Wireless temperature sensor with paper folding structure

Abstract

The invention discloses a wireless temperature sensor with a paper folding structure. The temperature sensor comprises a substrate, a planar inductor, a V-shaped beam, a substrate capacitor polar plate, a capacitor upper polar plate, a spring beam, the paper folding structure and a metal wire. When the temperature rises, thermal expansion of the V-shaped beam is caused, and then the capacitor upper polar plate is driven to move towards the two ends, so that the overlapping area between the capacitor upper polar plate and the substrate capacitor polar plate is increased, the capacitance value of the sensitive capacitor is increased, the resonant frequency of an LC resonant circuit formed by the sensitive capacitor and the planar inductor is reduced, and high-temperature measurement is realized. When the temperature is reduced, the V-shaped beam is contracted, the upper electrode plate of the driving capacitor moves towards the center, the paper folding structure protrudes upwards, the capacitance value of the sensitive capacitor is decreased, the resonant frequency of an LC resonant circuit composed of the sensitive capacitor and the planar inductor is increased, and low-temperature measurement is achieved. The temperature sensor has the advantages of simple structure, sensitive response, wide measuring range, process compatibility and the like.

Description

Technical Field

[0001] The present invention belongs to the technical field of sensors, and in particular relates to a wireless temperature sensor with an origami structure. Background Art

[0002] Temperature sensing technology, a core requirement in fields such as industrial production, logistics and transportation, environmental monitoring, and aerospace engineering, continues to drive innovation in sensing technology. Currently, mainstream temperature sensors utilize three principles: thermistor, thermocouple, and infrared radiation. However, these principles all have significant limitations: thermistor temperature sensors suffer from hysteresis and a limited measurement range; thermocouple temperature sensors face the dual challenges of complex signal conversion and environmental sensitivity; and infrared temperature sensors are constrained by high cost and weak anti-interference capabilities. These technical bottlenecks restrict the performance improvement and application expansion of temperature sensors. With the rapid development of the Internet of Things and smart devices, modern sensors are evolving towards wireless transmission, miniaturization, and multifunctional integration. Consequently, developing new wireless temperature sensors with fast response, wide-area adaptability, and high integration has become a key path to breaking through industry technical barriers. Summary of the Invention

[0003] In view of this, the present invention is aimed at the problems existing in the prior art and provides a wireless temperature sensor with an origami structure to solve the problems currently faced by temperature sensors, such as high power consumption, limited range, complex structure, and susceptibility to environmental influences. When the temperature rises, the V-shaped beam causes thermal expansion, which in turn drives the upper plate of the capacitor to output displacement along the X-axis direction, so that the overlapping area between the upper plate of the capacitor and the substrate capacitor plate increases, while the origami structure does not change. As a result, the capacitance of the third sensitive capacitor does not change, while the capacitance of the first and second sensitive capacitors increases, causing the resonant frequency of the LC resonant circuit composed of the sensitive capacitor and the planar inductor to decrease, thereby achieving high-temperature measurement. When the temperature drops, the V-shaped beam causes contraction, causing the origami structure to convexly deform, increasing the distance between the origami structure and the substrate capacitor plate, resulting in a decrease in the capacitance of the third sensitive capacitor. At the same time, the capacitance of the first and second sensitive capacitors decreases, causing the resonant frequency of the LC resonant circuit composed of the sensitive capacitor and the planar inductor to increase, thereby achieving low-temperature measurement. The resonant frequency is sensed contactlessly through mutual inductance coupling, thereby achieving wireless temperature measurement.

[0004] To achieve the above-mentioned objectives, the technical solution of the present invention is as follows: a wireless temperature sensor with an origami structure, wherein the wireless temperature sensor with an origami structure comprises: a substrate, an origami structure, a planar inductor, a V-shaped beam, a substrate capacitor plate, an upper capacitor plate, a spring beam, and a metal wire. The wireless temperature sensor with an origami structure is placed as a whole on a horizontal substrate.

[0005] As an improvement to the present invention, the V-shaped beam includes a first V-shaped beam, a second V-shaped beam, a first anchoring region of the first V-shaped beam, a second anchoring region of the first V-shaped beam, a first anchoring region of the second V-shaped beam, and a second anchoring region of the second V-shaped beam. The first V-shaped beam includes a first supporting beam of the V-shaped beam, a second supporting beam of the V-shaped beam, and a driving rod of the V-shaped beam; the second V-shaped beam includes a first supporting beam of the V-shaped beam, a second supporting beam of the V-shaped beam, and a driving rod of the V-shaped beam. The first anchoring region of the first V-shaped beam, the second anchoring region of the first V-shaped beam, the first anchoring region of the second V-shaped beam, and the second anchoring region of the second V-shaped beam are all fixed to a substrate.

[0006] As an improvement of the present invention, the capacitor upper plate includes a first capacitor upper plate and a second capacitor upper plate.

[0007] As an improvement of the present invention, the substrate capacitor plate includes a first substrate capacitor plate, a second substrate capacitor plate and a third substrate capacitor plate, wherein the first substrate capacitor plate, the second substrate capacitor plate and the third substrate capacitor plate are all fixed on the substrate.

[0008] As an improvement of the present invention, the spring beam includes a first spring beam and a second spring beam.

[0009] As an improvement of the present invention, the metal wire includes a first metal wire and a second metal wire.

[0010] As an improvement of the present invention, one end of the first support beam of the first V-shaped beam and the second support beam of the first V-shaped beam are respectively connected to one end of the first anchor area of ​​the first V-shaped beam and the second anchor area of ​​the first V-shaped beam, the other end of the first support beam of the first V-shaped beam and the second support beam of the first V-shaped beam are connected to one end of the first V-shaped beam driving rod, the first support beam of the second V-shaped beam and the second support beam of the second V-shaped beam are respectively connected to one end of the first anchor area of ​​the second V-shaped beam and the second anchor area of ​​the second V-shaped beam, the other end of the first support beam of the second V-shaped beam and the second support beam of the second V-shaped beam are connected to one end of the second V-shaped beam driving rod The first V-shaped beam driving rod and the second V-shaped beam driving rod are connected, the other ends of the first capacitor upper plate and the second capacitor upper plate are respectively connected, the centers of the recesses of the first capacitor upper plate and the second capacitor upper plate are respectively connected to one end of the first spring beam and the second spring, the other ends of the first spring beam and the second spring beam are respectively connected to the origami structure, one ends of the first metal wire and the second metal wire are respectively connected to the first substrate capacitor plate and the second substrate capacitor plate, the other ends of the first metal wire and the second metal wire are connected to the planar inductor, and the third substrate capacitor plate is placed under the origami structure.

[0011] As an improvement of the present invention, the method for using the sensor includes the following steps:

[0012] Step S1: When the temperature rises, the first support beam of the first V-shaped beam, the second support beam of the first V-shaped beam, the first support beam of the second V-shaped beam, and the second support beam of the second V-shaped beam are thermally expanded, and the first V-shaped beam driving rod and the second V-shaped beam driving rod are displaced in the negative direction of the X-axis and the positive direction of the X-axis, respectively, so that the overlapping areas of the first capacitor upper plate and the second capacitor upper plate and the first substrate capacitor plate and the second substrate capacitor plate, respectively, are increased, and the origami structure does not change, thereby causing the capacitance of the third sensitive capacitor to remain unchanged and the capacitance of the first and second sensitive capacitors to increase, causing the resonant frequency of the LC resonant circuit composed of the sensitive capacitor and the planar inductor to decrease, thereby achieving high temperature measurement;

[0013] Step S2: When the temperature drops, the first support beam of the first V-shaped beam, the second support beam of the first V-shaped beam, the first support beam of the second V-shaped beam, and the second support beam of the second V-shaped beam are caused to shrink, thereby pushing the first V-shaped beam driving rod and the second V-shaped beam driving rod to output displacement along the positive direction of the X-axis and the negative direction of the X-axis respectively, causing the origami structure to convexly deform, resulting in a decrease in the overlapping area and an increase in the distance between the origami structure and the third substrate capacitor plate, thereby reducing the capacitance of the third sensitive capacitor. At the same time, the overlapping areas of the first capacitor upper plate and the second capacitor upper plate with the first substrate capacitor plate and the second substrate capacitor plate are reduced respectively, thereby reducing the capacitance of the first sensitive capacitor and the second sensitive capacitor, causing the resonant frequency of the resonant circuit to increase, thereby achieving low-temperature measurement.

[0014] Beneficial effects:

[0015] The present invention discloses an origami-structured wireless temperature sensor. When the temperature rises, the V-shaped beam thermally expands, thereby driving the upper plate of the capacitor to output displacement along the X-axis direction, so that the overlapping area between the upper plate of the capacitor and the substrate capacitor plate increases, while the origami structure does not change. As a result, the capacitance of the third sensitive capacitor does not change, while the capacitance of the first and second sensitive capacitors increases. This causes the resonant frequency of the LC resonant circuit composed of the sensitive capacitor and the planar inductor to decrease, thereby achieving high-temperature measurement. When the temperature drops, the V-shaped beam contracts, causing the origami structure to convexly deform. The overlapping area between the origami structure and the substrate capacitor plate decreases, and the distance increases, causing the capacitance of the third sensitive capacitor to decrease. At the same time, the overlapping areas of the first and second capacitor upper plates with the first and second substrate capacitor plates respectively decrease, causing the capacitance of the first and second sensitive capacitors to decrease, causing the resonant frequency to increase, thereby achieving low-temperature measurement. The temperature sensor realizes temperature measurement through the V-beam structure. The structure is simple and the process is compatible. The sensitive capacitor composed of the substrate capacitor plate and the capacitor upper plate is used to achieve high temperature measurement. The substrate capacitor plate and origami structure are used to achieve low-temperature measurement, making the temperature sensor have sensitive response and wide range. Advantage. The wireless temperature measurement is realized by non-contact induction resonant frequency by mutual inductance coupling. The temperature sensor Device Applicable to more scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1This is a schematic structural diagram of an origami-structured wireless temperature sensor provided in the present invention.

[0017] Figure 2 This is an AA′ cross-sectional view of an origami-structured wireless temperature sensor provided in the present invention.

[0018] Figure 3 This is a schematic structural diagram of an origami-structured wireless temperature sensor provided by the present invention at high temperature.

[0019] Figure 4 This is an AA′ cross-sectional view of an origami-structured wireless temperature sensor provided by the present invention at high temperature.

[0020] Figure 5 This is a schematic structural diagram of an origami-structured wireless temperature sensor provided by the present invention at low temperatures.

[0021] Figure 6 This is an AA′ cross-sectional view of an origami-structured wireless temperature sensor provided by the present invention at low temperature.

[0022] In the picture:

[0023] 1. Substrate; 211. First anchor region of the first V-beam; 212. First support beam of the first V-beam; 213. Second support beam of the first V-beam; 214. Second anchor region of the first V-beam; 215. Push rod of the first V-beam; 221. First anchor region of the second V-beam; 222. First support beam of the second V-beam; 223. Second support beam of the second V-beam; 224. Second anchor region of the second V-beam; 225. Push rod of the second V-beam; 311. Upper plate of the first capacitor; 312. First spring beam; 321. Upper plate of the second capacitor; 322. Second spring beam; 4. Origami structure; 51. First substrate capacitor plate; 52. Second substrate capacitor plate; 53. Third substrate capacitor plate; 6. Planar inductor; 71. First metal wire; 72. Second metal wire. DETAILED DESCRIPTION

[0024] In order to deepen the understanding of the present invention, the present embodiment is described in detail below with reference to the accompanying drawings:

[0025] Example 1: See Figure 1-Figure 2 This embodiment provides a wireless temperature sensor with an origami structure, the temperature sensor comprising:

[0026] Substrate 1, planar inductor 6, V-shaped beam, origami structure, substrate capacitor plate, capacitor upper plate, spring beam, metal wire. The planar inductor, metal wire, and substrate capacitor plate are all fixed on the substrate.

[0027] The V-shaped beam includes a first V-shaped beam, a second V-shaped beam, a first anchoring region 211 of the first V-shaped beam, a second anchoring region 214 of the first V-shaped beam, a first anchoring region 221 of the second V-shaped beam, and a second anchoring region 224 of the second V-shaped beam. The first V-shaped beam includes a first supporting beam 212 of the V-shaped beam, a second supporting beam 213 of the V-shaped beam, and a V-shaped beam driving rod 215; the second V-shaped beam includes a first supporting beam 222 of the V-shaped beam, a second supporting beam 223 of the V-shaped beam, and a V-shaped beam driving rod 225. The first anchoring region 211 of the first V-shaped beam, the second anchoring region 214 of the first V-shaped beam, the first anchoring region 221 of the second V-shaped beam, and the second anchoring region 224 of the second V-shaped beam are all fixed on the substrate 1.

[0028] The capacitor upper plate includes a first capacitor upper plate 311 and a second capacitor upper plate 321 .

[0029] The spring beam includes a first spring beam 312 and a second spring beam 322 .

[0030] The substrate capacitor plates include a first substrate capacitor plate 51 , a second substrate capacitor plate 52 and a third substrate capacitor plate 53 .

[0031] The metal wires include a first metal wire 71 and a second metal wire 72 .

[0032] One end of the first V-beam first support beam 212 and the second V-beam 213 is connected to one end of the first V-beam first anchoring area 211 and the second V-beam 214 respectively, the other end of the first V-beam first support beam 212 and the second V-beam 213 is connected to one end of the first V-beam driving rod 215, one end of the second V-beam first support beam 212 and the second V-beam 213 is connected to one end of the second V-beam first anchoring area 211 and the second V-beam 214 respectively, the other end of the second V-beam first support beam 222 and the second V-beam 223 is connected to one end of the second V-beam driving rod (225), the first V-beam The other ends of the beam driving rod 215 and the second V-shaped beam driving rod 225 are respectively connected to the first capacitor upper plate 311 and the second capacitor upper plate 321. The centers of the notches of the first capacitor upper plate 311 and the second capacitor upper plate 321 are respectively connected to one ends of the first spring beam 312 and the second spring beam 322. The other ends of the first spring beam 312 and the second spring beam 322 are respectively connected to the origami structure 4. One ends of the first metal wire 71 and the second metal wire 72 are respectively connected to the first substrate capacitor plate 51 and the second substrate capacitor plate 52. The other ends of the first metal wire 71 and the second metal wire 72 are connected to the planar inductor. The third substrate capacitor plate 53 is placed below the origami structure 4.

[0033] The method for using the wide-range passive wireless temperature sensor with an origami structure described in this embodiment includes the following steps:

[0034] Step S1, see Figure 1-Figure 4 When the temperature rises, the first V-beam first support beam 212, the first V-beam second support beam 213, the second V-beam first support beam 222, and the second V-beam second support beam 223 will expand thermally, and then the first V-beam driving rod 215 and the second V-beam driving rod 225 will be displaced in the negative direction of the X-axis and the positive direction of the X-axis, respectively, so that the overlapping area of ​​the first capacitor upper plate 311 and the second capacitor upper plate 321 with the first substrate capacitor plate 51 and the third substrate capacitor plate 53 will increase respectively, and the origami structure will not change. As a result, the capacitance of the third sensitive capacitor will not change, while the capacitance of the first and second sensitive capacitors will increase, causing the resonant frequency of the LC resonant circuit composed of the capacitor and the planar inductor 6 to decrease, thereby achieving high-temperature measurement.

[0035] Step S2, see Figure 1 、 Figure 2 、 Figure 5 、 Figure 6 When the temperature drops, the first V-beam first support beam 212, the first V-beam second support beam 213, the second V-beam first support beam 222, and the second V-beam second support beam 223 are contracted, thereby pushing the first V-beam driving rod 215 and the second V-beam driving rod 225 to move in the positive direction of the X-axis and the negative direction of the X-axis, respectively, causing the origami structure 4 to convexly deform, resulting in a decrease in the overlapping area and an increase in the distance between the origami structure 4 and the second substrate capacitor plate 52, thereby reducing the capacitance of the third sensitive capacitor. At the same time, the overlapping areas of the first capacitor upper plate 311 and the second capacitor upper plate 321 with the first substrate capacitor plate 51 and the second substrate capacitor plate 52 are reduced, respectively, causing the capacitance of the first sensitive capacitor and the second sensitive capacitor to decrease, causing the resonant frequency of the resonant circuit to increase, thereby achieving low-temperature measurement.

[0036] In summary, the wireless temperature sensor with an origami structure in the present invention is different from other temperature sensors and has the following main features: 1. The capacitance of the sensitive capacitor is regulated by changing the overlapping area and distance between the substrate capacitor plate and the upper capacitor plate to achieve temperature measurement and improve sensitivity and accuracy; 2. The horizontal displacement direction of the output of the V-beam driving rod can be adjusted by the expansion or contraction of the V-beam, thereby expanding the temperature range; 3. High-sensitivity temperature measurement is achieved through the origami structure.

[0037] The criteria for distinguishing whether it is this structure are as follows:

[0038] (a) Temperature drive is achieved using a V-beam structure;

[0039] (b) High temperature measurement is achieved by using a sensitive capacitor consisting of a substrate capacitor plate and a capacitor upper plate;

[0040] (c) Low-temperature measurement using substrate capacitor plates and origami structures;

[0041] (d) Mutual inductance coupling is used to achieve contactless induction of resonant frequency to achieve wireless temperature measurement.

[0042] The structure that meets the above four conditions should be regarded as the origami structure temperature sensor of the structure.

[0043] Anything not described in detail in the present invention is well known to those skilled in the art.

[0044] The above describes in detail the preferred embodiments of the present invention. It should be understood that those skilled in the art can make numerous modifications and variations based on the concepts of the present invention without inventive effort. Therefore, any technical solutions that can be derived by those skilled in the art through logical analysis, reasoning, or limited experimentation based on the concepts of the present invention and the prior art should be within the scope of protection defined by the claims.

Claims

1. A wireless temperature sensor with an origami structure, characterized in that: The origami-structured wireless temperature sensor comprises a substrate (1), an origami structure (4), a planar inductor (6), a V-shaped beam, a substrate capacitor plate, a capacitor upper plate, a spring beam, and a metal wire, wherein the substrate capacitor plate, the metal wire, and the planar inductor are all fixed on the substrate.

2. The origami-structured wireless temperature sensor according to claim 1, characterized in that: The V-shaped beam comprises a first V-shaped beam, a second V-shaped beam, a first anchoring area (211) of the first V-shaped beam, a second anchoring area (214) of the first V-shaped beam, a first anchoring area (221) of the second V-shaped beam, and a second anchoring area (224) of the second V-shaped beam, wherein the first V-shaped beam comprises a first supporting beam (212) of the V-shaped beam, a second supporting beam (213) of the V-shaped beam, and a driving rod (215); the second V-shaped beam comprises a first supporting beam (222) of the V-shaped beam, a second supporting beam (223), and a driving rod (225); wherein the first anchoring area (211) of the first V-shaped beam, the second anchoring area (214) of the first V-shaped beam, the first anchoring area (221) of the second V-shaped beam, and the second anchoring area (224) of the second V-shaped beam are all fixed on a substrate (1).

3. The origami-structured wireless temperature sensor according to claim 1, characterized in that: The capacitor upper plate comprises a first capacitor upper plate (311) and a second capacitor upper plate (321).

4. The origami-structured wireless temperature sensor according to claim 1, characterized in that: The spring beam includes a first spring beam (312) and a second spring beam (322).

5. The origami-structured wireless temperature sensor according to claim 1, characterized in that: The substrate capacitor plate comprises a first substrate capacitor plate (51), a second substrate capacitor plate (52), and a third substrate capacitor plate (53).

6. The origami-structured wireless temperature sensor according to claim 1, characterized in that: The metal wires include a first metal wire (71) and a second metal wire (72).

7. The origami-structured wireless temperature sensor according to claim 2, characterized in that: One end of the first supporting beam (212) of the first V-shaped beam and one end of the second supporting beam (213) of the first V-shaped beam are respectively connected to one end of the first anchoring area (211) of the first V-shaped beam and one end of the second anchoring area (214) of the first V-shaped beam; the other ends of the first supporting beam (212) of the first V-shaped beam and one end of the second supporting beam (213) of the first V-shaped beam are respectively connected to one end of the first anchoring area (211) of the second V-shaped beam and one end of the second anchoring area (214) of the second V-shaped beam; the other ends of the first supporting beam (222) of the second V-shaped beam and one end of the second supporting beam (223) of the second V-shaped beam are connected to one end of the second V-shaped beam driving rod (225); the first V-shaped beam driving rod (21 5), the other end of the second V-beam driving rod (225) is respectively connected to the first capacitor upper plate (311) and the second capacitor upper plate (321); the centers of the notches of the first capacitor upper plate (311) and the second capacitor upper plate (321) are respectively connected to one end of the first spring beam (312) and the second spring beam (322); the other ends of the first spring beam (312) and the second spring beam (322) are respectively connected to two ends of the origami structure (4); one end of the first metal wire (71) and the second metal wire (72) are respectively connected to the first substrate capacitor plate (51) and the second substrate capacitor plate (52); the other ends of the first metal wire (71) and the second metal wire (72) are connected to the planar inductor (6); and the third substrate capacitor plate (53) is placed below the origami structure (4).

8. The origami-structured wireless temperature sensor according to claim 7, characterized in that: The method for using the sensor comprises the following steps: Step S1: When the temperature rises, the first V-beam first support beam (212), the first V-beam second support beam (213), the second V-beam first support beam (222), and the second V-beam second support beam (223) are thermally expanded, and then the first V-beam driving rod (215) and the second V-beam driving rod (225) are displaced along the negative direction of the X axis and the positive direction of the X axis respectively, so that the first capacitor upper electrode plate (311) and the second capacitor upper electrode plate (321) are respectively aligned with the first substrate capacitor electrode plate (51) and the second substrate capacitor electrode plate The overlapping area of ​​the plates (52) increases, and the origami structure does not change, thereby causing the capacitance of the third sensitive capacitor formed by the origami structure (4) and the third substrate capacitor plate (53) to remain unchanged, and the capacitance of the first sensitive capacitor and the second sensitive capacitor formed by the first capacitor upper plate (311) and the second capacitor upper plate (321) and the first substrate capacitor plate (51) and the second substrate capacitor plate (52) to increase, causing the resonant frequency of the LC resonant circuit formed by the sensitive capacitor and the planar inductor (6) to decrease, thereby achieving high-temperature measurement; Step S2: When the temperature decreases, the first V-beam first support beam (212), the first V-beam second support beam (213), the second V-beam first support beam (222), and the second V-beam second support beam (223) are caused to contract, thereby pushing the first V-beam driving rod (215) and the second V-beam driving rod (225) to output displacements along the positive direction of the X-axis and the negative direction of the X-axis, respectively, so that the origami structure (4) is convexly deformed, resulting in a decrease in the overlap area and an increase in the distance between the origami structure (4) and the third substrate capacitor plate (53), thereby reducing the capacitance of the third sensitive capacitor. At the same time, the overlap areas of the first capacitor upper plate (311) and the second capacitor upper plate (321) with the first substrate capacitor plate (51) and the second substrate capacitor plate (52) are reduced, thereby reducing the capacitance of the first sensitive capacitor and the second sensitive capacitor, causing the resonant frequency of the resonant circuit to increase, thereby achieving low-temperature measurement.

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