Manufacturing method of lens module, mold, lens module and sensor device

Abstract

The invention relates to the technical field of semiconductor luminescence, and discloses a manufacturing method of a lens module, a mold, the lens module and a sensor device. The manufacturing method comprises the following steps: S1, arranging at least two cavity structures with upper and lower openings in the bearing part; the upper mold and the lower mold are each internally provided with a mold cavity with an opening in one side. And mold cavities of the upper mold and the lower mold extend into the cavity structure from the upper opening end and the lower opening end of the bearing part correspondingly to be aligned and closed. And a gap is reserved between the upper mold and the lower mold in the mold closing process. And S2, a mold cavity for mold closing is filled with the light-transmitting glue, and the redundant light-transmitting glue flows out through gaps in the peripheries of the upper mold and the lower mold and adheres to the inner wall of the bearing part. And S3, after curing, the upper mold and the lower mold are moved away, and a first lens and a second lens are formed in the two cavity structures respectively. The manufacturing method is simple and high in efficiency, and the manufactured sensor device is simple and stable in structure, good in sealing performance, high in precision and easy to optically design.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor light emitting, and particularly relates to a lens module manufacturing method, a mold, a lens module, and a sensor device. BACKGROUND

[0002] In order to prevent the emitted light and the received light from interfering with each other, the sensor device with at least two light chips 5 for emitting light and receiving light usually uses a light-absorbing structure made of a light-proof material to isolate them (see Figure 21 The structure and manufacturing method of the existing sensor device are as follows:

[0003] Prior art one:

[0004] Step A1: refer to Figure 16 , fix at least two light chips 5 on the substrate 4, and cover the light-transmitting lens 2 above the light chips 5. The lens 2 has the functions of packaging the light chips 5 and adjusting the emitted light and the received light.

[0005] Step A2: refer to Figure 17 , cut a second groove 6 on the lens 2 between the light-emitting chip and the light-sensitive chip and around the light-emitting chip and the light-sensitive chip, so that the substrate 4 in the area where the second groove 6 is located is exposed, so that the receiving part 1 formed in the later process is directly connected with the substrate 4. This setting is because the adhesion of the receiving part 1 to the lens 2 is not as firm as the adhesion of the receiving part 1 to the substrate 4.

[0006] Step A3: use point gluing, injection molding or molding and other methods to directly cover the receiving part 1 in the second groove 6 or on the side and part of the top surface of the lens 2 adjacent to the second groove 6, refer to Figure 18 . The receiving part 1 has the function of preventing the light emitted by the light-emitting chip and the light-sensitive chip from interfering with each other and mixing light.

[0007] The method of prior art one uses point gluing, injection molding or molding and other methods to directly form the receiving part 1 in the second groove 6, which has the advantages of simple manufacturing method and good sealing performance. However, there is a problem that the part of the receiving part 1 adhered to the lens 2 is easily separated due to stress, resulting in poor stability of the entire structure.

[0008] Prior art two: steps A1 and A2 are the same as prior art one, and the difference lies in step A3. Refer to Figure 19 , step A3: make the receiving part 1 matching the second groove 6 in advance, apply adhesive on the bottom of the receiving part 1, insert the receiving part 1 into the second groove 6 and glue it to the substrate 4, and form the sensor device after curing. Figure 20

[0009] ​The method of the prior art two is that the receiving part 1 is pre-made, and then the receiving part 1 is assembled with the substrate 4 on which the lens 2 is fixed. Since the receiving part 1 is only fixedly connected with the substrate 4 and is not connected with the lens 2, there is no stress shedding problem with the lens 2. The existing problems are: 1. Since the size of the second groove 6 is small, the processing precision of the receiving part 1 and the assembly precision of the receiving part 1 and the second groove 6 are required to be high, the processing difficulty is great, and the yield and production efficiency are low. 2. Since it is assembled, there is a space allowance for assembly between the side wall of the receiving part 1 and the side wall of the second groove 6, so the sealing performance is poor.

[0010] Based on the above, the problems to be solved at present are: to provide a lens module manufacturing method and mold with simple and efficient process, and to provide a lens module with stable structure, good sealing performance and a sensor device with high precision. SUMMARY

[0011] The purpose of the present application is to provide a lens module manufacturing method, mold, lens module and sensor device, aiming to solve the problems in the prior art that the lens and receiving part of the lens module have complex forming process and low production efficiency, the reliability and sealing performance of the lens module are poor, and the precision of the sensor device is not high.

[0012] The present application is implemented as follows: a lens module manufacturing method, comprising the following steps:

[0013] Step S1, the receiving part is provided with at least two upper and lower open cavity structures; the upper mold and the lower mold are respectively provided with a side opening mold cavity; the mold cavities of the upper mold and the lower mold are respectively inserted into the cavity structure from the upper and lower opening ends of the receiving part for alignment and molding, and a gap is left between the upper mold and the lower mold during the molding process;

[0014] Step S2, fill the mold cavities of the mold with light-transmitting glue, and the excess light-transmitting glue flows out through the gap around the upper mold and the lower mold and is bonded to the inner wall of the receiving part;

[0015] Step S3, after curing, remove the upper mold and the lower mold to form a lens in the cavity structure, and the lens at least includes a first lens and a second lens formed in different cavity structures.

[0016] Further, step S1 further includes step S0 before step S1.

[0017] Step S0, distribute the light-transmitting glue in the mold cavities of the upper mold and / or the lower mold.

[0018] Further, the inner wall of the cavity structure in step S2 is provided with a first groove corresponding to the gap of the upper mold and the lower mold during molding; the mold cavities of the mold are filled with light-transmitting glue, and the excess light-transmitting glue flows out through the gap around the upper mold and the lower mold and flows into the first groove and is bonded to the inner wall of the receiving part.

[0019] Further, step S2 fills the mold cavity after the mold closing with injection of light-transmitting glue.

[0020] A mold for the manufacturing method of the lens module, comprising an upper mold and a lower mold, the upper mold and the lower mold are respectively provided with a mold cavity for light-transmitting glue to be molded between the upper mold and the lower mold; the upper mold and the lower mold are provided with a limiting plate for mold positioning on the side away from the mold cavity.

[0021] Further, the length of the limiting plate is greater than the length between the two side inner walls of the corresponding cavity structure, for clamping the end of the cavity structure during the mold closing process.

[0022] A lens module manufactured by the manufacturing method of the lens module, comprising:

[0023] A receiving part provided with at least two open upper and lower cavity structures;

[0024] A lens comprising at least a first lens and a second lens, the first lens and the second lens are respectively arranged in the two cavity structures; the lens is an optical functional area for optical adjustment of outgoing light or / and received light.

[0025] Further, the receiving part is a non-optical functional area for supporting the lens and isolating the light of the first lens and the second lens.

[0026] Further, the inner wall of the receiving part is provided with a first groove for connecting the peripheral edge of the optical lens.

[0027] A sensor device using the lens module, further comprising:

[0028] A substrate arranged below the lens;

[0029] A light chip comprising a light-emitting chip for emitting light and a photosensitive chip for receiving light; the light-emitting chip is arranged on the substrate below the first lens; the photosensitive chip is arranged on the substrate below the second lens.

[0030] Compared with the prior art, the manufacturing method of the lens module, the mold, the lens module and the sensor device provided by the present application have the following beneficial effects:

[0031] The manufacturing method of the sensor device of the present application adopts the method of pre-forming the lens 2 in the cavity structure 11 of the receiving part 1, reserving space for packaging the optical chip 5 at the lower part of the lens 2, and bonding the bottom or the bottom and part of the side of the receiving part 1 with the substrate 4. Compared with the prior art 1 and 2, the present application has the following advantages: 1. The manufacturing method of the present application can fix the lens 2 on the receiving part 1 while forming the lens 2, which is simple and efficient; 2. The receiving part 1 is firmly combined with the substrate 4; 3. The process of cutting the second groove 6 is saved, and the production process is simple; 4. The manufacturing precision and assembly precision are low, the yield is high, the sealing performance is good, and the precision is high.

[0032] The lens module of the present application comprises the lens 2 with optical function and the receiving part 1 for preventing the light of different optical function zones of the lens 2 from interfering with each other. The first lens 21 and the second lens 22 are pre-provided in the cavity structure 11 of the receiving part 1. Compared with the prior art 1 and 2, the lens 2 is not connected with the substrate 4, and no longer depends on the support of the substrate 4, so as not to affect the connection of the receiving part 1 with the substrate 4. The stability of the bonding of the receiving part 1 with the substrate 4 can be realized by properly adjusting the bonding area between the receiving part 1 and the substrate 4, and the cavity structure 11 provides sufficient space for the bonding glue of the receiving part 1 and the substrate 4. The bottom or the bottom and part of the side of the receiving part 1 is bonded with the substrate 4, the overall structure is stable, and the sealing performance is better.

[0033] Meanwhile, space for packaging the optical chip 5 is reserved at the lower part of the lens 2, which can be used to accommodate the optical chip 5 and for light propagation, which is beneficial to optical design. For example, the lower surface of the lens 2 can be designed in a surface shape to achieve a preset optical effect; or a "double-layer lens" can be formed between the optical chip 5 and the external atmosphere layer by utilizing the principle that the refractive index of different media is different, so as to perform optical design. The sensor device of the present application has the advantages of good reliability, good light control effect, and high precision.

[0034] The mold of the present application is provided as an upper mold 31 and a lower mold 32 which are separated from each other, and the lens 2 is formed by the way of molding by combining the upper mold 31 and the lower mold 32, which is simple and reasonable, and easy to combine and demold. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 is a partial state schematic diagram after step S0 of the manufacturing method of the lens module provided by the present application is implemented;

[0036] Figure 2 is a partial state schematic diagram after step S2 of the manufacturing method of the lens module provided by the present application is implemented;

[0037] Figure 3 is a partial state schematic diagram after step S3 of the manufacturing method of the lens module provided by the present application is implemented;

[0038] Figure 4 is a schematic diagram of the overall state after step S3 of the method for manufacturing the lens module according to the present application is implemented;

[0039] Figure 5 is a schematic diagram of the local state after step S3 of the first embodiment of the method for manufacturing the lens module according to the present application is implemented;

[0040] Figure 6 is a schematic diagram of the local cross-section of the first embodiment of the lens module according to the present application;

[0041] Figure 7 is a schematic diagram of the local state after step S3 of the second embodiment of the method for manufacturing the lens module according to the present application is implemented;

[0042] Figure 8 is a schematic diagram of the local cross-section of the second embodiment of the lens module according to the present application;

[0043] Figure 9 is a schematic diagram of the local state after step S3 of the third embodiment of the method for manufacturing the lens module according to the present application is implemented;

[0044] Figure 10 is a schematic diagram of the local cross-section of the third embodiment of the lens module according to the present application;

[0045] Figure 11 is a schematic diagram of the cross-section structure of the sensor device according to the present application;

[0046] Figure 12 is a schematic diagram of the three-dimensional structure of the mold according to the present application;

[0047] Figure 13 is a schematic diagram of the three-dimensional structure of the upper mold according to the present application;

[0048] Figure 14 is a schematic diagram of the three-dimensional structure of the lower mold according to the present application;

[0049] Figure 15 is a schematic diagram of the light path of the sensor device according to the present application;

[0050] Figure 16 is a schematic diagram of the state after step A1 of the method for manufacturing the sensor device of the prior art is implemented;

[0051] Figure 17 is a schematic diagram of the state after step A2 of the method for manufacturing the sensor device of the prior art is implemented;

[0052] Figure 18 is a schematic diagram of the state after step A3 of the method for manufacturing the sensor device of the prior art is implemented;

[0053] Figure 19 is a schematic diagram of the implementation process of step A3 of the manufacturing method of the sensor device of prior art 2;

[0054] Figure 20 is a schematic diagram of the state after implementation of step A3 of the manufacturing method of the sensor device of prior art 2;

[0055] Figure 21 is a top view of the sensor device of prior art;

[0056] In the figure: 1-adapter; 11-cavity structure; 12-first groove; 2-lens; 21-first lens; 22-second lens; 31-upper mold; 32-lower mold; 301-mold cavity; 302-limiting plate; 4-substrate; 5-optical chip; 6-second groove. DETAILED DESCRIPTION

[0057] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application is further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application and do not limit the present application.

[0058] The implementation of the present application is described in detail below in combination with specific examples.

[0059] The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar parts; in the description of the present application, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate the orientation or positional relationship shown in the drawings, they are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore the terms describing the positional relationship in the drawings are only used for illustrative purposes, and cannot be understood as a limitation of the present patent, for those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0060] Referring to Figures 1-15 , a preferred embodiment provided by the present application is shown.

[0061] A manufacturing method of a lens module, comprising the following steps:

[0062] Step S1, at least two upper and lower opening cavity structures 11 are provided in the adapter 1. The upper mold 31 and the lower mold 32 are respectively provided with a one-side opening mold cavity 301. Referring to Figure 2, only one cavity structure 11 is shown in the figure, another cavity structure 11 is not shown in the figure, and the manufacturing method is the same. After the receiving part 1 is placed, the mold cavity 301 of the upper mold 31 and the lower mold 32 respectively extends into the cavity structure 11 from the upper and lower opening ends of the receiving part 1, and the mold cavity 301 of the upper mold 31 and the lower mold 32 is aligned and closed. During the closing process, a gap is left between the upper mold 31 and the lower mold 32 for filling the excess transparent glue in the mold cavity 301, which flows out along the gap around the mold cavity 301 and adheres to the inner wall of the receiving part 1. The material of the receiving part 1 can be a transparent material or a light-absorbing material (such as black glue).

[0063] Step S2, fill the closed mold cavity 301 with transparent glue, and the shape of the mold cavity 301 is used to form the required optical interface. The excess transparent glue flows out through the gap around the mold cavity 301 of the upper mold 31 and the lower mold 32, and adheres to and fixes the inner wall of the receiving part 1, as shown in Figure 2 .

[0064] Step S3, after curing, remove the upper mold 31 and the lower mold 32, and form a transparent lens 2 for optical shaping in the cavity structure 11, as shown in the partial state schematic diagram Figure 3 and the overall state schematic diagram Figure 4 . The lens 2 includes a first lens 21 arranged in one cavity structure 11 for adjusting the output light, and a second lens 22 arranged in another cavity structure 11 for adjusting the received light. There is also space for placing the optical chip 5 in the cavity structure 11 below the first lens 21 and the second lens 22.

[0065] The manufacturing method of the lens module of the present application adopts the method of pre-forming the lens 2 in the cavity structure 11 of the receiving part 1, reserving space for packaging the optical chip 5 at the lower part of the lens 2, and bonding the bottom of the receiving part 1 or the bottom of the receiving part 1 and part of the side surface with the substrate 4. The combination of the receiving part 1 and the substrate 4 is firm. To increase the firmness of the bonding, the amount of adhesive used can also be appropriately increased. Compared with the prior art, the present application has more space for accommodating the adhesive, i.e. the adhesive can spread to part of the inner wall of the cavity structure 11 and part or all of the upper surface of the substrate 4, which is not easy to contaminate the lens 2. In addition, there is no need to cut out the second groove 6, the production process is simple, the manufacturing and assembly precision requirements are low, the production efficiency and yield are high, and the sensor device has good sealing performance and high precision.

[0066] There are two ways to fill the transparent glue during the closing process:

[0067] Method one, as shown in Figure 1 , a step S0 is set before step S1, and the transparent glue is distributed on the surface of the mold cavity 301 of the upper mold 31 and / or the lower mold 32.

[0068] In the mold closing process, the light-transmitting glue is extruded by the upper mold 31 and the lower mold 32, the mold cavity 301 of the upper mold 31 and the lower mold 32 is filled, the excess light-transmitting glue flows out along the gap around, the outflowing light-transmitting glue is connected with the inner wall of the receiving part 1, and the fixing effect is achieved.

[0069] In the second mode, the upper mold 31 and the lower mold 32 are combined to be provided with an injection port, the light-transmitting glue is injected through the injection port, the light-transmitting glue fills the mold cavity 301 of the mold closing, the excess light-transmitting glue flows out from the injection port, and meanwhile, the excess light-transmitting glue flows out along the gap around, the outflowing light-transmitting glue is connected with the inner wall of the receiving part 1, and the fixing effect is achieved.

[0070] The manufacturing method of the present application can fix the lens 2 on the receiving part 1 while forming the lens 2, and the process is simple and efficient. In the mold closing process, the excess light-transmitting glue flows out along the gap between the upper mold 31 and the lower mold 32, and spreads upwards and downwards on the inner wall of the cavity structure 11. The amount of the light-transmitting glue can control the bonding area of the periphery of the lens 2 and the cavity structure 11, that is, the lens 2 can be connected with part or all of the inner wall of the cavity structure 11, and the details are shown in the following. Figures 7-8 The area of the inner wall of the cavity structure 11 is large, so that the lens 2 is more firmly connected with the receiving part 1 than the prior art, and the stress influence is small.

[0071] In the optimization scheme, the inner wall of the cavity structure 11 in the step S2 is provided with a first groove 12 for accommodating the light-transmitting glue, which corresponds to the gap of the mold closing of the upper mold 31 and the lower mold 32. The first groove 12 can be a stepped groove, and the details are shown in the following. Figure 2 The first groove 12 can also be a notch-shaped groove which is recessed towards the inside of the receiving part 1, and the details are shown in the following. Figure 5 The specific structure is set according to the needs, and is not limited to the above structure, as long as the first groove 12 for accommodating and reinforcing is within the technical scheme of the present application. The light-transmitting glue fills the mold cavity 301 of the mold closing, the excess light-transmitting glue flows out along the gap around, and flows into the first groove 12 to bond with the inner wall of the receiving part 1, and the periphery of the lens 2 extends into the first groove 12. At the same time, the lens 2 can bond with the inner wall of the cavity structure 11 above and / or below the first groove 12, so that the lens 2 is more firmly connected with the receiving part 1.

[0072] A manufacturing method of a sensor device, which comprises the manufacturing method of the lens module described in the present specification, and further comprises a step S4 after the step S3. In the step S4, the cavity structure 11 of the receiving part 1 is aligned with at least two optical chips 5 provided on the substrate 4 one by one, and then the receiving part 1 is bonded to the substrate 4, and the optical chips 5 are packaged in the cavity structure 11 on the substrate 4 below the lens 2, and the details are shown in the following. Figure 11The optical chip 5 preferably includes a light-emitting chip and a photosensitive chip. The manufacturing method of the sensor device of the present invention is simple, efficient, produces products with good stability and sealing, requires low manufacturing and assembly precision, and achieves high accuracy.

[0073] The mold used in the lens module manufacturing method of this manual is referred to... Figure 12 The mold includes an upper mold 31 and a lower mold 32. (See reference...) Figures 13-14 The upper mold 31 and lower mold 32 are respectively provided with mold cavities 301 recessed into the upper mold 31 and lower mold 32. The mold cavities 301 are used for the light-transmitting adhesive to be molded between the upper mold 31 and lower mold 32. The upper mold 31 and lower mold 32 are provided with limiting plates 302 for mold closing positioning on the side away from the mold cavity 301. The length of the limiting plate 302 is greater than the length between the two outer walls of the mold cavity 301, that is, the length of the limiting plate 302 is greater than the length of the opening of the cavity structure 11 of the receiving part 1, so that the limiting plate 302 can be locked at the two ends of the receiving part 1, thereby controlling the length of the mold cavity 301 inserted into the cavity structure 11, and thus accurately controlling the mold closing position.

[0074] The upper mold 31 and the lower mold 32 are designed for easy demolding. The outer diameter of the upper mold 31, which extends into the cavity structure 11, is set to be the same at both the top and bottom (see reference). Figure 2 , Figure 5 Alternatively, the outer diameter of the mold cavity 301 end can be set to gradually decrease in the direction away from the limiting plate 302 (refer to...). Figure 9 The outer diameter of the cavity 301 of the lower mold 32's recessed cavity structure 11 is the same as that of the upper mold 31. Correspondingly, the diameter of the portion of the cavity structure 11 that accommodates the upper mold 31 is uniform, or the diameter of the portion of the cavity structure 11 that accommodates the upper mold 31 gradually decreases in the direction away from its opening; the diameter of the portion of the cavity structure 11 that accommodates the lower mold 32 is uniform, or the diameter of the portion of the cavity structure 11 that accommodates the lower mold 32 gradually decreases in the direction away from its opening. The structure that facilitates demolding is not limited to the above-described structure.

[0075] The mold of the present invention is configured as an upper mold 31 and a lower mold 32, which are separated into upper and lower parts. The lens 2 is formed by the two molds being closed together. This structure is simple and reasonable, and is easy to close and demold. The lengths of the outer walls on both sides of the cavity 301 of the upper mold 31 and the lower mold 32 are matched with the structure of the first groove 12, so that the four edges of the lens 2 after mold closing are formed in the first groove 12, or in the first groove 12 and on the inner wall of the cavity structure 11 above and / or below the first groove 12, making the overall structure more stable.

[0076] A lens module, as shown Figure 3, including a receiving part 1 and a lens 2. The receiving part 1 is provided with at least two cavity structures 11 with upper and lower openings. Figure 4 , the lens 2 comprises at least a first lens 21 and a second lens 22. The first lens 21 and the second lens 22 are respectively arranged in the two cavity structures 11.

[0077] The lens 2 is an optical functional area, that is, the lens 2 is made of a light-transmitting material and is used for optical adjustment of outgoing light or / and received light. The surface shape of the first lens 21 and the second lens 22 can be set according to optical needs.

[0078] The receiving part 1 is a non-optical functional area, which can be made of a light-transmitting material or a non-light-transmitting material according to needs, and is used for fixing the lens 2 and isolating the light of the first lens 21 and the second lens 22 to prevent light interference of the first lens 21 and the second lens 22. The material of the receiving part 1 is preferably a material with certain light absorption function, such as black glue.

[0079] In a preferred embodiment, to make the connection of the lens 2 and the receiving part 1 more stable, the inner wall of the receiving part 1 is provided with a first groove 12, and the four peripheral edges of the lens 2 are fixed in the first groove 12, that is, the lens 2 is placed in the first groove 12 by means of gluing, and is not easy to fall off, with high stability.

[0080] Embodiment one: a manufacturing method of a lens module, comprising the following steps:

[0081] Step S1, referring to Figure 5 , the receiving part 1 is provided with at least two cavity structures 11 with upper and lower openings, the cavity structure 11 is provided with a first groove 12 in the form of a notch recessing into the receiving part 1, and the diameters of the cavity structures 11 on both sides of the first groove 12 are consistent. The upper mold 31 and the lower mold 32 are respectively provided with a mold cavity 301 with one side opening, and the diameters of the outer walls at the ends of the mold cavities 301 of the upper mold 31 and the lower mold 32 are consistent.

[0082] The mold cavities 301 of the upper mold 31 and the lower mold 32 are respectively inserted into the cavity structures 11 from the upper and lower opening ends of the receiving part 1 for alignment and clamping, and a gap is left between the upper mold 31 and the lower mold 32 during the clamping process.

[0083] Step S2, the light-transmitting glue fills the clamped mold cavities 301, and the excess light-transmitting glue flows out through the gaps around the upper mold 31 and the lower mold 32 and flows into the first groove 12 to be bonded with the inner wall of the receiving part 1.

[0084] Step S3, after curing, the upper mold 31 and the lower mold 32 are removed. The lens 2 is formed in the cavity structure 11. The lens 2 comprises at least a first lens 21 and a second lens 22 formed in different cavity structures 11. The periphery of the lens 2 is connected with the first groove 12, referring to Figure 6 .

[0085] The main difference between the second embodiment and the first embodiment is that, referring to Figure 7 : the diameter of the cavity structure 11 above the first groove 12 is larger than the diameter of the cavity structure 11 below the first groove 12 in step S1. Correspondingly, the diameter of the outer wall of the mold cavity 301 end of the upper mold 31 is larger than the diameter of the outer wall of the mold cavity 301 end of the lower mold 32.

[0086] In step S2, the excess light-transmitting glue flows out through the gap between the upper mold 31 and the lower mold 32, and flows into the first groove 12 and adheres to the inner wall of the cavity structure 11 above and below the first groove 12 and the inner wall of the receiving part 1.

[0087] In step S3, the periphery of the lens 2 is connected with the inner wall of the cavity structure 11 above and below the first groove 12, referring to Figure 8 .

[0088] The other settings are the same as those of the first embodiment.

[0089] The main difference between the third embodiment and the first embodiment is that, referring to Figure 9 : the diameter of the cavity structure 11 above the first groove 12 gradually decreases in the direction away from the upper opening in step S1, and the diameter of the cavity structure 11 below the first groove 12 gradually decreases in the direction away from the lower opening. Correspondingly, the diameters of the outer walls of the mold cavities 301 ends of the upper mold 31 and the lower mold 32 are respectively set to gradually decrease in the direction away from the limiting plate 302.

[0090] Step S3 refers to Figure 10 .

[0091] The other settings are the same as those of the first embodiment.

[0092] A sensor device using the lens module of the present specification also includes a substrate 4 and a light chip 5, referring to Figure 11Lens 2 is fixed above substrate 4, and optical chip 5 is packaged between substrate 4 and lens 2. Optical chip 5 includes light-emitting chip and photosensitive chip for receiving light. Light-emitting chip is arranged in cavity structure 11 below first lens 21 on substrate 4. Photosensitive chip is arranged in another cavity structure 11 below second lens 22 on substrate 4. Light emitted by light-emitting chip reaches second lens 22 after refraction or / and reflection of first lens 21, and is received by second lens 22, and reaches photosensitive area of photosensitive chip after refraction or / and reflection of second lens 22, and is received and processed by photosensitive area. The sensor device of the present application has stable structure, good sealing property and high precision. Space for packaging optical chip 5 is reserved in lower part of lens 2, which is beneficial to optical design, and different surface profile design can be made through lower surface of first lens 21 and second lens 22 to achieve different optical effects such as divergence and convergence.

[0093] Working principle of sensor device Figure 15 Light emitted by light-emitting chip is emitted with preset exit angle, shape and brightness after optical shaping of first lens 21, and the emitted light irradiates to be detected and sensed object and is reflected, and the reflected light is incident to second lens 22 and is received by photosensitive chip after optical shaping of second lens 22, and the photosensitive chip converts the received light energy into electric energy and makes corresponding signal feedback. Lens 2 of the present application can be set to different surface profile and inclination angle according to different positions arranged in cavity structure 11. Lens 2 of prior art is tightly covered on optical chip 5, and the adjustable surface profile, angle and space of lens 2 are limited, so the sensor device of the present application is easy to optical design, has good optical adjustment effect and high detection precision.

[0094] Without limiting the present application, any modification, equivalent replacement and improvement within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for manufacturing a lens module, characterized in that, Includes the following steps: Step S1: The receiving part (1) is provided with at least two cavity structures (11) with upper and lower openings; the upper mold (31) and the lower mold (32) are respectively provided with mold cavities (301) with one side opening; the mold cavities (301) of the upper mold (31) and the lower mold (32) are inserted into the cavity structures (11) from the upper and lower opening ends of the receiving part (1) for alignment and mold closing, and a gap is left between the upper mold (31) and the lower mold (32) during the mold closing process; Step S2: Fill the mold cavity (301) with translucent glue. Excess translucent glue flows out through the gaps around the upper mold (31) and lower mold (32) and adheres to the inner wall of the receiving part (1). Step S3: After curing, remove the upper mold (31) and lower mold (32) to form a lens (2) in the cavity structure (11). The lens (2) includes at least a first lens (21) and a second lens (22) formed in different cavity structures (11).

2. The manufacturing method according to claim 1, characterized in that, Step S0 is included before step S1; Step S0: Distribute the translucent adhesive into the cavity (301) of the upper mold (31) and / or the lower mold (32).

3. The manufacturing method according to claim 1, characterized in that, In step S2, the inner wall of the cavity structure (11) is provided with a first groove (12) corresponding to the gap between the upper mold (31) and the lower mold (32) when they are closed; the mold cavity (301) is filled with light-transmitting glue, and the excess light-transmitting glue flows out through the gaps around the upper mold (31) and the lower mold (32) and flows into the first groove (12) to bond with the inner wall of the receiving part (1).

4. The manufacturing method according to claim 1, characterized in that, Step S2 involves filling the mold cavity (301) after mold closing with translucent injection adhesive.

5. A mold, characterized in that, The mold is the mold used in the manufacturing method as described in any one of claims 1-4: The mold includes an upper mold (31) and a lower mold (32). The upper mold (31) and the lower mold (32) are respectively provided with mold cavities (301) for the light-transmitting adhesive to be molded between the upper mold (31) and the lower mold (32). The upper mold (31) and the lower mold (32) are provided with limiting plates (302) for mold closing and positioning on the side away from the mold cavity (301).

6. The mold according to claim 5, characterized in that, The length of the limiting plate (302) is greater than the length between the two inner walls of the corresponding cavity structure (11), and is used to lock the end of the cavity structure (11) during the mold closing process.

7. A lens module, characterized in that, The lens module manufactured using the manufacturing method described in any one of claims 1-4 includes: The receiving part (1) has at least two cavity structures (11) with upper and lower openings. The lens (2) includes at least a first lens (21) and a second lens (22), wherein the first lens (21) and the second lens (22) are respectively disposed in the two cavity structures (11); the lens (2) is an optical functional area used for optical adjustment of the emitted light and / or received light.

8. The lens module according to claim 7, characterized in that, The receiving part (1) is a non-optical functional area used to support the lens (2) and isolate the light from the first lens (21) and the second lens (22).

9. The lens module according to claim 7 or 8, characterized in that, The inner wall of the receiving part (1) is provided with a first groove (12) for connecting the four edges of the optical lens (2).

10. A sensor device, characterized in that, The lens module as described in any one of claims 7-9 further includes: A substrate (4) is disposed below the lens (2); The light chip (5) includes a light-emitting chip that emits light and a light-receiving chip that receives light; the light-emitting chip is disposed on the substrate (4) and below the first lens (21); the light-receiving chip is disposed on the substrate (4) and below the second lens (22).

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