Integrated circuit chip detection device

Abstract

The invention relates to the technical field of chip detection, in particular to an integrated circuit chip detection device which comprises an X-ray detector, a driving motor, a centering assembly, a positioning plate, a reciprocating assembly and a cleaning film. Detection devices are mounted in the X-ray detector, a detection platform is arranged between the detection devices, and a driving cavity is formed in the detection platform; the driving motor is installed on the detection platform, a centering assembly is arranged in front of the driving motor, positioning plates are arranged in the centering assembly, the two positioning plates are installed on the detection platform in a sliding mode, and the driving motor drives the two positioning plates to slide horizontally through the centering assembly to achieve positioning of the integrated circuit chip. A reciprocating assembly is arranged in front of the centering assembly, a cleaning film is arranged on the reciprocating assembly, the centering assembly drives the cleaning film through the reciprocating assembly to clean the integrated circuit chip, the imaging precision of the X-ray detection machine is improved through rotary motion, then the detection efficiency and the detection quality are improved, and missed judgment and misjudgment are avoided.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, specifically to an integrated circuit chip testing device. Background Art

[0002] An integrated circuit chip is a new type of semiconductor device. It is an electronic device that integrates all the semiconductors, resistors, capacitors and other components required to form a circuit with a certain function, as well as the connecting wires between them, onto a small piece of silicon wafer, and then solders and encapsulates it in a casing. It has the advantages of small size, light weight, long life, high reliability and good performance.

[0003] After integrated circuit chips are packaged, they are tested to ensure their normal use and prevent defective products from entering the market. Integrated circuit chips are often tested using X-ray inspection machines. An X-ray inspection machine mainly consists of an inspection platform, an X-ray emitter, and a flat panel detector. When an X-ray inspection machine inspects an integrated circuit chip, the integrated circuit chip is placed above the inspection platform, and then the X-ray emitter is activated to emit X-rays. The X-rays pass through the integrated circuit chip, some of which are absorbed by the integrated circuit chip, and the remaining X-rays are transmitted to the flat panel detector to image the inside of the integrated circuit chip, facilitating the detection of internal defects.

[0004] However, during X-ray inspection, the integrated circuit chip may shift position, causing localized misalignment during imaging. This results in incomplete imaging or image distortion that affects subsequent algorithmic comparisons, impacting detection accuracy and leading to misjudgments or missed detections. In view of this, we propose an integrated circuit chip testing device. Summary of the Invention

[0005] The purpose of this invention is to provide an integrated circuit chip inspection device to solve the problem mentioned in the background art that the positioning of integrated circuit chips affects the inspection results of X-ray inspection machines.

[0006] To achieve the above objectives, the present invention provides the following technical solution: An integrated circuit chip inspection device includes: an X-ray inspection machine, a drive motor, an alignment component, a positioning plate, a reciprocating component, and a cleaning film; the X-ray inspection machine is equipped with inspection devices, and an inspection platform is provided between the inspection devices. The inspection platform is fixedly connected to the X-ray inspection machine. The inspection devices consist of an X-ray emitter and a flat panel detector. The inspection platform is fixedly installed between the X-ray emitter and the flat panel detector. The X-ray machine is located above the inspection platform, and the flat panel detector is located above the inspection platform. When the X-ray inspection machine inspects the integrated circuit chip, the integrated circuit chip is placed above the inspection platform. Then, the X-ray emitter is activated to emit X-rays. The X-rays pass through the integrated circuit chip, a portion of which is absorbed by the integrated circuit chip, and the remaining X-rays are transmitted to the flat panel detector to image the inside of the integrated circuit chip, facilitating the detection of internal defects. A drive cavity is provided on the inspection platform. The drive motor is fixedly mounted on the detection platform. A centering assembly is located in front of the drive motor, and a positioning plate is located within the centering assembly. There are two sets of positioning plates, which are slidably mounted on the detection platform. When the X-ray inspection machine is operating, the drive motor drives the two sets of positioning plates to slide horizontally through the centering assembly to position the integrated circuit chip. When inspecting the integrated circuit chip, it is crucial to ensure that the chip is directly above the X-ray emitter to guarantee the accuracy of the flat panel detector's imaging and prevent chip misalignment, which could lead to image distortion or incomplete imaging due to missing edges, resulting in detection errors. Therefore, the centering assembly drives the positioning plates to center and position the integrated circuit chip, ensuring the accuracy of the integrated circuit board's imaging. The alignment component is positioned directly above the X-ray emitter, improving image quality and thus detection accuracy. A reciprocating assembly is located in front of the alignment component, and a cleaning film is mounted on the reciprocating assembly. After the positioning plate completes alignment, the alignment component drives the cleaning film through the reciprocating assembly to clean the integrated circuit chip. During integrated circuit chip detection, if dust adheres to the chip surface, it can cause artifacts in the flat panel detector image, affecting the detection results and leading to misjudgments. Therefore, after the alignment component drives the positioning plate to position the integrated circuit chip, the reciprocating assembly drives the cleaning film to clean the chip surface, preventing dust from affecting the detection results.

[0007] Preferably, the two sets of positioning plates are divided into front and rear positioning plate groups and left and right positioning plate groups. The left and right positioning plate groups have reciprocating grooves, and cleaning film is slidably installed in the reciprocating grooves through reciprocating components. The front and rear positioning plate groups are I-shaped structures, and reciprocating components are slidably installed in the I-shaped structures. The positioning plates are divided into front and rear positioning plate groups and left and right positioning plate groups, and each group of positioning plates consists of two symmetrically arranged plates. When the integrated circuit board is square, the integrated circuit chip is freely placed on the testing platform. When the integrated circuit board is rectangular, the long side of the rectangle is aligned with the left and right positioning plate groups, and the short side of the rectangle is aligned with the front and rear positioning plates. This enables the testing of integrated circuit chips of various sizes and improves the universality of the testing.

[0008] Preferably, the alignment assembly includes a drive shaft, a fixed sleeve, a bushing, a double linkage mechanism, a drive rack, a transmission wheel, and a driven rack; the drive shaft is fixedly connected to a drive motor, the drive shaft has threads, and the fixed sleeve is slidably mounted on the drive shaft; the fixed sleeve has a sliding cavity, and the bushing is slidably mounted in the sliding cavity; the bushing has a threaded groove that mates with the drive shaft, and a telescopic cavity has a telescopic plate rotatably mounted in the telescopic cavity, the telescopic plate and the telescopic cavity being connected by a telescopic spring; when the X-ray inspection machine needs to perform inspection, the drive motor rotates forward, thereby driving the drive shaft synchronously. The drive shaft rotates, and the drive bushing slides horizontally via a threaded connection. The bushing slides along the direction of the integrated circuit chip, and the bushing drives the telescopic plate mounted on it to move synchronously. The telescopic plate contacts the inner wall of the sliding cavity opened on the fixed sleeve, thereby pushing the fixed sleeve to move synchronously. There are two double linkage mechanisms, each consisting of a driving rod, a connecting block, and a driven rod. One end of the driving rod is rotatably connected to the fixed sleeve, and the other end is rotatably connected to the connecting block. The connecting block is rotatably connected to the driven rod, and the driven rod is rotatably connected to the left and right positioning plate assemblies. When the fixed sleeve moves along the direction of the integrated circuit chip under the action of the bushing... When the integrated circuit chip slides in the direction of rotation, the fixed sleeve drives the active rod to rotate. The rotation of the active rod pushes the connecting block to move along the slide rail. The connecting block drives the driven rod to move synchronously. The rotation of the driven rod pushes the left and right positioning plate assemblies to center and fix the left and right ends of the integrated circuit chip. After the left and right positioning plate assemblies have fixed the left and right sections of the integrated circuit chip, the drive motor continues to rotate forward, thereby driving the drive shaft to continue rotating. The drive shaft continues to drive the bushing to slide horizontally through a threaded connection. At this time, the left and right positioning plate assemblies remain fixed under the action of the integrated circuit chip, and the fixed sleeve remains fixed under the action of the left and right positioning plates. The bushing continues to... The movement causes the telescopic plate and the sliding cavity to press against each other, which in turn causes the telescopic plate to compress the telescopic spring and slide into the telescopic cavity. The bushing separates from the fixed sleeve and continues to slide along the direction of the integrated circuit board, thereby driving the reciprocating assembly to clean the integrated circuit chip. A drive rack is provided below the left and right positioning plate groups. The drive rack is located in the drive cavity, and a transmission wheel is provided on one side of the drive rack. A driven rack is provided on one side of the transmission wheel. The driven rack is arranged perpendicular to the drive rack and is located below the drive rack. A strip-shaped groove is opened on the driven rack, and a slot is opened in the strip-shaped groove. The front and rear positioning plate groups are slidably installed in the strip-shaped groove.The front and rear positioning plate assemblies are equipped with locking blocks that mate with the slots. When the left and right positioning plate assemblies slide in alignment, they drive the drive rack fixedly mounted below them to slide synchronously. During the sliding process, the drive rack meshes with the transmission wheel, thereby driving the transmission wheel to rotate. The transmission wheel rotates and meshes with the driven rack, driving the driven rack to slide perpendicularly to the drive rack. The sliding of the driven rack drives the front and rear positioning plate assemblies to move in alignment, positioning and fixing the integrated circuit chip. If the integrated circuit chip is rectangular, the long side of the integrated circuit chip corresponds to the left and right positioning plate assemblies. In this case, the front and rear positioning plate assemblies first contact the integrated circuit chip. After the front and rear positioning plate assemblies contact the integrated circuit chip, the driven rack continues to slide under the action of the transmission wheel. At this time, the front and rear positioning plate assemblies are subjected to the reaction force of the integrated circuit chip, causing the locking blocks of the front and rear positioning plate assemblies to disengage from the slots. The front and rear positioning plate assemblies no longer slide with the driven rack and remain fixed.

[0009] Preferably, the sliding cavity is provided with an annular inclined surface, and the telescopic plate is provided with a groove that cooperates with the annular inclined surface. The cooperation between the annular inclined surface and the groove reduces the friction between the sliding cavity and the telescopic plate, thereby facilitating the telescopic plate to slide into the telescopic cavity under the action of the sliding cavity, improving the efficiency of the separation between the bushing and the fixed sleeve, and ensuring the stability of the transmission.

[0010] Preferably, the slot is divided into a fixed section and a sliding section, the fixed section is a hemispherical structure, and the sliding section is a semi-cylindrical structure; the front and rear positioning plates are provided with wave grooves, and a locking block is slidably installed in the wave grooves by a support spring, the locking block being a spherical structure that cooperates with the hemispherical structure; The fixed section is used to fix the locking block, allowing the front and rear positioning plate assemblies to move synchronously with the driven rack. The sliding section is used to limit the movement trajectory of the locking block after it disengages from the fixed section, thereby ensuring the stability of the front and rear positioning plate assemblies. The spherical structure of the locking block and the fixed groove of the hemispherical structure cooperate with each other to increase the contact area between the locking block and the fixed section, thus facilitating the driven rack to drive the front and rear positioning plates to move synchronously through the locking block. At the same time, the spherical structure facilitates the release from the hemispherical structure, ensuring the efficiency of the locking block's disengagement from the slot. After the front and rear positioning plate assemblies contact the integrated circuit chip, they remain fixed under the action of the integrated circuit chip. At this time, the driven rack continues to move forward, and the force of the fixed section on the locking block increases, thus pushing the locking block to slide upward into the wave groove. Then the locking block enters the sliding section, where the front and rear positioning plate assemblies remain stable under the action of the sliding section. Meanwhile, since the locking block is slidably installed in the wave groove, when the locking block disengages from the fixed section and enters the sliding section, it will not drive the front and rear positioning plates to slide upward, thus ensuring the stability of the front and rear positioning plates.

[0011] Preferably, the reciprocating assembly includes a telescopic rod, a top plate, a push rod, a transmission rack, a stepped gear wheel, and a gear rack; one end of the telescopic rod is installed with a fixed sleeve, and the other end of the telescopic rod is fixedly installed with the top plate; the top plate is provided with a push rod fixedly connected to the bushing, and a transmission rack is provided in front of the top plate; the top plate achieves synchronous movement with the fixed sleeve under the action of the telescopic plate and the push rod. After the left and right positioning plate assemblies have positioned and fixed the left and right ends of the integrated circuit chip, the telescopic plate of the bushing slides into the telescopic cavity and separates from the fixed sleeve, thereby keeping the fixed sleeve fixed. The bushing continues to move and pushes the top plate to continue sliding horizontally through the push rod. The top plate is fixedly connected to the fixed sleeve through the extension of the telescopic rod. One end of the transmission rack is located in the I-shaped structure. When the left and right positioning plates slide in the center, they squeeze the transmission rack through the reciprocating cavity, thereby driving the transmission rack to move synchronously. The front and rear positioning plate assemblies achieve sliding connection with the transmission rack through the I-shaped structure, and at the same time, they support the transmission rack to ensure its stability. The other end of the rack is located in the reciprocating groove. The transmission rack and the reciprocating groove are connected by a return spring. A stepped gearbox is provided above the transmission rack. The stepped gearbox is rotatably mounted in the middle of the reciprocating groove. The stepped gearbox is divided into a transmission section and a gear shift section. The gear ratio of the gear shift section is smaller than that of the transmission section, thus making the transmission distance of the gear shift section greater for the same number of rotations. The transmission section meshes with the transmission rack, and the gear shift section meshes with the gear shift rack. The gear shift rack is slidably mounted in the reciprocating groove. A cleaning film is mounted on the rack. When the top plate slides along the integrated circuit chip under the action of the bushing, the top plate pushes the transmission rack to move synchronously. The transmission rack meshes with the transmission section of the stepped gear wheel, thereby driving the stepped gear wheel to rotate. When the stepped gear wheel rotates, it drives the gear section to rotate synchronously. The gear section meshes with the gear rack, driving the gear rack to slide horizontally. The gear rack drives the cleaning film to move synchronously. The cleaning film cleans the dust on the integrated circuit chip, ensuring the cleanliness of the integrated circuit chip surface and improving the imaging effect.

[0012] Preferably, the telescopic rod consists of a fixed rod, a sliding rod, and a tension spring. The fixed rod is fixedly connected to the fixed sleeve, and the sliding rod is slidably installed inside the fixed rod. The sliding rod is fixedly connected to the top plate, and the sliding rod is connected to the inner wall of the fixed rod through the tension spring. When the bushing drives the fixed sleeve to move synchronously, the fixed rod and the sliding rod remain relatively fixed. When the bushing is disengaged from the fixed sleeve, the bushing pushes the top plate to continue sliding through the top rod, and the top plate pulls the sliding rod to move synchronously. The sliding rod pulls the tension spring, and the sliding rod ensures its connection with the fixed rod through the tension spring. At the same time, the fixed rod ensures the connection between the top plate and the fixed sleeve.

[0013] Preferably, the transmission rack has an arc-shaped structure at one end near the top plate; the top plate is symmetrically provided with top blocks that cooperate with the transmission rack; the top plate reduces the distance between itself and the transmission rack through the top blocks, making it easier for the top plate to push the transmission rack to slide; the arc-shaped structure of the transmission rack reduces the friction between the top blocks and the transmission rack, thereby making it easier for the top plate to push the transmission rack to slide through the top blocks and improving transmission efficiency.

[0014] Preferably, the cleaning film consists of a cleaning rod and an ultra-adhesive film. The cleaning rod is divided into a positioning rod and a centering rod. The centering rod is slidably installed inside the positioning rod via a keyway. The centering rod is rotatably connected to the gear rack via a bearing. The ultra-adhesive film is rotatably installed on the cleaning rod. When the positioning plate assembly moves to center, the left and right positioning plate assemblies drive the gear rack to slide synchronously, thereby driving the centering rod to slide into the positioning rod, ensuring the stable operation of the mechanism. At the same time, the cleaning film slides synchronously with the gear rack through the cleaning rod, thereby driving the ultra-adhesive film to move synchronously to clean the surface of the integrated circuit chip.

[0015] Preferably, the centering rod is equipped with a deflection wheel, and the left and right positioning plates are linearly arrayed with paddles. The centering rod moves synchronously with the left and right positioning plates via a geared rack, thereby keeping itself relatively stationary with the left and right positioning plates in the horizontal direction. This allows the centering rod to deflect and remain relatively stationary with the left and right positioning plates. Simultaneously, the centering rod slides synchronously with the geared rack, maintaining relative sliding with the left and right positioning plates in the front-back direction. This causes the deflection wheel to move relative to the paddles on the left and right positioning plates. The paddles cause the deflection wheel to rotate, which in turn causes the centering rod to rotate. The centering rod, through a keyway, drives the positioning rod to rotate synchronously, which in turn drives the ultra-adhesive rubber ring to rotate synchronously. The ultra-adhesive rubber ring rotates relative to the integrated circuit chip, enhancing the cleaning effect on the integrated circuit chip.

[0016] Preferably, the transmission rack is located at one end near the top plate; the top plate is symmetrically provided with top blocks that cooperate with the transmission rack.

[0017] Compared with the prior art, the present invention has the following beneficial effects: 1. An integrated circuit chip inspection device. The present invention improves the imaging clarity of the X-ray inspection machine by using a centering component and a cleaning component, thereby improving the inspection efficiency of the X-ray inspection machine and ensuring the inspection accuracy.

[0018] 2. An integrated circuit chip inspection device. The present invention realizes the centering and positioning of integrated circuit chips of different sizes through a centering component, realizes adaptive positioning and clamping, and improves the inspection efficiency and inspection range of X-ray inspection machine.

[0019] 3. An integrated circuit chip testing device. The present invention cleans dust from the surface of integrated circuit chips through a cleaning component, avoids the generation of artifacts, improves imaging clarity, and thus ensures testing accuracy. Attached Figure Description

[0020] Figure 1 This is a half-sectional schematic diagram of the X-ray inspection machine of the present invention; Figure 2 For the present invention Figure 1 A magnified view of point A; Figure 3 This is a half-sectional schematic diagram of the detection platform of the present invention; Figure 4 For the present invention Figure 3 A magnified view of point B; Figure 5 This is a partial cross-sectional view of the detection platform of the present invention; Figure 6 For the present invention Figure 5 A magnified view of point C; Figure 7 This is a schematic diagram of the centering component and reciprocating component of the present invention; Figure 8 This is a cross-sectional view of the positioning plate of the present invention; Figure 9 For the present invention Figure 8 A magnified view of point D; Figure 10 This is a half-sectional schematic diagram of the centering component of the present invention; Figure 11 For the present invention Figure 10 A magnified view of point E; Figure 12 This is a half-sectional schematic diagram of the reciprocating component of the present invention; Figure 13 For the present invention Figure 12 A magnified view of point F; Figure 14 This is a half-sectional schematic diagram of the cleaning film of the present invention; Figure 15 For the present invention Figure 14 A magnified view of point G; Figure 16 This is a vertical half-sectional view of the reciprocating component of the present invention; Figure 17 For the present invention Figure 16 A magnified view of point H.

[0021] In the picture: 1. X-ray inspection machine; 11. Inspection device; 12. Inspection platform; 121. Drive cavity; 2. Drive motor; 3. Centering assembly; 31. Drive shaft; 32. Fixed sleeve; 321. Sliding cavity; 322. Annular inclined surface; 33. Bushing; 331. Telescopic cavity; 332. Telescopic plate; 3321. Inclined groove; 333. Telescopic spring; 34. Double linkage mechanism; 341. Driving rod; 342. Connecting block; 343. Driven rod; 35. Drive rack; 36. Transmission wheel; 37. Driven rack; 371. Strip groove; 372. Slot; 3721. Fixed section; 3722. Sliding section; 4. Positioning plate; 41. Front and rear positioning plate assembly; 411. I-shaped structure; 412. Wave groove; 413. Support spring; 414. Locking block; 415. Spherical structure; 42. Left and right positioning plate assembly; 421. Reciprocating groove; 422. Push block; 5. Reciprocating assembly; 51. Telescopic rod; 511. Fixed rod; 512. Sliding rod; 513. Tension spring; 52. Top plate; 521. Top block; 53. Top rod; 54. Transmission rack; 541. Arc structure; 55. Stepped gearbox; 551. Transmission section; 552. Gearbox section; 56. Gearbox. 6. Cleaning film roll; 61. Cleaning rod; 611. Positioning rod; 612. Centering rod; 613. Deflection wheel; 62. Ultra-clean adhesive film roll. Detailed Implementation

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] After integrated circuit chips are packaged, they are tested to ensure their normal use and prevent defective products from entering the market. Integrated circuit chips are often tested using X-ray inspection machines. An X-ray inspection machine mainly consists of an inspection platform, an X-ray emitter, and a flat panel detector. When an X-ray inspection machine inspects an integrated circuit chip, the integrated circuit chip is placed above the inspection platform, and then the X-ray emitter is activated to emit X-rays. The X-rays pass through the integrated circuit chip, some of which are absorbed by the integrated circuit chip, and the remaining X-rays are transmitted to the flat panel detector to image the inside of the integrated circuit chip, facilitating the detection of internal defects.

[0024] However, during the X-ray inspection process, the integrated circuit chip may shift position, causing local off-target phenomena when the X-ray inspection machine images the integrated circuit chip. This results in incomplete imaging or image distortion that affects subsequent algorithm comparison and detection, impacting the accuracy of subsequent detection and leading to misjudgments or missed detections.

[0025] The present invention provides a technical solution: Figures 1 to 17 As shown, an integrated circuit chip inspection device 11 includes: an X-ray inspection machine 1, a drive motor 2, an alignment component 3, a positioning plate 4, a reciprocating component 5, and a cleaning film 6. The X-ray inspection machine 1 houses the inspection devices 11, and an inspection platform 12 is provided between the inspection devices 11. The inspection platform 12 is fixedly connected to the X-ray inspection machine 1, and a drive cavity 121 is formed on the inspection platform 12. The drive motor 2 is fixedly mounted on the inspection platform 12. An alignment component 3 is located in front of the drive motor 2, and a positioning plate 4 is located within the alignment component 3. There are two sets of positioning plates 4, which are slidably mounted on the inspection platform 12. When the X-ray inspection machine 1 is operating, the drive motor 2 drives the two sets of positioning plates 4 to slide horizontally through the alignment component 3 to achieve integrated circuit chip positioning. A reciprocating component 5 is located in front of the alignment component 3, and a cleaning film 6 is provided on the reciprocating component 5. After the positioning plate 4 completes alignment, the alignment component 3 drives the cleaning film 6 through the reciprocating component 5 to clean the integrated circuit chip. Specifically, an X-ray inspection machine 1 has an inspection platform 12 installed between the inspection devices 11 and the X-ray inspection machine 1. The inspection platform 12 is fixedly connected to the X-ray inspection machine 1. The inspection devices 11 consist of an X-ray emitter and a flat panel detector. The inspection platform 12 is fixedly installed between the X-ray emitter and the flat panel detector. The X-ray machine is located above the inspection platform 12. When the X-ray inspection machine 1 inspects the integrated circuit chip, the integrated circuit chip is placed above the inspection platform 12. Then the X-ray emitter is activated to emit X-rays. The X-rays pass through the integrated circuit chip. Part of the X-rays are absorbed by the integrated circuit chip, and the remaining X-rays are transmitted to the flat panel detector to image the inside of the integrated circuit chip, which facilitates the detection of internal defects. The inspection platform 12 has a drive cavity 121. The drive motor 2 is fixedly mounted on the inspection platform 12. A centering assembly 3 is located in front of the drive motor 2, and two sets of positioning plates 4 are installed within the centering assembly 3. These two sets of positioning plates 4 are slidably mounted on the inspection platform 12. When the X-ray inspection machine 1 is working, the drive motor 2 drives the two sets of positioning plates 4 to slide horizontally through the centering assembly 3 to position the integrated circuit chip. When inspecting the integrated circuit chip, it is essential to ensure that the integrated circuit chip is directly above the X-ray emitter to guarantee the accuracy of the flat panel detector's imaging and prevent chip misalignment, which could lead to image distortion or incomplete imaging due to missing edges, resulting in inspection errors. Therefore, the centering assembly 3 drives the positioning plates 4 to center and position the integrated circuit chip, ensuring the accuracy of the integrated circuit chip's imaging. The plate is positioned directly above the X-ray emitter, improving image quality and thus detection accuracy. A reciprocating assembly 5 is located in front of the centering assembly 3, and a cleaning film 6 is mounted on the reciprocating assembly 5. After the positioning plate 4 completes centering, the centering assembly 3 drives the cleaning film 6 through the reciprocating assembly 5 to clean the integrated circuit chip. If dust adheres to the surface of the integrated circuit chip during detection, it can cause artifacts in the flat panel detector image, affecting the detection results and leading to misjudgments. Therefore, after the centering assembly 3 drives the positioning plate 4 to position the integrated circuit chip, the reciprocating assembly 5 drives the cleaning film 6 to clean the surface of the integrated circuit chip, preventing dust from adhering to the chip and affecting the detection results.

[0026] In this embodiment, the two sets of positioning plates 4 are divided into front and rear positioning plate groups 41 and left and right positioning plate groups 42. The left and right positioning plate groups 42 are provided with reciprocating grooves 421. A cleaning film 6 is slidably installed in the reciprocating grooves 421 through a reciprocating component 5. The front and rear positioning plate groups 41 are I-shaped structures 411. The reciprocating component 5 is slidably installed in the I-shaped structure 411. Specifically, the positioning plate 4 is divided into front and rear positioning plate groups 41 and left and right positioning plate groups 42. Each group of positioning plates consists of two symmetrically arranged plates. When the integrated circuit board is square, the integrated circuit chip is freely placed on the detection platform 12. When the integrated circuit board is rectangular, the long side of the rectangle is aligned with the left and right positioning plate groups 42, and the short side of the rectangle is aligned with the front and rear positioning plates. This enables the detection of integrated circuit chips of various sizes and improves the universality of the detection.

[0027] In this embodiment, the centering assembly 3 includes a drive shaft 31, a fixed sleeve 32, a bushing 33, a double linkage mechanism 34, a drive rack 35, a transmission wheel 36, and a driven rack 37. The drive shaft 31 is fixedly connected to the drive motor 2. The drive shaft 31 has a thread, and the fixed sleeve 32 is slidably mounted on the drive shaft 31. The fixed sleeve 32 has a sliding cavity 321, and the bushing 33 is slidably mounted in the sliding cavity 321. The bushing 33 has a threaded groove that mates with the drive shaft 31. The bushing 33 has a telescopic cavity 331, and a telescopic plate 332 is rotatably mounted in the telescopic cavity 331. The telescopic plate 332 and the telescopic cavity 331 are connected by a telescopic spring 333. There are two double linkage mechanisms 34, each consisting of a driving rod 341, a connecting block 342, and a driven rod 37. The system comprises a rod 343, with one end of the active rod 341 rotatably connected to the fixed sleeve 32 and the other end rotatably connected to the connecting block 342. The connecting block 342 is rotatably connected to the driven rod 343, and the driven rod 343 is rotatably connected to the left and right positioning plate assemblies 42. A drive rack 35 is provided below the left and right positioning plate assemblies 42. The drive rack 35 is located in the drive cavity 121, and a transmission wheel 36 is provided on one side of the drive rack 35. A driven rack 37 is provided on one side of the transmission wheel 36. The driven rack 37 is arranged perpendicularly to the drive rack 35 and is located below the drive rack 35. A strip-shaped groove 371 is provided on the driven rack 371, and a slot 372 is provided in the strip-shaped groove 371. A front and rear positioning plate assemblies 41 are slidably installed in the strip-shaped groove 371. A locking block 414 that cooperates with the slot 372 is provided on the front and rear positioning plate assemblies 41. Specifically, the drive shaft 31 is fixedly connected to the drive motor 2. The drive shaft 31 has threads, and a fixed sleeve 32 is slidably mounted on it. The fixed sleeve 32 has a sliding cavity 321, and a bushing 33 is slidably mounted within the sliding cavity 321. The bushing 33 has a threaded groove that mates with the drive shaft 31, and a telescopic cavity 331 is also provided. A telescopic plate 332 is rotatably mounted within the telescopic cavity 331. The telescopic plate 332 and the telescopic cavity 331 are connected by a telescopic spring 333. The bushing 33 connects and separates from the fixed sleeve 32 via the telescopic plate 332. When the telescopic plate 332 is extended under the action of the telescopic spring 333, the bushing 33 pushes the inner wall of the sliding cavity 321 of the fixed sleeve 32 through the telescopic plate 332. The drive fixed sleeve 32 slides synchronously. When the telescopic plate 332 compresses the telescopic spring 333 and slides into the telescopic cavity 331, the bushing 33 separates from the fixed sleeve 32 and no longer drives the fixed sleeve 32 to move synchronously. When the X-ray inspection machine 1 needs to perform inspection, the drive motor 2 rotates forward, thereby driving the drive shaft 31 to rotate synchronously. The drive shaft 31 slides horizontally through the threaded connection of the drive shaft 31 sleeve. The bushing 33 slides along the direction of the integrated circuit chip. The bushing 33 drives the telescopic plate 332, which is rotatably mounted on it, to move synchronously. The telescopic plate 332 contacts the inner wall of the sliding cavity 321 opened on the fixed sleeve 32, thereby pushing the fixed sleeve 32 to move synchronously. There are two double linkage mechanisms 34, which are composed of a driving rod 341, a connecting block 342, and a driven rod 343. The active rod 341 is rotatably connected at one end to the fixed sleeve 32, and at the other end to the connecting block 342. The connecting block 342 is rotatably connected to the driven rod 343, and the driven rod 343 is rotatably connected to the left and right positioning plate assemblies 42. When the fixed sleeve 32 slides along the direction of the integrated circuit chip under the action of the bushing 33, the fixed sleeve 32 drives the active rod 341 to rotate. When the active rod 341 rotates, it pushes the connecting block 342 to move along the slide rail. The connecting block 342 drives the driven rod 343 to move synchronously. The rotation of the driven rod 343 pushes the left and right positioning plate assemblies 42 to move in the center to position and fix the left and right ends of the integrated circuit chip. After the left and right positioning plate assemblies 42 have fixed the left and right sections of the integrated circuit chip, the drive motor 2 continues to move forward. The rotation drives the drive shaft 31 to continue rotating. The drive shaft 31 continues to slide horizontally through the threaded connection. At this time, the left and right positioning plate groups 42 remain fixed under the action of the integrated circuit chip, and the fixed sleeve 32 remains fixed under the action of the left and right positioning plates. At this time, the bushing 33 continues to move, causing the telescopic plate 332 and the sliding cavity 321 to press against each other, thereby causing the telescopic plate 332 to press the telescopic spring 333 into the telescopic cavity 331. The bushing 33 separates from the fixed sleeve 32 and continues to slide along the direction of the integrated circuit board, thereby driving the reciprocating assembly 5 to work and clean the integrated circuit chip. A drive rack 35 is provided below the left and right positioning plate groups 42. The drive rack 35 is located in the drive cavity 121, and a transmission wheel 36 is provided on one side of the drive rack 35.A driven rack 37 is provided on one side of the transmission wheel 36. The driven rack 37 is arranged perpendicularly to the drive rack 35 and is located below the drive rack 35. A strip groove 371 is provided on the driven rack 37, and a slot 372 is provided in the strip groove 371. A front and rear positioning plate assembly 41 is slidably installed in the strip groove 371. A locking block 414 that cooperates with the slot 372 is provided on the front and rear positioning plate assembly 41. When the left and right positioning plate assemblies 42 slide in alignment, they drive the drive rack 35 fixedly installed below them to slide synchronously. During the sliding process, the drive rack 35 meshes with the transmission wheel 36, thereby driving the transmission wheel 36 to rotate. The rotation meshes with the driven rack 37, driving the driven rack 37 and the drive rack. 35. Vertical sliding: The driven rack 37 slides, driving the front and rear positioning plate assemblies 41 to move and center the integrated circuit chip. If the integrated circuit chip is rectangular, its long side corresponds to the left and right positioning plate assemblies 42. In this case, the front and rear positioning plate assemblies 41 first contact the integrated circuit chip. After contact, the driven rack 37 continues to slide under the action of the transmission wheel 36. At this time, the front and rear positioning plate assemblies 41 are subjected to the reaction force of the integrated circuit chip, causing the locking block 414 of the front and rear positioning plate assemblies 41 to disengage from the slot 372. The front and rear positioning plate assemblies 41 no longer slide with the driven rack 37 and remain fixed.

[0028] In this embodiment, the sliding cavity 321 is provided with an annular inclined surface 322, and the telescopic plate 332 is provided with a groove 3321 that cooperates with the annular inclined surface 322. Through the cooperation of the annular inclined surface 322 and the groove 3321, the friction between the sliding cavity 321 and the telescopic plate 332 is reduced, which facilitates the telescopic plate 332 to slide into the telescopic cavity 331 under the action of the sliding cavity 321, improves the efficiency of the separation of the bushing 33 and the fixed sleeve 32, and ensures the stability of the transmission.

[0029] In this embodiment, the slot 372 is divided into a fixed section 3721 and a sliding section 3722. The fixed section 3721 is a hemispherical structure 415, and the sliding section 3722 is a semi-cylindrical structure. The front and rear positioning plates are provided with a wave groove 412. A locking block 414 is slidably installed in the wave groove 412 by a support spring 413. The locking block 414 is a spherical structure 415 that cooperates with the hemispherical structure 415. The fixed section 3721 is used to fix the locking block 414 so that the front and rear positioning plate assemblies 41 move synchronously with the driven rack 37. The sliding section 3722 is used to limit the movement trajectory of the locking block 414 after it disengages from the fixed section 3721, thereby ensuring the stability of the front and rear positioning plate assemblies 41. The spherical structure 415 of the locking block 414 and the fixing groove of the hemispherical structure 415 cooperate with each other to enhance the contact area between the locking block 414 and the fixed section 3721, thereby facilitating the driven rack 37 to drive the front and rear positioning plates to move synchronously through the locking block 414. At the same time, the spherical structure 415 can easily disengage from the hemispherical structure 415, ensuring the efficiency of the locking block 414 disengaging from the slot 372. After the front and rear positioning plate assemblies 41 contact the integrated circuit chip, the front and rear positioning plate assemblies... 41 remains fixed under the action of the integrated circuit chip. At this time, the driven rack 37 continues to move forward, and the force of the fixed section 3721 on the locking block 414 increases, thereby pushing the locking block 414 to slide upward into the wave groove 412. The locking block 414 is supported by the support spring 413 to ensure synchronous movement with the front and rear positioning plate groups 41 and to achieve up and down sliding. Then the locking block 414 enters the sliding section 3722. Under the action of the sliding section 3722, the front and rear positioning plate groups 41 are kept stable. At the same time, since the locking block 414 is slidably installed in the wave groove 412, when the locking block 414 disengages from the fixed section 3721 and enters the sliding section 3722, the locking block 414 will not drive the front and rear positioning plates to slide upward, thereby ensuring the stability of the front and rear positioning plates.

[0030] In this embodiment, the reciprocating assembly 5 includes a telescopic rod 51, a top plate 52, a push rod 53, a transmission rack 54, a return spring, a stepped gear wheel 55, and a gear rack 56; one end of the telescopic rod 51 is installed with the fixed sleeve 32, and the other end of the telescopic rod 51 is fixedly installed with the top plate 52; the top plate 52 is provided with a push rod 53 fixedly connected to the bushing 33, and the transmission rack 54 is provided in front of the top plate 52; one end of the transmission rack 54 is located inside the I-shaped structure 411, and the other end of the transmission rack 54 is located in the reciprocating... Within the reciprocating groove 421, the transmission rack 54 and the reciprocating groove 421 are connected by a return spring. A stepped gear reducer 55 is provided above the transmission rack 54. The stepped gear reducer 55 is rotatably mounted in the middle of the reciprocating groove 421. The stepped gear reducer 55 is divided into a transmission section 551 and a speed-changing section 552. The transmission section 551 meshes with the transmission rack 54, and the speed-changing section 552 meshes with the speed-changing rack 56. The speed-changing rack 56 is slidably mounted within the reciprocating groove 421, and a cleaning film 6 is mounted on the speed-changing rack 56. Specifically, one end of the telescopic rod 51 is installed with the fixed sleeve 32, and the other end of the telescopic rod 51 is fixedly installed with the top plate 52; the top plate 52 is provided with a top rod 53 fixedly connected to the bushing 33, and a transmission rack 54 is provided in front of the top plate 52; the top plate 52 achieves synchronous movement with the fixed sleeve 32 under the action of the telescopic plate 332 and the top rod 53. After the left and right positioning plate groups 42 have completed the positioning and fixing of the left and right ends of the integrated circuit chip, the front and rear positioning plate groups 41 and the left and right positioning plate groups 42 have completed the positioning and fixing work of the integrated chip circuit. At this time, the drive motor 2 continues to rotate forward, thereby driving the drive shaft 31 to continue to rotate. The drive shaft 31 continues to slide horizontally through the threaded connection. At this time, the fixed sleeve 32 acts on the left and right positioning plates. When the bushing 33 remains fixed, the telescopic plate 332 and the sliding cavity 321 press against each other as the bushing 33 continues to move. This causes the telescopic plate 332 to press the telescopic spring 333 and slide into the telescopic cavity 331. The bushing 33 separates from the fixed sleeve 32 and continues to slide. At this time, the telescopic plate 332 of the bushing 33 slides into the telescopic cavity 331 and separates from the fixed sleeve 32, thus keeping the fixed sleeve 32 fixed. The bushing 33 continues to move and pushes the top plate 52 to continue to slide horizontally through the push rod 53. The top plate 52 is fixedly connected to the fixed sleeve 32 by the extension of the telescopic rod 51. One end of the transmission rack 54 is located in the I-shaped structure 411. When the left and right positioning plates slide in the center, they press the transmission rack 54 through the reciprocating cavity, thereby driving the transmission rack 54 to move in the same direction. In the step movement, the front and rear positioning plate assemblies 41 achieve a sliding connection with the transmission rack 54 through the I-shaped structure 411, and at the same time, support the transmission rack 54 to ensure its stability. The other end of the transmission rack 54 is located in the reciprocating groove 421, and the transmission rack 54 and the reciprocating groove 421 are connected by a return spring. A stepped speed-changing wheel 55 is provided above the transmission rack 54; the stepped speed-changing wheel 55 is rotatably mounted in the middle of the reciprocating groove 421. The stepped speed-changing wheel 55 is divided into a transmission section 551 and a speed-changing section 552. The gear ratio of the speed-changing section 552 is smaller than that of the transmission section 551, so that the transmission distance of the speed-changing section 552 is greater under the same number of rotations. The transmission section 551 meshes with the transmission rack 54, and the speed changes. Section 552 meshes with the gear rack 56; the gear rack 56 is slidably installed in the reciprocating groove 421, and a cleaning film 6 is installed on the gear rack 56. When the top plate 52 slides along the integrated circuit chip under the action of the bushing 33, the top plate 52 pushes the transmission rack 54 to move synchronously. The transmission rack 54 meshes with the transmission section 551 of the stepped gear wheel 55, thereby driving the stepped gear wheel 55 to rotate. When the stepped gear wheel 55 rotates, it drives the gear section 552 to rotate synchronously. The gear section 552 meshes with the gear rack 56, driving the gear rack 56 to slide horizontally. The gear rack 56 drives the cleaning film 6 to move synchronously. The cleaning film 6 cleans the dust on the integrated circuit chip, ensuring the cleanliness of the integrated circuit chip surface and improving the imaging effect.

[0031] In this embodiment, the telescopic rod 51 is composed of a fixed rod 511, a sliding rod 512 and a tension spring 513. The fixed rod 511 is fixedly connected to the fixed sleeve 32. The sliding rod 512 is slidably installed inside the fixed rod 511. The sliding rod 512 is fixedly connected to the top plate 52. The sliding rod 512 and the inner wall of the fixed rod 511 are connected by the tension spring 513. Specifically, when the bushing 33 drives the fixed sleeve 32 to move synchronously, the fixed rod 511 and the sliding rod 512 remain relatively fixed. When the bushing 33 disengages from the fixed sleeve 32, the bushing 33 pushes the top plate 52 to continue sliding through the push rod 53. The top plate 52 pulls the sliding rod 512 to move synchronously. The sliding rod 512 pulls the tension spring 513. The sliding rod 512 ensures its connection with the fixed rod 511 through the tension spring 513. At the same time, the fixed rod 511 ensures the connection between the top plate 52 and the fixed sleeve 32.

[0032] In this embodiment, the transmission rack 54 has an arc-shaped structure 541 at one end near the top plate 52; the top plate 52 is symmetrically provided with top blocks 521 that cooperate with the transmission rack 54; Specifically, the top plate 52 reduces the distance between itself and the transmission rack 54 through the top block 521, making it easier for the top plate 52 to push the transmission rack 54 to slide. The arc-shaped structure 541 of the transmission rack 54 reduces the friction between the top block 521 and the transmission rack 54, thereby making it easier for the top plate 52 to push the transmission rack 54 to slide through the top block 521 and improving the transmission efficiency.

[0033] In this embodiment, the cleaning film 6 is composed of a fixing rod 511 and an ultra-clean adhesive film 62. The cleaning rod 61 is divided into a positioning rod 611 and a centering rod 612. The centering rod 612 is slidably installed in the positioning rod 611 through a keyway. The centering rod 612 is rotatably connected to the gear rack 56 through a bearing. The ultra-clean adhesive film is rotatably installed on the cleaning rod 61. Specifically, when the positioning plate group moves to center, the left and right positioning plate groups 42 drive the gear rack 56 to slide synchronously, and then the gear rack 56 drives the centering rod 612 to slide into the positioning rod 611 to ensure the stable operation of the mechanism. At the same time, the cleaning film 6 slides synchronously with the gear rack 56 through the cleaning rod 61, and then drives the super-adhesive rubber ring to move synchronously to clean the surface of the integrated circuit chip.

[0034] In this embodiment, the centering rod 612 is provided with a deflection wheel 613, and the left and right positioning plate group 42 is linearly arrayed with toggle blocks 422; Specifically, the centering rod 612 moves synchronously with the left and right positioning plate assemblies 42 via the gear rack 56, thus keeping itself relatively stationary with the left and right positioning plate assemblies 42 in the horizontal direction. This causes the centering rod 612 to deflect and remain relatively stationary with the left and right positioning plate assemblies 42. At the same time, the centering rod 612 slides synchronously with the gear rack 56, maintaining relative sliding with the left and right positioning plate assemblies 42 in the front-back direction. This causes the deflection wheel 613 to move relative to the toggle block 422 on the left and right positioning plate assemblies 422. The toggle block 422 causes the deflection wheel 613 to rotate, which in turn causes the centering rod 612 to rotate. The centering rod 612 drives the positioning rod 611 to rotate synchronously via the keyway. The positioning rod 611 drives the super-adhesive rubber ring to rotate synchronously. The super-adhesive rubber ring rotates relative to the integrated circuit chip, enhancing the cleaning effect on the integrated circuit chip.

[0035] In use, the integrated circuit chip testing device 11 of the present invention places the integrated circuit chip on the testing platform 12, drives the motor 2 to rotate forward, and drives the drive shaft 31 to rotate synchronously. The drive shaft 31 slides horizontally through a threaded connection to the drive shaft 31 sleeve. The bushing 33 drives the fixed sleeve 32 to slide synchronously through the telescopic plate 332 rotatably connected to it. The fixed sleeve 32 pushes the active rod 341 to rotate. The active rod 341 drives the driven rod 343 to rotate. The driven rod 343 pushes the left and right positioning plate groups 42 to move in the center. The left and right positioning plate groups 42 drive the drive rack 35 to slide synchronously. The drive rack 35 drives the transmission wheel 36 to rotate. The transmission wheel 36 drives the driven rack 37 to slide. The driven rack 37 drives the front and rear positioning plate groups 41 to slide in the center. Simultaneously, the fixed sleeve 32 and the bushing 33 push the top plate 52 to slide synchronously through the telescopic rod 51 and the top rod 53, respectively. The left and right positioning plate assemblies 42 drive the transmission rack 54, the stepped gear wheel 55, and the gear rack 56 to slide synchronously. After the integrated circuit chip is positioned, the drive shaft 31 continues to rotate and slides horizontally. The telescopic plate 332 on the bushing 33 enters the telescopic cavity 331 under the pressure of the sliding cavity 321. The bushing 33 separates from the fixed sleeve 32, while the fixed sleeve 32 remains in place. Fixed, bushing 33 continues to slide forward. When bushing 33 slides, it pushes top plate 52 to move synchronously through push rod 53. Top plate 52 pushes transmission rack 54 to slide. Transmission rack 54 meshes with transmission section 551 of stepped gear wheel 55, thereby driving stepped gear wheel 55 to rotate. When stepped gear wheel 55 rotates, it drives gear section 552 to rotate synchronously. Gear section 552 meshes with gear rack 56, driving gear rack 56 to slide horizontally. Gear rack 56 drives cleaning film 6 to move synchronously. At this time, the drive motor 2 reverses, causing the drive shaft 31 to reverse as well. The drive shaft 31 slides backward to reset, and the drive shaft 31 drives the top plate 52 to reset via the push rod 53. The top plate 52 no longer presses against the transmission rack 54, and the transmission rack 54 slides back to reset under the action of the reset spring. The transmission rack 54 drives the stepped gear wheel 55 to reverse, and the stepped gear wheel 55 drives the gear rack 56 to slide back to reset. The gear rack 56 drives the cleaning film 6 to reset. When the cleaning film 6 has finished resetting, the sliding cavity 321 of the fixed sleeve 32 no longer presses against the telescopic plate 332, and the telescopic plate 332 extends and retracts. Under the action of spring 333, the sleeve 33 extends and contacts the inner wall of the sliding cavity 321. The bushing 33 drives the fixed sleeve 32 to slide back and reset through the telescopic plate 332. The fixed sleeve 32 pulls the active rod 341 to rotate. The active rod 341 drives the driven rod 343 to rotate. The driven rod 343 drives the left and right positioning plates to reset. At the same time, the left and right positioning plate group 42 drives the drive rack 35 to reset. The drive rack 35 drives the transmission wheel 36 to reverse. The transmission wheel 36 drives the driven rack 37 to reset. The driven rack 37 drives the front and rear positioning plate groups 41 to reset. The detection device 11 detects the integrated circuit chip.

[0036] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. An integrated circuit chip testing device (11), characterized in that, include: X-ray inspection machine (1), drive motor (2), centering assembly (3), positioning plate (4), reciprocating assembly (5) and cleaning film (6); The X-ray inspection machine (1) is equipped with an inspection device (11), and an inspection platform (12) is provided between the inspection devices (11). The inspection platform (12) is fixedly connected to the X-ray inspection machine (1), and a drive cavity (121) is provided on the inspection platform (12). The drive motor (2) is fixedly installed on the detection platform (12). A centering component (3) is provided in front of the drive motor (2). A positioning plate (4) is provided inside the centering component (3). There are two sets of positioning plates (4). The two sets of positioning plates (4) are slidably installed on the detection platform (12). When the X-ray inspection machine (1) is working, the drive motor (2) drives the two sets of positioning plates (4) to slide horizontally through the centering component (3) to realize the positioning of the integrated circuit chip. A reciprocating component (5) is provided in front of the centering component (3). A cleaning film (6) is provided on the reciprocating component (5). After the positioning plate (4) is centered, the centering component (3) drives the cleaning film (6) through the reciprocating component (5) to clean the integrated circuit chip.

2. The detection device (11) according to claim 1, characterized in that: The two sets of positioning plates (4) are divided into front and rear positioning plate groups (41) and left and right positioning plate groups (42). The left and right positioning plate groups (42) are provided with reciprocating grooves (421). A cleaning film (6) is slidably installed in the reciprocating grooves (421) through a reciprocating component (5). The front and rear positioning plate groups (41) are I-shaped structures (411). The reciprocating component (5) is slidably installed in the I-shaped structure (411).

3. The detection device (11) according to claim 2, characterized in that: The centering assembly (3) includes a drive shaft (31), a fixed sleeve (32), a bushing (33), a double linkage mechanism (34), a drive rack (35), a transmission wheel (36), and a driven rack (37). The drive shaft (31) is fixedly connected to the drive motor (2), and the drive shaft (31) is threaded, and a fixed sleeve (32) is slidably installed on the drive shaft (31). A sliding cavity (321) is provided on the fixed sleeve (32), and a bushing (33) is slidably installed in the sliding cavity (321). The bushing (33) is provided with a threaded groove that mates with the drive shaft (31). The bushing (33) is provided with a telescopic cavity (331). A telescopic plate (332) is rotatably installed in the telescopic cavity (331). The telescopic plate (332) and the telescopic cavity (331) are connected by a telescopic spring (333). The double linkage mechanism (34) consists of two parts. The double linkage mechanism (34) is composed of a driving rod (341), a connecting block (342) and a driven rod (343). One end of the driving rod (341) is rotatably connected to the fixed sleeve (32), and the other end of the driving rod (341) is rotatably connected to the connecting block (342). The connecting block (342) is rotatably connected to the driven rod (343), and the driven rod (343) is rotatably connected to the left and right positioning plate groups (42). A drive rack (35) is provided below the left and right positioning plate group (42); The drive rack (35) is located in the drive cavity (121), and a transmission wheel (36) is provided on one side of the drive rack (35). A driven rack (37) is provided on one side of the transmission wheel (36). The driven rack (37) is arranged perpendicularly to the driving rack (35) and is located below the driving rack (35); a strip groove (371) is provided on the driven rack (37), a slot (372) is provided in the strip groove (371), and a front and rear positioning plate assembly (41) is slidably installed in the strip groove (371). The front and rear positioning plate group (41) is provided with a locking block (414) that cooperates with the locking slot (372).

4. The detection device (11) according to claim 3, characterized in that: The sliding cavity (321) is provided with an annular inclined surface (322), and the telescopic plate (332) is provided with a groove (3321) that cooperates with the annular inclined surface (322).

5. The detection device (11) according to claim 3, characterized in that: The slot (372) is divided into a fixed section (3721) and a sliding section (3722). The fixed section (3721) is a hemispherical structure (415), and the sliding section (3722) is a semi-cylindrical structure. The front and rear positioning plates are provided with a wave groove (412), and a locking block (414) is slidably installed in the wave groove (412) by a support spring (413). The locking block (414) is a spherical structure (415) that cooperates with the hemispherical structure (415).

6. The detection device (11) according to claim 3, characterized in that: The reciprocating assembly (5) includes a telescopic rod (51), a top plate (52), a top rod (53), a transmission rack (54), a stepped gear wheel (55), and a gear rack (56). One end of the telescopic rod (51) is installed with the fixed sleeve (32), and the other end of the telescopic rod (51) is fixedly installed with the top plate (52); The top plate (52) is provided with a top rod (53) that is fixedly connected to the bushing (33), and a transmission rack (54) is provided in front of the top plate (52). One end of the transmission rack (54) is located in the I-shaped structure (411), and the other end of the transmission rack (54) is located in the reciprocating groove (421). The transmission rack (54) and the reciprocating groove (421) are connected by a return spring. A stepped speed-changing wheel (55) is provided above the transmission rack (54). The stepped gear wheel (55) is rotatably mounted in the middle of the reciprocating groove (421). The stepped gear wheel (55) is divided into a transmission section (551) and a speed-changing section (552). The transmission section (551) meshes with the transmission rack (54), and the speed-changing section (552) meshes with the speed-changing rack (56). The gear rack (56) is slidably installed in the reciprocating groove (421), and a cleaning film (6) is installed on the gear rack (56).

7. The detection device (11) according to claim 6, characterized in that: The telescopic rod (51) consists of a fixed rod (511), a sliding rod (512), and a tension spring (513). The fixed rod (511) is fixedly connected to the fixed sleeve (32). The sliding rod (512) is slidably installed inside the fixed rod (511). The sliding rod (512) is fixedly connected to the top plate (52). The sliding rod (512) is connected to the inner wall of the fixed rod (511) by the tension spring (513).

8. The detection device (11) according to claim 6, characterized in that: The transmission rack (54) has an arc-shaped structure (541) at one end near the top plate (52); the top plate (52) is symmetrically provided with top blocks (521) that cooperate with the transmission rack (54).

9. The detection device (11) according to claim 6, characterized in that: The cleaning film (6) consists of a cleaning rod (61) and an ultra-clean adhesive film (62). The cleaning rod (61) is divided into a positioning rod (611) and a centering rod (612). The centering rod (612) is slidably installed in the positioning rod (611) through a keyway. The centering rod (612) is rotatably connected to the gear rack (56) through a bearing. The ultra-clean adhesive film is rotatably installed on the cleaning rod (61).

10. The detection device (11) according to claim 9, characterized in that: The centering rod (612) is provided with a deflection wheel (613), and the left and right positioning plate groups (42) are linearly arrayed with toggle blocks (422).

Images