Integrated comprehensive network board with extensible functions

Abstract

The invention discloses a function-extensible integrated comprehensive network board, which is characterized in that through the integrated design and processing technology of a printed board, the traditional large-current lead interconnection is converted into vertical lead-free interconnection in the board, the transmission of high-voltage large-current signals in a limited space is realized, the control transmission of an array plane can be realized at the same time, and the integrated comprehensive network board has the advantages of high-voltage large-current signal transmission, high-voltage large-current signal transmission, high-voltage large-current signal transmission, high-voltage large-current signal transmission and high-voltage large-current signal transmission. Radio frequency distribution, power supply energy storage and other extended functions are realized. The problem of transmission of high-voltage large-current signals in a limited space is solved, and traditional large-current lead interconnection is innovatively converted into in-board vertical leadless interconnection through an optimized printed board integrated pressing process; the antenna also has extensible functions, namely, control transmission, radio frequency distribution, power supply energy storage and the like of an array plane can be realized at the same time. Therefore, the transmission problem of high-voltage large-current signals of the active phased array radar in a limited space is effectively solved, and the engineering requirements of function expansion can be met.

Description

Technical Field

[0001] This invention relates to antenna and microwave technology, and in particular to an integrated network board with scalable functionality. Background Technology

[0002] Currently, active broadband phased array radars are being used more and more widely, and highly integrated integrated network design has become the mainstream design for radar array feed systems.

[0003] The main function of a network integrated board is to distribute high-current signals, control signals, and radio frequency signals to each transceiver module, while also providing power storage for these modules. The design of network integrated boards has evolved from discrete component assembly to mechanical pressing assembly and thermoforming assembly. Thermoforming assembly network integrated boards are widely used in active phased array radar arrays. This method uses a thermoforming process to fabricate hybrid multilayer boards to distribute wave control signals and synthesize radio frequency signals. After thermoforming, the busbar is interconnected with the multilayer boards via soldered cables. Summary of the Invention

[0004] To address the problems existing in the prior art, this invention provides a solution to the transmission of high-voltage, high-current signals in confined spaces. Through an optimized integrated printed circuit board (PCB) lamination process, it innovatively transforms traditional high-current lead interconnections into vertical, leadless interconnections within the PCB. This invention also features functional scalability, enabling simultaneous array control transmission, RF distribution, and power storage. Therefore, it effectively solves the problem of transmitting high-voltage, high-current signals in confined spaces in active phased array radars and meets engineering requirements for functional expansion.

[0005] The objective of this invention is achieved through the following technical solutions.

[0006] A scalable integrated network board, through integrated PCB design and manufacturing technology, transforms traditional high-current leaded interconnects into vertical leadless interconnects within the board, enabling the transmission of high-voltage, high-current signals in a limited space. It can also simultaneously provide extended functions such as array control transmission, RF distribution, and power storage.

[0007] This invention includes an integrated design and processing technology for printed circuit boards. The overall process flow of the technology includes: (1) raw material preparation → (2) cutting and grooving → (3) internal pattern making → (4) pressing and molding → (5) drilling, electroplating and surface pattern making. In the pressing and molding process (4), the thickness of the metal base is generally much thicker than that of the copper foil. This causes the metal base, copper foil, copper-clad laminate substrate and prepreg to have different shrinkage and expansion forces due to thermal expansion and contraction during the pressing process, which can easily lead to inconsistencies. This invention avoids the misalignment between the various parts by accurately evaluating the expansion and contraction coefficient. At the same time, compared with traditional pressing, the selection of prepreg only needs to consider the thickness of the upper and lower metal layers and the proportion of copper cladding area. The copper pillar design of this invention needs to take into account the flow of the prepreg along the direction of the copper pillar to ensure the adhesion and fixation of the copper pillar. At the same time, the accurate evaluation of the thickness loss of the prepreg in the horizontal direction ensures the flushness of the height of the copper pillar with the surrounding copper skin.

[0008] This invention employs an integrated copper pillar to transmit high-voltage, high-current signals. Replacing traditional drilling with an integrated copper pillar, which is a solid, pure metal material (volume resistivity of approximately 1.7E-6 Ω•cm), its cross-sectional area significantly exceeds that of a drilled hole. This allows for a rapid increase in current-carrying area, thus meeting the electrical performance requirements of high-current products. Furthermore, the integrated copper pillar, instead of traditional independent welded pillars, effectively avoids the risks of tilting and detachment, greatly improving reliability.

[0009] This invention combines high-current transmission with multi-functional integration. The entire integrated network consists of functional area (I), integrated copper base (II), and functional area (III), which are integrated and laminated together using integrated design and processing technology. The functional area can be used for power storage (surface-mount energy storage capacitor A1), as well as for the transmission of control signals and radio frequency signals. Functional areas (I) and (III) can be selectively used according to actual functional requirements. The surface of the functional area can be used for mounting various devices, especially for high heat dissipation devices, enabling double-sided heat dissipation. Figure 3 Therefore, the function area can realize a wealth of extended functions.

[0010] Compared to existing technologies, the advantages of this invention are as follows: This invention transforms traditional high-current lead interconnects into vertical leadless interconnects within the board through integrated printed circuit board design and processing technology, achieving the transmission of high-voltage, high-current signals in confined spaces. Furthermore, this invention also incorporates extended functions such as control transmission, radio frequency distribution, and power storage. Therefore, it effectively solves the problem of high-voltage, high-current signal transmission in confined spaces for active phased array radars and can meet engineering requirements for functional expansion.

[0011] (1) High current transmission: In the traditional method of calculating the current carrying capacity in the vertical direction, drilling is used. Often, the drilled hole is filled with resin, which is an insulating material. Therefore, from the perspective of cross-sectional area, only the copper ring around the hole wall is used for current carrying. However, this invention uses copper pillars instead of drilling. The copper pillars are solid and have a cross-sectional area that is much larger than that of the drilled hole. Therefore, the current carrying area can be increased rapidly, thereby meeting the electrical performance requirements of high current products.

[0012] (2) High reliability: In traditional processes, to achieve the integrated design of vertical copper pillars and horizontal metal bases, separate copper pillars are often used and fixed to the surface of the horizontal metal base by welding. This not only makes alignment difficult but also makes it easy to weld at an angle, resulting in poor reliability and easy detachment. In this invention, the vertical copper pillars and horizontal metal bases are designed as a single unit, avoiding this risk and achieving higher reliability.

[0013] (3) High thermal conductivity: Copper metal substrate is a good thermal conductivity medium and can quickly dissipate heat. Therefore, the closer the power device on the printed circuit board is to the metal substrate, the better the heat dissipation performance and the longer the device life. However, traditional products only contain one layer of metal substrate in the printed circuit board, which often results in one side being neglected and the other side not being able to achieve heat dissipation on both sides at the same time. A double-layer metal substrate can perfectly solve this problem.

[0014] (4) Functional Scalability: The integrated network of this invention consists of functional area (Ⅰ), integrated copper base (Ⅱ), and functional area (Ⅲ), which are integrated and laminated together through integrated design and processing technology. The functional area can be used for power storage, as well as for the transmission of control signals and radio frequency signals. The surface of the functional area can be used for mounting various devices. Especially for high heat dissipation devices, double-sided heat dissipation can be achieved. The upper and lower functional areas can be selectively used according to actual functional requirements, and rich expansion functions can be realized. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the raw material preparation process of the present invention.

[0016] Figure 2 This is a schematic diagram of the cutting and grooving process of the present invention.

[0017] Figure 3 This is a schematic diagram of the internal graphic manufacturing process of the present invention.

[0018] Figure 4 This is a schematic diagram of the compression molding process of the present invention.

[0019] Figure 5 This is a schematic diagram of the drilling, electroplating, and surface pattern fabrication process of the present invention.

[0020] Figure 6 This is a schematic diagram of different heat conduction methods of the present invention.

[0021] Figure 7 This is a schematic diagram of the double-sided heat dissipation of the present invention.

[0022] Figure 8 This is a schematic diagram illustrating the high reliability of the present invention.

[0023] Figure 9 This is a diagram illustrating an application example of the integrated high-current transmission and energy storage of the present invention.

[0024] Figure 10 This is a schematic diagram of the stacked layer for the integrated application of high current transmission and multiple functions of the present invention. Detailed Implementation

[0025] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0026] This invention transforms traditional high-current lead interconnection into vertical leadless interconnection within the board through integrated design and processing technology of printed circuit boards, realizing the transmission of high-voltage and high-current signals in a limited space; the invention also has extended functions such as control transmission, radio frequency distribution, and power storage.

[0027] like Figure 1-5 The integrated design and processing technology of the integrated network board shown includes (1) raw material preparation, (2) cutting and grooving, (3) internal pattern making, (4) pressing and molding, and (5) drilling, electroplating and surface pattern making.

[0028] (1) Raw material preparation: Prepare raw materials and cut them into processing dimensions as required; 101 and 104 are epoxy copper clad laminates, of which *-1 and *-3 are copper foils, *-2 is the substrate, and 102 and 103 are the required copper pillar metal bases, made of red copper. The height of the copper pillars is theoretically calculated based on the thickness of each layer of the laminate.

[0029] (2) Cutting and grooving: Machining the inner layer clearance groove to prepare for pressing; the clearance groove consists of two parts, one is the groove used to avoid the copper pillar, such as Figure 2 Point A; secondly, to avoid short circuits between the finished interconnect holes and the grooves of metal base 102 and 103, such as... Figure 2 Point B.

[0030] (3) Internal pattern making: The inner layer pattern is processed, and the prepreg is also processed to prepare for lamination; 101-3 and 104-1 are the inner layer patterns to be pre-processed, 102 and 103 are filled with resin in the milled groove area, and the prepregs 105 and 106 are pre-processed with grooves to avoid the copper pillars in the area to be inserted, and the prepreg 107 is not specially treated.

[0031] (4) Pressing and molding: Press the epoxy copper-clad laminate and the copper pillar metal base together; using the pre-prepared prepreg sheets 105, 106, and 107, in the order of stacking, under high temperature and high pressure, the prepreg sheets begin to melt and flow, thereby bonding the various materials (101+102+103+104) to form a whole, where black indicates the area filled by the flow of the prepreg sheets.

[0032] (5) Drilling, electroplating and surface pattern making: Drilling and electroplating, making surface patterns, and applying green oil to form the shape; drilling, electroplating, and pattern making of the outer layer, and plugging holes, etc. Finally, the printed circuit board is milled out with a milling cutter to complete the integrated processing and forming.

[0033] like Figure 6 This diagram illustrates different current-carrying methods. Traditionally, vertical current carrying is achieved through drilling and then plugging the borehole. When resin is chosen as the plugging material (resistivity approximately 4.9E13 Ω·cm), only the copper ring around the borehole wall serves as the current carrier, as resin is an insulating material. When copper paste (resistivity approximately 4E-5 Ω·cm) is chosen, the entire borehole cross-section can be used for current carrying, resulting in a higher current-carrying capacity for the same borehole diameter compared to resin plugging. This invention uses copper pillars instead of boreholes. Copper pillars are solid, pure metal (resistivity approximately 1.7E-6 Ω·cm), with a significantly larger cross-sectional area than boreholes. This allows for a rapid increase in the current-carrying area, thus meeting the electrical performance requirements of high-current products.

[0034] From the perspective of orifice plugging, the orifice size of resin plugs is generally controlled within 0.15~1mm, and the thickness-to-diameter ratio must not exceed 12:1. The orifice size of copper paddle plugs is generally controlled within 0.2~0.5mm, and the thickness-to-diameter ratio must not exceed 10:1. The integrated copper pillar used in this invention has no limitations on orifice size and thickness-to-diameter ratio, and the size of the copper pillar can be selected according to actual needs. Therefore, this invention is more advantageous in terms of both current carrying capacity and processing feasibility.

[0035] like Figure 7 This is a schematic diagram of the double-sided heat dissipation of the present invention. As is well known, copper metal substrates are excellent thermal conductors, capable of rapidly dissipating heat. Therefore, theoretically, the closer a power device is to the metal substrate on a printed circuit board, the better its heat dissipation performance and the longer its lifespan. However, traditional products often contain only one layer of metal substrate in the printed circuit board, which frequently results in compromised heat dissipation on both sides, failing to achieve effective heat dissipation simultaneously. A double-layer metal substrate can perfectly solve this problem, such as… Figure 7 In the middle, the metal substrate of 202 dissipates heat for the device of 201, and the metal substrate of 203 dissipates heat for the device of 204.

[0036] like Figure 8This is a schematic diagram illustrating the high reliability of the present invention. In traditional processes ( Figure 8 (Right) To achieve a combined design of a vertical copper pillar and a horizontal metal base, separate copper pillars are often used, fixed to the surface of the horizontal metal base by welding. This not only makes alignment difficult but also easily leads to weld misalignment, resulting in poor reliability and easy detachment. However, in this invention ( Figure 8 (Left) The vertical copper pillar and horizontal metal base are integrated into one design, avoiding this risk and making it more reliable.

[0037] like Figure 9 The diagram illustrates an integrated application of high-current transmission and energy storage. A1 is an energy storage capacitor used for power supply and energy storage. A2 is a terminal block for external high-current input; this terminal block is integrally formed from a vertical copper column and a horizontal metal plate, enabling high-current transmission. B1 is a mounting hole, allowing for adjustments to the number and position of B1s as needed. B2 is a weight-reduction slot, contributing to the overall lightweight design of the integrated network board.

[0038] like Figure 10 This is a schematic diagram of a multi-functional integrated application for high-current transmission. The entire integrated network consists of functional area (Ⅰ), integrated copper base (Ⅱ), and functional area (Ⅲ), which are integrated and laminated together using integrated design and processing technology. The functional area can be used for power storage (surface-mount energy storage capacitor A1), as well as for the transmission of control signals and radio frequency signals. Functional areas (Ⅰ) and (Ⅲ) can be selectively used according to actual functional requirements. K1~K4 are vertical signal vias within the functional area, and K5~K6 are vertical vias used for the functional area to draw power from the high-current area. These vertical vias carry small currents and require plugging. Traditional plugging fixtures only support planar plugging, while for metal bases with copper pillars, since the copper pillars are protruding, this invention customizes a plugging fixture to avoid the copper pillar area to ensure the reliability of plugging. After the plugging and plating are completed, the surface of the functional area is flat and can be used for the mounting of various devices, especially for high heat dissipation devices, which can achieve double-sided heat dissipation. Figure 3 This allows for a wide range of extended functionalities.

Claims

1. A functionally expandable integrated network board, characterized in that: Through integrated design and processing technology of printed circuit boards, the traditional high-current lead interconnection is transformed into vertical leadless interconnection within the board, realizing the transmission of high-voltage and high-current signals in a limited space; at the same time, it also has the extended functions of control transmission, radio frequency distribution, and power storage.

2. The functionally expandable integrated network board according to claim 1, characterized in that: The integrated design and processing technology of the printed circuit board includes the following overall process flow: raw material preparation, cutting and grooving, internal pattern making, pressing and molding, drilling, electroplating, and surface pattern making.

3. The functionally expandable integrated network board according to claim 1, characterized in that... The pressing process involves precisely assessing the expansion and contraction coefficients of the metal substrate, copper foil, copper-clad laminate substrate, and prepreg during the pressing process to avoid misalignment between the components. Simultaneously, the selection of the prepreg only requires consideration of the thickness of the upper and lower metal layers and the proportion of the copper cladding area. The copper pillar design must also ensure that the prepreg flows along the direction of the copper pillar to guarantee its adhesion and fixation. Furthermore, precise assessment of the prepreg's thickness loss in the horizontal direction ensures the flushness of the copper pillar's height with the surrounding copper surface.

4. The functionally expandable integrated network board according to claim 1, characterized in that: Copper pillars are used instead of drilled holes. Copper pillars are solid pure metal materials with a cross-sectional area that exceeds that of drilled holes, thus rapidly increasing the current-carrying area and meeting the electrical performance requirements of high-current products.

5. The scalable integrated network board according to claim 1, characterized in that: The entire integrated network includes a first functional area, an integrated copper base, and a second functional area. The three are integrated and pressed together through integrated design and processing technology. The first and second functional areas are used for power storage and can also be used for the transmission of control signals and radio frequency signals. The first and second functional areas are used selectively according to actual functional requirements.

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