Plate conveying equipment for soft gold wire pretreatment

Abstract

The invention discloses plate conveying equipment for pretreatment of soft gold threads, and belongs to the technical field of conveying equipment.The plate conveying equipment comprises a conveying belt and a feeding mechanism arranged on one side of the conveying belt, an operation table is arranged at the tail end of the conveying belt, a first mechanical wall is arranged on one side of the operation table, and an edge covering mechanism is arranged on the operation table; a second mechanical wall is further arranged on one side of the operation table, the edge covering mechanism comprises a bearing table arranged on the upper surface of the operation table and edge covering machines symmetrically arranged on the two sides of the operation table, and a clamping assembly is further arranged on the operation table. According to the method disclosed by the invention, the subsequent procedures are simplified, the cost is reduced, rework is reduced, after edge covering, additional edge burr grinding is not needed, the manual plate repairing time is saved, environmental protection and compliance are realized, the cyanide-containing wastewater generation amount is reduced, and the emission standard is easier to reach.

Description

Technical Field

[0001] This invention belongs to the field of transmission equipment technology, and specifically relates to a board-based transmission device for soft gold wire pretreatment. Background Technology

[0002] "Soft gold wire" is a specific term in microelectronic packaging and semiconductor bonding processes, referring to a type of specially treated or alloyed gold wire. It offers better flexibility, ductility, and fatigue resistance than traditional pure gold bonding wire. Soft gold wire is a high-performance gold wire in the field of microelectronic bonding. Through precision annealing and / or micro-alloying, its flexibility, ductility, and fatigue resistance are significantly improved. It is particularly suitable for advanced packaging applications requiring precise arc control, high reliability, and long lifespan. It is one of the key materials in modern semiconductor packaging to ensure the stability and reliability of electrical connections. Using specialized equipment and processes, one end of the soft gold wire is bonded to the chip, and the other end is bonded to the PCB pad, achieving a reliable electrical interconnection between the semiconductor chip and the PCB.

[0003] Soft gold plating: An ultra-thin gold plating layer on PCB pads, whose core function is to provide a clean interface for bonding.

[0004] Soft gold wire: A solid metal wire used for connection, whose core function is to transmit electrical signals.

[0005] Both are indispensable in wire bonding: the soft gold wire is the "bridge" and the soft gold plating layer is the "pier", together achieving reliable interconnection between the chip and the PCB.

[0006] Electroplating soft gold: Nickel (2-8μm) is first plated onto the copper pads as a barrier layer, followed by high-purity soft gold (0.03-0.3μm). The nickel layer prevents copper-gold diffusion, while the soft gold layer provides the bonding interface. Difference from ordinary hard gold: Hard gold (such as gold fingers) adds cobalt / nickel to increase hardness, while soft gold has high purity and a soft texture, making it more suitable for bonding. The bonding process uses a bonding machine to solder one end of the gold wire to the chip pad (ball bonding) and the other end to the PCB bonding pad (wedge bonding), forming an electrical interconnect. The bonding process requires control of pressure, temperature, and time to ensure a strong metallurgical bond.

[0007] Electroplating soft gold (core step) process: clamping plate → micro-etching (cleaning copper surface) → nickel plating → flash gold plating (0.03-0.05μm transition layer) → soft gold plating → water washing and drying.

[0008] The process of electroplating soft gold requires the use of conveying equipment for transportation. In order to save raw materials before plating soft gold, the PCB board is wrapped with tape. The process is done manually, and the existing conveying equipment does not achieve automated production line during the conveying process. Summary of the Invention

[0009] The purpose of this invention is to provide a board conveying device for soft gold wire pretreatment, so as to solve the problems mentioned in the background art. To achieve the above objective, this invention provides the following technical solution: including a conveyor belt and a feeding mechanism disposed on one side of the conveyor belt, an operating table is provided at the end of the conveyor belt, a first mechanical wall is provided on one side of the operating table, an edge-wrapping mechanism is provided on the operating table, and a second mechanical wall is also provided on one side of the operating table;

[0010] The feeding mechanism includes fixed platforms respectively arranged on both sides of the conveyor belt and material boxes fixed on the fixed platforms. An electric gantry frame is fixed between the two fixed platforms, and an electric suction cup is slidably installed on the electric gantry frame.

[0011] The edge-binding mechanism includes a support platform set on the upper surface of the operating table and edge-binding machines symmetrically arranged on both sides of the operating table. The operating table is also equipped with a clamping assembly.

[0012] It should be noted in the solution that the output ends of the two edge-wrapping machines are respectively fixed with an upper frame and a lower frame, which can be combined to form an outer frame that wraps around the outside of the PCB.

[0013] It should be noted in the solution that the clamping assembly includes clamps symmetrically arranged on both sides of the support platform, the clamps being respectively arranged on the left and right sides of the support platform, and the edge-wrapping machine being respectively arranged on the front and rear sides of the support platform.

[0014] It should be noted in the solution that the two joints between the lower frame and the upper frame are provided with protrusions, and the protrusions are provided with several rubber sleeves. The upper frame is provided with grooves that match the protrusions.

[0015] It should be noted in the solution that both the first and second mechanical walls are equipped with grippers that are compatible with the PCB.

[0016] It should be noted in the solution that a wire frame is provided on one side of the operating table, and the wire frame is provided with several slots that are adapted to the outer frame.

[0017] Compared with the prior art, the board transfer device for soft gold wire pretreatment provided by the present invention has at least the following beneficial effects:

[0018] (1) By setting the edge wrapping mechanism, the protective layer can protect the board edge structure, reduce subsequent processing defects, prevent damage, avoid the copper layer on the edge from peeling off due to clamping of electroplating fixtures or collision in the tank, prevent gold leakage and short circuit. This invention simplifies the subsequent process, reduces costs, reduces rework. After edge wrapping, there is no need to grind the edge burrs, saving manual board repair time. It is environmentally compliant, reduces the amount of cyanide-containing wastewater generated (reduced chemical residue in the cleaning process), and is easier to meet emission standards.

[0019] (2) By setting the outer frame, the outer frame can be reused and can be better used in actual operation to achieve automation. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of the product of the present invention;

[0021] Figure 2 This is a top view cross-sectional structural diagram of the product of this invention;

[0022] Figure 3 This is an enlarged structural diagram of the outer frame of the product of this invention;

[0023] Figure 4 This is a side view cross-sectional structural diagram of the product of the present invention.

[0024] In the diagram: 1. Conveyor belt; 2. Fixed platform; 3. Material box; 4. Electric gantry frame; 5. Electric suction cup; 6. First mechanical wall; 7. Second mechanical wall; 8. Edge banding machine; 9. Operating table; 10. Supporting platform; 12. Frame; 13. Outer frame; 14. Upper frame; 15. Lower frame. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] Please see Figure 1-4 A board conveying device for pretreatment of soft gold wire includes a conveyor belt 1 and a feeding mechanism disposed on one side of the conveyor belt 1. An operating table 9 is provided at the end of the conveyor belt 1. A first mechanical wall 6 is provided on one side of the operating table 9. An edge-wrapping mechanism is provided on the operating table 9. A second mechanical wall 7 is also provided on one side of the operating table 9. The feeding mechanism includes a fixed platform 2 disposed on both sides of the conveyor belt 1 and a material box 3 fixed on the fixed platform 2. An electric gantry frame 4 is fixed between the two fixed platforms 2. An electric suction cup 5 is slidably installed on the electric gantry frame 4. The edge-wrapping mechanism includes a bearing platform 10 disposed on the upper surface of the operating table 9 and an edge-wrapping machine 8 symmetrically disposed on both sides of the operating table 9. A clamping assembly is also provided on the operating table 9.

[0027] With the edge-wrapping mechanism in place, the cleaned PCB is transported to the material box 3 during actual use. The electric suction cup 5 and the electric gantry 4 work together to transport the PCB to the conveyor belt 1. The PCB is then placed on the support platform 10 via the first mechanical wall 6. The edge-wrapping machine 8 is then started to wrap a protective layer around the outer periphery of the PCB. The protective layer can protect the edge structure of the board, reduce subsequent processing defects, prevent damage, avoid the copper layer from peeling off due to clamping of electroplating fixtures or collisions in the tank, and prevent gold seepage and short circuits. This invention simplifies the subsequent processes, reduces costs, and reduces rework. After edge wrapping, there is no need to grind the edge burrs, saving manual board repair time. It is environmentally compliant, reduces the amount of cyanide-containing wastewater generated (reduced chemical residue in the cleaning process), and is easier to meet emission standards.

[0028] Furthermore, referring to Figure 1-4 As shown, it is worth noting that the output ends of the two edge-binding machines 8 are respectively fixed with an upper frame 14 and a lower frame 15. The upper frame 14 and the lower frame 15 can be combined to form an outer frame 13, which wraps around the outside of the PCB. The two joints of the lower frame 15 with the upper frame 14 are provided with protrusions, and the protrusions are provided with several rubber sleeves. The upper frame 14 is provided with grooves that match the protrusions.

[0029] With the outer frame 13 in place, the protective layer can be high-temperature tape, liquid resist ink, or a wire mesh frame in actual use. The wire mesh frame can be reused and can also be better used in conjunction with the edge banding machine 8 to achieve automation.

[0030] Furthermore, referring to Figure 1-4 As shown, it is worth noting that the clamping assembly includes clamps symmetrically arranged on both sides of the support platform 10. The clamps are respectively arranged on the left and right sides of the support platform 10. The edge banding machine 8 is respectively arranged on the front and rear sides of the support platform 10. The first mechanical wall 6 and the second mechanical wall 7 are both provided with claws adapted to the PCB. A wire frame 12 is provided on one side of the operating table 9. The wire frame 12 is provided with a plurality of slots adapted to the outer frame 13.

[0031] By setting the clamping components, the PCB is prevented from being inaccurately positioned when installing the mesh frame during actual use. The PCB is fixed in position by the clamps. After the upper frame 14 and lower frame 15 are assembled with the PCB to a certain position, the clamps are retracted. Different specifications of outer frame 13 and mesh frame 12 are used according to different PCBs. The clamps on the first mechanical wall 6 and the second mechanical wall 7 are adjustable and can adapt to PCBs within a certain range.

[0032] The foregoing has described a board transfer device for soft gold wire pretreatment provided by the present invention. Specific preferred embodiments have been used to illustrate the principles and implementation of the present invention. These embodiments are only used to help understand the principles and core ideas of the present invention. It should be noted that for those skilled in the art, the implementation schemes in the above embodiments can be further combined or replaced without departing from the design concept of the present invention, and several improvements and modifications can be made to the present invention. These improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A board transfer device for soft gold wire pretreatment, characterized in that: It includes a conveyor belt (1) and a feeding mechanism disposed on one side of the conveyor belt (1). An operating table (9) is provided at the end of the conveyor belt (1). A first mechanical wall (6) is provided on one side of the operating table (9). An edge-binding mechanism is provided on the operating table (9). A second mechanical wall (7) is also provided on one side of the operating table (9). The feeding mechanism includes a fixed platform (2) respectively set on both sides of the conveyor belt (1) and a material box (3) fixed on the fixed platform (2). An electric gantry frame (4) is fixed between the two fixed platforms (2), and an electric suction cup (5) is slidably installed on the electric gantry frame (4). The edge-binding mechanism includes a support platform (10) set on the upper surface of the operating table (9) and edge-binding machines (8) symmetrically arranged on both sides of the operating table (9). The operating table (9) is also provided with a clamping assembly.

2. The board conveying device for soft gold wire pretreatment according to claim 1, characterized in that: The output ends of the two edge-sealing machines (8) are respectively fixed with an upper frame (14) and a lower frame (15). The upper frame (14) and the lower frame (15) can be combined to form an outer frame (13), which wraps around the outside of the PCB.

3. The board conveying device for soft gold wire pretreatment according to claim 2, characterized in that: The clamping assembly includes clamps symmetrically arranged on both sides of the support platform (10), the clamps being respectively arranged on the left and right sides of the support platform (10), and the edge banding machine (8) being respectively arranged on the front and rear sides of the support platform (10).

4. The board conveying device for soft gold wire pretreatment according to claim 3, characterized in that: The lower frame (15) has two protrusions at the joints with the upper frame (14), and the protrusions are provided with several rubber sleeves. The upper frame (14) is provided with grooves that match the protrusions.

5. The board conveying device for soft gold wire pretreatment according to claim 4, characterized in that: Both the first mechanical wall (6) and the second mechanical wall (7) are equipped with grippers that are compatible with the PCB.

6. The board conveying device for soft gold wire pretreatment according to claim 5, characterized in that: The operating table (9) has a wire frame (12) on one side, and the wire frame (12) has a number of slots that are adapted to the outer frame (13).

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