Wiring busbar of cluster type user line

Abstract

The invention relates to the field of wiring busbars, in particular to a wiring busbar of a cluster type user line, which comprises a busbar body, a wiring terminal module and a heat dissipation shell, and is characterized in that a manufacturing method comprises the following steps: S1, preparing a copper-aluminum composite busbar base material by adopting a rolling composite method, and carrying out synchronous hot pressing bonding on multiple layers to form a layered structure; s2, conducting channels are etched on the surface of the busbar base material through laser, and multiple branch wiring areas are formed; s3, under the protection of inert gas, fixing the sectional wiring terminal module in the wiring area through high-energy beam welding; s4, performing surface treatment on the surface of the busbar to improve the protection property of the busbar; s5, adding a heat dissipation structure between the busbar body and the heat dissipation shell; s6, processing the wiring terminal module, and integrating a monitoring module in the wiring terminal module; and S7, jointing the heat dissipation shell with the sealing insulating cover, and performing waterproof treatment on the busbar. According to the invention, the wiring busbar is enabled to adapt to a vibration environment, and the problem of thermal expansion of a local area of the wiring busbar is solved.

Description

Technical Field

[0001] This application relates to the field of busbars, and more particularly to a bundled busbar for service outlets. Background Technology

[0002] The bundled service busbar is a key conductive device in low-voltage power distribution systems used to centrally connect multiple service conductors. Its core design lies in achieving physical bundling and power distribution of multiple conductors through a modular busbar structure. Typical existing solutions usually include a busbar body made of copper or aluminum alloy, plated with tin or silver, with segmented terminals, each segment corresponding to one service conductor, and the conductors secured by bolts or spring clamps. For safety, the busbar is externally insulated with flame-retardant PVC or heat-shrink tubing, and insulating partitions are installed at the segmentation points to prevent short circuits. Mechanical fixation and auxiliary heat dissipation are achieved using metal or engineering plastic supports. This structure aims to improve space utilization, reduce wiring clutter, and utilize its modular design to flexibly expand the number of terminals and the length of the busbar to adapt to branch needs of different sizes.

[0003] While existing bundled busbar technology offers advantages such as high space utilization, relatively convenient installation, and controllable costs in small-capacity, stable load scenarios, it also has significant drawbacks: the centralized connection of multiple conductors leads to pronounced localized temperature rise in the busbar area, which can accelerate the aging of insulation materials during long-term high-load operation. Existing heat dissipation designs largely rely on natural convection, lacking effective active cooling measures, thus limiting current carrying capacity. Furthermore, the contact reliability of the terminals is highly dependent on manual installation accuracy; bolted connections are prone to loosening due to uneven tightening torque or vibration during use, leading to increased contact resistance. In addition, existing solutions have limited compatibility with conductor cross-sectional area and materials, making them unsuitable for special environments such as high current or high vibration. Summary of the Invention

[0004] In order to adapt the busbar to the vibration environment and solve the problem of thermal expansion in local areas of the busbar, this application provides a bundled busbar for the service drop line.

[0005] This application provides a bundled service drop busbar, which adopts the following technical solution:

[0006] A bundled service drop busbar includes a busbar body, a terminal block module, and a heat dissipation housing. The manufacturing method of the busbar includes the following steps:

[0007] S1. A copper-aluminum composite busbar substrate is prepared by a rolling composite method, including simultaneously hot-pressing and bonding a copper layer, an aluminum layer and an interface diffusion barrier layer to form a layered structure;

[0008] S2. Conductive channels are laser-etched on the surface of the busbar substrate to form a multi-branch wiring area;

[0009] S3. The segmented terminal block module is fixed to the wiring area by high-energy beam welding, and the welding process is carried out under inert gas protection;

[0010] S4. Perform surface treatment on the busbar surface to improve the busbar protection level;

[0011] S5. Add a heat dissipation structure between the busbar body and the heat dissipation shell;

[0012] S6. Process the terminal block module and integrate the monitoring module within the terminal block module;

[0013] S7. Connect the heat dissipation housing to the sealed insulation cover to waterproof the busbar.

[0014] By adopting the above technical solutions, electrochemical corrosion is fundamentally suppressed through the rolling bonding of copper-aluminum composite substrates, achieving lightweighting and cost optimization; laser etching of conductive channels precisely plans the current path, improving the space utilization of bundled wires, supporting multi-circuit parallel wiring and meeting installation efficiency requirements; high-energy beam welding under inert gas protection ensures the metallurgical bond between the terminal module and the busbar, eliminating contact resistance fluctuations caused by bolt connections, while improving vibration fatigue strength; surface protection treatment uses epoxy coating and heat shrink tubing for double encapsulation, effectively resisting outdoor humidity and salt spray corrosion; the heat dissipation structure, through the synergistic effect of the thermally conductive medium layer and fin array, controls the temperature rise under high current conditions, significantly delaying insulation aging; the integrated monitoring module enables real-time diagnosis of temperature and contact resistance, providing early warning of overheating risks and reducing fault diagnosis time; the waterproof sealing process utilizes the dynamic sealing mechanism of elastic sealing rings and breathable membranes to maintain sealing integrity under thermal stress deformation conditions.

[0015] Preferably, in step S1:

[0016] The interface diffusion barrier layer is made of nickel-based alloy foil with a thickness of 20-50 μm. During hot-press bonding, the temperature is controlled at 370℃-390℃ and the pressure is ≥15MPa. After bonding, the composite interface is subjected to in-situ solid solution treatment.

[0017] By adopting the above technical solution, using 20-50μm nickel-based alloy foil as an interfacial diffusion barrier layer, the electrochemical corrosion channel between copper and aluminum metals is blocked, reducing the corrosion rate at the contact surface; the hot-pressing bonding temperature is controlled to be lower than the melting point of aluminum but higher than the recrystallization temperature, so that the copper / aluminum / nickel three-layer material can achieve atomic diffusion bonding in the solid state, avoiding the formation of brittle interfacial phases caused by melting; applying a pressure of ≥15MPa ensures the elimination of microscopic voids at the interface; and in-situ solid solution treatment after bonding eliminates the risk of thermal stress deformation while improving the interfacial bonding strength.

[0018] Preferably, step S3 includes:

[0019] A spring-loaded clamping mechanism and an adaptive conductive pad are pre-installed in the wire clamping cavity of the terminal block module, and the mounting base of the module is fused to the surface of the busbar substrate by laser deep penetration welding.

[0020] By adopting the above technical solution, a spring pressing mechanism is pre-installed in the conductor clamping cavity. The constant pressure of the spring continuously compensates for the gap caused by conductor creep and vibration, eliminating the risk of overheating caused by loosening. The arc-shaped contact surface of the adaptive conductive pad automatically deforms and fits with the cross-sectional area of ​​the conductor, increasing the effective conductive area. Under the protection of inert gas, a metallurgical bonding layer with a depth of ≥0.8mm is formed, upgrading the current carrying capacity and supporting the long-term operation requirements of a high-reliability power distribution system.

[0021] Preferably, step S4 includes:

[0022] An epoxy insulating coating with a thickness of 0.2-0.5 mm is formed on the outer surface of the busbar body using an electrostatic spraying process, and then cured at 150℃ for 30 minutes after spraying.

[0023] A flame-retardant heat-shrink tubing is wrapped around the epoxy coating, and the tubing is tightly bonded to the coating through a hot air shrinking process.

[0024] By adopting the above technical solution, an epoxy insulating coating of 0.2-0.5mm is formed by electrostatic spraying. After curing at 150℃, a dense protective layer without pinholes is formed, blocking the electrochemical corrosion path on the busbar surface. The flame-retardant heat-shrink tubing is tightly bonded to the epoxy coating by hot air shrinkage, forming a double-layer protection system: the inner epoxy coating fills electrode burrs and micro-depressions, while the outer tubing provides mechanical impact protection and a flame-retardant barrier, improving the protection level. This combined design simultaneously solves the risks of insulation failure, moisture corrosion and fire.

[0025] Preferably, step S5 includes:

[0026] A thermally conductive silicone grease is filled between the busbar body and the heat dissipation shell to form a thermally conductive medium layer;

[0027] The outer surface of the heat dissipation shell is integrally formed with multiple heat dissipation fins by extrusion casting, and the height-to-spacing ratio of the heat dissipation fins is 1:1.5-1:2.

[0028] By adopting the above technical solution, a dielectric layer is formed by filling the space between the busbar body and the heat dissipation shell with thermally conductive silicone grease, which completely eliminates the micro air gap at the metal interface, so that the hot spot temperature of the busbar can be transferred to the heat dissipation shell with an efficiency of ≥90%; and an integrated heat dissipation fin array is formed by extrusion casting, which induces the formation of a laminar-turbulent mixed boundary layer under natural convection conditions.

[0029] Preferably, it also includes an anti-vibration bracket, wherein the anti-vibration bracket is fixed to the bottom of the heat dissipation housing by locking bolts;

[0030] Shock-absorbing pads are embedded in the contact surfaces of the anti-vibration bracket and the heat dissipation housing;

[0031] Staggered ventilation holes are provided on the side wall of the vibration-damping support.

[0032] By adopting the above technical solution, the vibration-resistant bracket is rigidly fixed to the bottom of the heat dissipation shell by locking bolts, thus constructing a stable mechanical load-bearing frame and improving the overall anti-overturning moment of the busbar. Silicone rubber damping pads are embedded in the contact surface between the bracket and the shell, and their high damping characteristics are used to absorb vibration energy, solving the problem of vibration fatigue failure of bolted connections. Staggered heat dissipation and ventilation holes are opened on the side wall of the bracket, which induces the formation of turbulent vortices in the air, improving the heat exchange efficiency compared with a straight hole array, while the staggered layout prevents dust from entering.

[0033] Preferably, step S6 includes:

[0034] A temperature sensing unit is embedded inside the terminal block module;

[0035] The temperature sensing unit is connected to the wireless communication module via a shielded data cable, and a sealed wire hole is made on the outer wall of the heat sink housing for the data cable to pass through.

[0036] By adopting the above technical solution, a temperature sensing unit is embedded inside the terminal module, allowing the sensor to be directly thermally coupled to the conductive interface, thus shortening the temperature rise response time. A shielded data cable is used to connect to the wireless communication module, with its twisted-pair structure covered by an aluminum-magnesium alloy braided layer to suppress electromagnetic interference in the distribution cabinet. The hole is filled with a fluororubber sealing ring and covered with an ePTFE waterproof and breathable membrane, which balances the air pressure while maintaining the protection level and prevents thermal expansion from causing cable compression damage.

[0037] Preferably, the wireless communication module is configured with impedance analysis firmware to calculate the contact resistance change rate in real time, and trigger an alarm signal when the contact resistance change rate is ≥10%.

[0038] By adopting the above technical solution, and configuring impedance analysis firmware for the wireless communication module, the contact resistance change rate is calculated in real time. By utilizing the inherent correlation between resistance change and contact state, accurate early warning can be achieved before physical faults occur. An alarm threshold of ≥10% contact resistance change rate is set to provide early warning of temperature threshold. When the alarm signal is triggered, the fault node location information is uploaded simultaneously, enabling maintenance personnel to take targeted measures.

[0039] Preferably, step S7 includes:

[0040] A ring-shaped sealing groove is machined at the junction of the heat dissipation housing and the sealing insulation cover;

[0041] An elastic sealing ring is injection molded in the sealing groove, and the injection molding material is fluororubber.

[0042] An ePTFE waterproof and breathable membrane is laminated onto the outer surface of the sealed insulating cover.

[0043] By adopting the above technical solution, and by processing an annular sealing groove at the joint to reserve compensation space for thermal expansion deformation, the composite ePTFE waterproof and breathable membrane achieves a gas phase water molecule permeability of ≥5000g / m² through its microporous structure. 2 • The liquid water barrier pressure is ≥50kPa for 24 hours, which simultaneously solves the problems of condensation accumulation and pressure imbalance.

[0044] A method for manufacturing a busbar expansion interface includes the following steps:

[0045] A flexible expansion interface is formed by stacking multiple layers of annealed copper sheets, and diffusion annealing is performed in a vacuum environment after stacking.

[0046] The standard connector is fixed to the interface end by laser welding, and the joint area is then subjected to X-ray inspection after welding.

[0047] The annealing temperature is 440℃-460℃.

[0048] By adopting the above technical solution, a flexible expansion interface is formed by stacking multiple layers of annealed copper sheets and performing diffusion annealing in a vacuum environment at 440-460℃. This eliminates cold working stress and increases the interlayer bonding strength to over 300MPa, thereby improving the interface's cold bending fatigue life. When laser welding standard connectors, heat input is precisely controlled to reduce connection resistance. Post-weld X-ray flaw detection enables micron-level detection of porosity / cracks, avoiding the risk of overheating due to welding defects.

[0049] In summary, this application includes at least one of the following beneficial technical effects:

[0050] 1. Electrochemical corrosion is fundamentally suppressed through rolling bonding of copper-aluminum composite substrates, achieving lightweighting and cost optimization; laser etching of conductive channels precisely plans current paths, improving the space utilization of bundled wires by up to 50%, supporting multi-circuit parallel wiring and meeting installation efficiency requirements; high-energy beam welding under inert gas protection ensures the metallurgical bond between the terminal module and the busbar, eliminating contact resistance fluctuations caused by bolt connections, while improving vibration fatigue strength; surface protection treatment uses epoxy coating and heat shrink tubing for double encapsulation, effectively resisting outdoor humidity and salt spray corrosion; the heat dissipation structure, through the synergistic effect of the thermally conductive medium layer and fin array, controls the temperature rise under high current conditions, significantly delaying insulation aging; the integrated monitoring module enables real-time diagnosis of temperature and contact resistance, providing early warning of overheating risks and reducing fault diagnosis time; the waterproof sealing process utilizes the dynamic sealing mechanism of elastic sealing rings and breathable membranes to maintain sealing integrity under thermal stress deformation conditions.

[0051] 2. By using multi-layer annealed copper sheets to form a flexible expansion interface, diffusion annealing is performed in a vacuum environment at 440-460℃ to eliminate cold working stress and increase the interlayer bonding strength to over 300MPa, thereby improving the interface's cold bending fatigue life; precise control of heat input is achieved when laser welding standard connectors to reduce connection resistance; post-weld X-ray flaw detection enables micron-level detection of porosity / cracks, avoiding the risk of overheating due to welding defects. Attached Figure Description

[0052] Figure 1 This is a flowchart illustrating the manufacturing method of the wiring busbar body in this application embodiment;

[0053] Figure 2 This is a flowchart of the manufacturing method of the busbar expansion interface in the embodiments of this application. Detailed Implementation

[0054] The following is in conjunction with the appendix Figure 1-2 This application will be described in further detail.

[0055] This application discloses a bundled service drop busbar. (Refer to...) Figure 1 and Figure 2 The bundled service drop busbar includes a busbar body, a terminal block module, and a heat dissipation housing. The busbar body and the terminal block module are connected by a connecting conductor. In an optional embodiment, the connecting conductor can be a copper busbar or a wire. The heat dissipation housing is disposed outside the busbar body and the terminal block module, protecting them. The manufacturing method of the busbar body specifically includes the following steps:

[0056] S1. A copper-aluminum composite busbar substrate is prepared by a rolling composite method, including simultaneously hot-pressing and bonding a copper layer, an aluminum layer, and an interface diffusion barrier layer to form a layered structure.

[0057] The interface diffusion barrier layer is composed of a nickel-based alloy foil with a thickness of 20-50 μm. During hot-press bonding, the temperature is controlled at 370℃-390℃, and the pressure needs to be ≥15 MPa. In a preferred embodiment, the composite interface is subjected to in-situ solution treatment after hot-press bonding. The interface diffusion barrier layer can block the migration of copper and aluminum ions, reduce the corrosion rate of the contact surface, and fundamentally inhibit electrochemical corrosion through the rolling bonding of the copper-aluminum composite substrate.

[0058] By employing a 20-50μm nickel-based alloy foil as an interfacial diffusion barrier layer, the electrode potential of nickel, falling between that of copper and aluminum, can suppress the galvanic cell effect, thereby effectively blocking the electrochemical corrosion channel between the copper and aluminum metals. The hot-press bonding temperature is controlled at 370℃-390℃, ensuring that the bonding temperature is below the melting point of aluminum but above the recrystallization temperature while maintaining effectiveness. This allows the copper / aluminum / nickel three-layer material to achieve atomic diffusion bonding in the solid state, avoiding the formation of brittle interfacial phases caused by melting. In an optional embodiment, a pressure of ≥15MPa is applied to the composite busbar substrate to completely eliminate interfacial micropores and reduce contact resistance. In-situ solution treatment is performed after bonding. In an optional embodiment, the substrate can be directly cooled to 150℃ and held for 1 hour within the hot-pressing equipment to eliminate the risk of thermal stress deformation and improve interfacial bonding strength.

[0059] S2. Conductive channels are laser-etched on the surface of the busbar substrate to form a multi-branch wiring area.

[0060] Among them, laser etching of conductive channels precisely plans the current path, improves the space utilization of bundled wires, enables the circuit to meet parallel wiring requirements, and improves installation efficiency.

[0061] S3. The segmented terminal block module is fixed to the wiring area by high-energy beam welding, and the welding process is carried out under inert gas protection.

[0062] Specifically, this includes: pre-installing a spring pressing mechanism and an adaptive conductive pad in the wire clamping cavity of the terminal block module, and cladding the module's mounting base onto the surface of the busbar substrate using laser deep penetration welding.

[0063] High-energy beam welding under inert gas protection ensures a metallurgical bond between the terminal block module and the busbar, eliminating contact resistance fluctuations caused by bolted connections and improving vibration fatigue resistance. A pre-installed spring-pressing mechanism within the wire clamping cavity continuously compensates for gaps caused by wire creep and vibration using constant spring pressure, controlling the fluctuation rate of contact resistance and eliminating the risk of overheating due to loosening. Laser deep penetration welding fuses the module base to the busbar substrate, forming a deep metallurgical bonding layer with a depth greater than or equal to 0.8 mm under inert gas protection.

[0064] S4. Perform surface treatment on the busbar surface to improve the busbar protection level.

[0065] The specific steps include: using electrostatic spraying to form an epoxy insulating coating with a thickness of 0.2-0.5mm on the outer surface of the busbar body, and then curing it at 150℃ for 30 minutes after spraying;

[0066] A flame-retardant heat-shrink tubing is wrapped around the epoxy coating, and the tubing is tightly bonded to the coating through a hot air shrinking process.

[0067] An epoxy insulation coating of 0.2-0.5mm is formed by electrostatic spraying. After curing at 150℃, a dense, pinhole-free protective layer is formed, blocking the electrochemical corrosion path on the busbar surface. The flame-retardant heat-shrink tubing is shrunk by hot air and tightly bonded to the epoxy coating to form a double-layer protection system: the inner epoxy coating fills electrode burrs and micro-depressions, while the outer tubing provides mechanical impact protection (impact resistance up to 20J / m) and a flame-retardant barrier, improving the protection level and simultaneously solving the risks of insulation failure, moisture corrosion and fire.

[0068] S5. Add a heat dissipation structure between the busbar body and the heat dissipation shell.

[0069] Specifically, this includes filling the space between the busbar body and the heat dissipation shell with thermally conductive silicone grease to form a thermally conductive medium layer;

[0070] The outer surface of the heat dissipation shell is integrally formed with multiple heat dissipation fins by extrusion casting, and the height-to-spacing ratio of the heat dissipation fins is 1:1.5-1:2.

[0071] By filling the space between the busbar body and the heat dissipation shell with thermally conductive silicone grease to form a dielectric layer, the microscopic air gaps at the metal interface are eliminated, enabling rapid heat dissipation. The heat dissipation fin array is integrally formed by extrusion casting, with a height-to-spacing ratio of 1:1.5-1:2. Under natural convection conditions, it induces air to form a laminar flow to a turbulent mixing boundary layer, thereby improving heat dissipation efficiency.

[0072] In an optional embodiment, a vibration-damping bracket is further included, which is fixed to the bottom of the heat dissipation housing by locking bolts;

[0073] Shock-absorbing pads are embedded at the contact surfaces of the vibration-damping bracket and the heat sink housing;

[0074] Staggered ventilation holes are made on the side wall of the vibration-damping support.

[0075] The vibration-damping bracket is rigidly fixed to the bottom of the heat dissipation shell by locking bolts, constructing a stable mechanical load-bearing frame and improving the overall overturning moment resistance of the busbar. Optionally, silicone rubber damping pads are embedded in the contact surface between the bracket and the shell to solve the problem of vibration fatigue failure of bolted connections. The side walls of the bracket have staggered heat dissipation and ventilation holes, which induce air turbulence vortices to improve heat exchange efficiency. At the same time, the staggered layout blocks most of the dust intrusion, achieving the three functions of vibration suppression, enhanced heat dissipation, and dust prevention.

[0076] S6. Process the terminal block module and integrate the monitoring module within the terminal block module.

[0077] Specifically, the steps include: embedding a temperature sensing unit inside the terminal block module;

[0078] The temperature sensing unit is connected to the wireless communication module via a shielded data cable, and a sealed wire hole is made on the outer wall of the heat sink housing for the data cable to pass through.

[0079] By embedding a temperature sensing unit inside the terminal block module, the sensor is directly thermally coupled to the conductive interface, shortening the temperature rise response time. A shielded data cable is used to connect to the wireless communication module, and its twisted-pair structure is covered with an aluminum-magnesium alloy braided layer to suppress electromagnetic interference in the distribution cabinet and reduce the temperature data error rate. Sealing holes are opened on the outer wall of the heat dissipation housing, and fluororubber sealing rings are injected into the holes and covered with ePTFE waterproof and breathable membranes. While maintaining the IP65 protection level, air pressure is balanced to prevent thermal expansion from causing cable compression damage.

[0080] In an optional embodiment, impedance analysis firmware is configured for the wireless communication module to calculate the contact resistance change rate in real time, and an alarm signal is triggered when the contact resistance change rate is ≥10%.

[0081] By configuring impedance analysis firmware for the wireless communication module, the contact resistance change rate is calculated in real time. The baseline value for the calculation is the initial installation resistance. By utilizing the inherent correlation between resistance change and contact state, accurate early warning can be achieved before physical failure occurs. An alarm threshold of ≥10% resistance change rate is set. This value has been verified as a failure critical point through accelerated aging experiments. If the resistance change rate exceeds 10%, the temperature rise rate increases non-linearly, which may lead to overheating within 48 hours. When the alarm signal is triggered, the fault node location information is uploaded simultaneously, enabling maintenance personnel to take targeted measures and shorten the fault troubleshooting time.

[0082] S7. Connect the heat dissipation housing to the sealed insulation cover to waterproof the busbar.

[0083] Specifically, the steps include: machining an annular sealing groove at the junction of the heat sink housing and the sealing insulation cover;

[0084] An elastic sealing ring is injection molded in the sealing groove, and the injection molding material is fluororubber.

[0085] An ePTFE waterproof and breathable membrane is laminated onto the outer surface of the sealed insulating cover.

[0086] By machining an annular sealing groove at the joint, compensation space is reserved for thermal expansion deformation. In an optional embodiment, the groove depth of the annular sealing groove can be ≥1.5 times the diameter of the sealing ring, so that the sealing interface maintains uniform compressive stress. The injection-molded fluororubber sealing ring, with its wide temperature range elasticity and weather resistance, maintains the integrity of the contact surface seal under vibration and thermal cycling conditions. At the same time, the composite ePTFE waterproof and breathable membrane solves the problems of condensation accumulation and air pressure imbalance.

[0087] A method for manufacturing a busbar expansion interface is also disclosed, including the following steps:

[0088] A flexible expansion interface is formed by stacking multiple layers of annealed copper sheets, and diffusion annealing is performed in a vacuum environment after stacking.

[0089] The standard connector is fixed to the interface end by laser welding, and the joint area is then subjected to X-ray inspection after welding.

[0090] The annealing temperature is 440℃-460℃.

[0091] Among these features, a flexible expansion interface is formed by stacking multiple layers of annealed copper sheets and performing diffusion annealing in a vacuum environment at 440-460℃. This eliminates cold working stress and increases the interlayer bonding strength to over 300MPa, thereby improving the interface's cold bending fatigue life. When laser welding standard connectors, heat input is precisely controlled to reduce connection resistance. Post-weld X-ray flaw detection enables micron-level detection of porosity / cracks, avoiding the risk of overheating due to welding defects.

[0092] The implementation principle of this application embodiment is as follows: Electrochemical corrosion is fundamentally suppressed through the rolling bonding of copper-aluminum composite substrates, achieving lightweighting and cost optimization; laser etching of conductive channels precisely plans the current path, improving the space utilization rate of bundled wires by up to 50%, supporting multi-circuit parallel wiring and meeting installation efficiency requirements; high-energy beam welding under inert gas protection ensures the metallurgical bonding of the terminal module and busbar, eliminating contact resistance fluctuations caused by bolt connections, while improving vibration fatigue strength; surface protection treatment uses a double encapsulation of epoxy coating and heat-shrink tubing, effectively resisting outdoor humidity and salt spray corrosion; the heat dissipation structure, through the synergistic effect of the thermally conductive medium layer and fin array, controls the temperature rise under high current conditions, significantly delaying insulation aging; the integrated monitoring module realizes real-time diagnosis of temperature and contact resistance, providing early warning of overheating risks and reducing fault diagnosis time; the waterproof sealing process utilizes the dynamic sealing mechanism of elastic sealing rings and breathable membranes to maintain sealing integrity under thermal stress deformation conditions.

[0093] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A bundled service busbar, comprising a busbar body, a terminal block module, and a heat dissipation housing, characterized in that, The manufacturing method of the wiring busbar includes the following steps: S1. A copper-aluminum composite busbar substrate is prepared by a rolling composite method, including simultaneously hot-pressing and bonding a copper layer, an aluminum layer and an interface diffusion barrier layer to form a layered structure; S2. Conductive channels are laser-etched on the surface of the busbar substrate to form a multi-branch wiring area; S3. The segmented terminal block module is fixed to the wiring area by high-energy beam welding, and the welding process is carried out under inert gas protection; S4. Perform surface treatment on the busbar surface to improve the busbar protection level; S5. Add a heat dissipation structure between the busbar body and the heat dissipation shell; S6. Process the terminal block module and integrate the monitoring module within the terminal block module; S7. Connect the heat dissipation housing to the sealed insulation cover to waterproof the busbar.

2. The bundled service busbar according to claim 1, characterized in that, In step S1: The interface diffusion barrier layer is made of nickel-based alloy foil with a thickness of 20-50 μm. During hot-press bonding, the temperature is controlled at 370℃-390℃ and the pressure is ≥15MPa. After bonding, the composite interface is subjected to in-situ solid solution treatment.

3. The bundled service busbar according to claim 1, characterized in that, Step S3 includes: A spring-loaded clamping mechanism and an adaptive conductive pad are pre-installed in the wire clamping cavity of the terminal block module, and the mounting base of the module is fused to the surface of the busbar substrate by laser deep penetration welding.

4. The bundled service busbar according to claim 1, characterized in that, Step S4 includes: An epoxy insulating coating with a thickness of 0.2-0.5 mm is formed on the outer surface of the busbar body using an electrostatic spraying process, and then cured at 150℃ for 30 minutes after spraying. A flame-retardant heat-shrink tubing is wrapped around the epoxy coating, and the tubing is tightly bonded to the coating through a hot air shrinking process.

5. The bundled service busbar according to claim 1, characterized in that, Step S5 includes: A thermally conductive silicone grease is filled between the busbar body and the heat dissipation shell to form a thermally conductive medium layer; The outer surface of the heat dissipation shell is integrally formed with multiple heat dissipation fins by extrusion casting, and the height-to-spacing ratio of the heat dissipation fins is 1:1.5-1:

2.

6. The bundled service busbar according to claim 5, characterized in that, It also includes a vibration-damping bracket, which is fixed to the bottom of the heat dissipation housing by locking bolts; Shock-absorbing pads are embedded in the contact surfaces of the anti-vibration bracket and the heat dissipation housing; Staggered ventilation holes are provided on the side wall of the vibration-damping support.

7. The bundled service busbar according to claim 1, characterized in that, Step S6 includes: A temperature sensing unit is embedded inside the terminal block module; The temperature sensing unit is connected to the wireless communication module via a shielded data cable, and a sealed wire hole is made on the outer wall of the heat sink housing for the data cable to pass through.

8. The bundled service busbar according to claim 7, characterized in that, The wireless communication module is configured with impedance analysis firmware to calculate the contact resistance change rate in real time. When the contact resistance change rate is ≥10%, an alarm signal is triggered.

9. The bundled service busbar according to claim 1, characterized in that, Step S7 includes: A ring-shaped sealing groove is machined at the junction of the heat dissipation housing and the sealing insulation cover; An elastic sealing ring is injection molded in the sealing groove, and the injection molding material is fluororubber. An ePTFE waterproof and breathable membrane is laminated onto the outer surface of the sealed insulating cover.

10. A method for manufacturing a busbar expansion interface, applicable to the wiring busbar of the bundled service drop line as described in any one of claims 1-9, characterized in that, Including the following steps: A flexible expansion interface is formed by stacking multiple layers of annealed copper sheets, and diffusion annealing is performed in a vacuum environment after stacking. The standard connector is fixed to the interface end by laser welding, and the joint area is then subjected to X-ray inspection after welding. The annealing temperature is 440℃-460℃.

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