Gas trapping system, method and device, computer equipment, readable storage medium and program product

By using segmented capture technology, the first absorbent is used to capture impurities in the gas source, and the second absorbent is used to capture the target gas. This solves the problem of absorbent degradation caused by impurities in the gas source and reduces the operating cost of the gas capture system.

CN121016449APending Publication Date: 2025-11-28CHN ENERGY NEW ENERGY TECHNOLOGY RESEARCH INSTITUTE CO LTD
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Patent Information

Application Number
CN202511024117.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-07-24
Publication Date
2025-11-28

AI Technical Summary

Technical Problem

In existing gas capture technologies, impurities in the gas source cause degradation of the absorbent, increasing the cost of gas capture.

Method used

A segmented capture technology is adopted, in which a first absorbent is used to capture impurities, and a second absorbent is used to capture the target gas, thus preventing impurities from entering the second absorbent and reducing the degradation of the absorbent.

Benefits of technology

This reduces the degradation rate and loss of the absorbent, thereby reducing the overall operating cost of the gas capture system.

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Abstract

The invention relates to a gas trapping system, method and device, computer equipment, a readable storage medium and a program product, and relates to the field of gas trapping. Comprising first gas trapping equipment, second gas trapping equipment and control equipment, the first gas trapping equipment is used for trapping impurity components; the impurity components refer to components influencing the degradation of the absorbent; the second gas trapping equipment is connected with the first gas trapping equipment and is used for trapping target gas; the control equipment is respectively connected with the first gas trapping equipment and the second gas trapping equipment, and is used for controlling the first gas trapping equipment to use a first absorbent to trap impurity components in the input gas source under the condition that the impurity components exist in the input gas source, so as to obtain a pretreated gas source; and controlling the second gas trapping equipment to use the second absorbent to trap the target gas in the pretreatment gas source. By adopting the method, the gas trapping cost can be reduced.
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Description

Technical Field

[0001] This application relates to the field of gas capture, and in particular to a gas capture system, a gas capture method, a gas capture device, a computer device, a computer-readable storage medium, and a computer program product. Background Technology

[0002] Gas capture refers to the technology of capturing or releasing specific gases contained in a gas source. Currently, absorbents are commonly used to achieve gas capture.

[0003] However, in practical applications, the gas source is prone to contain impurities, which can cause degradation of the absorbent, resulting in higher gas capture costs. Summary of the Invention

[0004] Therefore, it is necessary to provide a gas capture system, gas capture method, gas capture device, computer equipment, computer-readable storage medium, and computer program product that can reduce the cost of gas capture in order to address the above-mentioned technical problems.

[0005] In a first aspect, this application provides a gas capture system, including: a first gas capture device, a second gas capture device, and a control device;

[0006] The first gas capture device is used to capture impurities; impurities refer to components that affect the degradation of the absorbent.

[0007] The second gas capture device is connected to the first gas capture device and is used to capture the target gas;

[0008] The control device is connected to the first gas trapping device and the second gas trapping device respectively. When there are impurities in the input gas source, the control device is used to control the first gas trapping device to use the first absorbent to trap the impurities in the input gas source to obtain a pretreated gas source; and the control device is used to control the second gas trapping device to use the second absorbent to trap the target gas in the pretreated gas source.

[0009] In one embodiment, the first gas trapping device includes a first absorption device, and the second gas trapping device includes a second absorption device; the connection between the second gas trapping device and the first gas trapping device includes the connection between the exhaust port of the first absorption device and the inlet port of the second absorption device.

[0010] The first absorption device is used to absorb impurities in the input gas source using a first absorbent to obtain a pretreated gas source.

[0011] The second absorption device is used to receive the pretreated gas source transmitted by the first absorption device and to absorb the target gas in the pretreated gas source using the second absorbent.

[0012] In one embodiment, the first gas capture device further includes a first desorption device;

[0013] The rich liquid inlet of the first desorption device is connected to the rich liquid outlet of the first absorption device, and is used to receive the first rich liquid transmitted by the first absorption device and desorb the first rich liquid; the first rich liquid is a solution formed after the first absorbent absorbs impurity components.

[0014] In one embodiment, the second gas trapping device further includes a second desorption device;

[0015] The rich liquid inlet of the second desorption device is connected to the rich liquid outlet of the second absorption device. It is used to receive the second rich liquid transmitted by the second absorption device and to desorb the second rich liquid. The second rich liquid is a solution formed after the second absorbent absorbs the target gas.

[0016] In one embodiment, the connection between the second gas trapping device and the first gas trapping device further includes connecting the exhaust port of the first desorption device to the inlet port of the second desorption device.

[0017] The second desorption device is also used to receive the desorption gas transmitted by the first desorption device; the desorption gas is the gas generated after the first desorption device desorbs the first rich liquid.

[0018] Secondly, this application also provides a gas capture method applied to the aforementioned gas capture system, the gas capture method comprising:

[0019] When there are impurities in the input gas source, the first gas collection device is controlled to use the first absorbent to collect the impurities in the input gas source to obtain a pretreated gas source.

[0020] The second gas capture device is controlled to capture the target gas in the pretreated gas source using a second absorbent.

[0021] Secondly, this application also provides a gas trapping device, comprising:

[0022] The first collection module is used to control the first gas collection device to use the first absorbent to collect the impurities in the input gas source when there are impurities in the input gas source, so as to obtain a pretreated gas source; the first absorbent is an absorbent used to absorb impurities.

[0023] The second capture module is used to control the second gas capture device to capture the target gas in the pretreated gas source using the second absorbent; the second absorbent is an absorbent used to absorb the target gas.

[0024] Thirdly, this application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the following steps:

[0025] When there are impurities in the input gas source, the first gas collection device is controlled to use the first absorbent to collect the impurities in the input gas source to obtain a pretreated gas source.

[0026] The second gas capture device is controlled to capture the target gas in the pretreated gas source using a second absorbent.

[0027] Fourthly, this application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, performs the following steps:

[0028] When there are impurities in the input gas source, the first gas collection device is controlled to use the first absorbent to collect the impurities in the input gas source to obtain a pretreated gas source.

[0029] The second gas capture device is controlled to capture the target gas in the pretreated gas source using a second absorbent.

[0030] Fifthly, this application also provides a computer program product, including a computer program that, when executed by a processor, performs the following steps:

[0031] When there are impurities in the input gas source, the first gas collection device is controlled to use the first absorbent to collect the impurities in the input gas source to obtain a pretreated gas source.

[0032] The second gas capture device is controlled to capture the target gas in the pretreated gas source using a second absorbent.

[0033] The aforementioned gas capture system, gas capture method, gas capture device, computer equipment, computer-readable storage medium, and computer program product include a first gas capture device, a second gas capture device, and a control device. The first gas capture device is used to capture impurity components; impurity components refer to components that affect the degradation of the absorbent. The second gas capture device is connected to the first gas capture device and is used to capture the target gas. The control device is connected to both the first and second gas capture devices and is used to control the first gas capture device to use the first absorbent to capture the impurity components in the input gas source when impurity components are present, thus obtaining a pretreated gas source; and to control the second gas capture device to use the second absorbent to capture the target gas in the pretreated gas source. In this way, this system, through segmented capture technology, uses the first absorbent as a sacrificial agent to absorb impurity components, preventing them from entering the second gas capture device and causing degradation of the second absorbent, reducing the amount of absorbent processed, effectively reducing the degradation rate and degradation loss of the entire absorbent system, thereby reducing the overall operating cost of the gas capture system. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram of the process for capturing gas using chemical absorption in one embodiment;

[0036] Figure 2 This is a schematic diagram of the architecture of a gas capture system in one embodiment;

[0037] Figure 3 This is a schematic diagram of the gas capture system structure in one embodiment;

[0038] Figure 4 This is a schematic diagram of the gas capture system structure in another embodiment;

[0039] Figure 5 This is a flowchart illustrating a gas capture method in one embodiment;

[0040] Figure 6 This is a structural block diagram of a gas trapping device in one embodiment;

[0041] Figure 7 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0043] Gas capture refers to the technology of capturing or releasing specific gases contained in a gas source. It is widely used in various large power plants, steel plants, chemical plants, etc., and can effectively capture gases such as carbon dioxide (CO2) in industrial flue gas emissions. In traditional technology, gas capture is usually achieved by chemical absorption. The principle of chemical absorption is to utilize the change of gas solubility in absorbent with temperature, and to achieve gas capture through a cycle of low-temperature absorption and high-temperature release.

[0044] Figure 1A schematic diagram of a conventional chemical absorption method for gas capture is shown, applied to a gas capture system 10. The gas capture system 10 includes an absorption tower 101, a desorption tower 102, a rich solution pump 103, a lean solution pump 104, a rich-lean-lean solution heat exchanger 105, a reboiler 106, a reflux pump 107, a separation tank 108, a lean solution cooler 109, and a condenser 110. The absorption tower is an industrial device used to separate a specific gas from a gas mixture; its core principle is to achieve the absorption of the target gas through gas-liquid two-phase contact. In contrast, the desorption tower is a device used to transfer a solute from the liquid phase to the gas phase and then release it. The rich solution pump is used to pressurize the solution to overcome system resistance and meet the operating pressure requirements of the desorption tower. Specifically, after the rich solution flows out of the absorption tower, it must pass through pipes, the rich-lean-lean solution heat exchanger, valves, and other equipment. These components generate flow resistance; pressurization ensures that the rich solution is smoothly delivered to the desorption tower. Furthermore, desorption towers typically operate at higher pressures to optimize gas desorption efficiency and reduce energy consumption. The pressurized rich solution can directly enter the desorption tower, avoiding poor desorption performance due to insufficient pressure. Therefore, pressurizing with a rich solution pump ensures smooth flow, optimizes desorption efficiency, and reduces operating costs. A lean-rich solution heat exchanger, as the name suggests, facilitates heat exchange between lean and rich solutions. The lean-rich solution heat exchange process specifically includes a high-temperature lean solution (hot side) process and a low-temperature rich solution (cold side) process. The high-temperature lean solution process originates from the lean solution at the bottom of the desorption tower, which has been heated by a reboiler to a high temperature, typically 100-120°C. The high-temperature lean solution enters the heat exchanger, where it transfers heat to the low-temperature rich solution, causing its own temperature to drop, for example, to 60-80°C. The cooled lean solution is then pressurized by the lean solution pump and returned to the top of the absorption tower for recycling. The low-temperature rich solution process originates from the lower-temperature rich solution at the bottom of the absorption tower, for example, 40-60°C. The rich liquor, pressurized by a rich liquor pump, enters a heat exchanger where it is heated by the high-temperature lean liquor, causing its temperature to rise, for example, to 80-100°C. The preheated rich liquor then enters a desorption tower, where it desorbs gases with the assistance of a reboiler. The reboiler provides the heat source for desorption, typically derived from plant steam.

[0045] Taking carbon dioxide as the captured gas as an example Figure 1The gas capture process is explained below. Flue gas containing low concentrations of carbon dioxide, such as below 30%, first enters absorption tower 101. The absorbent in absorption tower 101 absorbs most of the carbon dioxide in the flue gas, forming a rich liquid. The rich liquid can be understood as the solution flowing out from the bottom of the tower after the carbon dioxide has been absorbed by the absorbent, containing the absorbed carbon dioxide. The absorbent can be an alcohol amine solution, such as monoethanolamine (MEA), diethanolamine (DEA), diisopropanolamine (DIPA), methyldiethanolamine (MDEA), or a mixture thereof. These alcohol amine solutions become alkaline after dissociation in water, readily reacting with acidic gases such as carbon dioxide, thereby achieving the purpose of absorbing and desorbing carbon dioxide. The rich liquid is pressurized by the rich liquid pump 103 and heat-exchanged with the lean-rich liquid heat exchanger 105 before being sent to the desorption tower 102. The reboiler 106 provides a heat source for desorption to assist in desorption. The gaseous components produced at the top of desorption tower 102 are mainly a mixture of carbon dioxide and water vapor. After condensation by condenser 110, it enters separator 108. The liquid water separated in separator 108 is returned to the tower by reflux pump 107 to maintain the water balance of the absorbent. The separated carbon dioxide is usually further pressurized to a certain pressure for industrial production or for oil displacement and storage. The lean liquor at the bottom of desorption tower 102 is pressurized by lean liquor pump 104, and then the waste heat is recovered by lean-rich liquor heat exchanger 105. Finally, it is cooled by lean liquor cooler 109 and sent to the absorption tower for circulation. In contrast to the rich liquor, the lean liquor is a low-concentration solution or a solution from which the target component (carbon dioxide) has been removed, and can be reused in the absorption process.

[0046] However, in practical applications, flue gas often contains impurities such as solid ash or sulfur dioxide (SO2). Solid ash is generally composed of tiny particles, possibly originating from the residues of incomplete combustion of coal / gas. These impurities accelerate the degradation rate of the absorbent. Currently, the main solution is to wash the flue gas with water before it enters the absorption tower. However, even after washing, some "stubborn elements," such as extremely fine particles or dissolved SO2, inevitably enter the absorption tower, leading to increased absorbent degradation. The accumulation of degradation products further accelerates the degradation of the absorbent throughout the system. After degradation, the absorbent's performance deteriorates, requiring replacement and increasing its cost, thus raising the overall operating cost of the gas capture system.

[0047] To address this issue, some embodiments provide a gas capture system, including: a first gas capture device, a second gas capture device, and a control device; the first gas capture device is used to capture impurity components; impurity components refer to components that affect the degradation of the absorbent; the second gas capture device is connected to the first gas capture device and is used to capture the target gas; the control device is connected to both the first and second gas capture devices, and is used to control the first gas capture device to use a first absorbent to capture the impurity components in the input gas source when impurity components are present in the input gas source, thereby obtaining a pretreated gas source; and to control the second gas capture device to use a second absorbent to capture the target gas in the pretreated gas source.

[0048] Impurities refer to components that affect the degradation of the absorbent, or those that accelerate its degradation rate, such as at least one of particles, dust, or sulfur dioxide. These components undergo irreversible chemical reactions with the absorbent, generating stable substances, i.e., degradation products. This process is absorbent degradation. After degradation, the absorbent's performance deteriorates, and degradation products may clog pipes, corrode equipment, or even force shutdown for cleaning. Therefore, slowing down absorbent degradation is essential. The target gas is the gas to be captured, such as carbon dioxide; other gases can be selected for capture depending on actual needs. The control equipment can be a standalone physical server, a server cluster or distributed system composed of multiple physical servers, or a cloud server providing cloud computing services. The input gas source refers to the gas source to be captured in the gas capture system, such as flue gas or other mixed gases. The pretreated gas source refers to the gas source from which impurities have been removed. The first absorbent is used to absorb impurities, and the second absorbent is used to absorb the target gas. The first and second absorbents can be of the same or different components. For example, in low-sulfur, low-dust flue gas, absorbents with the same composition, such as methyldiethanolamine solution, can be selected. This solution has a moderate absorption rate for carbon dioxide and some tolerance to trace amounts of sulfur dioxide. However, for high-sulfur, high-dust flue gas, absorbents with different compositions can be used. For instance, the first absorbent can be one with good absorption performance for sulfur dioxide and fixed ash, and resistance to degradation, while the second absorbent can be one with good carbon dioxide absorption performance and greater sensitivity to sulfur dioxide and fixed ash.

[0049] Figure 2A schematic diagram of a gas capture system is shown, wherein the gas capture system 10 includes a first gas capture device 11, a second gas capture device 12, and a control device 13. Specifically, the first gas capture device 11 is connected to the second gas capture device 12, and the control device 13 is connected to both the first gas capture device 11 and the second gas capture device 12. When impurities are present in the input gas source, the control device 13 first controls the first gas capture device 11 to use a first absorbent to capture the impurities in the input gas source, obtaining a pre-treated gas source free of impurities. The control device 13 then further controls the second gas capture device 12 to use a second absorbent to capture the target gas in the pre-treated gas source.

[0050] In some embodiments, the first gas capture device may include a first absorption device and a first desorption device, and the second gas capture device may include a second absorption device and a second desorption device. The first absorption device and the second absorption device may be two independent absorption towers or different absorption regions within the same absorption tower. Similarly, the first desorption device and the second desorption device may be two independent desorption towers or different desorption regions within the same desorption tower. Specifically, it can be any of the following combinations: the first absorption device and the second absorption device are different absorption regions within the same absorption tower, and the first desorption device and the second desorption device are each two independent desorption towers; the first absorption device and the second absorption device are different absorption regions within the same absorption tower, and the first desorption device and the second desorption device are also different desorption regions within the same desorption tower; the first absorption device and the second absorption device are each two independent absorption towers, and the first desorption device and the second desorption device are also different desorption regions within the same desorption tower; the first absorption device and the second absorption device are each two independent absorption towers, and the first desorption device and the second desorption device are also each two independent desorption towers. The specific combination can be determined based on the actual situation.

[0051] Taking the first and second absorption devices as different absorption zones within the same absorption tower, and the first and second desorption devices as different desorption zones within the same desorption tower as an example, the following is illustrated: Figure 3 A schematic diagram of the gas capture system is shown. The first gas capture device 11 includes a first absorption device 110, a first rich liquid pump 111, a first lean-rich liquid heat exchanger 112, a first lean liquid pump 113, a first reboiler 114, a first lean liquid cooler 115, and a first desorption device 116. The second gas capture device 12 includes a second absorption device 120, a second rich liquid pump 121, a second lean-rich liquid heat exchanger 122, a second lean liquid pump 123, a second reboiler 124, a second lean liquid cooler 125, a second desorption device 126, a condenser 127, a separation tank 128, and a reflux pump 129.

[0052] Taking the first and second absorption devices as different absorption zones within the same absorption tower, and the first and second desorption devices as two independent desorption towers, as an example, the following is illustrated. Figure 4 A schematic diagram of the gas capture system in the diagram. Figure 4 and Figure 3 The structures are similar and will not be elaborated further here. Similarly, it can be understood that the first absorption device and the second absorption device are two independent absorption towers, the first desorption device and the second desorption device are two independent desorption towers, and the first absorption device and the second absorption device are also different desorption regions within the same desorption tower. These structures will not be elaborated further here.

[0053] In this embodiment, by using segmented capture technology, the first absorbent is used as a sacrificial agent to absorb impurities, preventing them from entering the second gas capture device and causing degradation of the second absorbent. This reduces the amount of absorbent to be processed, effectively reducing the degradation rate and degradation loss of the entire absorbent system, thereby reducing the overall operating cost of the gas capture system.

[0054] In some embodiments, the exhaust port of the first absorption device is connected to the inlet port of the second absorption device; the first absorption device is used to absorb impurities in the input gas source using a first absorbent to obtain a pretreated gas source; the second absorption device is used to receive the pretreated gas source transmitted by the first absorption device and absorb the target gas in the pretreated gas source using a second absorbent.

[0055] For example, after the first absorption device 110 absorbs impurities in the input gas source using the first absorbent, a pretreated gas source is obtained. Since the target gas still exists in the pretreated gas source and needs to be further absorbed, the pretreated gas source is discharged from the exhaust port of the first absorption device 110 and enters the second absorption device 120 through the inlet of the second absorption device 120, so that the second absorption device 120 can further absorb the target gas in the pretreated gas source using the second absorbent.

[0056] In some embodiments, the rich liquid inlet of the first desorption device is connected to the rich liquid outlet of the first absorption device, for receiving the first rich liquid transmitted by the first absorption device and desorbing the first rich liquid; the first rich liquid is a solution formed after the first absorbent absorbs impurity components.

[0057] For example, after the first absorption device 110 absorbs impurities using the first absorbent, it obtains a pretreated gas source and a first rich liquid containing the impurities. It is understood that in practical applications, the first absorbent will absorb not only the impurities but also some of the target gas, so the first rich liquid will still contain some of the target gas. The first rich liquid is discharged from the rich liquid outlet of the first absorption device 110 and firstly flows into the first rich liquid pump 111 for pressurization via the rich liquid transfer pipe between the first absorption device 110 and the first rich liquid pump 111. The pressurized first rich liquid then flows into the first lean-rich liquid heat exchanger 112 for heat exchange via the rich liquid transfer pipe between the first rich liquid pump 111 and the first lean-rich liquid heat exchanger 112. The rich liquid outlet of the first lean-rich liquid heat exchanger 112 is connected to the rich liquid inlet of the first desorption device 116. After heat exchange, the first rich liquid can be discharged from the rich liquid outlet of the first lean-rich liquid heat exchanger 112 and flow into the first desorption device 116 for desorption through the rich liquid inlet of the first desorption device 116.

[0058] In some embodiments, the first reboiler 114 provides a heat source to the first desorption device 116 via steam and discharges hydrophobic water, i.e., condensate and steam generated during the operation of the reboiler 114.

[0059] In some embodiments, after the first desorption device 116 completes the desorption of the first rich solution, a first lean solution is obtained, which is a solution from which impurities and part of the target gas have been removed. The first lean solution can be pressurized by the first lean solution pump 113 and then flow into the first lean solution heat exchanger 112 through the lean solution transfer pipe between the first lean solution pump 113 and the first lean-rich solution heat exchanger 112 for heat exchange. After heat exchange, the first lean solution flows into the first lean solution cooler 115 through the lean solution transfer pipe between the first lean-rich solution heat exchanger 112 and the first lean solution cooler 115 for cooling. The lean solution outlet of the first lean solution cooler 115 is connected to the lean solution inlet of the first absorption device 110. The first lean solution cooled to a specified temperature, such as 40°C, can be discharged from the lean solution outlet of the first lean solution cooler 115 and discharged into the first absorption device 110 through the lean solution inlet of the first absorption device 110 to serve as a new first absorbent for the next round of absorption, thus completing the cycle of the first absorbent.

[0060] In some embodiments, the rich liquid inlet of the second desorption device is connected to the rich liquid outlet of the second absorption device, for receiving the second rich liquid transmitted by the second absorption device and desorbing the second rich liquid; the second rich liquid is a solution formed after the second absorbent absorbs the target gas.

[0061] For example, after the second absorption device 120 absorbs the target gas in the pretreated gas using the second absorbent, the resulting clean gas can be discharged into the atmosphere through the top exhaust port of the second absorption device 120. In addition, the second absorption device 120 also generates a second rich liquid containing the target gas. The second rich liquid is discharged from the rich liquid outlet of the second absorption device 120, first flowing into the second rich liquid pump 121 for pressurization through the rich liquid transfer pipe between the second absorption device 120 and the second rich liquid pump 121. The pressurized second rich liquid then flows into the second lean-rich liquid heat exchanger 122 for heat exchange through the rich liquid transfer pipe between the second rich liquid pump 121 and the second lean-rich liquid heat exchanger 122. The rich liquid outlet of the second lean-rich liquid heat exchanger 122 is connected to the rich liquid inlet of the first desorption device 126, and the heat-exchanged second rich liquid can then be discharged from the rich liquid outlet of the second lean-rich liquid heat exchanger 122 and flow into the second desorption device 126 for desorption through the rich liquid inlet of the second desorption device 126.

[0062] In some embodiments, the second reboiler 124 provides a heat source to the second desorption device 126 via steam and discharges hydrophobic water, i.e., condensate and steam generated during the operation of the reboiler 124.

[0063] In some embodiments, after the second desorption device 126 completes the desorption of the second rich liquid, a second lean liquid, i.e., a solution from which the target gas has been removed, is obtained. The second lean liquid can be pressurized by the second lean liquid pump 123 and then flow into the second lean liquid heat exchanger 122 through the lean liquid transfer pipe between the second lean liquid pump 123 and the second lean-rich liquid heat exchanger 122 for heat exchange. After heat exchange, the second lean liquid then flows into the second lean liquid cooler 125 through the lean liquid transfer pipe between the second lean-rich liquid heat exchanger 122 and the second lean liquid cooler 125 for cooling. The lean liquid outlet of the second lean liquid cooler 125 is connected to the lean liquid inlet of the second absorption device 120. The second lean liquid, cooled to a specified temperature, such as 40°C, can be discharged from the lean liquid outlet of the second lean liquid cooler 125 and discharged into the second absorption device 120 through the lean liquid inlet, serving as a new second absorbent for the next round of absorption, thus completing the second absorbent cycle.

[0064] In some embodiments, the desorbed gas generated by the second desorption device 126 first enters the condenser 127 connected to the second desorption device 126 for condensation. The condensed desorbed gas is then transported to the separation tank 128 via a transmission channel between the second desorption device 126 and the separation tank 128 for gas-liquid separation, separating the target gas and a liquid mixture, such as water vapor. The target gas can be discharged from the exhaust port of the separation tank 128 for industrial production, oil displacement, or storage. The liquid, after being diverted by the separation tank 128, enters the first desorption device 116 and the second desorption device 126 respectively to maintain the water balance of the first absorbent and the second absorption cycle.

[0065] In some embodiments, the exhaust port of the first desorption device is connected to the inlet port of the second desorption device; the second desorption device is also used to receive the desorption gas transmitted by the first desorption device; the desorption gas is the gas generated by the first desorption device after desorption of the first rich liquid.

[0066] It is understandable that, since the first absorbent will absorb part of the target gas, the desorbed gas obtained by the first desorption device 116 after desorbing the first rich liquid will contain part of the target gas. This part of the target gas will flow up through the second desorption device 126, and after it polymerizes with the target gas desorbed by the second desorption device 126, gas-liquid separation will be performed. This ensures that the target gas is completely captured.

[0067] In some embodiments, a gas capture method is also provided, applied to the control device 13 in the gas capture system 10, such as... Figure 5 As shown, the gas capture method includes:

[0068] Step S502: If there are impurities in the input gas source, control the first gas collection device to use the first absorbent to collect the impurities in the input gas source to obtain a pretreated gas source.

[0069] Step S504: Control the second gas collection device to use the second absorbent to collect the target gas in the pretreated gas source.

[0070] For example, the presence of impurities in the input gas source can be determined by a control device. For instance, the control device can pre-store the types of impurities. Upon receiving a capture command for the input gas source, it can first perform component detection. If impurities are detected, a segmented capture strategy can be initiated, controlling the operation of both the first and second gas capture devices. Alternatively, a dedicated gas source component detection tool or device can be used to detect the components of the input gas source and feed the results back to the control device. Furthermore, the capture command can directly include information indicating the presence of impurities in the input gas source. The specific criteria for judgment can be determined based on actual circumstances, and this embodiment does not impose any limitations on this.

[0071] If impurities are present in the input gas source, the control device can activate both the first and second gas trapping devices. The first gas trapping device uses a first absorbent to trap the impurities in the input gas source, resulting in a pretreated gas source. The second gas trapping device uses a second absorbent to trap the target gas in the pretreated gas source. Both the first and second gas trapping devices can feed back their respective gas trapping results to the control device, such as trapping time, trapping efficiency, the content of the target gas after trapping, and the content of the target gas in the input gas source before trapping, allowing the control device to optimize the gas trapping system based on these results. Conversely, if no impurities are present in the input gas source, the control device can activate only the second gas trapping device, which directly traps the target gas in the input gas source using the second absorbent.

[0072] In this embodiment, by using segmented capture technology, the first absorbent is used as a sacrificial agent to absorb impurities, preventing them from entering the second gas capture device and causing degradation of the second absorbent. This reduces the amount of absorbent to be processed, effectively reducing the degradation rate and degradation loss of the entire absorbent system, thereby reducing the overall operating cost of the gas capture system.

[0073] In some embodiments, the gas capture method further includes: a first gas capture device including a first absorption device, and a second gas capture device including a second absorption device; the connection between the second gas capture device and the first gas capture device includes the connection between the exhaust port of the first absorption device and the inlet port of the second absorption device; the first absorption device is used to absorb impurity components in the input gas source using a first absorbent to obtain a pretreated gas source; the second absorption device is used to receive the pretreated gas source transmitted by the first absorption device and absorb the target gas in the pretreated gas source using a second absorbent.

[0074] In some embodiments, the gas capture method further includes: the first gas capture device further includes a first desorption device; the rich liquid inlet of the first desorption device is connected to the rich liquid outlet of the first absorption device, for receiving the first rich liquid transmitted by the first absorption device and desorbing the first rich liquid; the first rich liquid is a solution formed after the first absorbent absorbs impurity components.

[0075] In some embodiments, the gas capture method further includes: the second gas capture device further includes a second desorption device; the rich liquid inlet of the second desorption device is connected to the rich liquid outlet of the second absorption device, for receiving the second rich liquid transmitted by the second absorption device and desorbing the second rich liquid; the second rich liquid is a solution formed after the second absorbent absorbs the target gas.

[0076] In some embodiments, the gas capture method further includes: the connection between the second gas capture device and the first gas capture device further includes connecting the exhaust port of the first desorption device to the inlet port of the second desorption device; the second desorption device is also used to receive the desorbed gas transmitted by the first desorption device; the desorbed gas is the gas generated after the first desorption device desorbs the first rich liquid.

[0077] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0078] Based on the same inventive concept, this application also provides a gas trapping device for implementing the gas trapping method described above. The solution provided by this device is similar to the solution described in the above method; therefore, the specific limitations in one or more gas trapping device embodiments provided below can be found in the limitations of the gas trapping method described above, and will not be repeated here.

[0079] In one exemplary embodiment, such as Figure 6 As shown, a gas capture device is provided, comprising:

[0080] The first collection module 602 is used to control the first gas collection device to use the first absorbent to collect the impurities in the input gas source when there are impurities in the input gas source, so as to obtain a pretreated gas source; the first absorbent is an absorbent used to absorb impurities.

[0081] The second capture module 604 is used to control the second gas capture device to capture the target gas in the pretreated gas source using the second absorbent; the second absorbent is an absorbent used to absorb the target gas.

[0082] In some embodiments, the first gas trapping device includes a first absorption device, and the second gas trapping device includes a second absorption device; the connection between the second gas trapping device and the first gas trapping device includes the connection between the exhaust port of the first absorption device and the inlet port of the second absorption device; the first absorption device is used to absorb impurities in the input gas source using a first absorbent to obtain a pretreated gas source; the second absorption device is used to receive the pretreated gas source transmitted by the first absorption device and absorb the target gas in the pretreated gas source using a second absorbent.

[0083] In some embodiments, the first gas capture device further includes a first desorption device; the rich liquid inlet of the first desorption device is connected to the rich liquid outlet of the first absorption device, for receiving the first rich liquid transmitted by the first absorption device and desorbing the first rich liquid; the first rich liquid is a solution formed after the first absorbent absorbs impurity components.

[0084] In some embodiments, the second gas capture device further includes a second desorption device; the rich liquid inlet of the second desorption device is connected to the rich liquid outlet of the second absorption device, for receiving the second rich liquid transmitted by the second absorption device and desorbing the second rich liquid; the second rich liquid is a solution formed after the second absorbent absorbs the target gas.

[0085] In some embodiments, the connection between the second gas collection device and the first gas collection device further includes connecting the exhaust port of the first desorption device to the inlet port of the second desorption device; the second desorption device is also used to receive the desorbed gas transmitted by the first desorption device; the desorbed gas is the gas generated after the first desorption device desorbs the first rich liquid.

[0086] Each module in the aforementioned gas capture device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of a computer device in software form, so that the processor can call and execute the operations corresponding to each module.

[0087] In one exemplary embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be as follows: Figure 7As shown, the computer device includes a processor, memory, input / output (I / O) interfaces, and a communication interface. The processor, memory, and I / O interfaces are connected via a system bus, and the communication interface is also connected to the system bus via the I / O interfaces. The processor provides computational and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system, computer programs, and a database. The internal memory provides the environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The database stores gas capture data. The I / O interfaces are used for exchanging information between the processor and external devices. The communication interface is used for communication with external terminals via a network connection. When the computer program is executed by the processor, it implements a gas capture method.

[0088] Those skilled in the art will understand that Figure 7 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0089] In one exemplary embodiment, a computer device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the following steps:

[0090] When there are impurities in the input gas source, the first gas collection device is controlled to use the first absorbent to collect the impurities in the input gas source to obtain a pretreated gas source.

[0091] The second gas capture device is controlled to capture the target gas in the pretreated gas source using a second absorbent.

[0092] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, the computer program performing the following steps when executed by a processor:

[0093] When there are impurities in the input gas source, the first gas collection device is controlled to use the first absorbent to collect the impurities in the input gas source to obtain a pretreated gas source.

[0094] The second gas capture device is controlled to capture the target gas in the pretreated gas source using a second absorbent.

[0095] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, performs the following steps:

[0096] When there are impurities in the input gas source, the first gas collection device is controlled to use the first absorbent to collect the impurities in the input gas source to obtain a pretreated gas source.

[0097] The second gas capture device is controlled to capture the target gas in the pretreated gas source using a second absorbent.

[0098] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of the relevant data must comply with relevant regulations.

[0099] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, artificial intelligence (AI) processors, etc., and are not limited to these.

[0100] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0101] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A gas capture system, characterized in that, The gas capture system includes a first gas capture device, a second gas capture device, and a control device; The first gas collection device is used to collect impurity components; the impurity components refer to components that affect the degradation of the absorbent; The second gas capture device is connected to the first gas capture device and is used to capture the target gas; The control device is connected to the first gas trapping device and the second gas trapping device respectively. When impurities are present in the input gas source, the control device controls the first gas trapping device to use a first absorbent to trap the impurities in the input gas source to obtain a pretreated gas source; and controls the second gas trapping device to use a second absorbent to trap the target gas in the pretreated gas source.

2. The gas capture system according to claim 1, characterized in that, The first gas capture device includes a first absorption device, and the second gas capture device includes a second absorption device; the connection between the second gas capture device and the first gas capture device includes the connection between the exhaust port of the first absorption device and the inlet port of the second absorption device. The first absorption device is used to absorb impurities in the input gas source using the first absorbent to obtain the pretreated gas source; The second absorption device is used to receive the pretreated gas source transmitted by the first absorption device and to absorb the target gas in the pretreated gas source using the second absorbent.

3. The gas capture system according to claim 2, characterized in that, The first gas capture device further includes a first desorption device; The rich liquid inlet of the first desorption device is connected to the rich liquid outlet of the first absorption device, and is used to receive the first rich liquid transmitted by the first absorption device and desorb the first rich liquid; the first rich liquid is a solution formed after the first absorbent absorbs the impurity components.

4. The gas capture system according to claim 2, characterized in that, The second gas capture device also includes a second desorption device; The rich liquid inlet of the second desorption device is connected to the rich liquid outlet of the second absorption device, and is used to receive the second rich liquid transmitted by the second absorption device and desorb the second rich liquid; the second rich liquid is a solution formed after the second absorbent absorbs the target gas.

5. The gas capture system according to any one of claims 1 to 4, characterized in that, The connection between the second gas capture device and the first gas capture device also includes the connection between the exhaust port of the first desorption device and the inlet port of the second desorption device; The second desorption device is also used to receive the desorption gas transmitted by the first desorption device; the desorption gas is the gas generated by the first desorption device after desorption of the first rich liquid.

6. A gas capture method, characterized in that, Applied to the gas capture system as described in any one of claims 1 to 5, characterized in that the method comprises: When there are impurities in the input gas source, the first gas collection device is controlled to use the first absorbent to collect the impurities in the input gas source to obtain a pretreated gas source. The second gas capture device is controlled to capture the target gas in the pretreated gas source using a second absorbent.

7. A gas capture device, characterized in that, The device includes: The first collection module is used to control the first gas collection device to use the first absorbent to collect the impurities in the input gas source when impurities are present in the input gas source, so as to obtain a pretreated gas source; the first absorbent is an absorbent used to absorb impurities. The second capture module is used to control the second gas capture device to capture the target gas in the pretreated gas source using a second absorbent; the second absorbent is an absorbent used to absorb the target gas.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method of claim 6.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method of claim 6.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method of claim 6.

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