Scattering parameter determination and de-embedding method and device of welding type test fixture and medium

Abstract

The invention relates to the technical field of electronic testing, in particular to a scattering parameter determination and de-embedding method and device of a welding type test fixture and a medium. The method comprises the following steps: obtaining the insertion loss of a test fixture; acquiring an impedance change curve of a first cascade circuit where the test fixture is located; wherein the first cascade circuit is a cascade circuit formed by welding the test fixture on a test welding point of a tested object; fitting the impedance change curve through an artificial circuit of the first cascade circuit to obtain impedance and time delay of the test fixture in a first welding state of forming the first cascade circuit; and determining a scattering parameter value of the test fixture in the first welding state based on the impedance, the time delay and the insertion loss.

Description

Technical Field

[0001] This invention relates to the field of electronic testing technology, specifically to a method, apparatus, and medium for determining scattering parameters of a welded test fixture and for removing embedded parts. Background Technology

[0002] With the continuous development of electronic devices, the performance testing requirements for electronic components are becoming increasingly stringent. In the testing process of electronic components, test fixtures are dedicated interface devices connecting the device under test (DUT) to the testing instruments, playing a crucial role in RF, microwave, and high-speed digital circuit testing. Their core function is to provide a stable and repeatable electrical and mechanical connection environment for the DUT, ensuring the accuracy of measurement results. When testing the scattering parameters of the DUT, it is necessary to exclude the scattering parameters of the test fixture. Therefore, accurately determining the scattering parameters of the test fixture is an urgent problem to be solved.

[0003] The main methods for testing the scattering parameters of test fixtures include the port extension method. However, while this method can obtain the scattering parameters of the test fixture, it only provides the parameters under normal conditions and cannot obtain the scattering parameters under soldered conditions. In scenarios requiring precise testing, such as intelligent driving scenarios, the accuracy of S-parameter testing is crucial for achieving high-speed data transmission between the sensor and the ECU via the GMSL (Gigabit Multimedia Serial Link) communication interface. In such cases, the impedance and delay caused by solder joints cannot be ruled out, leading to discrepancies between the fixture's scattering parameters and those obtained during testing, thus affecting the overall scattering parameters of the object under test in subsequent tests. Summary of the Invention

[0004] The scattering parameter determination, de-embedding method, apparatus, and medium of the welded test fixture provided in this disclosure can accurately determine the scattering parameters of the fixture in the welded state.

[0005] According to a first aspect of this disclosure, a method for determining the scattering parameters of a welded test fixture is provided, comprising:

[0006] Obtain the insertion loss of the test fixture;

[0007] Obtain the impedance change curve of the first cascaded circuit where the test fixture is located; wherein, the first cascaded circuit is a cascaded circuit formed by welding the test fixture to the test welding point of the object under test;

[0008] By fitting the impedance change curve through the simulation circuit of the first cascaded circuit, the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit are obtained.

[0009] The scattering parameter values ​​of the test fixture in the first welding state are determined based on the impedance, delay, and insertion loss.

[0010] According to a second aspect of this disclosure, a method for de-embedding scattering parameters of a welded test fixture is provided, comprising:

[0011] Obtain the insertion loss of the test fixture;

[0012] Obtain the impedance change curve of the first cascaded circuit where the test fixture is located; wherein, the first cascaded circuit is a cascaded circuit formed by welding the test fixture to the test welding point of the object under test;

[0013] By fitting the impedance change curve through the simulation circuit of the first cascaded circuit, the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit are obtained.

[0014] The scattering parameter values ​​of the test fixture in the first welding state are determined based on the impedance, delay, and insertion loss.

[0015] The scattering parameter values ​​of the test fixture in the first welding state are imported into a vector network analyzer, and the automatic fixture removal algorithm is used to remove the embedding to obtain the scattering parameter values ​​of the object under test.

[0016] According to a third aspect of this disclosure, a device for determining the scattering parameters of a welded test fixture is provided, comprising:

[0017] The first acquisition module is used to acquire the insertion loss of the test fixture;

[0018] The second acquisition module is used to acquire the impedance change curve of the first cascaded circuit where the test fixture is located; wherein, the first cascaded circuit is a cascaded circuit formed by welding the test fixture to the test welding point of the object under test.

[0019] The first fitting module is used to fit the impedance change curve through the simulation circuit of the first cascaded circuit to obtain the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit.

[0020] The first determining module is used to determine the scattering parameter values ​​of the test fixture in the first welding state based on the impedance, delay, and insertion loss.

[0021] According to a fourth aspect of this disclosure, a device for de-embedding scattering parameters of a welded test fixture is provided, characterized in that it comprises:

[0022] The third acquisition module is used to acquire the insertion loss of the test fixture;

[0023] The fourth acquisition module is used to acquire the impedance change curve of the first cascade circuit where the test fixture is located; wherein, the first cascade circuit is the cascade circuit formed by welding the test fixture to the test welding point of the object under test.

[0024] The second fitting module is used to fit the impedance change curve through the simulation circuit of the first cascaded circuit to obtain the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit.

[0025] The second determining module is used to determine the scattering parameter values ​​of the test fixture in the first welding state based on impedance, delay and insertion loss;

[0026] The de-embedding module is used to import the scattering parameter values ​​of the test fixture in the first welding state into the vector network analyzer, and perform de-embedding through the automatic fixture removal algorithm to obtain the scattering parameter values ​​of the test object.

[0027] According to a fifth aspect of this disclosure, a storage medium is provided that stores computer instructions thereon, which, when executed by a processor, implement the steps of the method as described in any one of the first or second aspects of this disclosure.

[0028] One beneficial effect of this disclosure is that it provides a method for determining the scattering parameters of a welded test fixture. This method involves fitting the impedance curve of the test fixture welded to the object under test using a simulation circuit to obtain the impedance and delay of the test fixture in the welded state. Based on the loss of the test fixture, the scattering parameter values ​​of the test fixture in the welded state are determined. In this way, the total scattering parameters of the weld point and the test fixture in the welded state are accurately obtained, enabling subsequent testing processes to accurately remove the weld and eliminate the influence of high impedance at the weld point on the object under test, thus obtaining accurate scattering parameters of the object under test.

[0029] Other features and advantages of the embodiments of this disclosure will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0030] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments of the present disclosure and, together with their description, serve to explain the principles of the embodiments of the present disclosure.

[0031] Figure 1 A flowchart illustrating a method for determining scattering parameters of a welded test fixture according to an embodiment of the present disclosure is shown.

[0032] Figure 2 A schematic diagram of a test fixture according to an embodiment of the present disclosure is shown;

[0033] Figure 3 A schematic diagram of the impedance variation curve according to an embodiment of the present disclosure is shown;

[0034] Figure 4 A schematic diagram of a simulation circuit according to an embodiment of the present disclosure is shown;

[0035] Figure 5 A flowchart of a scattering parameter de-embedding method for a welded test fixture according to an embodiment of the present disclosure is shown;

[0036] Figure 6 A schematic diagram of a scattering parameter determination device for a welded test fixture according to an embodiment of the present disclosure is shown;

[0037] Figure 7 A schematic diagram of a scattering parameter de-embedding device for a welded test fixture according to an embodiment of the present disclosure is shown. Detailed Implementation

[0038] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention.

[0039] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0040] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0041] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0042] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0043] This application provides a method for determining the scattering parameters of a welded test fixture. For example... Figure 1 As shown, the method includes steps S11-S14.

[0044] Step S11: Obtain the insertion loss of the test fixture.

[0045] In this example, the test fixture is as follows: Figure 2 As shown, the insertion loss of the test fixture is obtained by connecting the test fixture to a vector network analyzer.

[0046] In this embodiment, the insertion loss of the test fixture can be tested using a VNA (Vector Network Analyzer). Specifically, a test fixture can be connected to the VNA independently, and the insertion loss of the test fixture can be automatically measured using the VNA's automatic port extension algorithm.

[0047] Step S12: Obtain the impedance change curve of the first cascaded circuit where the test fixture is located; wherein, the first cascaded circuit is the cascaded circuit formed by welding the test fixture to the test welding point of the object under test.

[0048] In this embodiment, the overall S-parameters (scattering parameter values) of the cascaded circuit can be measured using a VNA. During testing, two test fixtures are typically soldered to test points at both ends of the object under test (DUT), such as a solder joint on a PCB board, forming a cascaded circuit. Then, the two test fixtures are connected to the VNA, and the overall S-parameter curve, including the test fixtures and the DUT, is measured using the VNA. The S-parameter curve is then converted into a TDR (Time Domain Reflectometry) impedance curve. Figure 3 As shown, the vertical axis of the coordinate system represents impedance, and the horizontal axis represents time. Through this TDR impedance curve, we can obtain the corresponding impedance and delay of the cascaded circuit, either as a whole or in a localized area. Figure 3 In the example shown, the channel impedance is 50 ohms, but at the positions of 2.0 and 2.2 ns, there are some discontinuities caused by the test fixture impedance, especially at the subsequent solder joints, where the impedance rises to about 57 ohms.

[0049] Step S13: By fitting the impedance change curve of the simulation circuit of the first cascaded circuit, the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit are obtained.

[0050] In one example of this embodiment, after obtaining the overall impedance change curve of the cascaded circuit, the curve can be fitted by a simulation circuit.

[0051] In one example of this embodiment, the simulation circuit includes multiple circuit elements corresponding to the object under test, and a virtual fixture element characterizing the test fixture in a first welding state; by fitting the impedance change curve of the simulation circuit of the first cascaded circuit, the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit are obtained, including: setting parameters for input circuit elements and virtual fixture elements; and fitting the impedance change curve based on the setting parameters to obtain the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit.

[0052] In this example, the user can set up simulation components in the simulation software, including multiple components of the object under test, and virtual fixture components representing the test fixture in the soldered state. That is, the virtual fixture components include the test fixture and the solder joint. In this example, the simulation circuit part is as follows: Figure 4 As shown, the simulation circuit includes multiple circuit elements of a virtual fixture and the object under test. After constructing the simulation circuit according to the first cascaded circuit, the parameters of the corresponding elements in the simulation circuit can be set based on the specific parameters of each element in the first cascaded circuit. The elements in the cascaded circuit can include transmission lines, and the corresponding parameters can also include the material, length, width, and transmission line distribution parameters including resistance, inductance, conductance, and capacitance per unit length. Similarly, parameters other than impedance and delay of the virtual fixture element can also be set, including the dielectric constant of the virtual fixture element. In this example, the dielectric constant is mainly composed of the real part of the relative dielectric constant and the imaginary part corresponding to the insertion loss. Since the insertion loss has little effect on the node constant, and the solder joint has a relatively small effect on the insertion loss, in this example, the insertion loss of the test fixture without solder joints obtained in the aforementioned steps can be input to determine the setting of the dielectric constant of the virtual fixture element. Then, by continuously adjusting the impedance and delay parameters, the impedance change curve corresponding to the simulation circuit is fitted to the actual curve of the first cascaded circuit. Once the fitting is complete, the impedance and delay of the virtual fixture element are used as the impedance and delay of the test fixture in the first welding state, which includes the impedance and delay of the welding point.

[0053] Step S14: Determine the scattering parameter values ​​of the test fixture in the first welding state based on impedance, delay, and insertion loss.

[0054] Scattering parameters are a set of parameters describing how linear electronic networks or components in radio frequency, microwave, and high-speed digital circuits scatter incident electromagnetic waves at a specific frequency. They mainly include return loss and insertion loss. In this example, impedance and delay can be used to determine the return loss of the test fixture in its first soldered state. Furthermore, since the solder joint has a relatively small impact on insertion loss, the insertion loss of the unsoldered test fixture can be used as the insertion loss in the scattering parameter values ​​of the test fixture in its first soldered state.

[0055] After obtaining the impedance and delay of the test fixture and weld joint, the return loss in the S-parameters can be determined. Because the impedance of the test fixture and weld joint is discontinuous, according to Kirchhoff's laws, reflected voltage and current will appear at the impedance discontinuity. Therefore, the reflection parameters of the test fixture in the first weld state are calculated using the following formula:

[0056]

[0057] Where ρ is the reflection parameter, Vin The input voltage, which is the voltage of the test fixture in the first welding state, is V. r Z1 is the reflected voltage, Z2 is the impedance of the test fixture in the first welding state, and Z3 is the impedance of the object under test. The amplitude of the return loss can be obtained from the frequency domain representation of the reflection parameters, and the phase of the return loss can be determined based on the delay of the test fixture in the first welding state.

[0058] This example provides a method for determining the scattering parameters of a welded test fixture. By fitting the impedance curve of the test fixture welded to the object under test using a simulation circuit, the impedance and delay of the test fixture in the welded state are obtained. Based on the loss of the test fixture, the scattering parameter values ​​of the test fixture in the welded state are determined. In this way, the total scattering parameters of the weld point and the test fixture in the welded state are accurately obtained, allowing subsequent testing steps to precisely remove the influence of the weld point and obtain accurate scattering parameters of the object under test.

[0059] In another example of this embodiment, the insertion loss of the test fixture is the insertion loss of the test fixture in a second soldering state, which is used to form a second cascaded circuit connecting the two test fixtures.

[0060] In this embodiment, two test fixtures of the same specifications can be directly connected and soldered before testing the object under test to obtain a second cascaded circuit. The overall insertion loss of the second cascaded circuit can then be tested using a device such as a VNA to determine the insertion loss of individual test fixtures and solder joints. In this example, although the soldering configuration of directly soldering two test fixtures differs from soldering onto a PCB board, the magnitude of the insertion loss is only related to the material. Therefore, using this method, the overall insertion loss of the test fixtures and solder joints can be obtained, which is equivalent to the insertion loss of the test fixtures in the first soldering state.

[0061] In one example of this embodiment, the insertion loss of the test fixture in the second soldered state is obtained by symmetrically dividing the overall insertion loss of the second cascaded circuit.

[0062] In this example, the second cascaded circuit can be symmetrically bisected directly using a symmetrical bisecting algorithm, such as the 2-port-Thru method, to obtain the overall insertion loss of the test fixture and solder joint, which is equivalent to the insertion loss of the test fixture in the first soldering state.

[0063] In one example of this embodiment, the simulation circuit includes multiple circuit elements corresponding to the object under test, and a virtual fixture element characterizing the test fixture in a first welding state. The impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit are obtained by fitting the impedance change curve through the simulation circuit of the first cascaded circuit. This includes: setting parameters for the input circuit elements and the virtual fixture element, wherein the setting parameters of the virtual fixture element include the dielectric constant of the test fixture, which is determined based on the insertion loss of the test fixture in a second welding state; and fitting the impedance change curve based on the setting parameters to obtain the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit.

[0064] In this embodiment, since the overall insertion loss of the test fixture and solder joint has been obtained, this overall insertion loss can be input into the imaginary part of the dielectric constant of the virtual fixture element. When fitting the impedance change curve through the simulation circuit, a more accurate impedance and delay of the test fixture in the first soldering state can be obtained, thus obtaining more accurate S-parameters.

[0065] In this example, by forming a second cascaded circuit with the test fixture, the total insertion loss of the test fixture and solder joint is obtained. This insertion loss is then used to set parameters in the virtual test fixture in the simulation circuit. This allows for a more accurate acquisition of the total scattering parameters of the solder joint and the test fixture under the soldered state. This enables the precise removal of the influence of the scattering parameters of the fixture and solder joint when measuring the scattering parameters of other objects. By de-embedding the test fixture and solder joint, accurate scattering parameters of other tested objects can be obtained, making it suitable for testing scenarios with high accuracy requirements.

[0066] This application also provides a method for de-embedding scattering parameters of a welded test fixture. For example... Figure 5 As shown, the method includes steps S21-S25.

[0067] S21, obtain the insertion loss of the test fixture.

[0068] S22, Obtain the impedance change curve of the first cascade circuit where the test fixture is located; wherein, the first cascade circuit is a cascade circuit formed by welding the test fixture to the test welding point of the object under test.

[0069] S23, by fitting the impedance change curve through the simulation circuit of the first cascaded circuit, the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit are obtained.

[0070] S24, determine the scattering parameter values ​​of the test fixture in the first welding state based on impedance, delay and insertion loss.

[0071] S25, the scattering parameter values ​​of the test fixture in the first welding state are imported into the vector network analyzer, and the automatic fixture removal algorithm is used to remove the embedding to obtain the scattering parameter values ​​of the object under test.

[0072] Fixture removal refers to eliminating the influence of the test fixture on the S-parameters through a specific method, thereby obtaining the S-parameters of the object under test and achieving the testing objective. In this embodiment, the S-parameters of the test fixture in its first welded state can be determined using any method in the method embodiment for determining the scattering parameters of the welded test fixture. These parameters are then imported into a vector network analyzer as the S-parameters of the test fixture. The automatic fixture removal algorithm in the vector network analyzer removes the influence of the test fixture and weld points, obtaining the accurate S-parameters of the object under test excluding the influence of the test fixture and weld points.

[0073] This application embodiment also provides a scattering parameter determination device 100 for a welded test fixture, such as... Figure 6 As shown, the device includes: a first acquisition module 101 for acquiring the insertion loss of the test fixture; a second acquisition module 102 for acquiring the impedance change curve of the first cascaded circuit where the test fixture is located; wherein, the first cascaded circuit is a cascaded circuit formed by welding the test fixture to the test welding point of the object under test; a first fitting module 103 for fitting the impedance change curve through the simulation circuit of the first cascaded circuit to obtain the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit; and a first determination module 104 for determining the scattering parameter values ​​of the test fixture in the first welding state based on the impedance, delay and insertion loss.

[0074] Optionally, the insertion loss of the test fixture is the insertion loss of the test fixture in the second soldering state, which is used to form a second cascaded circuit connecting the two test fixtures.

[0075] Optionally, the insertion loss of the test fixture in the second soldered state is obtained by symmetrically dividing the overall insertion loss of the second cascaded circuit.

[0076] Optionally, the simulation circuit includes multiple circuit elements corresponding to the object under test, and a virtual fixture element characterizing the test fixture in the first welding state; by fitting the impedance change curve of the simulation circuit of the first cascaded circuit, the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit are obtained, including: setting parameters of the input circuit elements and the virtual fixture element, wherein the setting parameters of the virtual fixture element include the dielectric constant of the test fixture, which is determined based on the insertion loss of the test fixture in the second welding state; and by fitting the impedance change curve based on the setting parameters, the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit are obtained.

[0077] Optionally, the simulation circuit includes multiple circuit elements corresponding to the object under test, and a virtual fixture element characterizing the test fixture in the first welding state; by fitting the impedance change curve of the simulation circuit of the first cascaded circuit, the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit are obtained, including: setting parameters of the input circuit elements and the virtual fixture element; and fitting the impedance change curve based on the setting parameters to obtain the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit.

[0078] Alternatively, the insertion loss of the test fixture is obtained by connecting the test fixture to a vector network analyzer.

[0079] This application embodiment also provides a scattering parameter de-embedding device 200 for a welded test fixture, such as... Figure 7 As shown, the device includes: a third acquisition module 201 for acquiring the insertion loss of the test fixture; a fourth acquisition module 202 for acquiring the impedance change curve of the first cascaded circuit where the test fixture is located; wherein, the first cascaded circuit is a cascaded circuit formed by welding the test fixture to the test welding point of the object under test; a second fitting module 203 for fitting the impedance change curve through the simulation circuit of the first cascaded circuit to obtain the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit; a second determination module 204 for determining the scattering parameter value of the test fixture in the first welding state based on the impedance, delay and insertion loss; and a de-embedding module 205 for importing the scattering parameter value of the test fixture in the first welding state into a vector network analyzer and performing de-embedding through an automatic fixture removal algorithm to obtain the scattering parameter value of the object under test.

[0080] Optionally, the insertion loss of the test fixture is the insertion loss of the test fixture in the second soldering state, which is used to form a second cascaded circuit connecting the two test fixtures.

[0081] Optionally, the insertion loss of the test fixture in the second soldered state is obtained by symmetrically dividing the overall insertion loss of the second cascaded circuit.

[0082] Optionally, the simulation circuit includes multiple circuit elements corresponding to the object under test, and a virtual fixture element characterizing the test fixture in the first welding state; by fitting the impedance change curve of the simulation circuit of the first cascaded circuit, the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit are obtained, including: setting parameters for the input circuit elements and the virtual fixture element, wherein the setting parameters of the virtual fixture element include the dielectric constant of the test fixture, which is determined based on the insertion loss of the test fixture in the second welding state; and by fitting the impedance change curve based on the setting parameters, the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit are obtained.

[0083] Optionally, the simulation circuit includes multiple circuit elements corresponding to the object under test, and a virtual fixture element characterizing the test fixture in the first welding state; by fitting the impedance change curve of the simulation circuit of the first cascaded circuit, the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit are obtained, including: setting parameters of the input circuit elements and the virtual fixture element; and fitting the impedance change curve based on the setting parameters to obtain the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit.

[0084] Alternatively, the insertion loss of the test fixture is obtained by connecting the test fixture to a vector network analyzer.

[0085] This application provides a storage medium storing a program or instructions. When the program or instructions are executed by a processor, they implement the test method steps of the method for determining the scattering parameters of the welded test fixture and the method for removing the scattering parameters of the welded test fixture according to any of the foregoing embodiments, and can achieve the same technical effect. To avoid repetition, they will not be described again here.

[0086] The various embodiments in this disclosure are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the control method and storage medium embodiments are basically similar to the device embodiments, so the descriptions are relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0087] The foregoing has described specific embodiments of this disclosure. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims may be performed in a different order than that shown in the embodiments and may still achieve the desired results. Furthermore, the processes depicted in the drawings do not necessarily require the specific or sequential order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0088] Embodiments of this disclosure may be systems, methods, and / or computer program products. A computer program product may include a computer-readable storage medium having computer-readable program instructions loaded thereon for causing a processor to implement various aspects of the embodiments of this disclosure.

[0089] Computer-readable storage media can be tangible devices capable of holding and storing instructions for use by an instruction execution device. Computer-readable storage media can be, for example—but not limited to—electrical storage devices, magnetic storage devices, optical storage devices, electromagnetic storage devices, semiconductor storage devices, or any suitable combination thereof. More specific examples (a non-exhaustive list) of computer-readable storage media include: portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), static random access memory (SRAM), portable compact disc read-only memory (CD-ROM), digital multifunction disc (DVD), memory sticks, floppy disks, mechanical encoding devices, such as punch cards or recessed protrusions storing instructions thereon, and any suitable combination thereof. The computer-readable storage media used herein are not to be construed as transient signals themselves, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through waveguides or other transmission media (e.g., light pulses through fiber optic cables), or electrical signals transmitted through wires.

[0090] The computer-readable program instructions described herein can be downloaded from computer-readable storage media to various computing / processing devices, or downloaded via a network, such as the Internet, local area network, wide area network, and / or wireless network, to an external computer or external storage device. The network may include copper transmission cables, fiber optic transmission, wireless transmission, routers, firewalls, switches, gateway computers, and / or edge servers. A network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards them to the computer-readable storage media in the respective computing / processing device.

[0091] Computer program instructions used to perform the operations of embodiments of this disclosure may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, state setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Smalltalk, C++, etc., and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The computer-readable program instructions may execute entirely on a user's computer, partially on a user's computer, as a standalone software package, partially on a user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving a remote computer, the remote computer may be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or may be connected to an external computer (e.g., via the Internet using an Internet service provider). In some embodiments, electronic circuitry, such as programmable logic circuitry, field-programmable gate arrays (FPGAs), or programmable logic arrays (PLAs), is personalized by utilizing state information from the computer-readable program instructions. This electronic circuitry can execute the computer-readable program instructions to implement various aspects of embodiments of this disclosure.

[0092] Various aspects of embodiments of this disclosure are described herein with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this disclosure. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer-readable program instructions.

[0093] These computer-readable program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus to produce a machine such that, when executed by the processor of the computer or other programmable data processing apparatus, they create means for implementing the functions / actions specified in one or more blocks of the flowchart and / or block diagram. These computer-readable program instructions can also be stored in a computer-readable storage medium that causes a computer, programmable data processing apparatus, and / or other device to operate in a particular manner; thus, the computer-readable medium storing the instructions comprises an article of manufacture that includes instructions for implementing aspects of the functions / actions specified in one or more blocks of the flowchart and / or block diagram.

[0094] Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device to cause a series of operational steps to be performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process, thereby causing the instructions executed on the computer, other programmable data processing apparatus, or other device to perform the functions / actions specified in one or more boxes of a flowchart and / or block diagram.

[0095] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of an instruction, which contains one or more executable instructions for implementing a specified logical function. In some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions. It will be known to those skilled in the art that implementation in hardware, implementation in software, and implementation in a combination of software and hardware are equivalent.

[0096] The various embodiments of this disclosure have been described above. These descriptions are exemplary and not exhaustive, and are not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A method for determining the scattering parameters of a welded test fixture, characterized in that, include: Obtain the insertion loss of the test fixture; Obtain the impedance change curve of the first cascaded circuit where the test fixture is located; wherein, the first cascaded circuit is a cascaded circuit formed by welding the test fixture to the test welding point of the object under test; By fitting the impedance change curve through the simulation circuit of the first cascaded circuit, the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit are obtained. The scattering parameter values ​​of the test fixture in the first welding state are determined based on the impedance, delay, and insertion loss.

2. The method according to claim 1, characterized in that, The insertion loss of the test fixture is the insertion loss of the test fixture in the second welding state, which is used to form a second cascaded circuit connecting the two test fixtures.

3. The method according to claim 2, characterized in that, The insertion loss of the test fixture in the second welded state is obtained by symmetrically dividing the overall insertion loss of the second cascaded circuit.

4. The method according to claim 2, characterized in that, The simulation circuit includes multiple circuit elements corresponding to the object under test, and a virtual fixture element characterizing the test fixture in the first welding state. The step of fitting the impedance change curve through the simulation circuit of the first cascaded circuit to obtain the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit includes: Input the setting parameters of the circuit element and the virtual fixture element, wherein the setting parameters of the virtual fixture element include the dielectric constant of the test fixture, which is determined based on the insertion loss of the test fixture in the second soldering state; By fitting the impedance change curve based on the set parameters, the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit are obtained.

5. The method according to claim 1, characterized in that, The simulation circuit includes multiple circuit elements corresponding to the object under test, and a virtual fixture element characterizing the test fixture in the first welding state. The step of fitting the impedance change curve through the simulation circuit of the first cascaded circuit to obtain the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit includes: Input the setting parameters of the circuit element and the virtual fixture element; By fitting the impedance change curve based on the set parameters, the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit are obtained.

6. The method according to claim 1, characterized in that, The insertion loss of the test fixture is obtained by connecting the test fixture to a vector network analyzer.

7. A method for de-embedding scattering parameters of a welded test fixture, characterized in that, include: Obtain the insertion loss of the test fixture; Obtain the impedance change curve of the first cascaded circuit where the test fixture is located; wherein, the first cascaded circuit is a cascaded circuit formed by welding the test fixture to the test welding point of the object under test; By fitting the impedance change curve through the simulation circuit of the first cascaded circuit, the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit are obtained. The scattering parameter values ​​of the test fixture in the first welding state are determined based on the impedance, delay, and insertion loss. The scattering parameter values ​​of the test fixture in the first welding state are imported into a vector network analyzer, and the automatic fixture removal algorithm is used to remove the embedding to obtain the scattering parameter values ​​of the object under test.

8. A device for determining the scattering parameters of a welded test fixture, characterized in that, include: The first acquisition module is used to acquire the insertion loss of the test fixture; The second acquisition module is used to acquire the impedance change curve of the first cascaded circuit where the test fixture is located; wherein, the first cascaded circuit is a cascaded circuit formed by welding the test fixture to the test welding point of the object under test. The first fitting module is used to fit the impedance change curve through the simulation circuit of the first cascaded circuit to obtain the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit. The first determining module is used to determine the scattering parameter values ​​of the test fixture in the first welding state based on the impedance, delay, and insertion loss.

9. A device for removing scattering parameters from a welded test fixture, characterized in that, include: The third acquisition module is used to acquire the insertion loss of the test fixture; The fourth acquisition module is used to acquire the impedance change curve of the first cascaded circuit where the test fixture is located; wherein, the first cascaded circuit is a cascaded circuit formed by welding the test fixture to the test welding point of the object under test. The second fitting module is used to fit the impedance change curve through the simulation circuit of the first cascaded circuit to obtain the impedance and delay of the test fixture in the first welding state of forming the first cascaded circuit. The second determining module is used to determine the scattering parameter values ​​of the test fixture in the first welding state based on the impedance, delay and insertion loss; The de-embedding module is used to import the scattering parameter values ​​of the test fixture in the first welding state into a vector network analyzer, and perform de-embedding through an automatic fixture removal algorithm to obtain the scattering parameter values ​​of the object under test.

10. A storage medium, characterized in that, It includes the step of storing computer instructions thereon, which, when executed by a processor, implement the method described in any one of claims 1-7.

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