Insulating glue step-by-step printing method for photovoltaic module, photovoltaic module and battery

Abstract

The invention belongs to the technical field of solar cells, and relates to an insulating glue step-by-step printing method for a photovoltaic module, the photovoltaic module and a battery, and the insulating glue step-by-step printing method comprises the steps of welding strip coverage area insulating glue printing, first curing, non-welding strip coverage area insulating glue printing and second curing which are carried out in sequence. Wherein the thickness of the insulation paste printing in the solder strip coverage area is greater than the thickness of the insulation paste printing in the non-solder strip coverage area. According to the insulation paste step-by-step printing method provided by the invention, differential control of the thickness of the insulation paste in the solder strip coverage area and the non-solder strip coverage area is realized, the hidden danger of short circuit is avoided, subfissure caused by warping is reduced, the assembly yield is improved, the cost is reduced, and large-scale popularization and application are facilitated.

Description

Technical Field

[0001] This invention belongs to the field of solar cell technology, and relates to a photovoltaic module, and more particularly to a stepwise printing method for insulating adhesive for photovoltaic modules, as well as a photovoltaic module and a battery. Background Technology

[0002] In the manufacturing of BC (Back Contact) modules, the coating of insulating materials is a crucial step in ensuring module performance. Currently, the industry commonly uses single-pass screen printing technology to print insulating adhesive on both solder strip-covered and non-solder strip-covered areas.

[0003] From a process requirement perspective, the area covered by the solder strip requires a higher thickness of insulating adhesive, typically exceeding 10μm, to prevent short circuits caused by solder strip puncture. In contrast, the non-solder strip covered area has a lower requirement for insulating adhesive thickness, generally exceeding 5μm. However, existing single-pass printing technology has significant limitations: to ensure the solder strip covered area reaches the required thickness, the entire printed pattern must be thickened. This not only results in substantial waste of insulating adhesive material but also increases cell warpage due to excessive adhesive layer thickness, leading to the risk of microcracks and impacting module yield, subsequent processing, and overall performance.

[0004] Furthermore, it is difficult to achieve differentiated control of the insulation adhesive thickness in different areas through a single printing process. This results in a small difference in insulation adhesive thickness between the solder strip-covered area and the non-solder strip-covered area, making it impossible to meet the specific requirements of both simultaneously. This could lead to short circuit hazards due to insufficient thickness in the solder strip-covered area, or additional cost and performance issues due to excessive thickness in the non-solder strip-covered area.

[0005] Therefore, how to achieve differentiated control of the insulation thickness in the solder strip-covered and non-solder strip-covered areas, avoid short circuit risks, prevent microcracks caused by warping, improve component yield, and reduce costs has become an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0006] To address the shortcomings of existing technologies, the present invention aims to provide a step-by-step printing method for insulating adhesive in photovoltaic modules, as well as a photovoltaic module and battery, thereby enabling differentiated control of the insulating adhesive thickness in areas covered by solder ribbons and areas not covered by solder ribbons, avoiding short circuit risks, preventing microcracks caused by warping, improving module yield, and reducing costs.

[0007] To achieve this objective, the present invention adopts the following technical solution: In a first aspect, the present invention provides a step-by-step printing method for insulating adhesive for photovoltaic modules, the step-by-step printing method comprising sequentially performing insulating adhesive printing on solder ribbon-covered areas, a first curing, insulating adhesive printing on non-solder ribbon-covered areas, and a second curing.

[0008] The thickness of the insulating adhesive printed in the area covered by the solder strip is greater than the thickness of the insulating adhesive printed in the area not covered by the solder strip.

[0009] The step-by-step printing method for insulating adhesive provided by this invention enables differentiated control of the insulating adhesive thickness in the solder ribbon-covered area and the non-solder ribbon-covered area. This not only effectively reduces the risk of short circuits caused by solder ribbon punctures by ensuring a certain insulating adhesive thickness in the solder ribbon-covered area, but also effectively reduces unit consumption and warping of the printed cells by reducing the insulating adhesive thickness in the non-solder ribbon-covered area. This prevents waste of insulating adhesive material, reduces costs, alleviates microcracks caused by increased cell warping due to excessive adhesive layer thickness, significantly improves module yield, and enhances subsequent processing and overall performance of the module.

[0010] Preferably, the thickness of the insulating adhesive printed in the area covered by the solder strip is 10-50 μm.

[0011] Preferably, the thickness of the insulating adhesive printed in the non-soldering strip covered area is 5-30 μm.

[0012] Preferably, the difference between the thickness of the insulating adhesive printed in the area covered by the solder strip and the thickness of the insulating adhesive printed in the area not covered by the solder strip is ≥10μm.

[0013] Preferably, the method of printing insulating adhesive in the area covered by the solder strip and the method of printing insulating adhesive in the area not covered by the solder strip each independently include screen printing.

[0014] Preferably, the screen printing stencil used for printing the insulating adhesive in the area covered by the solder strip has a mesh count of 200-500.

[0015] Preferably, the screen printing stencil used for printing the insulating adhesive in the area covered by the solder strip has a wire diameter of 10-40 μm.

[0016] Preferably, the screen printing stencil used for printing the insulating adhesive in the area covered by the welding strip has a yarn thickness of 20-80 μm.

[0017] Preferably, the screen printing plate used for printing the insulating adhesive in the area covered by the solder ribbon has a film thickness of 5-25 μm.

[0018] Preferably, the screen printing stencil used for printing the insulating adhesive in the non-soldering strip covered area has a mesh count of 200-500.

[0019] Preferably, the screen printing stencil used for printing the insulating adhesive in the non-soldering strip covered area has a wire diameter of 10-40μm.

[0020] Preferably, the screen printing stencil used for printing the insulating adhesive in the non-welding strip covered area has a yarn thickness of 20-80 μm.

[0021] Preferably, the screen printing plate used for printing the insulating adhesive in the non-soldering strip covered area has a film thickness of 5-25 μm.

[0022] Preferably, the weight of the insulating adhesive printed in the area covered by the solder strip is 0.05-0.6g.

[0023] Preferably, the weight of the insulating adhesive printed in the non-soldering strip covered area is 0.1-0.4g.

[0024] Preferably, the insulating adhesives used for printing the insulating adhesive in the solder strip covered area and the insulating adhesives used for printing the insulating adhesive in the non-solder strip covered area independently include silicone insulating adhesive and / or epoxy resin insulating adhesive.

[0025] Preferably, the first curing and the second curing methods independently include UV curing and / or thermal curing, respectively.

[0026] Taking thermosetting as an example, the temperatures of the first curing and the second curing are independently 120-150℃, and the times are independently 10-100min.

[0027] In a second aspect, the present invention provides a photovoltaic module, wherein the photovoltaic module adopts the step-by-step printing method of insulating adhesive as described in the first aspect.

[0028] Thirdly, the present invention provides a solar cell comprising a photovoltaic module as described in the second aspect.

[0029] Compared with the prior art, the present invention has the following beneficial effects: The step-by-step printing method for insulating adhesive provided by this invention enables differentiated control of the insulating adhesive thickness in the solder ribbon-covered area and the non-solder ribbon-covered area. This not only effectively reduces the risk of short circuits caused by solder ribbon punctures by ensuring a certain insulating adhesive thickness in the solder ribbon-covered area, but also effectively reduces unit consumption and warping of the printed cells by reducing the insulating adhesive thickness in the non-solder ribbon-covered area. This prevents waste of insulating adhesive material, reduces costs, alleviates microcracks caused by increased cell warping due to excessive adhesive layer thickness, significantly improves module yield, and enhances subsequent processing and overall performance of the module. Attached Figure Description

[0030] Figure 1 This is a magnified view of the area covered by the solder ribbon in the printing method provided in Example 1; Figure 2 These are enlarged views of the non-solder strip covered areas in the printing methods provided in Examples 1 and 2; Figure 3 This is a partial enlarged view of the insulating adhesive printing area of ​​the photovoltaic module obtained by the printing method provided in Example 1; Figure 4This is a magnified view of the area covered by the solder ribbon in the printing method provided in Example 2; Figure 5 This is a partial enlarged view of the insulating adhesive printing area of ​​the photovoltaic module obtained by the printing method provided in Example 2; Figure 6 This is a schematic diagram of the solder strip position in the printing methods provided in Examples 1 and 2. Detailed Implementation

[0031] The technical solution of the present invention will be further illustrated below through specific embodiments. Those skilled in the art should understand that the embodiments described are merely illustrative of the present invention and should not be construed as limiting the invention in any way.

[0032] One embodiment of the present invention provides a step-by-step printing method for insulating adhesive for photovoltaic modules. The step-by-step printing method includes sequentially performing insulating adhesive printing on solder ribbon-covered areas, a first curing, insulating adhesive printing on non-solder ribbon-covered areas, and a second curing.

[0033] The thickness of the insulating adhesive printed in the area covered by the solder strip is greater than the thickness of the insulating adhesive printed in the area not covered by the solder strip.

[0034] The step-by-step printing method for insulating adhesive provided by this invention enables differentiated control of the insulating adhesive thickness in the solder ribbon-covered area and the non-solder ribbon-covered area. This not only effectively reduces the risk of short circuits caused by solder ribbon punctures by ensuring a certain insulating adhesive thickness in the solder ribbon-covered area, but also effectively reduces unit consumption and warping of the printed cells by reducing the insulating adhesive thickness in the non-solder ribbon-covered area. This prevents waste of insulating adhesive material, reduces costs, alleviates microcracks caused by increased cell warping due to excessive adhesive layer thickness, significantly improves module yield, and enhances subsequent processing and overall performance of the module.

[0035] In some embodiments, the thickness of the insulating adhesive printed in the area covered by the solder ribbon is 10-50 μm, for example, it can be 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm or 50 μm, but is not limited to the listed values, other unlisted values ​​within this range are also applicable.

[0036] In some embodiments, the thickness of the insulating adhesive printed in the non-solder strip covered area is 5-30 μm, for example, it can be 5 μm, 10 μm, 15 μm, 20 μm, 25 μm or 30 μm, but is not limited to the listed values, other unlisted values ​​within this range are also applicable.

[0037] In some embodiments, the difference between the thickness of the insulating adhesive printed in the solder ribbon-covered area and the thickness of the insulating adhesive printed in the non-solder ribbon-covered area is ≥10μm, for example, it can be 10μm, 12μm, 14μm, 16μm, 18μm, 20μm, 22μm, 24μm, 26μm, 28μm or 30μm, but is not limited to the listed values, other unlisted values ​​within this range are also applicable.

[0038] This invention achieves a significant difference in the thickness of the insulating adhesive printed in the solder ribbon-covered area and the non-solder ribbon-covered area by limiting the difference to more than 10 μm. This further reduces the risk of short circuits caused by solder ribbon punctures, while also reducing unit consumption and the risk of foreign object overlap, thereby maximizing the improvement of the overall performance of the component.

[0039] In some embodiments, the method of printing insulating adhesive in the solder strip-covered area and the method of printing insulating adhesive in the non-solder strip-covered area each independently include screen printing.

[0040] In some embodiments, the mesh count of the screen printing stencil used for printing the insulating adhesive in the area covered by the solder ribbon is 200-500 mesh, for example, it can be 200 mesh, 250 mesh, 300 mesh, 350 mesh, 400 mesh, 450 mesh or 500 mesh, but it is not limited to the listed values, and other unlisted values ​​within this range are also applicable.

[0041] In some embodiments, the wire diameter of the screen printing stencil used for printing the insulating adhesive in the solder ribbon coverage area is 10-40μm, for example, it can be 10μm, 15μm, 20μm, 25μm, 30μm, 35μm or 40μm, but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0042] In some embodiments, the screen printing stencil used for printing the insulating adhesive in the solder ribbon coverage area has a yarn thickness of 20-80 μm, for example, it can be 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm or 80 μm, but is not limited to the listed values, other unlisted values ​​within this range are also applicable.

[0043] In some embodiments, the screen printing stencil used for printing the insulating adhesive in the solder ribbon coverage area has a film thickness of 5-25 μm, for example, it can be 5 μm, 10 μm, 15 μm, 20 μm or 25 μm, but is not limited to the listed values, other unlisted values ​​within this range are also applicable.

[0044] In some embodiments, the mesh count of the screen printing stencil used for printing the insulating adhesive in the non-soldering strip covered area is 200-500 mesh, for example, it can be 200 mesh, 250 mesh, 300 mesh, 350 mesh, 400 mesh, 450 mesh or 500 mesh, but it is not limited to the listed values, and other unlisted values ​​within this range are also applicable.

[0045] In some embodiments, the wire diameter of the screen printing stencil used for printing the insulating adhesive in the non-solder strip covered area is 10-40μm, for example, it can be 10μm, 15μm, 20μm, 25μm, 30μm, 35μm or 40μm, but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0046] In some embodiments, the screen printing stencil used for printing the insulating adhesive in the non-soldering strip covered area has a yarn thickness of 20-80μm, for example, it can be 20μm, 25μm, 30μm, 35μm, 40μm, 45μm, 50μm, 55μm, 60μm, 65μm, 70μm, 75μm or 80μm, but is not limited to the listed values, other unlisted values ​​within this range are also applicable.

[0047] In some embodiments, the screen printing stencil used for printing the insulating adhesive in the non-solder strip covered area has a film thickness of 5-25 μm, for example, it can be 5 μm, 10 μm, 15 μm, 20 μm or 25 μm, but is not limited to the listed values, other unlisted values ​​within this range are also applicable.

[0048] This invention can achieve different insulating adhesive printing effects by designing the screen pattern and adapting the screen parameters accordingly. As long as the thickness difference design between the insulating adhesive in the solder ribbon covered area and the insulating adhesive in the non-solder ribbon covered area can be achieved, no special limitation is made on the matching relationship between the screen pattern and the specific screen parameters.

[0049] In some embodiments, the weight of the insulating adhesive printed on the area covered by the solder strip is 0.05-0.6g, for example, it can be 0.05g, 0.1g, 0.15g, 0.2g, 0.25g, 0.3g, 0.35g, 0.4g, 0.45g, 0.5g, 0.55g or 0.6g, but is not limited to the listed values, other unlisted values ​​within this range are also applicable.

[0050] In some embodiments, the weight of the insulating adhesive printed on the non-solder strip covered area is 0.1-0.4g, for example, it can be 0.1g, 0.15g, 0.2g, 0.25g, 0.3g, 0.35g or 0.4g, but is not limited to the listed values, other unlisted values ​​within this range are also applicable.

[0051] In some embodiments, the types of insulating adhesives used for printing insulating adhesive in the solder strip covered area and the non-solder strip covered area independently include silicone insulating adhesive and / or epoxy resin insulating adhesive.

[0052] In some embodiments, the first curing and the second curing methods independently include UV curing and / or thermal curing, respectively.

[0053] Taking thermosetting as an example, the temperatures of the first curing and the second curing are independently 120-150℃, for example, 120℃, 125℃, 130℃, 135℃, 140℃, 145℃ or 150℃. The times of the first curing and the second curing are independently 10-100min, for example, 10min, 20min, 30min, 40min, 50min, 60min, 70min, 80min, 90min or 100min, but are not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0054] One embodiment of the present invention also provides a photovoltaic module, wherein the photovoltaic module adopts the step-by-step printing method of insulating adhesive described in any of the above embodiments.

[0055] One embodiment of the present invention also provides a solar cell, which includes the photovoltaic module described in any of the above embodiments.

[0056] The numerical range described in this invention includes not only the point values ​​listed above, but also any point values ​​within the numerical ranges not listed above. Due to space limitations and for the sake of brevity, this invention will not exhaustively list all the specific point values ​​included in the range.

[0057] Example 1 This embodiment provides a step-by-step printing method for insulating adhesive in BC components, specifically including the following steps: (1) Battery cell loading; (2) Printing of insulating adhesive in the area covered by welding strip: The screen printing process is adopted according to the following... Figure 1 The pattern shown is printed with insulating adhesive over the area covered by the solder strip; the screen printing stencil has a mesh count of 250, a wire diameter of 30μm, a yarn thickness of 60μm, and a film thickness of 15μm; the pattern area is 7885mm². 2 The adhesive weight is 0.35g, and the printing thickness is 35μm; (3) First curing: The curing temperature is 120℃ and the curing time is 15min; (4) Printing of insulating adhesive in areas not covered by solder strips: Using screen printing process according to... Figure 2The pattern shown is printed with insulating adhesive on the non-solder strip covered area; the screen printing stencil has a mesh count of 360 mesh, a wire diameter of 16μm, a yarn thickness of 30μm, and a film thickness of 10μm; the pattern area is 6230mm². 2 The adhesive weight is 0.15g, and the printing thickness is 15μm; (5) Second curing: The curing temperature is 120℃ and the curing time is 15min.

[0058] In this embodiment, both the insulating adhesive used for printing the insulating adhesive in the solder strip-covered area and the insulating adhesive used for printing the insulating adhesive in the non-solder strip-covered area are silicone insulating adhesives.

[0059] A partial magnified view of the insulating adhesive printing area of ​​the photovoltaic module obtained in this embodiment is shown below. Figure 3 See the location of the solder strip. Figure 6 .

[0060] Example 2 This embodiment provides a step-by-step printing method for insulating adhesive in BC components, specifically including the following steps: (1) Battery cell loading; (2) Printing of insulating adhesive in the area covered by welding strip: The screen printing process is adopted according to the following... Figure 4 The pattern shown is printed with insulating adhesive over the area covered by the solder strip; the screen printing stencil has a mesh count of 250, a wire diameter of 30μm, a yarn thickness of 60μm, and a film thickness of 15μm; the pattern area is 2060mm². 2 The adhesive weight is 0.11g, and the printing thickness is 38μm; (3) First curing: The curing temperature is 120℃ and the curing time is 15min; (4) Printing of insulating adhesive in areas not covered by solder strips: Using screen printing process according to... Figure 2 The pattern shown is printed with insulating adhesive on the non-solder strip covered area; the screen printing stencil has a mesh count of 360 mesh, a wire diameter of 16μm, a yarn thickness of 30μm, and a film thickness of 10μm; the pattern area is 6230mm². 2 The adhesive weight is 0.15g, and the printing thickness is 15μm; (5) Second curing: The curing temperature is 120℃ and the curing time is 10min.

[0061] In this embodiment, the insulating adhesive used for printing the insulating adhesive in the area covered by the solder strip and the area not covered by the solder strip is epoxy resin insulating adhesive.

[0062] A partial magnified view of the insulating adhesive printing area of ​​the photovoltaic module obtained in this embodiment is shown below. Figure 5 See the location of the solder strip. Figure 6 .

[0063] Example 3 This embodiment provides a step-by-step printing method for insulating adhesive in BC components. Except that the thickness of the insulating adhesive printed in the non-solder strip covered area is changed to 29μm, so that the difference between the thickness of the insulating adhesive printed in the solder strip covered area and the non-solder strip covered area is 6μm, the other steps and conditions are the same as in Embodiment 1, and will not be repeated here.

[0064] Example 4 This embodiment provides a step-by-step printing method for insulating adhesive in BC components. Except that the thickness of the insulating adhesive printed in the non-solder strip covered area is changed to 30μm, so that the difference between the thickness of the insulating adhesive printed in the solder strip covered area and the non-solder strip covered area is 8μm, the other steps and conditions are the same as in Embodiment 2, and will not be repeated here.

[0065] Comparative Example 1 This comparative example provides a method for printing insulating adhesive for BC components, including the following steps: (1) Battery cell loading; (2) One-step insulating adhesive printing: Insulating adhesive is printed simultaneously in the areas covered by the solder strip and the areas not covered by the solder strip using screen printing technology; the screen printing stencil has a mesh count of 250 mesh, a wire diameter of 30μm, a yarn thickness of 60μm, and a film thickness of 15μm; the graphic area is 14115mm². 2 The adhesive weight is 0.67g, and the printing thickness is 34μm; (3) Curing: The curing temperature is 120℃ and the curing time is 20min.

[0066] In this comparative example, the insulating adhesive used in the one-step insulating adhesive printing is silicone insulating adhesive, and the areas covered by the solder ribbon and the areas not covered by the solder ribbon are the same as in Example 1.

[0067] Comparative Example 2

[0068] This comparative example provides a method for printing insulating adhesive for BC components, including the following steps: (1) Battery cell loading; (2) One-step insulating adhesive printing: Insulating adhesive is printed simultaneously in the areas covered by the solder strip and the areas not covered by the solder strip using screen printing technology; the screen printing stencil has a mesh count of 250 mesh, a wire diameter of 30μm, a yarn thickness of 60μm, and a film thickness of 15μm; the graphic area is 8290mm². 2 The adhesive weight is 0.45g, and the printing thickness is 38μm; (3) Curing: The curing temperature is 120℃ and the curing time is 20min.

[0069] In this comparative example, the insulating adhesive used in the one-step insulating adhesive printing is epoxy resin insulating adhesive, and the areas covered by the solder ribbon and the areas not covered by the solder ribbon are the same as in Example 2.

[0070] 1000 BC modules were prepared using the printing methods provided in Examples 1-2 and Comparative Examples 1-2, respectively. The average warpage height, microcrack ratio, and short circuit ratio of the cells obtained by each printing method were statistically analyzed. The relevant statistical results are shown in Table 1 below.

[0071] Table 1

[0072] As shown in Table 1 above, compared with Example 1, Example 3 requires more adhesive weight and has increased warpage height and microcrack ratio. However, while maintaining a certain thickness of insulating adhesive, the short circuit ratio remains basically unchanged. However, Comparative Example 1 uses one-step insulating adhesive printing, resulting in a significant decrease in overall performance. Similarly, the performance parameters of Examples 2, 4 and Comparative Example 2 can be seen.

[0073] Therefore, the step-by-step printing method for insulating adhesive provided by this invention achieves differentiated control of the insulating adhesive thickness in the solder ribbon-covered area and the non-solder ribbon-covered area. It not only effectively reduces the risk of short circuits caused by solder ribbon puncture by ensuring that the solder ribbon-covered area has a certain insulating adhesive thickness, but also effectively reduces unit consumption and warping of the printed cells by reducing the insulating adhesive thickness in the non-solder ribbon-covered area. This prevents waste of insulating adhesive material, reduces costs, alleviates microcracks caused by increased cell warping due to excessive adhesive layer thickness, significantly improves module yield, and enhances subsequent processing and overall performance of the module.

[0074] The above description is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention fall within the protection and disclosure scope of the present invention.

Claims

1. A step-by-step printing method for insulating adhesive used in photovoltaic modules, characterized in that, The step-by-step printing method for insulating adhesive includes sequentially performing insulating adhesive printing on the solder ribbon-covered area, first curing, insulating adhesive printing on the non-solder ribbon-covered area, and second curing. The thickness of the insulating adhesive printed in the area covered by the solder strip is greater than the thickness of the insulating adhesive printed in the area not covered by the solder strip.

2. The method for step-by-step printing of insulating adhesive according to claim 1, characterized in that, The thickness of the insulating adhesive printed in the area covered by the welding strip is 10-50 μm; And / or, the thickness of the insulating adhesive printed in the non-solder strip covered area is 5-30 μm; And / or, the difference between the thickness of the insulating adhesive printed in the area covered by the solder strip and the thickness of the insulating adhesive printed in the area not covered by the solder strip is ≥10μm.

3. The step-by-step printing method for insulating adhesive according to claim 1 or 2, characterized in that, The methods for printing insulating adhesive in the areas covered by the solder strip and the methods for printing insulating adhesive in the areas not covered by the solder strip each independently include screen printing.

4. The step-by-step printing method for insulating adhesive according to claim 3, characterized in that, The mesh count of the screen printing stencil used for printing the insulating adhesive in the area covered by the welding strip is 200-500 mesh. And / or, the wire diameter of the screen printing stencil used for printing the insulating adhesive in the area covered by the solder strip is 10-40μm; And / or, the screen printing stencil used for printing the insulating adhesive in the area covered by the solder strip has a yarn thickness of 20-80μm; And / or, the screen printing plate used for printing the insulating adhesive in the area covered by the solder strip has a film thickness of 5-25 μm.

5. The method for step-by-step printing of insulating adhesive according to claim 3, characterized in that, The mesh count of the screen printing stencil used for printing the insulating adhesive in the non-welding strip covered area is 200-500 mesh. And / or, the wire diameter of the screen printing stencil used for printing the insulating adhesive in the non-solder strip covered area is 10-40μm; And / or, the screen printing stencil used for printing the insulating adhesive in the non-welding strip covered area has a yarn thickness of 20-80μm; And / or, the screen printing plate used for printing the insulating adhesive in the non-solder strip covered area has a film thickness of 5-25μm.

6. The method for step-by-step printing of insulating adhesive according to claim 1 or 2, characterized in that, The weight of the insulating adhesive printed on the area covered by the welding strip is 0.05-0.6g; And / or, the weight of the insulating adhesive printed on the non-solder strip covered area is 0.1-0.4g.

7. The method for step-by-step printing of insulating adhesive according to claim 1 or 2, characterized in that, The insulating adhesives used for printing insulating adhesive in the areas covered by the solder strip and the areas not covered by the solder strip are independently classified as silicone insulating adhesive and / or epoxy resin insulating adhesive, respectively.

8. The method for step-by-step printing of insulating adhesive according to claim 1 or 2, characterized in that, The first curing and the second curing methods independently include UV curing and / or thermal curing, respectively.

9. A photovoltaic module, characterized in that, The photovoltaic module is manufactured using the step-by-step printing method for insulating adhesive as described in any one of claims 1-8.

10. A solar cell, characterized in that, The solar cell contains the photovoltaic module as described in claim 9.

Images