Power supply device for heating device, heating device and refrigeration appliance

Abstract

The invention relates to a power supply device for a heating device. The power supply device comprises at least two functional modules; the radiator comprises radiating fins and wall parts extending in the flowing direction of radiating airflow, the wall parts comprise a first wall part and a second wall part, and the second wall part is transverse to the first wall part when viewed in a section perpendicular to the flowing direction; wherein the inner cavity of the power supply equipment is divided into at least three air channels by the first wall part and the second wall part, and at least two of the at least three air channels are configured to be suitable for correspondingly accommodating the at least two functional modules of the power supply equipment. The invention further relates to a corresponding heating device and a refrigeration appliance. The power supply device has the advantages that heat dissipation power distribution which is as appropriate as possible can be provided in a limited space, so that different heat dissipation requirements of each module of the power supply device for the heating device, especially the radio frequency heating device, can be met.

Description

TECHNICAL FIELD

[0001] The present application relates to a power supply device for a heating device, a heating device and a refrigeration appliance. BACKGROUND

[0002] The power supply device of a heating device, especially a radio frequency heating device, comprises a plurality of functional modules. These functional modules are usually installed in a tiled manner, thus occupying a large space. In addition, different functional modules usually have different heat generation amounts, thus requiring separate heat dissipation channels, resulting in high cost of the power supply device. SUMMARY

[0003] It is an object of embodiments of the present application to provide an improved power supply device, an improved heating device and an improved refrigeration appliance.

[0004] According to a first aspect of the present application, embodiments of the present application provide a power supply device for a heating device, the power supply device comprising:

[0005] at least two functional modules;

[0006] a heat sink comprising fins and a wall portion extending along a flow direction of a heat dissipation airflow, the wall portion comprising a first wall portion and a second wall portion, the second wall portion being transverse to the first wall portion as seen in a cross section perpendicular to the flow direction;

[0007] wherein the inner cavity of the power supply device is partitioned into at least three air channels by the first wall portion and the second wall portion, at least two of the at least three air channels being configured to accommodate the at least two functional modules of the power supply device, respectively.

[0008] By the first wall portion and the second wall portion, it is convenient to partition a plurality of air channels in the inner cavity of the power supply device and accommodate the functional modules in appropriate air channels.

[0009] According to an optional embodiment of the present application, the at least two air channels have different through-flow cross-sectional areas. Thus, appropriate air volume is allocated to different functional modules to ensure normal operation of the functional modules.

[0010] According to an optional embodiment of the present application, the at least two functional modules comprise a first module and a second module, the first module having a higher heat dissipation requirement than the second module.

[0011] According to an optional embodiment of the present application, the at least three air channels comprise exactly three air channels.

[0012] According to an optional embodiment of the present application, the power supply device has a height direction and a width direction, the height direction, the width direction and the flow direction being perpendicular to each other.

[0013] According to an optional embodiment of the present application, the first module comprises a radio frequency circuit board module, and the second module comprises a power supply circuit board module and a control circuit board module.

[0014] According to an optional embodiment of the present application, the first module is configured in a single-sided panel, in which case the electronic components of the first module are connected to only one side of the circuit board of the first module. Thus, the other side of the first module can be used for heat conduction cooling.

[0015] According to an optional embodiment of the present application, the second module is configured in a double-sided panel, in which case electronic components are provided on both sides of the circuit board of the second module. Since the cooling requirement of the second module is not as high, cooling by heat convection is sufficient, and by configuring the second module in a double-sided panel, the second module can be made as compact as possible while meeting the cooling requirement.

[0016] According to an optional embodiment of the present application, the three air ducts comprise a first air duct below in the height direction of the power supply device, a second air duct above the first air duct, and a third air duct, the second air duct and the third air duct being side by side in the width direction of the power supply device. Thus, the three functional modules are stably and stereoscopically laid in the three air ducts.

[0017] According to an optional embodiment of the present application, the power supply device comprises an air duct cover for covering the air duct of the first module. Thus, air leakage is advantageously prevented.

[0018] According to an optional embodiment of the present application, the first wall portion comprises a first outer vertical wall portion, a second outer vertical wall portion, and an intermediate vertical wall portion extending in a vertical plane, the second wall portion comprises a first horizontal wall portion and a second horizontal wall portion extending in a horizontal plane, the first horizontal wall portion being connected between the first outer vertical wall portion and the intermediate vertical wall portion, and the second horizontal wall portion being connected between the intermediate vertical wall portion and the second outer vertical wall portion. Thus, the three air ducts arranged stereoscopically are formed in a simple structure.

[0019] According to an optional embodiment of the present application, at least one of the wall portions forms a cooling wall portion, the cooling wall portion being provided with cooling fins on a first side, and a second side opposite to the first side of the cooling wall portion being configured to be adapted to abut a surface of the circuit board of the first module which is not used for arranging electronic components. Thus, the first module with higher cooling requirement can be efficiently cooled in a heat conduction manner.

[0020] According to an optional embodiment of the present application, the first module comprises a main heat generating device, and the circuit board of the first module has a notch through which the main heat generating device is directly attached to the heat dissipation wall. In this way, the main heat generating device of the first module is particularly efficiently cooled.

[0021] According to an optional embodiment of the present application, the three air ducts are respectively used for accommodating the power supply circuit board module, the radio frequency circuit board module and the control circuit board module.

[0022] According to an optional embodiment of the present application, the first outer vertical wall, the second outer vertical wall and the intermediate vertical wall are flush at the top end. In this way, it is advantageous to form a cuboid.

[0023] According to an optional embodiment of the present application, the height of the second outer vertical wall is greater than the height of the first outer vertical wall, and the height of the first outer vertical wall is greater than the height of the intermediate vertical wall. In this way, the first outer vertical wall can be directly used to form the housing of the power supply device and make the structure of the power supply device stable.

[0024] According to an optional embodiment of the present application, a first heat dissipation fin is arranged on the lower side of the first horizontal wall.

[0025] According to an optional embodiment of the present application, a second heat dissipation fin is arranged on the lower side of the second horizontal wall.

[0026] According to an optional embodiment of the present application, the first horizontal wall is higher than the second horizontal wall. In this way, a heat dissipation fin with a longer height can be arranged on the first side of the second air duct.

[0027] According to an optional embodiment of the present application, the first air duct is used for accommodating the power supply circuit board module, the second air duct is used for accommodating the radio frequency circuit board module, and the third air duct is used for accommodating the control circuit board module.

[0028] According to an optional embodiment of the present application, the air duct for accommodating the first module is smaller than the air duct for accommodating the second module. Since the first module has already adopted the efficient cooling method of single-sided board and direct heat conduction, the air duct for the first module does not need to be designed too large, and more flow area can be left for the second module.

[0029] According to an optional embodiment of the present application, the heat dissipation wall has a groove for accommodating the main heat generating device. Through the groove, on the one hand, the main heat generating device can be better accommodated, and on the other hand, the heat dissipation wall is thinned, so that more efficient cooling is performed.

[0030] According to an optional embodiment of the present application, the main heat generating device comprises at least a radio frequency power amplifier.

[0031] According to an optional embodiment of the present application, the first heat sink is flush with the second heat sink at a lower end; and / or, the first heat sink is flush with the first outer vertical wall portion at a lower end. Thereby, the power supply circuit board module is facilitated to be accommodated in the first air duct.

[0032] According to an optional embodiment of the present application, the power supply device comprises a housing.

[0033] According to an optional embodiment of the present application, the power supply device is substantially cuboid shaped. Thereby, installation and storage is facilitated.

[0034] According to an optional embodiment of the present application, the power supply device comprises a fan for blowing the air duct with a cooling airflow.

[0035] According to an optional embodiment of the present application, the heat sink is integral.

[0036] According to an optional embodiment of the present application, the heating device is a radio frequency heating device.

[0037] According to a second aspect of the present application, embodiments of the present application provide a heating device, the heating device comprising the power supply device for a heating device as previously described.

[0038] According to a third aspect of the present application, embodiments of the present application provide a refrigeration appliance, the refrigeration appliance comprising the heating device as previously described.

[0039] According to an optional embodiment of the present application, the refrigeration appliance is a refrigerator.

[0040] According to an optional embodiment of the present application, the heating device is a thawing device of the refrigeration appliance. BRIEF DESCRIPTION OF DRAWINGS

[0041] The principles, features and advantages of the present application will be better understood by the following detailed description of the application, taken in conjunction with the accompanying drawings. The drawings include:

[0042] Figure 1 An example of the power supply device for a heating device of the present application is shown in a schematic view.

[0043] Figure 2 An example of the power supply device of the present application is shown in a perspective view.

[0044] Figure 3 The functional modules and the heat sink of the power supply device of Figure 2 are shown in a front view.

[0045] Figure 4 The functional module of the power supply device is shown schematically in a front view. Figure 2 The functional module and the heat sink of the power supply device are shown schematically in a perspective view.

[0046] Figure 5 The functional module of the power supply device is shown schematically in a perspective view. Figure 2 The functional module and the heat sink of the power supply device are shown schematically in a perspective view.

[0047] Figure 6 The heat sink of the power supply device is shown schematically in a perspective view. Figure 2 The heat sink of the power supply device is shown schematically in a perspective view.

[0048] Figure 7 The heat sink of the power supply device is shown schematically in a front view. Figure 2 The heat sink of the power supply device is shown schematically in a front view.

[0049] List of reference signs

[0050] 1 functional module, 11 first module, 110 main heat generating device, 111 notch, 12 second module, 13 power circuit board module, 14 radio frequency circuit board module, 15 control circuit board module;

[0051] 2 heat sink, 20 heat dissipation fin, 21 first heat dissipation fin, 22 second heat dissipation fin;

[0052] 3 wall part, 31 first outer vertical wall part, 32 second outer vertical wall part, 33 first horizontal wall part, 34 second horizontal wall part, 35 intermediate vertical wall part, 36 first wall part, 37 second wall part;

[0053] 4 heat dissipation wall part, 41 first side surface, 42 second side surface, 43 groove;

[0054] 5 inner cavity;

[0055] 6 air duct, 61 first air duct, 62 second air duct, 63 third air duct;

[0056] 7 housing;

[0057] 8 fan;

[0058] 9 air duct cover;

[0059] Z height direction;

[0060] X width direction;

[0061] Y flow direction. DETAILED DESCRIPTION

[0062] In order to make the technical problems, technical solutions and beneficial technical effects of the present application clearer, the present application will be further described in detail below in conjunction with the drawings and a plurality of exemplary embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the protection scope of the present application.

[0063] Figure 1 An example of a power supply device for a heating device according to the present application is shown in a schematic view. The heating device is for example an electromagnetic wave heating device, in particular a radio frequency heating device. The heating device can be a heating device which is sold as a finished product on its own, for example a microwave oven, or a heating device for a refrigeration appliance, for example a thawing device in a refrigerator.

[0064] As shown in Figure 1 the power supply device comprises:

[0065] at least two functional modules 1;

[0066] a heat sink 2, the heat sink 2 comprising heat sink fins 20 and wall portions 3 extending along a flow direction Y of a heat sink airflow, the wall portions 3 comprising first wall portions 36 and second wall portions 37, the second wall portions 37 being transverse to the first wall portions 36 as seen in a cross section perpendicular to the flow direction Y;

[0067] wherein the inner cavity 5 of the power supply device is divided into at least three air ducts 6 by the first wall portions 36 and the second wall portions 37, at least two of the at least three air ducts 6 being configured to accommodate at least two of the functional modules 1 of the power supply device, respectively.

[0068] The wall portions 3 are in particular understood to be wall portions 3 which form a frame of the heat sink 2, the wall portions 3 being thicker than the heat sink fins 20, at least one of the wall portions 3 carrying the heat sink fins 20. The heat sink fins 20 are in particular a plurality of fins which are next to each other. The skilled person can thus easily distinguish between the wall portions 3 of the heat sink 2 and the heat sink fins 20 of the heat sink 2. The second wall portions 37 being transverse to the first wall portions 36 is in particular understood to mean that the second wall portions 37 are perpendicular to the first wall portions 36, with a tolerance of plus or minus 10 degrees.

[0069] In the present application, the first wall portions 36 and the second wall portions 37 conveniently divide the inner cavity 5 of the power supply device into a plurality of suitable air ducts 6, the air ducts 6 having a suitable air volume to meet the different heat dissipation requirements of the functional modules 1 accommodated in the air ducts 6. Furthermore, the first wall portions 36 and the second wall portions 37 also conveniently form at least three air ducts 6 which are arranged in three dimensions. Arranged in three dimensions is in particular understood to mean that the at least three air ducts 6 do not form a row or a column.

[0070] Figure 2 An example of a power supply device according to the present application is shown in a perspective view.

[0071] Figure 3 a functional module 1 of a power supply device and a heat sink 2 are shown in a front view Figure 2

[0072] Figure 4 a functional module 1 of a power supply device and a heat sink 2 are shown in a front view Figure 2

[0073] Figure 5 a functional module 1 of a power supply device and a heat sink 2 are shown in a perspective view Figure 2

[0074] Figure 6 a heat sink 2 of a power supply device is shown in a perspective view Figure 2

[0075] Figure 7 a heat sink 2 of a power supply device is shown in a front view Figure 2

[0076] As shown in Figure 1 and Figure 2 , the power supply device has a height direction Z and a width direction X, which are perpendicular to a flow direction Y.

[0077] According to one exemplary embodiment of the present application, referring to Figure 3 , the at least two functional modules 1 include a first module 11 and a second module 12, the first module 11 having a higher heat dissipation requirement than the second module 12.

[0078] According to one exemplary embodiment of the present application, as shown in Figure 1 and Figure 3 , the at least two air ducts 6 for accommodating the functional modules 1 have different cross-sectional areas. In this way, appropriate air volume is allocated to different functional modules 1 to ensure normal operation of the functional modules 1.

[0079] According to one exemplary embodiment of the present application, referring to Figure 2 , the power supply device is substantially cuboid in shape. In this way, installation and storage are facilitated.

[0080] As shown in Figure 2 , the power supply device can include a housing 7. The heat sink 2 can also form part of the housing 7 of the power supply device.

[0081] In order to generate a heat dissipation air flow, as shown in Figure 2 , the power supply device can include a fan 8 for blowing the air ducts 6 with the heat dissipation air flow. The front and rear ends of the housing 7 are at least partially open to allow air to enter and flow out.

[0082] ​​​​​According to an exemplary embodiment of the present application, as shown in Figure 2 and Figure 3 , the first module 11 can comprise a radio frequency circuit board module 14, and the second module 12 comprises a power supply circuit board module 13 and a control circuit board module 15. Correspondingly, as shown in Figure 3 , the at least three air ducts 6 comprise exactly three air ducts 6, namely a first air duct 61, a second air duct 62 and a third air duct 63. The three air ducts 6 are respectively used to accommodate the power supply circuit board module 13, the radio frequency circuit board module 14 and the control circuit board module 15.

[0083] According to an exemplary embodiment of the present application, as shown in Figure 4 , the first module 11 is configured in the form of a single panel, in the case of a single panel, the electronic devices of the first module 11 are connected to only one side of the circuit board of the first module 11. Correspondingly, at least one of the wall portions 3 forms a heat dissipation wall portion 4, the heat dissipation wall portion 4 is provided with fins 20 on the first side 41 (shown in dashed line in Figure 4 ), and the second side 42 of the heat dissipation wall portion 4 opposite to the first side 41 is configured to be suitable for placing the surface of the circuit board of the first module 11 which is not used to set electronic devices. Thus, for the first module 11 which has higher heat dissipation requirements, direct heat conduction can be used for heat dissipation, so as to advantageously improve the heat dissipation efficiency.

[0084] According to an exemplary embodiment of the present application, as shown in Figure 5 , the first module 11 comprises a main heat generating device 110, and the circuit board of the first module 11 has a notch 111, the main heat generating device 110 is directly placed on the heat dissipation wall portion 4 through the notch 111. Thus, the main heat generating device 110 of the first module 11 is particularly efficiently cooled. The main heat generating device 110 at least comprises a radio frequency power amplifier.

[0085] Further, as shown in Figure 6 , the heat dissipation wall portion 4 can have a groove 43 for accommodating the main heat generating device 110. Through the groove 43, on the one hand, the main heat generating device 110 can be better accommodated, and on the other hand, the heat dissipation wall portion 4 is thinned, so as to be more efficiently cooled.

[0086] Further, in order to prevent air leakage, as shown in Figure 2 and Figure 3 , the power supply device can comprise an air duct cover 9 for covering the air duct 9 of the first module 11. Thus, the cooling of the first module 11 is ensured.

[0087] According to an exemplary embodiment of the present application, as shown in Figure 4As shown, the second module 12 is constructed in a double-sided board format. In this case, electronic components are located on both sides of the circuit board of the second module 12. Since the heat dissipation requirements of the second module 12 are relatively low, heat dissipation by convection is sufficient. By constructing the second module 12 in a double-sided board format, the second module 12 can be made as compact as possible while still meeting the heat dissipation requirements. It is also conceivable that, depending on the requirements, only one of the second modules 12 can be constructed as a double-sided board, while the other can be constructed as a single-sided board.

[0088] According to an exemplary embodiment of the present application, Figure 3 As shown, the three air ducts 6 include a first air duct 61 located below the power supply device in the height direction Z, a second air duct 62 located above the first air duct 61, and a third air duct 63. The second air duct 62 and the third air duct 63 are arranged side by side in the width direction X of the power supply device. This facilitates the three functional modules 1 to be stably and compactly placed flat within the three air ducts 6.

[0089] For example, Figure 3 As shown, the first air duct 61 is used to accommodate the power circuit board module 13 , the second air duct 62 is used to accommodate the radio frequency circuit board module 14 , and the third air duct 63 is used to accommodate the control circuit board module 15 .

[0090] Here, for example, the air duct 6 for accommodating the first module 11 is smaller than the air duct 6 for accommodating the second module 12. Since the first module 11 already adopts a single-sided board and a highly efficient heat dissipation method of direct heat conduction, the air duct 6 for the first module 11 does not need to be designed to be too large, and more flow area can be reserved for the second module 12.

[0091] According to an exemplary embodiment of the present application, Figure 7 As shown, the first wall portion 36 includes a first outer vertical wall portion 31, a second outer vertical wall portion 32, and an intermediate vertical wall portion 35 extending in a vertical plane, and the second wall portion 37 includes a first horizontal wall portion 33 and a second horizontal wall portion 34 extending in a horizontal plane. The first horizontal wall portion 33 is connected between the first outer vertical wall portion 31 and the intermediate vertical wall portion 35, and the second horizontal wall portion 34 is connected between the intermediate vertical wall portion 35 and the second outer vertical wall portion 32. In this way, three air ducts 6 arranged in three dimensions are formed with a simple structure. Figure 7 In the embodiment, the first horizontal wall portion 33 forms the heat dissipation wall portion 4 for the first module 11 .

[0092] like Figure 7 As shown, the first outer vertical wall portion 31, the second outer vertical wall portion 32 and the middle vertical wall portion 35 may be flush at the top, thereby facilitating the formation of a cube shape.

[0093] For example, Figure 7As shown, the height of the second outer vertical wall portion 32 is greater than the height of the first outer vertical wall portion 31, and the height of the first outer vertical wall portion 31 is greater than the height of the intermediate vertical wall portion 35. Thus, the housing 7 of the power supply device can be directly formed with the first outer vertical wall portion 31, and the structure of the power supply device is stabilized.

[0094] As shown, the first horizontal wall portion 33 is higher than the second horizontal wall portion 34. Figure 7 As shown, the first horizontal wall portion 33 is higher than the second horizontal wall portion 34.

[0095] As shown, the first horizontal wall portion 33 is higher than the second horizontal wall portion 34. Figure 7 As shown, the first horizontal wall portion 33 is higher than the second horizontal wall portion 34.

[0096] As shown, the first horizontal wall portion 33 is higher than the second horizontal wall portion 34. Figure 7 As shown, the first horizontal wall portion 33 is higher than the second horizontal wall portion 34.

[0097] As shown, the first horizontal wall portion 33 is higher than the second horizontal wall portion 34. Figure 6 As shown, the heat sink 2 is integral. Thus, the heat sink 2 is simple to manufacture and has good heat dissipation effect.

[0098] In the above context, the words indicating the orientation or position relationship such as "upper", "lower", "front", "rear", "height", "width", "vertical", "horizontal" and the like are used to describe the position relationship of the components with reference to the drawings, which are only for the convenience of describing the present specification and simplifying the description, and do not indicate or imply that the devices or elements referred to have a specific orientation, are constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present disclosure. Obviously, the meanings of these words will change accordingly according to the different placement attitudes of the power supply device.

[0099] In the drawings, the shapes, sizes and relative position relationships of the components should be understood exemplarily, and should not be regarded as a limitation of the present application.

[0100] Although specific embodiments have been described above, these embodiments are not intended to limit the scope of the present disclosure, even if only a single embodiment is described with respect to a particular feature. The examples of features provided in the present disclosure are intended to be illustrative rather than limiting, unless expressly stated otherwise. In practice, a plurality of features can be combined with each other, as technically feasible, according to actual needs, in a specific implementation. Furthermore, a plurality of features described in combination can also be considered as independent of each other, as technically feasible, and can be combined with different features. Various substitutions, modifications and alterations are also conceivable within the spirit and scope of the present disclosure.

Claims

1. A power supply device for a heating apparatus, characterized by, The power supply device comprises: at least two functional modules (1); a heat sink (2) comprising fins (20) and a wall portion (3) extending along a flow direction (Y) of a cooling airflow, the wall portion (3) comprising a first wall portion (36) and a second wall portion (37) which, in a cross section perpendicular to the flow direction (Y), is transverse to the first wall portion (36); wherein an inner cavity (5) of the power supply device is divided by the first wall portion (36) and the second wall portion (37) into at least three air ducts (6), at least two of the at least three air ducts (6) being configured to accommodate the at least two functional modules (1) of the power supply device, respectively.

2. The power supply device according to claim 1, characterized by, The power supply device comprises at least one of the following features: The at least two air ducts (6) have different throughflow cross-sectional areas; The at least two functional modules (1) comprise a first module (11) and a second module (12), the first module (11) having a higher heat dissipation requirement than the second module (12); The at least three air ducts (6) comprise exactly three air ducts (6); The power supply device has a height direction (Z) and a width direction (X), the height direction (Z), the width direction (X) and the flow direction (Y) being perpendicular to one another.

3. The power supply device according to claim 2, characterized by The power supply device comprises at least one of the following features: The first module (11) comprises a radio frequency circuit board module (14), the second module (12) comprising a power supply circuit board module (13) and a control circuit board module (15); The first module (11) is configured in the form of a single-sided board, in the case of which the electronics of the first module (11) are connected to only one side of the circuit board of the first module (11); The second module (12) is configured in the form of a double-sided board, in the case of which electronics are provided on both sides of the circuit board of the second module (12); The three air ducts (6) comprise a first air duct (61) which is lower in the height direction (Z) of the power supply device, a second air duct (62) which is above the first air duct (61) and a third air duct (63), the second air duct (62) and the third air duct (63) being side by side in the width direction (X) of the power supply device; The power supply device comprises an air duct cover (9) for covering the air duct of the first module (11); The first wall portion (36) comprises a first outer vertical wall portion (31), a second outer vertical wall portion (32) and an intermediate vertical wall portion (35) extending in a vertical plane, the second wall portion (37) comprising a first horizontal wall portion (33) and a second horizontal wall portion (34) extending in a horizontal plane, the first horizontal wall portion (33) being connected between the first outer vertical wall portion (31) and the intermediate vertical wall portion (35), the second horizontal wall portion (34) being connected between the intermediate vertical wall portion (35) and the second outer vertical wall portion (32).

4. The power supply device according to claim 3, characterized by The power supply device comprises at least one of the following features: At least one of the wall portions (3) forms a heat dissipation wall portion (4) provided with a heat dissipation fin (20) on a first side (41), a second side (42) of the heat dissipation wall portion (4) opposite to the first side (41) being configured to be adapted to a surface of a circuit board of the first module (11) not used for setting electronic devices; The first module (11) comprises a main heat generating device (110), the circuit board of the first module (11) has a notch (111), and the main heat generating device (110) is directly attached to the heat dissipation wall portion (4) through the notch (111); The three air ducts (6) are respectively used for accommodating the power supply circuit board module (13), the radio frequency circuit board module (14) and the control circuit board module (15); The first outer vertical wall portion (31), the second outer vertical wall portion (32) and the intermediate vertical wall portion (35) are flush at the top end; The height of the second outer vertical wall portion (32) is greater than the height of the first outer vertical wall portion (31), and the height of the first outer vertical wall portion (31) is greater than the height of the intermediate vertical wall portion (35); A first heat dissipation fin (21) extending downward is arranged on the lower side of the first horizontal wall portion (33); A second heat dissipation fin (22) extending downward is arranged on the lower side of the second horizontal wall portion (34); The first horizontal wall portion (33) is higher than the second horizontal wall portion (34).

5. The power supply device according to claim 4, characterized by The power supply device comprises at least one of the following features: The first air duct (61) is used for accommodating the power supply circuit board module (13), the second air duct (62) is used for accommodating the radio frequency circuit board module (14), and the third air duct (63) is used for accommodating the control circuit board module (15); The air duct (6) used for accommodating the first module (11) is smaller than the air duct (6) used for accommodating the second module (12); The heat dissipation wall portion (4) has a groove (43) used for accommodating the main heat generating device (110); The main heat generating device (110) at least comprises a radio frequency power amplifier; The first heat dissipation fin (21) and the second heat dissipation fin (22) are flush at the lower end; The first heat dissipation fin (21) and the first outer vertical wall portion (31) are flush at the lower end.

6. The power supply device according to any one of claims 1 to 5, characterized by, The power supply device comprises at least one of the following features: The power supply device comprises a housing (7) enclosing the inner cavity (5); The power supply device is substantially cuboid-shaped; The power supply device comprises a fan (8) used for blowing the air duct (6) with a heat dissipation air flow; The heat sink (2) is integral; The heating device is a radio frequency heating device.

7. A heating device, characterized by The heating device comprises the power supply device for a heating device according to any one of claims 1 to 6.

8. A refrigeration appliance characterized in that, The refrigeration appliance comprises the heating device according to claim 7.

9. The refrigeration appliance of claim 8, wherein, The refrigeration appliance is a refrigerator.

10. The refrigeration appliance of claim 8 or 9, wherein, The heating device is a thawing device of the refrigeration appliance. The heating device is a thawing device of the refrigeration appliance.

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