive colloid, the method comprising: after determining a target thermally conductive colloid, performing finite element modeling on the target thermally conductive colloid to obtain an assembly model of the target thermally conductive colloid; performing finite element analysis on the assembly model based on preset working conditions to obtain an assembly response of the target thermally conductive colloid; and determining whether the target thermally conductive colloid meets preset design requirements based on the assembly response.

[0007] The thermally conductive colloid evaluation method provided by the present invention performs finite element modeling of the target thermally conductive colloid, performs finite element analysis on the resulting assembly model based on preset operating conditions, and determines whether the target thermally conductive colloid meets preset design requirements based on the assembly response obtained from the analysis. By performing finite element simulation analysis on the thermally conductive colloid, the present invention can quickly, efficiently, accurately, and reliably determine the rationality of the thermally conductive colloid's uniformity design at the initial design stage. If it is not rational, timely adjustments can be made, thereby selecting the optimal solution during assembly, avoiding quality issues that may arise during later testing and verification, and effectively addressing the problem of uneven thermal distribution caused by thermally conductive colloid deformation, resulting in excessive temperatures and serious thermal failure.

[0008] In an optional embodiment, the process of determining the target thermally conductive colloid includes: obtaining preset assembly parameters, the preset assembly parameters including: application position, connected parts, connection relationship, contact area and maximum operating temperature; determining the material type of the target thermally conductive colloid based on the preset assembly parameters, the target thermally conductive colloid is divided into a curing material and a non-curing material.

[0009] By selecting the thermally conductive colloid according to the assembly parameters, the present invention can select a more suitable thermally conductive colloid according to the actual situation, thereby achieving initial screening, thereby reducing the subsequent evaluation and analysis process to a certain extent.

[0010] In an optional embodiment, finite element modeling is performed on the target thermally conductive colloid to obtain an assembly model of the target thermally conductive colloid, including: if the target thermally conductive colloid is a solidified material, finite element modeling is performed according to a three-dimensional model of the target thermally conductive colloid after molding and the connected components to obtain a first initial model; first material parameters of the target thermally conductive colloid and the thermal expansion coefficient of the target thermally conductive colloid at different temperatures, and second material parameters of the connected components are obtained, and the first material parameters, thermal expansion coefficient, and second material parameters are input into the first initial model to obtain an assembly model.

[0011] By modeling a thermally conductive colloid made of a curing material and the connected components, the present invention can accurately simulate electronic devices after the thermally conductive colloid is assembled, thereby simulating and analyzing various working conditions of the electronic devices and determining whether the thermally conductive colloid will deform during use of the electronic devices, resulting in uneven distribution and affecting the thermal conductivity effect.

[0012] In an optional embodiment, finite element modeling is performed on the target thermally conductive colloid to obtain an assembly model of the target thermally conductive colloid, further comprising: if the target thermally conductive colloid is a non-curing material, determining the distribution of the target thermally conductive colloid according to the connected components, and performing finite element modeling based on the distribution and the connected components to obtain a second initial model; obtaining second material parameters of the connected components, and inputting the second material parameters into the second initial model to obtain an assembly model.

[0013] The present invention models the connected components when selecting a thermally conductive colloid made of a non-curing material. This allows the present invention to simulate electronic devices assembled with the thermally conductive colloid to the greatest extent possible when the thermally conductive colloid cannot be modeled. This allows for simulation analysis of various operating conditions of the electronic devices, and allows for judgment of whether the thermally conductive colloid will be squeezed during use, resulting in uneven distribution and affecting the thermal conductivity, thereby ensuring the quality of the electronic devices.

[0014] In an optional embodiment, obtaining the first material parameter of the target thermally conductive colloid includes: performing a mechanical property test on a standard test specimen of the target thermally conductive colloid to obtain a corresponding stress-strain relationship curve; fitting the stress-strain relationship curve to obtain a material constitutive equation of the target thermally conductive colloid; and simulating the basic deformation performance of the target thermally conductive colloid based on the material constitutive equation to obtain the first material parameter.

[0015] By conducting mechanical property tests on thermally conductive colloids made of solid materials, the present invention can accurately capture the mechanical responses of solid thermally conductive colloids under different stress states such as tension and compression, precisely quantify the mechanical and thermal properties of the thermally conductive colloids, and obtain the material parameters of the thermally conductive colloids, thereby achieving accurate modeling of the thermally conductive colloids.

[0016] In an optional embodiment, the preset working conditions include: assembly conditions, temperature cycling conditions or structural reliability analysis conditions. Finite element analysis is performed on the assembly model based on the preset working conditions to obtain the assembly response of the target thermal conductive colloid, including: if it is an assembly condition, then according to the assembly relationship between the target thermal conductive colloid and the connected components, the assembly force is applied to the assembly model to obtain the force parameters of the target thermal conductive colloid; if it is a temperature cycling condition, then according to the preset temperature range corresponding to the maximum operating temperature and the preset minimum temperature, the ambient temperature of the assembly model is cyclically adjusted to obtain the deformation parameters of the target thermal conductive colloid; if it is a structural reliability analysis condition, then a preset external force is applied to the assembly model to obtain the force parameters and deformation parameters of the target thermal conductive colloid.

[0017] By simulating the load forms and load sizes of the assembly model under different working conditions, the present invention can fully simulate whether the electronic device will experience leakage or extrusion of the thermal conductive colloid when the force is too large, uneven or the temperature is abnormal. Therefore, before assembling the thermal conductive colloid and the connected components, a full evaluation and analysis can be carried out. If the current selection of the thermal conductive colloid does not meet the working requirements of the electronic device, it is replaced and adjusted in time to avoid quality problems in subsequent test verification, improve the quality of the electronic device, and ensure the reliability and safety of the electronic device.

[0018] In an optional embodiment, determining whether the target thermally conductive colloid meets the preset design requirements is based on the assembly response, including: if the target thermally conductive colloid is a solidified material, determining the maximum pressure area average value and the minimum pressure area average value based on the force parameters; judging whether the difference between the maximum pressure area average value and the minimum pressure area average value is less than or equal to a first preset pressure threshold, and whether the minimum pressure area average value is less than or equal to a second preset pressure threshold; if the difference between the maximum pressure area average value and the minimum pressure area average value is less than or equal to the first preset pressure threshold, and the minimum pressure area average value is less than or equal to the second preset pressure threshold, then the preset design requirements are met.

[0019] By directly measuring the pressure borne by the thermally conductive colloid of the curing material, the present invention can establish a quantitative correlation between the pressure distribution and the colloid performance, accurately determine whether the force borne by the thermally conductive colloid is reasonable and uniform, and thus determine whether the selection of the thermally conductive colloid meets the design requirements.

[0020] In an optional embodiment, determining whether the target thermally conductive colloid meets the preset design requirements based on the assembly response further includes: if the target thermally conductive colloid is a non-curing material, determining a first displacement of a first component in the connected components and a second displacement of a second component in the connected components based on the deformation parameter; and determining whether the difference between the first displacement and the second displacement is less than or equal to a preset distance threshold; if so, the preset design requirements are met.

[0021] By measuring the displacement of the components connected by the thermally conductive colloid made of non-curing material, the present invention can establish a quantitative correlation between the deformation of the colloid under stress and its adaptability to actual working conditions, and indirectly determine whether the thermally conductive colloid is deformed under stress, thereby determining whether the selection of the thermally conductive colloid meets the design requirements.

[0022] In a second aspect, the present invention provides a device for evaluating a thermally conductive colloid, the device comprising:

[0023] A model building module is used to perform finite element modeling on the target thermal conductive colloid after the target thermal conductive colloid is determined, so as to obtain an assembly model of the target thermal conductive colloid;

[0024] The working condition analysis module is used to perform finite element analysis on the assembly model based on the preset working conditions to obtain the assembly response of the target thermal conductive colloid;

[0025] The performance analysis module is used to determine whether the target thermal conductive adhesive meets the preset design requirements based on the assembly response.

[0026] In a third aspect, the present invention provides a computer device comprising: a memory and a processor, the memory and the processor being communicatively connected to each other, the memory storing computer instructions, and the processor executing the computer instructions to thereby perform the thermal conductive colloid evaluation method of the first aspect or any corresponding embodiment thereof.

[0027] In a fourth aspect, the present invention provides a computer-readable storage medium having computer instructions stored thereon, the computer instructions being used to cause a computer to execute the thermal conductive colloid evaluation method of the first aspect or any corresponding embodiment thereof.

[0028] In a fifth aspect, the present invention provides a computer program product, comprising computer instructions for causing a computer to execute the method for evaluating a thermally conductive colloid according to the first aspect or any corresponding embodiment thereof.

[0029] Beneficial effects of the present invention:

[0030] (1) The present invention can quickly, efficiently, accurately, and reliably determine whether the uniformity design of the thermal conductive colloid is reasonable in the early stage of design by performing finite element simulation analysis on the thermal conductive colloid. If it is unreasonable, timely adjustments can be made, thereby selecting the optimal solution during assembly and avoiding quality problems in subsequent test verification. This effectively solves the problem of uneven distribution of the thermal conductive colloid due to deformation of the thermal conductive colloid, resulting in excessive temperature and serious thermal failure.

[0031] (2) The present invention can accurately simulate electronic devices assembled with the thermally conductive colloid by modeling the thermally conductive colloid of a curable material and the connected components, or by modeling the connected components when the thermally conductive colloid of a non-curable material is selected, thereby simulating and analyzing various working conditions of the electronic devices and determining whether the thermally conductive colloid will deform during use of the electronic devices, resulting in uneven distribution and affecting the thermal conductivity.

[0032] (3) By simulating the load forms and load sizes of the assembly model under different working conditions, the present invention can fully simulate whether the electronic device will experience leakage or extrusion of the thermal conductive colloid when the force is too large, uneven or the temperature is abnormal. Therefore, before assembling the thermal conductive colloid and the connected components, a full evaluation and analysis can be carried out. If the current selection of the thermal conductive colloid does not meet the working requirements of the electronic device, it can be replaced and adjusted in time, thereby improving the quality of the electronic device and ensuring the reliability and safety of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0034] Figure 1 is a schematic flow chart of a method for evaluating a thermally conductive colloid according to an embodiment of the present invention;

[0035] Figure 2 is a flow chart of another method for evaluating a thermally conductive colloid according to an embodiment of the present invention;

[0036] Figure 3 is a schematic diagram of the overall process of another method for evaluating a thermally conductive colloid according to an embodiment of the present invention;

[0037] Figure 4 is a schematic diagram of a stress-strain curve according to another method for evaluating a thermally conductive colloid according to an embodiment of the present invention;

[0038] Figure 5 is a flow chart of another method for evaluating a thermally conductive colloid according to an embodiment of the present invention;

[0039] Figure 6 is a structural block diagram of a device for evaluating a thermally conductive colloid according to an embodiment of the present invention;

[0040] Figure 7 Schematic diagram of the hardware structure of a computer device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0041] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of the present invention.

[0042] The embodiments of the present invention are applicable to scenarios where thermally conductive colloids are used to connect components of electrical devices to increase the heat dissipation of electronic devices, such as all scenarios where thermally conductive colloids are used in the fields of batteries, electronic controls, motors, etc. Thermally conductive colloid is a polymer composite material with heat conduction as its core function. It has the properties of bonding, filling, insulation, and shock absorption, and is widely used in thermal management scenarios in the fields of electronics, automobiles, aerospace, etc. Its core function is to reduce the contact thermal resistance and quickly conduct the heat of heating elements (such as chips, power devices) to the radiator or housing to avoid performance degradation or failure due to overheating.

[0043] During the actual design and use process, the following situations may occur: (1) Component deformation (such as chip thermal expansion, mechanical vibration displacement) breaks the initial uniform distribution state of the thermal conductive colloid, causing the colloid to over-accumulate or become thinner in local areas; (2) Non-curing thermal conductive colloids exhibit fluid-like properties under dynamic loads. When the component deformation generates shear force, the colloid is easily squeezed out of the interface gap. Non-curing thermal conductive silicone grease, gel and other materials exhibit fluid-like properties under dynamic loads. When the component deformation generates shear force, the colloid is easily squeezed out of the interface gap. The loss or uneven distribution of thermal conductive colloid causes local hot spots, which in turn triggers a vicious cycle: the temperature rise in the hot spot area accelerates the aging of the colloid; the thermal conductivity of the colloid after aging further decreases, causing the temperature to continue to rise, and eventually triggering the thermal protection of the component to reduce the frequency or permanent damage. Therefore, the embodiment of the present invention provides a method for evaluating thermal conductive colloids, which can quickly, efficiently, accurately and reliably determine whether the uniformity design of the thermal conductive colloid is reasonable in the early stage of design by performing an evaluation before assembling the thermal conductive colloid.

[0044] According to an embodiment of the present invention, an embodiment of a method for evaluating a thermally conductive adhesive is provided. It should be noted that the steps shown in the flowcharts of the accompanying drawings can be executed in a computer system, such as a set of computer-executable instructions. Moreover, although a logical order is shown in the flowcharts, in some cases, the steps shown or described may be executed in a different order than shown.

[0045] In this embodiment, a method for evaluating a thermally conductive colloid is provided, which can be used in mobile terminals, such as computers, etc. Figure 1 FIG. 1 is a flow chart of a method for evaluating a thermally conductive colloid according to an embodiment of the present invention. Figure 1 As shown, the process includes the following steps:

[0046] Step S101 : After determining the target thermally conductive colloid, finite element modeling is performed on the target thermally conductive colloid to obtain an assembly model of the target thermally conductive colloid.

[0047] Specifically, in an embodiment of the present invention, before assembling an electronic device, it is first necessary to determine the assembly parameters according to the expected assembly effect, and select a thermally conductive colloid according to the assembly parameters. After determining the target thermally conductive colloid, in order to ensure that the assembled electronic device can achieve the best heat dissipation effect, the target thermally conductive colloid is subjected to finite element modeling before assembly, so that simulation analysis can be performed based on the obtained assembly model. Among them, finite element modeling (FEM) is an engineering simulation technology based on numerical analysis. It decomposes a complex physical system into a finite number of simple units (called "finite elements") and mathematically models each unit, and finally solves the physical behavior of the entire system (such as stress, strain, temperature field, electromagnetic field, etc.) by computer. Thermally conductive colloids are adhesive and filling materials for components. Since the parameters and structure cannot be determined in advance, finite element modeling cannot be directly performed. In an embodiment of the present invention, thermally conductive colloids are divided into solidifying materials and non-solidifying materials. For thermally conductive colloids of solidifying materials, a three-dimensional model after molding is determined, and then finite element modeling is completed. However, thermally conductive colloids of non-solidifying materials cannot be molded, so they can only be modeled as much as possible based on their distribution. By modeling the thermally conductive colloid, the embodiments of the present invention can accurately simulate the electronic device after the thermally conductive colloid is assembled, thereby simulating and analyzing various working conditions of the electronic device, and determining whether the thermally conductive colloid will deform during the use of the electronic device, resulting in uneven distribution and affecting the thermal conductivity effect.

[0048] Step S102 : performing finite element analysis on the assembly model based on a preset working condition to obtain an assembly response of the target thermally conductive colloid.

[0049] Specifically, in an embodiment of the present invention, after determining the assembly model corresponding to the thermal conductive colloid, simulation is performed according to the working conditions that the electronic device may face, the load form and load size of the thermal conductive colloid during use are studied, and the assembly response corresponding to the selected thermal conductive colloid is obtained through finite element analysis. The embodiment of the present invention divides the working conditions into: assembly conditions, temperature cycle conditions and structural reliability analysis conditions. Among them, the assembly conditions correspond to the assembly process of the electronic device and simulate the force distribution of the thermal conductive colloid under the assembly condition. The temperature cycle condition corresponds to the working environment of the electronic device. Due to the on and off of the circuit, the electronic device will have an environment with alternating high and low temperatures. The performance of the thermal conductive colloid at different temperatures is different, and deformation may also occur. Therefore, it is necessary to simulate the deformation and force conditions of the thermal conductive colloid under the temperature cycle environment. The structural reliability analysis condition corresponds to the situation where the electronic device is subjected to external forces during use, and simulates the deformation and force conditions of the thermal conductive colloid when subjected to external forces.

[0050] Step S103 : determining whether the target thermally conductive colloid meets preset design requirements based on the assembly response.

[0051] Specifically, in an embodiment of the present invention, after obtaining the deformation and stress conditions of the thermal conductive colloid under different working conditions, it is determined whether the selected thermal conductive colloid meets the design requirements based on the deformation and stress conditions. If the deformation and stress conditions of the thermal conductive colloid are both within the ideal range, it is proved that the currently selected thermal conductive colloid can enable the electronic device to achieve a better heat dissipation effect, and the structure is relatively stable. Therefore, there is no need to replace the material, and the solution optimization stage can be directly entered, for example, by optimizing the detailed structure of the relevant structural components to meet the design requirements, or by optimizing the number of bolts and increasing the torque of the bolts to meet the design requirements. This is only an example and is not limited to this. On the contrary, if the deformation or stress conditions of the thermal conductive colloid are not within the ideal range, it is proved that the currently selected thermal conductive colloid cannot enable the electronic device to achieve a better heat dissipation effect, or the structure is unstable. Therefore, the process returns to the initial material selection stage, and finite element modeling and finite element analysis are performed again after replacing the thermal conductive colloid or adjusting the assembly of the thermal conductive colloid until the optimal assembly method is determined. For example, if the thermal conductive colloid is a non-curing material, the area or capacity of the colloid application needs to be guided by the distribution of force; if the thermal conductive colloid is a curing material, it needs to be guided by the use of thermal conductive colloid materials with different hardness or elasticity for optimization. This is only an example and is not limited to this.

[0052] The thermally conductive colloid evaluation method provided by the present invention performs finite element modeling of the target thermally conductive colloid, performs finite element analysis on the resulting assembly model based on preset operating conditions, and determines whether the target thermally conductive colloid meets preset design requirements based on the assembly response obtained from the analysis. By performing finite element simulation analysis on the thermally conductive colloid, the present invention can quickly, efficiently, accurately, and reliably determine the rationality of the thermally conductive colloid's uniformity design at the initial design stage. If it is not rational, timely adjustments can be made, thereby selecting the optimal solution during assembly, avoiding quality issues that may arise during later testing and verification, and effectively addressing the problem of uneven thermal distribution caused by thermally conductive colloid deformation, resulting in excessive temperatures and serious thermal failure.

[0053] In this embodiment, a method for evaluating a thermally conductive colloid is provided, which can be used in the above-mentioned mobile terminals, such as computers, etc. Figure 2 FIG. 1 is a flow chart of a method for evaluating a thermally conductive colloid according to an embodiment of the present invention. Figure 2 As shown, the process includes the following steps:

[0054] Step S201, obtaining preset assembly parameters, which include: application position, connected parts, connection relationship, contact area and maximum operating temperature; determining the material type of the target thermal conductive colloid according to the preset assembly parameters, the target thermal conductive colloid is divided into curing material and non-curing material.

[0055] Specifically, in an embodiment of the present invention, the application position of the thermal conductive colloid, the material of the connected component to which the application position of the thermal conductive colloid is connected, the connection relationship between the thermal conductive colloid and the connected component (whether it is detachable), the contact area between the thermal conductive colloid and the connected component, and the maximum operating temperature of the thermal conductive colloid are determined in advance according to the assembly requirements of the electronic device. Thermal conductive colloids are mainly divided into silicone rubber-based thermal conductive colloids, polyurethane-based thermal conductive colloids, non-curing thermal conductive silicone greases, and semi-solid thermal conductive colloids. In an embodiment of the present invention, the above-mentioned various thermal conductive colloids are divided into curing materials (non-fluid materials) and non-curing materials (fluid materials, including semi-solid and fluid materials), and then the material type of the required thermal conductive colloid is determined according to the above-mentioned assembly parameters, such as Figure 3 shown.

[0056] In some optional embodiments, taking the thermal conductive colloid used in the vehicle controller as an example, the selection is determined by automatic matching based on the working requirements of the vehicle controller and the core characteristics of the thermal conductive colloid. It can also be determined manually based on experience, including operating temperature, insulation, maintainability (whether it can be disassembled), whether high reliability is required, voltage environment, aging resistance, etc. For example, the core characteristics of silicone rubber-based thermal conductive adhesive include: ① Temperature resistance: -50℃~200℃ (some high-temperature models can reach 250℃), suitable for wide temperature environments; ② Softness and elasticity: anti-vibration and impact resistance, and can conform to irregular surfaces; ③ Insulation: Volume resistivity>10 12 Ω·cm, suitable for high-voltage applications; ④ Repairability: Non-curing or semi-curing types are removable and suitable for repairs. ⑤ Disadvantages: Low bonding strength and prone to oil release under prolonged high temperatures (a low-volatility type should be selected). Applications for silicone rubber-based thermal adhesives include: ① Automotive electronics: IGBT modules and on-board controllers (requires high and low temperature resistance and vibration resistance); ② High-power LEDs: require long-term stable heat dissipation and yellowing resistance; ③ Flexible circuits: wearable devices and foldable screen heat dissipation (conforms to curved surfaces); ④ Insulation applications: power modules and inverters (avoids leakage risks).

[0057] Step S202 : performing finite element analysis on the assembly model based on a preset working condition to obtain an assembly response of the target thermally conductive colloid.

[0058] Specifically, the above step S202 includes:

[0059] Step S2021 : If the target thermally conductive colloid is a solidified material, finite element modeling is performed according to the three-dimensional model of the target thermally conductive colloid after molding and the connected components to obtain a first initial model.

[0060] Specifically, in the embodiment of the present invention, Figure 3As shown, if the selected thermal conductive colloid is a solidifying material, it means that after assembly with the connected components, the thermal conductive colloid will solidify into a relatively fixed material. Therefore, the three-dimensional model of the thermal conductive colloid after forming is determined based on the assembly results of the connected components. The thermal conductive colloid is treated as a structural component and divided into hexahedral units for finite element modeling.

[0061] In some optional embodiments, based on the modeling of the thermally conductive colloid, finite element modeling is performed on the connected components corresponding to the thermally conductive colloid. If the thermally conductive colloid and the connected components are connected by a connection structure such as a bolt connection, finite element modeling of the bolts and other connecting parts is also required, thereby obtaining a first initial model that is identical to the actual physical foundation after assembly.

[0062] Step S2022 , obtaining first material parameters of the target thermally conductive colloid and its thermal expansion coefficient at different temperatures, and second material parameters of the connected component, and inputting the first material parameters, thermal expansion coefficient, and second material parameters into the first initial model to obtain an assembly model.

[0063] Specifically, in this embodiment of the present invention, after obtaining the physical appearance of the thermally conductive colloid and the connected component, the material parameters of the thermally conductive colloid and the connected component must be input. The material parameters of the connected component are generally known, and key parameters such as the tensile modulus, shear modulus, Poisson's ratio, and thermal expansion coefficient at different temperatures can be determined based on the manufacturer. The material parameters of the thermally conductive colloid, however, must be obtained through mechanical property testing.

[0064] In some optional implementations, the above step S2022 includes:

[0065] Step a1: Perform a mechanical property test on a standard test specimen of the target thermal conductive colloid to obtain a corresponding stress-strain relationship curve.

[0066] Step a2: Fitting the stress-strain relationship curve to obtain the material constitutive equation of the target thermal conductive colloid.

[0067] Step a3: simulating the deformation basic performance of the target thermal conductive colloid based on the material constitutive equation to obtain the first material parameters.

[0068] Specifically, in the embodiment of the present invention, a standard test specimen is made based on the solidified thermal conductive colloid in advance, and the mechanical properties of the standard test specimen are tested. The relationship curve between tensile stress and strain is tested through uniaxial tension and compression tests, such as Figure 4As shown in the figure, the relationship between compressive stress and strain is shown in the figure. Solid thermal conductive colloids are typical hyperelastic materials. The Mooney-Rivlin model can be used to fit the constitutive equation. The strain energy function of the Mooney-Rivlin model is shown below:

[0069] W=C1[I1-3]+C2[I2-3]

[0070] Where W is the elastic strain energy stored per unit volume of the thermally conductive colloid; I1 and I2 are the first and second strain invariants, describing the geometric quantities of the thermally conductive colloid's deformation and used to characterize the material's deformation state (tension, compression, shear, etc.); C1 and C2 are material constants, with C1 reflecting the stiffness (ability to resist stretching) corresponding to the tensile deformation of the material's molecular chain, and C2 reflecting the stiffness (ability to resist shear or volume change) corresponding to the shear or volumetric deformation of the material's molecular chain, determined by fitting the stress-strain relationship curves described above. The constitutive equation of the thermally conductive colloid is used to simulate the basic deformation properties of the solid-state thermally conductive colloid. At the same time, the thermal expansion coefficient of the thermally conductive colloid distributed at different temperatures is input as an important input for temperature cycling load analysis.

[0071] Step S203 : performing finite element analysis on the assembly model based on a preset working condition to obtain an assembly response of the target thermally conductive colloid.

[0072] Specifically, the above step S203 includes:

[0073] Step S2031 : If it is an assembly working condition, then according to the assembly relationship between the target thermally conductive colloid and the connected component, an assembly force is applied to the assembly model to obtain the force parameters of the target thermally conductive colloid.

[0074] Specifically, in the embodiments of the present invention, the assembly force (such as bolt pre-tightening force, pressing pressure) is transmitted to the thermal conductive colloid through the connected components (such as chips, heat sinks), and its size, direction and point of action directly affect the stress distribution and deformation morphology of the colloid. For example, excessive bolt pre-tightening force may cause local stress concentration in the solidified colloid, accelerating cracking; uneven pressure will cause the flow distribution of the non-solidified colloid to be unbalanced, reducing the thermal conductivity. Therefore, if Figure 3 As shown, the embodiment of the present invention establishes an assembly working condition based on the assembly relationship between the thermal conductive colloid and its connected components. If a connection method such as a bolt connection exists, a bolt preload is applied to the bolts in the assembly model to simulate the force distribution of the thermal conductive colloid under assembly conditions and obtain the force parameters of the thermal conductive colloid, including pressure, stress, strain, bolt axial force and other parameters.

[0075] Step S2032: If it is a temperature cycle working condition, the ambient temperature of the assembly model is cyclically adjusted according to the preset temperature range corresponding to the maximum working temperature and the preset minimum temperature to obtain the deformation parameters of the target thermal conductive colloid.

[0076] Specifically, in the embodiment of the present invention, due to the difference in thermal expansion coefficients between the thermal conductive colloid and the connected components, thermal mismatch stress is generated when the temperature changes. For example, a chip (CTE≈2.6×10 -6 / ℃) and substrate (CTE≈18×10 -6 / ℃) In the cycle of -40℃~85℃, the colloid needs to withstand periodic stretching and compression, which may cause fatigue cracking or performance degradation under long-term action. Moreover, the performance of the thermally conductive colloid at different temperatures is also different. The embodiment of the present invention is based on the situation that the electronic device will have a high and low temperature alternating environment due to the on and off of the circuit. It simulates the temperature cycle condition (temperature from high to low, or from low to high) according to the predetermined maximum operating temperature and the preset minimum temperature, and obtains the deformation parameters of the thermally conductive colloid, that is, the displacement. Among them, the highest temperature adopts the highest temperature of the electronic heating element, and the lowest temperature adopts the lowest temperature used in the environment, such as -40℃, which is only used as an example and is not limited to this.

[0077] Step S2033: If it is a structural reliability analysis condition, a preset external force is applied to the assembly model to obtain the force parameters and deformation parameters of the target thermal conductive colloid.

[0078] Specifically, in an embodiment of the present invention, a preset external force (such as vibration, impact, and extrusion) is transmitted to the thermally conductive colloid through the connected components (chip, heat sink), and its magnitude, frequency, and direction of action directly affect the stress distribution and deformation mode of the colloid. For example: vibration load: high-frequency vibration (100Hz-500Hz) can easily cause fatigue damage to the colloid; impact load: instantaneous high acceleration (such as 100g) may cause local stress concentration in the colloid, causing cracking or falling off. The embodiment of the present invention simulates impact load conditions, vibration endurance conditions, etc., to obtain the force parameters and deformation parameters of the thermally conductive colloid, and the size of the loaded load can be formulated according to actual conditions.

[0079] Step S204 : determining whether the target thermally conductive colloid meets preset design requirements based on the assembly response.

[0080] Specifically, the above step S204 includes:

[0081] In step S2041 , if the target thermally conductive colloid is a solidified material, an average value of the maximum pressure region and an average value of the minimum pressure region are determined according to the force parameters.

[0082] Specifically, in the embodiment of the present invention, for the thermally conductive colloid made of a solidifying material, the pressure distribution directly affects its thermal conductivity and structural stability. Uneven pressure may lead to an increase in local thermal resistance (such as a reduction in contact area in an area with insufficient pressure) or stress concentration causing colloid cracking (such as excessive pressure at the edge). Uniform pressure can ensure that the colloid is in full contact with the connected components and maintain a stable heat conduction path. Therefore, if Figure 3 As shown, when the embodiment of the present invention performs working condition analysis on the assembly model, the pressure data on the surface of the thermal conductive colloid is obtained, and the average value P of the maximum pressure area of ​​the thermal conductive colloid is located by evaluating the pressure distribution. max and the average value of the minimum pressure area P min .

[0083] Step S2042: Determine whether the difference between the average value of the maximum pressure area and the average value of the minimum pressure area is less than or equal to a first preset pressure threshold, and whether the average value of the minimum pressure area is less than or equal to a second preset pressure threshold.

[0084] Specifically, in the embodiment of the present invention, the pressure difference ΔP=P between the maximum pressure area and the minimum pressure area is first calculated. max -P min The pressure difference ΔP is compared with the first preset pressure threshold A (Mpa) to determine the uniformity of the pressure on the thermal conductive colloid. In addition, the average value of the minimum pressure area P min The pressure is compared with the second preset pressure threshold B (Mpa) to determine the rationality of the pressure on the thermal conductive colloid.

[0085] Step S2043: If the difference between the average value of the maximum pressure area and the average value of the minimum pressure area is less than or equal to the first preset pressure threshold, and the average value of the minimum pressure area is less than or equal to the second preset pressure threshold, the preset design requirement is met.

[0086] Specifically, in the embodiment of the present invention, if the pressure difference ΔP is less than or equal to the first preset pressure threshold A (Mpa), it proves that the pressure on the thermal conductive colloid is relatively uniform, and if the pressure difference ΔP is greater than the first preset pressure threshold A (Mpa), it proves that the force on the thermal conductive colloid is uneven and does not meet the design requirements. In addition, if the average value of the minimum pressure area P min If the average value of the minimum pressure area P is less than or equal to the second preset pressure threshold B (Mpa), it proves that the pressure on the thermal conductive colloid is reasonable. min If the pressure is greater than the second preset pressure threshold B (Mpa), the force applied to the thermally conductive colloid is unreasonable and does not meet the design requirements. If the force applied to the thermally conductive colloid is determined to be uniform and reasonable, the design requirements are met. The first preset pressure threshold A and the second preset pressure threshold B are determined based on actual scenarios and are not limited here.

[0087] The thermally conductive colloid evaluation method provided by the present invention performs finite element modeling of the target thermally conductive colloid, performs finite element analysis on the resulting assembly model based on preset operating conditions, and determines whether the target thermally conductive colloid meets preset design requirements based on the assembly response obtained from the analysis. By performing finite element simulation analysis on the thermally conductive colloid, the present invention can quickly, efficiently, accurately, and reliably determine the rationality of the thermally conductive colloid's uniformity design at the initial design stage. If it is not rational, timely adjustments can be made, thereby selecting the optimal solution during assembly, avoiding quality issues that may arise during later testing and verification, and effectively addressing the problem of uneven thermal distribution caused by thermally conductive colloid deformation, resulting in excessive temperatures and serious thermal failure.

[0088] In this embodiment, a method for evaluating a thermally conductive colloid is provided, which can be used in the above-mentioned mobile terminals, such as computers, etc. Figure 5 FIG. 1 is a flow chart of a method for evaluating a thermally conductive colloid according to an embodiment of the present invention. Figure 5 As shown, the process includes the following steps:

[0089] Step S501 : After determining the target thermally conductive colloid, finite element modeling is performed on the target thermally conductive colloid to obtain an assembly model of the target thermally conductive colloid.

[0090] Specifically, the above step S501 includes:

[0091] Step S5011: If the target thermally conductive colloid is a non-curing material, the distribution of the target thermally conductive colloid is determined according to the connected components, and finite element modeling is performed based on the distribution and the connected components to obtain a second initial model.

[0092] Specifically, in an embodiment of the present invention, if the selected thermally conductive colloid is a non-curing material, it still cannot solidify into a relatively fixed form after assembly is completed, but exists in a semi-solid or fluid form. In this case, it is impossible to model the thermally conductive colloid. Therefore, an embodiment of the present invention determines the distribution of the target thermally conductive colloid based on the connected components, and performs finite element modeling based on the distribution and the connected components to obtain a second initial model, that is, the location of the thermally conductive colloid does not set the model of the thermally conductive colloid, but the deformation of the connected components is used to determine the reasonable distribution of the thermally conductive colloid, such as Figure 3 The embodiment of the present invention takes into account thermally conductive colloids of different materials, which are mainly divided into flowing state and non-flowing state. Different forms of thermally conductive colloids use different material models, which can be used for targeted simulation analysis.

[0093] Step S5012: Acquire second material parameters of the connected components, and input the second material parameters into the second initial model to obtain an assembly model.

[0094] Specifically, in this embodiment of the present invention, because the thermally conductive adhesive is a non-curing material, its material parameters cannot be determined. Therefore, this embodiment of the present invention only obtains the material parameters of the connected components, including key parameters such as the tensile elastic modulus, shear elastic modulus, Poisson's ratio, and thermal expansion coefficient at different temperatures. This is for example only and not limited to this. The material parameters of the connected components are input into the constructed initial model to obtain the assembly model when the non-curing thermally conductive adhesive is selected for assembly.

[0095] Step S502: Perform finite element analysis on the assembly model based on the preset working conditions to obtain the assembly response of the target thermal conductive colloid. Figure 2 Step S202 of the illustrated embodiment will not be described in detail here.

[0096] Step S503 : determining whether the target thermally conductive colloid meets preset design requirements based on the assembly response.

[0097] Specifically, the above step S503 includes:

[0098] In step S5031 , if the target thermally conductive adhesive is a non-curing material, a first displacement of a first component in the connected components and a second displacement of a second component in the connected components are determined according to the deformation parameter.

[0099] Specifically, in this embodiment of the present invention, because the constructed assembly model does not include a model of the non-curing thermally conductive adhesive, its stress conditions cannot be determined, nor can the direct deformation of the thermally conductive adhesive be determined. Therefore, this embodiment of the present invention uses the relative position of the connected components as the deformation of the thermally conductive adhesive. During the finite element analysis process, the initial position of the connected components and their real-time positions under the tested conditions are recorded, thereby determining the first displacement U1 and second displacement U2 of the two connected components.

[0100] Step S5032: determine whether the difference between the first displacement and the second displacement is less than or equal to a preset distance threshold. If so, the preset design requirement is met.

[0101] Specifically, in the embodiment of the present invention, for example, the connected components are a top-bottom structure, the upper part of the thermal conductive colloid is the connector 1, and the lower part of the thermal conductive colloid is the connector 2. Through analysis, it can be found that the displacement of the connector 1 in the thermal conductive colloid is U1, and the displacement of the connector 2 is U2. Then the difference between the two displacements is calculated as ΔU = U2-U2. This displacement difference represents the maximum relative deformation value of the thermal conductive colloid connection components, such as Figure 3As shown. If ΔU is less than or equal to the preset distance threshold C (mm), it proves that the thermal conductive colloid has not undergone significant deformation and meets the design requirements. If ΔU is greater than the preset distance threshold C (mm), it proves that the thermal conductive colloid has undergone significant deformation, resulting in positional displacement of the connected components, which does not meet the design requirements. The embodiment of the present invention determines the evaluation criteria for the material of the thermal conductive colloid, and evaluates the rationality of the design from the pressure or the displacement of the connected components. It can verify to the greatest extent whether the selection of the thermal conductive colloid meets the design requirements, solve the problem of uneven distribution of the thermal conductive colloid due to deformation of the thermal conductive colloid, resulting in excessive temperature and serious thermal failure, and thus solve this quality problem, which can reduce testing and R&D costs, shorten the product development cycle, and support the "one-time design for electronic products".

[0102] The thermally conductive colloid evaluation method provided by the present invention performs finite element modeling of the target thermally conductive colloid, performs finite element analysis on the resulting assembly model based on preset operating conditions, and determines whether the target thermally conductive colloid meets preset design requirements based on the assembly response obtained from the analysis. By performing finite element simulation analysis on the thermally conductive colloid, the present invention can quickly, efficiently, accurately, and reliably determine the rationality of the thermally conductive colloid's uniformity design at the initial design stage. If it is not rational, timely adjustments can be made, thereby selecting the optimal solution during assembly, avoiding quality issues that may arise during later testing and verification, and effectively addressing the problem of uneven thermal distribution caused by thermally conductive colloid deformation, resulting in excessive temperatures and serious thermal failure.

[0103] This embodiment also provides a device for evaluating thermally conductive colloids, which is used to implement the above-mentioned embodiments and preferred embodiments. Details already described will not be repeated here. As used below, the term "module" may refer to a combination of software and / or hardware that implements a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, implementation using hardware, or a combination of software and hardware, is also possible and contemplated.

[0104] This embodiment provides a device for evaluating thermally conductive colloids. Figure 6 Shown, including:

[0105] The model building module 601 is used to perform finite element modeling on the target thermally conductive colloid after the target thermally conductive colloid is determined, so as to obtain an assembly model of the target thermally conductive colloid.

[0106] The working condition analysis module 602 is used to perform finite element analysis on the assembly model based on the preset working condition to obtain the assembly response of the target thermal conductive colloid.

[0107] The performance analysis module 603 is used to determine whether the target thermal conductive colloid meets the preset design requirements according to the assembly response.

[0108] In some optional embodiments, the device also includes: a type determination module for obtaining preset assembly parameters, the preset assembly parameters including: application position, connected parts, connection relationship, contact area and maximum operating temperature; determining the material type of the target thermal conductive colloid according to the preset assembly parameters, the target thermal conductive colloid is divided into a curing material and a non-curing material.

[0109] In some optional implementations, the model building module 601 includes:

[0110] The first model building unit is used to, if the target thermally conductive colloid is a solidified material, perform finite element modeling according to the three-dimensional model of the target thermally conductive colloid after molding and the connected components to obtain a first initial model; obtain first material parameters of the target thermally conductive colloid and the thermal expansion coefficient of the target thermally conductive colloid at different temperatures, and second material parameters of the connected components, and input the first material parameters, thermal expansion coefficient, and second material parameters into the first initial model to obtain an assembly model.

[0111] The second model building unit is used to determine the distribution of the target thermally conductive colloid according to the connected components if the target thermally conductive colloid is a non-curing material, and perform finite element modeling based on the distribution and the connected components to obtain a second initial model; obtain second material parameters of the connected components, and input the second material parameters into the second initial model to obtain an assembly model.

[0112] In some optional embodiments, the first model building unit includes:

[0113] The mechanical testing subunit is used to perform mechanical property tests on standard test specimens of the target thermal conductive colloid to obtain the corresponding stress-strain relationship curve.

[0114] The equation determination subunit is used to fit the stress-strain relationship curve to obtain the material constitutive equation of the target thermal conductive colloid.

[0115] The parameter determination subunit is used to simulate the deformation basic performance of the target thermal conductive colloid based on the material constitutive equation to obtain the first material parameter.

[0116] In some optional implementations, the operating condition analysis module 602 includes:

[0117] The first working condition analysis unit is used to apply an assembly force to the assembly model according to the assembly relationship between the target thermally conductive colloid and the connected component if it is an assembly working condition, so as to obtain the force parameters of the target thermally conductive colloid.

[0118] The second working condition analysis unit is used to cyclically adjust the ambient temperature of the assembly model according to a preset temperature range corresponding to the maximum working temperature and the preset minimum temperature if it is a temperature cycle working condition, so as to obtain the deformation parameters of the target thermal conductive colloid.

[0119] The third working condition analysis unit is used to apply a preset external force to the assembly model if it is a structural reliability analysis working condition, and obtain the force parameters and deformation parameters of the target thermal conductive colloid.

[0120] In some optional implementations, the performance analysis module 603 includes:

[0121] The first performance analysis unit is used to determine the average value of the maximum pressure area and the average value of the minimum pressure area based on the force parameters if the target thermal conductive colloid is a solidified material; determine whether the difference between the average value of the maximum pressure area and the average value of the minimum pressure area is less than or equal to a first preset pressure threshold, and whether the average value of the minimum pressure area is less than or equal to a second preset pressure threshold; if the difference between the average value of the maximum pressure area and the average value of the minimum pressure area is less than or equal to the first preset pressure threshold, and the average value of the minimum pressure area is less than or equal to the second preset pressure threshold, then the preset design requirements are met.

[0122] The second performance analysis unit is configured to determine, if the target thermally conductive colloid is a non-curing material, a first displacement of a first component in the connected components and a second displacement of a second component in the connected components based on the deformation parameter; and determine whether a difference between the first displacement and the second displacement is less than or equal to a preset distance threshold. If so, the preset design requirement is met.

[0123] The further functional description of each of the above modules and units is the same as that of the above corresponding embodiments and will not be repeated here.

[0124] The evaluation device for the thermally conductive colloid in this embodiment is presented in the form of a functional unit, where the unit refers to an ASIC (Application Specific Integrated Circuit) circuit, a processor and memory that executes one or more software or fixed programs, and / or other devices that can provide the above functions.

[0125] The embodiment of the present invention also provides a computer device having the above Figure 6 Evaluation device for thermally conductive gel shown.

[0126] See also Figure 7 , Figure 7 is a structural diagram of a computer device provided by an optional embodiment of the present invention, such as Figure 7As shown, the computer device includes: one or more processors 10, memory 20, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. Various components utilize different buses to communicate with each other and can be installed on a common mainboard or installed in other ways as needed. The processor can process the instructions executed in the computer device, including instructions stored in the memory or on the memory to display the graphical information of the GUI on an external input / output device (such as, a display device coupled to the interface). In some optional embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Equally, multiple computer devices can be connected, and each device provides part of the necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Figure 7 A processor 10 is taken as an example.

[0127] The processor 10 may be a central processing unit, a network processor, or a combination thereof. The processor 10 may further include a hardware chip. The hardware chip may be an application-specific integrated circuit, a programmable logic device, or a combination thereof. The programmable logic device may be a complex programmable logic device, a field programmable gate array, a general purpose array logic, or any combination thereof.

[0128] The memory 20 stores instructions that can be executed by at least one processor 10, so that the at least one processor 10 executes the method shown in the above embodiment.

[0129] The memory 20 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and application programs required for at least one function; the data storage area may store data created based on the use of the computer device, etc. In addition, the memory 20 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some optional embodiments, the memory 20 may optionally include a memory remotely located relative to the processor 10, and these remote memories may be connected to the computer device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0130] The memory 20 may include a volatile memory, such as a random access memory; the memory may also include a non-volatile memory, such as a flash memory, a hard disk or a solid-state drive; the memory 20 may also include a combination of the above types of memory.

[0131] The computer device further includes a communication interface 30 for the computer device to communicate with other devices or a communication network.

[0132] The embodiment of the present invention also provides a computer-readable storage medium. The above-mentioned method according to the embodiment of the present invention can be implemented in hardware, firmware, or implemented as a computer code that can be recorded in a storage medium, or implemented as a computer code that is originally stored in a remote storage medium or a non-temporary machine-readable storage medium and downloaded through a network and will be stored in a local storage medium, so that the method described herein can be stored in such software processing on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. Among them, the storage medium can be a magnetic disk, an optical disk, a read-only storage memory, a random access memory, a flash memory, a hard disk or a solid-state drive, etc.; further, the storage medium can also include a combination of the above-mentioned types of memory. It can be understood that a computer, a processor, a microprocessor controller or programmable hardware includes a storage component that can store or receive software or computer code. When the software or computer code is accessed and executed by a computer, a processor or hardware, the method shown in the above embodiment is implemented.

[0133] A portion of the present invention may be applied as a computer program product, such as a computer program instruction, which, when executed by a computer, can call or provide the method and / or technical solution according to the present invention through the operation of the computer. Those skilled in the art should understand that the form in which the computer program instruction exists in a computer-readable medium includes, but is not limited to, a source file, an executable file, an installation package file, etc. Accordingly, the way in which the computer program instruction is executed by the computer includes, but is not limited to: the computer directly executes the instruction, or the computer compiles the instruction and then executes the corresponding compiled program, or the computer reads and executes the instruction, or the computer reads and installs the instruction and then executes the corresponding installed program. Here, the computer-readable medium may be any available computer-readable storage medium or communication medium that can be accessed by the computer.

[0134] Although the embodiments of the present invention have been described with reference to the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention. Such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A method for evaluating a thermally conductive colloid, characterized in that: The method comprises: After the target thermal conductive colloid is determined, finite element modeling is performed on the target thermal conductive colloid to obtain an assembly model of the target thermal conductive colloid; Performing finite element analysis on the assembly model based on a preset working condition to obtain an assembly response of the target thermally conductive colloid; Determine whether the target thermally conductive colloid meets preset design requirements according to the assembly response.

2. The method according to claim 1, characterized in that The process of determining the target thermally conductive colloid includes: Obtaining preset assembly parameters, wherein the preset assembly parameters include: application position, connected parts, connection relationship, contact area, and maximum operating temperature; The material type of the target thermally conductive colloid is determined according to the preset assembly parameters, and the target thermally conductive colloid is divided into a solidifying material and a non-solidifying material.

3. The method according to claim 2, characterized in that The step of performing finite element modeling on the target thermally conductive colloid to obtain an assembly model of the target thermally conductive colloid includes: If the target thermally conductive colloid is the solidified material, finite element modeling is performed according to the three-dimensional model of the target thermally conductive colloid after molding and the connected component to obtain a first initial model; The first material parameters of the target thermally conductive colloid and the thermal expansion coefficient of the target thermally conductive colloid at different temperatures, and the second material parameters of the connected component are obtained, and the first material parameters, the thermal expansion coefficient, and the second material parameters are input into the first initial model to obtain the assembly model.

4. The method according to claim 2, characterized in that The performing finite element modeling on the target thermally conductive colloid to obtain an assembly model of the target thermally conductive colloid further includes: If the target thermally conductive colloid is the non-curing material, determining the distribution of the target thermally conductive colloid according to the connected component, and performing finite element modeling based on the distribution and the connected component to obtain a second initial model; A second material parameter of the connected component is obtained, and the second material parameter is input into the second initial model to obtain the assembly model.

5. The method according to claim 3, characterized in that The obtaining of the first material parameter of the target thermally conductive colloid includes: Performing mechanical property tests on standard test specimens of the target thermally conductive colloid to obtain corresponding stress-strain relationship curves; Fitting the stress-strain relationship curve to obtain a material constitutive equation of the target thermal conductive colloid; The first material parameters are obtained by simulating the deformation basic performance of the target thermally conductive colloid based on the material constitutive equation.

6. The method according to claim 2, characterized in that The preset working conditions include: assembly conditions, temperature cycle conditions, or structural reliability analysis conditions. The finite element analysis of the assembly model based on the preset working conditions to obtain the assembly response of the target thermally conductive colloid includes: If it is the assembly working condition, applying an assembly force to the assembly model according to the assembly relationship between the target thermally conductive colloid and the connected component to obtain the force parameters of the target thermally conductive colloid; If it is the temperature cycle working condition, the ambient temperature of the assembly model is cyclically adjusted according to the preset temperature range corresponding to the maximum operating temperature and the preset minimum temperature to obtain the deformation parameters of the target thermal conductive colloid; If it is the structural reliability analysis working condition, a preset external force is applied to the assembly model to obtain the force parameters and the deformation parameters of the target thermal conductive colloid.

7. The method according to claim 6, characterized in that Determining whether the target thermally conductive colloid meets preset design requirements according to the assembly response includes: If the target thermally conductive colloid is a solidified material, the average value of the maximum pressure area and the average value of the minimum pressure area are determined according to the force parameters; Determine whether the difference between the average value of the maximum pressure area and the average value of the minimum pressure area is less than or equal to a first preset pressure threshold, and whether the average value of the minimum pressure area is less than or equal to a second preset pressure threshold; If the difference between the average value of the maximum pressure area and the average value of the minimum pressure area is less than or equal to the first preset pressure threshold, and the average value of the minimum pressure area is less than or equal to the second preset pressure threshold, the preset design requirement is met.

8. The method according to claim 6, characterized in that The determining whether the target thermally conductive colloid meets preset design requirements according to the assembly response further includes: If the target thermally conductive colloid is a non-curing material, determining a first displacement of a first component in the connected components and a second displacement of a second component in the connected components according to the deformation parameter; It is determined whether the difference between the first displacement and the second displacement is less than or equal to a preset distance threshold; if so, the preset design requirement is met.

9. A device for evaluating a thermally conductive colloid, characterized in that: The device comprises: A model building module is used to perform finite element modeling on the target thermally conductive colloid after determining the target thermally conductive colloid, so as to obtain an assembly model of the target thermally conductive colloid; A working condition analysis module, configured to perform finite element analysis on the assembly model based on a preset working condition to obtain an assembly response of the target thermally conductive colloid; A performance analysis module is used to determine whether the target thermally conductive colloid meets preset design requirements based on the assembly response.

10. A computer device, characterized in that: include: A memory and a processor, wherein the memory and the processor are communicatively connected to each other, the memory stores computer instructions, and the processor executes the evaluation method of the thermal conductive colloid according to any one of claims 1 to 8 by executing the computer instructions.

11. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a computer to execute the thermal conductive adhesive evaluation method according to any one of claims 1 to 8.

12. A computer program product, characterized in that The method comprises computer instructions for causing a computer to execute the thermal conductive adhesive evaluation method according to any one of claims 1 to 8.

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