Semiconductor level flip chip surface mounting technology production process

Abstract

The invention relates to the technical field of flip chips, and provides a semiconductor level flip chip surface mounting technology production process, which comprises the following steps: obtaining a circuit board and a flip chip; first solder paste is printed on the circuit board, and the flip chip is pasted to the first solder paste of the circuit board; welding the flip chip to the circuit board through a reflow soldering process; filling the bottom of the flip chip; according to the semiconductor-level flip chip surface mounting technology production process provided by the embodiment of the invention, the flip chip is welded to the circuit board, so that the flip chip has higher connection density and better electrical performance, and the bottom of the flip chip is filled, so that the filler can enhance the mechanical bonding force between the flip chip and the circuit board, thereby improving the reliability of the flip chip. The probability that the flip chip falls off from the circuit board or the welding point is loosened due to external force or temperature change can be effectively reduced.

Description

TECHNICAL FIELD

[0001] The application relates to the field of flip chip technology, and particularly provides a semiconductor-level flip chip surface mounting technology production process. BACKGROUND

[0002] With the development of optical module transmission in the direction of high speed and large bandwidth, the traditional Bonding process (a process of connecting electronic components, chips and the like to a substrate) is not suitable for the demand of 5G high speed and large bandwidth, and the launch of high-speed optical modules will further reduce the delay caused by insufficient network carrying capacity of 5G new applications. Especially in the aspects of cloud computing and big data, 800G, 1.6T and 3.2T high-speed optical modules will continue to promote the construction of cloud computing data centers and meet the demand of large data exchange. Therefore, the solder balls and gaps of ultra-fine pitch components are getting smaller and smaller, and the SMT (surface mounting technology) assembly process technology is required to be updated and improved. SUMMARY

[0003] The purpose of the embodiment of the application is to provide a semiconductor-level flip chip surface mounting technology production process to meet the demand of high requirement of the SMT assembly process technology.

[0004] To achieve the above purpose, the technical scheme adopted by the embodiment of the application is:

[0005] The embodiment of the application provides a semiconductor-level flip chip surface mounting technology production process, and the production process comprises the following steps:

[0006] Obtaining a circuit board and a flip chip;

[0007] Printing first tin paste on the circuit board, and pasting the flip chip to the first tin paste on the circuit board;

[0008] Soldering the flip chip to the circuit board through a reflow soldering process;

[0009] Filling the bottom of the flip chip.

[0010] Beneficial effects of the embodiments of the present application: The semiconductor-level flip chip surface mounting technology production process provided in the embodiments of the present application adopts a flip chip that is reflow-soldered on a circuit board using a first solder paste, with the pads of the flip chip facing downward and connected to the circuit board by solder balls, thereby having a higher connection density and better electrical performance, and the pad spacing in the flip chip package can be smaller, thereby achieving higher integration and faster signal transmission speed; and, by filling the bottom of the flip chip, the filler can enhance the mechanical adhesion between the flip chip and the circuit board, and can effectively reduce the probability of the flip chip falling off the circuit board or the soldering point loosening due to external force or temperature changes; and the filler can help effectively conduct the heat from the bottom of the flip chip to the circuit board, reducing the negative impact of heat accumulation on the performance and life of the flip chip; at the same time, the filler can also absorb the stress formed due to uneven thermal expansion, thereby reducing the probability of damage to the soldering point or flip chip.

[0011] In some embodiments, after the steps of printing a first solder paste on the flip chip and attaching the flip chip to the first solder paste portion of the circuit board, the method further includes:

[0012] Use X-ray to check if the flip chip is offset from the board.

[0013] In some embodiments, after the step of soldering the flip chip to the circuit board through a reflow process, the method further includes:

[0014] Use X-ray to inspect the soldering status of flip chips to circuit boards.

[0015] In some embodiments, after the step of inspecting the soldering status of the flip chip to the circuit board using X-rays, the method further includes:

[0016] Flip chip inspection using 3D X-ray.

[0017] In some embodiments, after the step of filling the bottom of the flip chip, the method further includes:

[0018] Flip chip inspection using 3D X-ray.

[0019] In some embodiments, the steps of obtaining a circuit board and flip-chip include:

[0020] Inspect incoming circuit boards;

[0021] Inspect incoming flip chip materials.

[0022] In some embodiments, before the steps of printing a first solder paste on a circuit board and attaching a flip chip to the first solder paste portion of the circuit board, the method further includes:

[0023] performing a first component placement and soldering of first components on a bottom side of the circuit board.

[0024] In some embodiments, the step of performing a first component placement and soldering of first components on a bottom side of the circuit board comprises:

[0025] printing a second solder paste on the bottom side of the circuit board and inspecting the quality of the second solder paste printing;

[0026] performing a first component placement on the bottom side of the circuit board;

[0027] automatically inspecting the bottom side of the circuit board for defects using a camera and optical sensors prior to soldering;

[0028] soldering the first components to the bottom side of the circuit board using a reflow soldering process;

[0029] automatically inspecting the bottom side of the circuit board for defects using a camera and optical sensors after soldering;

[0030] inspecting the quality of the soldering on the bottom side of the circuit board.

[0031] In some embodiments, the step of printing a first solder paste on the circuit board and flip chip placement on the first solder paste of the circuit board comprises:

[0032] printing a first solder paste on a top side of the circuit board;

[0033] flip chip placement on the first solder paste of the top side of the circuit board;

[0034] prior to the step of soldering the flip chip on the circuit board using a reflow soldering process, further comprising:

[0035] printing a third solder paste on the top side of the circuit board and inspecting the quality of the third solder paste printing;

[0036] performing a second component placement on the top side of the circuit board, the second component placement on the third solder paste of the top side of the circuit board;

[0037] soldering the flip chip and the second component on the circuit board using a reflow soldering process.

[0038] In some embodiments, the step of soldering the flip chip and the second component on the circuit board using a reflow soldering process comprises:

[0039] automatically inspecting the top side of the circuit board for defects using a camera and optical sensors prior to soldering;

[0040] soldering the second component and the flip chip on the top side of the circuit board using a reflow soldering process;

[0041] automatically inspecting the top side of the circuit board for defects using a camera and optical sensors after soldering;

[0042] Check the soldering quality on the top surface of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0044] Figure 1 A flowchart of the steps of a semiconductor-level flip-chip surface mount technology production process provided in an embodiment of the present application;

[0045] Figure 2 A flowchart of the steps of another semiconductor-level flip-chip surface mounting technology production process provided in an embodiment of the present application. DETAILED DESCRIPTION

[0046] The following describes in detail embodiments of the present application, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0047] In the description of this application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0048] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0049] In this application, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components or interactions between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on specific circumstances.

[0050] As optical module transmission evolves toward higher speeds and greater bandwidth, traditional bonding processes (the process of attaching electronic components, chips, etc., to substrates) are no longer suitable for the high speeds and bandwidths required by 5G. The introduction of high-speed optical modules will further reduce latency associated with insufficient network capacity in new 5G applications. In particular, in cloud computing and big data, 800G, 1.6T, and 3.2T high-speed optical modules will continue to drive the construction of cloud computing data centers, meeting their massive data exchange needs. Consequently, the solder balls and gaps of ultra-fine-pitch components are shrinking, placing new and higher demands on SMT (surface mount technology) assembly processes.

[0051] Based on the above considerations, in order to solve the problem of putting forward newer and higher requirements for SMT (surface mount technology) assembly process technology, a semiconductor-level flip chip surface mount technology production process is designed. This process uses a flip chip to be soldered on a circuit board using solder paste reflow soldering. The flip chip's pads face down and are soldered to the circuit board through solder balls, thereby having a higher connection density and better electrical performance, and the pad spacing in the flip chip package can be smaller, thereby achieving higher integration and faster signal transmission speed; and, by filling the bottom of the flip chip, the filler can enhance the mechanical adhesion between the flip chip and the circuit board, and can effectively reduce the probability of the flip chip falling off the circuit board or the soldering point loosening due to external force or temperature changes; and the filler can help effectively conduct the heat from the bottom of the flip chip to the circuit board, reducing the negative impact of heat accumulation on the performance and life of the flip chip; at the same time, the filler can also absorb the stress formed by uneven thermal expansion, thereby reducing the probability of damage to the soldering point or flip chip.

[0052] The following will introduce in detail a semiconductor-level flip chip surface mounting technology production process provided by the present application based on specific embodiments.

[0053] Please refer to Figure 1 The embodiment of the present application provides a semiconductor-level flip-chip surface mount technology production process, the production process comprising:

[0054] S100, obtaining a circuit board and a flip chip;

[0055] S200, printing a first solder paste on a circuit board, and attaching a flip chip to the first solder paste portion of the circuit board;

[0056] S300, soldering the flip chip to the circuit board through a reflow process;

[0057] S400 , filling the bottom of the flip chip.

[0058] A flip chip is a chip that is directly connected to a circuit board with its active surface (usually the circuit layer) facing downward. By connecting the flip chip's solder points (usually metal balls or solder) directly to the pads on the circuit board, the overall size can be effectively reduced, and heat dissipation and performance can be improved.

[0059] In step S200, the first solder paste is a paste-like substance made from a mixture of solder powder and flux to help achieve good electrical and mechanical connections during the soldering process. When printing the first solder paste, it is necessary to ensure the uniformity of the solder paste to reduce the occurrence of poor solder joints and other defects during subsequent soldering.

[0060] In step S300 , when the flip chip is soldered through a reflow process, the solder in the first solder paste melts during the reflow process, thereby forming a firm mechanical connection.

[0061] By directly soldering the flip chip's solder points to the circuit board, the package can be made more compact to meet the needs of high-density, highly integrated circuit designs. At the same time, since the lead length is reduced, the signal transmission delay is lower.

[0062] In step S400 , the filler used to fill the bottom of the flip chip may be, but is not limited to, resin or epoxy resin.

[0063] The primary purpose of filling the bottom of a flip chip is to provide additional mechanical support, preventing damage to the solder joints caused by thermal expansion and contraction during use. Because flip chips have small solder joints and are susceptible to external forces or temperature fluctuations, fillers can effectively strengthen these joints and reduce stress between the flip chip and the circuit board. Fillers also help dissipate heat, directing heat generated by the chip away, reducing the risk of chip overheating and improving the overall reliability and service life of the circuit board. Furthermore, fillers can enhance the long-term stability of the flip chip, protecting the solder joints from the effects of environmental factors such as mechanical shock, vibration, and temperature fluctuations.

[0064] The semiconductor-level flip chip surface mounting technology production process provided in the embodiment of the present application adopts a flip chip that is reflow-soldered on a circuit board using a first solder paste. The pads of the flip chip face downward and are soldered to the circuit board through solder balls, thereby having a higher connection density and better electrical performance, and the pad spacing in the flip chip package can be smaller, thereby achieving higher integration and faster signal transmission speed; and, by filling the bottom of the flip chip, the filler can enhance the mechanical adhesion between the flip chip and the circuit board, and can effectively reduce the probability of the flip chip falling off the circuit board or the soldering point loosening due to external force or temperature changes; and the filler can help effectively conduct the heat from the bottom of the flip chip to the circuit board, reducing the negative impact of heat accumulation on the performance and life of the flip chip; at the same time, the filler can also absorb the stress formed due to uneven thermal expansion, thereby reducing the probability of damage to the soldering point or flip chip.

[0065] Please refer to Figure 1 In some embodiments, after the steps of printing the first solder paste on the flip chip and attaching the flip chip to the first solder paste portion of the circuit board, the method further includes:

[0066] Use X-ray to check if the flip chip is offset from the board.

[0067] It should be understood that when attaching a flip chip to the first solder paste area of ​​a circuit board, the flip chip may shift. To reduce the likelihood of the flip chip shifting during attachment and affecting subsequent soldering operations, in this embodiment, X-rays can be used to inspect the flip chip for shifting during attachment to the circuit board. Subsequent soldering operations can then be performed on flip chips that have not shifted. This effectively reduces product defect rates.

[0068] Please refer to Figure 1 In some embodiments, after the step of soldering the flip chip to the circuit board through a reflow process, the method further includes:

[0069] Use X-ray to inspect the soldering status of flip chips to circuit boards.

[0070] It should be understood that after the welding operation, it is also necessary to use X-ray inspection to check the welding status of the flip chip to the circuit board to check its welding quality and whether there is any cold solder joint, etc. This can further ensure the welding quality of the flip chip and further reduce the defective rate of the product.

[0071] Please refer to Figure 1 , using X-rays to inspect the soldering status of the flip chip to the circuit board.

[0072] In some embodiments, after the step of inspecting the soldering status of the flip chip to the circuit board using X-rays, the method further includes:

[0073] Flip chip inspection using 3D X-ray.

[0074] In this embodiment, after using X-rays to inspect the soldering status of the flip chip to the circuit board, 3D X-rays can be used to further inspect the flip chip. 3D X-rays synthesize X-ray images from multiple angles to generate a 3D image with depth information, providing a more detailed and three-dimensional view. This facilitates further inspection of the flip chip's overall condition, ensuring its high reliability and performance.

[0075] Please refer to Figure 1 In some embodiments, after the step of filling the bottom of the flip chip, the method further includes:

[0076] Flip chip inspection using 3D X-ray.

[0077] In this embodiment, 3D X-rays can be used to check whether the filler is evenly distributed between the bottom of the flip chip and the solder joints, ensuring the absence of bubbles, voids, or uneven filling. Furthermore, the filler can be inspected to confirm complete cure and any uncured areas, thus preventing mechanical problems later caused by incomplete filling and effectively reducing product defect rates.

[0078] Please refer to Figure 1 In some embodiments, the steps of obtaining a circuit board and flip-chip include:

[0079] Inspect incoming circuit boards;

[0080] Inspect incoming flip chip materials.

[0081] In this embodiment, the incoming circuit board materials are inspected to ensure that the size and thickness of the circuit board meet the design requirements, thereby avoiding difficulties in subsequent welding or assembly due to size mismatch; at the same time, the conductivity and insulation of the circuit board are checked to ensure that the circuits on the circuit board will not have electrical problems such as open circuits and short circuits.

[0082] By inspecting the incoming flip chip materials, the size and packaging of the flip chip must meet the design specifications to ensure that they match the pads on the circuit board to avoid poor soldering or incorrect flip chip positioning; at the same time, it is necessary to check whether the flip chip is functional and ensure that there are no defects or damage to avoid failures in the later production process; it is also necessary to check whether the solder balls of the flip chip are uniform and whether there are any soldering defects, such as solder balls that are too large, too small, or bridging.

[0083] Please refer to Figure 1 In some embodiments, before the steps of printing a first solder paste on the circuit board and attaching the flip chip to the first solder paste portion of the circuit board, the method further includes:

[0084] The first component mounting and soldering operations are performed on the bottom surface of the circuit board.

[0085] In this embodiment, before performing flip chip placement, it is necessary to perform placement and soldering of a first component on the bottom surface of the circuit board, wherein the first component includes but is not limited to a resistor, a capacitor, a chip, and the like.

[0086] Please refer to Figure 1 In some embodiments, the step of performing the first component placement and soldering operations on the bottom surface of the circuit board includes:

[0087] Printing a second solder paste on the bottom surface of the circuit board and testing the quality of the second solder paste printing;

[0088] Performing a first component placement on the bottom surface of the circuit board;

[0089] Automatically inspect the bottom surface of the circuit board for defects using cameras and optical sensors before soldering;

[0090] soldering the first component to the bottom surface of the circuit board through a reflow soldering process;

[0091] Automatically inspect the bottom surface of the circuit board for defects after soldering using cameras and optical sensors;

[0092] Check the soldering quality of the bottom surface of the circuit board.

[0093] The quality of the second solder paste printing is detected, including but not limited to detecting the thickness, distribution and accuracy of the second solder paste, so as to ensure that the solder paste meets the requirements and reduce the defective rate of the first component patch and welding.

[0094] Before soldering, the bottom surface of the circuit board is automatically inspected for defects using cameras and optical sensors. For example, AOI (Automated Optical Inspection) can be performed. This technology automatically checks the PCB surface for defects using cameras and optical sensors. This technology can identify problems such as uneven solder paste printing, component misalignment, cold solder joints, and empty solder joints.

[0095] At the same time, after welding, the bottom surface of the circuit board is automatically inspected for defects using cameras and optical sensors, such as AOI inspection, to further inspect the soldered circuit board and identify problems such as uneven solder paste printing, component misalignment, cold solder joints, and empty solder joints.

[0096] In the step of inspecting the soldering quality of the bottom surface of the circuit board, for example, a VMI inspection (Visual Measurement Inspection) can be performed. This is an inspection of the soldered PCB using visual inspection or high-magnification cameras, with a focus on checking whether the soldering quality meets the standards. The main inspection points include: whether the solder paste is printed evenly, whether the solder joints are sufficient, and whether there are any soldering defects (such as cold solder joints, short circuits, empty solder joints, etc.).

[0097] The above-mentioned multiple inspection methods can effectively ensure the quality of the bottom surface of the circuit board after the first component is soldered.

[0098] Please refer to Figure 1 In some embodiments, the step of printing a first solder paste on a circuit board and attaching a flip chip to the first solder paste portion of the circuit board includes:

[0099] Printing the first solder paste on the top surface of the circuit board;

[0100] Mounting the flip chip to the first solder paste on the top surface of the circuit board;

[0101] Before the flip chip is soldered to the circuit board through the reflow process, it also includes:

[0102] Printing a third solder paste on the top surface of the circuit board and inspecting the quality of the third solder paste printing;

[0103] Performing a second component patch on the top surface of the circuit board, and patching the second component to the third solder paste on the top surface of the circuit board;

[0104] The flip chip and the second component are soldered to the circuit board through a reflow process.

[0105] In this embodiment, the first solder paste and the third solder paste can be printed on the top surface of the circuit board first, and then the quality of the first solder paste and the third solder paste can be tested respectively; then the flip chip and the second component can be mounted respectively to facilitate the subsequent overall welding operation on the top surface of the circuit board.

[0106] The second component mentioned above includes but is not limited to resistors, capacitors, chips and other components.

[0107] Inspect the quality of the third solder paste printing, including but not limited to the thickness, distribution and accuracy of the third solder paste, to ensure that the solder paste meets the requirements and reduce the defective rate of the second component patch and welding.

[0108] Please refer to Figure 1 In some embodiments, the step of soldering the flip chip and the second component to the circuit board through a reflow process includes:

[0109] Automatically inspect the top surface of the circuit board for defects using cameras and optical sensors before soldering;

[0110] soldering the second component and the flip chip to the top surface of the circuit board through a reflow soldering process;

[0111] Automatically inspect the top surface of the circuit board for defects after soldering using cameras and optical sensors;

[0112] Check the soldering quality on the top surface of the circuit board.

[0113] Before soldering, the top surface of the circuit board is automatically inspected for defects using cameras and optical sensors. For example, AOI inspection can be performed. This technology automatically checks the circuit board surface for defects using cameras and optical sensors. This technology can identify problems such as uneven solder paste printing, component misalignment, cold solder joints, and empty solder joints.

[0114] At the same time, after welding, the top surface of the circuit board is automatically inspected for defects using cameras and optical sensors, such as AOI inspection, to further inspect the soldered circuit board to identify problems such as uneven solder paste printing, component misalignment, cold solder joints, and empty solder joints.

[0115] In the step of inspecting the soldering quality of the top surface of the circuit board, for example, a VMI inspection can be performed; it is an inspection of the circuit board after soldering through visual inspection or high-magnification camera and other equipment, focusing on checking whether the soldering quality meets the standards. The main inspection points include: whether the solder paste printing is uniform, whether the solder joints are sufficient, and whether there are soldering defects (such as cold solder joints, short circuits, empty solder joints, etc.).

[0116] Through the above-mentioned multiple inspection methods, the quality of the circuit board after the second component and flip chip are soldered on the fixed surface can be effectively guaranteed.

[0117] Below, a semiconductor-level flip-chip surface mounting technology production process provided by the present application will be illustrated based on specific implementation methods.

[0118] Please refer to Figure 2 In some embodiments, a semiconductor-grade flip-chip surface mount technology production process includes the following steps:

[0119] S01. Obtain circuit boards and flip chips, inspect incoming circuit boards, and inspect incoming flip chips;

[0120] S02, printing a second solder paste on the bottom surface of the circuit board and testing the quality of the second solder paste printing;

[0121] S03, performing a first component patch on the bottom surface of the circuit board;

[0122] S04. Perform AOI inspection on the bottom surface of the circuit board before welding;

[0123] S05, soldering the first component to the bottom surface of the circuit board through a reflow soldering process;

[0124] S06. Perform AOI inspection on the bottom surface of the circuit board after welding;

[0125] S07. Perform VMI inspection on the bottom surface of the circuit board;

[0126] S08, printing a first solder paste on the top surface of the circuit board and inspecting the quality of the first solder paste printing;

[0127] S09, printing a third solder paste on the top surface of the circuit board and inspecting the quality of the third solder paste printing;

[0128] S10, performing a second component patch on the top surface of the circuit board, and patching the second component to the third solder paste on the top surface;

[0129] S11, attaching the flip chip to the first solder paste on the top surface of the circuit board;

[0130] S12, using X-ray to check whether the flip chip is offset from the circuit board;

[0131] S13. Perform AOI inspection on the top surface of the circuit board before welding;

[0132] S14, soldering the second component and the flip chip to the top surface of the circuit board through a reflow soldering process;

[0133] S15. Performing AOI inspection on the top surface of the circuit board after welding;

[0134] S16, using X-ray to inspect the soldering status of the flip chip to the circuit board;

[0135] S17. Check the welding quality of the top surface of the circuit board;

[0136] S18, inspecting the flip chip using three-dimensional X-rays;

[0137] S19, filling the bottom of the flip chip;

[0138] S20. Inspect the flip chip using three-dimensional X-rays.

[0139] It should be understood that the above steps are only the key steps in the production process of semiconductor-level flip-chip surface mounting technology. Conventional steps such as the baking step of the circuit board, the step of applying high-temperature glue protection to the circuit board, the step of ion contamination detection, the step of separating the boards, and the step of packaging are not reflected one by one in the above steps.

[0140] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A semiconductor-grade flip-chip surface mount technology production process, characterized by: The production process comprises: Obtain circuit boards and flip chips; Printing a first solder paste on the circuit board, and attaching the flip chip to the first solder paste on the circuit board; Soldering the flip chip to the circuit board through a reflow process; The bottom of the flip chip is filled.

2. The semiconductor-grade flip-chip surface mount technology production process according to claim 1, characterized in that: After the steps of printing the first solder paste on the flip chip and attaching the flip chip to the first solder paste on the circuit board, the method further includes: X-rays are used to check whether the flip chip is offset from being mounted on the circuit board.

3. The semiconductor-grade flip-chip surface mount technology production process according to claim 2, characterized in that: After the step of soldering the flip chip to the circuit board through a reflow process, the method further includes: The soldering state of the flip chip to the circuit board is inspected using X-rays.

4. The semiconductor-grade flip-chip surface mount technology production process according to claim 3, characterized in that: After the step of inspecting the soldering state of the flip chip to the circuit board using X-rays, the method further includes: The flip chip is inspected using three-dimensional X-ray.

5. The semiconductor-grade flip-chip surface mount technology production process according to claim 1, characterized in that: After the step of filling the bottom of the flip chip, the method further includes: The flip chip is inspected using three-dimensional X-ray.

6. The semiconductor-grade flip-chip surface mount technology production process according to any one of claims 1 to 5, characterized in that: The steps of obtaining the circuit board and the flip chip include: Inspecting the incoming circuit board materials; The flip chip incoming materials are inspected.

7. The semiconductor-grade flip-chip surface mount technology production process according to any one of claims 1 to 5, characterized in that: Before the step of printing the first solder paste on the circuit board and attaching the flip chip to the first solder paste on the circuit board, the method further includes: The first component mounting and welding operations are performed on the bottom surface of the circuit board.

8. The semiconductor-grade flip-chip surface mount technology production process according to claim 7, characterized in that: The step of performing a first component patching and soldering operation on the bottom surface of the circuit board includes: Printing a second solder paste on the bottom surface of the circuit board and testing the quality of the second solder paste printing; Performing a first component patch on the bottom surface of the circuit board; Automatically inspecting the bottom surface of the circuit board for defects using a camera and an optical sensor before soldering; Soldering the first component to the bottom surface of the circuit board through a reflow soldering process; After soldering, the bottom surface of the circuit board is automatically inspected for defects using a camera and an optical sensor; The soldering quality of the bottom surface of the circuit board is inspected.

9. The semiconductor-grade flip-chip surface mount technology production process according to claim 7, characterized in that: The step of printing a first solder paste on the circuit board and attaching the flip chip to the first solder paste on the circuit board includes: printing the first solder paste on the top surface of the circuit board; Mounting the flip chip on the first solder paste on the top surface of the circuit board; Before the step of soldering the flip chip to the circuit board through a reflow process, the method further includes: printing a third solder paste on the top surface of the circuit board and detecting the quality of the third solder paste printing; Performing a second component patch on the top surface of the circuit board, and patching the second component to the third solder paste on the top surface of the circuit board; The flip chip and the second component are soldered to the circuit board through a reflow process.

10. The semiconductor-grade flip-chip surface mount technology production process according to claim 9, characterized in that: The step of soldering the flip chip and the second component to the circuit board through a reflow process includes: Automatically inspecting the top surface of the circuit board for defects using a camera and an optical sensor before soldering; Soldering the second component and the flip chip to the top surface of the circuit board through a reflow soldering process; Automatically inspecting the top surface of the circuit board for defects using a camera and an optical sensor after soldering; The soldering quality of the top surface of the circuit board is inspected.

Images