Substrate processing apparatus

Abstract

The invention provides a substrate processing apparatus capable of improving solvent concentration in a shorter time. This substrate processing apparatus (100) is provided with a processing tank (Tk0), a substrate holding unit (10), a discharge unit (4), and an organic solvent recovery unit (5). The processing tank (Tk0) stores a liquid (L1). The substrate holding unit (10) holds a plurality of substrates (W) and immerses the plurality of substrates (W) in the liquid (L1) in the processing tank (Tk0). The discharge unit (4) discharges a second-concentration liquid having a higher solvent concentration than the first-concentration liquid from a treatment tank (Tk0) in which a liquid (L1) is stored in the treatment tank (Tk0), the liquid (L1) containing water and an organic solvent having a lower specific gravity than the water and having a higher solvent concentration on the upper side than on the lower side, while avoiding at least a part of the first-concentration liquid in the liquid (L1). The organic solvent recovery unit (5) includes a dehydrator that separates water from the second-concentration liquid discharged by the discharge unit (4) and generates a third-concentration liquid having a higher solvent concentration than the second-concentration liquid.

Description

Technical Field

[0001] The present invention relates to a substrate processing device. Background Art

[0002] Patent document 1 discloses an IPA recovery system for recovering aqueous IPA (isopropyl alcohol) discharged from a processing unit for processing a substrate. The IPA recovery system includes a storage tank, a circulation pipe, a pump, a dehydration unit, and a filter. The aqueous IPA from the processing unit is supplied to the storage tank. The circulation pipe is connected to the storage tank to return the aqueous IPA from the storage tank to the storage tank. The pump is provided in the circulation pipe to transport the aqueous IPA from the upstream end to the downstream end of the circulation pipe. The filter is provided in the circulation pipe to remove foreign matter in the aqueous IPA. The dehydration unit is provided in the circulation pipe to remove water from the aqueous IPA.

[0003] The recovery system circulates aqueous IPA through a circulation path consisting of a storage tank and circulation piping. This circulation allows the aqueous IPA to pass through the filter and dehydration unit. This increases the IPA concentration of the circulating aqueous IPA and reduces foreign matter in the aqueous IPA. In other words, this circulation allows clean aqueous IPA with a high IPA concentration to be stored in the storage tank. The aqueous IPA in this storage tank is then supplied to the processing unit again, thereby reducing the amount of IPA waste.

[0004] [Background Art Literature]

[0005] [Patent Document]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-41505 Summary of the Invention

[0007] [Problems to be solved by the invention]

[0008] When a mixed liquid having a low solvent concentration is recovered from a treatment unit to a storage tank, there is a problem that it takes a longer time to increase the solvent concentration of the mixed liquid in the storage tank.

[0009] Therefore, an object of the present invention is to provide a substrate processing apparatus capable of increasing the solvent concentration in a shorter time.

[0010] [Technical means to solve the problem]

[0011] The first form is a substrate processing device, which comprises: a processing tank for storing liquid; a substrate holding part for holding multiple substrates and immersing the multiple substrates in the liquid in the processing tank; a discharge part for discharging a second concentration liquid having a higher solvent concentration than the first concentration liquid from the processing tank storing the liquid, avoiding at least a portion of the first concentration liquid in the liquid, and the liquid contains water and an organic solvent with a lighter specific gravity than the water, and is stored in the processing tank with a concentration distribution in which the solvent concentration on the upper side is higher than that on the lower side; and an organic solvent recovery part, comprising a dehydrator, which separates water from the second concentration liquid discharged through the discharge part to produce a third concentration liquid having a higher solvent concentration than the second concentration liquid.

[0012] The second form is a substrate processing device according to the first form, which comprises: a pure water supply unit, including a supply pipe for causing pure water to flow to the processing tank; a solvent vapor supply unit, including a spray pipe, which sprays the vapor of the organic solvent with higher volatility than the pure water to a space above the processing tank; and a control unit; wherein the substrate holding unit causes the plurality of substrates to be raised and lowered between an immersion position inside the processing tank and a position above the processing tank, and the control unit causes the pure water supply unit to supply the pure water to the processing tank, and causes the The substrate holding unit lowers the multiple substrates to the immersion position so that the multiple substrates are immersed in the pure water. In the immersed state of the multiple substrates immersed in the pure water, the solvent vapor supply unit is caused to eject the vapor from the ejection pipe to form a liquid film of the organic solvent on the liquid surface of the processing tank. In the state where the liquid film is formed, the multiple substrates are raised from the immersion position. In the non-immersed state where the multiple substrates are located at a position higher than the processing tank, the discharge unit is caused to discharge the second concentration liquid from the processing tank.

[0013] The third form is a substrate processing device based on the second form, which further includes a pressure adjustment unit for adjusting the pressure in the processing chamber accommodating the processing tank, and the control unit dries the multiple substrates when the pressure adjustment unit reduces the pressure in the processing chamber to a first pressure value, and causes the discharge unit to discharge the second concentration liquid from the processing tank when the pressure adjustment unit adjusts the pressure in the processing chamber to be higher than the first pressure value.

[0014] A fourth aspect is the substrate processing apparatus according to any one of the first to third aspects, wherein the solvent concentration of the second concentration liquid is equal to or greater than a lower limit of an applicable range of the solvent concentration of the dehydrator.

[0015] A fifth aspect is the substrate processing apparatus according to the fourth aspect, wherein the dehydrator includes a membrane separator having a separation membrane that allows water contained in the second concentration liquid to pass therethrough.

[0016] The 6th form is a substrate processing device according to any one of the 1st to 5th forms, wherein the discharge part includes: a discharge piping having an upstream end and a downstream end, the upstream end being immersed in the liquid in the processing tank at a height position corresponding to the second concentration liquid, and the downstream end being connected to the organic solvent recovery part; and a discharge valve inserted in the discharge piping.

[0017] The 7th form is a substrate processing device according to any one of the 1st to 6th forms, wherein the discharge part comprises: a first discharge piping connected to the bottom of the processing tank; a second discharge piping connected to the bottom of the processing tank and connected to the organic solvent recovery part; a switching valve part, switching between a first state and a second state, the first state being a state in which the liquid from the bottom of the processing tank flows in the first discharge piping, and the second state being a state in which the liquid flows in the second discharge piping; and a control part, causing the switching valve part to select the first state to discharge the first concentration liquid from the bottom of the processing tank, and then causing the switching valve part to select the second state to discharge the second concentration liquid from the bottom of the processing tank.

[0018] The eighth form is a substrate processing device according to the seventh form, which includes a chamber for accommodating the processing tank, the discharge portion further includes a slot valve for switching the opening and closing of the bottom of the processing tank, the upstream end of the first discharge piping is connected to the bottom of the chamber, the flow rate of the liquid flowing out of the bottom of the processing tank is greater than the flow rate of the liquid flowing into the upstream end of the first discharge piping, and the control portion causes the switching valve portion to select the second state after passing through the interruption state of closing the slot valve from the first state.

[0019] The 9th form is a substrate processing device according to the 7th or 8th form, which comprises: a pure water supply part, including a supply piping, the supply piping causes pure water to flow to the processing tank and causes the pure water to be stored in the processing tank; and a solvent vapor supply part, including a spray pipe, the spray pipe sprays the vapor of the organic solvent with higher volatility than the pure water into a space above the processing tank; and the substrate holding part causes the multiple substrates to be raised and lowered between an immersion position inside the processing tank and a position above the processing tank, and the control part causes the pure water supply part to supply the pure water to the processing tank. water, and the substrate holding portion lowers the multiple substrates to the immersion position so that the multiple substrates are immersed in the pure water. In the immersed state of the multiple substrates immersed in the pure water in the processing tank, the vapor of the organic solvent is ejected from the ejection pipe, and a liquid film of the organic solvent is formed on the liquid surface in the processing tank. In the state where the liquid film has been formed, the substrate holding portion is caused to raise the multiple substrates while the switching valve portion is caused to select the first state, so that the liquid in the processing tank flows to the first discharge piping as the first concentration liquid.

[0020] The 10th form is a substrate processing device according to any one of the 1st to 7th forms, which is equipped with a control unit, and the processing tank includes: a main tank, which stores the liquid; and an upflow tank, which receives the liquid overflowing from the upper part of the main tank; the discharge part includes: an upflow pipe, which is arranged in the lower part of the processing tank, and sprays pure water into the processing tank to make the liquid overflow from the main tank; and a discharge piping, including an upstream end connected to the upflow tank, and a downstream end connected to the organic solvent recovery part; the control unit causes the discharge part to spray the pure water from the upflow pipe, so that the second concentration liquid in the liquid in the processing tank flows into the upflow tank, and the second concentration liquid is supplied from the upflow tank to the organic solvent recovery part through the discharge piping.

[0021] [Effects of the Invention]

[0022] According to the first embodiment, the organic solvent recovery unit generates the third concentration liquid from the second concentration liquid having a higher solvent concentration than the first concentration liquid. Therefore, the organic solvent recovery unit can generate the third concentration liquid in a shorter time than when generating the third concentration liquid from the first concentration liquid.

[0023] According to the second embodiment, the substrate can be treated with pure water by immersing it in pure water. Furthermore, by raising the substrate, the main surface of the substrate passes through a liquid film of organic solvent. This allows the organic solvent to adhere to the main surface of the substrate. Since the organic solvent is easily volatile, the substrate can be easily dried. Furthermore, since a liquid film of organic solvent forms on the liquid surface of the treatment tank, the liquid is stored in the treatment tank with a higher concentration of solvent on the upper side. Therefore, after the substrate is treated, the second concentration liquid can be discharged from the treatment tank at an earlier time.

[0024] According to the third aspect, when the pressure in the processing chamber is relatively high, a relatively high pressure is applied to the liquid surface of the processing tank. Therefore, the discharge unit can discharge the second concentration liquid more quickly.

[0025] According to the fourth aspect, the dehydrator can appropriately separate water from the second concentration liquid.

[0026] According to the fifth aspect, water can be separated from the second concentration liquid with relatively low energy. Furthermore, although the lower limit of the applicable range of the separation membrane is relatively high, the discharge section supplies the second concentration liquid having a relatively high solvent concentration to the organic solvent recovery section. Therefore, the separation membrane can appropriately separate water from the second concentration liquid. In other words, a separation membrane capable of separating water with relatively low energy can be appropriately utilized.

[0027] According to the sixth embodiment, the portion of the liquid in the treatment tank above the upstream end of the discharge pipe flows into the discharge pipe. Since the solvent concentration in the upper portion of the liquid is higher, the second concentration liquid can be supplied to the organic solvent recovery unit through the discharge pipe.

[0028] According to the seventh embodiment, the first concentration liquid and the second concentration liquid can be discharged separately from the bottom of the treatment tank. In addition, the solvent concentration of the second concentration liquid can be adjusted by adjusting the discharge amount of the first concentration liquid.

[0029] According to the eighth embodiment, the flow rate of the liquid flowing out of the bottom of the treatment tank is greater than the flow rate of the liquid flowing into the upstream end of the first discharge pipe, so that the liquid accumulates at the bottom of the chamber while the liquid flows into the upstream end of the first discharge pipe. That is, in the first state, the first concentration liquid accumulates at the bottom of the chamber and is discharged through the first discharge pipe. After the first state, the tank valve is closed, so the first concentration liquid accumulated at the bottom of the chamber is discharged through the first discharge pipe. Then, the switching valve unit selects the second state. Therefore, it is possible to suppress the second concentration liquid from mixing with the first concentration liquid accumulated at the bottom of the chamber. That is, the discharge unit can suppress the decrease in the solvent concentration of the second concentration liquid and supply it to the organic solvent recovery unit.

[0030] According to the ninth aspect, since the substrate is lifted up and the first concentration liquid is discharged in parallel, the throughput can be increased.

[0031] According to the tenth embodiment, the second concentration liquid is extracted from the liquid in the main body tank by allowing the second concentration liquid to overflow from the main body tank into the upflow tank, and the discharge unit discharges the second concentration liquid from the upflow tank. Therefore, the solvent concentration of the second concentration liquid can be easily adjusted by adjusting the supply rate of pure water. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a diagram schematically showing an example of the substrate processing apparatus according to the first embodiment.

[0033] Figure 2 This is a diagram schematically showing another example of the second concentration discharge unit.

[0034] Figure 3 This is a flowchart showing an example of processing of a substrate by the processing unit according to the first embodiment.

[0035] Figure 4 This is a diagram showing an example of temporal changes in the status of the processing unit.

[0036] Figure 5 This is a diagram showing an example of temporal changes in the status of the processing unit.

[0037] Figure 6 This is a diagram schematically showing an example of an organic solvent recovery unit.

[0038] Figure 7 This is a diagram schematically showing an example of a substrate processing apparatus according to a first example of the second embodiment.

[0039] Figure 8 This is a flowchart showing an example of the operation of the processing unit in the first example of the second embodiment.

[0040] Figure 9 This is a diagram showing an example of temporal changes in the status of the processing unit.

[0041] Figure 10 This is a diagram showing an example of temporal changes in the state of a processing unit that discharges liquid from a processing tank.

[0042] Figure 11 This is a diagram schematically showing an example of a substrate processing apparatus according to a second example of the second embodiment.

[0043] Figure 12 This is a flowchart showing an operation example of the substrate processing apparatus of the second example.

[0044] Figure 13 This is a diagram showing an example of temporal changes in the state of the processing unit of the second example.

[0045] Figure 14 This is a diagram showing an example of temporal changes in the state of the processing unit of the second example.

[0046] Figure 15 It is a diagram schematically showing a third example of the substrate processing apparatus according to the second embodiment.

[0047] Figure 16 This is a diagram showing an example of the temporal change in the state of the processing unit after the solvent replacement step.

[0048] Figure 17 This is a diagram schematically showing an example of a substrate processing apparatus according to a third embodiment.

[0049] Figure 18 This is a diagram schematically showing an example of temporal changes in the state of the processing unit in the second concentration discharge step of the third embodiment. DETAILED DESCRIPTION

[0050] The following describes the embodiments in detail with reference to the accompanying drawings. In addition, for ease of understanding, the dimensions and numbers of various parts in the accompanying drawings may be exaggerated or simplified as necessary. Parts having the same structure and function are denoted by the same reference numerals, and repeated descriptions are omitted in the following description.

[0051] In the following description, the same components are denoted by the same reference numerals and have the same names and functions, and their detailed descriptions may be omitted to avoid redundancy.

[0052] In the following description, even if ordinal numbers such as "first" or "second" are used, these terms are used only to facilitate understanding of the contents of the implementation method and are not limited to the order in which these ordinal numbers may occur.

[0053] When using expressions that express relative or absolute positional relationships (such as "in a direction", "along a direction", "parallel", "orthogonal", "center", "concentric", "coaxial", etc.), unless otherwise specified, the expression not only strictly expresses the positional relationship, but also expresses the state after relative displacement in terms of angle or distance within a tolerance or a range that can achieve equivalent functions. When using expressions that express equal states (such as "same", "equal", "homogeneous", etc.), unless otherwise specified, the expression not only strictly expresses the equal state quantitatively, but also expresses the state of difference with a tolerance or a range that can achieve equivalent functions. When using expressions that express shape (such as "quadrilateral" or "cylindrical shape", etc.), unless otherwise specified, the expression not only strictly expresses the shape geometrically, but also expresses a shape with, for example, concave-convex or chamfered corners within a range that can achieve equivalent effects. When using expressions such as "equipped with", "equipped with", "equipped with", "including", or "having" a component, the expression is not an exclusive expression that excludes the presence of other components. When an expression such as "at least one of A, B, and C" is used, the expression includes: only A; only B; only C; any two of A, B, and C; and all of A, B, and C.

[0054] <First embodiment>

[0055] <Overview of Substrate Processing Apparatus>

[0056] Figure 1 It is a diagram schematically showing an example of the substrate processing apparatus 100 according to the first embodiment. Figure 1 In the example, the substrate processing apparatus 100 is a so-called batch processing apparatus that processes a plurality of substrates W as processing targets at once. The substrates W as processing targets of the substrate processing apparatus 100 are, for example, semiconductor substrates. The substrates W as processing targets are, for example, disk-shaped.

[0057] like Figure 1 As shown, the substrate processing apparatus 100 includes a processing unit 1 , a discharge unit 4 , an organic solvent recovery unit 5 , and a control unit 6 .

[0058] The processing unit 1 processes a plurality of substrates W using pure water and an organic solvent. Figure 1 As shown, the processing unit 1 includes a processing tank Tk0 and a substrate holder 10. Liquid L1 is stored in the processing tank Tk0. Liquid L1 is a liquid containing water and an organic solvent. The specific gravity of the organic solvent is lower than that of water. Therefore, the liquid L1 stored in the processing tank Tk0 has a concentration distribution in which the solvent concentration is higher on the upper side than on the lower side. The solvent concentration referred to here refers to the concentration of the organic solvent in the liquid L1.

[0059] Figure 1In the example, the upper portion of the liquid L1 stored in the treatment tank Tk0 forms a high-concentration portion L11. The high-concentration portion L11 is a portion of the liquid L1 where the solvent concentration is relatively high. Hereinafter, the portion of the liquid L1 that is lower than the high-concentration portion L11 is also referred to as the low-concentration portion L12. The low-concentration portion L12 is a portion of the liquid L1 where the solvent concentration is relatively low. In addition, the high-concentration portion L11 may have a concentration distribution showing a tendency for the solvent concentration to become higher on the upper side. The low-concentration portion L12 may be almost entirely water. That is, the solvent concentration of the low-concentration portion L12 may be almost zero and uniform. Alternatively, the low-concentration portion L12 may have a concentration distribution showing a tendency for the solvent concentration to become higher on the upper side.

[0060] As an example, this concentration profile can be formed in the liquid L1 within the processing tank Tk0 through a series of treatments on the substrate W, described below. Alternatively, this concentration profile can be formed by allowing the liquid L1 within the processing tank Tk0, which is a mixture of water and an organic solvent at a more uniform concentration, to stand for a long period of time. This is because the specific gravity of the organic solvent is lower than that of water, so the organic solvent within the processing tank Tk0 rises within the liquid L1 over time.

[0061] The substrate holding portion 10 holds a plurality of substrates W in an upright position. The upright position here refers to a position in which the thickness direction of the substrate W is along the horizontal direction ( Figure 1 In addition, the substrate holding portion 10 holds the plurality of substrates W in a position in which the plurality of substrates W are positioned along the thickness direction ( Figure 1 The substrate holding portion 10 can hold a plurality of substrates W in a state of being immersed in the liquid L1 in the processing tank Tk0.

[0062] The discharge unit 4 discharges the liquid L1 from the treatment tank Tk0. The discharge unit 4 includes a first concentration discharge unit 41 and a second concentration discharge unit 42. The first concentration discharge unit 41 will be described below.

[0063] The second concentration discharge unit 42 discharges the second concentration liquid, having a higher solvent concentration than the first concentration liquid, from the treatment tank Tk0, bypassing at least a portion of the first concentration liquid in liquid L1. The so-called "at least a portion of the first concentration liquid" refers to the liquid in liquid L1 with a lower solvent concentration, specifically the lower portion of liquid L1. In other words, the first concentration liquid primarily comprises the liquid in the low-concentration portion L12. On the other hand, the second concentration liquid primarily comprises the liquid in the high-concentration portion L11. The solvent concentration of the second concentration liquid can be, for example, 50 wt% or greater, 60 wt% or greater, or even 70 wt% or greater.

[0064] Figure 1 In the example of , the second concentration discharge unit 42 includes a second discharge pipe 421 . Figure 1 In the example shown in FIG. 1 , the upstream end (upstream port) of the second discharge pipe 421 is positioned at a height corresponding to the second concentration liquid and is immersed in the liquid L1 within the treatment tank Tk0. For example, the upstream end of the second discharge pipe 421 may be positioned above the vertical center of the treatment tank Tk0. Figure 1 In the example of FIG, the upstream end portion of the second discharge pipe 421 is located near the boundary between the high-concentration portion L11 and the low-concentration portion L12.

[0065] The portion of the liquid L1 in the processing tank Tk0 below the upstream end of the second discharge pipe 421 has difficulty flowing into the second discharge pipe 421. Since the solvent concentration in the lower portion is low, the liquid L1 with a relatively low solvent concentration has difficulty flowing into the second discharge pipe 421. On the other hand, the portion of the liquid L1 in the processing tank Tk0 above or at the same level as the upstream end easily flows into the second discharge pipe 421. Since the solvent concentration in the upper portion is high, the liquid L1 with a relatively high solvent concentration flows into the second discharge pipe 421 as the second concentration liquid. Figure 1 In the example of FIG, the upstream end of the second discharge pipe 421 is connected to the side wall of the treatment tank Tk0 . The downstream end of the second discharge pipe 421 is connected to the organic solvent recovery unit 5 .

[0066] like Figure 1 As shown, a discharge valve 422 is inserted into the second discharge pipe 421. When the control unit 6 opens the discharge valve 422, the upper portion of the liquid L1 (i.e., the second concentration liquid) is discharged through the second discharge pipe 421, and the second concentration liquid is supplied to the organic solvent recovery unit 5 through the second discharge pipe 421. Figure 1 As shown, a liquid feeding unit 423 may be provided in the second discharge pipe 421. The liquid feeding unit 423 is, for example, an ejector, and feeds the second concentrated liquid from the treatment tank Tk0 to the organic solvent recovery unit 5.

[0067] Figure 2 This is a diagram schematically showing another example of the second concentration discharge portion 42 . Figure 2In the example, the upstream end of the second discharge pipe 421 is also set at a height position corresponding to the second concentration liquid. However, the second discharge pipe 421 extends upward from the upstream end and passes through the liquid surface of the liquid L1. In addition, the second discharge pipe 421 bends and extends downward at a position further outside than the treatment tank Tk0. In this second concentration discharge section 42, the liquid L1 can be sucked to the upstream end of the second discharge pipe 421 by activating the liquid supply section 423 with the discharge valve 422 open by the control section 6. Through this suction, the portion of the liquid L1 that is further above the upstream end of the second discharge pipe 421 mainly flows into the second discharge pipe 421. Therefore, the second concentration liquid with a relatively high solvent concentration flows into the second discharge pipe 421. The second concentration liquid is supplied to the organic solvent recovery section 5 through the second discharge pipe 421.

[0068] The organic solvent recovery unit 5 includes a dehydrator 62. The dehydrator 62 separates water from the second concentration liquid discharged from the discharge unit 4 to produce a third concentration liquid having a higher solvent concentration than the second concentration liquid. An example of a specific structure of the organic solvent recovery unit 5 will be described in detail below.

[0069] The control unit 6 controls the various components of the substrate processing apparatus 100. The control unit 6 is comprised of, for example, a conventional computer having electrical circuits. As an example, the control unit 6 includes a CPU (Central Processor Unit) that performs various computations (data processing), a ROM (Read Only Memory) that stores basic programs, etc., a RAM (Random Access Memory) used as a work area when the CPU performs designated processing (data processing), a storage device comprising non-volatile storage devices such as flash memory and a hard disk drive, and a bus interconnecting these components. The storage device or RAM may also store a program that specifies the processing performed by the control unit 6. In this case, for example, the CPU can execute this program, causing the various components of the substrate processing apparatus 100 to be controlled by the control unit 6, thereby executing the processing specified by the program in the substrate processing apparatus 100. In other words, the CPU can execute the program, thereby implementing circuitry within the control unit 6 that executes the processing specified by the program. However, part or all of the control performed by the control unit 6 (part or all of the circuits implemented in the control unit 6) may be executed (implemented) by hardware such as a dedicated logic circuit.

[0070] In this substrate processing apparatus 100, as described above, the discharge unit 4 supplies the second concentration liquid having a relatively high solvent concentration to the organic solvent recovery unit 5. Therefore, compared to the case where the organic solvent recovery unit 5 generates the third concentration liquid from the first concentration liquid, the third concentration liquid can be generated from the second concentration liquid in a shorter time and with less energy.

[0071] Hereinafter, a detailed description will be given of a specific configuration and an example of a specific operation of the treatment unit 1. Next, a detailed description will be given of a specific configuration and an example of a specific operation of the organic solvent recovery unit 5.

[0072] <Detailed example of processing unit>

[0073] Figure 1 In the example shown in FIG. 1 , the substrate holding portion 10 includes a plate portion 11, a plurality of holding rods 12, and a lifting drive portion 13. The plate portion 11 has a plate-like shape, and its thickness direction is along the thickness direction of the substrate W ( Figure 1 The substrate holder 10 is arranged in an upright position (in a direction perpendicular to the paper). Each holding rod 12 extends along the thickness direction of the substrate W, with its base end connected to the plate portion 11. The holding rods 12 are positioned below the substrates W and spaced apart along the circumference of the substrates W. Each holding rod 12 has a plurality of holding grooves (not shown) formed at intervals along the thickness direction of the substrates W, and a portion of the substrate W is inserted into each holding groove. By inserting the substrates W into the holding grooves, the substrate holder 10 holds the substrates W in an upright position.

[0074] The lifting drive unit 13 lifts and lowers the plate 11, the plurality of holding rods 12, and the plurality of substrates W in an integrated manner. The lifting drive unit 13 includes a drive source such as a motor and a power transmission unit that transmits power from the drive source to the plate 11. The power transmission unit is, for example, a ball screw mechanism or a cam mechanism.

[0075] Figure 1 In the example shown, the processing unit 1 includes a chamber 1a forming a processing chamber H1. The interior space of chamber 1a corresponds to processing chamber H1. Chamber 1a includes an openable and closable lid 1b on its top wall. An opening and closing drive unit (e.g., a motor) (not shown) is provided in chamber 1a to open and close lid 1b. When lid 1b is open, the substrate holder 10 raises and lowers multiple substrates W between a position inside processing chamber H1 and a position above processing chamber H1. Figure 1 , a substrate W located inside the processing chamber H1 is shown. As described below, the substrate holder 10 carries a plurality of unprocessed substrates W into the processing chamber H1 and removes a plurality of processed substrates W from the processing chamber H1.

[0076] The processing chamber H1 houses a processing tank Tk0. The substrate holder 10 can also raise and lower multiple substrates W within the processing chamber H1 between an immersion position and a drying position, which will be described later. The immersion position is where the multiple substrates W are immersed in the liquid in the processing tank Tk0. Figure 1The example in FIG shows a substrate W at the immersion position. The drying position is a position where the plurality of substrates W are positioned above the processing tank Tk0. As described below, the processing unit 1 performs a pure water treatment on the substrate W stopped at the immersion position and performs a drying treatment on the substrate W stopped at the drying position.

[0077] Figure 1 In the example of FIG, the processing unit 1 further includes a pure water supply unit 21, a solvent vapor supply unit 22, and an inert gas supply unit 23. The pure water supply unit 21 supplies pure water (ie, deionized water) to the processing tank Tk0, so that the pure water is stored in the processing tank Tk0. Figure 1 In the example shown in FIG. 2 , the pure water supply unit 21 includes a nozzle 211, a supply pipe 212, and a supply valve 213. The nozzle 211 sprays pure water toward the treatment tank Tk0. Figure 1 In the example shown, nozzle 211 is located above treatment tank Tk0 within treatment chamber H1. Nozzle 211 is connected to the downstream end of supply piping 212, whose upstream end is connected to pure water supply source 214. Supply piping 212 is the piping that flows pure water to treatment tank Tk0. Supply valve 213 is inserted into supply piping 212.

[0078] The control unit 6 opens the supply valve 213, and pure water is ejected from the nozzle 211 toward the treatment tank Tk0. As a result, pure water is stored in the treatment tank Tk0. When a sufficient amount of pure water is stored in the treatment tank Tk0, the control unit 6 closes the supply valve 213.

[0079] The solvent vapor supply unit 22 supplies organic solvent vapor to the space above the treatment tank Tk0 in the treatment chamber H1. As described below, the solvent vapor supply unit 22 supplies organic solvent vapor into the treatment chamber H1 while the plurality of substrates W are immersed in the pure water in the treatment tank Tk0. A portion of the organic solvent vapor reaches the liquid surface in the treatment tank Tk0 and condenses there to form a liquid film of the organic solvent. Therefore, the liquid L1 is stored in the treatment tank Tk0 with the aforementioned concentration distribution. In other words, the aforementioned concentration distribution is formed in the liquid L1 in the treatment tank Tk0. The key point is that the organic solvent liquid film corresponds to the high concentration portion L11, and the pure water below the organic solvent liquid film corresponds to the low concentration portion L12.

[0080] Figure 1 In the example of FIG. 1 , the solvent vapor supply unit 22 includes a discharge pipe 221, a supply pipe 222, a supply valve 223, and a solvent vapor generating unit 224. The discharge pipe 221 is provided in the processing chamber H1. Figure 1 In the example of FIG, the organic solvent vapor is disposed above the treatment tank Tk0. The discharge pipe 221 has a discharge port from which the vapor of the organic solvent is discharged. Figure 1In the example, two ejection pipes 221 are provided. The two ejection pipes 221 are arranged in the horizontal direction and are provided on opposite sides of the substrates W. As an example, one of the ejection pipes 221 ejects vapor of the organic solvent toward the other.

[0081] The supply pipe 222 connects the discharge pipe 221 and the solvent vapor generating unit 224. The supply pipe 222 is a pipe for allowing the vapor of the organic solvent to flow into the processing chamber H1. Figure 1 In the example of FIG, the supply pipe 222 branches into two pipes, and the downstream ends of the two pipes are connected to the discharge pipe 221 . The upstream end of the supply pipe 222 is connected to the solvent vapor generating unit 224 .

[0082] The solvent vapor generating unit 224 generates vapor of the organic solvent and causes the vapor to flow into the supply pipe 222. Figure 1 As shown, the solvent vapor generating unit 224 includes a supply tank Tk3. The supply tank Tk3 stores a liquid containing an organic solvent. The solvent vapor generating unit 224 includes a heater (not shown) for heating the organic solvent. The organic solvent is heated by the heater of the solvent vapor generating unit 224 to generate organic solvent vapor, which is then flowed to the supply pipe 222. The solvent vapor generating unit 224 can also flow a carrier gas to the supply pipe 222 together with the organic solvent vapor. The carrier gas can be an inert gas. The inert gas is, for example, a rare gas or nitrogen. The rare gas is, for example, argon or neon.

[0083] The controller 6 opens the supply valve 223, causing the solvent vapor generator 224 to generate organic solvent vapor. This causes the organic solvent vapor to be ejected from the ejection pipe 221. A portion of the organic solvent vapor ejected from the ejection pipe 221 into the processing chamber H1 reaches the surface of the pure water stored in the processing tank Tk0. This vapor cools and condenses as it passes through the pure water, forming a liquid film of the organic solvent on the surface of the pure water.

[0084] Figure 1 In the example shown, supply tank Tk3 is connected to a fresh liquid supply source 227 via a fresh liquid pipe 225. Specifically, the downstream end of fresh liquid pipe 225 is connected to supply tank Tk3, and the upstream end of fresh liquid pipe 225 is connected to fresh liquid supply source 227. Fresh liquid supply source 227 is a source of unused organic solvent (e.g., IPA with a concentration of 99.8 wt% or greater) that has never been supplied to substrate W. A fresh liquid valve 226 is inserted into fresh liquid pipe 225.

[0085] The inert gas supply unit 23 supplies inert gas into the processing chamber H1 . Figure 1 In the example of FIG, the inert gas supply unit 23 includes a discharge pipe 231, a supply pipe 232, a supply valve 2331, and a supply valve 2332. Figure 1In the example, the ejection pipe 221 is also used for the inert gas supply unit 23. That is, the ejection pipe 221 can also eject inert gas. The ejection pipe 231 is provided in the processing chamber H1. Figure 1 In the example shown in FIG, the discharge pipe 231 is provided below the discharge pipe 221 and above the processing tank Tk0. The discharge pipe 231 has a discharge port, and discharges the inert gas into the processing chamber H1 from the discharge port. Figure 1 In the example shown, two discharge pipes 231 are provided. The two discharge pipes 231 are arranged horizontally and positioned on opposite sides of the substrates W. For example, one discharge pipe 231 discharges an inert gas toward the other discharge pipe. As described below, the inert gas can be used to dry the substrates W and adjust the pressure within the processing chamber H1.

[0086] The supply pipe 232 connects the ejection pipe 221 and the ejection pipe 231 to the inert gas supply source 234, respectively. The supply pipe 232 is a pipe that allows the inert gas to flow to the processing chamber H1. The upstream end of the supply pipe 232 is connected to the inert gas supply source 234. The supply pipe 232 branches into two pipes, namely a branch pipe 2321 and a branch pipe 2322. The downstream end of the branch pipe 2321 is connected to the portion between the supply valve 223 and the branch point P1 in the supply pipe 222. The branch pipe 2322 further branches into two pipes, and the downstream ends of these two pipes are connected to the ejection pipe 231. A supply valve 2331 is inserted into the branch pipe 2321, and a supply valve 2332 is inserted into the branch pipe 2322.

[0087] The supply valve 2331 is opened by the control unit 6, and the inert gas is ejected from the ejection pipe 221. In addition, the supply valve 2332 is opened by the control unit 6, and the inert gas is ejected from the ejection pipe 231.

[0088] Figure 1 In the example shown in FIG. 1 , the processing unit 1 further includes a gas exhaust unit 3. The gas exhaust unit 3 draws gas from the processing chamber H1. By drawing gas, the gas exhaust unit 3 can reduce the pressure within the processing chamber H1. The gas exhaust unit 3 includes an exhaust pipe 31 and an aspirator 32. The aspirator 32 is connected to the chamber 1a via the exhaust pipe 31. The aspirator 32 is, for example, a pump (a specific example is a water-sealed vacuum pump). Figure 1 In the example shown in FIG. 5 , the upstream end of the discharge pipe 31 is connected to the bottom of the chamber 1 a .

[0089] The controller 6 activates the aspirator 32, and the gas in the processing chamber H1 is exhausted through the exhaust pipe 31. This may cause the pressure in the processing chamber H1 to decrease.

[0090] When the pressure in processing chamber H1 is reduced and gas exhaust unit 3 stops sucking gas while inert gas supply unit 23 supplies inert gas, the pressure in processing chamber H1 increases. Therefore, gas exhaust unit 3 and inert gas supply unit 23 constitute pressure adjustment unit 30 for adjusting the pressure in processing chamber H1.

[0091] The first concentration discharge unit 41 discharges the first concentration liquid in the treatment tank Tk0 . Figure 1 In the example shown, the first concentration discharge unit 41 includes a tank valve 410, a first discharge pipe 411, and a discharge valve 412. The tank valve 410 is located at the bottom of the processing tank Tk0 and switches the bottom of the processing tank Tk0 open and closed. The upstream end of the first discharge pipe 411 is connected to the bottom of the chamber 1a. Figure 1 In the example shown in FIG. 4 , the upstream end of the first discharge pipe 411 is connected to the bottom of the chamber 1 a at a position vertically facing the slot valve 410 . The discharge valve 412 is inserted into the first discharge pipe 411 .

[0092] After the second concentration liquid is discharged from the second concentration discharge unit 42, the controller 6 opens the tank valve 410 and the discharge valve 412. This causes the first concentration liquid to flow out of the bottom of the treatment tank Tk0 and into the upstream end of the first discharge pipe 411. The first concentration liquid is discharged to the outside through the first discharge pipe 411.

[0093] In addition, although Figure 1 Different, but the upstream portion of the first discharge pipe 411 and the upstream portion of the discharge pipe 31 can also be common. For example, the suction device 32 can also be inserted into Figure 1 The first discharge pipe 411 (see also Figure 15 In this case, the first exhaust pipe 411 also functions as the exhaust pipe 31 for the exhaust gas. A gas-liquid separator may be provided in the first exhaust pipe 411 on the downstream side of the aspirator 32. The gas from the processing chamber H1 and the first concentration liquid from the processing tank Tk0 flowing into the first exhaust pipe 411 are transported downstream through the aspirator 32 and flow into the gas-liquid separator. The gas-liquid separator separates the gas and the first concentration liquid, and each is discharged to the outside through different exhaust pipes.

[0094] <Operation Example of Processing Unit 1>

[0095] Figure 3 1 is a flowchart showing an example of processing of a substrate W by the processing unit 1 according to the first embodiment. This processing is executed by the control unit 6 controlling various components of the substrate processing apparatus 100 . Figure 4 and Figure 5 1 is a diagram showing an example of the temporal change of the status of the processing unit 1 . Figure 4 and Figure 5In FIG, the valve is painted black to indicate that the valve is open. Here, first, the control unit 6 causes the inert gas supply unit 23 to eject the inert gas from the ejection pipe 221 .

[0096] First, the processing unit 1 performs pure water processing on a plurality of substrates W (step S1: pure water process). Specifically, the control unit 6 causes the pure water supply unit 21 to supply pure water to the processing tank Tk0, and causes the substrate holding unit 10 to lower the plurality of substrates W to the immersion position so that the plurality of substrates W are immersed in pure water. For example, first, the control unit 6 opens the supply valve 213 to store pure water in the processing tank Tk0. Then, the control unit 6 opens the cover 1b and causes the substrate holding unit 10 to lower the plurality of substrates W from a position above the processing chamber H1 to the immersion position. Thus, as Figure 4 As shown in the first figure from the left, a plurality of substrates W are immersed in pure water in the processing tank Tk0. Then, the control unit 6 closes the lid 1b.

[0097] Here, it is assumed that chemical liquid or particles adhere to the main surface of each substrate W due to pretreatment. When multiple substrates W are immersed in pure water, the chemical liquid or particles adhered to the substrates W migrate within the pure water over time. As a result, the chemical liquid or particles are gradually removed from the substrates W.

[0098] In addition, as an example, the control unit 6 causes the gas exhaust unit 3 to exhaust the gas in the processing chamber H1. Specifically, the control unit 6 activates the aspirator 32. As a result, the gas in the processing chamber H1 is supplied to the aspirator 32.

[0099] The processing unit 1 immerses the substrate W until the chemical liquid or particles are fully removed from the substrate W, that is, until the pure water treatment is fully completed. For example, the control unit 6 may determine that the chemical liquid or particles have been fully removed from the substrate W when the time elapsed since the substrate W arrived at the immersion position exceeds a specified pure water reference time. The pure water reference time is set to a value greater than the time required to fully remove the chemical liquid or particles from the substrate W, for example, to approximately 30 to 60 seconds.

[0100] After the pure water treatment is complete, the processing unit 1 uses the following process to change the state of the main surface of the substrate W from being immersed in pure water to a state where the organic solvent adheres to the main surface (step S2: solvent replacement process). Here, the organic solvent has a higher volatility than pure water. The organic solvent may also have a lower surface tension than pure water. An example of the organic solvent is IPA.

[0101] First, the control unit 6 controls the solvent vapor supply unit 22 to supply the vapor of the organic solvent into the processing chamber H1 while the plurality of substrates W are immersed in the pure water in the processing tank Tk0. Figure 4As shown in the second figure from the left, the control unit 6 opens the supply valve 223 and activates the solvent vapor generating unit 224. As a result, the vapor of the organic solvent is ejected from the ejection pipe 221 into the processing chamber H1. The vapor moves downward due to the suction of the aspirator 32. A portion of the organic solvent vapor reaches the liquid surface of the pure water in the processing tank Tk0 and condenses there. As a result, a liquid film of the organic solvent is formed at the liquid surface of the pure water in the processing tank Tk0. In other words, the processing tank Tk0 stores a liquid L1 containing water and an organic solvent, and a high concentration portion L11 and a low concentration portion L12 are formed in the liquid L1.

[0102] Then, if Figure 4 As shown in the third figure from the left, the control unit 6 temporarily stops the gas exhaust unit 3 from sucking the gas in the processing chamber H1. In other words, the control unit 6 stops the aspirator 32.

[0103] When a liquid film of the organic solvent (e.g., the high-concentration portion L11) has formed to a sufficient thickness, the control unit 6 causes the substrate holder 10 to raise the plurality of substrates W to the drying position. Specifically, the control unit 6 may cause the substrate holder 10 to raise the plurality of substrates W when the time elapsed from the start of supplying the organic solvent vapor reaches or exceeds a specified film reference time. The film reference time is set to a value greater than the time required to form a liquid film of the organic solvent to a sufficient thickness, for example, to approximately 5 to 10 seconds.

[0104] As the substrates W rise, multiple substrates W pass through the high concentration area L11. This passage causes the organic solvent to adhere to the main surface of the substrates W. Therefore, after the multiple substrates W rise to the drying position, the organic solvent adheres to most of the main surface of each substrate W. However, there are cases where pure water remains on the main surface of the substrate W immediately after reaching the drying position. In this case, Figure 4 As shown in the fourth figure from the left, the processing unit 1 can keep the substrate W in the drying position during the specified replacement time. Figure 4 In the example shown, the discharge pipe 221 continuously discharges organic solvent vapor toward the substrates W. A portion of the organic solvent vapor within the processing chamber H1 condenses on the main surfaces of the substrates W, replacing the organic solvent with residual pure water, which then flows down from the substrates W. Furthermore, the replacement time is set to be longer than the time required to fully replace the pure water with the organic solvent, for example, approximately 10 to 50 seconds. Because the volatility of the organic solvent is higher than that of water, the drying of the substrates W, described later, can be performed quickly.

[0105] When the pure water on the main surface of the substrate W is fully replaced with the organic solvent, the processing unit 1 dries the plurality of substrates W (step S3: drying process). Specifically, the control unit 6 causes the solvent vapor supply unit 22 to stop supplying the organic solvent vapor, causes the inert gas supply unit 23 to supply the inert gas, and causes the gas exhaust unit 3 to absorb the gas in the processing chamber H1. For example, Figure 5 As shown in the first figure from the left, the control unit 6 closes the supply valve 223 and opens the supply valve 2331. As a result, the inert gas is ejected from the ejection pipe 221 into the processing chamber H1. Figure 5 In the example shown, the discharge pipe 221 is aligned horizontally with the substrate W at the stop position, and discharges the inert gas toward the substrate W. The inert gas supply unit 23 can supply a high-temperature inert gas. For example, a heater can be provided in the supply pipe 232 of the inert gas supply unit 23.

[0106] Furthermore, the controller 6 activates the aspirator 32. As a result, the gas within the processing chamber H1 is exhausted through the exhaust pipe 31. The gas exhaust unit 3 adjusts the pressure within the processing chamber H1 to a first pressure value suitable for drying the substrates W. In other words, the processing unit 1 dries multiple substrates W while the pressure within the processing chamber H1 is reduced to the first pressure value. This promotes the evaporation of the organic solvent. In other words, the processing unit 1 can quickly dry the substrates W.

[0107] When the substrate W is sufficiently dried, the processing unit 1 increases the pressure within the processing chamber H1 (step S4: pressure increasing step). For example, the control unit 6 may determine that the substrate W is sufficiently dried when the time elapsed from the start of the inert gas supply reaches or exceeds a predetermined reference drying time. The reference drying time is set to be longer than the time required to dry the substrate W, for example, approximately 40 to 80 seconds.

[0108] The control unit 6 causes the pressure regulating unit 30 to increase the pressure in the processing chamber H1. Specifically, the control unit 6 causes the gas exhaust unit 3 to stop sucking the gas in the processing chamber H1. The control unit 6 may cause the inert gas supply unit 23 to increase the flow rate of the inert gas. For example, Figure 5 As shown in the second figure from the left, the controller 6 also opens the supply valve 2332. This causes inert gas to be supplied into the processing chamber H1 from both the discharge pipe 221 and the discharge pipe 231. The controller 6 causes the inert gas supply unit 23 to supply inert gas so that the pressure within the processing chamber H1 reaches a second pressure value that is greater than the first pressure value. The second pressure value is closer to standard atmospheric pressure than the first pressure value.

[0109] Next, the control unit 6 opens the cover 1b and causes the substrate holding unit 10 to lift the plurality of substrates W to a position above the processing chamber H1 (step S5: unloading process). Figure 5As shown in the third figure from the left, a plurality of processed substrates W are carried out of the processing chamber H1.

[0110] Next, the second concentration liquid discharge unit 42 discharges the second concentration liquid from the treatment tank Tk0 and supplies the second concentration liquid to the organic solvent recovery unit 5 (step S6: second concentration liquid discharge process). That is, the discharge unit 4 discharges the second concentration liquid while the plurality of substrates W are in a non-immersed state at a position above the treatment tank Tk0. Specifically, Figure 5 As shown in the third figure from the left, the control unit 6 opens the discharge valve 422. When a liquid supply unit 423 is provided, the control unit 6 activates the liquid supply unit 423. As a result, the liquid L1 flowing into the upstream end of the second discharge piping 421 in the treatment tank Tk0 is supplied to the organic solvent recovery unit 5 through the second discharge piping 421 as the second concentration liquid. The portion of the liquid L1 that is roughly above the upstream end flows into the upstream end of the second discharge piping 421. In other words, the portion of the liquid L1 that is lower than the upstream end of the second discharge piping 421 hardly flows into the second discharge piping 421, but remains in the treatment tank Tk0. That is, the discharge unit 4 (specifically, the second concentration discharge unit 42) avoids at least a portion of the first concentration liquid in the treatment tank Tk0 and supplies the second concentration liquid to the organic solvent recovery unit 5.

[0111] When the second concentration liquid has been fully discharged, the second concentration discharge unit 42 stops discharging the second concentration liquid. For example, the controller 6 closes the discharge valve 412 when the time elapsed from the time the discharge valve 422 was opened exceeds a specified second discharge reference time. The second discharge reference time is pre-set to be longer than the time required to discharge the second concentration liquid. The controller 6 stops the liquid supply unit 423 as needed. By discharging the second concentration liquid, the treatment tank Tk0 is essentially filled with only the first concentration liquid.

[0112] Next, the first concentration discharge unit 41 discharges the first concentration liquid from the treatment tank Tk0 (step S7: first concentration liquid discharge process). Figure 5 As shown in the fourth figure from the left, the control unit 6 opens the tank valve 410 and the discharge valve 412. As a result, the first concentration liquid flows out of the chamber 1a through the bottom of the processing tank Tk0 (tank valve 410) and flows into the upstream end of the first discharge pipe 411 connected to the bottom of the chamber 1a. The first concentration liquid is discharged to the outside through the first discharge pipe 411. When the first concentration liquid has been fully discharged, the first concentration discharge unit 41 stops discharging the first concentration liquid. For example, the control unit 6 closes the tank valve 410 and the discharge valve 412 when the time elapsed from the time point of opening the tank valve 410 and the discharge valve 412 reaches or exceeds the specified first discharge reference time. The first discharge reference time is set in advance to be longer than the time required to discharge the first concentration liquid.

[0113] As described above, the processing unit 1 is capable of performing pure water treatment on multiple substrates W. Furthermore, in the example described above, the processing unit 1 condenses organic solvent vapor on the surface of the pure water in the processing tank Tk0, thereby forming a liquid film of the organic solvent. Consequently, the liquid L1 in the processing tank Tk0 forms a concentration profile in which the solvent concentration increases toward the upper side. Specifically, while the substrates W are immersed in the pure water in the processing tank Tk0, a high-concentration portion L11 and a low-concentration portion L12 are formed in the liquid L1 in the processing tank Tk0. Therefore, after processing the substrates W, the remaining time required to form the high-concentration portion L11 and the low-concentration portion L12 is substantially unnecessary, allowing the second-concentration liquid to be drained from the processing tank Tk0 much earlier after the processing of the substrates W is completed. Consequently, the draining of the first-concentration liquid can also be completed much earlier. Consequently, the processing unit 1 can process the next batch of multiple substrates W much earlier. This improves the processing throughput of the processing unit 1.

[0114] Furthermore, in the example described above, after the pressure within the processing chamber H1 is increased by the pressure adjustment unit 30 (step S4), the second concentration discharge unit 42 discharges the second concentration liquid from the processing tank Tk0 (step S6). Specifically, the control unit 6 controls the discharge unit 4 to discharge the second concentration liquid from the processing tank Tk0 after the pressure adjustment unit 30 has adjusted the pressure within the processing chamber H1 to the second pressure value. As a result, when the second concentration liquid is discharged, the gas within the processing chamber H1 can exert a relatively high pressure on the liquid level in the processing tank Tk0. Consequently, the second concentration discharge unit 42 can discharge the second concentration liquid more quickly.

[0115] Furthermore, the second concentration discharge unit 42 does not necessarily begin discharging the second concentration liquid from the processing tank Tk0 after the substrate W is unloaded (step S5). The second concentration discharge unit 42 may also begin discharging the second concentration liquid from the processing tank Tk0 before the substrate W is unloaded. As an example, the second concentration discharge unit 42 may begin discharging the second concentration liquid when the pressure within the processing chamber H1 reaches or exceeds a predetermined pressure reference value. For example, the pressure reference value may be pre-set to a value greater than the first pressure value.

[0116] <Organic Solvent Recovery Section 5>

[0117] Next, an example of the organic solvent recovery unit 5 will be described. The organic solvent recovery unit 5 may be provided below the floor where the processing unit 1 is provided. Figure 6 1 is a diagram schematically showing an example of the organic solvent recovery unit 5 . Figure 6In the example shown in FIG, the organic solvent recovery unit 5 includes a recovery tank Tk1, a dehydration circulation unit 60, a purification circulation unit 80, and a liquid feeding pipe 85. The second concentration liquid flows into the recovery tank Tk1 through the second discharge pipe 421. In other words, the second concentration liquid is recovered in the recovery tank Tk1.

[0118] The dehydration circulation unit 60 includes a dehydration circulation pipe 61 and a dehydrator 62. The dehydration circulation pipe 61 is connected to the recovery tank Tk1. The dehydration circulation pipe 61 is a pipe for returning the second concentration liquid from the recovery tank Tk1 to the recovery tank Tk1.

[0119] A dehydration-side liquid-feeding pump 63, a first switching valve 641, and a second switching valve 642 are inserted into the dehydration circulation pipe 61. As an example, the dehydration-side liquid-feeding pump 63 is provided at a position upstream of a dehydrator 62 to be described later, the first switching valve 641 is provided at a position downstream of the dehydrator 62, and the second switching valve 642 is provided at a position upstream of the dehydration-side liquid-feeding pump 63.

[0120] The dehydrator 62 is inserted into the dehydration circulation pipe 61. Therefore, the second concentration liquid flows into the dehydrator 62. The dehydrator 62 separates water from the inflowing second concentration liquid and allows the water to flow to the separation discharge pipe 65. The separated second concentration liquid continues to circulate in the dehydration circulation pipe 61. Through this dehydration, the concentration of the organic solvent (hereinafter referred to as the solvent concentration) of the second concentration liquid immediately after the dehydrator 62 in the dehydration circulation pipe 61 becomes higher than the solvent concentration of the second concentration liquid immediately before the dehydrator 62. The dehydration circulation section 60 circulates the second concentration liquid through the dehydration circulation pipe 61, so the second concentration liquid continues to flow into the dehydrator 62. Therefore, the dehydrator 62 continues to separate water from the second concentration liquid. As a result, the solvent concentration of the circulating second concentration liquid increases over time. Hereinafter, the second concentration liquid whose solvent concentration is increased to above the specified solvent reference value is referred to as the third concentration liquid. The dehydration circulation section 60 generates a third-concentration liquid by circulating the second-concentration liquid.

[0121] The dehydrator 62 may be, for example, a distiller, an atomizing separator, or a membrane separator. Figure 5 In the example, the dehydrator 62 includes a membrane separator 621. The membrane separator 621 includes a first path 621a, a second path 621b, and a separation membrane 621c. The first path 621a is inserted into the dehydration circulation piping 61 and constitutes part of the dehydration circulation path of the dehydration circulation unit 60. Therefore, the second concentration liquid passes through the first path 621a. The separation membrane 621c separates the first path 621a from the second path 621b. The separation membrane 621c is a membrane that allows the passage of water in the second concentration liquid while substantially preventing the passage of the organic solvent. A portion of the water in the second concentration liquid that flows into the first path 621a passes through the separation membrane 621c and flows into the second path 621b.

[0122] The separation membrane 621c can be a zeolite membrane, an organic separation membrane or a CNT (carbon nanotube) separation membrane. The zeolite membrane has a tetrahedral structure (SiO4) 4- and (AlO4) 5- A crystal structure connected to each other. Examples of organic separation membranes are organic membranes such as polyvinyl alcohol, chitosan, and polyimide. Examples of CNT separation membranes are membranes obtained by adding carbon nanotubes to membranes such as polyamide. Alternatively, a two-dimensional material may be used as the material for the separation membrane 621c. A two-dimensional material is a material composed of one layer of atoms, such as molybdenum sulfide (MoS2), or a composite atomic layer compound formed by a pre-periodic transition metal (such as titanium or vanadium) and a light element (carbon or nitrogen). Alternatively, as the material for the separation membrane 621c, MOF (Metal Organic Frameworks) materials or carbon materials (such as graphene or graphene oxide) may also be used. Here, a zeolite membrane is used as the separation membrane 621c.

[0123] The second path 621b is connected to the upstream end of the separation and discharge piping 65. The water separated from the second concentration liquid is discharged to the outside (for example, the wastewater treatment unit of the factory equipment) through the separation and discharge piping 65. A pressure reducing pump for reducing the pressure of the second path 621b can be provided in the separation and discharge piping 65. Figure 5 As shown, a discharge valve 66 is inserted into the separation discharge pipe 65 .

[0124] Figure 5 In the example, a purification tank Tk2 is provided in the organic solvent recovery section 5. The purification tank Tk2 is connected to the recovery tank Tk1 via the first liquid supply pipe 71, and receives the third concentration liquid from the recovery tank Tk1 via the first liquid supply pipe 71. As an example, the downstream end of the first liquid supply pipe 71 is connected to the purification tank Tk2, and the upstream end of the first liquid supply pipe 71 is connected to the dehydration circulation pipe 61. The upstream end of the first liquid supply pipe 71 is connected to the dehydration circulation pipe 61 at a position between the dehydration-side liquid supply pump 63 and the first switching valve 641. A first liquid supply valve 72 is inserted into the first liquid supply pipe 71.

[0125] The purification circulation unit 80 includes a purification circulation pipe 81 and a filter 82. The purification circulation pipe 81 is a circulation pipe for circulating the third concentration liquid. Figure 5 In the example of FIG. 1 , the purification circulation pipe 81 is connected to the purification tank Tk2. The purification circulation pipe 81 is a pipe that returns the third concentration liquid from the purification tank Tk2 to the purification tank Tk2.

[0126] A purification-side liquid-feeding pump 83 and a switching valve 84 are inserted into the purification circulation pipe 81. As an example, the purification-side liquid-feeding pump 83 is provided upstream of the filter 82, and the switching valve 84 is provided downstream of the filter 82.

[0127] Filter 82 is inserted into the purification circulation piping 81. Therefore, the third concentration liquid flows into filter 82. Filter 82 captures foreign matter in the third concentration liquid. Due to this capture, the foreign matter content rate in the third concentration liquid immediately before filter 82 becomes lower than the foreign matter content rate in the third concentration liquid immediately after filter 82. The purification circulation unit 80 circulates the third concentration liquid through the purification circulation piping 81, so the third concentration liquid continuously flows into filter 82. Therefore, filter 82 continuously captures foreign matter from the third concentration liquid. As a result, the foreign matter content rate of the circulating third concentration liquid decreases over time. In other words, the cleanliness of the third concentration liquid improves over time.

[0128] The second liquid supply pipe 85 is a pipe that flows the third concentrated liquid, whose foreign matter content has been reduced by the purification circulation unit 80, to the supply tank Tk3. As an example, the downstream end of the second liquid supply pipe 85 is connected to the supply tank Tk3, and the upstream end of the second liquid supply pipe 85 is connected to the purification circulation pipe 81.

[0129] As described above, the organic solvent recovery unit 5 increases the solvent concentration of the second concentration liquid discharged from the processing unit 1 to produce a third concentration liquid, and then reduces the foreign matter content of the third concentration liquid. The third concentration liquid with a reduced foreign matter content is then reused by the processing unit 1. In other words, the substrate processing apparatus 100 reuses the organic solvent in the second concentration liquid discharged from the processing unit 1. This reduces the amount of organic solvent waste and enables more efficient use of the organic solvent. In other words, the organic solvent recovery unit 5 contributes to liquid conservation.

[0130] Furthermore, in the above example, the dehydrator 62 includes a membrane separator 621. The membrane separator 621 can separate water from the second concentration liquid with low energy.

[0131] <Concentration of Second Concentration Solution>

[0132] The dehydrator 62 may have an applicable range of solvent concentration. The applicable range refers to the applicable range of solvent concentration of the liquid flowing into the dehydrator 62. For example, if a fluid having a solvent concentration below the lower limit of the applicable range flows into the dehydrator 62, the dehydrator 62 may malfunction. For example, the dehydrator 62 may not be able to adequately separate water from the fluid. In the case where the separation membrane 621c is a zeolite membrane, its lower limit may be approximately 50 wt%. For example, if a first concentration liquid having a low solvent concentration flows into the zeolite membrane, the zeolite membrane may be damaged.

[0133] The solvent concentration of the second concentration liquid can be above the lower limit of the applicable range of the separation membrane 621c. Specifically, the upstream end of the discharge pipe 421 can be positioned at a height where the average solvent concentration of the second concentration liquid flowing into the upstream end is above the lower limit. This allows the recovery tank Tk1 to store the second concentration liquid having a solvent concentration above the lower limit. Consequently, the second concentration liquid having a solvent concentration within the applicable range flows into the dehydrator 62.

[0134] Furthermore, the solvent concentration of the second concentration liquid flowing into the second discharge pipe 421 is not necessarily constant over time. For example, if the upstream end of the second discharge pipe 421 is positioned slightly lower, the second concentration liquid with a slightly lower solvent concentration will initially flow in, followed by the second concentration liquid with a higher solvent concentration. The solvent concentration of the second concentration liquid supplied to the organic solvent recovery section 5 can be the solvent concentration obtained when the total amount of liquid L1 flowing into the second discharge pipe 421 is uniform.

[0135] Although the lower limit of the applicable range of separation membrane 621c is relatively high as described above, discharge section 4 supplies the second concentration liquid having a higher solvent concentration to organic solvent recovery section 5. Therefore, separation membrane 621c can appropriately separate water from the second concentration liquid. In other words, separation membrane 621c, which can separate water with relatively low energy, can be appropriately utilized.

[0136] <Second embodiment>

[0137] Figure 7 1 is a diagram schematically showing an example of a substrate processing apparatus 100 according to a first example of the second embodiment. The substrate processing apparatus 100 according to the first example of the second embodiment differs from the first embodiment in the specific configuration of the discharge unit 4 .

[0138] The discharge unit 4 includes a first discharge pipe 411 , a second discharge pipe 421 , and a switching valve unit 43 . Figure 7 In the example shown in FIG. 4 , the first discharge pipe 411 includes the common discharge pipe 400 and the first branch pipe 401, and the second discharge pipe 421 includes the common discharge pipe 400 and the second branch pipe 402. In other words, the common discharge pipe 400 is shared by the first discharge pipe 411 and the second discharge pipe 421. Liquid L1 from the bottom of the treatment tank Tk0 flows into the upstream end of the common discharge pipe 400 (that is, the upstream ends of the first discharge pipe 411 and the second discharge pipe 421). In other words, the first discharge pipe 411 and the second discharge pipe 421 are connected to the bottom of the treatment tank Tk0. Figure 7In the example shown, the upstream end of the common discharge pipe 400 is connected to the bottom of the chamber 1a at a position vertically opposite the tank valve 410. The downstream end of the common discharge pipe 400 is connected to the upstream ends of the first branch pipe 401 and the second branch pipe 402. The downstream end of the first branch pipe 401 is connected to the outside, for example, while the downstream end of the second branch pipe 402 is connected to the organic solvent recovery unit 5 (for example, the recovery tank Tk1).

[0139] The switching valve portion 43 switches between a first state in which the liquid L1 from the processing tank Tk0 flows to the first discharge pipe 411 and a second state in which the liquid L1 from the processing tank Tk0 flows to the second discharge pipe 421 . Figure 7 In the example of FIG, the switching valve unit 43 includes a discharge valve 412 and a discharge valve 422. The discharge valve 412 is inserted into the first branch pipe 401, and the discharge valve 422 is inserted into the second branch pipe 402.

[0140] When the liquid L1 is stored in the treatment tank Tk0, the control unit 6 first causes the switching valve unit 43 to select the first state. Specifically, the control unit 6 closes the discharge valve 422 and opens the tank valve 410 and the discharge valve 412. As a result, the lower part of the liquid L1 in the treatment tank Tk0 (that is, the first concentration liquid) flows out from the tank valve 410 and is discharged to the outside through the first discharge pipe 411. Therefore, the volume of the low concentration part L12 in the treatment tank Tk0 decreases over time. On the other hand, due to this discharge, although the high concentration part L11 in the treatment tank Tk0 decreases over time, the volume of the high concentration part L11 remains almost unchanged. Therefore, the average value of the solvent concentration of the liquid L1 in the treatment tank Tk0 increases over time. Therefore, the average value of the solvent concentration of the liquid L1 in the treatment tank Tk0 will eventually reach or exceed the specified concentration reference value.

[0141] When the solvent concentration (average value) of the liquid L1 in the treatment tank Tk0 reaches or exceeds the concentration reference value, the control unit 6 causes the switching valve unit 43 to select the second state. Specifically, the control unit 6 closes the discharge valve 412 and opens the discharge valve 422. As a result, the second concentration liquid in the treatment tank Tk0 is supplied to the organic solvent recovery unit 5 via the second discharge pipe 421.

[0142] As a condition for switching from the first state to the second state by the switching valve unit 43, a usage time condition can be applied, for example. For example, the control unit 6 can cause the switching valve unit 43 to switch from the first state to the second state when the time elapsed since the start of draining the liquid L1 in the processing tank Tk0 reaches or exceeds a predetermined switching reference time. The switching reference time can be pre-set as the time required for the solvent concentration (average value) of the liquid L1 in the processing tank Tk0 to reach a concentration reference value.

[0143] Alternatively, the switching condition may be based on the storage amount of the liquid L1 within the treatment tank Tk0. The storage amount of the liquid L1 may be detected by a sensor (not shown) (e.g., a liquid level sensor). The control unit 6 may cause the switching valve unit 43 to switch from the first state to the second state when the storage amount detected by the sensor falls below a predetermined storage reference value. The storage reference value may be pre-set as the storage amount at which the solvent concentration (average value) of the liquid L1 within the treatment tank Tk0 reaches the concentration reference value.

[0144] <Operation Example of Processing Unit 1>

[0145] Figure 8 This is a flowchart showing an example of the operation of the processing unit 1 in the first example of the second embodiment. Steps S11 to S15 are respectively the same as steps S1 to S5 in the first embodiment. Figure 8 In the example, after step S15 (discharge process) is completed, the discharge unit 4 first discharges the first concentration liquid from the treatment tank Tk0 (step S16: first concentration liquid discharge process), and then discharges the second concentration liquid from the treatment tank Tk0 (step S17: second concentration liquid discharge process). Figure 9 This is a diagram showing an example of the temporal change of the status of the processing unit 1 in step S16 and step S17.

[0146] First, the switching valve unit 43 selects the first state. Specifically, Figure 9 As shown in the first figure from the left, the controller 6 closes the discharge valve 422 and opens the tank valve 410 and the discharge valve 412. As a result, the lower portion of the liquid L1 in the processing tank Tk0 (i.e., the first concentration liquid) flows out of the tank valve 410 and is discharged to the outside through the first discharge pipe 411.

[0147] By this discharge, the solvent concentration (average value) of the liquid L1 in the treatment tank Tk0 increases over time. When the solvent concentration (average value) of the liquid L1 in the treatment tank Tk0 reaches or exceeds the concentration reference value, the control unit 6 causes the switching valve unit 43 to select the second state (step S17). Specifically, as Figure 9 As shown in the second figure from the left, the controller 6 closes the discharge valve 412 and opens the discharge valve 422. As a result, the second concentration liquid in the treatment tank Tk0 is supplied to the organic solvent recovery unit 5 through the second discharge pipe 421.

[0148] As described above, the discharge unit 4 can discharge the first concentration liquid and the second concentration liquid separately from the bottom of the treatment tank Tk0. Furthermore, the discharge unit 4 supplies the second concentration liquid to the organic solvent recovery unit 5, bypassing the first concentration liquid. Therefore, similar to the first embodiment, the organic solvent recovery unit 5 can produce the third concentration liquid in a shorter time and with lower energy.

[0149] In addition, in the first example of the second embodiment, the liquid L1 remaining in the treatment tank Tk0 after the first concentration liquid is discharged (step S16) is supplied to the organic solvent recovery section 5 as the second concentration liquid (step S17). That is, the solvent concentration of the second concentration liquid depends on the discharge amount of the liquid L1 (first concentration liquid) discharged through the first discharge piping 411. The greater the discharge amount of the first concentration liquid, the higher the solvent concentration of the second concentration liquid. Therefore, by adjusting the time point when the switching valve section 43 switches from the first state to the second state, the solvent concentration of the second concentration liquid can be simply adjusted. For example, replacement and aging of the dehydrator 62 may cause the lower limit value of the applicable range of the dehydrator 62 to change. In this case, the discharge section 4 can also simply supply the second concentration liquid having a solvent concentration above the lower limit value of the applicable range to the organic solvent recovery section 5 by adjusting the switching time point of the switching valve section 43.

[0150] Furthermore, the flow rate of liquid L1 passing through slit valve 410 may sometimes be greater than the flow rate of liquid L1 flowing into the upstream end of common discharge piping 400. In such cases, a portion of liquid L1 flowing out of slit valve 410 accumulates at the bottom of chamber 1a while simultaneously flowing into the upstream end of common discharge piping 400. While the first concentration liquid is accumulating at the bottom of chamber 1a, when switching valve unit 43 switches from the first state to the second state, the second concentration liquid from the bottom of treatment tank Tk0 merges with the first concentration liquid at the bottom of chamber 1a. This merging reduces the solvent concentration of the second concentration liquid.

[0151] Therefore, the switching valve portion 43 can temporarily close the tank valve 410 when switching from the first state to the second state. Figure 10 1 is a diagram showing an example of a change over time in the state of the processing unit 1 that discharges the liquid L1 from the processing tank Tk0. Figure 10 As shown in the first figure from the left, first, the discharge unit 4 discharges the first concentration liquid from the treatment tank Tk0. Specifically, the control unit 6 closes the discharge valve 422 and opens the tank valve 410 and the discharge valve 412. Here, the outflow rate of the liquid L1 from the bottom of the treatment tank Tk0 (tank valve 410) is greater than the inflow rate of the liquid L1 to the upstream end of the first discharge piping 411. For example, the flow path area of ​​the tank valve 410 is greater than the flow path area of ​​the upstream end of the first discharge piping 411. Therefore, as Figure 10As shown in the first figure from the left, the first concentration liquid is accumulated at the bottom of the chamber 1 a and is discharged through the first discharge pipe 411 .

[0152] When the solvent concentration (average value) of the liquid L1 in the treatment tank Tk0 reaches or exceeds the concentration reference value, the control unit 6 causes the switching valve unit 43 to interrupt the discharge from the treatment tank Tk0. Figure 10 As shown in the second figure from the left, the controller 6 closes the tank valve 410. As a result, the second concentration liquid is not discharged from the processing tank Tk0, and the first concentration liquid accumulated at the bottom of the chamber 1a is discharged through the first discharge pipe 411.

[0153] When discharge of the first concentration liquid from chamber 1a is complete, control unit 6 causes switching valve unit 43 to select the second state. For example, control unit 6 may determine that discharge of the first concentration liquid from chamber 1a has been completed when the time elapsed since slot valve 410 was closed exceeds a specified discharge reference time. The discharge reference time is, for example, pre-set to be greater than the time required to discharge the first concentration liquid from chamber 1a.

[0154] like Figure 10 As shown in the third figure from the left, the controller 6 closes the discharge valve 412 and opens the tank valve 410 and the discharge valve 422. As a result, the second concentration liquid in the treatment tank Tk0 is supplied to the organic solvent recovery unit 5 through the tank valve 410 and the second discharge pipe 421.

[0155] As described above, the switching valve unit 43 selects the second state after switching from the first state to the interrupted state in which the tank valve 410 is closed. Therefore, the discharge unit 4 can discharge the second concentration liquid from the bottom of the treatment tank Tk0 while substantially all of the first concentration liquid in the chamber 1a has been discharged. Consequently, the discharge unit 4 can supply the second concentration liquid to the organic solvent recovery unit 5 while suppressing a decrease in the solvent concentration of the second concentration liquid.

[0156] Figure 11 This is a diagram schematically showing an example of a substrate processing apparatus 100 of the second example of the second embodiment. The substrate processing apparatus 100 of the second example is different from the substrate processing apparatus 100 of the first example in the configuration of the processing unit 1. In the second example, the ejection pipe 231 is not provided in the processing unit 1. In addition, in the second example, the downstream end of the supply piping 232 of the inert gas supply section 23 is connected to the supply piping 222 at a position P2 that is further downstream than the supply valve 223 of the solvent vapor supply section 22. The supply valve 233 is inserted into the supply piping 232. In addition, as an example, the ejection direction of the ejection pipe 221 is different from that of the first example. As an example, the ejection direction of the ejection pipe 221 is upward in the vertical direction.

[0157] Figure 12This is a flowchart showing an operation example of the substrate processing apparatus 100 according to the second example. Figure 13 and Figure 14 1 is a diagram showing an example of temporal changes in the state of the processing unit 1 of the second example. Initially, the control unit 6 causes the inert gas supply unit 23 to supply the inert gas.

[0158] The processing unit 1 performs pure water treatment on the plurality of substrates W in the same manner as in step S1 (step S21: pure water process). Specifically, the control unit 6 causes the pure water supply unit 21 to supply pure water to the processing tank Tk0, and causes the substrate holding unit 10 to lower the plurality of substrates W to the immersion position so that the plurality of substrates W are immersed in the pure water. Figure 13 As shown in the first figure from the left, a plurality of substrates W are immersed in pure water in the processing tank Tk0. Then, the control unit 6 closes the lid 1b.

[0159] When the pure water treatment is fully performed, the processing unit 1 changes the state of the main surface of the substrate W from the state of being immersed in pure water to the state of being attached with the organic solvent through the processing described below (step S22: solvent replacement process). First, the control unit 6 causes the solvent vapor supply unit 22 to supply the vapor of the organic solvent into the processing chamber H1. Specifically, as Figure 13 As shown in the second figure from the left, the controller 6 opens the supply valve 223, activating the solvent vapor generator 224. This causes the organic solvent vapor to be ejected from the ejection pipe 221 into the processing chamber H1. For example, the ejection pipe 221 ejects the organic solvent vapor vertically upward.

[0160] Here, the controller 6 activates the aspirator 32. The vapor ejected from the discharge pipe 221 is sucked into the aspirator 32, making a U-shaped U-turn and moving downward within the processing chamber H1. A portion of this vapor reaches the surface of the pure water in the processing tank Tk0 and condenses there. This forms a liquid film of the organic solvent on the surface of the pure water in the processing tank Tk0. In other words, a high-concentration portion L11 and a low-concentration portion L12 are formed within the liquid L1 in the processing tank Tk0.

[0161] When the liquid film has formed a sufficient thickness, the substrate holding portion 10 raises the plurality of substrates W. Specifically, Figure 13 As shown in the third figure from the left, the control unit 6 controls the substrate holder 10 to raise the substrate W. During this raising process, the main surface of the substrate W passes through the liquid film of the organic solvent. As a result, the organic solvent adheres to the main surface of the substrate W. When the substrates W reach the drying position, the substrate holder 10 stops the substrates W at the drying position. The solvent vapor supply unit 22 continues to supply organic solvent vapor into the processing chamber H1 even after the substrates W stop. This replaces the pure water remaining on the main surface of the substrate W with the organic solvent.

[0162] In addition, if Figure 13 As shown in the third figure from the left, the discharge unit 4 discharges liquid L1 from the processing tank Tk0 in parallel with the ascent of the substrate W. Specifically, the switching valve unit 43 selects the first state. That is, the control unit 6 closes the discharge valve 422 and opens the tank valves 410 and 412. As a result, the liquid L1 (here, the first concentration liquid) in the processing tank Tk0 flows down through the tank valve 410 and is discharged through the first discharge pipe 411. This discharge causes the high-concentration portion L11 to descend. In this way, when the ascent of the substrate W and the discharge of liquid L1 proceed in parallel, the substrate W can be pulled out of the liquid L1 more quickly.

[0163] When the solvent concentration (average value) of the liquid L1 in the treatment tank Tk0 reaches or exceeds the concentration reference value, the discharge unit 4 stops discharging the first concentration liquid and discharges the second concentration liquid. In other words, the switching valve unit 43 switches from the first state to the second state. Specifically, Figure 13 As shown in the fourth figure from the left, the controller 6 closes the discharge valve 412 and opens the discharge valve 422. As a result, the liquid L1 (ie, the second concentration liquid) in the treatment tank Tk0 is supplied to the organic solvent recovery unit 5 through the second discharge pipe 421.

[0164] After the pure water on the main surface of the substrate W is fully replaced with the organic solvent, the processing unit 1 dries the plurality of substrates W (step S23: drying process). For example, the solvent vapor supply unit 22 stops supplying the organic solvent vapor, the inert gas supply unit 23 supplies the inert gas to the processing chamber H1, and the gas exhaust unit 3 exhausts the gas in the processing chamber H1. Specifically, Figure 14 As shown in the first figure from the left, the controller 6 closes the supply valve 223, opens the supply valve 233, and activates the aspirator 32. The gas exhaust unit 3 adjusts the pressure within the processing chamber H1 to a first pressure value suitable for drying the substrate W. This allows the processing unit 1 to quickly dry the substrate W.

[0165] When the substrate W is sufficiently dried, the processing unit 1 increases the pressure in the processing chamber H1 (step S24: pressure increasing process). Figure 14 As shown in the second figure from the left, the controller 6 stops the operation of the aspirator 32. The inert gas supply unit 23 continues to supply the inert gas into the processing chamber H1, so the pressure in the processing chamber H1 increases. For example, the inert gas supply unit 23 supplies the inert gas so that the pressure in the processing chamber H1 reaches the second pressure value.

[0166] Next, after the cover 1b is opened, the processing unit 1 causes the substrate holder 10 to lift the plurality of substrates W to a position above the processing chamber H1 (step S25; unloading process: see also Figure 14 (3rd picture from the left in the middle).

[0167] In the second example of the second embodiment, during the process of replacing the pure water on the main surface of the substrate W with an organic solvent (step S22), the first concentration liquid and the second concentration liquid are sequentially discharged from the processing tank Tk0. Therefore, it is no longer necessary to discharge the first and second concentration liquids after drying the substrates W. Consequently, the next batch of multiple substrates W can be loaded into the processing unit 1 (processing chamber H1) at an earlier time. In other words, the processing unit 1 can process substrates W at a higher throughput.

[0168] In addition, in the second example, the first concentration liquid and the second concentration liquid are discharged from the processing tank Tk0 during the process of the substrate W rising to the drying position. At this time, if the pressure in the processing chamber H1 is low, it is ideal to set a liquid delivery part (such as a pump or an injector) in the first discharge pipe 411 and the second discharge pipe 421. Thus, when the pressure in the processing chamber H1 is low, the liquid delivery part can also quickly deliver the first concentration liquid and the second concentration liquid. However, when the liquid delivery part is set in the common discharge pipe 400, there is a risk that the first concentration liquid remaining inside the liquid delivery part will mix with the second concentration liquid. By separately setting the liquid delivery part in the first branch pipe 401 and the second branch pipe 40, this confluence of the first concentration liquid and the second concentration liquid can be avoided. On the other hand, it may lead to an increase in manufacturing costs. The following aims to reduce the number of liquid delivery parts while quickly discharging the second concentration liquid.

[0169] Figure 15 This is a diagram schematically showing a third example of the substrate processing apparatus 100 of the second embodiment. The substrate processing apparatus 100 of the third example is different from the substrate processing apparatus 100 of the second example in two aspects: the exhaust portion 4 and the gas exhaust portion 3. In the third example, the suction device 32 is inserted into the first branch pipe 401. In this configuration, the common exhaust pipe 400 and the first branch pipe 401 function as the first exhaust pipe 411 and the exhaust pipe 31. The suction device 32 is, for example, a water-sealed vacuum pump, and also has the function of transporting the first concentration liquid in the first exhaust pipe 411. In the first branch pipe 401, a gas-liquid separator (not shown) can be inserted at a position further downstream than the suction device 32. The gas-liquid separator separates the first concentration liquid and the gas, and causes them to flow to different exhaust pipes (not shown).

[0170] On the other hand, Figure 15 As shown, the liquid feeding unit may not be provided in the second discharge pipe 421. The organic solvent recovery unit 5 is provided below the bottom of the chamber 1a, and the second concentration liquid in the treatment tank Tk0 flows in the second discharge pipe 421 by its own weight as described below.

[0171] An example of the operation of the processing unit 1 of the third example is Figure 12However, the discharge timing of the second concentration liquid is different from that of the second example. Figure 16 1 is a diagram showing an example of the change over time of the condition of the processing unit 1 after step S22 (solvent replacement process). Figure 16 As shown in the first figure from the left, while the substrate holder 10 raises multiple substrates W to the drying position, the discharge unit 4 discharges the first concentration liquid from the processing tank Tk0. Although the pressure within the processing chamber H1 is sufficiently lower than standard atmospheric pressure, the controller 6 activates the aspirator 32 (liquid delivery unit), enabling faster discharge of the first concentration liquid.

[0172] Then, while the second concentration liquid is stored in the treatment tank Tk0, the discharge unit 4 stops discharging the liquid L1 from the treatment tank Tk0. For example, the discharge unit 4 stops discharging the liquid L1 when the solvent concentration (average value) of the liquid L1 in the treatment tank Tk0 reaches or exceeds a concentration reference value. Specifically, the control unit 6 closes the tank valve 410.

[0173] Then, when the pure water on the main surface of the substrate W has been sufficiently replaced with the organic solvent, the processing unit 1 dries the plurality of substrates W (see Figure 16 (The second figure from the left in the figure). Specifically, with only the second concentration liquid substantially stored in the processing tank Tk0, the processing unit 1 dries the plurality of substrates W. Specifically, the controller 6 closes the supply valve 223, opens the supply valve 233, and activates the aspirator 32. The gas exhaust unit 3 adjusts the pressure in the processing chamber H1 to the first pressure value.

[0174] Then, when the substrate W has been sufficiently dried, the processing unit 1 increases the pressure in the processing chamber H1 (see Figure 16 (The third figure from the left in the figure) Specifically, while processing tank Tk0 essentially holds only the second concentration liquid, processing unit 1 increases the pressure within processing chamber H1. Specifically, controller 6 stops aspirator 32. Consequently, the pressure within processing chamber H1 increases over time.

[0175] Then, when the pressure in the treatment chamber H1 is increased to a predetermined pressure reference value or higher, the discharge unit 4 discharges the second concentration liquid in the treatment tank Tk0 and supplies the second concentration liquid to the organic solvent recovery unit 5 (see FIG. Figure 16 (The fourth figure from the left in the middle image) Specifically, controller 6 opens tank valve 410 and discharge valve 422. Because the pressure within processing chamber H1 is elevated, discharge unit 4 can quickly discharge the second concentration liquid, for example, by its own weight. Furthermore, since aspirator 32 for admitting the first concentration liquid is not provided in second discharge piping 421, mixing of the second concentration liquid and the first concentration liquid can be avoided.

[0176] <Third embodiment>

[0177] Figure 17 1 is a diagram schematically showing an example of a substrate processing apparatus 100 according to a third embodiment. The processing unit 1 according to the third embodiment differs from the first embodiment in the structure of a processing tank Tk0 and the configuration of a discharge unit 4 .

[0178] In the third embodiment, the processing tank Tk0 includes a main tank Tk11 and an upflow tank Tk12. The main tank Tk11 stores liquid. Multiple substrates W held by the substrate holder 10 are immersed in the liquid within the main tank Tk11. The upflow tank Tk12 receives liquid that overflows from the upper portion of the main tank Tk11. The upflow tank Tk12 includes a bottom and sidewalls. The bottom has an annular shape when viewed from above, with its inner periphery connected to the sidewalls of the main tank Tk11 throughout its entire circumference. The sidewalls extend upward from the outer periphery of the bottom.

[0179] The discharge section 4 includes an upflow section 24. The upflow section 24 supplies pure water to the interior of the main tank Tk11, causing the liquid in the main tank Tk11 to overflow from the top. The liquid overflowing from the main tank Tk11 flows into the upflow tank Tk12. The upflow section 24 includes an upflow pipe 241, a supply pipe 242, and a supply valve 243. The upflow pipe 241 is installed at a position immersed in the liquid in the main tank Tk11. Figure 17 In the example of , it is set below the plurality of substrates W located at the immersion position. Figure 17 In the example of FIG, two rising flow pipes 241 are provided. The two rising flow pipes 241 are arranged in the horizontal direction and are provided on opposite sides of each other with respect to the center of the substrate W. The rising flow pipe 241 has a discharge port from which pure water is discharged.

[0180] Supply pipe 242 is a pipe that directs pure water toward upflow pipe 241. Supply pipe 242 branches into two pipes on the downstream side, and the downstream ends of these two pipes are connected to upflow pipe 241. The upstream end of supply pipe 242 is connected to pure water supply source 214. Supply valve 243 is inserted into supply pipe 242.

[0181] With liquid L1 stored in the main tank Tk11, the upflow section 24 supplies pure water into the liquid L1. Specifically, the controller 6 opens the supply valve 243 in the storage state. This causes pure water to be ejected from the upflow pipe 241, causing the liquid L1 in the main tank Tk11 to overflow from the top and be caught by the upflow trough Tk12. Initially, the upper portion of the liquid L1, or the high-concentration portion L11, overflows, and the liquid L1 with a relatively high solvent concentration (i.e., the second-concentration liquid) flows into the upflow trough Tk12.

[0182] The upstream end of the second discharge pipe 421 is connected to the ascending flow tank Tk12. Figure 17 In the example shown in FIG, the upstream end of the second discharge pipe 421 is connected to the bottom of the ascending tank Tk12. The controller 6 opens the discharge valve 422, and the second concentrated liquid in the ascending tank Tk12 is supplied to the organic solvent recovery unit 5 through the second discharge pipe 421.

[0183] <Operation Example of Processing Unit 1>

[0184] An example of the operation of the processing unit 1 of the third embodiment is similar to that of the first embodiment. Figure 2 However, the specific operation of step S6 is different from that of the first embodiment. Figure 18 This is a diagram schematically showing an example of temporal changes in the state of the processing unit 1 in step S6 (second concentration discharge step) of the third embodiment.

[0185] In step S6, Figure 18 As shown in the first figure from the left, the upflow section 24 first supplies pure water into the main tank Tk11. Specifically, the controller 6 opens the supply valve 243. This causes pure water to be ejected from the upflow pipe 241 into the liquid L1, causing the liquid L1 to overflow from the upper portion of the main tank Tk11. The overflowing liquid L1 is caught by the upflow trough Tk12. The overflow initially occurs in the high-concentration portion L11.

[0186] The discharge unit 4 discharges the second concentration liquid in the ascending tank Tk12 and supplies the second concentration liquid to the organic solvent recovery unit 5. Specifically, the control unit 6 opens the discharge valve 422. As a result, the second concentration liquid in the ascending tank Tk12 is supplied to the organic solvent recovery unit 5 through the second discharge pipe 421.

[0187] When the high-concentration portion L11 in the main tank Tk11 almost entirely flows into the ascending tank Tk12, the liquid L1 with a lower solvent concentration begins to flow into the ascending tank Tk12. Therefore, the average solvent concentration of the liquid L1 flowing into the ascending tank Tk12 decreases over time. Therefore, when the solvent concentration (average concentration) of the liquid L1 flowing into the ascending tank Tk12 reaches a specified concentration reference value, the ascending portion 24 stops supplying pure water. Specifically, the control unit 6 closes the supply valve 243. That is, the ascending portion 24 does not allow the first concentration liquid with a relatively low solvent concentration to overflow from the main tank Tk11, but instead stores it in the main tank Tk11. Thus, the discharge portion 4 can supply the second concentration liquid with a concentration above the concentration reference value to the organic solvent recovery portion 5.

[0188] For example, the controller 6 may stop the supply of pure water from the upflow section 24 when the elapsed time from the start of pure water supply reaches a predetermined supply reference time or longer. The supply reference time is set in advance as the time required to discharge the second concentration liquid.

[0189] When the discharge of the second concentration liquid is completed, the discharge unit 4 discharges the first concentration liquid from the main tank Tk11 (step S7: first concentration liquid discharge process). Figure 18 As shown in the second figure from the left, the controller 6 opens the tank valve 410 and the discharge valve 412. As a result, the first concentration liquid in the treatment tank Tk0 is discharged to the outside through the first discharge pipe 411.

[0190] As described above, in the third embodiment, the discharge unit 4 can also avoid at least a portion of the first concentration liquid stored in the treatment tank Tk0 (main tank Tk11) and supply the second concentration liquid to the organic solvent recovery unit 5. Therefore, as in the first embodiment, the organic solvent recovery unit 5 can produce the third concentration liquid in a shorter time and with lower energy.

[0191] Furthermore, in the third embodiment, the substrate processing apparatus 100 causes the second concentration liquid, which has a relatively high concentration, to overflow from the main body tank Tk11 and be supplied to the organic solvent recovery unit 5 via the upflow tank Tk12 and the second discharge pipe 421. In other words, the solvent concentration of the second concentration liquid depends on the amount of liquid L1 overflowing from the main body tank Tk11. In other words, the solvent concentration of the second concentration liquid depends on the amount of pure water supplied by the discharge unit 4. The greater the amount of pure water supplied, the lower the solvent concentration of the second concentration liquid. Therefore, the solvent concentration of the second concentration liquid can be easily adjusted by adjusting the amount of pure water supplied by the discharge unit 4.

[0192] While the substrate processing apparatus 100 has been described in detail above, the description is provided for illustrative purposes only and does not limit the present invention to such embodiments. Furthermore, the various variations described above may be combined and applied to the extent that they do not conflict with each other. Furthermore, it should be understood that numerous variations not illustrated in the examples above may be employed without departing from the scope of the present invention.

[0193] [Explanation of Symbols]

[0194] 10 substrate holding portion

[0195] 100 substrate processing device

[0196] 1a Chamber

[0197] 21 Pure water supply unit

[0198] 212 Supply piping

[0199] 22 Solvent vapor supply unit

[0200] 221 ejection pipe

[0201] 241 Upflow pipe

[0202] 30 Pressure adjustment unit

[0203] 4. Discharge section

[0204] 410 slot valve

[0205] 411 1st discharge pipe

[0206] 421 Discharge pipe, 2nd discharge pipe

[0207] 422 discharge valve

[0208] 43 Switching valve

[0209] 5. Organic solvent recovery department

[0210] 6 Control Unit

[0211] 62 Dehydrator

[0212] 621 membrane separator

[0213] 621c separation membrane

[0214] Tk0 processing tank

[0215] Tk11 main body slot

[0216] Tk12 Upwelling Trough

[0217] W substrate.

Claims

1. A substrate processing apparatus comprising: treatment tanks, storing liquids; a substrate holding portion for holding a plurality of substrates and immersing the plurality of substrates in the liquid in the processing tank; a discharge unit configured to discharge a second concentration liquid having a higher solvent concentration than the first concentration liquid from the treatment tank storing the liquid, avoiding at least a portion of the first concentration liquid in the liquid, wherein the liquid comprises water and an organic solvent having a specific gravity lighter than that of the water and is stored in the treatment tank with a concentration distribution in which the solvent concentration is higher on an upper side than on a lower side; and The organic solvent recovery unit includes a dehydrator that separates water from the second concentration liquid discharged through the discharge unit to produce a third concentration liquid having a higher solvent concentration than the second concentration liquid.

2. The substrate processing apparatus according to claim 1, comprising: a pure water supply unit including a supply pipe for flowing pure water to the treatment tank; a solvent vapor supply unit including a spray pipe configured to spray vapor of the organic solvent having a higher volatility than the pure water toward a space above the treatment tank; and Control Department; The substrate holding portion moves the plurality of substrates up and down between an immersion position in the processing tank and a position above the processing tank. The control unit causing the pure water supply unit to supply the pure water to the treatment tank, and causing the substrate holding unit to lower the plurality of substrates to the immersion position so that the plurality of substrates are immersed in the pure water, The solvent vapor supply unit is caused to eject the vapor from the ejection pipe while the plurality of substrates are immersed in the pure water, thereby forming a liquid film of the organic solvent on the liquid surface of the treatment tank. In a state where the liquid film has been formed, the plurality of substrates are lifted from the immersion position, The discharge unit is caused to discharge the second concentration liquid from the processing tank in a non-immersion state in which the plurality of substrates are positioned above the processing tank.

3. The substrate processing apparatus according to claim 2, further comprising a pressure regulating unit for regulating the pressure in a processing chamber containing the processing tank; The control unit drying the plurality of substrates in a state where the pressure adjustment unit has reduced the pressure in the processing chamber to a first pressure value; The discharge unit is caused to discharge the second concentration liquid from the treatment tank in a state where the pressure adjustment unit adjusts the pressure in the treatment chamber to be higher than the first pressure value.

4. The substrate processing apparatus according to any one of claims 1 to 3, wherein The solvent concentration of the second concentration liquid is equal to or greater than the lower limit of the applicable range of the solvent concentration of the dehydrator.

5. The substrate processing apparatus according to claim 4, wherein The dehydrator includes a membrane separator having a separation membrane that allows water contained in the second concentration liquid to pass therethrough.

6. The substrate processing apparatus according to any one of claims 1 to 3, wherein The discharge portion includes: a discharge pipe having an upstream end and a downstream end, the upstream end being immersed in the liquid in the treatment tank at a height corresponding to the second concentration liquid, and the downstream end being connected to the organic solvent recovery unit; and The discharge valve is inserted into the discharge pipe.

7. The substrate processing apparatus according to claim 1, wherein The discharge portion includes: a first discharge pipe connected to the bottom of the treatment tank; a second discharge pipe communicating with the bottom of the treatment tank and connected to the organic solvent recovery unit; a switching valve portion that switches between a first state in which the liquid from the bottom of the treatment tank flows through the first discharge pipe and a second state in which the liquid flows through the second discharge pipe; and The control unit causes the switching valve unit to select the first state to discharge the first concentration liquid from the bottom of the treatment tank, and then causes the switching valve unit to select the second state to discharge the second concentration liquid from the bottom of the treatment tank.

8. The substrate processing apparatus according to claim 7, A chamber is provided, wherein the chamber houses the processing tank; The discharge unit further includes a tank valve for switching the opening and closing of the bottom of the treatment tank. The upstream end of the first discharge pipe is connected to the bottom of the chamber. The flow rate of the liquid flowing out of the bottom of the treatment tank is greater than the flow rate of the liquid flowing into the upstream end of the first discharge pipe. The control unit causes the switching valve unit to select the second state after passing through an interruption state in which the sump valve is closed from the first state.

9. The substrate processing apparatus according to claim 7 or 8, comprising: a pure water supply unit including a supply pipe configured to allow the pure water to flow to the treatment tank and to store the pure water in the treatment tank; and a solvent vapor supply unit including a spray pipe configured to spray vapor of the organic solvent having a higher volatility than the pure water toward a space above the treatment tank; The substrate holding portion moves the plurality of substrates up and down between an immersion position in the processing tank and a position above the processing tank. The control unit The pure water supply unit supplies the pure water to the treatment tank, and the substrate holding unit lowers the plurality of substrates to the immersion position so that the plurality of substrates are immersed in the pure water. While the plurality of substrates are immersed in the pure water in the treatment tank, the vapor of the organic solvent is ejected from the ejection pipe to form a liquid film of the organic solvent on the liquid surface in the treatment tank. With the liquid film formed, the substrate holding portion is caused to elevate the plurality of substrates while the switching valve portion is caused to select the first state, thereby causing the liquid in the processing tank to flow as the first concentration liquid to the first discharge pipe.

10. The substrate processing apparatus according to any one of claims 1 to 3, Equipped with a control unit, The processing tank comprises: a main body tank for storing the liquid; and an ascending trough for receiving the liquid overflowing from the upper part of the main trough; The discharge portion includes: an ascending flow pipe, disposed at a lower portion of the treatment tank, for spraying pure water into the treatment tank so that the liquid overflows from the main tank; and a discharge pipe including an upstream end connected to the ascending trough and a downstream end connected to the organic solvent recovery section; The control unit causes the discharge unit to The pure water is ejected from the ascending pipe so that the second concentration liquid in the liquid in the treatment tank flows into the ascending tank and is supplied from the ascending tank to the organic solvent recovery unit through the discharge pipe.

Images