Disk laser cutting, chamfering and splitting method

Abstract

The invention provides a disc laser cutting, chamfering and splitting method, and relates to the technical field of glass product processing, and the method comprises the following steps: carrying out annular shape cutting on a to-be-processed glass raw material by using Bessel laser, and determining a mark point at the center of the to-be-processed glass raw material; according to the marking points, a camera is used for marking and positioning, and coordinate values of chamfering are obtained; performing laser chamfering on the current glass raw material according to the chamfering coordinate value to obtain a chamfered workpiece; the chamfered workpiece is sequentially moved below an outer ring heating block and an inner ring heating block, outer ring waste materials and inner ring waste materials sequentially and automatically fall off through the thermal expansion and cold contraction effect, and the finished annular glass piece is obtained. The problems of high glass processing cost, poor precision and environmental pollution in the prior art are solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of glass product processing, in particular to a disc laser cutting and chamfering method. BACKGROUND

[0002] The existing glass processing method is: laser cutting and CNC chamfering. Laser cutting and chamfering is performed on the outer shape of the ring-shaped or circular product, and the ring-shaped or circular product is obtained. The product is transferred to the CNC section, and the outer circle and the inner circle are chamfered by CNC; laser cutting and laser chamfering. Laser first performs bottom grooving and processes a mark point at the center of the product, a camera captures the mark point for cutting and splitting, and the camera captures the mark point for front chamfering; laser cutting and etching splitting. Laser spot completes the shape and edge cutting at one time, and then hydrofluoric acid or sodium hydroxide is used for etching splitting.

[0003] The above processing method has the following problems:

[0004] The CNC chamfering efficiency is slow, and five to eight CNC devices need to be matched with one laser device for chamfering. With the wear of the tool, continuous correction is required, which causes waste of space, increase of equipment cost, and increase of labor cost. In a limited space, high productivity cannot be achieved.

[0005] After laser chamfering, the product is cut and split by the mark point, and then chamfered by the mark point. The whole processing process is positioned twice by the camera and the product is moved multiple times. Multiple camera positioning and product movement will affect the positioning accuracy, causing the problem of inconsistent chamfering on both sides and offset of chamfering on the same side. It cannot meet the demand of high-precision chamfering. The precision is lower than that of CNC, and it is difficult to realize the cutting and chamfering of ring-shaped products.

[0006] Laser cutting and etching splitting cannot change the product thickness, chamfering size and shape at will, and need to etch the splitting with acid or alkali, which pollutes the environment. SUMMARY

[0007] In order to overcome the shortcomings of the prior art, the purpose of the present application is to provide a disc laser cutting and chamfering method, which solves the problems of high cost, low precision and environmental pollution in the prior art.

[0008] To achieve the above purpose, the present application provides the following scheme:

[0009] A disc laser cutting and chamfering method, comprising:

[0010] The ring-shaped outer shape of the glass raw material to be processed is cut by a Bessel laser, and a mark point is determined at the center of the glass raw material to be processed;

[0011] According to the mark point, a camera is used for mark positioning to obtain the coordinate value of chamfering.

[0012] According to the coordinate value of the chamfering, laser chamfering is performed on the current glass raw material to obtain a chamfered workpiece;

[0013] The chamfered workpiece is sequentially moved under the outer ring heating block and the inner ring heating block, and the outer ring waste and the inner ring waste are sequentially and automatically separated from the chamfered workpiece by using the thermal expansion and contraction effect to obtain a finished annular glass piece.

[0014] Preferably, the mark point comprises:

[0015] A circle or a cross.

[0016] Preferably, the laser chamfering comprises:

[0017] Laser front chamfering and laser back chamfering.

[0018] A disc laser cutting and chamfering device, the device comprises:

[0019] A laser cutting unit for emitting a Bessel laser to cut the outer shape of the glass raw material and determine a mark point in the center of the glass raw material;

[0020] A visual positioning unit for positioning the mark by using a camera to obtain the coordinate value of the chamfering;

[0021] A picosecond laser chamfering unit for performing laser chamfering on the current glass raw material according to the coordinate value of the chamfering to obtain a chamfered workpiece;

[0022] A thermal cracking unit for sequentially and automatically separating the outer ring waste and the inner ring waste from the chamfered workpiece by using the outer ring heating block and the inner ring heating block and the thermal expansion and contraction effect to obtain a finished annular glass piece;

[0023] A stage unit for moving the workpiece in the machining process.

[0024] The picosecond laser chamfering unit comprises:

[0025] A picosecond laser, a beam expander, a mirror, a galvanometer and a field lens;

[0026] The picosecond laser is used to generate a picosecond laser, and the picosecond laser comprises a green picosecond laser or an infrared picosecond laser, the beam expander is used to expand the picosecond laser, the mirror is used to reflect the expanded laser to obtain reflected laser and enter the galvanometer, the galvanometer is used to control the path of the reflected laser by rotating and focus the current laser by using the field lens to perform laser chamfering.

[0027] The present application discloses the following technical effects:

[0028] The application provides a disc laser cutting chamfering and splitting method, which comprises the following steps: cutting the annular shape of a glass raw material to be processed by using a Bessel laser and determining a mark point in the center of the glass raw material to be processed; positioning the mark by using a camera according to the mark point to obtain the coordinate value of the chamfering; performing laser chamfering on the current glass raw material according to the coordinate value of the chamfering to obtain a workpiece after chamfering; and moving the workpiece after chamfering into the outer ring heating block and the inner ring heating block in sequence, and making the outer ring waste material and the inner ring waste material automatically fall off in sequence by using the thermal expansion and cold shrinkage effect to obtain a finished annular glass piece. The application improves the chamfering efficiency and precision, and has no pollution except a small amount of dust. The application can meet the cutting and chamfering of annular or circular products. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings described below only show some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0030] Figure 1 The application provides a disc laser cutting chamfering and splitting method flow chart. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments only show some embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0032] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0033] As shown in Figure 1 The application provides a disc laser cutting chamfering and splitting method, which comprises the following steps:

[0034] Step 100: cutting the annular shape of a glass raw material to be processed by using a Bessel laser and determining a mark point in the center of the glass raw material to be processed;

[0035] Step 200: positioning the mark by using a camera according to the mark point to obtain the coordinate value of the chamfering;

[0036] Step 300: performing double-sided or single-sided laser chamfering on the current glass raw material according to the coordinate value of the chamfering to obtain a workpiece after chamfering;

[0037] According to the coordinate value of the chamfer, the current glass raw material is chamfered on both sides by laser, the bottom surface can be chamfered first, and then the front surface is chamfered by improving the focal point to obtain the chamfered workpiece; or the surface can be chamfered first, then the surface is turned over, and the second surface is chamfered after camera positioning to obtain the chamfered workpiece (the positioning accuracy of the two surfaces after turning over is slightly poor).

[0038] Step 400: The chamfered workpiece is sequentially moved into the outer ring heating block and the inner ring heating block, and the outer ring waste and the inner ring waste are sequentially and automatically separated by the thermal expansion and cold shrink effect to obtain a finished annular glass piece.

[0039] Specifically, laser cutting: the computer control platform cuts the annular shape on the raw material by using the Bessel laser beam according to the drawing, and cuts a mark point in the product center waste area, which can be a "circle" or a "cross" shape.

[0040] Camera positioning: the cut product is moved to the camera by the stage adsorption, the camera is positioned by the "circle" or "cross" mark point, the coordinate value of the chamfer is calculated, and the stage is moved to the coordinate value for chamfering.

[0041] Laser back chamfering: the laser generated by the green light or infrared picosecond laser passes through the beam expander, is reflected by the reflector, and enters the galvanometer; the computer controls the rotation of the lens in the galvanometer according to the preset chamfering drawing and parameters to make the laser move according to the preset trajectory; the field lens is connected to the galvanometer, and the laser is focused on the product surface by the field lens to realize processing; in order to realize the chamfering of the upper and lower surfaces without turning over and ensure the penetration of the laser, the focal point is first controlled to act on the lower surface to complete the chamfering of the lower surface.

[0042] Laser front chamfering: the focal point position is improved, and the upper surface chamfering is completed according to the preset trajectory and parameters.

[0043] Fragmentation: the thermal cracking device is composed of an outer ring heating block and an inner ring heating block. The two parts can be independently operated by computer control, and the temperature, depression height and action time of the two parts can be independently controlled. The stage moves the product with chamfered two surfaces to the outer ring or inner ring heating block, starts the preset program, and the outer ring or inner ring heating block heats the product according to the preset program. The product forms a temperature difference due to the action of the heating block, and the outer ring or inner ring waste falls off according to the principle of thermal expansion and cold shrinkage, and the outer ring or inner ring fragmentation is completed. The stage moves the product with completed outer ring or inner ring fragmentation to the other heating block, and completes the fragmentation according to the same method to obtain an annular product.

[0044] The embodiment also provides a disc laser cutting, chamfering and fragmentation device, which comprises:

[0045] The laser cutting unit is used for emitting a Bessel laser to perform annular contour cutting on the glass raw material to be processed and determine a mark point at the center of the glass raw material to be processed.

[0046] The visual positioning unit is used for mark positioning by using a camera to obtain the coordinate value of the chamfering.

[0047] The picosecond laser chamfering unit is used for laser chamfering of the current glass raw material according to the coordinate value of the chamfering to obtain a workpiece after chamfering.

[0048] The hot splitting unit is used for automatically making the outer circle waste and the inner circle waste fall off in sequence according to the outer circle heating block and the inner circle heating block and by using the thermal expansion and cold shrinkage effect to obtain a finished annular glass piece.

[0049] The stage unit is used for moving the workpiece in the processing process.

[0050] Further, the picosecond laser chamfering unit comprises:

[0051] A picosecond laser, a beam expander, a mirror, a galvanometer and a field lens.

[0052] The picosecond laser is used for generating a picosecond laser, which comprises green light picosecond laser or infrared picosecond laser. The beam expander is used for expanding the picosecond laser. The mirror is used for reflecting the expanded laser to obtain reflected laser and enter the galvanometer. The galvanometer is used for controlling the path of the reflected laser by rotating and focusing the current laser by using the field lens to perform laser chamfering.

[0053] Specifically, the entire device is controlled by a computer. The raw material is placed on the stage. First, the stage is moved to the cutting station. According to the drawing preset on the computer, the annular product is processed on the raw material by using the Bessel laser cutting glass principle. A circular mark point is processed in the center of the waste area of the product. After cutting, the stage adsorbs the cut product and moves to the CCD. The product is positioned according to the circular mark point to obtain the chamfering coordinate.

[0054] The stage adsorbs the product and moves to the chamfering coordinate position. The chamfering laser is an infrared picosecond laser. The galvanometer chamfering mode of the picosecond laser and the galvanometer system is used to change the focal point position to perform the lower surface chamfering. The lower surface

[0055] After the chamfering is completed, the focal point position is raised to perform the upper surface chamfering. The CCD positioning can ensure that the cutting track is in the center of the chamfering track.

[0056] Once positioning and moving the stage can effectively reduce the positioning error caused by multiple positioning and moving the stage. After the cutting and chamfering of both surfaces are completed, the stage is moved to the splitting station. The splitting station has two groups of heating blocks. According to the principle of thermal expansion and cold shrinkage, the heating blocks heat the outer circle and the inner circle of the annular product in sequence. The remaining material falls off automatically. Finally, the product is formed.

[0057] The various embodiments described in this specification are presented for the purpose of illustrating the principles of the application and its best mode of operation. Each of the embodiments described in this specification are presented for the purpose of illustrating the various aspects of the application, and the embodiments are not intended to limit the scope of the application.

[0058] The principles and implementations of the present application are described in the above embodiments, which are used to help understand the method and its core idea of the present application. Meanwhile, for those skilled in the art, the specific implementation and application range of the present application can be changed according to the idea of the present application. In summary, the content of the specification should not be understood as a limitation of the present application.

Claims

1. A method for laser cutting chamfered discs, characterized in that: include: Use Bessel laser to cut the glass material to be processed into a circular shape and determine the marking point in the center of the glass material to be processed; According to the marking points, a camera is used to mark and locate the points to obtain the coordinate values ​​of the chamfers; Laser chamfering the current glass raw material according to the coordinate values ​​of the chamfer to obtain a chamfered workpiece; The chamfered workpiece is moved under the outer ring heating block and the inner ring heating block in turn, and the outer ring waste and the inner ring waste are automatically dropped off in turn by utilizing the thermal expansion and contraction effect to obtain a finished annular glass piece.

2. A method for laser cutting chamfered discs according to claim 1, characterized in that: The marking points include: Circular or cross-shaped.

3. The method for laser cutting chamfered discs according to claim 1, characterized in that: The laser chamfering comprises: Laser front chamfering and laser back chamfering.

4. A device for laser cutting and chamfering a disc, applied to the method according to any one of claims 1 to 3, characterized in that: The device comprises: A laser cutting unit, used for emitting a Bessel laser to cut the glass material to be processed into a circular shape and to determine a marking point at the center of the glass material to be processed; A visual positioning unit is used to use a camera to perform marking positioning and obtain the coordinate value of the chamfer; A picosecond laser chamfering unit, configured to laser chamfer the current glass raw material according to the coordinate values ​​of the chamfer to obtain a chamfered workpiece; The thermal splitting unit is used to automatically fall off the outer ring waste and the inner ring waste in sequence by utilizing the thermal expansion and contraction effects according to the outer ring heating block and the inner ring heating block to obtain the finished annular glass piece; The stage unit is used to shift the workpiece during the processing.

5. The disc laser cutting and chamfering device according to claim 4, characterized in that: The picosecond laser chamfering unit comprises: Picosecond laser, beam expander, reflector, galvanometer and field mirror; The picosecond laser is used to generate picosecond laser, which includes: green light picosecond laser or infrared picosecond laser. The beam expander expands the picosecond laser, and the reflector reflects the expanded laser to obtain reflected laser and enter the galvanometer. The galvanometer is used to control the path of the reflected laser by rotation and use the field lens to focus the current laser to perform laser chamfering.

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