Dustproof and waterproof sealing cover for optoelectronic device

Abstract

The invention relates to the field of photoelectronic devices, and discloses a dustproof and waterproof sealing cover for a photoelectronic device, which comprises a sealing cover body, a base is arranged on the lower surface of the sealing cover body, a first reset spring is arranged in the sealing cover body, a buffer assembly is arranged on the outer wall of the first reset spring, and the buffer assembly is connected with the base. A limiting assembly is arranged on the lower surface of the sealing cover body, heat dissipation fins are arranged on the upper surface of the base, the heat dissipation fins are connected with a buffering assembly, a photoelectronic device body is arranged on the upper surfaces of the heat dissipation fins, and a cooling assembly is arranged in the base. The heat of the photoelectronic device body is transmitted to the base through the heat dissipation fins, so that the effects of continuously dissipating heat of the photoelectronic device body, keeping the photoelectronic device body at a stable working temperature, improving the working efficiency, avoiding heat accumulation of the photoelectronic device body and preventing the photoelectronic device body from being damaged by high temperature can be achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optoelectronic devices, in particular to a dustproof and waterproof sealing cover for optoelectronic devices. BACKGROUND

[0002] Optoelectronic devices refer to devices that use optoelectronic technology to convert, process, transmit and detect optical and electrical signals. The working basis of optoelectronic devices is the photoelectric effect, which is the phenomenon that a substance absorbs photon energy to produce corresponding electrical effects. Common photoelectric effects include external photoelectric effect and internal photoelectric effect. Devices based on external photoelectric effect include phototubes and photomultiplier tubes. Devices based on internal photoelectric effect include photoresistors, photodiodes and solar cells. In the use of optoelectronic devices, they are often used in combination with sealing covers.

[0003] The existing sealing cover seals the optoelectronic device in the cover to isolate it from the external environment, preventing contaminants from entering and avoiding problems such as corrosion, short circuit or optical performance degradation of the device, ensuring that the device works in a stable environment. However, the accumulation of a large amount of heat generated by the long-term operation of the optoelectronic device in the sealing cover cannot be discharged, resulting in damage to the optoelectronic device due to high temperature. SUMMARY

[0004] In view of the deficiencies of the prior art, the present application provides a dustproof and waterproof sealing cover for optoelectronic devices, which solves the problem of damage to the optoelectronic device due to high temperature caused by the accumulation of a large amount of heat generated by the long-term operation of the optoelectronic device in the sealing cover.

[0005] To achieve the above purpose, the present application realizes the technical scheme as follows: a dustproof and waterproof sealing cover for optoelectronic devices, comprising a sealing cover body, a base is arranged on the lower surface of the sealing cover body, a reset spring one is arranged in the sealing cover body, a buffer assembly is arranged on the outer wall of the reset spring one, the buffer assembly is connected with the base, a limiting assembly is arranged on the lower surface of the sealing cover body, a heat dissipation fin is arranged on the upper surface of the base, the heat dissipation fin is connected with the buffer assembly, an optoelectronic device body is arranged on the upper surface of the heat dissipation fin, the optoelectronic device body is connected with the buffer assembly, and a cooling assembly is arranged in the base.

[0006] Preferably, the buffer assembly comprises a reset spring one, one end of the reset spring one is arranged in the sealing cover body, and the other end of the reset spring one is provided with a clamping plate.

[0007] Preferably, the outer wall of the clamping plate is arranged on the outer wall of the optoelectronic device body, the outer wall of the clamping plate is arranged on the outer wall of the heat dissipation fin, and the lower surface of the clamping plate is slidingly connected to the upper surface of the base.

[0008] Preferably, the limiting assembly comprises a clamping block one, the upper surface of the clamping block one is fixedly connected to the lower surface of the sealing cover body, and the interior of the base is provided with a clamping groove one.

[0009] Preferably, the outer wall of the clamping block one is arranged in the interior of the base, and the outer wall of the clamping block one is arranged in the interior of the clamping groove one.

[0010] Preferably, the cooling assembly comprises a heat dissipation pipeline, the interior of the base is fixedly connected with the heat dissipation pipeline, the outer wall of the heat dissipation pipeline is fixedly connected with a heat exchange box, and the heat exchange box is made of aluminum alloy.

[0011] Preferably, the upper surface of the base is fixedly connected with a limiting block, the interior of the limiting block is provided with a return spring two, the outer wall of the return spring two is provided with a clamping block two, the outer wall of the clamping block two is slidably connected in the interior of the limiting block, the outer wall of the clamping block two is fixedly connected with a clamping block three, the outer wall of the clamping block three is arranged in the interior of the limiting block, the interior of the heat dissipation fin is provided with a clamping groove two, and the outer wall of the clamping block two is arranged in the interior of the heat dissipation fin through the clamping groove two.

[0012] Preferably, the interior of the limiting block is provided with a limiting groove one and a limiting groove two, and the outer wall of the clamping block three is arranged in the interior of the limiting groove one.

[0013] Preferably, the sealing cover body comprises a protective layer, the protective layer is the outermost layer of the sealing cover body, the outer wall of the protective layer is fixedly connected with a sealing layer, the outer wall of the sealing layer is fixedly connected with a heat conduction layer, and the outer wall of the heat conduction layer is fixedly connected with a buffer layer.

[0014] Preferably, the protective layer is made of aluminum alloy, the sealing layer is made of nitrile rubber, the heat conduction layer is made of silica gel sheet, and the buffer layer is made of sponge.

[0015] Working principle: the heat of the optoelectronic device body is transmitted to the base through the heat dissipation fin, the interior of the heat dissipation pipeline has circulating cooling liquid, the heat in the interior of the base enters the cooling liquid through the heat dissipation pipeline, and then enters the heat exchange box with the cooling liquid, which makes the heat carried by the cooling liquid successively dissipate to the outside through the heat dissipation pipeline and the heat exchange box, the cooling liquid returns to the low-temperature state and repeats the above process, so that the optoelectronic device body can be continuously cooled, the optoelectronic device body can be kept at a stable working temperature, the working efficiency can be improved, the accumulation of heat in the optoelectronic device body can be avoided, and the effect of preventing the optoelectronic device body from being damaged by high temperature can be achieved.

[0016] The sealed cavity is formed by the combination of the sealing cover body and the base, then the optoelectronic device body is placed in the cavity, avoiding the optoelectronic device body from contacting with external dust and water, and the heat dissipation fins are installed on the upper surface of the base, then the optoelectronic device body is installed on the upper side of the heat dissipation fins, and the clamping plate is installed on the sealing cover body, when the sealing cover body is shaken by external impact, the optoelectronic device body is shaken synchronously, at this time, the optoelectronic device body contacts with the clamping plate, then the elastic deformation of the reset spring I is caused under the driving of the clamping plate, then the reset spring I is reset and pushes back the clamping plate, avoiding the dislocation of the optoelectronic device body caused by impact, and the cooling assembly is installed in the base, the cooling assembly is used for assisting the heat energy transmission of the heat dissipation fins, so that the sealed space for the optoelectronic device body is provided and isolated from the external environment, preventing the rust and damage of the optoelectronic device body, preventing the damage and dislocation of the optoelectronic device body under external impact.

[0017] The clamping block three is rotated to separate from the inside of the limiting groove one, at this time, the clamping block two is rotated under the driving of the clamping block three, then the clamping block three drives the clamping block two to separate from the inside of the heat dissipation fin, then the elastic deformation of the reset spring two is caused, when the clamping block three reaches the limiting groove two, the clamping block three is clamped into the inside of the limiting block by rotating the clamping block three again, at this time, the clamping block two is separated from the inside of the heat dissipation fin, and the heat dissipation fin can be separated from the surface of the base, so that the sealing cover body of the same type can be installed with different specifications of heat dissipation fins, and then the sealing cover body can be applied to various types and powers of optoelectronic device bodies.

[0018] The sealing cover body is combined by a plurality of materials with different performances, wherein the outermost layer of the sealing cover body is a protective layer composed of aluminum alloy, the aluminum alloy has high strength, heat conductivity and corrosion resistance, which enables the sealing cover body to resist external impact and wear, a sealing layer composed of nitrile rubber is installed on one side of the protective layer, the nitrile rubber has oil resistance, wear resistance and aging resistance, and has a blocking effect on dust and moisture, a heat conduction layer composed of silica gel sheet is installed on the other side of the sealing layer, the heat conduction layer has high heat conductivity, and the heat dissipation performance of the sealing cover body is enhanced, and a buffer layer composed of sponge is installed on the innermost side of the sealing cover body, the sponge is soft, elastic and insulating, and can prevent the optoelectronic device body from leaking current and causing damage to personnel equipment, so that the optoelectronic device body can be protected from external impact and vibration, the dustproof and waterproof and heat dissipation performance of the sealing cover body is enhanced, current leakage and damage to personnel equipment are prevented, and the sealing cover body can protect the optoelectronic device body in a changing environment.

[0019] The application provides a dustproof and waterproof sealing cover for an optoelectronic device.

[0020] 1. This invention transfers heat from the optoelectronic device body to the base through heat dissipation fins, while the heat dissipation pipe contains circulating coolant. Heat from inside the base enters the coolant through the heat dissipation pipe, thereby achieving continuous heat dissipation from the optoelectronic device body, maintaining the optoelectronic device body at a stable operating temperature, improving working efficiency, preventing heat accumulation in the optoelectronic device body, and preventing high temperature damage to the optoelectronic device body.

[0021] 2. This invention forms a sealed cavity by combining the sealing cover body and the base, and then places the optoelectronic device body in the cavity to prevent the optoelectronic device body from contacting external dust and water sources. This achieves the effect of providing a sealed space for the optoelectronic device body and isolating it from the outside world, preventing the optoelectronic device body from rusting and being damaged, and preventing the optoelectronic device body from being damaged or misaligned under external impact.

[0022] 3. The present invention rotates the third locking block to disengage it from the inside of the limiting groove one. At this time, the second locking block rotates under the drive of the third locking block, and then pushes the third locking block to drive the second locking block to disengage from the inside of the heat dissipation fins. This allows for the installation of heat dissipation fins of different specifications on the same type of sealing cover body, thereby enabling the sealing cover body to be suitable for various types and power optoelectronic device bodies.

[0023] 4. This invention combines various materials with different properties to form a sealing cover body. The outermost layer of the sealing cover body is a protective layer, and a sealing layer is installed on the side that is attached to the protective layer. A heat-conducting layer is then installed on the other side of the sealing layer, and a buffer layer is installed on the innermost side of the sealing cover body. This can protect the optoelectronic device body from external impacts and vibrations, enhance the dustproof, waterproof and heat dissipation performance of the sealing cover body, prevent current leakage from damaging personnel and equipment, and enable the sealing cover body to protect the optoelectronic device body in changing environments. Attached Figure Description

[0024] Figure 1 This is a three-dimensional structural diagram of the dustproof and waterproof sealing cover for optoelectronic devices proposed in this invention;

[0025] Figure 2 This is a cross-sectional schematic diagram of the internal structure of the dustproof and waterproof sealing cover body of the optoelectronic device proposed in this invention.

[0026] Figure 3 This is a partial structural diagram of the heat dissipation pipe of the dustproof and waterproof sealing cover for optoelectronic devices proposed in this invention;

[0027] Figure 4 This is a partial structural diagram of the heat dissipation fins of the dustproof and waterproof sealing cover for optoelectronic devices proposed in this invention;

[0028] Figure 5The partial structure diagram of the reset spring two of the dustproof and waterproof sealing cover for the optoelectronic device provided in the application is shown in the figure.

[0029] Figure 6 The partial structure diagram of the protective layer of the dustproof and waterproof sealing cover for the optoelectronic device provided in the application is shown in the figure.

[0030] In the figure, 1 is a sealing cover body, 2 is a base, 3 is a reset spring one, 4 is a clamping plate, 5 is a heat dissipation fin, 6 is a heat dissipation pipeline, 7 is a heat exchange box, 8 is a clamping block one, 9 is a clamping groove one, 10 is an optoelectronic device body, 11 is a limiting block, 12 is a reset spring two, 13 is a clamping block two, 14 is a clamping groove two, 15 is a limiting groove one, 16 is a clamping block three, 17 is a limiting groove two, 18 is a protective layer, 19 is a sealing layer, 20 is a heat conduction layer, and 21 is a buffer layer. DETAILED DESCRIPTION

[0031] The technical solutions of the application will be described clearly and completely below with reference to the drawings of the application. Obviously, the described embodiments are only some of the embodiments of the application, but not all the embodiments. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the application.

[0032] Please refer to the drawings of the application Figure 1 - the drawings of the application Figure 3 The dustproof and waterproof sealing cover for the optoelectronic device provided in the embodiments of the application includes a sealing cover body 1, the lower surface of the sealing cover body 1 is provided with a base 2, the inside of the sealing cover body 1 is provided with a reset spring one 3, the outer wall of the reset spring one 3 is provided with a buffer assembly, the buffer assembly is connected with the base 2, the lower surface of the sealing cover body 1 is provided with a limiting assembly, the upper surface of the base 2 is provided with a heat dissipation fin 5, the heat dissipation fin 5 is connected with the buffer assembly, the upper surface of the heat dissipation fin 5 is provided with an optoelectronic device body 10, the optoelectronic device body 10 is connected with the buffer assembly, and the inside of the base 2 is provided with a cooling assembly.

[0033] Specifically, the sealing cover body 1 and the base 2 are combined to form a closed cavity therebetween, and the optoelectronic device body 10 is installed in the cavity to be isolated from the outside, preventing the optoelectronic device body 10 from being damaged by contacting with dust and water source from the outside. The limiting assembly is used to assist the alignment and installation of the sealing cover body 1 and the base 2, and to enhance the lateral deformation resistance between the sealing cover body 1 and the base 2, thereby enhancing the stability. The heat dissipation fins 5 are installed on the upper surface of the base 2, and the heat dissipation fins 5 are used to transfer the heat generated by the operation of the optoelectronic device body 10. Then, the optoelectronic device body 10 is installed on the upper side of the heat dissipation fins 5. The buffer assembly is symmetrically installed on the inner side of the sealing cover body 1, and is used to assist the positioning and stability of the optoelectronic device body 10, avoiding the installation of the optoelectronic device body 10 from being skewed. When the sealing cover body 1 is impacted by the outside, the buffer assembly absorbs part of the impact, avoiding the damage of the optoelectronic device body 10 caused by the impact. The cooling assembly is installed in the base 2, and is used to assist the heat transfer of the heat dissipation fins 5, thereby providing a closed space for the optoelectronic device body 10 to isolate the water source and impurities from the outside, avoiding the rust and damage of the optoelectronic device body 10, improving the stability of the optoelectronic device body 10, and preventing the damage and misplacement of the optoelectronic device body 10 under the impact of the outside.

[0034] Referring to the accompanying drawings Figure 2 The buffer assembly includes a reset spring 3, one end of the reset spring 3 is arranged in the interior of the sealing cover body 1, and the other end of the reset spring 3 is provided with a clamping plate 4.

[0035] Specifically, when the sealing cover body 1 is shaken by the impact from the outside, the optoelectronic device body 10 is shaken synchronously. At this time, the optoelectronic device body 10 contacts with the clamping plate 4. The clamping plate 4 is made of sponge, which has elasticity and softness. The clamping plate 4 can absorb part of the impact and will not scratch the outer surface of the optoelectronic device body 10. Then, the reset spring 3 is elastically deformed under the driving of the clamping plate 4. When the shaking ends, the reset spring 3 resets and pushes the clamping plate 4 back to the initial position, avoiding the impact and misplacement of the optoelectronic device body 10, which affects the operation.

[0036] Referring to the accompanying drawings Figure 2 The outer wall of the clamping plate 4 is arranged on the outer wall of the optoelectronic device body 10, and the outer wall of the clamping plate 4 is arranged on the outer wall of the heat dissipation fins 5. The lower surface of the clamping plate 4 is slidingly connected to the upper surface of the base 2.

[0037] Specifically, the base 2 provides a sliding plane for the clamping plate 4. The installation position of the clamping plate 4 is matched with the outer wall of the optoelectronic device body 10, which is convenient for the positioning and installation of the optoelectronic device body 10.

[0038] Referring to the accompanying drawings Figure 2 and the accompanying drawings Figure 3The limiting component includes a locking block 8, the upper surface of which is fixedly connected to the lower surface of the sealing cover body 1, and a locking groove 9 is provided inside the base 2, with the outer wall of the locking block 8 located inside the locking groove 9.

[0039] Specifically, by inserting the card block 8 into the card slot 9, the sealing cover body 1 is installed in a fixed position on the base 2.

[0040] See appendix Figure 3 The outer wall of the card block 8 is set inside the base 2. The cooling component includes a heat dissipation pipe 6. The heat dissipation pipe 6 is fixedly connected inside the base 2. The heat exchange box 7 is fixedly connected to the outer wall of the heat dissipation pipe 6. The heat exchange box 7 is made of aluminum alloy.

[0041] Specifically, the heat from the optoelectronic device body 10 is transferred to the base 2 through the heat dissipation fins 5. The base 2 is equipped with heat dissipation pipes 6, and coolant is circulating inside the heat dissipation pipes 6. When the coolant passes through the heat dissipation pipes 6, it creates a temperature difference between the inside and outside of the heat dissipation pipes 6. As a result, the heat inside the base 2 enters the coolant through the heat dissipation pipes 6 and then enters the heat exchange box 7 with the coolant. The heat exchange box 7 is made of aluminum alloy, which has heat dissipation properties. This allows the heat carried by the coolant to be dissipated to the outside through the heat dissipation pipes 6 and the heat exchange box 7 in sequence. The coolant returns to a low temperature and repeats the above process. This achieves real-time heat dissipation of the optoelectronic device body 10, preventing the optoelectronic device body 10 from accumulating heat after long-term operation and preventing high temperature damage to the optoelectronic device body 10.

[0042] See appendix Figure 2 Appendix Figure 4 and attached Figure 5 A limiting block 11 is fixedly connected to the upper surface of the base 2. A second reset spring 12 is provided inside the limiting block 11. A second locking block 13 is provided on the outer wall of the second reset spring 12. The outer wall of the second locking block 13 is slidably connected to the inside of the limiting block 11. A third locking block 16 is fixedly connected to the outer wall of the second locking block 13. The outer wall of the third locking block 16 is located inside the limiting block 11. A second locking groove 14 is opened inside the heat dissipation fin 5. The outer wall of the second locking block 13 is located inside the heat dissipation fin 5 through the second locking groove 14. A first limiting groove 15 and a second limiting groove 17 are opened inside the limiting block 11. The outer wall of the third locking block 16 is located inside the first limiting groove 15.

[0043] Specifically, by rotating the clamping block three 16 to make it from the inside of the limiting groove one 15, since the clamping block two 13 and the clamping block three 16 are fixedly connected, the clamping block two 13 is driven by the clamping block three 16 to rotate in the inside of the limiting block 11, then the clamping block three 16 drives the clamping block two 13 to separate from the inside of the heat dissipation fin 5, and then the reset spring two 12 is elastically deformed, and the reset spring two 12 is used to assist the clamping block two 13 to reset. When the clamping block three 16 reaches the limiting groove two 17, rotate the clamping block three 16 again to clamp the clamping block three 16 into the inside of the limiting block 11, at this time the clamping block two 13 separates from the inside of the heat dissipation fin 5, the heat dissipation fin 5 is no longer fixed on the upper side of the base 2, and finally the purpose of controlling the disassembly of the heat dissipation fin 5 is realized, so that the same type of sealing cover body 1 can be replaced by different specifications of heat dissipation fin 5, and is suitable for various types and power of optoelectronic device body 10, so as to realize the effect of universality of the sealing cover body 1.

[0044] Referring to the accompanying drawings Figure 6 The sealing cover body 1 comprises a protective layer 18, the protective layer 18 is the outermost layer of the sealing cover body 1, the outer wall of the protective layer 18 is fixedly connected with a sealing layer 19, the outer wall of the sealing layer 19 is fixedly connected with a heat conducting layer 20, and the outer wall of the heat conducting layer 20 is fixedly connected with a buffer layer 21; the protective layer 18 is made of aluminum alloy, the sealing layer 19 is made of butyronitrile rubber, the heat conducting layer 20 is made of silica gel, and the buffer layer 21 is made of sponge.

[0045] Specifically, by combining a plurality of materials with different properties into the sealing cover body 1, wherein the outermost layer of the sealing cover body 1 is the protective layer 18, the protective layer 18 is composed of aluminum alloy, the aluminum alloy has high strength, thermal conductivity and corrosion resistance, which makes the sealing cover body 1 able to resist external impact and wear, and protects the optoelectronic device body 10, and the side of the protective layer 18 is installed with the sealing layer 19, the sealing layer 19 is composed of butyronitrile rubber, butyronitrile rubber is a synthetic rubber, butyronitrile rubber has oil resistance, wear resistance and aging resistance, and has a barrier effect on dust and moisture, which makes the sealing cover body 1 have dustproof and waterproof performance, then the other side of the sealing layer 19 is installed with the heat conduction layer 20, the heat conduction layer 20 is composed of silica gel sheet, the silica gel sheet is a sheet-shaped product made of silicone rubber, and has high thermal conductivity, the heat conduction layer 20 and the protective layer 18 cooperate with each other to assist heat conduction and strengthen the heat dissipation performance of the sealing cover body 1, and the innermost side of the sealing cover body 1 is installed with the buffer layer 21, the buffer layer 21 is composed of sponge, which is soft, elastic and insulating, which makes the optoelectronic device body 10 contact the buffer layer 21 when it is impacted and touched the inner wall of the sealing cover body 1, avoids damage, and can prevent the optoelectronic device body 10 from current leakage, causing damage to personnel and equipment, so as to achieve the effect of protecting the optoelectronic device body 10 from external impact and vibration, strengthening the dustproof and waterproof and heat dissipation performance of the sealing cover body 1, and preventing current leakage and damage to personnel and equipment, and promoting the sealing cover body 1 to protect the optoelectronic device body 10 in changing environment.

[0046] Although embodiments of the present application have been shown and described, it is to be understood that various modifications, substitutions, replacements and changes can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A dustproof and waterproof sealing cover for optoelectronic devices, comprising a sealing cover body (1), characterized in that, The lower surface of the sealing cover body (1) is provided with a base (2), the interior of the sealing cover body (1) is provided with a reset spring (3), the outer wall of the reset spring (3) is provided with a buffer assembly, the buffer assembly is connected to the base (2), the lower surface of the sealing cover body (1) is provided with a limit assembly, the upper surface of the base (2) is provided with a heat dissipation fin (5), the heat dissipation fin (5) is connected to the buffer assembly, the upper surface of the heat dissipation fin (5) is provided with a photoelectronic device body (10), the photoelectronic device body (10) is connected to the buffer assembly, and the interior of the base (2) is provided with a cooling assembly.

2. The dustproof and waterproof sealing cover for optoelectronic devices according to claim 1, characterized in that, The buffer assembly includes a reset spring (3), one end of which is disposed inside the sealing cover body (1), and the other end of which is provided with a clamping plate (4).

3. The dustproof and waterproof sealing cover for optoelectronic devices according to claim 2, characterized in that, The outer wall of the clamp (4) is set on the outer wall of the optoelectronic device body (10), the outer wall of the clamp (4) is set on the outer wall of the heat dissipation fin (5), and the lower surface of the clamp (4) is slidably connected to the upper surface of the base (2).

4. The dustproof and waterproof sealing cover for optoelectronic devices according to claim 1, characterized in that, The limiting component includes a locking block (8), the upper surface of which is fixedly connected to the lower surface of the sealing cover body (1), and the base (2) has a locking groove (9) inside.

5. The dustproof and waterproof sealing cover for optoelectronic devices according to claim 4, characterized in that, The outer wall of the first card block (8) is located inside the base (2), and the outer wall of the first card block (8) is located inside the card slot (9).

6. The dustproof and waterproof sealing cover for optoelectronic devices according to claim 1, characterized in that, The cooling assembly includes a heat dissipation pipe (6), the heat dissipation pipe (6) is fixedly connected inside the base (2), and a heat exchange box (7) is fixedly connected to the outer wall of the heat dissipation pipe (6). The heat exchange box (7) is made of aluminum alloy.

7. The dustproof and waterproof sealing cover for optoelectronic devices according to claim 1, characterized in that, A limiting block (11) is fixedly connected to the upper surface of the base (2). A second reset spring (12) is provided inside the limiting block (11). A second locking block (13) is provided on the outer wall of the second reset spring (12). The outer wall of the second locking block (13) is slidably connected to the inside of the limiting block (11). A third locking block (16) is fixedly connected to the outer wall of the second locking block (13). The outer wall of the third locking block (16) is located inside the limiting block (11). A second locking groove (14) is opened inside the heat dissipation fin (5). The outer wall of the second locking block (13) is located inside the heat dissipation fin (5) through the second locking groove (14).

8. The dustproof and waterproof sealing cover for optoelectronic devices according to claim 7, characterized in that, The limiting block (11) has a limiting groove 1 (15) inside, the limiting block (11) has a limiting groove 2 (17) inside, and the outer wall of the card block 3 (16) is set inside the limiting groove 1 (15).

9. The dustproof and waterproof sealing cover for optoelectronic devices according to claim 1, characterized in that, The sealing cover body (1) includes a protective layer (18), which is the outermost layer of the sealing cover body (1). A sealing layer (19) is fixedly connected to the outer wall of the protective layer (18), a heat-conducting layer (20) is fixedly connected to the outer wall of the sealing layer (19), and a buffer layer (21) is fixedly connected to the outer wall of the heat-conducting layer (20).

10. The dustproof and waterproof sealing cover for optoelectronic devices according to claim 9, characterized in that, The protective layer (18) is made of aluminum alloy, the sealing layer (19) is made of nitrile rubber, the thermal conductive layer (20) is made of silicone sheet, and the buffer layer (21) is made of sponge.

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