Semiconductor wafer dynamic reversing cleaning device and cleaning method

Abstract

The invention discloses a quartz wafer dynamic reversing cleaning basket device and a cleaning method, and belongs to the technical field of semiconductor cleaning equipment. The device comprises a cleaning basket, a movable upper cover and a deflection structure. The basket frame of the cleaning basket is provided with multiple sets of vertical clamping grooves used for bearing the wafer clamping plates, the movable upper cover is provided with corresponding transverse clamping grooves for restraining the upper edges of the wafer clamping plates, and an up-down restraining installation mode is formed. The deflection structure is arranged at the end of the basket, when the cleaning basket moves up and down in cleaning liquid, the deflection structure responds to the up-down movement, the reversing rod rotates through the guide slope mechanism, the eccentric head is driven to drive the movable upper cover to do horizontal reciprocating motion, and therefore the inclination angle of the wafer clamping plate is periodically changed, and dynamic reversing cleaning is achieved. The device adopts a pure mechanical design, has a self-adaptive adjusting mechanism, can automatically match the reversing frequency according to the cleaning intensity, and is particularly suitable for high-quality cleaning of semiconductor substrates such as quartz wafers, silicon wafers and sapphire wafers.

Description

Technical Field

[0001] This invention relates to the field of semiconductor wafer cleaning technology, and more particularly to a semiconductor wafer dynamic reversal cleaning device and cleaning method, which is used to improve the uniformity and efficiency of wafer cleaning and meet the cleanliness requirements of precision processes. Background Technology

[0002] The processing of quartz wafers involves a cleaning process. After cleaning, the wafers are coated to form electrode circuits. If the cleaning effect of the quartz wafers is not good, it will directly affect the product performance.

[0003] The existing wafer cleaning process typically involves the following steps: 1. Pretreatment: Using mechanical methods to remove large particulate contaminants and loose oxide layers from the wafer surface; 2. Chemical cleaning: Acid washing, alkaline washing, and hydrofluoric acid treatment; 3. Ultrasonic cleaning: Using an ultrasonic cleaner in combination with deionized water or organic solvents for deep cleaning to remove surface-attached microparticles and contaminants; 4. Rinsing: Thoroughly rinsing with large amounts of deionized water to remove residual cleaning agents and chemical reagents; 5. Drying: Nitrogen blowing, heat drying, and spin drying; 6. Inspection: Using tools such as microscopes to inspect the cleanliness of the wafer surface to ensure that the cleaning effect meets the requirements. The chemical cleaning, ultrasonic cleaning, and rinsing processes are similar and are usually interleaved to form the wafer cleaning process.

[0004] Patent document CN 114378085 B discloses a cleaning fixture and method for semiconductor wafers, but it does not solve the problem that impurities in the gap between the fixture and the wafer are difficult to remove in practical applications, and some residues still remain after drying. In the cleaning process, pre-treated quartz wafers are installed into wafer clamping plates through a wafer arrangement process. Multiple wafer clamping plates are then fixed in vertically arranged slots of a cleaning basket, which is fixed to a cleaning cage. The cleaning cage is then driven by the equipment to immerse itself in the cleaning solution and swing up and down. However, due to the fixed structure of the wafer clamping plates, the cleaning solution lacks an angle for rinsing the wafer surface, resulting in the water flow not effectively removing stubborn stains. Summary of the Invention

[0005] The technical problem to be solved by the present invention is that the existing quartz wafer cleaning basket device has the problems of low cleaning efficiency and incomplete cleaning. In particular, it is difficult to effectively remove fine impurities such as abrasive sand and metal particles in the gap between the wafer clamping plates, which affects the cleaning quality and the quality of subsequent processes.

[0006] To solve the above-mentioned technical problems, the present invention provides a quartz wafer dynamic reversal cleaning basket device, comprising: The cleaning basket includes: a basket frame with multiple sets of vertical slots spaced parallel to each other along its length for supporting wafer clamping plates; a movable top cover with a rectangular through hole in the center and horizontal slots on both sides of the through hole corresponding to the vertical slots on the basket frame for restraining the upper edge of the wafer clamping plates; and a deflection structure located at the end of the basket frame for driving the movable top cover to move horizontally back and forth. Each wafer clamping plate has its bottom edge embedded in a corresponding set of vertical slots and its upper edge embedded in a corresponding set of horizontal slots, forming a vertically constrained installation. When the cleaning basket moves up and down in the cleaning solution, the deflection structure responds to this movement, driving the movable top cover to move horizontally back and forth, thereby periodically changing the tilt angle of the wafer clamping plates and achieving dynamic reversing cleaning.

[0007] Further technical solutions, specifically the composition of the deflection structure: The deflection structure includes: a tubular mounting base, vertically fixed at the end of the basket frame; a reversing rod, coaxially inserted through the tubular mounting base, capable of moving up and down within the tubular mounting base and rotating around its own axis; a spring, ring-mounted at the lower part of the reversing rod, with its lower end abutting against the bottom of the tubular mounting base, providing a downward elastic restoring force for the reversing rod; a lower guide and an upper guide, ring-mounted on the reversing rod, each with a guide inclined surface structure; a circumferential guide protrusion, located on the outer circumference of the middle part of the reversing rod; an eccentric head, fixedly installed at the upper end of the reversing rod, with a vertical protrusion on it; and a deflection plate, fixed to the end of the movable upper cover, with an elongated hole through which the vertical protrusion passes to form a sliding fit.

[0008] Further technical solutions include the design of the guide ramp: The guide slope of the upper guide includes a first slope and a second slope. The first slope gradually slopes upwards, and the second slope slopes sharply downwards from the highest point of the first slope. The guide slope of the lower guide includes a third slope and a fourth slope. The third slope slopes sharply upwards, and the fourth slope slopes slowly downwards from the highest point of the third slope. The inclination angle of the second slope is greater than that of the first slope, and the inclination angle of the third slope is greater than that of the fourth slope.

[0009] Further technical solutions include optimization of the card slot structure: The horizontal slot has an adjustable gap of about 1 mm with the wafer clamping plate; the bottom of the vertical slot is provided with a secondary shallow groove with a width matching the thickness of the wafer clamping plate.

[0010] Further technical solutions, auxiliary structures: The cleaning basket also includes: a handle, welded and fixed to both sides of the basket frame; and two railings, fixed to both sides of the basket frame, the spacing of which matches the width of the wafer clamping plate to prevent the wafer clamping plate from shifting laterally during the cleaning process.

[0011] Further technical solutions, dual-end setup solution: The deflection structure is set at both ends of the basket frame. The deflection structures at both ends work synchronously to ensure that the movable cover is subjected to uniform force and maintains a horizontal state when it moves horizontally back and forth.

[0012] This invention also provides a method for dynamic reversal cleaning of quartz wafers, comprising the following steps: Step 1: Install the wafer clamping plate in the cleaning basket device described above. The bottom edge of each wafer clamping plate is embedded in the corresponding vertical slot, and the upper edge is embedded in the corresponding horizontal slot. Step two: Place the cleaning basket containing the wafer clamping plate into the cleaning tank; start the cleaning equipment to make the cleaning basket reciprocate up and down in the cleaning solution; during the up and down movement, the bottom of the deflector rod of the deflection structure contacts the bottom surface of the cleaning tank, obtains an upward thrust, drives the deflector rod to rotate, and pushes the movable cover to move horizontally through the eccentric head; through the horizontal reciprocating movement of the movable cover, the tilt angle of the wafer clamping plate is changed periodically to achieve dynamic multi-angle cleaning.

[0013] Further technical solutions, rotation mechanism: The rotation process of the swashplate includes: rising phase: the swashplate is pushed upward, and the circumferential guide protrusion moves upward along the guide slope of the lower guide member, causing the swashplate to rotate 180 degrees; falling phase: after the external force disappears, the elastic force of the spring causes the swashplate to move downward, and the circumferential guide protrusion moves downward along the guide slope of the upper guide member, causing the swashplate to continue to rotate 180 degrees; thus completing a full 360-degree rotation cycle.

[0014] Further technical solutions include adaptive adjustment: The cleaning process has an adaptive adjustment mechanism: when the swing amplitude of the cleaning equipment is small, the reversing rod does not complete a full rotation cycle, and the wafer clamping plate maintains a relatively stable angle for cleaning; when the swing amplitude of the cleaning equipment is large enough, the reversing rod completes a full 360-degree rotation and 180-degree reversal; thus achieving automatic matching between cleaning intensity and reversal frequency.

[0015] Further technical solutions and application scope: The method is applicable to the cleaning process of quartz wafers, silicon wafers, and sapphire wafers, and effectively reduces residual contaminants on the wafer surface through dynamic reversal cleaning.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. Significantly Improved Cleaning Performance: The wafer clamping plate can periodically change its tilt angle during the cleaning process, achieving multi-angle and all-around cleaning coverage. Compared to the traditional fixed vertical cleaning method, dynamic reversal allows the cleaning fluid to impact the wafer surface from different directions, effectively avoiding the generation of cleaning dead zones. In particular, for fine impurities such as abrasive sand and metal particles in the gaps between the wafer clamping plates, the turbulence effect and impact force generated by the periodic change of the tilt angle can more effectively flush out stubborn contaminants.

[0017] 2. Ingenious and Efficient Structural Design: The entire device employs a purely mechanical design, requiring no additional power source, control system, or electrical components. It achieves 180-degree periodic reversal solely through the reciprocating motion of the cleaning equipment itself. This design not only significantly reduces equipment complexity and manufacturing costs but also avoids the risk of electrical failures, exhibiting excellent reliability and safety in cleaning fluid environments.

[0018] 3. Adaptive Adjustment Mechanism: Through the combination of the elastic restoring force of the spring and the multi-stage guide ramp structure, the system can automatically adapt to different cleaning intensities and frequencies. The up-and-down movement amplitude of the reversing rod can be automatically adjusted according to the depth of the cleaning tank and the up-and-down movement amplitude of the cleaning equipment, realizing automatic matching between cleaning intensity and reversing frequency, and ensuring optimal cleaning results under different cleaning conditions.

[0019] 4. Simple and economical maintenance: The modular design of the deflection structure allows for independent replacement of damaged components, resulting in low maintenance costs. The manufacturing cost of the entire system is significantly lower than that of electric or pneumatic commutation devices, offering a substantial economic advantage.

[0020] 5. Improved Product Quality: Dynamic commutation cleaning effectively reduces residual contaminants on the wafer surface, lowering the defect rate in subsequent processes. Especially for cleaning high-precision semiconductor wafers, it ensures higher standards of surface cleanliness, thereby improving the yield and reliability of the final product.

[0021] 6. Wide range of applications: This device is not only suitable for cleaning quartz wafers, but can also be applied to the cleaning processes of various semiconductor substrates such as silicon wafers and sapphire wafers, and has good versatility and promotional value. Attached Figure Description

[0022] Figure 1 : A schematic diagram of the overall structure of the cleaning basket; Figure 2 : A schematic diagram of the overall structure of the movable top cover, showing the installation of a deflection mechanism; Figure 3 : Schematic diagram of the overall structure of the quartz wafer dynamic reversing cleaning basket device; Figure 4 : Figure 3 The enlarged view at point A shows the connection between the movable top cover, the cleaning basket, and the deflection structure; Figure 5 Left view of the device; Figure 6 :for Figure 5 The full cross-sectional view of the AA shows a schematic diagram of the reversing swing of the wafer clamping plate; Figure 7 Example 1: Schematic diagram of the dynamic reversal activity of the deflection structure; Figure 8 : Schematic diagram of the cleaning basket being fixed to the cleaning cage.

[0023] Reference numerals: 001. Cleaning basket; 002. Movable top cover; 003. Deflection structure; 010. Wafer clamping plate; 011. Basket frame; 012. Handle; 013. Fence; 020. Cleaning cage; 031. Tubular mounting base; 032. Reversing rod; 033. Spring; 034. Lower guide; 035. Upper guide; 036. Circumferential guide protrusion; 037. Eccentric head; 038. Vertical protrusion; 039. Deflection plate; 041. First inclined surface; 042. Second inclined surface; 051. Third inclined surface; 052. Fourth inclined surface; 111. Vertical slot; 222. Horizontal slot; 391. Long slot. Detailed Implementation

[0024] The following is combined Figures 1-8 This invention describes a quartz wafer dynamic reversing cleaning basket device.

[0025] Example 1: See Figure 3 This embodiment provides a quartz wafer cleaning device, including a cleaning basket 001 with an overall rectangular shape, a movable top cover 002 that provides upper constraint for the wafer clamping plate 10, and a deflection structure 003 that drives the movable top cover to translate.

[0026] See Figure 1 The cleaning basket 001 includes: a basket frame 011 providing lower support for the wafer mounting plate 10; handles 012 welded and fixed to both sides of the basket frame 011; and two railings 013 fixed to both sides of the basket frame 011. Specifically, as... Figure 1 , Figure 2 , Figure 4As shown, the basket frame 011 has multiple sets of vertical slots 111 spaced parallel to each other along its length. Each set of vertical slots 111 consists of one symmetrical slot located on each side of the basket frame 011, and each set of vertical slots 111 is used to support one wafer mounting plate 10. Typically, the width of the vertical slot 111 is 6-8mm, with a 4-5mm clearance relative to the thickness (2-3mm) of the wafer mounting plate 10. Compared to the prior art, this clearance is larger to accommodate the swinging of the wafer mounting plate 10. Preferably, the bottom of the vertical slot 111 has a secondary shallow groove with a width matching the thickness of the wafer mounting plate 10, serving as a positioning point for the wafer mounting plate 10 and making the swing more stable.

[0027] See Figure 2 The movable top cover 002 has a rectangular through hole in the center. Horizontal slots 222, with a number not less than the vertical slots 111, are provided on both sides of the through hole corresponding to the vertical slots 111 of the basket frame 011. The horizontal slots 222 are used to constrain the upper edge of the wafer clamping plate 10, and have an approximately 1mm clearance from the wafer clamping plate 10. The movable top cover 002 covers the basket frame 011 by its own weight. Furthermore, a limiting bolt extending into the bottom of the fence 013 can be provided at a position lower than the fence 013.

[0028] The wafer mounting plate 10 has a structure that is existing technology and is not an improvement of this embodiment. Therefore, it will not be described here. Only the installation method in this embodiment is described: the bottom edge of each wafer mounting plate 10 is embedded in a set of corresponding vertical slots 111, and the upper edge is embedded in a corresponding horizontal slot 222, forming an installation method with upper and lower constraints.

[0029] The spacing between the two guardrails 013 matches the width of the wafer clamping plate 10 to prevent the wafer clamping plate 10 from shifting laterally during the cleaning process.

[0030] At least one deflection structure 003 is provided and located at one end of the basket frame 011, preferably at both ends of the basket frame 011. This has the advantages of: a dual-end configuration ensures more even force distribution on the movable cover 002 during horizontal reciprocating movement, avoiding torsional stress and uneven deformation that may occur with single-end drive, and ensuring that the movable cover 002 always remains horizontal. Furthermore, the simultaneous operation of both deflection structures 003 ensures synchronous movement at both ends of the movable cover 002, eliminating the swaying or shaking that may occur with single-end drive, resulting in smoother and more precise changes in the tilt angle of the wafer clamping plate 10. Additionally, even if one deflection structure 003 fails, the other end can still provide partial reversing functionality, improving the system's fault tolerance and facilitating separate inspection and maintenance.

[0031] Each deflection structure 003 includes the following components: A tubular mounting base 031 is vertically fixed at the end of the basket frame 011; used to mount the moving parts of the deflection structure 003. A reversing rod 032 is coaxially mounted in the tubular mounting base 031; the reversing rod 032 can move up and down within the tubular mounting base 031 and rotate around its own axis; A spring 033 is mounted on the lower part of the reversing lever 032. The lower end of the spring 033 abuts against the bottom of the tubular mounting base 031, and the upper end supports the lower guide 034, providing the reversing lever 032 with a downward elastic restoring force. The lower guide 034, which is fixed to the reversing rod 032, is located above the spring 033 and has a guide slope structure on its upper edge. The upper guide 035, which is fixed to the reversing rod 032, is located above the lower guide 034 and has a guide slope structure on its lower edge. A circumferential guide protrusion 036 is provided on the outer circumference of the middle part of the reversing lever 032, located in the annular space between the upper guide 035 and the lower guide 034; An eccentric head 037 is fixedly installed at the upper end of the reversing rod 032, and a vertical protrusion 038 is provided on it; The deflection plate 039 is fixed to the end of the movable cover 002 by bolts, and the deflection plate 039 has an elongated hole 391.

[0032] Guide slope structure: like Figure 7 As shown, the guide ramp of the upper guide 035 includes: First inclined plane 041: It slowly slopes upwards, guiding the circumferential guide protrusion 036 to rise and causing the reversing rod 032 to rotate; Second inclined plane 042: It slopes sharply downward from the highest point of the first inclined plane 041, and the inclination angle of the second inclined plane 042 is greater than that of the first inclined plane 041; The guide ramp of the lower guide 034 includes: Third inclined plane 051: It slopes sharply from bottom to top, with a greater angle of inclination than the fourth inclined plane 052; Fourth slope 052: Slowly slopes downward from the highest point of the third slope 051; The height relationship of the inclined planes is as follows: the lowest point of the third inclined plane 051 is lower than the lowest point of the fourth inclined plane 052, and the lowest point of the first inclined plane 041 is higher than the lowest point of the second inclined plane 042.

[0033] Connection and mating relationships: The vertical protrusion 038 of the eccentric head 037 passes through the elongated hole 391 of the deflection plate 039 from below, forming a sliding fit between the two. When the reversing rod 032 rotates, the eccentric head 037 rotates synchronously, and the vertical protrusion 038 makes an eccentric movement within the elongated hole 391, pushing the deflection plate 039 and the movable upper cover 002 to move horizontally back and forth.

[0034] Reference Figure 7 Working principle: like Figure 3 , Figure 5 As shown, when the cleaning basket 001 is fixedly placed in the cleaning cage 20 for cleaning operations: Initial contact: The cleaning cage 20 drives the cleaning basket 001 to move up and down in the cleaning solution, and the bottom of the reversing rod 032 contacts the bottom surface of the cleaning tank; Rising phase: The reversing lever 032 is subjected to an upward thrust, and the peripheral guide protrusion 036 first contacts the third inclined surface 051 of the lower guide 034, and moves upward along the third inclined surface 051 to the highest point. During this process, the reversing lever 032 rotates about 90 degrees. Continue to rise: the peripheral guide protrusion 036 continues to move upward along the fourth inclined plane 052, and the reversing rod 032 continues to rotate 90 degrees to complete a 180-degree rotation; Descent phase: When the external force disappears, the elastic force of the spring 033 causes the reversing rod 032 to move downward. The circumferential guide protrusion 036 contacts the first inclined surface 041 of the guide member 035 and moves downward along the first inclined surface 041. The reversing rod 032 rotates 90 degrees again. Returning to the initial position: The peripheral guide protrusion 036 continues to move downward along the second inclined plane 042, and the reversing rod 032 completes the last 90-degree rotation, completing a total of 360-degree full rotation cycle; During each up-and-down movement cycle, the reversing rod 032 rotates 180 degrees, causing the eccentric head 037 to rotate 180 degrees, which changes the position of the vertical protrusion 038 within the elongated hole 391, pushing the deflection plate 039 and the movable upper cover 002 to make horizontal displacement, thereby changing the tilt angle of the wafer clamping plate 10.

[0035] Technical effects: Through the aforementioned deflection structure 003 and dynamic commutation mechanism, the present invention achieves the following significant technical effects: 1. Significantly improved cleaning effect: The wafer mounting plate 10 can periodically change its tilt angle during the cleaning process, achieving multi-angle and all-round cleaning coverage. Compared with the traditional fixed vertical cleaning method, dynamic reversal allows the cleaning fluid to impact the wafer surface from different directions, effectively avoiding the generation of cleaning dead zones. In particular, for fine impurities such as abrasive sand and metal particles in the gaps between the wafer mounting plates, the turbulence effect and impact force generated by the periodic change of the tilt angle can more effectively flush out these stubborn contaminants.

[0036] 2. Ingenious and efficient structural design: The entire device employs a purely mechanical design, requiring no additional power source, control system, or electrical components. It achieves 180-degree periodic reversal solely through the up-and-down reciprocating motion of the cleaning equipment itself. This design not only significantly reduces equipment complexity and manufacturing costs but also avoids the risk of electrical failures, exhibiting excellent reliability and safety in cleaning fluid environments.

[0037] 3. Adaptive adjustment mechanism: Through the elastic restoring force provided by spring 033 and the cooperation of the multi-stage guide inclined structure (first inclined surface 041, second inclined surface 042, third inclined surface 051, fourth inclined surface 052), the system can automatically adapt to different cleaning intensities and frequencies. The up-and-down movement range of the reversing rod 032 can be automatically adjusted according to the depth of the cleaning tank and the up-and-down movement range of the cleaning equipment. Reversal is not completed with every up-and-down movement; for example: During small-amplitude movements: When the swing amplitude of the cleaning equipment is small or the contact time between the reversing rod 032 and the bottom of the pool is short, the peripheral guide protrusion 036 may only contact part of the guide slope and will not complete a complete 360-degree rotation cycle. At this time, the wafer clamping plate 10 maintains a relatively stable angle for cleaning. During large-amplitude movements: When the swing amplitude of the cleaning equipment is large enough, allowing the reversing rod 032 to have sufficient up and down travel, the circumferential guide protrusion 036 can completely pass through all the guide ramps, completing a 360-degree rotation and a 180-degree reversal; Progressive response: As the cleaning intensity increases, the reversing frequency also increases accordingly, achieving automatic matching between cleaning intensity and reversing frequency.

[0038] This intelligent adaptive mechanism ensures optimal cleaning results under different cleaning conditions: it avoids ineffective reversal when the cleaning intensity is insufficient, and ensures sufficient reversal during intensive cleaning, making the entire cleaning process more efficient and stable.

[0039] 4. Easy and economical to maintain: The modular design of the deflection structure 003 allows for independent replacement of individual components when damaged, resulting in low maintenance costs. The manufacturing cost of the entire system is more than 60% lower than that of electric or pneumatic commutation devices, offering significant economic advantages.

[0040] 5. Improve product quality: Dynamic commutation cleaning effectively reduces residual contaminants on the wafer surface, lowering the defect rate in subsequent processes. Especially for cleaning high-precision semiconductor wafers, it ensures higher standards of surface cleanliness, thereby improving the yield and reliability of the final product.

[0041] 6. Wide range of applications: This device is not only suitable for cleaning quartz wafers, but can also be applied to the cleaning processes of various semiconductor substrates such as silicon wafers and sapphire wafers, demonstrating its versatility and potential for widespread adoption.

[0042] Through the above technical means, this invention fundamentally solves the technical problems of low efficiency and incomplete cleaning in traditional static cleaning methods, and provides an efficient, reliable and economical solution for semiconductor wafer cleaning processes.

[0043] Example 2: Alternative deflection structure options: Option 1: Ballpoint pen-style press-to-switch mechanism.

[0044] Product example: Ballpoint pen press-to-extract / retract mechanism.

[0045] Structural components: Lifting and pressing lever: Equivalent to the pressing cap of a ballpoint pen, it generates thrust as the cleaning basket moves up and down; Built-in cam disk: The disk has serrated cam grooves, similar to the rotating disk inside a ballpoint pen; Pawl mechanism: works with cam disk, each press rotates the cam disk by a fixed angle (e.g., 60 degrees); Eccentric drive head: Fixed on the cam disk, the eccentric distance is designed to produce horizontal displacement when it rotates; Connecting arm: Transmits the motion of the eccentric drive head to the movable top cover.

[0046] Working principle: Each time the cleaning basket rises, the pressing lever receives an upward thrust, and the pawl pushes the cam plate to rotate 60 degrees. After six up-and-down movements, a 360-degree cycle is completed. The eccentric motion of the eccentric drive head pushes the movable cover to swing left and right through the connecting arm, realizing the periodic change of the tilt angle of the wafer clamping plate.

[0047] Option 2: Keyboard key-triggered reset mechanism. Example product: Mechanical keyboard key mechanism.

[0048] Structural components: Trigger lever: Equivalent to the key lever on a keyboard, it accepts up and down movement input; Return spring: Provides rebound force, similar to the rebound mechanism of a keyboard key; Bistable switcher: It adopts a bistable structure similar to a keyboard microswitch; Swinging transmission arm: One end is connected to a bistable switcher, and the other end is connected to a movable top cover; Limit guide rail: restricts the movement trajectory of the transmission arm.

[0049] Working principle: As the washing basket descends, the trigger lever contacts the bottom of the pool, generating an upward thrust, similar to pressing a keyboard key. The bistable switch instantly changes state upon reaching the trigger point, causing the swing arm to swing from one extreme position to the other. When the external force disappears, the return spring returns the trigger lever to its initial position, but the bistable switch remains in the new state until the next trigger.

[0050] The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to replace them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.

Claims

1. A semiconductor wafer dynamic reversing cleaning basket device, characterized in that, include: Cleaning basket (001) includes: The basket frame (011) has multiple sets of vertical slots (111) arranged parallel to each other on both sides along its length direction for supporting the wafer mounting plate (10). The movable top cover (002) has a rectangular through hole in the center, and horizontal slots (222) are provided on both sides of the through hole corresponding to the vertical slots (111) of the basket frame (011) to constrain the upper edge of the wafer clamping plate (10); A deflection structure (003) is provided at the end of the basket (011) for driving the movable cover (002) to move horizontally back and forth; In this case, the bottom edge of each wafer mounting plate (10) is embedded in a corresponding set of vertical slots (111), and the upper edge is embedded in a corresponding horizontal slot (222), forming an installation method with upper and lower constraints. When the cleaning basket (001) moves up and down in the cleaning solution, the deflection structure (003) responds to the up and down movement and drives the movable cover (002) to move horizontally back and forth, thereby periodically changing the tilt angle of the wafer clamping plate (10) to achieve dynamic reversing cleaning.

2. The semiconductor wafer dynamic reversing cleaning basket device according to claim 1, characterized in that, The deflection structure (003) includes: A tubular mounting base (031) is vertically fixed at the end of the basket frame (011); The reversing rod (032) is coaxially mounted in the tubular mounting base (031) and can move up and down and rotate around its own axis within the tubular mounting base (031); A spring (033) is ring-mounted on the lower part of the reversing rod (032), with its lower end abutting against the bottom of the tubular mounting base (031), providing the reversing rod (032) with a downward elastic restoring force; The lower guide (034) and the upper guide (035) are ring-fixed on the reversing rod (032) and are respectively provided with guide slope structure; A circumferential guide protrusion (036) is provided on the outer circumference of the middle part of the reversing rod (032); An eccentric head (037) is fixedly installed on the upper end of the reversing rod (032), and a vertical protrusion (038) is provided on it. The deflection plate (039) is fixed to the end of the movable cover (002) and has an elongated hole (391). The vertical protrusion (038) passes through the elongated hole (391) to form a sliding fit.

3. The semiconductor wafer dynamic reversing cleaning basket device according to claim 2, characterized in that, The guide slope of the upper guide (035) includes a first slope (041) and a second slope (042). The first slope (041) gradually slopes upward from bottom to top, and the second slope (042) slopes sharply downward from the highest point of the first slope (041). The guide slope of the lower guide (034) includes a third slope (051) and a fourth slope (052). The third slope (051) slopes sharply upward from bottom to top, and the fourth slope (052) slopes slowly downward from the highest point of the third slope (051). Among them, the inclination angle of the second inclined plane (042) is greater than that of the first inclined plane (041), and the inclination angle of the third inclined plane (051) is greater than that of the fourth inclined plane (052).

4. The semiconductor wafer dynamic reversing cleaning basket device according to claim 1, characterized in that, The transverse slot (222) and the wafer clamping plate (10) have an active gap of about 1 mm; The bottom of the vertical slot (111) is provided with a secondary shallow groove whose width matches the thickness of the wafer clamping plate (10).

5. The semiconductor wafer dynamic reversing cleaning basket device according to claim 1, characterized in that, The cleaning basket (001) also includes: Handles (012) are welded and fixed to both sides of the basket frame (011); Two railings (013) are fixed on both sides of the basket frame (011). The spacing of the railings (013) matches the width of the wafer clamping plate (10) to prevent the wafer clamping plate (10) from shifting laterally during the cleaning process.

6. The semiconductor wafer dynamic reversing cleaning basket device according to claim 1, characterized in that, The deflection structure (003) is set at both ends of the basket frame (011). The deflection structures (003) set at both ends work synchronously to ensure that the movable cover (002) is subjected to uniform force when it moves horizontally back and forth, and maintains a horizontal state.

7. A method for dynamic reversing cleaning of semiconductor wafers, characterized in that, Includes the following steps: Step 1: Install the wafer clamping plate (10) in the cleaning basket device according to claim 1. The bottom edge of each wafer clamping plate (10) is embedded in the corresponding vertical slot (111), and the upper edge is embedded in the corresponding horizontal slot (222). Step 2: Place the cleaning basket (001) containing the wafer clamping plate (10) into the cleaning tank; Start the cleaning equipment to make the cleaning basket (001) move up and down in the cleaning solution; During the up-and-down movement, the bottom of the reversing rod (032) of the deflection structure (003) contacts the bottom surface of the cleaning tank, obtains an upward thrust, drives the reversing rod (032) to rotate, and pushes the movable cover (002) to move horizontally back and forth through the eccentric head (037); Dynamic multi-angle cleaning is achieved by periodically changing the tilt angle of the wafer clamping plate (10) through the horizontal reciprocating movement of the movable cover (002).

8. The method according to claim 7, characterized in that, The rotation process of the reversing lever (032) includes: Rising phase: The reversing lever (032) is pushed upward, and the circumferential guide protrusion (036) moves upward along the guide slope of the lower guide (034), causing the reversing lever (032) to rotate 180 degrees; Descent phase: After the external force disappears, the elastic force of the spring (033) causes the reversing rod (032) to move downward, and the peripheral guide protrusion (036) moves downward along the guide slope of the upper guide (035), causing the reversing rod (032) to continue to rotate 180 degrees; Complete a full 360-degree rotation cycle.

9. The method according to claim 7, characterized in that, The cleaning process has an adaptive adjustment mechanism: When the oscillation amplitude of the cleaning equipment is small, the reversing rod (032) does not complete a full rotation cycle, and the wafer clamping plate (10) maintains a relatively stable angle for cleaning; When the swing amplitude of the cleaning equipment is large enough, the reversing rod (032) completes a full 360-degree rotation and 180-degree reversal; It achieves automatic matching between cleaning intensity and commutation frequency.

10. The method according to claim 7, characterized in that, The method is applicable to the cleaning process of quartz wafers, silicon wafers, and sapphire wafers, and effectively reduces residual contaminants on the wafer surface through dynamic reversal cleaning.

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