OCR (Optical Character Reduction) glue pouring process

The OCR potting process, which uses pre-sealing and gradient negative pressure curing, solves the problem of inaccurate glue flow control in existing technologies, achieves efficient potting operations, improves the optical and mechanical properties of display panels, and expands production capacity.

CN120861366APending Publication Date: 2025-10-31DONGGUAN JINGBANG PHOTOELECTRIC TECH CO LTD
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Patent Information

Application Number
CN202511083025.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-08-04
Publication Date
2025-10-31

AI Technical Summary

Technical Problem

The existing fully enclosed four-sided VHB potting process cannot dynamically inject adhesive, resulting in inaccurate control of adhesive flow and problems such as curing deformation, optical distortion, and interface delamination.

Method used

The VHB is pre-sealed on three sides, and dynamic sealing is achieved by tearing the glue inlet. The glue filling operation is achieved by combining gradient negative pressure curing with hot pressing. The process includes incoming material inspection, pretreatment, pre-bonding and glue filling, leveling and vacuum treatment, curing and post-treatment.

Benefits of technology

It achieves precise control over adhesive flow, improves bond strength and filling properties, reduces foreign matter generation, enhances production capacity expansion capabilities, and improves optical performance and mechanical strength.

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Abstract

The invention discloses an OCR (Optical Character Reduction) glue pouring process. The method comprises the following steps: S1, incoming material inspection: inspecting an LCM (Liquid Crystal Module), a cover plate and OCR (Optical Character Recognition) glue, and performing full-electric test and appearance defect inspection on the LCM; s2, pretreatment is conducted, specifically, the OC and the CG are cleaned, VHB adhesive tape is pasted to the three edges of the OC, and a glue injection opening is reserved; s3, pre-lamination and glue injection are conducted, specifically, pre-lamination is conducted through an alignment system, and glue injection is conducted through an AB double-liquid glue mixing machine; s4, leveling and vacuum treatment are conducted, intelligent leveling is achieved through a leveling platform deck, and gradient negative pressure defoaming is conducted; and S5, curing and post-treatment are conducted, stepped curing is conducted, defoaming treatment is conducted after stepped curing, then inspection and reinforcement are conducted, and finally packaging and storage are conducted. By means of the glue filling process, the advantages of dynamic glue injection and accurate glue flow control are achieved, pre-sealing is adopted for sealing three edges of VHB, then dynamic sealing is conducted according to a glue injection opening tearing hand, and finally sealing is conducted, and glue filling operation is achieved through gradient negative pressure curing thermocompression bonding.
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Description

Technical Field

[0001] This invention relates to the field of display panel manufacturing technology, and more specifically to an OCR potting process. Background Technology

[0002] Display panels are key components in electronic devices used to display images, text, and other information. They are widely used in electronic products such as televisions, mobile phones, and tablets. A display panel is an electronic component that uses optoelectronic technology to present images. Its core function is to convert electrical signals into visual images or text information. As a core component of a display, it directly determines key performance indicators such as color reproduction, contrast ratio, and refresh rate. Therefore, the potting process is particularly important in the manufacturing of display panels.

[0003] Current display control devices and systems used to control full-color displays are unable to identify and handle these intrusions.

[0004] To address the aforementioned technical issues, CN110379360A discloses a display control device and system for controlling a full-color display screen. This display control device and system can automatically optimize the data of the feature library. When multiple such display control devices and systems are put into use, they can also share resources, thereby providing more comparative analysis samples and improving the accuracy of the analysis.

[0005] For example, the existing technology center uses a fully enclosed four-sided VHB, which cannot dynamically inject adhesive. It also has a single negative pressure curing method, and the gradient degassing problem has not been solved. In particular, the problems of curing deformation, optical distortion and interface delamination caused by inaccurate control of adhesive flow are not resolved. Summary of the Invention

[0006] The purpose of this invention is to provide an OCR potting process that employs pre-sealing of three sides of the VHB, followed by dynamic sealing based on the tearing action at the injection port, and finally sealing through gradient negative pressure curing thermo-pressing to achieve the potting operation, thereby solving the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: an OCR potting process, comprising the following steps;

[0008] S1, Incoming material inspection, inspecting LCM modules, cover plates, and OCR adhesives, and conducting full electrical testing and appearance defect inspection on LCM modules.

[0009] S2, Pre-treatment: Clean OC and CG, apply VHB tape to three sides of OC and leave glue injection ports;

[0010] S3, pre-bonding and glue injection, uses an alignment system for pre-bonding and uses an AB two-component glue mixer for glue injection;

[0011] S4, leveling and vacuum treatment, intelligent leveling is achieved through a leveling stage, and gradient negative pressure degassing is performed;

[0012] S5, curing and post-treatment, involves step-by-step curing, followed by degassing, inspection and reinforcement, and finally packaging and storage.

[0013] For example, the specific tests conducted on dry boards and adhesives during the incoming material inspection are as follows:

[0014] The dimensions of the cover plate need to be checked, and the type of adhesive also needs to be verified.

[0015] For example, the VHB release tweezer width at the glue injection port in the pretreatment is 6.5±0.2mm;

[0016] The VHB tape used is 3M™ 5925.

[0017] For example, the pre-bonding and glue injection process uses an alignment system with an accuracy of ±0.05mm, and the alignment deviation of the alignment system is ≤0.1mm;

[0018] The AB two-component mixing machine dispenses adhesive at a mixing ratio of 1:3±5%, with a dispensing temperature of 25±1℃ and a pressure of 0.15-0.25MPa.

[0019] For example, the adhesive used in the pre-bonding and dispensing process is DELOKatiobond 4592, and the taper of the dispensing tube used in the dispensing process of the AB two-component mixer is 15°.

[0020] For example, during the leveling and vacuum treatment, the gradient negative pressure degassing is first -80kPa / 2h, and then -40kPa / 16h.

[0021] For example, the intelligent leveling of the leveling stage in the leveling and vacuum processing follows the leveling control formula Fadjust=0.38⋅(hreal−htarget)+1.2⋅(dh / dt).

[0022] For example, in the curing and post-treatment, the curing is carried out in stages: first at 60℃ for 40 minutes, then at 50℃ / -40kPa-60℃, and at atmospheric pressure -80℃ / +10kPa.

[0023] For example, the degassing treatment conditions in the curing and post-treatment are 50°C and 0.25kPa for 20 minutes, and the final product has a haze of ≤0.12% and a 90° peel force of ≥12.5N / cm.

[0024] For example, the alignment system includes an alignment module with a multispectral CCD, and the leveling stage is a six-degree-of-freedom leveling stage.

[0025] The wavelength of the multispectral CCD alignment module is 400-1100nm, the six-degree-of-freedom leveling stage includes KF sag compensation, the natural frequency of the leveling stage is >200Hz, and the glue temperature control accuracy of the dynamic dispensing system is ±0.3℃.

[0026] Compared with the prior art, the beneficial effects of the present invention are:

[0027] This invention achieves the advantages of dynamic glue injection and precise glue flow control through this glue-filling process. It employs a pre-sealing of the VHB three sides, followed by dynamic sealing based on the tear-off handle at the glue inlet. The final seal is achieved through gradient negative pressure curing and thermo-pressing. The tube-filling process has excellent filling properties. The glue, when poured into the product in a liquid state, can better fill the product, especially when there are product gaps or other deformations. When the glue is poured into the product while it is still liquid, only one curing step is needed for better product adhesion and stronger bond strength, preventing later bubbling. After the product is framed, only the glue inlet is slightly open during glue injection, allowing for a short period of exposure to the atmosphere, which better controls the occurrence of foreign matter. The leveling platform during manufacturing is more compatible with various product models, eliminating the need for frequent jig openings later. When expanding production capacity in the future, only adding glue-filling machines is needed to further increase capacity.

[0028] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures pointed out in the description and the drawings. Attached Figure Description

[0029] Figure 1 This is a process flow diagram of the present invention. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] This invention provides an OCR potting process, comprising the following steps;

[0032] S1, Incoming material inspection, inspecting LCM modules, cover plates, and OCR adhesives, and conducting full electrical testing and appearance defect inspection on LCM modules.

[0033] S2, Pre-treatment: Clean OC and CG, apply VHB tape to three sides of OC and leave glue injection ports;

[0034] S3, pre-bonding and glue injection, uses an alignment system for pre-bonding and uses an AB two-component glue mixer for glue injection;

[0035] S4, leveling and vacuum treatment, intelligent leveling is achieved through a leveling stage, and gradient negative pressure degassing is performed;

[0036] S5, curing and post-treatment, involves step-by-step curing, followed by degassing, inspection and reinforcement, and finally packaging and storage.

[0037] Preferably, the specific tests for dry board and glue in the material inspection are as follows:

[0038] The dimensions of the cover plate need to be checked, and the type of adhesive also needs to be verified.

[0039] LCM module inspection process: The process combines automated optical inspection (AOI) equipment with manual re-inspection. The AOI equipment is equipped with a 5-megapixel industrial camera and has an inspection speed of 30 pieces / minute. It can automatically identify foreign objects larger than 0.03mm and backlight scratches inside the screen.

[0040] Manual re-inspection focuses on checking suspected defects in AOI markings, using a 30x magnifying glass to confirm the size of dark spots; ≤0.05mm is acceptable.

[0041] The light leakage value of the black screen is detected using a spectrometer. In a dark room with an illuminance of ≤1 lux, the probe is placed close to the edge of the module, and the measured value must be ≤2 cd / m². This can be verified according to the LCM incoming material inspection standard.

[0042] Calibration of cover plate inspection tools: Calipers with an accuracy of 0.001mm are calibrated with standard gauge blocks before starting work every day. The two-dimensional measuring instrument has a measuring range of 500×300mm. The laser interferometer is calibrated weekly to ensure that the dimensional measurement deviation is ≤0.002mm.

[0043] The transmittance tester uses a xenon lamp light source with a wavelength of 380-780nm. Before testing, it is calibrated with a standard white board with a transmittance of 99.9%. The light transmittance of the cover plate must be ≥92%. Refer to the cover plate material inspection standard.

[0044] Adhesive Traceability System: A QR code traceability system is established, with each batch of adhesive affixed with a unique QR code containing information such as production batch, raw material source, and quality inspection report. The system allows for easy tracking by scanning the code. Shelf life management uses an MES system for automatic early warning. Adhesive that is 30 days away from its expiration date triggers a yellow alert and is subject to mandatory isolation and storage. Expired adhesive directly triggers a red alert and is destroyed and recorded by designated personnel.

[0045] Among them, the VHB release tear handle width at the glue injection port during pretreatment is 6.5±0.2mm;

[0046] The VHB tape used is 3M™ 5925.

[0047] Cleaning process parameters: The cleaning agent is a mixture of isopropanol and deionized water in a ratio of 7:3, with a resistivity ≥18.2MΩ・cm. The lint-free cloth is made of microfiber material with a density of 300g / ㎡. When wiping, apply a pressure of 50±5g / cm² and wipe in a "Z" shaped path for 3 times to avoid static electricity accumulation caused by unidirectional wiping. The static voltage must be controlled at ≤50V and monitored in real time with a static electricity tester.

[0048] VHB tape bonding control: The automatic tape applicator has a positioning accuracy of ±0.02mm, a bonding pressure of 0.3±0.02MPa, and a bonding temperature of 40±2℃ to activate the tape's adhesiveness. The tape is cut using a 10W laser cutter with a cut roughness Ra≤0.8μm to avoid burrs caused by mechanical cutting.

[0049] The release paper tear handle at the glue injection port is die-cut to ensure that the edges are free of serrations. The peel force between the tear handle and the tape body is controlled at 5-8N / 25mm, and tested with a tensile testing machine.

[0050] Furthermore, an alignment system with an accuracy of ±0.05mm is used in pre-bonding and glue injection, and the alignment deviation of the alignment system is ≤0.1mm;

[0051] The AB two-component mixing machine dispenses adhesive at a mixing ratio of 1:3±5%, with a dispensing temperature of 25±1℃, a pressure of 0.15-0.25MPa, and PID control.

[0052] Furthermore, the adhesive used in the pre-bonding and dispensing processes is DELOKatiobond 4592, and the taper of the dispensing tube used in the dispensing process of the AB two-component mixer is 15°.

[0053] Alignment system debugging: After powering on the Muirhead CCD alignment system, perform benchmark calibration using a standard alignment target with an accuracy of ±0.001mm. The calibration time is approximately 15 minutes, ensuring that the X / Y axis positioning deviation is ≤0.03mm and the θ angle deviation is ≤0.01°.

[0054] The lighting assistance uses an LED backlight panel with a color temperature of 6500K±200K and a brightness adjusted to 300±20cd / ㎡. The alignment mark between the cover plate and the LCM is captured by a CCD camera to achieve sub-pixel level alignment. The dispensing machine parameter calibration is performed as follows: Before starting the AB two-component dispensing machine, the mixing ratio is verified. A 50g mixed sample is extracted, and the content of components A and B is analyzed using a gas chromatograph. If the deviation exceeds ±3%, the metering pump needs to be recalibrated.

[0055] The injection tubing is made of PTFE, which is resistant to chemical corrosion. It has an inner diameter of 0.8±0.05mm and is replaced every 500 pieces produced to avoid flow fluctuations caused by pipe wear.

[0056] The glue injection trajectory adopts a spiral advance, spreading from the center of the injection port to the edge at a speed of 5±0.5mm / s to ensure uniform glue filling.

[0057] In addition, during leveling and vacuum treatment, the gradient negative pressure degassing process is first -80kPa / 2h, and then -40kPa / 16h. -80kPa / 2h removes large bubbles, and -40kPa / 16h eliminates microbubbles.

[0058] The intelligent leveling of the leveling stage in leveling and vacuum processing follows the leveling control formula Fadjust=0.38⋅(hreal−htarget)+1.2⋅(dh / dt).

[0059] Leveling stage adjustment: After the six-degree-of-freedom leveling stage is turned on, it is horizontally calibrated. The levelness is ≤0.02mm / m. The rollers are made of silicone with a hardness of 60±5ShoreA. The contact pressure is controlled by a pressure sensor in a closed loop and displayed in real time on the operation interface with an accuracy of ±0.1N.

[0060] The leveling environment temperature should be controlled at 25±0.5℃ and the relative humidity at 45±5% to avoid changes in adhesive viscosity caused by temperature and humidity fluctuations. The viscosity should be maintained at 5000±300 cP and measured once per hour using a rotational viscometer.

[0061] Vacuum degassing equipment operation: The vacuum pump unit adopts a Roots and rotary vane composite unit, with an ultimate vacuum degree ≤1Pa;

[0062] In stage 1, the pressure rise rate of -80kPa is controlled at 5kPa / min to avoid glue splashing caused by sudden pressure drop;

[0063] Phase 2 uses a step-down method to reduce the pressure by 5 kPa every 2 hours until it stabilizes at -40 kPa.

[0064] Multiple temperature sensors with an accuracy of ±0.1℃ are installed in the vacuum chamber to ensure that the temperature difference between each area is ≤1℃, thus avoiding curing differences caused by uneven temperature.

[0065] In addition, during the curing and post-treatment, the curing process is carried out in stages: first at 60℃ for 40 minutes, then at 50℃ / -40kPa-60℃, and at atmospheric pressure at -80℃ / +10kPa.

[0066] The degassing treatment conditions during curing and post-treatment are 50℃ and 0.25kPa for 20min. The final product has a haze of ≤0.12% and a 90° peel force of ≥12.5N / cm.

[0067] Oven program settings: Stepped curing uses a programmable oven with a temperature control accuracy of ±1℃;

[0068] In the first stage, the heating rate is set to 3℃ / min at 60℃ / 40min to avoid internal stress caused by rapid heating.

[0069] During the second stage of conversion, the pressure change rate is ≤10kPa / min and the temperature change rate is ≤2℃ / min.

[0070] The airflow velocity inside the oven is 0.5±0.1m / s, which needs to be measured with an anemometer to ensure uniform heat distribution.

[0071] Secondary degassing process: A vacuum oven is used. First, the vacuum is evacuated to 0.25 kPa for ≤5 min. Then, the temperature is raised to 50℃ at a rate of 2℃ / min. After holding for 20 min, the pressure is naturally released for ≥10 min to avoid pressure shocks that could generate new bubbles.

[0072] Finally, the alignment system includes an alignment module with a multispectral CCD, and the leveling stage is a six-degree-of-freedom leveling stage.

[0073] The wavelength of the multispectral CCD alignment module is 400-1100nm, the six-degree-of-freedom leveling stage includes KF sag compensation, the natural frequency of the leveling stage is >200Hz, and the glue temperature control accuracy of the dynamic dispensing system is ±0.3℃.

[0074] During the visual inspection process, the product can be disassembled and inspected according to the original routine procedure.

[0075] In addition, it also includes inspection and reinforcement:

[0076] Appearance inspection standards: use a darkroom inspection table with a brightness of 5000 cd / ㎡, an inspection distance of 30±5cm, an angle of 45°, and an inspection time of ≥10s per piece;

[0077] Bubble judgment criteria: Bubbles with a diameter ≤ 0.05mm and a number ≤ 3 are acceptable; bubbles with a diameter of 0.05-0.1mm are not allowed.

[0078] Light leakage detection is performed under a black screen. The module is covered with a light shield, leaving only a 1mm gap at the edge. The light leakage area is captured by a CCD camera. If the grayscale value exceeds the threshold of 20, it is judged as unqualified.

[0079] Reinforcement process parameters: The reinforcement material is UV adhesive with a viscosity of 8000 cP. It is applied using a dispensing machine with an accuracy of ±0.01mm. The adhesive is applied evenly along the opposite edge of the dispensing nozzle with a glue line width of 0.8±0.1mm and a thickness of 0.15±0.02mm.

[0080] UV curing was performed using a 365nm UV lamp with a power of 100mW / cm² and an irradiation time of 30±2s to ensure a curing degree of ≥95%, which was tested using a DSC differential scanning calorimeter.

[0081] Environmental requirements for standing for 12 hours: temperature 25±2℃, relative humidity 50±5%, avoid vibration, amplitude ≤0.01mm.

[0082] Including in-vehicle display variants:

[0083] For enhanced inspection of incoming materials:

[0084] Temperature resistance test: LCM module is subjected to thermal shock cycle of -40℃ for 4h and -85℃ for 4h, for 100 cycles. After the cycle, electrical test is performed. The functional failure rate must be ≤0.1%. Cover plate is subjected to high temperature and high humidity test, 85℃ / 85%RH, 1000h. After the test, the light transmittance attenuation is ≤2%. Ink adhesion cross-cut test ≥5B.

[0085] For vibration resistance pre-testing, a simulated transportation vibration table was used, according to GB / T4857.23 standard, with a frequency of 1-100Hz, an acceleration of 20m / s², and vibration in each of the XYZ axes for 2 hours. After the test, the module showed no structural loosening or electrical abnormalities.

[0086] The injection port buffer structure is made of TPU material with a Shore hardness of 80A. The cross-section is U-shaped and the thickness is 0.3±0.02mm. It is integrally formed with VHB tape through in-mold injection molding. The bonding strength is ≥10N / 25mm. The stiffness coefficient K=85N / mm is tested with a tensile testing machine. The system is optimized through finite element simulation software such as ANSYS to ensure that the resonance peak value is ≤1.5g in the vibration range of 10-200Hz.

[0087] The installation process uses a positioning fixture to assist in bonding. The fixture has a positioning accuracy of ±0.03mm, a bonding pressure of 0.4±0.05MPa, and a pressure holding time of 30s to ensure that the alignment deviation between the buffer structure and the glue injection port is ≤0.1mm.

[0088] Mechanical vibration testing was conducted according to GB / T28046.5-2011 standard, with a test frequency of 10-2000Hz, a sweep rate of 1oct / min, and an acceleration of 10m / s². Displacement control was applied in the 10-55Hz frequency band, with an amplitude of 0.35mm, and acceleration control was applied in the 55-2000Hz frequency band. Ten cycles were performed in each of the XYZ axes.

[0089] After testing, an airtightness test was conducted with a pressure drop of ≤1 kPa / 24h and an optical performance retest was performed to ensure no bubbles were generated and the haze change was ≤0.02%.

[0090] Weather resistance verification was conducted through a sunlight simulation test, using a xenon lamp aging chamber with an irradiance of 1.12 W / m²@340 nm, a black standard temperature of 65±3℃, a relative humidity of 50±5%, and an exposure time of 1000 h.

[0091] After testing, the module showed no discoloration or cracking, and the 90° peel force retention rate was ≥90% compared to the initial value.

[0092] This invention primarily utilizes a three-stage dynamic sealing and gradient negative pressure curing process to achieve an adhesive layer thickness deviation of <1.5μm in the OCR module. Tests show that the bubble defect rate is reduced from 3.2% to 0.18%, and energy consumption is reduced by 22%.

[0093] Existing technologies have the drawback of residual air bubbles. Even after traditional vacuum degassing, 0.5-1mm air bubbles remain, as observed under a microscope.

[0094] Uneven adhesive layer: The adhesive thickness at the edges is 15-20% thinner than that at the center, as measured by an interferometer;

[0095] Sealing failure: VHB tape developed microcracks at high temperatures, as analyzed by SEM electron microscopy;

[0096] This leads to problems such as curing deformation, optical distortion, and interface delamination in existing technologies due to inaccurate control of adhesive flow.

[0097] In summary, the present invention can solve the defects and problems existing in the prior art through this glue-pouring process, and has the advantages of dynamic glue injection and precise control of glue flow.

[0098] It employs a pre-sealing method for three-sided sealing of VHB, followed by dynamic sealing based on the tear-off handle at the injection port, and finally achieves the injection operation through gradient negative pressure curing thermo-pressing.

[0099] Based on the excellent filling properties of the tube adhesive process, the adhesive, when poured into the product in a liquid state, can better fill the product, especially when there are product gaps or other deformations. When the adhesive is poured into the product in a liquid state, only one curing step is needed to better bond the product, resulting in stronger adhesion and preventing later bubble formation. After the product is framed, only the glue inlet is slightly open during glue injection, allowing for a short period of exposure to the atmosphere, which can better control the occurrence of foreign matter during manufacturing. The leveling platform during manufacturing can better accommodate various product models, eliminating the need for frequent jig openings later. When expanding production capacity in the future, only adding glue injection machines is needed to further expand production capacity.

[0100] Optical performance: Haze value decreased from 0.8% to 0.12%;

[0101] Mechanical strength: 90° peel force reaches 12.5 N / cm, an increase of 42%;

[0102] Production efficiency: Daily production capacity increased from 1,200 pieces to 1,800 pieces.

[0103] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An OCR potting process, characterized in that, Includes the following steps; S1, Incoming material inspection, inspecting LCM modules, cover plates, and OCR adhesives, and conducting full electrical testing and appearance defect inspection on LCM modules. S2, Pre-treatment: Clean OC and CG, apply VHB tape to three sides of OC and leave glue injection ports; S3, pre-bonding and glue injection, uses an alignment system for pre-bonding and uses an AB two-component glue mixer for glue injection; S4, leveling and vacuum treatment, intelligent leveling is achieved through a leveling stage, and gradient negative pressure degassing is performed; S5, curing and post-treatment, involves step-by-step curing, followed by degassing, inspection and reinforcement, and finally packaging and storage.

2. The OCR potting process according to claim 1, characterized in that: The specific tests for dry boards and adhesives during the incoming material inspection are as follows: The dimensions of the cover plate need to be checked, and the type of adhesive also needs to be verified.

3. The OCR potting process according to claim 1, characterized in that: The VHB release tweezer width at the glue injection port during the pretreatment is 6.5±0.2mm; The VHB tape used is 3M™ 5925.

4. The OCR potting process according to claim 1, characterized in that: The pre-bonding and glue injection processes employ an alignment system with an accuracy of ±0.05mm, and the alignment deviation of the alignment system is ≤0.1mm. The AB two-component mixing machine dispenses adhesive at a mixing ratio of 1:3±5%, with a dispensing temperature of 25±1℃ and a pressure of 0.15-0.25MPa.

5. The OCR potting process according to claim 1, characterized in that: The adhesive used in the pre-bonding and glue injection process is DELOKatiobond 4592, and the taper of the glue injection tube used in the AB two-component glue mixer during the glue injection process is 15°.

6. The OCR potting process according to claim 1, characterized in that: During the leveling and vacuum treatment, the gradient negative pressure degassing process is first -80kPa / 2h, and then -40kPa / 16h.

7. The OCR potting process according to claim 1, characterized in that: The intelligent leveling of the leveling stage in the leveling and vacuum processing follows the leveling control formula Fadjust=0.38⋅(hreal−htarget)+1.2⋅(dh / dt).

8. The OCR potting process according to claim 1, characterized in that: During the curing and post-treatment process, the curing is carried out in stages: first at 60℃ for 40 minutes, then at 50℃ / -40kPa-60℃, and at atmospheric pressure of -80℃ / +10kPa.

9. The OCR potting process according to claim 1, characterized in that: The degassing treatment conditions during the curing and post-treatment are 50℃ and 0.25kPa for 20min, and the final product has a haze of ≤0.12% and a 90° peel force of ≥12.5N / cm.

10. An OCR potting process according to claim 1, characterized in that, The alignment system includes a multispectral CCD alignment module, and the leveling stage is a six-degree-of-freedom leveling stage. The wavelength of the multispectral CCD alignment module is 400-1100nm, the six-degree-of-freedom leveling stage includes KF sag compensation, the natural frequency of the leveling stage is >200Hz, and the glue temperature control accuracy of the dynamic dispensing system is ±0.3℃.

Citation Information

Patent Citations

  • Display control device and system for controlling full-color display screen

    CN110379360A