Line laser measurement system and method for judging cutting yield and precision
By using the first and second line laser sensors to simultaneously scan opposite sides of the IC carrier, acquire data and simulate the cutting surface, the problems of large errors and low efficiency in CCD optical lens measurement are solved, and higher-precision and faster cutting surface measurement is achieved.
Patent Information
- Application Number
- CN202410395828.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-02
- Publication Date
- 2025-10-14
AI Technical Summary
When measuring the cut surface of an IC carrier board using an existing CCD optical lens, there are problems such as large errors in the bevel measurement results and low efficiency.
The first and second line laser sensors are used to scan the object to be measured on two opposite sides at the same time, acquire data and simulate the cutting surface through analysis and calculation modules to improve measurement accuracy and efficiency.
It achieves more accurate and faster cutting surface measurement, reduces bevel measurement errors, and improves production efficiency.
Smart Images
Figure CN120772142A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a line laser measurement system and a method for determining cutting yield and accuracy, and more particularly to a line laser measurement system and a method for determining cutting yield and accuracy that utilize a first and a second line laser sensor to simultaneously scan an object to be measured to obtain data.
[0002] Prior Art
[0003] The primary function of a typical IC carrier is to carry the IC, primarily protecting circuits, securing wiring, and dissipating excess heat. As a key component in the packaging process, it is crucial that the differences in the cut surfaces of its four sides (also known as cross-sectional differences) are relatively flat and smooth, without significant fluctuations. Conventional technology for measuring the bevel angle of a carrier's cut surface uses a single charge-coupled device (CCD) optical lens, moving it across the four sides of the carrier / object under test. Since the CCD simply converts images into digital signals, the simulated cut surfaces obtained using the CCD are quite rough for carriers with thicknesses of only 0.10mm to 0.36mm, resulting in significant errors in the resulting bevel angle measurements. Therefore, it is essential to obtain more accurate and faster simulated cut surfaces to reduce errors and shorten bevel angle measurement time.
[0004] Therefore, how to solve the problem of the rough simulated cutting surface of the carrier obtained by CCD is worth considering. In view of the shortcomings of the existing technology, the present invention was conceived after careful experiments and research. The following is a brief description of the present invention. Summary of the Invention
[0005] The line laser measurement system of the present invention is used to measure polygonal objects. The first and second line laser sensors simultaneously obtain data on two opposite sides to calculate the simulated cutting surface of the polygonal object, which can accelerate the collection of thickness difference and bevel angle information of the polygonal object.
[0006] The present invention relates to a line laser measurement system for measuring a first object to be measured, wherein the first object to be measured has a thickness direction and includes first, second, third, and fourth cutting surfaces, the first and second cutting surfaces being located on opposite sides of the first object to be measured. The line laser measurement system includes first and second line laser sensors and an analysis and calculation module. The first position of the first line laser sensor is a first reference position, which is located above the first cutting surface of the first object to be measured. The second line laser sensor is located above the second cutting surface of the first object to be measured, and the first and second line laser sensors are configured to simultaneously scan above the first and second cutting surfaces, respectively, to obtain first and second data parallel to the thickness direction. The analysis and calculation module is coupled to the first and second line laser sensors, wherein the analysis and calculation module is configured to simulate the first and second cutting surfaces of the first object to be measured based on the first and second data to obtain first and second simulated cutting surfaces.
[0007] According to one main technical perspective, the present invention provides a line laser measurement module for measuring an object under test, wherein the object under test includes a cut surface, and the line laser measurement module includes a line laser sensor. The line laser sensor is disposed above the cut surface and configured to emit a line laser toward the cut surface; obtain data of the cut surface; and provide the data to an analysis and calculation module, which then simulates the cut surface of the object under test based on the data to generate a simulated cut surface.
[0008] From another practical perspective, the present invention encompasses a line laser module for measuring whether the surface of an object under test is flat, comprising a laser emitter, a sensor module, and an analysis and calculation module. The laser emitter is positioned on one edge of the surface and emits a laser line perpendicular to the edge. The sensor module simultaneously senses multiple reflections of the laser line from the laser emitter at depths relative to the surface. The analysis and calculation module analyzes and calculates these multiple reflections to determine whether the surface is flat.
[0009] The present invention may also be a method for determining the yield and cutting accuracy of an object to be tested, using a line laser measurement system, wherein the line laser measurement system includes first and second line laser sensors, an analysis and calculation module, and a comparison module. The method includes cutting the object to be cut using a cutting machine to obtain a plurality of objects to be tested; moving the first and second line laser sensors above a specific object to be tested; causing the first and second line laser sensors to simultaneously obtain first and second data of the specific object to be tested, respectively; simulating first and second simulated cut surfaces of the specific object to be tested by the analysis and calculation module based on the first and second data; and comparing the first and second simulated cut surfaces with the specifications of the specific object to be tested by the comparison module to determine whether the specific object to be tested is a defective product. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Figure 1 1 is a three-dimensional schematic diagram of a tray and an object to be tested therein used in a preferred embodiment of the present invention;
[0011] Figure 2 Schematic diagram of the structure of a line laser measurement system according to a preferred embodiment of the present invention;
[0012] Figure 3 yes Figure 2 A three-dimensional diagram of a line laser sensor in a line laser measurement system shooting out a line laser;
[0013] Figure 4 yes Figure 2 A three-dimensional schematic diagram of the first and second line laser sensors mounted on a bracket;
[0014] Figure 5 yes Figure 1 A schematic three-dimensional diagram of the first and second simulated cutting surfaces of the object to be tested;
[0015] Figure 6 yes Figure 4 A bottom-up perspective diagram of the first and second line laser sensors;
[0016] Figure 7 is located in Figure 1 Schematic diagram of the oblique line between the top and bottom surfaces of the object to be measured;
[0017] Figure 8 yes Figure 1 Schematic diagram of an ideal cutting plane between the top and bottom surfaces of the object under test; and
[0018] Figure 9 It is the use of Figure 2 The system in the embodiment is used to obtain a schematic diagram of a simulated cutting line of a cutting machine for cutting an object to be cut. Implementation Method
[0019] The present invention can be used for products requiring measurement of the thickness of cut surfaces and the bevel angle of cut surfaces. Furthermore, the measured data can be further analyzed, and based on changes in the data, it can be used to determine matters that should have been noted in the previous process, such as the degree of wear of the blade used to cut the product or the precision setting during cutting (that is, when the blade is first used, since it has not yet been worn, a lower precision setting can naturally be used. However, as the blade is used for a longer time, its degree of wear increases, and the precision setting must be correspondingly increased). The present invention accelerates data collection efficiency by simultaneously acquiring data on two opposing sides. Furthermore, based on the different locations of multiple objects to be tested within a tray, the present invention can simultaneously scan an entire row of objects to be tested without changing the distance between the two sensors.
[0020] See also Figures 1 to 5 , which shows a method for measuring Figure 1 The line laser measurement system 20 of the first object to be measured 11 in the tray 10 shown in FIG. 1 , wherein the first object to be measured 11 has a Figure 3 The thickness direction (Z-axis direction) shown in FIG. 1 includes a first cutting surface 31, a second cutting surface 32, a third cutting surface 33 and a fourth cutting surface 34. The first and second cutting surfaces 31 and 32 are located on opposite sides of the first object to be measured 11. The line laser measurement system 20 includes Figure 4 The first line laser sensor 41 and the second line laser sensor 42 and the analysis and calculation module 21 are shown. The first position of the first line laser sensor 41 is the first reference position, and the first position is located above the first cutting surface 31 of the first object to be measured 11. The second line laser sensor 42 is located above the second cutting surface 32 of the first object to be measured 11, and the first and second line laser sensors 41, 42 are configured to scan simultaneously above the first and second cutting surfaces 31, 32 respectively to obtain first data and second data parallel to the thickness direction. The analysis and calculation module 21 is coupled to the first and second line laser sensors 41, 42, wherein the analysis and calculation module 21 is configured to simulate the first and second cutting surfaces 31, 32 of the first object to be measured 11 according to the first and second data to obtain the following: Figure 5 The first simulated cutting surface 61 and the second simulated cutting surface 62 are shown. In addition, the movement direction MD of the first and second line laser sensors 41, 42 is along the first side 351 and the second side 352 of the object 11 (i.e., the Y-axis direction) to obtain complete data of the first and second cutting surfaces 31, 32.
[0021] In the aforementioned embodiment, the third and fourth cutting surfaces 33 and 34 of the line laser measurement system 20 are located on opposite sides of the first object under test 11. The second position of the first line laser sensor 41 serves as a second reference position and is located above the third cutting surface 33 of the first object under test 11. The second line laser sensor 42 is located above the fourth cutting surface 34 of the first object under test 11. The first and second line laser sensors 41 and 42 are configured to scan above the third and fourth cutting surfaces 33 and 34, respectively, to obtain third and fourth data. The first and second line laser sensors 41 and 42 move along the third side 353 and the fourth side 354 of the object under test 11 (i.e., in the direction of the X-axis) to obtain complete data of the third and fourth cutting surfaces 33 and 34. The analysis and calculation module 21 is configured to simulate the third and fourth cutting surfaces 33 and 34 of the first object under test 11 based on the third and fourth data to obtain a third simulated cutting surface 63 and a fourth simulated cutting surface 64.
[0022] In the aforementioned embodiments, the line laser measurement system 20 further includes a comparison module 22 coupled to the analysis and calculation module 21, wherein the comparison module 22 is configured to compare the first and second simulated cutting surfaces 61, 62 or the third and fourth simulated cutting surfaces 63, 64 with the specifications of the first object under test 11 to determine whether the first object under test 11 is a defective product.
[0023] In the aforementioned embodiments, each line laser sensor 41, 42 in the line laser measurement system 20 emits a line laser 30 on each cutting surface 31-34. For a general ultra-high-precision in-line profile sensor, the number of profile data in each line laser can be as high as 3200. Each of the first to fourth data includes a plurality of heights of a plurality of points on each cutting surface 31-34, and the analysis and calculation module 21 is used to determine the height of each cutting surface 31-34 based on the plurality of heights. Figure 7 The angled lines 81 shown in FIG. 8 are arranged such that the distance between the plurality of points is 2.5 μm. The first object to be tested 11 is a polygonal object to be tested, such as a carrier board or a PCB. Figure 1 Although a quadrilateral is used as an example, in actual application, it can correspond to a specific polygonal object to be measured. The carrier is used to measure the necessary process control before the IC is installed in the future. The IC is usually connected to the carrier in a flip-chip manner. The first and second line laser sensors 41 and 42 have the following features: Figure 6 The respective sensor modules 71 and 72 are shown, and the sensor modules 71 and 72 are used to sense the multiple heights of the multiple points.
[0024] In the aforementioned embodiments, the first object to be measured 11 of the line laser measurement system 20 further includes a top surface 82 and a bottom surface 83. The bevel line 81 is a connecting line between the top surface 82 and the bottom surface 83, and the bevel line 81 forms an oblique angle θ with the thickness direction. The comparison module 22 is used to determine whether the oblique angle θ meets the specification. Figure 8 The ideal cutting surface 90 shown in FIG is a 90° vertical surface.
[0025] In the aforementioned embodiments, the first and second line laser sensors 41 and 42 of the line laser measurement system 20 are mounted on the bracket 73 in a non-coaxial positioning manner, and the scanning of the first object to be measured 11 is completed without changing the distance between the first and second line laser sensors 41 and 42, and the scanning of the second object to be measured 12 is continued.
[0026] From a primary technical perspective, the present invention is a line laser measurement module (e.g., a module including a first line laser sensor 41 and a sensor module 71) for measuring an object under test (e.g., a first object under test 11). The object under test includes a cut surface (e.g., a first cut surface 31), and the line laser measurement module includes a line laser sensor (e.g., a first line laser sensor 41). The line laser sensor is disposed above the cut surface and configured to emit a line laser 30 toward the cut surface, obtain data (e.g., the first data) of the cut surface, and provide the data to an analysis and calculation module 21, which then simulates the cut surface of the object under test 11 based on the data to obtain a simulated cut surface (e.g., a first simulated cut surface 61).
[0027] From another practical perspective, the present invention may encompass a line laser module for measuring whether a plane (e.g., first cutting surface 31) of an object under test 11 is flat, comprising a laser emitter (e.g., first line laser sensor 41), a sensor module 71, and an analysis and calculation module 21. The laser emitter is disposed on one edge of the plane (e.g., first edge 351) and emits a laser line (e.g., line laser 30) perpendicular to the edge. The sensor module 71 is configured to simultaneously sense multiple reflections of the laser line from the laser emitter at depths relative to the plane. The analysis and calculation module 21 is configured to analyze and calculate the multiple reflections to determine whether the plane is flat.
[0028] The present invention may also be a method for determining the yield and cutting accuracy of an object to be tested (e.g., a first object to be tested 11) using a line laser measurement system 20. The line laser measurement system 20 includes first and second line laser sensors 41 and 42, an analysis and calculation module 21, and a comparison module 22. The method includes cutting an object to be cut (e.g., a printed circuit board) using a cutting machine (not shown) to obtain a plurality of objects to be tested; moving the first and second line laser sensors 41 and 42 above a specific object to be tested (e.g., the first object to be tested 11); causing the first and second line laser sensors 41 and 42 to simultaneously acquire first and second data of the specific object to be tested, respectively; simulating first and second simulated cut surfaces 61 and 62 of the specific object to be tested by the analysis and calculation module 21 based on the first and second data; and comparing the first and second simulated cut surfaces 61 and 62 with the specifications of the specific object to be tested by the comparison module 22 to determine whether the specific object to be tested is a defective product.
[0029] In the aforementioned embodiment, the method further includes: after the first and second line laser sensors 41 and 42 obtain the first and second data, the analysis and calculation module 21 simulates the first and second simulated cutting surfaces 61 and 62 of the object to be measured, and obtains the cutting surface of the object to be cut by the cutting machine. Figure 9 and the comparison module 22 determines the cutting accuracy of the cutting machine according to the simulated cutting line 101 .
[0030] In summary, the present invention discloses a novel line laser measurement system that, through scanning with first and second line laser sensors and employing an analysis and calculation module, can simulate the first and second cut surfaces of the first object to be measured based on the first and second data to obtain first and second simulated cut surfaces. Therefore, the system has industrial value and thus achieves the intended purpose of developing the present invention.
[0031] Although the present invention is disclosed above with reference to preferred embodiments, it is not intended to limit the scope of the present invention. Any changes and modifications made by those skilled in the art without departing from the spirit and scope of the present invention should fall within the scope of the present invention.
[0032] Explanation of symbols
[0033] 10: Pallet
[0034] 11: First object to be tested
[0035] 12: Second DUT
[0036] 20: Line laser measurement system
[0037] 21: Analysis and calculation module
[0038] 22: Comparison module
[0039] 30: Line Laser
[0040] 31: First cutting surface
[0041] 32: Second cutting surface
[0042] 33: The third cutting surface
[0043] 34: Fourth cutting surface
[0044] 351: First side
[0045] 352: Second side
[0046] 353: The Third Side
[0047] 354: The Fourth Side
[0048] 41: First-line laser sensor
[0049] 42: Second line laser sensor
[0050] 61: First simulated cutting surface
[0051] 62: Second simulated cutting surface
[0052] MD: moving direction
[0053] 63: The third simulated cutting surface
[0054] 64: Fourth simulated cutting surface
[0055] 71, 72: Sensor module
[0056] 73: Bracket
[0057] 81: Bevel line
[0058] 82: Top
[0059] 83: Bottom
[0060] θ: angle
[0061] 90: Ideal cutting surface
[0062] 101: Simulate cutting line.
Claims
1. A line laser measurement system for measuring a first object to be measured, wherein the first object to be measured has a thickness direction and includes a first cutting surface, a second cutting surface, a third cutting surface, and a fourth cutting surface, wherein the first cutting surface and the second cutting surface are located on opposite sides of the first object to be measured, the line laser measurement system comprising: a first line laser sensor and a second line laser sensor, wherein a first position of the first line laser sensor is a first reference position, the first position being located above the first cut surface of the first object to be measured, and the second line laser sensor is located above the second cut surface of the first object to be measured, and the first line laser sensor and the second line laser sensor are configured to simultaneously scan above the first cut surface and the second cut surface, respectively, to obtain first data and second data parallel to the thickness direction; and An analysis and calculation module is coupled to the first line laser sensor and the second line laser sensor, wherein the analysis and calculation module is configured to simulate the first cutting surface and the second cutting surface of the first object to be measured according to the first data and the second data to obtain a first simulated cutting surface and a second simulated cutting surface.
2. The line laser measurement system according to claim 1, wherein the third cutting surface and the fourth cutting surface are located on opposite sides of the first object to be measured, a second position of the first line laser sensor is a second reference position, the second position is located above the third cutting surface of the first object to be measured, the second line laser sensor is located above the fourth cutting surface of the first object to be measured, and the first line laser sensor and the second line laser sensor are configured to scan above the third cutting surface and the fourth cutting surface respectively to obtain third data and fourth data, and the analysis and calculation module is configured to simulate the third cutting surface and the fourth cutting surface of the first object to be measured based on the third data and the fourth data to obtain a third simulated cutting surface and a fourth simulated cutting surface.
3. The line laser measurement system according to claim 2, further comprising a comparison module coupled to the analysis and calculation module, wherein the comparison module is configured to compare the first simulated cutting surface and the second simulated cutting surface or the third simulated cutting surface and the fourth simulated cutting surface with a specification of the first object to be measured to determine whether the first object to be measured is a defective product.
4. The line laser measurement system according to claim 2, wherein each of the line laser sensors emits a line of laser light on each of the cutting surfaces, each of the first to fourth data includes a plurality of heights of a plurality of points on each of the cutting surfaces, and the analysis and calculation module is used to determine a bevel line of each of the cutting surfaces based on the plurality of heights, a distance of 2.5 μm between the plurality of points, the first object to be measured is a polygonal object to be measured, the polygonal object to be measured being a carrier board, a PCB, or a specific polygonal object to be measured, and the first and second line laser sensors each have a sensor module to sense the plurality of heights of the plurality of points.
5. The line laser measurement system of claim 4 , wherein the first object to be measured further comprises a top surface and a bottom surface, the bevel line is a connecting line between the top surface and the bottom surface, and the bevel line forms an oblique angle with the thickness direction, and the comparison module is used to determine whether the bevel angle meets the specification.
6. The line laser measurement system according to claim 1 , wherein the first line laser sensor and the second line laser sensor are mounted on a bracket in a coaxial positioning manner, and the scanning of the first object to be measured and the second object to be measured are completed without changing the distance between the first line laser sensor and the second line laser sensor.
7. A line laser measurement module for measuring an object to be measured, wherein the object to be measured includes a cut surface, and the line laser measurement module comprises: A line laser sensor is disposed above the cutting surface, wherein the line laser sensor is configured to: emitting a line of laser light to the cutting surface; Obtaining data of one of the cutting surfaces; and The data is provided to an analysis and calculation module, so that the analysis and calculation module simulates the cutting surface of the object to be measured according to the data to obtain a simulated cutting surface.
8. A line laser module for measuring whether a plane of an object to be measured is level, comprising: a laser emitter, disposed on one side of the plane, for emitting a laser line in a direction perpendicular to the side; a sensor module for simultaneously sensing a plurality of reflections of the laser line from the laser emitter at depths relative to the plane; as well as An analysis and calculation module is used to analyze and calculate the multiple reflections to determine whether the plane is a flat plane.
9. A method for determining a yield rate and a cutting accuracy setting of an object to be measured, using a line laser measurement system, wherein the line laser measurement system includes a first line laser sensor and a second line laser sensor, an analysis and calculation module, and a comparison module, and the method comprises: A cutting machine cuts an object to be cut to obtain multiple objects to be tested; Moving the first line laser sensor and the second line laser sensor to above a specific object to be measured; The first line laser sensor and the second line laser sensor are configured to respectively obtain first data and second data of the specific object to be measured simultaneously; The analysis and calculation module simulates a first simulated cutting surface and a second simulated cutting surface of the specific object to be tested according to the first data and the second data; and The comparison module compares the first simulated cutting surface and the second simulated cutting surface with a specification of the specific object to be tested to determine whether the specific object to be tested is a substandard product.
10. The method according to claim 9, further comprising: After the first line laser sensor and the second line laser sensor obtain the first data and the second data, the analysis and calculation module simulates the first simulated cutting surface and the second simulated cutting surface of each object to be measured, and obtains a simulated cutting line of the object to be cut by the cutting machine; and The comparison module determines the cutting accuracy of the cutting machine according to the simulated cutting line.