Joint treatment method for film replacement of base-material-free adhesive tape
Through the precise alignment and bonding of multiple layers of silicone tape and sealing tape, the bonding problem at the joints of tapes without substrates is solved, and the firmness of the joints and the continuity of the die-cutting process are achieved.
Patent Information
- Application Number
- CN202511182486.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-22
- Publication Date
- 2025-10-10
AI Technical Summary
When processing the joints of existing non-base tapes, excessive or insufficient bonding is prone to occur, resulting in the joints being disconnected or detached during the die-cutting process, affecting continuous production.
A combined treatment method of multiple layers of silicone tape and sealing tape is used. The tail and head of the tape without substrate are pre-baked to make it easy to peel off. Then the silicone tape and sealing tape are precisely aligned and fitted to ensure the firmness of the joints.
It achieves reliable connection of tape joints without substrate, avoids disconnection before die-cutting and film transfer, and ensures the continuity and reliability of the die-cutting process.
Smart Images
Figure CN120756913A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of film replacement of a non-base material adhesive tape, in particular to a joint processing method for film replacement of a non-base material adhesive tape. Background Art
[0002] The structure of the tape without substrate is shown in Figure 1 , which includes stacked self-contained paper 1, baseless adhesive tape 2, and release film 3. During the die-cutting operation, the amount of baseless adhesive tape used is relatively large, and a transfer operation is often required. That is, the end of the previous roll of baseless adhesive tape needs to be docked with the starting end of the next roll of baseless adhesive tape before it is almost used up, thereby ensuring the continuous operation of the die-cutting production line; however, when processing the existing joints, either the two sets of baseless adhesive tapes are excessively bonded, resulting in the baseless adhesive tape in the middle position being unusable; or the bonding viscosity is insufficient, resulting in the two sets of baseless adhesive tapes being separated at the moment of tensioning; therefore, how to reliably connect the baseless adhesive tapes is a technical problem that urgently needs to be solved. Summary of the Invention
[0003] In response to the above problems, the present invention provides a method for processing joints of a tape without a substrate for film transfer, which makes the joints of the tape without a substrate firm and reliable, and prevents the joints from breaking before die-cutting and film transfer, thereby ensuring reliable and continuous die-cutting.
[0004] A method for processing joints during film replacement of substrate-free adhesive tapes is characterized in that the tail of the previous roll of substrate-free adhesive tape and the beginning of the next roll of substrate-free adhesive tape are removed in advance, and then the tail and beginning of the tape are briefly baked to facilitate peeling of the paper, substrate-free adhesive tape, and release film of each set of substrate-free adhesive tapes, and then the following operations are performed: S1. Use the adhesive surface of the first silicone tape to adhere to the non-release surfaces of the two sets of release films. At the same time, the two sets of release films are joined together to form an integral release surface, with the lower joining seam of the two sets of release films located within the surface area of the first silicone tape. S2. Three second silicone tapes are arranged in sequence on the upper surfaces of the release surfaces of the two sets of release films. The second silicone tapes on both sides are arranged symmetrically with respect to the second silicone tape in the center. The second silicone tape in the center covers the upper joint seam of the two sets of release films. S3. The tail of the first roll of double-sided tape without a backing material and the beginning of the second roll of double-sided tape without a backing material are joined and attached to the non-adhesive surface formed by the three sets of second silicone tapes. The adhesive surface of the sealing tape is attached to the upper joint area of the two sets of double-sided tape without a backing material for gluing. S4. The adhesive surface of the third silicone tape is placed upwards on the lower joint of the two sets of self-contained paper, and the lower non-adhesive surface of the third silicone tape is superimposed on the upper non-adhesive surface of the sealing tape; S5. A fourth silicone tape is attached to the upper surfaces of the two sets of self-contained papers. The adhesive surface of the fourth silicone tape is attached to the self-contained papers at both ends, and the surface area of the fourth silicone tape covers the upper joint seam of the two sets of self-contained papers.
[0005] It is further characterized by: The first silicone tape, the second silicone tape, the third silicone tape, and the fourth silicone tape are made of the same material and are obtained by cutting the silicone tape roll one by one, with one surface being an adhesive surface and the other surface being a non-adhesive surface; In step S1, the first silicone tape, the second silicone tape, and the third silicone tape are all applied so that their length directions are perpendicular to the length direction of the non-substrate tape, ensuring that the corresponding silicone tape completely covers the width area of the corresponding self-contained paper, non-substrate tape, and release film, and completely covers the corresponding joint seam; The length of the fourth silicone tape is equal to the sum of the widths of the three groups of second silicone tapes, which makes the surface length of the fourth silicone tape correspond to the sum of the surface lengths formed by the three groups of second silicone tapes below, ensuring uniform and reliable force. The second silicone tape on both sides is used to enhance the adhesion between the two sets of substrate-free tapes, ensuring that the two sets of substrate-free tapes will not separate when tensioned; The width of the sealing tape is equal to the width of the third silicone tape to ensure that there is no misalignment during stacking; The first silicone tape, the second silicone tape, and the third silicone tape are silicone tapes of the same size, which are obtained in advance by cutting, and then the mounting operation is completed by manual or machine alignment.
[0006] After adopting this method, the upper and lower surfaces of the aligned and spliced release films are respectively provided with silicone tapes, the upper surface of the aligned and spliced non-base tape is glued with sealing tape and the lower surface is adhered with silicone tape, and the upper and lower surfaces of the aligned and spliced self-contained paper are respectively provided with silicone tapes, and the sealing tape is used to enhance the adhesion at the position of the non-base silicone tape, and the remaining release films and self-contained paper are provided with upper and lower silicone tapes for auxiliary bonding, which makes the joints of the non-base tapes firm and reliable, and the joints will not break before die-cutting and film transfer, ensuring that die-cutting is reliable and continuous. BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Figure 1 Schematic diagram of the material layer structure of an existing substrate-free adhesive tape; Figure 2 Schematic diagram of the membrane layer corresponding to the method of the present invention; The names corresponding to the serial numbers in the figure are as follows: Self-contained paper 1, non-base tape 2, release film 3 The first silicone tape 10 , the second silicone tape 20 , the side second silicone tape 22 , the center second silicone tape 21 , the third silicone tape 30 , the sealing tape 40 , and the fourth silicone tape 50 . DETAILED DESCRIPTION
[0008] A method for processing joints during film replacement of substrate-free adhesive tapes is characterized in that the tail of a previous roll of substrate-free adhesive tape and the beginning of a next roll of substrate-free adhesive tape are removed in advance, and then the tail and beginning of the tape are briefly baked to facilitate peeling of the self-contained paper 1, substrate-free adhesive tape 2, and release film 3 of each set of substrate-free adhesive tapes, followed by the following operations: S1. Use the adhesive surface of the first silicone tape 10 to adhere to the non-release surfaces of the two sets of release films 3. At the same time, the two sets of release films 3 are joined together to form an integral release surface. The lower joining seam of the two sets of release films 3 is located within the surface area of the first silicone tape 10. S2. Three second silicone tapes 20 are arranged in sequence on the upper surfaces of the release surfaces of the two sets of release films 3. The side second silicone tapes 22 are arranged symmetrically with respect to the central second silicone tape 21 at the center. The central second silicone tape 21 at the center covers the upper joint seam of the two sets of release films 3. S3. The tail of the first roll of double-sided tape 2 without a backing material and the beginning of the second roll of double-sided tape 2 without a backing material are joined and attached to the non-adhesive surface formed by the three sets of second silicone tapes 20. The sticky surface of the sealing tape 40 is attached to the upper joint area of the two sets of double-sided tape 2 without a backing material for gluing. S4. The adhesive surface of the third silicone tape 30 is placed upwards on the lower joint of the two sets of self-contained paper 1, and the lower non-adhesive surface of the third silicone tape 30 is overlapped with the upper non-adhesive surface of the sealing tape 40; S5. The upper surfaces of the two sets of self-contained papers 1 are adhered with a fourth silicone tape 50. The adhesive surface of the fourth silicone tape 50 adheres to the self-contained papers 1 at both ends, and the surface area of the fourth silicone tape 50 covers the upper joint seam of the two sets of self-contained papers 1.
[0009] In a specific implementation, the first silicone tape 10, the second silicone tape 20, the third silicone tape 30, and the fourth silicone tape 50 are made of the same material and are cut one by one from a silicone tape roll with a width of W = 50 mm. One surface of each of the silicone tapes is adhesive and the other surface is non-adhesive. In step S1, the first silicone tape 10, the second silicone tape 20, and the third silicone tape 30 are all placed so that their length directions are perpendicular to the length direction of the non-substrate tape 2, ensuring that the corresponding silicone tape completely covers the width area of the corresponding self-contained paper 1, non-substrate tape 2, and release film 3, and completely covers the corresponding joint seam; The length of the fourth silicone tape 50 is equal to the sum of the widths of the three sets of second silicone tapes 20, that is, 150 mm. This makes the surface length of the fourth silicone tape 50 correspond to the sum of the surface lengths of the three sets of second silicone tapes 20 below it, ensuring uniform and reliable force. The second side silicone tapes 22 located on both sides are used to enhance the adhesion between the two sets of substrate-free adhesive tapes to ensure that the two sets of substrate-free adhesive tapes will not separate when tensioned; The width of the sealing tape 40 is equal to the width of the third silicone tape 30, which is 50 mm, to ensure that there is no misalignment when stacking; The first silicone tape 10 , the second silicone tape 20 , and the third silicone tape 30 are silicone tapes of the same size, which are obtained by cutting in advance and then are manually or machine aligned and attached to complete the mounting operation.
[0010] During specific implementation, the joints of each layer must be flat and free of bubbles and wrinkles, and the joints must be compacted to prevent the inherent film from being pulled apart when the film is replaced at the joints.
[0011] Its working principle is as follows: silicone tape is provided on the upper and lower surfaces of the parallel-jointed release film respectively, sealing tape is adhered to the upper surface of the parallel-jointed non-base tape and silicone tape is adhered to the lower surface, silicone tape is provided on the upper and lower surfaces of the parallel-jointed self-contained paper respectively, and the sealing tape is used to enhance the adhesion at the position of the non-base silicone tape, while the remaining release films and self-contained paper are provided with upper and lower silicone tapes for auxiliary bonding, which makes the joints of the non-base tapes firm and reliable, and the joints will not break before die-cutting and film transfer, ensuring reliable and continuous die-cutting.
[0012] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.
[0013] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.
Claims
1. A method for processing a joint of a non-substrate adhesive tape for film replacement, characterized in that: The tail of the previous roll of non-substrate tape and the beginning of the next roll of non-substrate tape are removed in advance, and then the tail and beginning of the tape are briefly baked to make the self-contained paper, non-substrate tape, and release film of each set of non-substrate tapes easy to peel off. Then the following operations are carried out: S1. Use the adhesive surface of the first silicone tape to adhere to the non-release surfaces of the two sets of release films. At the same time, the two sets of release films are joined together to form an integral release surface, with the lower joining seam of the two sets of release films located within the surface area of the first silicone tape. S2. Three second silicone tapes are arranged in sequence on the upper surfaces of the release surfaces of the two sets of release films. The second silicone tapes on both sides are arranged symmetrically with respect to the second silicone tape in the center. The second silicone tape in the center covers the upper joint seam of the two sets of release films. S3. The tail of the first roll of double-sided tape without a backing material and the beginning of the second roll of double-sided tape without a backing material are joined and attached to the non-adhesive surface formed by the three sets of second silicone tapes. The adhesive surface of the sealing tape is attached to the upper joint area of the two sets of double-sided tape without a backing material for gluing. S4. The adhesive surface of the third silicone tape is placed upwards on the lower joint of the two sets of self-contained paper, and the lower non-adhesive surface of the third silicone tape is superimposed on the upper non-adhesive surface of the sealing tape; S5. A fourth silicone tape is attached to the upper surfaces of the two sets of self-contained papers. The adhesive surface of the fourth silicone tape is attached to the self-contained papers at both ends, and the surface area of the fourth silicone tape covers the upper joint seam of the two sets of self-contained papers.
2. The method for processing a joint of a non-substrate adhesive tape for film replacement according to claim 1, characterized in that: The first silicone tape, the second silicone tape, the third silicone tape, and the fourth silicone tape are silicone tape structures made of the same material, which are obtained by cutting the silicone tape roll one by one, and one surface of each is a sticky surface and the other surface is a non-sticky surface.
3. The method for processing a joint of a non-substrate adhesive tape for film replacement according to claim 2, characterized in that: In step S1, the first silicone tape, the second silicone tape, and the third silicone tape are all attached so that the length direction of the silicone tape is perpendicular to the length direction of the non-substrate tape, ensuring that the corresponding silicone tape completely covers the width area of the corresponding self-contained paper, non-substrate tape, and release film, and completely covers the corresponding splicing seam.
4. The method for processing a joint of a non-substrate adhesive tape for film replacement according to claim 3, characterized in that: The length of the fourth silicone tape is equal to the sum of the widths of the three groups of second silicone tapes, which makes the surface length of the fourth silicone tape correspond to the sum of the surface lengths formed by the three groups of second silicone tapes below.
5. The method for processing a joint of a non-substrate adhesive tape for film replacement according to claim 1, characterized in that: The second silicone tape located on both sides is used to enhance the adhesion between the two sets of substrate-free tapes.
6. The method for processing a joint of a non-substrate adhesive tape for film replacement according to claim 2, characterized in that: The width of the sealing tape is equal to the width of the third silicone tape.
7. The method for processing a joint of a non-substrate adhesive tape for film replacement according to claim 2, characterized in that: The first silicone tape, the second silicone tape, and the third silicone tape are silicone tapes of the same size, which are obtained in advance by cutting, and then the mounting operation is completed by manual or machine alignment.