Temperature control system and method, electronic equipment and storage medium

Abstract

The invention provides a temperature control system and method, electronic equipment and a storage medium, and relates to the technical field of semiconductor laser temperature control. The temperature control system is used for the vertical-cavity surface-emitting laser, and comprises a temperature measurement assembly which is used for measuring the real-time temperature of the vertical-cavity surface-emitting laser and providing a feedback signal; the digital PID algorithm assembly is connected with the temperature measuring assembly and is used for determining a control signal according to the feedback signal and a set temperature; and the power driving assembly is connected with the digital PID algorithm assembly and is used for providing driving current according to the control signal so as to adjust the temperature of the vertical cavity surface emitting laser. According to the invention, a four-wire system wiring method is adopted to eliminate lead resistance errors, and a high-precision element is matched, so that the temperature detection precision reaches 2mK, and the accuracy is remarkably improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor laser temperature control technology, and more specifically, to a temperature control system and method, electronic device and storage medium. Background Technology

[0002] A vertical-cavity surface-emitting laser (VCSEL) is a semiconductor laser that emits light perpendicular to the surface of a chip. Its core structure consists of upper and lower distributed Bragg reflectors (DBRs) and an active quantum well layer in between. The emission wavelength of a VCSEL is highly sensitive to temperature, with a wavelength drift rate typically ranging from 0.06 to 0.08 nm / ℃. This characteristic has a significant impact on quantum precision instruments that rely on specific laser wavelengths.

[0003] In atomic magnetometers, wavelength drift causes the laser frequency to deviate from the specific transition frequency of atoms (such as the D1 / D2 line), reducing pump efficiency, preventing atoms from being effectively polarized, and leading to resonance mismatch. In MEMS gyroscopes, wavelength changes directly alter the phase detection results of optical path difference, causing angular velocity measurement deviations. They also change the effective refractive index of waveguides or microcavities, affecting resonance conditions and reducing detection accuracy.

[0004] The closest existing technology is a thermoelectric cooler (TEC) temperature control system based on digital PID control. This system uses a thermistor and two-wire temperature measurement, driven by a microcontroller outputting a PWM signal. However, this technology has the following drawbacks: 1. Insufficient temperature measurement accuracy: In two-wire temperature measurement, current and voltage share a common wire, and the wire resistance introduces a significant error. Two-wire or three-wire temperature measurement methods result in the measured resistance being the sum of the thermistor resistance, wire resistance, PCB resistance, and contact resistance. While three-wire systems reduce error by compensating for wire resistance, symmetrical wires are required, and compensation is incomplete. 2. Poor temperature control stability: The current ripple of the PWM-driven TEC is large, leading to significant temperature fluctuations and making high-precision, stable control difficult. 3. Insufficient anti-interference capability: The high-frequency characteristics of PWM drive easily introduce high-frequency noise under high current, affecting sensitive measurements. Two-wire or three-wire wiring methods are susceptible to external environmental interference, further reducing signal reliability. Summary of the Invention

[0005] To address at least one of the aforementioned problems, this application proposes a temperature control system and method, electronic device and storage medium with high temperature measurement accuracy, strong anti-interference ability and good temperature control stability, to solve the wavelength drift problem of VCSEL caused by temperature fluctuations and meet the stringent requirements of quantum precision instruments for laser wavelength stability.

[0006] According to a first aspect of this application, at least one embodiment of this application provides a temperature control system for a vertical-cavity surface-emitting laser (VCSEL). The temperature control system includes: a temperature measurement component for measuring the real-time temperature of the VCSEL and providing a feedback signal; a digital PID algorithm component connected to the temperature measurement component for determining a control signal based on the feedback signal and a set temperature; and a power drive component connected to the digital PID algorithm component for providing a drive current based on the control signal to adjust the temperature of the VCSEL.

[0007] For example, in some embodiments of this application, the temperature measuring component includes: a constant current source for providing current; a thermistor; a first current loop, one end connected to the constant current source and the other end connected to the thermistor; a second current loop, one end connected to the thermistor and the other end grounded, wherein the first current loop and the second current loop are used to transmit the current provided by the constant current source to drive the thermistor; a first voltage acquisition loop, one end connected to the other end of the first current loop; a second voltage acquisition loop, one end connected to the first end of the second current loop, wherein the first voltage acquisition loop and the second voltage acquisition loop are used to acquire voltage signals across the thermistor; a voltage follower, the input end of which is connected to the output ends of the first voltage acquisition loop and the second voltage acquisition loop respectively, for eliminating interference from the resistance in the loop on the voltage signal; and a differential analog-to-digital converter, the input end of which is connected to the output end of the voltage follower, for converting the voltage signal into the feedback signal.

[0008] For example, in some embodiments of this application, the digital PID algorithm component includes: a proportional unit for performing proportional calculation on the difference between the feedback signal and the set temperature; an integral unit for performing integral calculation on the difference between the feedback signal and the set temperature; and a differential unit for performing differential calculation on the difference between the feedback signal and the set temperature, and determining the control signal based on the proportional calculation, the integral calculation, and the differential calculation.

[0009] For example, in some embodiments of this application, the digital PID algorithm component further includes a filter connected to the differential unit for filtering the result of the differential calculation to suppress noise interference.

[0010] For example, in some embodiments of this application, the power drive component includes: a digital-to-analog converter for converting the control signal into an analog voltage signal; a current-limiting resistor, one end of which is connected to the digital-to-analog converter for converting the analog voltage signal into the drive current; a thermoelectric cooler, the negative terminal of which is connected to a DC voltage source; and a transistor, the emitter of which is grounded, the base of which is connected to the other end of the current-limiting resistor, and the collector of which is connected to the positive terminal of the thermoelectric cooler, for amplifying the drive current and driving the thermoelectric cooler, so that the thermoelectric cooler can heat according to the current change to adjust the temperature of the vertical cavity surface-emitting laser.

[0011] According to a second aspect of this application, at least one embodiment of this application provides a temperature control method executed by a temperature control system as described in any one of the first aspects, the temperature control method comprising: measuring the real-time temperature of the vertical-cavity surface-emitting laser and providing a feedback signal; determining a control signal based on the feedback signal and a set temperature; and providing a drive current based on the control signal to adjust the temperature of the vertical-cavity surface-emitting laser.

[0012] For example, in some embodiments of this application, determining the control signal based on the feedback signal and the set temperature includes: calculating the control signal using an incremental PID algorithm based on the current error between the set temperature and the feedback signal, including:

[0013] The current error is calculated using the following formula:

[0014] e(k) = r(k) - y(k)

[0015] Where e(k) is the current error, r(k) is the set temperature, and y(k) is the feedback signal; the control signal is calculated according to the following formula:

[0016]

[0017] Where Δμ(k) is the control signal, K p K is the proportionality coefficient. i K is the integral coefficient. d Here, is the differential coefficient, T is the sampling period, and e(k-1) and e(k-2) are the historical errors.

[0018] For example, in some embodiments of this application, determining the control signal based on the feedback signal and the set temperature further includes: stopping the integral calculation when the control quantity of the control signal reaches a first set threshold; and performing low-pass filtering on the differential components of the control signal.

[0019] According to a third aspect of this application, at least one embodiment of this application provides an electronic device, comprising: one or more processors; a memory for storing one or more programs; and, when the one or more programs are executed by the one or more processors, causing the one or more processors to perform the method as described in any one aspect of the first application.

[0020] According to a fourth aspect of this application, at least one embodiment of this application provides a computer-readable storage medium having a computer program stored thereon that, when executed by a processor, implements the method as described in any one of the first aspects.

[0021] Through the above exemplary embodiments, the temperature control system, method, electronic device, and storage medium provided in this application employ a four-wire wiring method to eliminate wire resistance errors. Combined with high-precision components, this achieves a temperature detection accuracy of 2mK, significantly improving accuracy. Furthermore, differential circuits and low-noise components suppress power supply noise and common-mode interference, enhancing the signal-to-noise ratio and making it more suitable for electromagnetic interference environments. The use of a digital PID anti-saturation algorithm enables rapid temperature stabilization and more accurate compensation for steady-state errors, avoiding repeated adjustments due to integral saturation. Simultaneously, the transistor is used as a linear current amplifier to output low-frequency analog current, rather than PWM modulation, reducing high-frequency noise interference.

[0022] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0023] The above and other objects, features, and advantages of this application will become more apparent from the detailed description of exemplary embodiments with reference to the accompanying drawings. The drawings described below are merely some embodiments of this application and are not intended to limit the scope of this application.

[0024] Figure 1 A schematic diagram of a temperature control system of an exemplary embodiment is shown;

[0025] Figure 2 A schematic diagram of a temperature measuring component is shown in an exemplary embodiment;

[0026] Figure 3 A schematic diagram of a power drive component is shown in an exemplary embodiment;

[0027] Figure 4 A flowchart illustrating a temperature control method of an exemplary embodiment is shown.

[0028] Figure 5 A block diagram of a digital PID algorithm of an exemplary embodiment is shown;

[0029] Figure 6 This diagram illustrates the structure of an electronic device provided in this application. Detailed Implementation

[0030] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this application will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted.

[0031] The described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a full understanding of embodiments of this disclosure. However, those skilled in the art will recognize that the technical solutions of this disclosure can be practiced without one or more of these specific details, or other methods, components, materials, devices, etc. In these cases, well-known structures, methods, devices, implementations, materials, or operations will not be shown or described in detail.

[0032] The flowcharts shown in the accompanying drawings are merely illustrative and do not necessarily include all content and operations / steps, nor do they necessarily have to be performed in the described order. For example, some operations / steps can be broken down, while others can be combined or partially combined; therefore, the actual execution order may change depending on the specific circumstances.

[0033] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0034] Those skilled in the art will understand that the accompanying drawings are merely schematic diagrams of exemplary embodiments, and the modules or processes in the drawings are not necessarily essential for implementing this application, and therefore cannot be used to limit the scope of protection of this application.

[0035] Figure 1 A schematic diagram of a temperature control system of an exemplary embodiment is shown.

[0036] like Figure 1 As shown, the temperature control system includes: a temperature measurement component 101, a digital PID algorithm component 102, and a power drive component 103.

[0037] The temperature measurement component 101 measures the real-time temperature of the vertical-cavity surface-emitting laser (VCSEL) and provides a feedback signal. The digital PID algorithm component 102, connected to the temperature measurement component 101, determines the control signal based on the feedback signal and the set temperature. The power drive component 103, connected to the digital PID algorithm component 102, provides a drive current based on the control signal to regulate the temperature of the VCSEL.

[0038] like Figure 2 As shown, the temperature measurement component 101 includes: a constant current source 1011, a thermistor 1012, a first current loop R_Line1, a second current loop R_Line4, a first voltage acquisition loop R_Line2, a second voltage acquisition loop R_Line3, voltage followers 1013 and 1014, and a differential analog-to-digital converter 1015.

[0039] The constant current source 1011 provides current. One end of the first current loop R_Line1 is connected to the constant current source, and the other end is connected to the thermistor 1012. One end of the second current loop R_Line4 is connected to the thermistor 1012, and the other end is grounded. The first current loop R_Line1 and the second current loop R_Line4 are used to transmit the current provided by the constant current source 1011 to drive the thermistor 1012. One end of the first voltage acquisition loop R_Line2 is connected to the other end of the first current loop R_Line1. One end of the second voltage acquisition loop R_Line3 is connected to one end of the second current loop R_Line4. The first voltage acquisition loop R_Line2 and the second voltage acquisition loop R_Line3 are used to acquire the voltage signal across the thermistor 1012. The input terminals of voltage followers 1013 and 1014 are respectively connected to the output terminals of the first voltage acquisition loop R_Line2 and the second voltage acquisition loop R_Line3 to eliminate the interference of the resistors in the loop on the voltage signal. The input terminal of the differential analog-to-digital converter 1015 is connected to the output terminal of the voltage followers 1013 and 1014, and is used to convert the voltage signal into a feedback signal.

[0040] This application uses four wires (R_Line1-R_Line4) to connect the thermistor (NTC10k), two of which transmit constant current source current and two of which acquire voltage signals, which can separate the current loop and the voltage acquisition loop, eliminating the influence of wire resistance, PCB line resistance and contact resistance.

[0041] According to some embodiments, the constant current source can be the TI REF200 chip, which has high accuracy (100μA±0.5%), low temperature drift (±25ppm / ℃) and high output impedance (impedance value up to 40MΩ). These characteristics can significantly reduce the impact of load changes on current, making it suitable for driving high impedance loads.

[0042] According to some embodiments, the first current loop R_Line1 is the sum of the wire resistance, PCB line resistance, and device contact resistance from the constant current chip output terminal to one end of the thermistor (NTC10k). The second current loop R_Line4 is the sum of the wire resistance, PCB line resistance, and device contact resistance from the other end of the constant current chip output terminal to the other end of the thermistor (NTC10k). The first voltage acquisition loop R_Line2 is the sum of the PCB line resistance from one end of the thermistor (NTC10k) to the input terminal of the voltage follower. The second voltage acquisition loop R_Line3 is the sum of the PCB line resistance from the other end of the thermistor (NTC10k) to the input terminal of the voltage follower.

[0043] According to some embodiments, the calculation formula for the thermistor is as follows:

[0044]

[0045] Where R is the resistance of the thermistor at 25℃ (10kΩ), T0 is the Kelvin temperature of the thermistor at 25℃, T1 is the Kelvin temperature at the target temperature, and B is the material coefficient, typically 3950. Based on the resistance data generated from the target temperature, after conversion, it can be seen that the temperature detection accuracy can reach 2mK.

[0046] According to some embodiments, the voltage follower can use the ADA4841, which has strong anti-interference capabilities. Its common-mode rejection ratio (CMRR) can reach 100dB, which can effectively suppress power supply noise and common-mode interference. Its power supply rejection ratio (PSRR) can reach 80dB (1kHz), which can effectively reduce the impact of power supply fluctuations on the output. Moreover, it has extremely high input impedance, with a common-mode input impedance of up to 90M ohms. Therefore, almost no current flows through the traces at R_Line2 and R_Line3. This wiring method can eliminate the influence of wire resistance, and the voltage output of the voltage follower can be considered as only the voltage across the thermistor.

[0047] According to some embodiments, the high-precision differential analog-to-digital converter can employ the AD7691, an 18-bit SAR ADC that supports 262,144 quantization levels and can detect micro-signals at the μV level. Furthermore, when used in conjunction with the ADA4841, this device can directly buffer high-impedance sensor signals, preventing signal attenuation. In addition, this device supports true differential input, suppresses common-mode noise, and is suitable for long-distance transmission or electromagnetic interference environments, improving the signal-to-noise ratio.

[0048] According to some embodiments, the resistance of the thermistor of the VCSEL laser at room temperature is 10kΩ, and the voltage generated by a 100uA current flowing through the thermistor is 1V. Using the 2.5V reference voltage on the AD7691 chip, the detection accuracy can reach 9.5uV.

[0049] The digital PID algorithm component 102 includes: a proportional unit, an integral unit, a derivative unit, and a filter.

[0050] The system comprises three main components: a proportional unit for calculating the proportional difference between the feedback signal and the set temperature; an integral unit for calculating the integral difference between the feedback signal and the set temperature; and a differential unit for calculating the differential difference between the feedback signal and the set temperature. A filter, connected to the differential unit, filters the results of the differential calculation to suppress noise interference and determines the control signal based on the proportional, integral, and differential calculations.

[0051] like Figure 3 As shown, the power drive assembly 103 includes: a digital-to-analog converter 1031, a current-limiting resistor 1032, a thermoelectric cooler 1033, and a transistor 1034.

[0052] The digital-to-analog converter 1031 converts the control signal into an analog voltage signal. One end of the current-limiting resistor 1032 is connected to the digital-to-analog converter to convert the analog voltage signal into a drive current. The negative terminal of the thermoelectric cooler 1033 is connected to a DC voltage source, and the vertical-cavity surface-emitting laser is placed on the thermoelectric cooler 1033. The emitter of the transistor 1034 is grounded, its base is connected to the other end of the current-limiting resistor 1032, and its collector is connected to the positive terminal of the thermoelectric cooler 1033. This amplifies the drive current and drives the thermoelectric cooler 1033, enabling the thermoelectric cooler 1033 to heat up according to the current change, thereby regulating the temperature of the vertical-cavity surface-emitting laser.

[0053] In some embodiments, the digital-to-analog converter (DAC) can be the AD5060. The AD5060 provides 16-bit output precision, allowing for accurate control of minute voltage changes. This chip integrates a 2.5V reference voltage source, thus achieving an output voltage control precision of up to 38µV. The AD5060 outputs a low-frequency analog voltage signal, which, when connected in series with a current-limiting resistor, generates current at the base of a transistor. The transistor's on-state voltage is typically 0.6V, and the current-limiting resistor is typically 100Ω. Therefore, the maximum output current is 19mA, with a current control precision of 0.29µA. The transistor's current amplification gain is typically 100-300, thus achieving a current control precision of 29µA-87µA for the DAC.

[0054] This application also provides a temperature control method, performed by the temperature control system as described above.

[0055] like Figure 4 As shown, the temperature control method includes steps S401-S403.

[0056] In step S401, the real-time temperature of the vertical cavity surface-emitting laser is measured and a feedback signal is provided.

[0057] The thermistor voltage of the VCSEL laser is acquired through a four-wire temperature measurement circuit, and the voltage signal is converted into a feedback signal.

[0058] In step S402, a control signal is determined based on the feedback signal and the set temperature.

[0059] Based on the current error between the set temperature and the feedback signal, the control signal is calculated using an incremental PID algorithm, and the current error is saved for use in the next cycle.

[0060] Calculate the current error using the following formula:

[0061] e(k) = r(k) - y(k)

[0062] Where e(k) is the current error, r(k) is the set temperature, and y(k) is the feedback signal.

[0063] The proportional, integral, and derivative terms of the control signal are calculated using the incremental PID formula. The derivative term is then superimposed after low-pass filtering. Figure 5 As shown.

[0064] The control signal is calculated using the following formula:

[0065]

[0066] Where Δμ(k) is the control signal, K p K is the proportionality coefficient. i K is the integral coefficient. d Here, is the differential coefficient, T is the sampling period, e(k) is the current error, and e(k-1) and e(k-2) are the historical errors.

[0067] According to some embodiments, the control signal Δμ(k) is limited (e.g., from 0-100% power) to prevent TEC overload. When the control signal Δμ(k) output saturates, i.e., reaches a first set threshold, such as 100% heating power, the integral term calculation is paused to avoid integral saturation.

[0068] The digital PID anti-integral saturation algorithm reduces overshoot and oscillation. When the output reaches the actuator's limit (100% heating power), the algorithm pauses integration to prevent the control quantity from getting stuck at the limit, thereby reducing overshoot and settling time. This saturation integral algorithm can quickly stabilize the temperature. When the temperature approaches the setpoint, the integral term can more accurately compensate for steady-state errors, avoiding repeated adjustments due to integral saturation. Furthermore, it only differentiates the measured value, reducing the impact caused by sudden changes in the setpoint, and adds a low-pass filter to the derivative term to suppress high-frequency noise interference. This improved strategy balances response speed, accuracy, and anti-interference capability.

[0069] In step S403, a drive current is provided according to a control signal to adjust the temperature of the vertical cavity surface-emitting laser.

[0070] The digital-to-analog converter converts the digital control signal into an analog voltage, which is then linearly amplified by a transistor and outputs a continuously adjustable current to the thermoelectric cooler. This enables the thermoelectric cooler to heat the device according to changes in the current, thus achieving dynamic and stable control of the VCSEL's operating temperature.

[0071] This application provides a temperature control system and method that employs a four-wire wiring method to eliminate wire resistance errors. Combined with high-precision components, this achieves a temperature detection accuracy of 2mK, significantly improving accuracy. Differential circuits and low-noise components suppress power supply noise and common-mode interference, enhancing the signal-to-noise ratio and making it more suitable for electromagnetic interference environments. A digital PID anti-saturation algorithm is used to quickly stabilize the temperature and more accurately compensate for steady-state errors, avoiding repeated adjustments due to integral saturation. Simultaneously, a transistor is used as a linear current amplifier to output low-frequency analog current, rather than PWM modulation, reducing high-frequency noise interference.

[0072] Figure 6 This diagram illustrates the structure of an electronic device provided in this application.

[0073] See Figure 6 , Figure 6 An electronic device is provided, including a processor and a memory. The memory stores computer instructions, which, when executed by the processor, cause the processor to perform the computer instructions to achieve the following: Figure 4 and Figure 5 The method and its detailed scheme are shown.

[0074] It should be understood that the above-described device embodiments are merely illustrative, and the device disclosed in this application can also be implemented in other ways. For example, the division of units / modules in the above embodiments is only a logical functional division, and there may be other division methods in actual implementation. For example, multiple units, modules, or components may be combined, or integrated into another system, or some features may be ignored or not executed.

[0075] Furthermore, unless otherwise specified, the functional units / modules in the various embodiments of this application can be integrated into one unit / module, or each unit / module can exist physically separately, or two or more units / modules can be integrated together. The integrated units / modules described above can be implemented in hardware or as software program modules.

[0076] When integrated units / modules are implemented in hardware, the hardware can be digital circuits, analog circuits, etc. The physical implementation of the hardware structure includes, but is not limited to, transistors, memristors, etc. Unless otherwise specified, the processor or chip can be any suitable hardware processor, such as a CPU, GPU, FPGA, DSP, and ASIC, etc. Unless otherwise specified, on-chip cache, off-chip memory, and storage can be any suitable magnetic or magneto-optical storage medium, such as Resistive Random Access Memory (RRAM), Dynamic Random Access Memory (DRAM), Static Random Access Memory (SRAM), Enhanced Dynamic Random Access Memory (EDRAM), High-Bandwidth Memory (HBM), Hybrid Memory Cube (HMC), etc.

[0077] If the integrated unit / module is implemented as a software program module and sold or used as an independent product, it can be stored in a computer-readable storage device (CMD). Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a memory and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments disclosed herein. The aforementioned memory includes various media capable of storing program code, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard drive, magnetic disk, or optical disk.

[0078] This application also provides a non-transitory computer storage medium storing a computer program, which, when executed by multiple processors, causes the processors to perform actions such as... Figure 4 and Figure 5 The method and its detailed scheme are shown.

[0079] It should be clearly understood that this application describes how specific examples are formed and used, but this application is not limited to any details of these examples. Rather, based on the teachings of the disclosure of this application, these principles can be applied to many other embodiments.

[0080] Furthermore, it should be noted that the above figures are merely illustrative representations of the processes included in the method according to exemplary embodiments of this application, and are not intended to be limiting. It is readily understood that the processes shown in the above figures do not indicate or limit the temporal order of these processes. Additionally, it is readily understood that these processes may be executed synchronously or asynchronously, for example, in multiple modules.

[0081] Exemplary embodiments of this application have been specifically shown and described above. It should be understood that this application is not limited to the detailed structures, arrangements, or implementation methods described herein; rather, this application is intended to cover various modifications and equivalent arrangements that fall within the objectives and scope of the appended claims.

Claims

1. A temperature control system, characterized in that, For a vertical-cavity surface-emitting laser, the temperature control system includes: A temperature measurement component is used to measure the real-time temperature of the vertical cavity surface-emitting laser and provide a feedback signal. A digital PID algorithm component, connected to the temperature measurement component, is used to determine a control signal based on the feedback signal and the set temperature; A power drive component, connected to the digital PID algorithm component, is used to provide drive current according to the control signal to adjust the temperature of the vertical cavity surface emitter laser.

2. The temperature control system as described in claim 1, characterized in that, The temperature measuring component includes: A constant current source is used to provide current. Thermistor; The first current loop has one end connected to the constant current source and the other end connected to the thermistor. The second current loop has one end connected to the thermistor and the other end grounded. The first current loop and the second current loop are used to transmit the current provided by the constant current source to drive the thermistor. The first voltage acquisition circuit has one end connected to the other end of the first current circuit; The second voltage acquisition circuit is connected at one end to the first end of the second current circuit. The first voltage acquisition circuit and the second voltage acquisition circuit are used to acquire the voltage signal across the thermistor. A voltage follower, with its input terminal connected to the output terminals of the first voltage acquisition circuit and the second voltage acquisition circuit respectively, is used to eliminate the interference of the resistance in the circuit on the voltage signal; A differential analog-to-digital converter, with its input terminal connected to the output terminal of the voltage follower, is used to convert the voltage signal into the feedback signal.

3. The temperature control system as described in claim 1, characterized in that, The digital PID algorithm component includes: A proportional unit is used to perform proportional calculations on the difference between the feedback signal and the set temperature; An integration unit is used to perform integration calculations on the difference between the feedback signal and the set temperature; The differential unit is used to perform differential calculation on the difference between the feedback signal and the set temperature, and to determine the control signal based on the proportional calculation, the integral calculation, and the differential calculation.

4. The temperature control system as described in claim 3, characterized in that, The digital PID algorithm component also includes: A filter, connected to the differentiating unit, is used to filter the results of the differential calculation in order to suppress noise interference.

5. The temperature control system as described in claim 1, characterized in that, The power drive component includes: A digital-to-analog converter is used to convert the control signal into an analog voltage signal; A current-limiting resistor, one end of which is connected to the digital-to-analog converter, is used to convert the analog voltage signal into the drive current; Thermoelectric cooler, with the negative terminal connected to a DC voltage source; The transistor has its emitter grounded, its base connected to the other end of the current-limiting resistor, and its collector connected to the positive terminal of the thermoelectric cooler. This amplifies the driving current and drives the thermoelectric cooler, enabling the thermoelectric cooler to heat according to the current change, thereby adjusting the temperature of the vertical cavity surface-emitting laser.

6. A temperature control method, characterized in that, Performed by the temperature control system as described in any one of claims 1-5, the temperature control method includes: The real-time temperature of the vertical-cavity surface-emitting laser is measured and a feedback signal is provided. The control signal is determined based on the feedback signal and the set temperature; A drive current is provided according to the control signal to regulate the temperature of the vertical cavity surface-emitting laser.

7. The temperature control method as described in claim 6, characterized in that, The step of determining the control signal based on the feedback signal and the set temperature includes: Based on the current error between the set temperature and the feedback signal, a control signal is calculated using an incremental PID algorithm, including: The current error is calculated using the following formula: e(k) = r(k) - y(k) Where e(k) is the current error, r(k) is the set temperature, and y(k) is the feedback signal; The control signal is calculated according to the following formula: Where Δμ(k) is the control signal, K p K is the proportionality coefficient. i K is the integral coefficient. d Here, is the differential coefficient, T is the sampling period, and e(k-1) and e(k-2) are the historical errors.

8. The temperature control method as described in claim 7, characterized in that, The step of determining the control signal based on the feedback signal and the set temperature further includes: When the control quantity of the control signal reaches the first set threshold, the integral calculation is stopped; The minor components of the control signal are low-pass filtered.

9. An electronic device, characterized in that, include: One or more processors; Memory, used to store one or more programs; When the one or more programs are executed by the one or more processors, the one or more processors perform the method as described in any one of claims 6-8.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the program is executed by the processor, it implements the method as described in any one of claims 6-8.

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