High-silicon aluminum alloy die-casting device

Abstract

The invention relates to the technical field of aluminum alloy die-casting, and discloses a high-silicon aluminum alloy die-casting device which comprises a workbench and further comprises a mounting frame connected to the top of the workbench, a die-casting mechanism arranged on the mounting frame, a placing frame arranged on the top of the workbench, a die mounted in the placing frame through bolts, an ejection mechanism arranged on the workbench, and a die-casting mechanism arranged on the workbench. And the temperature control mechanism is arranged at the top of the workbench and used for preheating and cooling the die. In the ejection mechanism, when a ball screw ascends to eject a workpiece, a large gear and a small gear are driven to rotate through ball transmission of a ball sleeve and the ball screw, so that a first rotating rod drives a knocking block to knock the two sides of a mold, and meanwhile, a surrounding sleeve and a lifting rod drive a knocking plate to swing to knock the bottom of the mold; the adsorption force between the workpiece and the mold is destroyed through mechanical knocking, the workpiece is prevented from deforming or remaining during ejection, and manual intervention is reduced.

Description

Technical Field

[0001] This invention relates to the field of aluminum alloy die casting technology, specifically to a high-silicon aluminum alloy die casting device. Background Technology

[0002] High-silicon aluminum alloy is a binary alloy composed of silicon and aluminum. It is an alloy material mainly used in aerospace, space technology and portable electronic devices. Therefore, high-silicon aluminum alloy materials can maintain the excellent properties of silicon and aluminum respectively. Moreover, the content of silicon and aluminum is quite rich. The preparation technology of silicon powder is mature and the cost is low. At the same time, this material does not pollute the environment and is harmless to the human body.

[0003] According to Chinese Patent Publication No. CN212945361U, a high-silicon aluminum alloy die-casting device includes a lifting mechanism, a die-casting mold, and an anti-drip mechanism. The lifting mechanism includes a base with a U-shaped support frame on its upper surface. An electric telescopic rod is located on the top side of the U-shaped support frame, and a mounting plate is located at the bottom of the electric telescopic rod. A hydraulic pump is located on the bottom side of the mounting plate. The anti-drip mechanism includes a discharge pipe with a cavity inside. A heating wire is located inside the cavity. A cross plate and a fixing ring are arranged sequentially from top to bottom on the inner side of the discharge pipe. A second sliding groove is located between the cross plate and the fixing ring on the inner side of the discharge pipe, and an L-shaped slider is slidably connected to the second sliding groove. This high-silicon aluminum alloy die-casting device can seal any residual liquid inside the punch, preventing it from dripping after the punch moves upward, thus preventing contamination and facilitating user operation.

[0004] When using the above-mentioned patent, after die casting is completed, the mold is cooled naturally and then manually removed, which greatly reduces the work efficiency. Therefore, a high-silicon aluminum alloy die casting device is proposed to solve the above-mentioned problems. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a high-silicon aluminum alloy die-casting device to address the shortcomings of the prior art.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is: a high-silicon aluminum alloy die-casting device, including a worktable, and further comprising: Mounting bracket, attached to the top of the workbench; The die-casting mechanism is mounted on the mounting frame. Placement frame, set on top of the workbench; The mold is bolted inside the placement frame; The ejection mechanism, located on the worktable, is used to eject the die-cast workpiece. The temperature control mechanism, located on the top of the workbench, is used to preheat and cool the mold. The impurity removal mechanism, set on the worktable, is used to clean impurities from the inner wall of the mold; The ejection mechanism includes: The base frame is installed on top of the workbench; The first electric actuator is installed on the bottom inner wall of the base frame; A ball screw is connected to the top of the output end of the first electric actuator; The ejector plate is fixed to the top of the ball screw; A rotating component is mounted on the ejector component; The tapping component is set on the rotating component.

[0007] Preferably, the die-casting mechanism includes a hydraulic cylinder, a mounting plate, a hydraulic pump, and a discharge pipe. The hydraulic cylinder is mounted on the top of the inner wall of the mounting frame, the mounting plate is connected to the bottom of the output end of the hydraulic cylinder, the hydraulic pump is mounted on the bottom of the mounting plate, the discharge pipe is located below the hydraulic pump, the bottom of the mold has an ejection hole, the top of the worktable has a receiving groove, the ejection hole, the receiving groove and the ejection plate have the same size, and the bottom of the worktable has a groove.

[0008] Preferably, the rotating assembly includes a ball sleeve, a connecting rod, a large gear, a first rotating rod, a small gear, and a striking block. The ball sleeve is rotatably connected to the top of the inner wall of the groove, and the ball sleeve is connected to the ball screw via balls. The connecting rod is fixedly connected to the bottom of the ball sleeve, the large gear is fixedly connected to the bottom of the connecting rod, the first rotating rod rotates through the top of the worktable, the small gear is fixedly sleeved on the bottom of the first rotating rod and meshes with the large gear, and the striking block is fixedly connected to the outer wall of the first rotating rod.

[0009] Preferably, the striking assembly includes a second rotating rod, a striking plate, a surrounding groove, a surrounding sleeve, a telescopic rod, and a lifting rod. The second rotating rod is rotatably connected to the inner wall of the placement frame. The striking plate is fixedly sleeved on the second rotating rod and has a first sliding groove. The surrounding groove is formed on the outer wall of the first rotating rod. The surrounding sleeve is connected to the surrounding groove via a slider and is connected to the top of the worktable via the telescopic rod. The lifting rod is fixedly connected to the outer wall of the surrounding sleeve and passes through the first sliding groove and is slidably connected to the inner wall of the first sliding groove.

[0010] Preferably, the temperature control mechanism includes a water tank, a tank cover, conductive partitions, a semiconductor heating element, a water outlet pipe, a surrounding pipe, a circulating water pump, and a water inlet pipe. The water tank is located on the top of the workbench, and the tank cover is located on the top of the water tank. A sealing ring is provided at the connection between the water tank and the tank cover. There are two conductive partitions, which are fixed inside the water tank. The semiconductor heating element is located between the two conductive partitions, and its heating end and cooling end are in contact with the two conductive partitions respectively. Both ends of the water outlet pipe are connected to the front of the water tank, and both ends of the water outlet pipe are located on both sides of the two conductive partitions. The surrounding pipe is arranged around the outer wall of the placement frame. The circulating water pump is located on the top of the workbench. The input end of the circulating water pump is connected to the middle of the water outlet pipe, and the output end of the circulating water pump is connected to one end of the surrounding pipe. Both ends of the water inlet pipe are connected to the rear of the water tank, and both ends of the water inlet pipe are located on both sides of the two conductive partitions. The middle of the water inlet pipe is connected to the other end of the surrounding pipe.

[0011] Preferably, both the outlet pipe and the inlet pipe are equipped with two control valves. The top plate is hollow and has two connecting pipes connected to its bottom. Each connecting pipe is equipped with a one-way valve. The other ends of the two connecting pipes pass through the bottom of the storage tank and the worktable and are connected to the surrounding pipe.

[0012] Preferably, the impurity removal mechanism includes a support rod, a swing frame, a second electric push rod, a push plate, a vacuum cleaner, an air pipe, and a suction pipe. The support rod is rotatably connected to the top of the workbench. The swing frame is fixedly sleeved on the support rod. The second electric push rod is fixedly installed on the top of the swing frame. The push plate is fixedly connected to the top of the output end of the second electric push rod. The vacuum cleaner is installed on the top of the workbench. One end of the air pipe is connected to the output end of the vacuum cleaner. The suction pipe is installed on the push plate, and one end of the suction pipe passes through the push plate and is connected to the other end of the air pipe.

[0013] Preferably, the impurity removal mechanism further includes a third rotating rod and a rotating block. The third rotating rod rotates through the top of the worktable and is connected to the first rotating rod via a synchronous pulley. The rotating block is fixedly connected to the top of the third rotating rod and is slidably connected to the inner wall of the swing frame.

[0014] The present invention, by adopting the above technical solution, can bring the following beneficial effects: 1. In the high-silicon aluminum alloy die-casting device of the present invention, the ball screw rises and ejects the workpiece while the ball sleeve and the ball screw drive the large gear and the small gear to rotate, so that the first rotating rod drives the striking block to strike both sides of the mold. At the same time, the surrounding sleeve and the lifting rod drive the striking plate to swing and strike the bottom of the mold. The mechanical striking breaks the adsorption force between the workpiece and the mold, avoids the workpiece from deforming or remaining during ejection, and reduces manual intervention.

[0015] 2. This high-silicon aluminum alloy die-casting device heats and cools the water on both sides of the water tank through the heating and cooling ends of the semiconductor heating element, respectively. With the help of the circulating water pump and the surrounding pipe, hot or cold water can be quickly circulated to the outer wall of the mold. Before die-casting, the mold is preheated by circulating hot water to avoid shrinkage cavities caused by rapid cooling of the melt. After die-casting, the cooling is accelerated by circulating cold water, thus shortening the overall production cycle.

[0016] 3. This high-silicon aluminum alloy die-casting device uses a second electric push rod to push the suction pipe into the mold, while the third rotating rod and rotating block drive the swing frame to swing back and forth, so that the suction pipe moves in all directions along the inner wall of the mold. In conjunction with the vacuum cleaner, it adsorbs metal debris, oxides and other impurities, reducing the defect rate caused by impurities.

[0017] 4. In this high-silicon aluminum alloy die-casting device, the ejector plate is hollow inside and connected to the surrounding pipe through a connecting pipe. During the temperature control stage, hot or cold water can flow through the inside of the ejector plate to simultaneously heat or cool the bottom of the mold, thereby preventing the melt from solidifying prematurely or cooling slowly at the bottom of the mold and improving the overall density and dimensional accuracy of the casting. Attached Figure Description

[0018] Figure 1 This is a front view of the present invention; Figure 2 This is a front sectional view of the present invention; Figure 3 This is a schematic diagram of the structure of the present invention; Figure 4 This is a schematic diagram of the ejection mechanism of the present invention; Figure 5 This is an enlarged schematic diagram of point A in the present invention; Figure 6 This is an enlarged schematic diagram of section B of the present invention; Figure 7 This is a schematic diagram of the temperature control mechanism of the present invention; Figure 8 This is a cross-sectional view of the water tank of the present invention.

[0019] In the diagram: 1. Workbench; 2. Mounting frame; 3. Die-casting mechanism; 31. Hydraulic cylinder; 32. Mounting plate; 33. Hydraulic pump; 34. Discharge pipe; 4. Placement frame; 5. Mold; 6. Ejection mechanism; 61. Base frame; 62. First electric push rod; 63. Ball screw; 64. Ejection plate; 65. Ball sleeve; 66. Connecting rod; 67. Large gear; 68. First rotating rod; 69. Small gear; 610. Striking block; 611. Second rotating rod; 612. Striking plate; 613. Circular groove; 14. Encircling sleeve; 615. Telescopic rod; 616. Lifting rod; 617. Connecting pipe; 7. Temperature control mechanism; 71. Water tank; 72. Tank cover; 73. Conductive partition; 74. Semiconductor heating element; 75. Water outlet pipe; 76. Encircling pipe; 77. Circulating water pump; 78. Water inlet pipe; 8. Impurity removal mechanism; 81. Support rod; 82. Swing frame; 83. Second electric push rod; 84. Push plate; 85. Vacuum cleaner; 86. Air pipe; 87. Suction pipe; 88. Third rotating rod; 89. Rotating block. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0022] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection or setting, a detachable connection or setting, or an integral connection or setting. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a number" means two or more, unless otherwise explicitly specified.

[0024] Please see Figure 1-8One embodiment of the present invention is: a high-silicon aluminum alloy die-casting device, including a worktable 1, and further including: a mounting frame 2 connected to the top of the worktable 1, a die-casting mechanism 3 disposed on the mounting frame 2, a placement frame 4 disposed on the top of the worktable 1, a mold 5 mounted inside the placement frame 4 by bolts, an ejection mechanism 6 disposed on the worktable 1 for ejecting the die-cast workpiece, a temperature control mechanism 7 disposed on the top of the worktable 1 for preheating and cooling the mold 5, and a cleaning mechanism 8 disposed on the worktable 1 for cleaning impurities from the inner wall of the mold 5, wherein the ejection mechanism 6 includes: a bottom frame 61 mounted on the top of the worktable 1, and a first electric push rod 62 mounted on... At the bottom of the inner wall of the base frame 61, a ball screw 63 is connected to the top of the output end of the first electric push rod 62. An ejector plate 64 is fixed to the top of the ball screw 63. A rotating assembly is mounted on the ejector assembly, and a striking assembly is mounted on the rotating assembly. The die-casting mechanism 3 includes a hydraulic cylinder 31, a mounting plate 32, a hydraulic pump 33, and a discharge pipe 34. The hydraulic cylinder 31 is mounted on the top of the inner wall of the mounting frame 2. The mounting plate 32 is connected to the bottom of the output end of the hydraulic cylinder 31. The hydraulic pump 33 is mounted on the bottom of the mounting plate 32. The discharge pipe 34 is located below the hydraulic pump 33. An ejection hole is provided at the bottom of the mold 5, and a receiving groove is provided at the top of the worktable 1. The ejection hole, the receiving groove, and the ejector plate 64 are all connected together. The plates 64 are the same size. A groove is provided at the bottom of the worktable 1. The rotating assembly includes a ball sleeve 65, a connecting rod 66, a large gear 67, a first rotating rod 68, a small gear 69, and a striking block 610. The ball sleeve 65 is rotatably connected to the top of the inner wall of the groove, and is connected to the ball screw 63 via balls. The connecting rod 66 is fixedly connected to the bottom of the ball sleeve 65. The large gear 67 is fixedly connected to the bottom of the connecting rod 66. The first rotating rod 68 rotates through the top of the worktable 1. The small gear 69 is fixedly sleeved on the bottom of the first rotating rod 68 and meshes with the large gear 67. The striking block 610 is fixedly connected to the outer wall of the first rotating rod 68. The striking assembly... The system includes a second rotating rod 611, a striking plate 612, a surrounding groove 613, a surrounding sleeve 614, a telescopic rod 615, and a lifting rod 616. The second rotating rod 611 is rotatably connected to the inner wall of the placement frame 4. The striking plate 612 is fixedly sleeved on the second rotating rod 611, and a first sliding groove is provided on the striking plate 612. The surrounding groove 613 is provided on the outer wall of the first rotating rod 611. The surrounding sleeve 614 is connected to the surrounding groove 613 through a slider, and the surrounding sleeve 614 is connected to the top of the worktable 1 through the telescopic rod 615. The lifting rod 616 is fixedly connected to the outer wall of the surrounding sleeve 614, and the lifting rod 616 passes through the first sliding groove and is slidably connected to the inner wall of the first sliding groove.

[0025] Preferably, the temperature control mechanism 7 includes a water tank 71, a tank cover 72, conductive partitions 73, a semiconductor heating element 74, a water outlet pipe 75, a surrounding pipe 76, a circulating water pump 77, and a water inlet pipe 78. The water tank 71 is located on top of the workbench 1, and the tank cover 72 is located on top of the water tank 71. A sealing ring is provided at the connection between the water tank 71 and the tank cover 72. There are two conductive partitions 73, which are fixed inside the water tank 71. The semiconductor heating element 74 is located between the two conductive partitions 73, and the heating end and cooling end of the semiconductor heating element 74 are in contact with the two conductive partitions 73 respectively. The two ends of the water outlet pipe 75 are connected to the front of the water tank 71, and the two ends of the water outlet pipe 75 are located on both sides of the two conductive partitions 73 respectively. The surrounding pipe 76 is arranged around the water tank 71. On the outer wall of the frame 4, a circulating water pump 77 is installed on the top of the workbench 1. The input end of the circulating water pump 77 is connected to the middle of the outlet pipe 75, and the output end of the circulating water pump 77 is connected to one end of the surrounding pipe 76. The two ends of the inlet pipe 78 are connected to the rear of the water tank 71. The two ends of the inlet pipe 78 are respectively located on both sides of the two conductive partitions 73, and the middle of the inlet pipe 78 is connected to the other end of the surrounding pipe 76. Two control valves are installed on both the outlet pipe 75 and the inlet pipe 78. The top plate 64 is hollow, and two connecting pipes 617 are connected to the bottom of the top plate 64. One-way valves are installed on both connecting pipes 617. The other ends of the two connecting pipes 617 movably pass through the storage tank and the bottom of the workbench 1 and are connected to the surrounding pipe 76.

[0026] Working Principle: Before die casting the workpiece, the semiconductor heating element 74 is activated. The heating end of the semiconductor heating element 74 heats the water on one side of the water tank 71 through the conduction baffle 73 on one side, while the cooling end of the semiconductor heating element 74 cools the water on the other side of the water tank 71 through the conduction baffle 73 on the other side. The control valve corresponding to the heating end is opened, and the circulating water pump 77 is activated to connect the heated water with the water in the surrounding pipe 76, so that the hot water flows in the surrounding pipe 76, thereby heating the outer wall of the placement frame 4. The heat is then transferred to the mold 5 through the placement frame 4 to preheat the mold 5. At the same time, the hot water in the surrounding pipe 76 enters the ejector plate 64 through the connecting pipe 617, and then flows back to the surrounding pipe 76 through the connecting pipe 617, thereby heating the ejector plate 64 and the bottom of the mold 5. This prevents the melt from cooling rapidly during die casting, forming a hard shell on the surface, which could lead to shrinkage cavities and cracks in the workpiece. After the mold 5 is preheated, the mounting plate 32 is lowered by the hydraulic cylinder 31. The process begins with hydraulic pump 33 pumping molten material from discharge pipe 34 into mold 5 for die casting. After die casting, a control valve is switched to allow cooled water from the other side of water tank 71 to flow into the surrounding pipe 76, cooling mold 5 and accelerating workpiece cooling. Then, the first electric push rod 62 is activated, causing ball screw 63 to rise, which in turn causes ejector plate 64 to rise, ejecting the workpiece. Simultaneously, the rising ball screw 63 causes ball sleeve 65 to rotate, which in turn drives large gear 67 to rotate via connecting rod 66. The small gear 69 drives the first rotating rod 68 to rotate, which in turn drives the striking block 610 to rotate, striking both sides of the mold 5. At the same time, the rotation of the first rotating rod 68 drives the surrounding groove 613 to rotate, which in turn drives the surrounding sleeve 614 to move up and down repeatedly through the slider. The surrounding sleeve 614 drives the lifting rod 616 to move up and down, which in turn drives the striking plate 612 to swing back and forth, striking the bottom of the mold 5. This speeds up the separation of the workpiece from the mold 5, making it easier for the ejector plate 64 to eject.

[0027] Please see Figure 1-8Based on the above embodiments, in another embodiment of the present invention, the impurity removal mechanism 8 includes a support rod 81, a swing frame 82, a second electric push rod 83, a push plate 84, a vacuum cleaner 85, an air pipe 86, and a suction pipe 87. The support rod 81 is rotatably connected to the top of the workbench 1, the swing frame 82 is fixedly sleeved on the support rod 81, the second electric push rod 83 is fixedly installed on the top of the swing frame 82, the push plate 84 is fixedly connected to the top of the output end of the second electric push rod 83, and the vacuum cleaner 85 is installed on the workbench. At the top of the workbench 1, one end of the air pipe 86 is connected to the output end of the vacuum cleaner 85. The suction pipe 87 is installed on the push plate 84, and one end of the suction pipe 87 passes through the push plate 84 and is connected to the other end of the air pipe 86. The cleaning mechanism 8 also includes a third rotating rod 88 and a rotating block 89. The third rotating rod 88 rotates through the top of the workbench 1 and is connected to the first rotating rod 68 via a synchronous pulley. The rotating block 89 is fixedly connected to the top of the third rotating rod 88 and is slidably connected to the inner wall of the swing frame 82.

[0028] Working principle: After the workpiece is removed, the second electric push rod 83 is activated to move the push plate 84, so that the dust suction pipe 87 is above the mold 5. At the same time, when the first electric push rod 62 drives the ball screw 63 to descend and reset, it will drive the first rotating rod 68 to rotate. When the first rotating rod 68 rotates, it will drive the third rotating rod 88 to rotate through the synchronous belt, thereby stimulating the rotating block 89 to rotate. The rotation of the rotating block 89 will drive the swing frame 82 to swing back and forth, thereby driving the dust suction pipe 87 to swing back and forth. By starting the vacuum cleaner 85, the impurities in the mold 5 are cleaned for the next use.

[0029] This invention provides a high-silicon aluminum alloy die-casting device. Many methods and approaches exist for implementing this technical solution; the above description is merely a preferred embodiment of the invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this invention, and these improvements and modifications should also be considered within the scope of protection of this invention. All components not explicitly stated in this embodiment can be implemented using existing technologies.

Claims

1. A high-silicon aluminum alloy die-casting apparatus, comprising a worktable, characterized in that, Also includes: Mounting bracket, attached to the top of the workbench; The die-casting mechanism is mounted on the mounting frame. Placement frame, set on top of the workbench; The mold is bolted inside the placement frame; The ejection mechanism, located on the worktable, is used to eject the die-cast workpiece. The temperature control mechanism, located on the top of the workbench, is used to preheat and cool the mold. The impurity removal mechanism, set on the worktable, is used to clean impurities from the inner wall of the mold; The ejection mechanism includes: The base frame is installed on top of the workbench; The first electric actuator is installed on the bottom inner wall of the base frame; A ball screw is connected to the top of the output end of the first electric actuator; The ejector plate is fixed to the top of the ball screw; A rotating component is mounted on the ejector component; The tapping component is set on the rotating component.

2. The high-silicon aluminum alloy die-casting device according to claim 1, characterized in that: The die-casting mechanism includes a hydraulic cylinder, a mounting plate, a hydraulic pump, and a discharge pipe. The hydraulic cylinder is mounted on the top of the inner wall of the mounting frame. The mounting plate is connected to the bottom of the output end of the hydraulic cylinder. The hydraulic pump is mounted on the bottom of the mounting plate. The discharge pipe is located below the hydraulic pump. The bottom of the mold has an ejection hole. The top of the worktable has a receiving groove. The ejection hole, the receiving groove, and the ejection plate are the same size. The bottom of the worktable has a groove.

3. The high-silicon aluminum alloy die-casting device according to claim 2, characterized in that: The rotating assembly includes a ball sleeve, a connecting rod, a large gear, a first rotating rod, a small gear, and a striking block. The ball sleeve is rotatably connected to the top of the inner wall of the groove, and the ball sleeve is connected to the ball screw via balls. The connecting rod is fixedly connected to the bottom of the ball sleeve, and the large gear is fixedly connected to the bottom of the connecting rod. The first rotating rod rotates through the top of the worktable, and the small gear is fixedly sleeved on the bottom of the first rotating rod and meshes with the large gear. The striking block is fixedly connected to the outer wall of the first rotating rod.

4. The high-silicon aluminum alloy die-casting device according to claim 3, characterized in that: The striking assembly includes a second rotating rod, a striking plate, a surrounding groove, a surrounding sleeve, a telescopic rod, and a lifting rod. The second rotating rod is rotatably connected to the inner wall of the placement frame. The striking plate is fixedly sleeved on the second rotating rod and has a first sliding groove. The surrounding groove is formed on the outer wall of the first rotating rod. The surrounding sleeve is connected to the surrounding groove via a slider and is connected to the top of the worktable via the telescopic rod. The lifting rod is fixedly connected to the outer wall of the surrounding sleeve and passes through the first sliding groove and is slidably connected to the inner wall of the first sliding groove.

5. The high-silicon aluminum alloy die-casting apparatus according to claim 4, characterized in that: The temperature control mechanism includes a water tank, a tank cover, conductive partitions, a semiconductor heating element, a water outlet pipe, a surrounding pipe, a circulating water pump, and a water inlet pipe. The water tank is located on top of the workbench, and the tank cover is located on top of the water tank. A sealing ring is provided at the connection between the water tank and the tank cover. There are two conductive partitions, which are fixed inside the water tank. The semiconductor heating element is located between the two conductive partitions, and its heating and cooling ends are in contact with the two conductive partitions respectively. Both ends of the water outlet pipe are connected to the front of the water tank, and both ends of the water outlet pipe are located on both sides of the two conductive partitions. The surrounding pipe is arranged around the outer wall of the placement frame. The circulating water pump is located on top of the workbench. The input end of the circulating water pump is connected to the middle of the water outlet pipe, and the output end of the circulating water pump is connected to one end of the surrounding pipe. Both ends of the water inlet pipe are connected to the rear of the water tank, and both ends of the water inlet pipe are located on both sides of the two conductive partitions. The middle of the water inlet pipe is connected to the other end of the surrounding pipe.

6. The high-silicon aluminum alloy die-casting apparatus according to claim 5, characterized in that: Both the outlet pipe and the inlet pipe are equipped with two control valves. The top plate is hollow and has two connecting pipes connected to its bottom. Each connecting pipe is equipped with a one-way valve. The other ends of the two connecting pipes pass through the bottom of the storage tank and the worktable and are connected to the surrounding pipe.

7. The high-silicon aluminum alloy die-casting apparatus according to claim 6, characterized in that: The impurity removal mechanism includes a support rod, a swing frame, a second electric push rod, a push plate, a vacuum cleaner, an air pipe, and a suction pipe. The support rod is rotatably connected to the top of the workbench. The swing frame is fixedly sleeved on the support rod. The second electric push rod is fixedly installed on the top of the swing frame. The push plate is fixedly connected to the top of the output end of the second electric push rod. The vacuum cleaner is installed on the top of the workbench. One end of the air pipe is connected to the output end of the vacuum cleaner. The suction pipe is installed on the push plate, and one end of the suction pipe passes through the push plate and is connected to the other end of the air pipe.

8. The high-silicon aluminum alloy die-casting apparatus according to claim 7, characterized in that: The impurity removal mechanism also includes a third rotating rod and a rotating block. The third rotating rod rotates through the top of the worktable and is connected to the first rotating rod via a synchronous pulley. The rotating block is fixedly connected to the top of the third rotating rod and is slidably connected to the inner wall of the swing frame.

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