Metasurface coupling dynamic filtering infrared tunable spectrum encoder and manufacturing method

Abstract

The invention relates to the field of infrared spectrum detection integrated chips, in particular to a metasurface coupling dynamic filtering infrared tunable spectrum encoder which comprises a fixed mirror, a movable mirror and a supporting layer. The moving mirror is of a folding cantilever structure. The movable mirror and the fixed mirror are bonded with each other. The supporting layer is located between the movable mirror and the fixed mirror and supports the movable mirror and the fixed mirror, a suspension layer is formed between the movable mirror and the fixed mirror, electrode connection between the movable mirror and the fixed mirror is completed, and the first-stage dynamic tuning function is completed. And the fixed mirror and the movable mirror electrode are connected to an external circuit. When an external circuit applies bias voltage to the fixed mirror and the movable mirror, the folding cantilever structure is bent, the height of the suspension layer is changed, and filtering tuning is achieved. A more stable suspended micro-bridge structure is adopted, the filtering structure is more compact, and a filtering optical channel with a larger area is obtained. A metasurface light splitting structure is also integrated, namely, a multi-stage dynamic light splitting coding effect is achieved, and a fine bandwidth spectrum effect is achieved. And meanwhile, the metasurface light splitting structure comprehensively utilizes incident light.

Description

Technical Field

[0001] The present invention relates to the field of infrared spectrum detection integrated chips, in particular to a super-surface coupled dynamic filtering infrared tunable spectrum encoder and a manufacturing method thereof. Background Art

[0002] Infrared detection technology offers advantages such as long range, excellent anti-interference capabilities, strong cloud and fog penetration, and 24 / 7 operation. Spectral integrated detection, as a branch of multi-dimensional detection and imaging technology, is a key research area. Traditional infrared detection chips, with their single-intensity detection mode, lack the ability to actively detect targets in complex environments without avoiding interference bands, thus failing to meet the requirements for clear target identification in camouflaged and obscured environments. A new generation of infrared spectral integrated detection chips leverages the "fingerprint recognition" properties of the infrared spectrum and utilizes dynamic spectral active tuning technology to dynamically add a three-dimensional data cube (x, y, λ) to the current two-dimensional spatial imaging of the target (x, y). Low-noise spectral channels are selected to improve the signal-to-background ratio and achieve clear imaging performance. A key technology involves dynamically encoding the incident light's narrowband spectrum, providing an effective spectral encoding channel for back-end reconstruction imaging.

[0003] The existing spectral encoders mainly use aperture coding. The traditional aperture coding filtering method uses filtering encoding, which has low energy utilization. For an N-channel spectral encoder, its energy utilization efficiency is only 1 / N of the total energy utilization efficiency.

[0004] Existing spectral encoders use a static filtering mode, with fixed spectral band selection and no ability to actively tune the spectral range. Furthermore, different filtering ranges and transmittances vary across different regions, resulting in static spectral encoding at the expense of the incident light's photon energy and the spatial resolution of the detection chip. For example, the patent document "High-throughput Coded Aperture Component for Hyperspectral Video Imaging" (patent number CN202211428192.7, Xi'an Institute of Applied Optics) exemplifies this current approach to aperture filtering encoding. The United States has also made advances in this area. For example, NASA's 2023 patent application, titled "Methods And Apparatus For Multi-Spectral Imaging Pyrometer Utilizing Tunable Optics" (US2023 / 0336846 A1), proposes a dynamically tunable metasurface filter concept. Based on project materials, this concept uses thermal actuation to achieve dynamic tuning of the transmission spectrum, attempting to replace traditional mechanically rotating filter wheels used in space remote sensing payloads. Therefore, the country needs to strengthen its patent layout in this area, continue to follow up on the layout of US patents, and seize the initiative for subsequent application and promotion. Summary of the Invention

[0005] The purpose of the present invention is to provide a metasurface coupled dynamic filtering infrared tunable spectral encoder and a manufacturing method, which mainly solves the problems existing in the above-mentioned prior art. It designs a dynamic spectral coding element (Tunable Metafilter) based on a metasurface spectroscopic coupled cantilever beam structure resonant cavity for the core optical elements required for front-end spectral encoding. The metasurface coupled dynamic tunable encoder proposed in this project, on the one hand, proposes a tunable filtering structure based on a cantilever beam to realize a dynamic filtering method, and on the other hand, couples a metasurface structure on the filter surface, and utilizes the metasurface spectroscopic method to utilize the incident light energy as much as possible, thereby realizing dynamic spectroscopic encoding of the infrared incident light.

[0006] In order to achieve the above object, the technical solution adopted by the present invention is to provide a metasurface coupled dynamic filtering infrared tunable spectrum encoder, which is characterized by comprising a fixed mirror, a moving mirror and a support layer;

[0007] The movable mirror is a folded cantilever structure; the movable mirror and the fixed mirror are bonded to each other; the supporting layer is located between the movable mirror and the fixed mirror, supports the movable mirror and the fixed mirror, forms a suspended layer between the two, and completes the electrode connection between the movable mirror and the fixed mirror, completing the first-level dynamic tuning function; the fixed mirror and the movable mirror electrodes are connected to an external circuit; when the external circuit applies a bias voltage to the fixed mirror and the movable mirror, the folded cantilever structure bends, causing the height of the suspended layer to change, thereby realizing filtering tuning.

[0008] Furthermore, the fixed mirror comprises a first substrate layer, a first electrode layer, a first filtering region and a light-splitting metasurface array;

[0009] The first electrode layer and the first filter area are located on the front side of the first substrate layer; the first electrode layer electrode is connected to the external circuit; the first filter area is located below the suspended layer; the spectroscopic metasurface array is located on the back side of the first substrate layer, opposite to the first filter area.

[0010] Furthermore, the spectroscopic metasurface array is composed of a plurality of superpixels; the superpixels are composed of a plurality of nanopillars, and the original light is divided into multiple paths using spectroscopic channels; the number of spectroscopic channels of each superpixel can be customized; the metasurface is composed of nanopillars arranged in an orderly manner on a substrate; the size of the nanopillar substrate is equivalent to half the spectroscopic working wavelength; the height of the nanopillar is equivalent to the spectroscopic working wavelength.

[0011] Furthermore, the substrate is square or hexagonal; the cross-sectional shape of the nanocolumn is a symmetrical figure, preferably a highly symmetrical figure such as a rectangle, an ellipse, a circle, a cross and a ring.

[0012] Furthermore, the moving mirror includes a second substrate layer, a cantilever beam, a cantilever beam electrode, and a second filtering area; the cantilever beam is located on the front of the second substrate layer; the cantilever beam electrode is arranged on the outer ring of the cantilever beam; the cantilever beam electrode is connected to the external circuit; the second filtering area is arranged in the central area of ​​the cantilever beam; an anti-reflection film is manufactured on the back of the second substrate layer to form an anti-reflection film area; the anti-reflection film area covers the area of ​​the suspended layer.

[0013] Furthermore, there are multiple cantilever beams formed by carving through the second substrate layer; the multiple cantilever beams are arranged in a centrally symmetrical shape to jointly support the bridge deck area located in the center of the cantilever beams, thereby forming the folded cantilever structure.

[0014] Furthermore, the support layer is an indium column beam, which is fixed on the fixed mirror and bonded to the movable mirror.

[0015] The present invention also discloses a method for manufacturing the above-mentioned metasurface coupled dynamic filtering infrared tunable spectrum encoder, which is characterized by comprising the steps of:

[0016] Step S100, independently manufacturing the fixed mirror, and manufacturing the supporting layer on the fixed mirror using a growth process;

[0017] Step S200, independently manufacturing the moving mirror;

[0018] In step S300 , the movable mirror and the fixed mirror are bonded together by reverse welding bonding, the supporting layer separates the movable mirror and the fixed mirror, and the suspended layer is formed between the movable mirror and the fixed mirror.

[0019] Furthermore, in step S100, the manufacturing of the fixed mirror includes the following steps:

[0020] Step S101, preparing a first substrate layer;

[0021] Step S102, forming a first electrode layer on the front surface of the first substrate layer by using a photolithography lift-off process;

[0022] Step S103, growing a first filter region in the middle region of the front surface of the first substrate layer, that is, the region surrounded by the first electrode layer, by using a magnetron sputtering method or a coating method;

[0023] Step S104 , growing an indium column beam as the support layer on the selected electrode in the first electrode layer through a photolithography lift-off process, for supporting the moving mirror and forming a circuit path with the moving mirror.

[0024] Step S105, manufacturing a light-splitting metasurface array at a position corresponding to the first filtering area on the back side of the first substrate layer;

[0025] Furthermore, in step S200, the manufacturing of the moving mirror includes the following steps:

[0026] Step S201, forming a cantilever beam electrode on the front surface of the second substrate layer by using a photolithography lift-off process;

[0027] Step S202: growing a second filter region in the middle area of ​​the front surface of the second substrate layer, that is, the area surrounded by the cantilever beam electrode, by using a magnetron sputtering method or a coating method;

[0028] Step S203: using a deep silicon etching method to etch through the second substrate layer to release and form a cantilever beam.

[0029] In view of the above technical features, the metasurface-coupled dynamic filtering infrared tunable spectrum encoder and manufacturing method of the present invention have the following advantages over the prior art:

[0030] 1. The present invention realizes a dynamic filter structure based on the guidance of a multi-physics field simulation model. The structural design of the arc-shaped cantilever beam is as follows. The cantilever beam structure is in the shape of an arc, with one end connected to the substrate and the other end extending to the bridge surface area. The use of an arc-shaped structure makes the filter structure more compact. On the other hand, it can effectively reduce stress, making the suspended structure more stable and able to support filtering work in a vacuum and low-temperature environment. It can not only effectively reduce surface stress to obtain a more stable suspended microbridge structure, but also make the filter structure more compact and obtain a larger area of ​​filtering optical channel.

[0031] 2. This invention enables dynamic spectral tuning, enabling active tuning of the transmission spectrum within the 3-5 micron mid-wave infrared range. This dynamic tuning capability is further integrated into the metasurface spectroscopic structure, achieving a multi-level dynamic spectroscopic encoding effect. This compensates for the spectral broadening inherent in conventional large-area FP dynamic filters due to their suspended structure. This achieves fine-bandwidth spectral effects by leveraging the localized light field effects of the metasurface structure.

[0032] 3. This invention utilizes a metasurface spectrometry approach, integrating a subwavelength metasurface structure onto a dynamic filter structure to further achieve fine spectral separation and convergence. This allows for comprehensive utilization of incident light, further focusing and splitting it, ensuring energy efficiency, which is essentially limited only by the transmittance of the metasurface structure. Compared to traditional static encoders that rely on filtering for spectral encoding, this reduces optical energy loss, providing sufficient guarantees for energy collection and detection utilization in back-end detectors. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a structural diagram of a preferred embodiment of the dynamic filtering infrared tunable spectrum encoder of the present invention;

[0034] Figure 2 1 is a side view of a preferred embodiment of the dynamic filtering infrared tunable spectrum encoder of the present invention;

[0035] Figure 3 1 is a top view of a cantilever beam in a preferred embodiment of a dynamic filtering infrared tunable spectrum encoder according to the present invention;

[0036] Figure 4 2. It is a structural diagram of a spectroscopic metasurface array in a preferred embodiment of the dynamic filtering infrared tunable spectrum encoder of the present invention;

[0037] Figure 5 1. It is a schematic diagram of the operation of a superpixel in a spectroscopic metasurface array in a preferred embodiment of a dynamic filtering infrared tunable spectrum encoder of the present invention;

[0038] Figure 6 A flowchart of a preferred embodiment of a method for manufacturing a dynamic filtering infrared tunable spectrum encoder according to the present invention;

[0039] Figure 7 A semiconductor structure diagram of a fixed mirror manufacturing process in a preferred embodiment of a method for manufacturing a dynamic filtering infrared tunable spectrum encoder of the present invention;

[0040] Figure 8 A semiconductor structure diagram of a moving mirror manufacturing process in a preferred embodiment of a method for manufacturing a dynamic filtering infrared tunable spectrum encoder of the present invention;

[0041] Figure 9 This is a semiconductor structure diagram in the bonding process of a preferred embodiment of the manufacturing method of the dynamic filtering infrared tunable spectrum encoder of the present invention.

[0042] In the figure: 1-fixed mirror, 2-moving mirror, 3-support layer;

[0043] 11-first substrate layer, 12-first electrode layer, 13-first filtering region, 14-spectroscopy metasurface array; 141-superpixel, 142-subpixel;

[0044] 21 - second substrate layer, 22 - cantilever beam, 23 - cantilever beam electrode, 24 - second filtering region, 25 - antireflection film region, 26 - circular bridge surface region. DETAILED DESCRIPTION

[0045] Below in conjunction with specific embodiment, further set forth the present invention.Should be understood that these embodiments are only used to illustrate the present invention and are not used in limiting the scope of the present invention.In addition, should be understood that after reading the content taught by the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms fall equally within the scope limited by the appended claims of the application.

[0046] See also Figure 1 、 Figure 2 and Figure 3 The present invention discloses a metasurface coupled dynamic filtering infrared tunable spectrum encoder. As shown in the figure, a preferred embodiment thereof has the basic function of a multi-level dynamic spectroscopic encoding function for the medium-wave infrared range of 3 to 5 microns. It is composed of a fixed mirror 1, a movable mirror 2 and a support layer 3, and adopts a multi-level combined dynamic spectroscopic encoding method. The fixed mirror 1 and the movable mirror 2 are both on the silicon substrate layer and are independently processed and manufactured. After manufacturing, the fixed mirror 1 and the movable mirror 2 are bonded to each other and isolated by the support layer 3, thereby forming a suspended layer between the fixed mirror 1 and the movable mirror 2. The support layer 3 also serves as an electrical conduction channel between the fixed mirror 1 and the movable mirror 2. In this embodiment, the support layer 3 is processed together with the fixed mirror 1, and is an indium column beam grown on the fixed mirror 1 structure, and then connected to the movable mirror 2 during bonding. The height of the indium column beam is 2 microns. The moving mirror 2 has a folded cantilever structure. Under the action of an external electric field, the electrostatic force acts on the folded cantilever structure, causing it to bend, resulting in a change in the height of the suspended layer between mirror 1 and the moving mirror 2, thereby realizing a first-level dynamic tuning function, that is, a first-level dynamic spectroscopic function of the incident light.

[0047] The fixed mirror 1 includes a first substrate layer 11, a first electrode layer 12, a first filter region 13, and a spectroscopic metasurface array 14. The first substrate layer 11 is a silicon substrate. The first electrode layer 12 and the first filter region 13 are fabricated on the front surface of the first substrate layer 11. The first electrode layer 12 is a gold bottom electrode layer composed of multiple gold electrode groups. The first filter region 13 is located in the center, while the first electrode layer 12 is located on the periphery of the first filter region 13. The spectroscopic metasurface array 14 is disposed on the back surface of the fixed mirror 1, that is, fabricated on the back surface of the first substrate layer 11. The spectroscopic metasurface array 14 implements a secondary spectroscopic function, further splitting and converging the incident light to ensure energy utilization. The spectroscopic metasurface array 14 is opposite the first filter region 13 located on the front surface of the first substrate layer 11, and its size also matches the size of the first filter region 13. In this embodiment, the thickness of the first substrate layer 11 is 400 microns, and the thickness of the first electrode layer 12 is 150 nanometers. In another embodiment, the thickness of the first substrate layer 11 is 500 micrometers, and the thickness of the first electrode layer 12 is 150 nanometers.

[0048] Correspondingly, the dynamic mirror 2 includes a second substrate layer 21, a cantilever beam 22, a cantilever beam electrode 23, and a second filter region 24. The second substrate layer 21 is a silicon substrate. On the front surface of the second substrate layer 21, a cantilever beam 22 is fabricated to form a folded cantilever structure.

[0049] There are multiple cantilever beams 22, which are cantilever structures formed by carving through the second substrate layer 21. In this embodiment, there are three arc-shaped cantilever beams 22, which are arranged together to form a complete circle with the center of the circle as the center of symmetry. In the area surrounded by these three cantilever beams 22, a circular bridge area 26 is formed. The circular bridge area 26 is supported by the three cantilever beams 22, forming a complete folded cantilever structure. Cantilever beam electrodes 23 are manufactured along the outer circle of the cantilever beams 22. In the central area of ​​the cantilever beam 22, that is, below the circular bridge area 26, a second filter area 24 is provided. An anti-reflection film is manufactured on the back of the moving mirror 2 to form an anti-reflection film area 25. The anti-reflection film area 25 is opposite to the area of ​​the second filter area 24, and its area is larger than the area of ​​the suspended layer, that is, it covers the second filter area 24 located on the front of the second substrate layer 21. In this embodiment, the second substrate layer 21 has a thickness of 100 micrometers, the cantilever beam electrode 23 has a thickness of 150 nanometers, and the radius of the top circular bridge surface region 26 is 3.75 millimeters.

[0050] After the fixed mirror 1 and the movable mirror 2 are bonded, the first electrode layer 12 and the cantilever beam electrode 23 are opposite each other, and the first filter region 13 and the second filter region 24 are opposite each other. The gap between the first filter region 13 and the second filter region 24 forms a suspended layer. Specifically, the first filter region 13 of the fixed mirror 1 is located below the suspended layer, forming the bottom of the suspended layer. The second filter region 24 of the movable mirror 2 is located above the suspended layer, forming the top of the suspended layer. The first electrode layer 12 and the cantilever beam electrode 23 are both connected to an external circuit, connected to the positive and negative poles, respectively. In this way, the external circuit can control the degree of deformation of the cantilever beam 22 by applying a bias voltage to the first electrode layer 12 and the cantilever beam electrode 23. The greater the degree of deformation of the cantilever beam 22, the smaller the distance between the first filter region 13 and the second filter region 24, and vice versa.

[0051] See also Figure 4 and Figure 5The function of the spectroscopic metasurface array 14 is to realize secondary spectroscopic, and it is an array composed of multiple superpixels 141. Each superpixel 141 contains multiple spectroscopic channels. The original light incident on the superpixel 141 is filtered out of specific wavelengths by the spectroscopic channel. Different spectroscopic channels have different filtering characteristics. Therefore, after the original light passes through the superpixel 141, it is split into multiple sub-lights containing different wavelengths. The specific structure of the spectroscopic channel is the sub-pixel 142. Each superpixel 141 contains the same number of sub-pixels 142 as the spectroscopic channels. Each sub-pixel 142 can be regarded as a spectroscopic channel, which is composed of nanopillars arranged in an orderly manner on the substrate to form a spectroscopic structure. In the sub-pixel 142, the overall phase distribution is determined according to the spectroscopic component. The sizes of the substrate and the nanopillars are different, thereby determining the structural parameters of the sub-pixel 142. Specifically, the size of the nanopillar substrate is equivalent to half of the spectroscopic working wavelength, and the height of the nanopillar is equivalent to the spectroscopic working wavelength. On the premise of meeting the above requirements, there are many options for the shape of the nanocolumn base, as long as the plane is fully covered, such as a square or hexagon. The cross-sectional shape of the nanocolumn is preferably a symmetrical figure, such as a rectangle, an ellipse, a circle, a cross and a ring. In this embodiment, a super pixel 141 includes four sub-partitions, which means that the incident light is divided into four parts. In different scenarios, the number of sub-beams can also be customized according to the application scenario. After passing through the super pixel 141, the incident light is split into multiple beams. As shown in the figure, the spectral information of multiple components is distributed on a dynamically tunable wide spectrum band, and exhibits a multi-peak interlaced phenomenon, with certain orthogonal characteristics, which can ensure that the light fields of each channel of the dynamic filter can be utilized with high energy and decomposed and encoded when entering.

[0052] In this embodiment, the light-splitting metasurface array 14 is composed of N×N sub-pixels. When the light is split into four beams, the ideal state of the super-pixel 141 structural unit is 2×2, at which the spatial resolution is the highest. The base of the nanopillars in each sub-pixel 142 is arranged in a square or hexagonal shape. The cross-sectional shape of the nanopillars adopts a highly symmetrical pattern, including but not limited to square, circular, cross, ring, etc. In another embodiment, the base of the nanopillars in the light-splitting metasurface array 14 is arranged in a square shape. The cross-sectional shape of the nanopillars adopts a pattern with C4 or higher symmetry, including but not limited to elliptical, square, circular, etc.

[0053] See also Figures 6 to 9 The present invention also discloses a method for manufacturing the above-mentioned dynamic filtering infrared tunable spectrum encoder by metasurface coupling. A preferred embodiment thereof comprises the steps of:

[0054] Step S1 , manufacturing the fixed mirror 1 and the supporting layer 3 .

[0055] The fixed mirror 1 and the support layer 3 are independently manufactured using bulk silicon processing technology.

[0056] Step S11: preparing a first substrate layer 11.

[0057] Step S12 , manufacturing the first electrode layer 12 by photolithography and lift-off.

[0058] On the front surface of the first substrate layer 11, a first electrode layer 12 is formed by using a photolithography lift-off process.

[0059] Step S13: manufacturing the first filter region 13.

[0060] In the middle area of ​​the front surface of the first substrate layer 11 , ie, the area surrounded by the first electrode layer 12 , the first filter region 13 is grown by using a magnetron sputtering method or a coating method.

[0061] Step S14: manufacturing the support layer 3 by photolithography lift-off process.

[0062] By means of a photolithography lift-off process, an indium column beam is grown on the electrode selected in the first electrode layer 12 as a support layer 3 for supporting the moving mirror and forming a circuit path with the moving mirror.

[0063] Step S15, manufacturing the light-splitting metasurface array 14 on the back side.

[0064] A spectroscopic metasurface array 14 is fabricated on the back side of the first substrate layer 11 at a position corresponding to the first filter region 13. Specifically, an electron beam exposure method is used to define a pattern on the back side of the first substrate layer 11, and the spectroscopic metasurface array 14 is fabricated by an etching method.

[0065] Step S2, manufacturing the moving mirror 2.

[0066] The moving mirror 2 is independently manufactured using bulk silicon processing technology.

[0067] Step S21 , preparing a second substrate layer 21 .

[0068] Step S22 , manufacturing the cantilever beam electrode 23 by photolithography and lift-off.

[0069] On the front surface of the second substrate layer 21 , a cantilever beam electrode 23 is formed by using a photolithography lift-off process.

[0070] Step S23 , manufacturing the second filter region 24 .

[0071] In the middle area of ​​the front surface of the second substrate layer 21 , ie, the area surrounded by the cantilever beam electrode 23 , the second filter region 24 is grown by using a magnetron sputtering method or a coating method.

[0072] Step S24 : deep silicon etching to form the cantilever beam 22 .

[0073] The second substrate layer 21 is etched through by a deep silicon etching method to release and form a cantilever beam 22 .

[0074] Step S3, bonding the fixed mirror 1 and the movable mirror 2.

[0075] The fixed mirror 1 and the movable mirror 2 are bonded together by reverse welding bonding, and the supporting layer 3 separates the movable mirror 2 and the fixed mirror 1 to form a suspended layer between the movable mirror 2 and the fixed mirror 1.

[0076] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A metasurface coupled dynamic filtering infrared tunable spectrum encoder, characterized in that: Contains fixed mirror, moving mirror and supporting layer; The movable mirror is a folded cantilever structure; the movable mirror and the fixed mirror are bonded to each other; the supporting layer is located between the movable mirror and the fixed mirror, supports the movable mirror and the fixed mirror, forms a suspended layer between the two, and completes the electrode connection between the movable mirror and the fixed mirror, completing the first-level dynamic tuning function; the fixed mirror and the movable mirror electrodes are connected to an external circuit; when the external circuit applies a bias voltage to the fixed mirror and the movable mirror, the folded cantilever structure bends, causing the height of the suspended layer to change, thereby realizing filtering tuning.

2. The dynamic filtering infrared tunable spectrum encoder according to claim 1, characterized in that: The fixed mirror comprises a first substrate layer, a first electrode layer, a first filtering region and a light-splitting metasurface array; The first electrode layer and the first filter area are located on the front side of the first substrate layer; the electrodes of the first electrode layer are connected to the external circuit; The first filtering area is located below the suspended layer; the light-splitting metasurface array is located on the back side of the first substrate layer, opposite to the first filtering area.

3. The dynamic filtering infrared tunable spectrum encoder according to claim 2, characterized in that: The spectroscopic metasurface array is composed of a plurality of superpixels; the superpixel is composed of a plurality of sub-pixels, and the original light is divided into multiple paths using a spectroscopic channel; the number of spectroscopic channels of each superpixel can be customized; the superpixel is composed of nanopillars arranged in an orderly manner on a substrate; the size of the nanopillar substrate is equivalent to half the spectroscopic working wavelength; the height of the nanopillar is equivalent to the spectroscopic working wavelength.

4. The dynamic filtering infrared tunable spectrum encoder according to claim 3, characterized in that: The substrate is square or hexagonal; the cross-sectional shape of the nanocolumn is a symmetrical figure, preferably a highly symmetrical figure such as an ellipse, a circle, a cross and a ring.

5. The dynamic filtering infrared tunable spectrum encoder according to claim 1, characterized in that: The dynamic mirror comprises a second substrate layer, a cantilever beam, a cantilever beam electrode, and a second filtering area; the cantilever beam is located on the front of the second substrate layer; the cantilever beam electrode is arranged on the outer ring of the cantilever beam; the cantilever beam electrode is connected to the external circuit; and the second filtering area is arranged in the central area of ​​the cantilever beam; manufacturing an antireflection film on the back side of the second substrate layer to form an antireflection film region; The antireflection film region covers the region of the suspended layer.

6. The dynamic filtering infrared tunable spectrum encoder according to claim 5, characterized in that: There are multiple cantilever beams formed by carving through the second substrate layer; the multiple cantilever beams are arranged in a centrally symmetrical shape and jointly support the bridge deck area located in the center of the cantilever beams, thereby forming the folded cantilever structure.

7. The dynamic filtering infrared tunable spectrum encoder according to claim 1, characterized in that: The supporting layer is an indium column beam, which is fixed on the fixed mirror and bonded to the moving mirror.

8. A method for manufacturing a dynamic filtering infrared tunable spectrum encoder according to claim 1, characterized in that: Contains steps: Step S100, independently manufacturing the fixed mirror, and manufacturing the supporting layer on the fixed mirror using a growth process; Step S200, independently manufacturing the moving mirror; In step S300 , the movable mirror and the fixed mirror are bonded together by reverse welding bonding, the supporting layer separates the movable mirror and the fixed mirror, and the suspended layer is formed between the movable mirror and the fixed mirror.

9. The manufacturing method of the dynamic filtering infrared tunable spectrum encoder according to claim 8, characterized in that: In step S100, the manufacturing of the fixed mirror includes the following steps: Step S101, preparing a first substrate layer; Step S102, forming a first electrode layer on the front surface of the first substrate layer by using a photolithography lift-off process; Step S103, growing a first filter region in the middle region of the front surface of the first substrate layer, that is, the region surrounded by the first electrode layer, by using a magnetron sputtering method or a coating method; Step S104 , growing an indium column beam as the support layer on the selected electrode in the first electrode layer through a photolithography lift-off process, for supporting the moving mirror and forming a circuit path with the moving mirror. Step S105: manufacturing a light-splitting metasurface array at a position on the back side of the first substrate layer corresponding to the first filtering area.

10. The manufacturing method of the dynamic filtering infrared tunable spectrum encoder according to claim 8, characterized in that: In step S200, the manufacturing of the moving mirror includes the following steps: Step S201, forming a cantilever beam electrode on the front surface of the second substrate layer by using a photolithography lift-off process; Step S202, growing a second filter region in the middle region of the front surface of the second substrate layer, that is, the region surrounded by the cantilever beam electrode, by using a film coating method; Step S203: etching through the second substrate layer using an etching method to release the second substrate layer to form a cantilever beam.

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