Novel phenolic amide based on cardanol as well as preparation method and application of novel phenolic amide

Abstract

The invention relates to the technical field of polymer synthesis and application, and particularly discloses novel phenolic amide based on cardanol as well as a preparation method and application of the novel phenolic amide. The preparation method of the novel phenolic amide based on cardanol comprises the following steps: cooling 15C cardanol at a low temperature, reacting through mixed gas of O3 and O2 to obtain 8C carboxyl phenol, reacting with a first amine component to obtain modified cardanol amide, mixing and stirring the modified cardanol amide and a second amine component, adding an aldehyde component, and reacting to obtain the novel phenolic amide based on cardanol. The novel phenolic amide based on cardanol can be used as an epoxy resin curing agent and has the characteristics of high amine value, low viscosity and quick drying, and a formed paint film has good appearance and excellent application performance.

Description

Technical Field

[0001] This application relates to the field of polymer synthesis and application technology, and more specifically, it relates to a novel phenolic amide based on cashew nut phenol, its preparation method and application. Background Technology

[0002] In the field of polymer synthesis and application, epoxy resins are widely used in coatings, adhesives and composite materials due to their excellent mechanical properties, electrical insulation properties and adhesive properties. As an indispensable component in the application of epoxy resins, the performance of the cured epoxy resin directly affects the performance of the epoxy resin in application.

[0003] Cashew nut shell phenol is a natural, renewable resource. Its molecular structure contains a benzene ring and a long carbon chain (usually 15 carbons), giving it excellent flexibility and corrosion resistance. It is widely used in the preparation of phenolic resin curing agents. The synthesis of traditional cashew nut shell phenol aldehyde amide curing agents is usually based on the amidation reaction of cashew nut shell phenol with amines. The 15-carbon chain at the meta position of cashew nut shell phenol gives the paint film excellent flexibility and mechanical properties, while the benzene ring structure endows the paint film with excellent corrosion resistance.

[0004] However, regarding the aforementioned technologies, the inventors have discovered that the compatibility between cashew phenol aldehyde amide curing agent and epoxy resin in the prior art is poor, and phase separation is prone to occur during mixing, resulting in cloudy paint film, rough surface, or reduced adhesion. For example, after the cashew phenol aldehyde amide curing agent is mixed with epoxy resin (such as E51) in the prior art, the resulting paint film often exhibits defects such as whitening and bubbles, which directly affects the appearance quality and protective performance of the paint film.

[0005] In addition, although traditional cashew phenol amide curing agents can cure at low temperatures, the curing time is long due to the amidation reaction, and the final product has a high viscosity. This greatly limits their application, especially in winter. Furthermore, the low amine value and insufficient active hydrogen content also lead to a long curing time, making it difficult to meet the requirements of modern industrial coatings for solvent-free, low-viscosity, and fast-drying coatings. Summary of the Invention

[0006] To improve the compatibility between phenolic amide curing agents and epoxy resins, and to enhance the film-forming properties and drying speed of phenolic amide curing agents, this application provides a novel phenolic amide based on cashew phenol, its preparation method, and its application.

[0007] In the first aspect, this application provides a novel phenolic amide based on cashew nut shell phenol, its preparation method, and its application, employing the following technical solution: A novel phenolic amide based on cashew nut phenol comprises modified cashew nut phenol amide, a second amine component, and an aldehyde component in a molar ratio of 1:(1-2):(1.5-2.5), and its structural formula is as follows: -HN-R-NH2 is the characteristic chain segment of the second amine component.

[0008] By adopting the above technical solution, the inventors oxidized the 15C chain of the cashew phenol side chain containing double bonds into a carboxyphenol with an 8C chain that does not contain double bonds through an oxidation reaction, introduced carboxyl groups, and then reacted with a second amine component and an aldehyde component in a specific molar ratio to finally obtain a novel phenolic amide with a completely new structure. The molecular polarity is greatly improved, and the novel phenolic amide has a higher amine value and lower viscosity. The side chain also contains a second amine component, which makes its active hydrogen more functional and its crosslinking density greater.

[0009] When mixed with epoxy resin as a curing agent, the novel phenolic amide exhibits significantly improved compatibility with epoxy resin, effectively reducing potential phase separation, resulting in faster curing speed and excellent film-forming performance. It also retains the excellent flexibility and mechanical properties brought by the long-chain structure and the excellent anti-corrosion properties brought by the benzene ring structure, leading to better paint film performance.

[0010] Optionally, the second amine component is selected from any one or more combinations of aliphatic amines, aromatic amines, or alicyclic amines.

[0011] Optionally, the second amine component is an aliphatic amine.

[0012] By adopting the above technical solution, after the modified cashew phenol undergoes an amidation reaction, it reacts with different second amine components. Aliphatic amines, aromatic amines, or alicyclic amines contain primary amine groups (-NH2), which can provide abundant active hydrogen functional groups, further optimizing the molecular structure of the novel phenolic amide, increasing the amine value and active hydrogen content of the novel phenolic amide, increasing the crosslinking density, effectively shortening the curing time when used as a curing agent, promoting the rapid drying of the paint film, and the multi-amine structure helps to promote the performance of the three-dimensional crosslinking network, further improving the hardness and mechanical strength of the cured paint film.

[0013] Secondly, this application provides a method for preparing a novel phenolic amide based on cashew nut shell phenol, using the following technical solution: A method for preparing a novel phenolic amide based on cashew nut shell extract includes the following steps: S1: 15C cashew phenol is cooled at -20 to -10℃, and a mixture of 5-10% O3 and O2 is introduced for reaction. After condensation and recovery, the temperature is raised and vacuum is drawn to remove small molecule acids and obtain 8C carboxyphenol. S2: Mix and stir the carboxyphenol with the first amine component, then condense and recover, heat up, and deacidify to obtain modified cashew phenolamide; S3: Mix the modified cashew phenol amide with the second amine component, add the aldehyde component, heat the reaction, condense and recover, vacuum, remove moisture and free amine, and obtain the final product.

[0014] By adopting the above technical solution, this application uses a mixture of O3 and O2 as a strong oxidant, which can effectively eliminate the double bond in the 15C cashew phenol structure to form 8C carboxyphenol at low temperature, prevent side reactions, and ensure the integrity of the carboxyphenol structure. Then, the molecular structure is further optimized through amide reaction and Mannich reaction, thereby fundamentally improving the compatibility problem between phenolic amide curing agent and epoxy resin.

[0015] By switching between condensation reflux and condensation recovery in oxidation, amidation, and Mannich reactions, residual small molecule acid substances and free amines are effectively removed, reducing the viscosity of the system. This allows the novel phenolic amide product to dry quickly when used as a curing agent, ensuring that the paint film has good appearance and application performance.

[0016] Optionally, the structural formula of the cashew phenol is as follows: Where n = 0, 1, 2 or 3.

[0017] Optionally, the structural formula of the carboxyphenol is as follows:

[0018] Optionally, the molar ratio of the carboxyphenol to the first amine component in step S2 is 1:(0.95-1.05).

[0019] Optionally, the first amine component is an aliphatic amine, selected from either diethylenetriamine or triethylenetetramine.

[0020] By adopting the above technical solution, the fatty amine contains multiple primary amine groups (-NH2), which provides a high active hydrogen density and can significantly improve the curing speed of the novel phenolic amide.

[0021] Optionally, the temperature range in step S1 is 80-120℃, the temperature range in step S2 is 140-200℃, and the temperature range in step S3 is 60-100℃.

[0022] By adopting the above technical solution, through temperature control during low-temperature oxidation followed by heating, high-temperature amidation, and the medium-temperature Mannich reaction, the generation of side reactions can be effectively suppressed, the condensation reaction accelerated, the crosslinking rate balanced, and the integrity and stability of the reaction product structure ensured.

[0023] Thirdly, this application provides an application of a novel phenolic amide based on cashew nut shell phenol, employing the following technical solution: A novel phenolic amide based on cashew phenol is applied to epoxy resin curing agents.

[0024] By adopting the above technical solution, when applied to epoxy resin curing agents, this application achieves significantly improved compatibility with epoxy resins compared to traditional phenolic amide curing agents. It exhibits high amine value and low viscosity, resulting in faster curing speed. This meets the requirements of modern industrialization for solvent-free, low-viscosity, and fast-drying coatings. The resulting paint film has a good appearance and excellent flexibility and mechanical properties.

[0025] In summary, this application has the following beneficial effects: 1. This application uses a mixture of O3 and O2 as a strong oxidant to oxidize and modify 15C cashew phenol at low temperature, removing the unsaturated double bonds in the molecular structure to obtain 8C carboxyphenol. The molecular structure is then further optimized to obtain a novel phenolic amide with higher amine content and low viscosity. The molecular polarity is greatly improved, which fundamentally enhances the compatibility between traditional phenolic amide curing agents and epoxy resins.

[0026] 2. In this application, aliphatic amines are preferably used as the second amine component and the first amine component contains multiple primary amine groups (-NH2), which can provide abundant active hydrogen functional groups, further optimize the molecular structure of the novel phenolic amide, improve the amine value and active hydrogen content of the novel phenolic amide, increase the crosslinking density, effectively shorten the curing time when used as a curing agent, promote the rapid drying of the paint film, and the side chain polyamine structure also helps to promote the formation of a three-dimensional crosslinking network, further improving the hardness and mechanical strength of the cured paint film.

[0027] 3. The novel phenolic amide based on cashew nut phenol prepared in this application has a faster curing speed when applied as an epoxy resin curing agent. It retains the excellent flexibility and mechanical properties of the paint film brought by the long chain structure of cashew nut phenol, and significantly improves the appearance and application performance of the paint film. Attached Figure Description

[0028] Figure 1 This is the infrared spectrum of the novel phenolic amide based on cashew phenol in Example 1 of this application. Detailed Implementation

[0029] The following embodiments provide a further detailed description of this application. Example

[0030] The structural formula of cashew phenol, the raw material in this application, is: Where n = 0, 1, 2 or 3, the following examples use the case of n = 1 as an example.

[0031] Example 1 A method for preparing a novel phenolic amide based on cashew phenol includes the following steps: S1: Add 300g of cashew phenol to a four-necked flask, stir well, reflux, and cool to -10℃ in an ice-salt bath. Slowly introduce a 10% O3 and O2 mixed gas and react for 2 hours. The reaction endpoint is reached when no cashew phenol component is detected by HPLC. Stop introducing the mixed gas, change the reflux to condensation recovery, raise the temperature to 120℃, and remove small molecule acids under vacuum at 1000Pa for 3 hours. The acid value is ≤250, yielding 8C carboxyphenol. The reaction equation is as follows: S2: Change the condensation recovery to condensation reflux, cool down to below 100℃, add the carboxyphenol obtained in step S1 and diethylenetriamine in a molar ratio of 1:1.05 to a four-necked flask, stir evenly, and after the exothermic reaction temperature stabilizes, change the condensation reflux to condensation recovery, raise the temperature to 160℃, maintain the temperature for 2 hours, continue to raise the temperature to 180℃, maintain the temperature for 3 hours, and take a sample to test the acid value ≤2, to obtain modified cashew phenolamide. The reaction equation is as follows: H2N-R1-NH2 is diethylenetriamine; S3: The condensation recovery was changed to condensation reflux. The temperature was lowered to 50℃, and the modified cashew phenol amide and ethylenediamine were added to a four-necked flask and stirred evenly. Paraformaldehyde was added in three portions, with a molar ratio of modified cashew phenol amide, ethylenediamine and paraformaldehyde of 1:1.5:2.5. After the exothermic reaction temperature stabilized, the temperature was raised to 80℃ and refluxed for 6 hours. The condensation reflux was changed to condensation recovery, and a vacuum of 3000 Pa was applied for 2 hours to remove the amine-containing water until the material was clear and transparent. The temperature was then lowered to 50℃ and the material was discharged to obtain a novel phenolic amide based on cashew phenol. The reaction equation is as follows: H2N-R-NH2 is ethylenediamine.

[0032] Example 2 A method for preparing a novel phenolic amide based on cashew phenol includes the following steps: S1: Add 300g of cashew phenol to a four-necked flask, stir well, reflux, and cool to -20℃ in an ice-salt bath. Slowly introduce a mixture of 8% O3 and O2 gas and react for 1 hour. The reaction endpoint is reached when no cashew phenol component is detected by HPLC. Stop introducing the mixed gas, change the reflux to condensation recovery, raise the temperature to 100℃, and remove small molecule acids under vacuum at 1000Pa for 3 hours. The acid value is ≤250 when tested, yielding 8C carboxyphenol. The reaction equation is as follows: S2: Change the condensation recovery to condensation reflux, cool down to below 100℃, add the carboxyphenol obtained in step S1 and diethylenetriamine in a molar ratio of 1:0.95 to a four-necked flask, stir evenly, and after the exothermic reaction temperature stabilizes, change the condensation reflux to condensation recovery, raise the temperature to 140℃, maintain the temperature for 2 hours, continue to raise the temperature to 160℃, maintain the temperature for 4 hours, and take a sample to test the acid value ≤2, to obtain modified cashew phenolamide. The reaction equation is as follows: H2N-R1-NH2 is diethylenetriamine; S3: The condensation recovery was changed to condensation reflux. The temperature was lowered to 50℃, and the modified cashew phenol amide and ethylenediamine were added to a four-necked flask and stirred evenly. Paraformaldehyde was added in three portions, with a molar ratio of modified cashew phenol amide, ethylenediamine and paraformaldehyde of 1:1:2. After the exothermic reaction temperature stabilized, the temperature was raised to 90℃ and refluxed for 8 hours. The condensation reflux was changed to condensation recovery, and a vacuum of 3000 Pa was applied for 2 hours to remove the amine-containing water until the material was clear and transparent. The temperature was lowered to 50℃ and the material was discharged to obtain a novel phenolic amide based on cashew phenol. The reaction equation is as follows: H2N-R-NH2 is ethylenediamine.

[0033] Example 3 A method for preparing a novel phenolic amide based on cashew phenol includes the following steps: S1: Add 300g of cashew phenol to a four-necked flask, stir well, reflux, and cool to -15℃ in an ice-salt bath. Slowly introduce a 5% O3 and O2 mixed gas and react for 2 hours. The reaction endpoint is reached when no cashew phenol component is detected by HPLC. Stop introducing the mixed gas, change the reflux to condensation recovery, raise the temperature to 80℃, and remove small molecule acids under vacuum at 1000Pa for 3 hours. The acid value is ≤250, yielding 8C carboxyphenol. The reaction equation is as follows: S2: Change the condensation recovery to condensation reflux, cool to below 100℃, add the carboxyphenol obtained in step S1 and diethylenetriamine in a molar ratio of 1:1 to a four-necked flask, stir evenly, and after the exothermic reaction temperature stabilizes, change the condensation reflux to condensation recovery, raise the temperature to 160℃, maintain the temperature for 2 hours, continue to raise the temperature to 200℃, maintain the temperature for 2 hours, and take a sample to test the acid value ≤2, to obtain modified cashew phenolamide. The reaction equation is as follows: H2N-R1-NH2 is diethylenetriamine; S3: The condensation recovery was changed to condensation reflux. The temperature was lowered to 50℃, and the modified cashew phenol amide and ethylenediamine were added to a four-necked flask and stirred evenly. Paraformaldehyde was added in three portions, with a molar ratio of modified cashew phenol amide, ethylenediamine and paraformaldehyde of 1:2:1.5. After the exothermic reaction temperature stabilized, the temperature was raised to 100℃ and refluxed for 4 hours. The condensation reflux was changed to condensation recovery, and a vacuum of 3000 Pa was applied for 2 hours to remove the amine-containing water until the material was clear and transparent. The temperature was then lowered to 50℃ to discharge the material, yielding a novel phenolic amide based on cashew phenol. The reaction equation is as follows: H2N-R-NH2 is ethylenediamine.

[0034] Example 4 A method for preparing a novel phenolic amide based on cashew nut shell phenol is disclosed, differing from Example 1 in that the H2N-R1-NH2 used in the amidation reaction in step S2 is triethylenetetramine. All other steps are the same as in Example 1. The structural formula of the obtained novel phenolic amide based on cashew nut shell phenol is as follows:

[0035] Example 5 A method for preparing a novel phenolic amide based on cashew nut shell phenol is disclosed, differing from Example 1 in that the H2N-R-NH2 used in the amidation reaction in step S2 is methylcyclohexanediamine. All other steps are the same as in Example 1. The structural formula of the obtained novel phenolic amide based on cashew nut shell phenol is as follows:

[0036] Example 6 A method for preparing a novel phenolic amide based on cashew nut shell phenol is disclosed, differing from Example 1 in that the H2N-R-NH2 used in the amidation reaction in step S2 is m-phenylenediamine. All other steps are the same as in Example 1. The structural formula of the obtained novel phenolic amide based on cashew nut shell phenol is as follows:

[0037] Performance testing Test Example 1: Product Performance Testing LITE 3000 served as the control group (Comparative Example 1), while the novel phenolic amides based on cashew nut shell phenol obtained in Examples 1-6 were used as the experimental group. The following performance tests were conducted, and the theoretical value of the active hydrogen equivalent (AHEW) was calculated (the active hydrogen equivalent of the curing agent, H). eq =M / n, where M is the molecular weight of the curing agent and n is the total number of active hydrogens in the curing agent molecule. Each test is performed 3 times, and the average data value of the 3 test results is taken as the final result and the final result is recorded in Table 1.

[0038] 1. Visually inspect the appearance, color, and condition of the products in the experimental and control groups. 2. Color: Tested according to the methods and specifications of ASTM D1544; 3. Non-volatile matter content (wt%): Tested according to the methods and specifications of ASTM D2369-98; 4. Viscosity (mPa·s / 25℃): Tested according to the methods and specifications of ASTM D2196; 5. Amine value (mg KOH / g): Amine value was tested according to the methods and specifications of ASTM D2074.

[0039] Table 1 As can be seen from the performance test results in Table 1, the novel phenolic amide obtained by low-temperature oxidation modification based on cashew nut shell phenol and using a mixture of O3 and O2 as a strong oxidant has a viscosity of 500-1800 mPa·s. Compared with traditional phenolic amide curing agents, the viscosity is significantly reduced, and it has a higher solid content and amine value. This indicates that the molecular polarity of the novel phenolic amide based on cashew nut shell phenol in this application has been greatly improved, which can fundamentally improve the compatibility between traditional phenolic amide curing agents and epoxy resins, and is also more environmentally friendly. This also indicates that the novel phenolic amide based on cashew nut shell phenol in this application has a faster curing speed and better film-forming performance when used as a curing agent.

[0040] The performance test results of Examples 1-4 and Examples 5-6 show that the novel phenolic amide obtained by the Mannich reaction using aliphatic amines as raw materials also contains aliphatic amines in its side chain, and the product has a lower viscosity. This is because aliphatic amines have a linear or less branched molecular structure, contain multiple primary amine groups (-NH2), and have weaker intermolecular interaction forces compared to aromatic amines and alicyclic amines. The restriction effect on molecular chain movement is smaller, and the active hydrogen content is higher, which significantly reduces the viscosity of the system and makes it more reactive.

[0041] Test Example 2: Application Performance Testing. The novel phenolic amide based on cashew phenol obtained in Examples 1-6 was used as the epoxy resin curing agent in the experimental group. LITE 3000 was used as Comparative Example 1, with the epoxy resin curing agent serving as the control group. Epoxy resin E51 (epoxy equivalent of 190) was mixed with the tested epoxy resin curing agent in both the experimental and control groups at a ratio of epoxy equivalent / active hydrogen equivalent (AHEW) of 1:1 to prepare mixed coatings. The curing properties were then tested, and the results are recorded in Table 2, including the following test items: 1. Observe the compatibility of mixing with epoxy resin E51 during the mixing process, and the appearance of the paint film formed at 5℃ and 25℃; 2. Test the film drying / complete drying time at 5°C and 25°C according to the methods and specifications of ASTM D5895, in hours; 3. Test the gel time of 120g of mixed coating at 25°C according to the relevant specifications and methods of ASTM D2471; 4. Mechanical properties of the paint film after 7 days of natural drying (tinplate, film thickness 20μm): (1) Resistance to positive and negative impacts: Tested according to the relevant methods specified in GB / T 1732-2020; (2) Hardness: Tested in accordance with the relevant provisions and methods of GB / T 6739-2006; (3) Cross-cut adhesion: Refer to the relevant provisions and methods of ISO 2409, evaluate the paint film peeling according to the standard, and classify it into grades from 0B (no paint film peeling) to 5B (complete peeling); (4) Bending resistance: Tested according to the relevant provisions and methods of ASTM D522.

[0042] Table 2 As can be seen from the performance test results in Table 2, the novel phenolic amide based on cashew nut shell phenol, when used as an epoxy resin curing agent, remains transparent and does not become cloudy during the mixing process with the epoxy resin. The resulting paint film maintains good appearance at different temperatures. Compared with traditional phenolic amide curing agents, the novel phenolic amide curing agent based on cashew nut shell phenol has a hardening drying time of ≤1.5h and a complete drying time of ≤4h at 25℃, reaching a gel state within 50min. At 5℃, the hardening drying time is ≤5h and the complete drying time is ≤7h. The curing speed is significantly improved compared with traditional phenolic amide curing agents, achieving the requirement of rapid drying. Furthermore, the paint film formed by the novel phenolic amide based on cashew nut shell phenol as an epoxy resin curing agent has excellent flexibility and mechanical properties, indicating that the modification method of this application retains the excellent flexibility and mechanical properties brought by the long chain of cashew nut shell phenol.

[0043] Based on the performance test results of Examples 1-4 and Examples 5-6, it can be seen that, compared with the novel phenolic amides obtained by using aromatic amines and alicyclic amines as Mannich reaction raw materials in Examples 5-6, the curing speed of the novel phenolic amides obtained by using aliphatic amines as Mannich reaction raw materials in Examples 5-6, was significantly improved when used as epoxy resin curing agents. However, the film-forming performance of Examples 5-6 was significantly worse than that of Examples 1-4, and the curing speed was reduced. This is because, when aliphatic amines are used as side chains of novel phenolic amides, compared with aromatic amines and alicyclic amines, they have a higher active hydrogen content and better linear molecular structure flexibility, which significantly improves the crosslinking rate and density between the curing agent and the epoxy resin. The paint film cures rapidly to form a dense three-dimensional crosslinked network, resulting in better appearance and various mechanical properties of the paint film.

[0044] Test Example 3: Infrared Spectrum Test Figure 1 The infrared spectrum of Embodiment 1 of this application is based on Figure 1 As shown, 1640-1680cm -1 The absence of stretching vibration absorption peaks of C=C double bonds at the point confirms that the double bonds have been reacted away. 1700-1750cm -1 The absence of a characteristic absorption peak with a carboxyl group confirms that the carboxyl bond has been reacted away. 1630cm -1 It has a C=O stretching vibration peak and a 3300 cm⁻¹ peak. -1 The CH stretching vibration peak confirmed the formation of amide bonds.

[0045] This specific embodiment is merely an explanation of this application and is not intended to limit it. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but such modifications are protected by patent law as long as they fall within the scope of the claims of this application.

Claims

1. A novel phenolic amide based on cashew phenol, characterized in that, The raw materials include modified cashew phenolamide, a second amine component, and an aldehyde component in a molar ratio of 1:(1-2):(1.5-2.5), and their structural formulas are as follows: -HN-R-NH2 is the characteristic chain segment of the second amine component.

2. The novel phenolic amide based on cashew phenol according to claim 1, characterized in that, The second amine component is selected from any one or more combinations of aliphatic amines, aromatic amines, or alicyclic amines.

3. The method for preparing the novel phenolic amide based on cashew phenol as described in claim 1 or 2, characterized in that, Includes the following steps: S1: 15C cashew phenol is cooled at -20 to -10℃, and a mixture of 5-10% O3 and O2 is introduced for reaction. After condensation and recovery, the temperature is raised and vacuum is drawn to remove small molecule acids and obtain 8C carboxyphenol. S2: Mix and stir the carboxyphenol with the first amine component, then condense and recover, heat up, and deacidify to obtain modified cashew phenolamide; S3: Mix the modified cashew phenol amide with the second amine component, add the aldehyde component, heat the reaction, condense and recover, vacuum, remove moisture and free amine, and obtain the final product.

4. The method for preparing the novel phenolic amide based on cashew phenol according to claim 3, characterized in that, The structural formula of cashew phenol is as follows: Where n = 0, 1, 2 or 3.

5. The method for preparing the novel phenolic amide based on cashew phenol according to claim 3, characterized in that, The structural formula of the carboxyphenol is as follows:

6. The method for preparing the novel phenolic amide based on cashew phenol according to claim 3, characterized in that, The molar ratio of the carboxyphenol to the first amine component in step S2 is 1:(0.95-1.05).

7. The method for preparing the novel phenolic amide based on cashew phenol according to claim 3, characterized in that, The first amine component is an aliphatic amine, selected from either diethylenetriamine or triethylenetetramine.

8. The method for preparing the novel phenolic amide based on cashew phenol according to claim 3, characterized in that, The temperature range in step S1 is 80-120℃, the temperature range in step S2 is 140-200℃, and the temperature range in step S3 is 60-100℃.

9. The novel phenolic amide based on cashew phenol as described in claim 1 or 2 is applied to an epoxy resin curing agent.

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