Reliability detection method and system based on chip module packaging and medium

Abstract

The invention provides a reliability detection method and system based on chip module packaging and a medium. The method comprises the following steps: querying a basic threshold value by obtaining chip module packaging process detection parameters and design data; combining the real-time influence data with a preset rule to obtain compensation data, and calculating a correction threshold value; obtaining a process capability state and threshold control data through historical data and statistical process control, further calculating a dynamic threshold, and comparing detection parameters to obtain a process state; after all procedures are qualified, evaluating edge states to obtain risk factors and summing the risk factors to obtain a comprehensive risk value, obtaining a final threshold by combining reliability test data and a reference threshold, and determining the reliability state of the module after comparison; therefore, through calculation processing and threshold comparison of the basic threshold, the corrected threshold, the dynamic threshold and the final threshold, the technology for detecting the packaging reliability of the chip module is realized.

Description

Technical Field

[0001] The present application relates to the field of reliability testing technology, and in particular to a reliability testing method, system, and medium based on chip module packaging. Background Art

[0002] With the rapid development of electronic technology, chip modules are increasingly used in various electronic devices. The reliability of chip module packaging is directly related to the performance and service life of electronic devices. In actual applications, chip modules may be affected by various environmental factors such as temperature fluctuations and humidity, leading to packaging problems and, in turn, affecting the normal operation of the chip module.

[0003] At present, traditional chip packaging reliability testing methods mainly include tests of single environmental factors such as temperature cycling tests and humidity tests, which rely on single, static threshold standards. However, there are many dynamic variables in actual production, which leads to significant limitations of traditional methods. On the one hand, the actual use environment is often the result of the combined effects of multiple factors. Single or simple combination tests cannot truly and comprehensively simulate complex actual working conditions, resulting in deviations between test results and actual reliability. On the other hand, existing testing methods are relatively traditional in terms of testing processes and data processing, lacking efficiency and intelligence, making it difficult to quickly and accurately evaluate the reliability of chip module packaging.

[0004] Therefore, there is an urgent need for an innovative, more practical, efficient and intelligent reliability detection method based on chip module packaging. Summary of the Invention

[0005] The purpose of this application is to provide a reliability detection method, system and medium based on chip module packaging, and to realize the technology of chip module packaging reliability detection by calculating and processing the basic threshold, correction threshold, dynamic threshold and final threshold and comparing the thresholds.

[0006] This application also provides a reliability testing method based on chip module packaging, comprising the following steps: Obtain the inspection parameters and corresponding design data of the process in the chip module packaging process, and obtain the basic threshold of the process based on the design data query; Obtain real-time impact data, query the preset floating ratio rule library based on the real-time impact data to obtain real-time environmental compensation data, and calculate the correction threshold based on the process basic threshold; Obtain historical data, obtain process capability data through statistical process control calculations, compare the process capability data with the preset process capability status assessment threshold, and obtain the process capability status and corresponding threshold control data; The dynamic threshold is calculated based on the threshold control data and the correction threshold, and the process status is obtained by comparing the detection parameters with the dynamic threshold; If all process states are qualified, the marginal state of each process detection parameter is obtained, and the risk factor value of each process is obtained according to the preset assignment rules based on the marginal degree. The risk factors of all process parameters are weighted summed to obtain the comprehensive risk value of the chip module; Obtain reliability test data and benchmark threshold data, and obtain the final threshold value after processing the comprehensive risk value and benchmark threshold data; Compare the reliability test data with the final threshold to obtain the reliability status of the chip module.

[0007] Optionally, in the chip module packaging-based reliability detection method described in the present application, obtaining detection parameters and corresponding design data of a process in the chip module packaging process, and obtaining a process basic threshold value based on the design data query, specifically includes: Obtain design data for the chip module packaging process, including material specification data and design specification requirement data; The preset process basic threshold database is queried according to the material specification data and the design specification requirement data to obtain the process basic threshold.

[0008] Optionally, in the chip module packaging-based reliability detection method described in the present application, obtaining real-time impact data, obtaining real-time environmental compensation data by querying a preset floating ratio rule library based on the real-time impact data, and calculating a correction threshold in combination with a process basic threshold, specifically includes: Obtain real-time impact data on the chip module packaging process, including equipment continuous operation time, calibration record data, and temperature and humidity parameters; According to the real-time impact data, the preset floating ratio rule library is queried to obtain real-time environmental compensation data. The correction threshold is calculated based on the real-time environmental compensation data and the process basic threshold.

[0009] Optionally, in the chip module packaging-based reliability detection method described in the present application, acquiring historical data, obtaining process capability data through statistical process control calculations, comparing the process capability data with a preset process capability status assessment threshold, and obtaining the process capability status and corresponding threshold control data specifically include: Obtain historical data on chip module packaging, including historical impact data, historical design data, and historical detection parameters corresponding to the combination of the two; Obtain process capability data through statistical process control calculations based on historical data, real-time impact data, and detection parameters, including process capability index and revised version of process capability index; The preset process capability status assessment threshold includes a first threshold and a second threshold; Comparing the process capability index and the revised version of the process capability index with the first threshold and the second threshold respectively to obtain the process capability status and corresponding threshold control data; If the process capability index is greater than or equal to the first threshold and the revised version of the process capability index is greater than or equal to the second threshold, the process capability state is a process stable state, and the corresponding threshold control data is unchanged data; If the process capability index is less than the first threshold and the revised version of the process capability index is less than the second threshold, the process capability state is a process unstable state, and the corresponding threshold control data is reduced threshold data.

[0010] Optionally, in the chip module packaging-based reliability detection method described in the present application, the dynamic threshold value is calculated based on the threshold control data and the correction threshold value, and the process status is obtained after comparing the detection parameter with the dynamic threshold value, which specifically includes: Obtaining a dynamic threshold value according to the threshold control data and the modified threshold value, and extracting a third threshold value and a fourth threshold value, wherein the third threshold value is greater than the fourth threshold value; After comparing the detection parameters with the dynamic threshold, the process status is obtained, and the process status includes a qualified state or a failed state; If the detection parameter is greater than a third threshold or less than a fourth threshold, the process status is an unqualified state; If the detection parameter is greater than or equal to the fourth threshold and less than or equal to the third threshold, the process status is a qualified status.

[0011] Optionally, in the chip module packaging-based reliability testing method described in the present application, if the status of each process is qualified, then obtaining the marginal status of each process detection parameter, and obtaining the risk factor value of each process according to the marginal degree according to a preset assignment rule, and obtaining the comprehensive risk value of the chip module by weighted summation of the risk factors of all process parameters, specifically including: Obtain the marginal state of the detection parameters of each process. If it is a marginal state, obtain the risk factor of each process according to the preset assignment rules; If it is a non-marginal state, there is no risk factor; The comprehensive risk value of the chip module is obtained by weighted summing up each risk factor.

[0012] Optionally, in the chip module packaging-based reliability detection method described in the present application, obtaining reliability test data and benchmark threshold data, and obtaining a final threshold value after processing the comprehensive risk value and the benchmark threshold data, specifically includes: The final threshold is obtained by multiplying the comprehensive risk value by the benchmark threshold and then adding the benchmark threshold.

[0013] Optionally, in the chip module packaging-based reliability detection method described in the present application, comparing the reliability test data with the final threshold value to obtain the reliability status of the chip module specifically includes: Comparing the reliability test data with the final threshold value to obtain the reliability status of the chip module, including reliability qualified or reliability unqualified; If the reliability test data is greater than or equal to the final threshold, the reliability status is qualified; If the reliability test data is less than the final threshold, the reliability status is unqualified.

[0014] Optionally, in the reliability testing method based on chip module packaging described in the present application, the packaging process includes at least one of chip mounting, wire bonding, plastic encapsulation, and solder ball production, and the corresponding testing parameters include at least one of chip tilt angle, bonding wire tension, percentage of plastic encapsulation void area, and solder ball height range; The reliability test data includes at least one of the number of failure cycles of a thermal cycle test, the failure time of a high temperature and high humidity test, and the functional integrity after a drop test.

[0015] In a second aspect, the present application provides a reliability detection system based on chip module packaging, the system comprising: a memory and a processor, wherein the memory stores a program for a reliability detection method based on chip module packaging, and when the program for the reliability detection method based on chip module packaging is executed by the processor, the following steps are implemented: Obtain the inspection parameters and corresponding design data of the process in the chip module packaging process, and obtain the basic threshold of the process based on the design data query; Obtain real-time impact data, query the preset floating ratio rule library based on the real-time impact data to obtain real-time environmental compensation data, and calculate the correction threshold based on the process basic threshold; Obtain historical data, obtain process capability data through statistical process control calculations, compare the process capability data with the preset process capability status assessment threshold, and obtain the process capability status and corresponding threshold control data; The dynamic threshold is calculated based on the threshold control data and the correction threshold, and the process status is obtained by comparing the detection parameters with the dynamic threshold; If all process states are qualified, the marginal state of each process detection parameter is obtained, and the risk factor value of each process is obtained according to the preset assignment rules based on the marginal degree. The risk factors of all process parameters are weighted summed to obtain the comprehensive risk value of the chip module; Obtain reliability test data and benchmark threshold data, and obtain the final threshold value after processing the comprehensive risk value and benchmark threshold data; Compare the reliability test data with the final threshold to obtain the reliability status of the chip module.

[0016] In a third aspect, the present application also provides a readable storage medium, which stores a reliability detection method program based on chip module packaging. When the reliability detection method program based on chip module packaging is executed by a processor, the steps of the reliability detection method based on chip module packaging as described in any one of the above items are implemented.

[0017] From the above, it can be seen that the reliability detection method, system and medium based on chip module packaging provided by this application. The method obtains the chip module packaging process detection parameters and design data, queries to obtain the basic threshold; combines the real-time impact data and preset rules to obtain compensation data, and calculates the correction threshold; obtains the process capability status and threshold control data through historical data and statistical process control, and then calculates the dynamic threshold, and compares the detection parameters to obtain the process status; after all processes are qualified, evaluates the edge status to obtain the risk factor and sums it to obtain the comprehensive risk value, combines the reliability test data with the benchmark threshold to obtain the final threshold, and determines the module reliability status after comparison; thus, through the calculation and processing of the basic threshold, correction threshold, dynamic threshold and final threshold and threshold comparison, the chip module packaging reliability detection technology is realized.

[0018] Other features and advantages of the present application will be described in the following description, and in part will become apparent from the description, or understood by practicing the present application. The purpose and other advantages of the present application can be realized and obtained by the structures particularly pointed out in the written description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 A flowchart of a reliability detection method based on chip module packaging provided in an embodiment of the present application; Figure 2 A flowchart of obtaining a basic threshold value of a process in a reliability detection method based on chip module packaging provided in an embodiment of the present application; Figure 3 A flowchart of obtaining a correction threshold value for a reliability detection method based on chip module packaging provided in an embodiment of the present application; Figure 4A logic flow chart for obtaining process capability status and corresponding threshold control data of a reliability detection method based on chip module packaging provided in an embodiment of the present application. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work fall within the scope of protection of the present application.

[0022] It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and should not be understood as indicating or implying relative importance.

[0023] Please refer to Figure 1 , Figure 1 This is a flow chart of a reliability testing method based on chip module packaging in some embodiments of the present application. The reliability testing method based on chip module packaging is used in terminal devices, such as computers, mobile phones, etc. The reliability testing method based on chip module packaging includes the following steps: S11. Obtaining detection parameters and corresponding design data of the process in the chip module packaging process, and obtaining a basic threshold value of the process according to the design data query; S12. Acquire real-time impact data, obtain real-time environmental compensation data by querying a preset floating ratio rule library based on the real-time impact data, and calculate a correction threshold value in combination with the process basic threshold value; S13. Acquire historical data, obtain process capability data through statistical process control calculation, compare the process capability data with a preset process capability status assessment threshold, and obtain process capability status and corresponding threshold control data; S14. Calculate a dynamic threshold value based on the threshold control data and the modified threshold value, and compare the detection parameter with the dynamic threshold value to obtain the process status; S15. If all process states are qualified, obtain the marginal state of each process detection parameter, and obtain the risk factor value of each process according to the preset assignment rule based on the marginal degree. The risk factors of all process parameters are weighted summed to obtain the comprehensive risk value of the chip module; S16. Obtain reliability test data and benchmark threshold data, and obtain a final threshold value after processing the comprehensive risk value and the benchmark threshold data; S17. Compare the reliability test data with the final threshold value to obtain the reliability status of the chip module.

[0024] It should be noted that there are multiple processes in the chip packaging process. According to different requirements for the chip, each process will have different design data, including the use of different materials and different specifications and parameters. According to the required design data, the basic process threshold corresponding to the process can be queried; there will be different influencing data in the chip module packaging process, including the continuous operation time of the equipment, calibration record data and temperature and humidity parameters. The impact of the influencing data on the chip module has a certain regularity. According to the historical influencing data, a floating proportion rule library can be trained to obtain real-time environmental compensation data through real-time influencing data, and then the correction threshold can be obtained to realize dynamic threshold management; after obtaining historical data, the process capability data can be obtained through statistical process control calculation. Process capability data is used in statistical process control (SPC) to measure the stability of the production process and meet product quality requirements. The key indicators of capability can help determine whether the process can stably produce products that meet the specifications; compare the process capability data with the preset process capability status assessment threshold to obtain the process capability status and the corresponding threshold control data; the threshold control data can appropriately adjust the correction threshold according to the stability of the production process, and calculate the dynamic threshold based on the threshold control data and the correction threshold, and then obtain the process status through threshold comparison; if the process status is unqualified, it is necessary to issue an early warning and display the unqualified factors. If the status of each process is qualified, the edge status of each process detection parameter is obtained, and the risk factor value is obtained according to the edge degree. The comprehensive risk value of the chip module is calculated by weighted summation; then the reliability data and the benchmark threshold data are obtained, and the final threshold is obtained after combining the comprehensive risk value and the benchmark threshold data. Finally, the reliability status of the chip module is obtained through threshold comparison.

[0025] Please refer to Figure 2 , Figure 2 This is a flow chart of obtaining a process-based threshold value for a reliability testing method based on chip module packaging provided by an embodiment of the present application. According to an embodiment of the present invention, obtaining the test parameters and corresponding design data of the process in the chip module packaging process, and obtaining the process-based threshold value based on the design data query, specifically includes: S21. Obtain design data for the process steps in the chip module packaging process, including material specification data and design specification requirement data; S22. Query a preset process basic threshold database according to the material specification data and the design specification requirement data to obtain a process basic threshold.

[0026] It should be noted that first, the process links in the chip module packaging process are obtained, and the design data of the process is obtained, including the material specification data and design specification requirement data used in the chip module, the material specification data such as different types of silver paste, epoxy molding compound and solder paste; the design specification requirement data such as pad size; in this embodiment, the material specification data is a gold wire diameter of 0.8mil or a gold wire diameter of 1.0mil, and a gold wire with a wire diameter of 0.8mil is used for wire bonding. The tensile strength qualification threshold range may be set to [6gf, 12gf]; if it is switched to a 1.0mil gold wire, the system automatically adjusts the threshold to [8gf, 15gf]; the preset process basic threshold database is obtained by analyzing a large amount of historical data, and the process basic threshold corresponding to the material specification data and the design specification requirement data can be directly queried when the material specification data and the design specification requirement data are determined.

[0027] Please refer to Figure 3 , Figure 3 This is a flowchart of obtaining a correction threshold value for a reliability testing method based on chip module packaging provided by an embodiment of the present application. According to an embodiment of the present invention, obtaining real-time impact data, obtaining real-time environmental compensation data by querying a preset floating ratio rule library based on the real-time impact data, and calculating the correction threshold value in combination with the process basic threshold value specifically includes: S31. Obtain real-time impact data of the chip module packaging process, including equipment continuous operation time, calibration record data, and temperature and humidity parameters; S32, query the preset floating ratio rule library according to the real-time impact data to obtain real-time environmental compensation data, S33. Calculate and obtain a correction threshold value based on the real-time environmental compensation data and the process basic threshold value.

[0028] It should be noted that during the chip module packaging process, differences in production equipment and environmental parameters can lead to deviations in the detection parameters of chip modules produced from the same material. The continuous operation time of the equipment refers to the continuous operation time of the equipment after startup or maintenance, measured in hours. The longer the equipment runs continuously, the greater the probability of a decrease in equipment accuracy, and the greater the decrease in accuracy. The calibration record refers to the deviation calibration after the equipment has run for a period of time. The temperature and humidity parameters refer to temperature and humidity. For example, high temperature affects the fluidity of the molding compound. In this embodiment, after the equipment has run continuously for 8 hours, the basic tensile threshold is adjusted from [8gf, 15gf] to [7.92gf, 14.85gf] (floating at -1%). The preset floating ratio rule base is obtained by analyzing a large amount of historical data and contains real-time environmental compensation data corresponding to the continuous operation time of the equipment, calibration record data, and temperature and humidity parameters. In this embodiment, the preset floating ratio rule base is: , The data can be obtained by querying based on the continuous operation time of the equipment, calibration record data and temperature and humidity parameters; the floating calculation is performed on the process basic threshold according to the real-time environmental compensation data to obtain the corrected threshold; if multiple factors affect at the same time, the final floating ratio needs to be calculated comprehensively, and the calculation method is weighted summation, and a weight is assigned to each factor. In this embodiment, the weight of the continuous operation time of the equipment is 0.3, the weight of the calibration record data is 0.4, and the weight of the temperature and humidity parameters is 0.3.

[0029] According to an embodiment of the present invention, the acquisition of historical data, obtaining process capability data through statistical process control calculations, comparing the process capability data with a preset process capability status assessment threshold, and obtaining the process capability status and corresponding threshold control data specifically includes: Obtain historical data on chip module packaging, including historical impact data, historical design data, and historical detection parameters corresponding to the combination of the two; Obtain process capability data, including process capability index and revised version of process capability index, through statistical process control calculation based on historical data, real-time impact data and detection parameters; The preset process capability status assessment threshold includes a first threshold and a second threshold; Comparing the process capability index and the revised version of the process capability index with the first threshold and the second threshold respectively to obtain the process capability status and corresponding threshold control data; If the process capability index is greater than or equal to the first threshold and the revised version of the process capability index is greater than or equal to the second threshold, the process capability state is a process stable state, and the corresponding threshold control data is unchanged data; If the process capability index is less than the first threshold and the revised version of the process capability index is less than the second threshold, the process capability state is a process unstable state, and the corresponding threshold control data is reduced threshold data.

[0030] It should be noted that historical impact data refers to the historical data of equipment continuous operation time, calibration records, and temperature and humidity parameters. Historical detection parameters refer to the detection parameters detected by chip modules produced under the conditions determined by historical image data and historical design data. Process capability refers to the range of product quality fluctuation that can be achieved under a stable production process (determined by the inherent variation of the process itself). It reflects the "potential capability" of the process and is usually expressed as 6 times the standard deviation (6σ) of the process output. The process capability index is an indicator that measures the degree of match between the inherent variation (6σ) of the process and the specification range (upper specification limit USL - lower specification limit LSL). It only considers the degree of dispersion of the process and does not consider whether the process mean deviates from the specification center. The revised version of the process capability index is an indicator that further considers whether the process mean deviates from the specification center based on the process capability index, which is more in line with actual production. In this embodiment, the first threshold is 1.33 and the second threshold is 1.0. The data remains unchanged at 1, and the data with a reduced threshold is 0.85.

[0031] In this embodiment, a dynamic threshold is calculated based on the threshold control data and the modified threshold, and the process status is obtained after comparing the detection parameters with the dynamic threshold, which specifically includes: Obtaining a dynamic threshold value according to the threshold control data and the modified threshold value, and extracting a third threshold value and a fourth threshold value, wherein the third threshold value is greater than the fourth threshold value; After comparing the detection parameters with the dynamic threshold, the process status is obtained, and the process status includes a qualified state or a failed state; If the detection parameter is greater than a third threshold or less than a fourth threshold, the process status is an unqualified state; If the detection parameter is greater than or equal to the fourth threshold and less than or equal to the third threshold, the process status is a qualified status.

[0032] It should be noted that the dynamic threshold is obtained based on the threshold control data and the correction threshold. The dynamic threshold includes the dynamic threshold specification upper limit and the dynamic threshold specification lower limit; the third threshold is the dynamic threshold specification upper limit, and the fourth threshold is the dynamic threshold specification lower limit; if it is an unqualified state, an early warning is output.

[0033] According to an embodiment of the present invention, if the states of each process are all qualified, the marginal state of each process detection parameter is obtained, and the risk factor value of each process is obtained according to the marginal degree according to the preset assignment rule. The risk factors of all process parameters are weighted summed to obtain the comprehensive risk value of the chip module, which specifically includes: Obtain the marginal state of the detection parameters of each process. If it is a marginal state, obtain the risk factor of each process according to the preset assignment rules; If it is a non-marginal state, there is no risk factor; The comprehensive risk value of the chip module is obtained by weighted summing up each risk factor.

[0034] It should be noted that even if the process detection parameters are "qualified", their "marginal state" or "specific combination" may still hide reliability risks. In this embodiment, the marginal state means that although the parameter value is within the threshold range, the distance from the upper limit / lower limit is ≤ 10% of the threshold interval width, and the threshold interval width is the value of the specification upper limit minus the specification lower limit; the preset assignment rule is obtained through analysis of historical data, and the assignment principle is that the closer the edge, the larger the factor.

[0035] According to an embodiment of the present invention, obtaining the reliability test data and the benchmark threshold data, and obtaining the final threshold value after processing the comprehensive risk value and the benchmark threshold data, specifically includes: The final threshold is obtained by multiplying the comprehensive risk value by the benchmark threshold and then adding the benchmark threshold.

[0036] It should be noted that the calculation formula for the final threshold is: final threshold = benchmark threshold * (1 + comprehensive risk value).

[0037] According to an embodiment of the present invention, comparing the reliability test data with the final threshold to obtain the reliability status of the chip module specifically includes: Comparing the reliability test data with the final threshold value to obtain the reliability status of the chip module, including reliability qualified or reliability unqualified; If the reliability test data is greater than or equal to the final threshold, the reliability status is qualified; If the reliability test data is less than the final threshold, the reliability status is unqualified.

[0038] It should be noted that after obtaining the final threshold, the reliability test data is compared with the final threshold. If the reliability is qualified, the chip module meets the requirements. If the reliability is unqualified, an early warning is output.

[0039] According to an embodiment of the present invention, the packaging process includes at least one of chip mounting, wire bonding, plastic encapsulation, and solder ball production, and the corresponding detection parameters include at least one of chip tilt angle, bonding wire tension, plastic encapsulation void area percentage, and solder ball height range. The reliability test data includes at least one of the number of failure cycles of a thermal cycle test, the failure time of a high temperature and high humidity test, and the functional integrity after a drop test.

[0040] It should be noted that there are multiple chip module packaging processes and multiple reliability test data, all of which can be applied to this embodiment.

[0041] The present invention also discloses a reliability detection system based on chip module packaging, comprising a memory and a processor. The memory stores a reliability detection method program based on chip module packaging. When the reliability detection method program based on chip module packaging is executed by the processor, the following steps are implemented: Obtain the inspection parameters and corresponding design data of the process in the chip module packaging process, and obtain the basic threshold of the process based on the design data query; Obtain real-time impact data, query the preset floating ratio rule library based on the real-time impact data to obtain real-time environmental compensation data, and calculate the correction threshold based on the process basic threshold; Obtain historical data, obtain process capability data through statistical process control calculations, compare the process capability data with the preset process capability status assessment threshold, and obtain the process capability status and corresponding threshold control data; The dynamic threshold is calculated based on the threshold control data and the correction threshold, and the process status is obtained by comparing the detection parameters with the dynamic threshold; If all process states are qualified, the marginal state of each process detection parameter is obtained, and the risk factor value of each process is obtained according to the preset assignment rules based on the marginal degree. The risk factors of all process parameters are weighted summed to obtain the comprehensive risk value of the chip module; Obtain reliability test data and benchmark threshold data, and obtain the final threshold value after processing the comprehensive risk value and benchmark threshold data; Compare the reliability test data with the final threshold to obtain the reliability status of the chip module.

[0042] It should be noted that there are multiple processes in the chip packaging process. According to different requirements for the chip, each process will have different design data, including the use of different materials and different specifications and parameters. According to the required design data, the basic process threshold corresponding to the process can be queried; there will be different influencing data in the chip module packaging process, including the continuous operation time of the equipment, calibration record data and temperature and humidity parameters. The impact of the influencing data on the chip module has a certain regularity. According to the historical influencing data, a floating proportion rule library can be trained to obtain real-time environmental compensation data through real-time influencing data, and then the correction threshold can be obtained to realize dynamic threshold management; after obtaining historical data, the process capability data can be obtained through statistical process control calculation. Process capability data is used in statistical process control (SPC) to measure the stability of the production process and meet product quality requirements. The key indicators of capability can help determine whether the process can stably produce products that meet the specifications; compare the process capability data with the preset process capability status assessment threshold to obtain the process capability status and the corresponding threshold control data; the threshold control data can appropriately adjust the correction threshold according to the stability of the production process, and calculate the dynamic threshold based on the threshold control data and the correction threshold, and then obtain the process status through threshold comparison; if the process status is unqualified, it is necessary to issue an early warning and display the unqualified factors. If the status of each process is qualified, the edge status of each process detection parameter is obtained, and the risk factor value is obtained according to the edge degree. The comprehensive risk value of the chip module is calculated by weighted summation; then the reliability data and the benchmark threshold data are obtained, and the final threshold is obtained after combining the comprehensive risk value and the benchmark threshold data. Finally, the reliability status of the chip module is obtained through threshold comparison.

[0043] According to an embodiment of the present invention, obtaining detection parameters and corresponding design data of a process in a chip module packaging process, and obtaining a basic threshold value of the process based on the design data query, specifically includes: Obtain design data for the chip module packaging process, including material specification data and design specification requirement data; The preset process basic threshold database is queried according to the material specification data and the design specification requirement data to obtain the process basic threshold.

[0044] It should be noted that first, the process links in the chip module packaging process are obtained, and the design data of the process is obtained, including the material specification data and design specification requirement data used in the chip module, the material specification data such as different types of silver paste, epoxy molding compound and solder paste; the design specification requirement data such as pad size; in this embodiment, the material specification data is a gold wire diameter of 0.8mil or a gold wire diameter of 1.0mil, and a gold wire with a wire diameter of 0.8mil is used for wire bonding. The tensile strength qualification threshold range may be set to [6gf, 12gf]; if it is switched to a 1.0mil gold wire, the system automatically adjusts the threshold to [8gf, 15gf]; the preset process basic threshold database is obtained by analyzing a large amount of historical data, and the process basic threshold corresponding to the material specification data and the design specification requirement data can be directly queried when the material specification data and the design specification requirement data are determined.

[0045] According to an embodiment of the present invention, the real-time impact data is obtained, and the real-time environmental compensation data is obtained by querying a preset floating ratio rule library based on the real-time impact data, and the correction threshold is obtained by combining the process basic threshold. Specifically, the following steps are performed: Obtain real-time impact data on the chip module packaging process, including equipment continuous operation time, calibration record data, and temperature and humidity parameters; According to the real-time impact data, the preset floating ratio rule library is queried to obtain real-time environmental compensation data. The correction threshold is calculated based on the real-time environmental compensation data and the process basic threshold.

[0046] It should be noted that during the chip module packaging process, differences in production equipment and environmental parameters can lead to deviations in the detection parameters of chip modules produced from the same material. The continuous operation time of the equipment refers to the continuous operation time of the equipment after startup or maintenance, measured in hours. The longer the equipment runs continuously, the greater the probability of a decrease in equipment accuracy, and the greater the decrease in accuracy. The calibration record refers to the deviation calibration after the equipment has run for a period of time. The temperature and humidity parameters refer to temperature and humidity. For example, high temperature affects the fluidity of the molding compound. In this embodiment, after the equipment has run continuously for 8 hours, the basic tensile threshold is adjusted from [8gf, 15gf] to [7.92gf, 14.85gf] (floating at -1%). The preset floating ratio rule base is obtained by analyzing a large amount of historical data and contains real-time environmental compensation data corresponding to the continuous operation time of the equipment, calibration record data, and temperature and humidity parameters. In this embodiment, the preset floating ratio rule base is: , The data can be obtained by querying based on the continuous operation time of the equipment, calibration record data and temperature and humidity parameters; the floating calculation is performed on the process basic threshold according to the real-time environmental compensation data to obtain the corrected threshold; if multiple factors affect at the same time, the final floating ratio needs to be calculated comprehensively, and the calculation method is weighted summation, and a weight is assigned to each factor. In this embodiment, the weight of the continuous operation time of the equipment is 0.3, the weight of the calibration record data is 0.4, and the weight of the temperature and humidity parameters is 0.3.

[0047] According to an embodiment of the present invention, the acquisition of historical data, obtaining process capability data through statistical process control calculations, comparing the process capability data with a preset process capability status assessment threshold, and obtaining the process capability status and corresponding threshold control data specifically includes: Obtain historical data on chip module packaging, including historical impact data, historical design data, and historical detection parameters corresponding to the combination of the two; Obtain process capability data through statistical process control calculations based on historical data, real-time impact data, and detection parameters, including process capability index and revised version of process capability index; The preset process capability status assessment threshold includes a first threshold and a second threshold; Comparing the process capability index and the revised version of the process capability index with the first threshold and the second threshold respectively to obtain the process capability status and corresponding threshold control data; If the process capability index is greater than or equal to the first threshold and the revised version of the process capability index is greater than or equal to the second threshold, the process capability state is a process stable state, and the corresponding threshold control data is unchanged data; If the process capability index is less than the first threshold and the revised version of the process capability index is less than the second threshold, the process capability state is a process unstable state, and the corresponding threshold control data is reduced threshold data.

[0048] It should be noted that historical impact data refers to the historical data of equipment continuous operation time, calibration records, and temperature and humidity parameters. Historical detection parameters refer to the detection parameters detected by chip modules produced under the conditions determined by historical image data and historical design data. Process capability refers to the range of product quality fluctuation that can be achieved under a stable production process (determined by the inherent variation of the process itself). It reflects the "potential capability" of the process and is usually expressed as 6 times the standard deviation (6σ) of the process output. The process capability index is an indicator that measures the degree of match between the inherent variation (6σ) of the process and the specification range (upper specification limit USL - lower specification limit LSL). It only considers the degree of dispersion of the process and does not consider whether the process mean deviates from the specification center. The revised version of the process capability index is an indicator that further considers whether the process mean deviates from the specification center based on the process capability index, which is more in line with actual production. In this embodiment, the first threshold is 1.33 and the second threshold is 1.0. The data remains unchanged at 1, and the data with a reduced threshold is 0.85.

[0049] In this embodiment, a dynamic threshold is calculated based on the threshold control data and the modified threshold, and the process status is obtained after comparing the detection parameters with the dynamic threshold, which specifically includes: Obtaining a dynamic threshold value according to the threshold control data and the modified threshold value, and extracting a third threshold value and a fourth threshold value, wherein the third threshold value is greater than the fourth threshold value; After comparing the detection parameters with the dynamic threshold, the process status is obtained, and the process status includes a qualified state or a failed state; If the detection parameter is greater than a third threshold or less than a fourth threshold, the process status is an unqualified state; If the detection parameter is greater than or equal to the fourth threshold and less than or equal to the third threshold, the process status is a qualified status.

[0050] It should be noted that the dynamic threshold is obtained based on the threshold control data and the correction threshold. The dynamic threshold includes the dynamic threshold specification upper limit and the dynamic threshold specification lower limit; the third threshold is the dynamic threshold specification upper limit, and the fourth threshold is the dynamic threshold specification lower limit; if it is an unqualified state, an early warning is output.

[0051] According to an embodiment of the present invention, if the states of each process are all qualified, the marginal state of each process detection parameter is obtained, and the risk factor value of each process is obtained according to the marginal degree according to the preset assignment rule. The risk factors of all process parameters are weighted summed to obtain the comprehensive risk value of the chip module, which specifically includes: Obtain the marginal state of the detection parameters of each process. If it is a marginal state, obtain the risk factor of each process according to the preset assignment rules; If it is a non-marginal state, there is no risk factor; The comprehensive risk value of the chip module is obtained by weighted summing up each risk factor.

[0052] It should be noted that even if the process detection parameters are "qualified", their "marginal state" or "specific combination" may still hide reliability risks. In this embodiment, the marginal state means that although the parameter value is within the threshold range, the distance from the upper limit / lower limit is ≤ 10% of the threshold interval width, and the threshold interval width is the value of the specification upper limit minus the specification lower limit; the preset assignment rule is obtained through analysis of historical data, and the assignment principle is that the closer the edge, the larger the factor.

[0053] According to an embodiment of the present invention, obtaining the reliability test data and the benchmark threshold data, and obtaining the final threshold value after processing the comprehensive risk value and the benchmark threshold data, specifically includes: The final threshold is obtained by multiplying the comprehensive risk value by the benchmark threshold and then adding the benchmark threshold.

[0054] It should be noted that the calculation formula for the final threshold is: final threshold = benchmark threshold * (1 + comprehensive risk value).

[0055] According to an embodiment of the present invention, comparing the reliability test data with the final threshold to obtain the reliability status of the chip module specifically includes: Comparing the reliability test data with the final threshold value to obtain the reliability status of the chip module, including reliability qualified or reliability unqualified; If the reliability test data is greater than or equal to the final threshold, the reliability status is qualified; If the reliability test data is less than the final threshold, the reliability status is unqualified.

[0056] It should be noted that after obtaining the final threshold, the reliability test data is compared with the final threshold. If the reliability is qualified, the chip module meets the requirements. If the reliability is unqualified, an early warning is output.

[0057] According to an embodiment of the present invention, the packaging process includes at least one of chip mounting, wire bonding, plastic encapsulation, and solder ball production, and the corresponding detection parameters include at least one of chip tilt angle, bonding wire tension, plastic encapsulation void area percentage, and solder ball height range. The reliability test data includes at least one of the number of failure cycles of a thermal cycle test, the failure time of a high temperature and high humidity test, and the functional integrity after a drop test.

[0058] It should be noted that there are multiple chip module packaging processes and multiple reliability test data, all of which can be applied to this embodiment.

[0059] The third aspect of the present invention provides a readable storage medium, which includes a reliability detection method program based on chip module packaging. When the reliability detection method program based on chip module packaging is executed by a processor, the steps of the reliability detection method based on chip module packaging as described in any one of the above items are implemented.

[0060] The present invention discloses a reliability detection method, system and medium based on chip module packaging. The method obtains the detection parameters and design data of the chip module packaging process to query and obtain the basic threshold; combines the real-time impact data and the preset rules to obtain the compensation data and calculates the correction threshold; obtains the process capability status and threshold control data through historical data and statistical process control, and then calculates the dynamic threshold, and compares the detection parameters to obtain the process status; after all processes are qualified, the edge status is evaluated to obtain the risk factor and the sum is obtained to obtain the comprehensive risk value, combines the reliability test data with the benchmark threshold to obtain the final threshold, and determines the module reliability status after comparison; thus, the chip module packaging reliability detection technology is realized by calculating and processing the basic threshold, the correction threshold, the dynamic threshold and the final threshold and comparing the thresholds.

[0061] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is merely a logical function division. In actual implementation, there may be other division methods, such as: multiple units or components can be combined, or can be integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the components shown or discussed can be through some interfaces, and the indirect coupling or communication connection of the devices or units can be electrical, mechanical or other forms.

[0062] The units described above as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units; they may be located in one place or distributed across multiple network units; some or all of the units may be selected according to actual needs to achieve the purpose of the scheme of this embodiment.

[0063] In addition, all functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may be separately used as a unit, or two or more units may be integrated into one unit; the above-mentioned integrated units may be implemented in the form of hardware or in the form of hardware plus software functional units.

[0064] Those skilled in the art will appreciate that all or part of the steps of the above-mentioned method embodiments may be implemented by hardware related to program instructions, and the aforementioned program may be stored in a readable storage medium. When the program is executed, the program executes the steps of the above-mentioned method embodiments. The aforementioned storage medium includes various media that can store program codes, such as mobile storage devices, read-only memories (ROMs), random access memories (RAMs), magnetic disks, or optical disks.

[0065] Alternatively, if the integrated units described above are implemented as software functional modules and sold or used as standalone products, they can also be stored on a readable storage medium. Based on this understanding, the technical solutions of the embodiments of the present invention, or the portion that contributes to the prior art, can be embodied in the form of a software product. This software product, stored on a storage medium, includes instructions for enabling a computer device (such as a personal computer, server, or network device) to execute all or part of the methods described in the various embodiments of the present invention. The aforementioned storage media include various media capable of storing program code, such as removable storage devices, ROM, RAM, magnetic disks, or optical disks.

Claims

1. A reliability detection method based on chip module packaging, characterized in that: include: Obtain the inspection parameters and corresponding design data of the process in the chip module packaging process, and obtain the basic threshold of the process based on the design data query; Obtain real-time impact data, query the preset floating ratio rule library based on the real-time impact data to obtain real-time environmental compensation data, and calculate the correction threshold based on the process basic threshold; Obtain historical data, obtain process capability data through statistical process control calculations, compare the process capability data with the preset process capability status assessment threshold, and obtain the process capability status and corresponding threshold control data; The dynamic threshold is calculated based on the threshold control data and the correction threshold, and the process status is obtained by comparing the detection parameters with the dynamic threshold; If all process states are qualified, the marginal state of each process detection parameter is obtained, and the risk factor value of each process is obtained according to the preset assignment rules based on the marginal degree. The risk factors of all process parameters are weighted summed to obtain the comprehensive risk value of the chip module; Obtain reliability test data and benchmark threshold data, and obtain the final threshold value after processing the comprehensive risk value and benchmark threshold data; Compare the reliability test data with the final threshold to obtain the reliability status of the chip module.

2. The reliability detection method based on chip module packaging according to claim 1, characterized in that: The obtaining of detection parameters and corresponding design data of a process in the chip module packaging process, and obtaining a basic threshold value of the process according to the design data query, specifically includes: Obtain design data for the chip module packaging process, including material specification data and design specification requirement data; The preset process basic threshold database is queried according to the material specification data and the design specification requirement data to obtain the process basic threshold.

3. The reliability detection method based on chip module packaging according to claim 2, characterized in that: The real-time impact data is obtained, and the real-time environmental compensation data is obtained by querying a preset floating ratio rule library based on the real-time impact data, and the correction threshold is obtained by combining the process basic threshold. Specifically, the following steps are performed: Obtain real-time impact data on the chip module packaging process, including equipment continuous operation time, calibration record data, and temperature and humidity parameters; According to the real-time impact data, the preset floating ratio rule library is queried to obtain real-time environmental compensation data. The correction threshold is calculated based on the real-time environmental compensation data and the process basic threshold.

4. The reliability detection method based on chip module packaging according to claim 3 is characterized in that: The process capability data is obtained by statistical process control calculation, and the process capability data is compared with a preset process capability status assessment threshold to obtain the process capability status and corresponding threshold control data, specifically including: Obtain historical data on chip module packaging, including historical impact data, historical design data, and historical detection parameters corresponding to the combination of the two; Obtain process capability data, including process capability index and revised version of process capability index, through statistical process control calculation based on historical data, real-time impact data and detection parameters; The preset process capability status assessment threshold includes a first threshold and a second threshold; Comparing the process capability index and the revised version of the process capability index with the first threshold and the second threshold respectively to obtain the process capability status and corresponding threshold control data; If the process capability index is greater than or equal to the first threshold and the revised version of the process capability index is greater than or equal to the second threshold, the process capability state is a process stable state, and the corresponding threshold control data is unchanged data; If the process capability index is less than the first threshold and the revised version of the process capability index is less than the second threshold, the process capability state is a process unstable state, and the corresponding threshold control data is reduced threshold data.

5. The reliability detection method based on chip module packaging according to claim 4, characterized in that: The dynamic threshold is calculated based on the threshold control data and the correction threshold, and the process status is obtained after comparing the detection parameters with the dynamic threshold, which specifically includes: Obtaining a dynamic threshold value according to the threshold control data and the modified threshold value, and extracting a third threshold value and a fourth threshold value, wherein the third threshold value is greater than the fourth threshold value; After comparing the detection parameters with the dynamic threshold, the process status is obtained, and the process status includes a qualified state or a failed state; If the detection parameter is greater than a third threshold or less than a fourth threshold, the process status is an unqualified state; If the detection parameter is greater than or equal to the fourth threshold and less than or equal to the third threshold, the process status is a qualified status.

6. The reliability detection method based on chip module packaging according to claim 5, characterized in that: If the states of each process are qualified, the marginal state of each process detection parameter is obtained, and the risk factor value of each process is obtained according to the preset assignment rule based on the marginal degree. The risk factors of all process parameters are weighted summed to obtain the comprehensive risk value of the chip module, which specifically includes: Obtain the marginal state of the detection parameters of each process. If it is a marginal state, obtain the risk factor of each process according to the preset assignment rules; If it is a non-marginal state, there is no risk factor; The comprehensive risk value of the chip module is obtained by weighted summing up each risk factor.

7. The reliability detection method based on chip module packaging according to claim 6, characterized in that: The obtaining of reliability test data and benchmark threshold data, and obtaining a final threshold value after processing the comprehensive risk value and the benchmark threshold data, specifically includes: The final threshold is obtained by multiplying the comprehensive risk value by the benchmark threshold and then adding the benchmark threshold.

8. The reliability detection method based on chip module packaging according to claim 7, characterized in that: Comparing the reliability test data with the final threshold to obtain the reliability status of the chip module specifically includes: Comparing the reliability test data with the final threshold value to obtain the reliability status of the chip module, including reliability qualified or reliability unqualified; If the reliability test data is greater than or equal to the final threshold, the reliability status is qualified; If the reliability test data is less than the final threshold, the reliability status is unqualified.

9. The reliability detection method based on chip module packaging according to claim 1, characterized in that: The packaging process includes at least one of chip mounting, wire bonding, plastic encapsulation, and solder ball production, and the corresponding inspection parameters include at least one of chip tilt angle, bond wire tension, plastic encapsulation void area percentage, and solder ball height range. The reliability test data includes at least one of the number of failure cycles of a thermal cycle test, the failure time of a high temperature and high humidity test, and the functional integrity after a drop test.

10. A reliability detection system based on chip module packaging, characterized in that: The device comprises a memory and a processor, wherein the memory comprises a reliability detection method program based on chip module packaging, and when the reliability detection method program based on chip module packaging is executed by the processor, the following steps are implemented: Obtain the inspection parameters and corresponding design data of the process in the chip module packaging process, and obtain the basic threshold of the process based on the design data query; Obtain real-time impact data, query the preset floating ratio rule library based on the real-time impact data to obtain real-time environmental compensation data, and calculate the correction threshold based on the process basic threshold; Obtain historical data, obtain process capability data through statistical process control calculations, compare the process capability data with the preset process capability status assessment threshold, and obtain the process capability status and corresponding threshold control data; The dynamic threshold is calculated based on the threshold control data and the correction threshold, and the process status is obtained by comparing the detection parameters with the dynamic threshold; If all process states are qualified, the marginal state of each process detection parameter is obtained, and the risk factor value of each process is obtained according to the preset assignment rules based on the marginal degree. The risk factors of all process parameters are weighted summed to obtain the comprehensive risk value of the chip module; Obtain reliability test data and benchmark threshold data, and obtain the final threshold value after processing the comprehensive risk value and benchmark threshold data; Compare the reliability test data with the final threshold to obtain the reliability status of the chip module.

11. A computer-readable storage medium, characterized in that The computer-readable storage medium includes a reliability detection method program based on chip module packaging. When the reliability detection method program based on chip module packaging is executed by a processor, the steps of the reliability detection method based on chip module packaging as described in any one of claims 1 to 9 are implemented.

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