Chip test equipment and test method

Abstract

The invention provides chip testing equipment and a testing method, and relates to the technical field of chip testing. At least one tested chip is placed on a first test platform deck, and the first test platform deck is set to be controlled to move in the front-back direction of the chip test equipment. The second test platform deck is arranged on the side, away from the first test platform deck, of the test machine, at least one tested chip is placed on the second test platform deck, and the second test platform deck is arranged to move in the front-back direction in a controlled mode. The first test platform deck and the second test platform deck are arranged to alternately move into the test machine, so that the test machine alternately performs functional test on the tested chips on the first test platform deck and the second test platform deck. According to the technical scheme, the first test platform deck and the second test platform deck alternately enter the test machine, so that the loading waiting time is shortened, the test machine alternately tests the tested chips on the first test platform deck and the second test platform deck and is always in a test state, and the test efficiency of the chips is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip testing, in particular to a chip testing device and a testing method. BACKGROUND

[0002] At present, the testing device for chips usually adopts a single testing machine to test chips, and the chips need to be placed on a testing platform for testing. When testing the chips, the tested chips of the previous batch need to be taken away before the chips of the next batch to be tested are connected, so that the waiting time is too long and the testing efficiency is low. Therefore, it is urgent to design a testing device capable of improving the testing efficiency of chips. SUMMARY

[0003] An object of the present application is to provide a chip testing device to solve the technical problem of low chip testing efficiency in the prior art.

[0004] A further object of the present application is to further improve the testing efficiency of chips.

[0005] Another object of the present application is to provide a testing method applied to the above chip testing device.

[0006] In particular, the present application also provides a chip testing device, comprising:

[0007] a testing machine for performing functional testing on the tested chips;

[0008] a first testing platform arranged on one side of the testing machine and having at least one tested chip placed thereon, the first testing platform being arranged to move along the front-back direction of the chip testing device under control;

[0009] a second testing platform arranged on the side of the testing machine away from the first testing platform and having at least one tested chip placed thereon, the second testing platform being arranged to move along the front-back direction under control;

[0010] The first testing platform and the second testing platform are arranged to move alternately into the testing machine, so that the testing machine alternately performs functional testing on the tested chips on the first testing platform and the second testing platform.

[0011] Optionally, two first loading and unloading devices are further included;

[0012] One of the first loading and unloading devices is arranged on the side of the first testing platform away from the testing machine, and is used to carry the tested chips to the first testing platform and take away the tested chips on the first testing platform after testing;

[0013] Another first loading and unloading device is arranged on the side of the second test platform away from the test machine, and is used for carrying the tested chips to the second test platform and taking the tested chips that have completed testing on the second test platform.

[0014] Optionally, each first loading and unloading device comprises:

[0015] A first sliding rail extending in the lateral direction of the chip testing device;

[0016] At least one first loading suction member and at least one first unloading suction member, which are both slidably connected with the first sliding rail, the first loading suction member is used for adsorbing the tested chips and carrying the tested chips to the corresponding first test platform or the second test platform, and the first unloading suction member is used for adsorbing and taking the tested chips that have completed testing on the corresponding first test platform or the second test platform.

[0017] Optionally, the chip testing device further comprises:

[0018] Two visual correction mechanisms, each corresponding to a first loading and unloading device and slidably connected with the first sliding rail of the corresponding first loading and unloading device, the visual correction mechanism is used for adjusting the position of the tested chips placed on the corresponding first test platform or the second test platform.

[0019] Optionally, the chip testing device further comprises:

[0020] A first carrying device and a second carrying device, which are both arranged in the front-rear direction and located on both sides of the test machine in the lateral direction, and are both used for carrying the tested chips in the front-rear direction.

[0021] The first loading and unloading device is arranged to adsorb the tested chips from the first carrying device and carry the tested chips that have completed testing to the second carrying device.

[0022] Optionally, the chip testing device further comprises:

[0023] A loading machine arranged at the front end of the chip testing device and close to the first carrying device, and used for loading the tested chips;

[0024] An unloading machine arranged in parallel with the unloading machine and close to the second carrying device, and used for unloading the tested chips that have completed testing;

[0025] A second loading and unloading device, comprising a second slide rail arranged along a transverse direction of the chip testing device, at least one second loading suction member and at least one second unloading suction member, the second loading suction member and the second unloading suction member are both slidably connected with the second slide rail, the second loading suction member is used to carry the tested chip on the loading machine to the first carrying device, and the second unloading suction member is used to carry the tested chip after testing on the second carrying device to the unloading machine.

[0026] Optionally, the first carrying device and the second carrying device both comprise:

[0027] Two third slide rails arranged in parallel;

[0028] Two tray components, each of the tray components is movably connected with one of the third slide rails and corresponds to one of the first loading and unloading devices, and the tray component has a tray body for placing the tested chip;

[0029] The two tray components are arranged to be alternately moved to the second loading and unloading device to receive the tested chip and transport the tested chip to the corresponding first loading and unloading device.

[0030] Optionally, each of the tray components further comprises:

[0031] A fourth slide rail arranged along a longitudinal direction and slidably connected with the corresponding third slide rail, and the tray component is slidably connected with the fourth slide rail along a vertical direction;

[0032] The tray bodies of the two tray components are arranged to be moved in planes at different heights.

[0033] Optionally, further comprising:

[0034] A first detection device arranged between the loading machine and the first carrying device, the second loading suction member is arranged to carry the tested chip on the loading machine to the first detection device, so that the first detection device performs visual detection on the tested chip, and carries the tested chip that passes the detection to the first carrying device;

[0035] A second detection device arranged between the unloading machine and the second carrying device, the second unloading suction member is arranged to carry the tested chip after testing on the second carrying device to the second detection device, so that the second detection device performs visual detection on the tested chip after testing, and carries the tested chip that passes the detection to the unloading machine.

[0036] Optionally, further comprising:

[0037] A waste device is arranged between the upper feeding machine and the lower feeding machine, and the second upper feeding suction member and the second lower feeding suction member are further arranged to carry the detected unqualified chips to the waste device.

[0038] In particular, the application further provides a testing method of the chip testing device, comprising the following steps:

[0039] controlling the first testing platform to move into the testing machine in response to a testing control instruction;

[0040] controlling the testing machine to perform functional testing on the detected chips on the first testing platform;

[0041] controlling the first testing platform to move outside the testing machine after the testing of the detected chips is completed;

[0042] controlling the second testing platform to move into the testing machine;

[0043] controlling the testing machine to perform functional testing on the detected chips on the second testing platform;

[0044] controlling the second testing platform to move outside the testing machine after the testing of the detected chips is completed, and repeating the above steps.

[0045] Optionally, the step of controlling the first testing platform to move into the testing machine in response to a testing control instruction further comprises the following steps:

[0046] controlling the two disc parts of the first carrying device to alternately move to the second upper and lower feeding devices to sequentially receive the detected chips sucked by the second upper feeding suction member from the upper feeding machine in response to a receiving control instruction;

[0047] controlling the two disc parts of the first carrying device to alternately move along the corresponding third slide rails to the corresponding first upper and lower feeding devices, so that the first upper feeding suction members of the two first upper and lower feeding devices respectively suck the detected chips on the corresponding disc parts;

[0048] controlling the first upper feeding suction members of the two first upper and lower feeding devices to move along the corresponding first slide rails to carry the detected chips to the corresponding first testing platform or the second testing platform.

[0049] Optionally, the step of controlling the first upper feeding suction members to move along the corresponding first slide rails to carry the detected chips to the corresponding first testing platform or the second testing platform further comprises the following steps:

[0050] The two visual correction mechanisms are controlled to adjust the positions of the chips under test on the first test platform and the second test platform respectively.

[0051] Optionally, the method further comprises the following steps:

[0052] Optionally, the method further comprises the following steps:

[0053] The two tray components of the second conveying device are controlled to alternately move to the second loading and unloading device, so that the second loading and unloading device sequentially adsorbs the tested chips on the two tray components.

[0054] The second loading and unloading device is controlled to move along the corresponding second slide rail to convey the tested chips to the unloading machine.

[0055] In the present application, the first test platform is arranged on one side of the testing machine and has at least one chip under test placed thereon, and the first test platform is arranged to be controlled to move along the front-back direction of the chip testing device. The second test platform is arranged on the side of the testing machine away from the first test platform and has at least one chip under test placed thereon, and the second test platform is arranged to be controlled to move along the front-back direction. The first test platform and the second test platform are arranged to alternately move into the testing machine, so that the testing machine alternately tests the chips under test on the first test platform and the second test platform. The above technical solution uses the mode that the first test platform and the second test platform alternately enter the testing machine, reduces the loading waiting time, and the testing machine alternately tests the chips under test on the first test platform and the second test platform, which is always in a testing state, so that the testing efficiency of the chips is improved.

[0056] Further, in the present application, the first conveying device and the second conveying device each include two third slide rails arranged in parallel and two tray components, each tray component is movably connected with one third slide rail and corresponds to one first loading and unloading device, and the tray component has a tray body for placing the chip under test. The two tray components are arranged to alternately move to the second loading and unloading device to receive the chip under test and transport the chip under test to the corresponding first loading and unloading device. The above technical solution alternately conveys the chip under test by the two tray components, compared with the technical solution of arranging only one tray component, the conveying efficiency of the chip under test can be improved, so that the testing efficiency is further improved.

[0057] The above and other objects, advantages and features of the present application will become more apparent from the following detailed description of specific embodiments thereof, taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0058] Some specific embodiments of the present application will be described in detail in the following with reference to the drawings, which are provided by way of illustration only and are non-limiting in nature. Where the same reference numerals are used in different drawings to refer to the same or like parts or portions, it should be understood that these drawings are not necessarily drawn to scale. In the drawings:

[0059] Figure 1 is a schematic diagram of a chip testing apparatus according to an embodiment of the present application;

[0060] Figure 2 is a schematic structural diagram of a chip testing apparatus according to an embodiment of the present application;

[0061] Figure 3 is Figure 1 is a schematic structural diagram of a first loading and unloading device, a first testing stage and a vision correction mechanism of a chip testing apparatus in

[0062] Figure 4 is Figure 1 is a schematic structural diagram of a first conveying device of a chip testing apparatus in

[0063] Figure 5 is Figure 1 is a schematic structural diagram of a second loading and unloading device of a chip testing apparatus in

[0064] Figure 6 is a schematic flowchart of a chip testing method according to an embodiment of the present application;

[0065] Figure 7 is a schematic flowchart of a chip testing method according to another embodiment of the present application;

[0066] Figure 8 is a schematic flowchart of a chip testing method according to yet another embodiment of the present application.

[0067] Reference numerals:

[0068] 100 - chip testing apparatus, 200 - chip under test, 10 - testing machine, 11 - guide rail, 20 - first testing stage, 30 - second testing stage, 40 - first loading and unloading device, 41 - first slide rail, 42 - first loading suction member, 43 - first unloading suction member, 50 - vision correction mechanism, 61 - first conveying device, 62 - second conveying device, 611 - tray body, 612 - third slide rail, 613 - fourth slide rail, 614 - tray member, 71 - loading machine, 72 - unloading machine, 73 - waste device, 74 - first detection device, 75 - second detection device, 80 - second loading and unloading device, 81 - second slide rail, 82 - second loading suction member, 83 - second unloading suction member. DETAILED DESCRIPTION

[0069] The embodiments of the present application will be described in detail below with reference to the attached drawings, wherein the same or similar components are denoted by the same or similar reference numerals, and therefore repeated description is omitted. The embodiments described below are examples for explaining the present application and are not intended to be limiting of the present application.

[0070] In the description of the present application, it is to be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "front", "rear", and the like is based on the orientation or positional relationship shown in the drawings, and is merely for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be construed to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be construed as limiting the present application.

[0071] The terms "first", "second", and the like are used only for the purpose of description, and cannot be construed to indicate or imply relative importance or imply the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features, i.e. one or more of the features. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically limited. When a certain feature "includes or contains" a certain or certain features, unless otherwise specifically described, it indicates that other features are not excluded and can further include other features.

[0072] Unless otherwise explicitly specified and limited, the terms "connection", "installation", and the like should be interpreted broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through an intermediate medium; it can be internal communication of two elements or interaction relationship between two elements, unless otherwise explicitly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in the present application according to the specific circumstances.

[0073] Unless otherwise limited, all terms (including technical terms and scientific terms) used in the description of the embodiments of the present application have the same meaning as generally understood by those skilled in the art to which the present application belongs.

[0074] Figure 1 is a schematic diagram of a chip testing device 100 according to an embodiment of the present application, Figure 2 is a schematic structural diagram of a chip testing device 100 according to an embodiment of the present application. As shown in Figure 1 and Figure 2As shown, in one specific embodiment, the chip testing device 100 comprises a testing machine 10, a first testing platform 20 and a second testing platform. The testing machine 10 is used to perform functional testing on the chips 200. The first testing platform 20 is arranged on one side of the testing machine 10 and at least one chip 200 is placed on the first testing platform 20. The first testing platform 20 is arranged to move along the front-to-back direction of the chip testing device 100 under control. The second testing platform 30 is arranged on the side of the testing machine 10 away from the first testing platform 20 and at least one chip 200 is placed on the second testing platform 30. The second testing platform 30 is arranged to move along the front-to-back direction under control. The first testing platform 20 and the second testing platform 30 are arranged to move into the testing machine 10 alternately so that the testing machine 10 performs functional testing on the chips 200 on the first testing platform 20 and the second testing platform 30 alternately. Here, the first testing platform 20 and the second testing platform 30 are arranged on opposite sides of the chip testing device 100 respectively.

[0075] This embodiment uses the first testing platform 20 and the second testing platform 30 to enter the testing machine 10 alternately, which reduces the waiting time for loading and unloading. The testing machine 10 performs testing on the chips 200 on the first testing platform 20 and the second testing platform 30 alternately, which is always in the testing state, so the testing efficiency of the chips is improved.

[0076] In some embodiments, the first testing platform 20 and the second testing platform 30 have the same structure. The testing machine 10 is provided with a guide rail 11 below, which extends along the front-to-back direction of the chip testing device 100, i.e. the up-to-down direction in Figure 1 . The first testing platform 20 and the second testing platform 30 are both mounted on the guide rail 11 and can slide along the guide rail 11, so as to enter the testing machine 10 alternately.

[0077] Figure 3 is Figure 1 a schematic structural diagram of the first loading and unloading device 40, the first testing platform 20 and the visual correction mechanism 50 of the chip testing device 100 in Figure 3 . As shown, and referring to Figure 1 and Figure 2In some embodiments, the chip testing equipment 100 further includes two first loading / unloading devices 40. One first loading / unloading device 40 is disposed on the side of the first test stage 20 away from the test machine 10, and is used to transport the chip under test 200 to the first test stage 20 and remove the chip under test 200 that has completed testing from the first test stage 20. The other first loading / unloading device 40 is disposed on the side of the second test stage 30 away from the test machine 10, and is used to transport the chip under test 200 to the second test stage 30 and remove the chip under test 200 that has completed testing from the second test stage 30. Here, it is equivalent to configuring one first loading / unloading device 40 for the first test stage 20 and the second test stage 30 respectively, so as to transport the chip under test 200 to the corresponding test stage and remove the chip under test 200 that has completed testing from the corresponding test stage. The two first loading / unloading devices 40 extend laterally along the chip testing equipment 100, that is... Figure 1 It extends in the left and right direction. The first test platform 20 and the second test platform 30 are arranged between the two first loading and unloading devices 40, and the testing machine 10 is arranged between the first test platform 20 and the second test platform 30.

[0078] In some embodiments, each first loading / unloading device 40 includes a first slide rail 41 and at least one first loading suction member 42 and at least one first unloading suction member 43. The first slide rail 41 extends laterally along the chip testing equipment 100. The first loading suction member 42 and the first unloading suction member 43 are slidably connected to the first slide rail 41. The first loading suction member 42 is used to suction the chip under test 200 and transport the chip under test 200 to the corresponding first test stage 20 or second test stage 30. The first unloading suction member 43 is used to suction and remove the chip under test 200 that has completed testing on the corresponding first test stage 20 or second test stage 30.

[0079] In some embodiments, the number of the first feeding adsorption member 42 and the first discharging adsorption member 43 is one.

[0080] In some embodiments, the first feeding adsorption member 42 and the first unloading adsorption member 43 have the same structure and the same number. Both the first feeding adsorption member 42 and the first unloading adsorption member 43 have at least one suction nozzle, and each nozzle can adsorb one chip 200 under test. To improve the handling efficiency of the chip 200 under test, multiple nozzles can be used to simultaneously handle multiple chips 200 under test. For example, two, three, four, or five nozzles can be used, and the number of nozzles is selected according to specific needs.

[0081] In some embodiments, multiple chips under test 200 can be placed on the first test stage 20 and the second test stage 30 to perform functional tests on multiple chips under test 200 simultaneously. For example, the first test stage 20 and the second test stage 30 can each test 16 chips simultaneously. Therefore, the nozzles of the first loading suction member 42 and the first unloading suction member 43 can both be set to 4, suctioning 4 chips under test 200 at a time. The first loading suction member 42 can suction 16 chips under test 200 by going back and forth 4 times, thereby completing the loading of chips under test 200. After all the chips under test 200 have been placed, the first test stage 20 or the second test stage 30 enters the testing machine 10 for testing.

[0082] In some embodiments, the chip testing equipment 100 further includes two vision correction mechanisms 50. Each vision correction mechanism 50 corresponds to a first loading / unloading device 40 and is slidably connected to the first slide rail 41 of the corresponding first loading / unloading device 40. The vision correction mechanism 50 is used to adjust the position of the chip under test 200 placed on the corresponding first test stage 20 or second test stage 30. Since the chip under test 200 may move and its position may change during transportation, this embodiment adjusts the position of the chip under test 200 before testing, thereby avoiding inaccurate testing due to position changes and improving the accuracy of the chip under test 200 testing. Here, the vision correction mechanism 50 can be any existing vision correction mechanism 50, and will not be described in detail here.

[0083] In some embodiments, the vision correction mechanism 50 can simultaneously adjust the positions of multiple chips under test 200, thereby improving the testing efficiency of the chips under test 200. For example, when 16 chips under test 200 are placed on the test platform, the vision correction mechanism 50 can adjust the positions of 4 chips under test 200 at a time, and after 4 adjustments, the position adjustment of all chips under test 200 can be completed.

[0084] Figure 4 yes Figure 1 A schematic structural diagram of the first conveying device 61 of the chip testing equipment 100. (See diagram for reference.) Figure 4 As shown, in some embodiments, the chip testing equipment 100 further includes a first transport device 61 and a second transport device 62, both arranged in the front-to-back direction and located on opposite sides of the test machine 10 in the lateral direction. Both the first transport device 61 and the second transport device 62 are used to transport the chip 200 under test in the front-to-back direction. The first loading / unloading device 40 is configured to pick up the chip 200 under test from the first transport device 61 and transport the tested chip 200 to the second transport device 62.

[0085] The embodiment adopts two conveying devices to respectively perform feeding and discharging of the measured chips 200, compared with the technical solution of adopting only one conveying device, the test efficiency of the measured chips 200 can be improved.

[0086] In some embodiments, the first conveying device 61 and the second conveying device 62 are of the same structure and extend along the front-rear direction of the chip testing device 100, that is, the up-down direction in the Figure 1 The first conveying device 61 and the second conveying device 62 are respectively located on the left and right sides of the first feeding and discharging device 40, the first feeding suction member 42 on the first feeding and discharging device 40 can suction the measured chips 200 from the first conveying device 61, the first discharging suction member 43 can suction the measured chips 200 after test and convey the measured chips 200 after test to the second conveying device 62, so that the second conveying device 62 performs discharging.

[0087] Figure 5 is Figure 1 a schematic structural view of the second feeding and discharging device 80 of the chip testing device 100. As Figure 5 indicated, and referring to Figure 1 and Figure 2 In some embodiments, the chip testing device 100 further comprises a feeding machine 71, a discharging machine 72 and the second feeding and discharging device 80. The feeding machine 71 is arranged at the front end of the chip testing device 100 and close to the first conveying device 61, for feeding the measured chips 200. The discharging machine 72 is arranged in parallel with the discharging machine 72 and close to the second conveying device 62, for discharging the measured chips 200 after test. The second feeding and discharging device 80 comprises a second sliding rail 81 arranged along the lateral direction of the chip testing device 100, at least one second feeding suction member 82 and at least one second discharging suction member 83, the second feeding suction member 82 and the second discharging suction member 83 are both slidably connected with the second sliding rail 81, the second feeding suction member 82 is used to convey the measured chips 200 on the feeding machine 71 to the first conveying device 61, and the second discharging suction member 83 is used to convey the measured chips 200 after test on the second conveying device 62 to the discharging machine 72. Here, the feeding machine 71 is used to feed wafers, and the wafers have a plurality of measured chips 200. When feeding the wafers, the gripper grabs the wafer in the basket and pulls the wafer out of the basket, so that the second feeding suction member 82 of the second feeding and discharging device 80 suctions the measured chips 200 on the wafer, thereby performing feeding. The structure of the discharging machine 72 is the same as that of the feeding machine 71, which is not described here.

[0088] In some embodiments, the structure of the second feeding suction member 82 is the same as that of the first feeding suction member 42, and the structure of the second discharging suction member 83 is the same as that of the second feeding suction member 82, which is not described here.

[0089] Referring to Figure 1 The first and second feeding and discharging devices 40 and 80 are arranged in parallel at the front end of the chip testing apparatus 100, and the second feeding and discharging device 80 extends along the left-right direction of the chip testing apparatus 100 and is located at the side of the feeding machine 71 close to the testing machine 10. That is, the second feeding and discharging device 80 is arranged in parallel with the two first feeding and discharging devices 40 and is used for feeding and discharging the tested chips 200. One of the second suction members of the second feeding and discharging device 80 suctions the tested chip 200 from the feeding machine 71 and carries the tested chip 200 to the first carrying device 61. Then the first carrying device 61 carries the tested chip 200 along the front-rear direction of the chip testing apparatus 100 to the first feeding and discharging device 40, which is equivalent to carrying the tested chip 200 from the front end to the rear end of the chip testing apparatus 100. Then the first feeding suction member 42 of the first feeding and discharging device 40 suctions the tested chip 200 on the first carrying device 61 and carries the tested chip 200 to the first test platform 20. Then the vision correction mechanism 50 corrects the position of the tested chip 200 on the first test platform 20, and after the correction is completed, the first test platform 20 moves along the guide rail 11 into the testing machine 10, so that the testing machine 10 performs functional testing on the tested chip 200. During the testing of the tested chip 200 on the first test platform 20, the second test platform 30 can be fed, that is, the first feeding suction member 42 of the other first feeding and discharging device 40 suctions the tested chip 200 to the second test platform 30, and then the vision correction mechanism 50 corrects the position of the tested chip 200. When the first test platform 20 moves out of the testing machine 10, the second test platform 30 moves along the guide rail 11 into the testing machine 10, so that the testing machine 10 performs functional testing on the tested chip 200 on the second test platform 30. It can be understood that the first test platform 20 and the second test platform 30 alternately enter the testing machine 10, which can improve the testing efficiency. After the first test platform 20 moves to the outside of the testing machine 10, the first discharging suction member 43 of the corresponding first feeding and discharging device 40 carries the tested chip 200 on the first test platform 20 to the second carrying device 62, and the second carrying device 62 carries the tested chip 200 along the front-rear direction of the chip testing apparatus 100 to the second feeding and discharging device 80. The second discharging suction member 83 of the second feeding and discharging device 80 suctions the tested chip 200 and carries it to the discharging machine 72 for discharging. When the tested chip 200 on the second test platform 30 is tested, the same discharging step as the first test platform 20 is performed.

[0090] In some embodiments, the first conveying device 61 and the second conveying device 62 each include two third sliding rails 612 arranged in parallel and two tray components 614, each of which is movably connected with one third sliding rail 612 and corresponds to one first loading and unloading device 40, and the tray component 614 has a tray body 611 for placing the tested chip 200. The two tray components 614 are arranged to be moved to the second loading and unloading device 80 alternately to receive the tested chip 200 and transport the tested chip 200 to the corresponding first loading and unloading device 40. Here, the tray body 611 has a plurality of mounting positions for placing the tested chip 200, and the plurality of mounting positions are arranged in an array.

[0091] Compared with the technical solution of arranging only one tray component 614, the embodiment can improve the conveying efficiency of the tested chip 200 and further improve the test efficiency by alternately conveying the tested chip 200 through the two tray components 614.

[0092] When one of the tray components 614 of the first conveying device 61 moves to the second loading and unloading device 80, the second loading and unloading device 80 adsorbs the tested chip 200 and conveys the tested chip 200 to the tray body 611 for loading. After the tray component 614 completes the loading, the tray component 614 is controlled to move along the second sliding rail 81 to the corresponding first loading and unloading device 40. During the movement of the tray component 614, the other tray component 614 can be controlled to move to the second loading and unloading device 80 for loading, so that the loading can be continuously performed, the waiting time for loading can be reduced, and the test efficiency can be improved.

[0093] In a preferred embodiment, each tray component 614 further includes a fourth sliding rail 613 arranged in the longitudinal direction, the fourth sliding rail 613 is slidably connected with the corresponding third sliding rail 612, and the tray component 614 is slidably connected with the fourth sliding rail 613 in the vertical direction. The tray bodies 611 of the two tray components 614 are arranged to move in different height planes.

[0094] The embodiment is equivalent to that the two tray bodies 611 can be arranged longitudinally overlapped, which can make the structure of the conveying device more compact and save arrangement space. In addition, compared with the technical solution of arranging only one conveying component, the embodiment can improve the conveying efficiency of the tested chip 200 and improve the test efficiency by alternately conveying the tested chip 200 through the two tray components 614.

[0095] When one of the tray bodies 611 is in the process of loading, the other tray body 611 can first move to the lower side of the tray body 611 to wait until the tray body 611 finishes loading and moves to the first loading and unloading device 40, and then the other tray body 611 can be controlled to rise along the corresponding fourth slide rail 613 to load.

[0096] In some embodiments, the chip testing device 100 further comprises a first detection device 74 and a second detection device 75. The first detection device 74 is arranged between the loading machine 71 and the first conveying device 61, and the second loading suction member 82 is arranged to convey the tested chip 200 on the loading machine 71 to the first detection device 74, so that the first detection device 74 performs visual detection on the tested chip 200, and the first detection device 74 conveys the tested chip 200 that passes the detection to the first conveying device 61. The second detection device 75 is arranged between the unloading machine 72 and the second conveying device 62, and the second unloading suction member 83 is arranged to convey the tested chip 200 that finishes the test on the second conveying device 62 to the second detection device 75, so that the second detection device 75 performs visual detection on the tested chip 200 that finishes the test, and the second detection device 75 conveys the tested chip 200 that passes the detection to the unloading machine 72. Here, the first detection device 74 and the second detection device 75 are both prior art in the field, and will not be described here.

[0097] In some embodiments, the chip testing device 100 further comprises a waste device 73 arranged between the loading machine 71 and the unloading machine 72, and the second loading suction member 82 and the second unloading suction member 83 are further arranged to convey the tested chip 200 that fails the detection to the waste device 73. Here, the waste device 73 has a waste box, and the tested chip 200 that fails the detection can be conveyed to the waste box.

[0098] Figure 6 is a schematic flow chart of a chip testing method according to an embodiment of the present application. As shown in Figure 6 the testing method applied to the chip testing device 100 of any of the above embodiments includes the following steps:

[0099] Step S100, in response to a control instruction of the test, control the first test platform 20 to move into the test machine 10;

[0100] Step S200, control the test machine 10 to perform functional test on the tested chip 200 on the first test platform 20;

[0101] Step S300, after the tested chip 200 finishes the test, control the first test platform 20 to move to the outside of the test machine 10;

[0102] Step S400, control the second test platform 30 to move into the test machine 10;

[0103] Step S500, control the tester 10 to perform functional test on the DUT 200 on the second test platform 30.

[0104] Step S600, after the test of the DUT 200 is completed, control the second test platform 30 to move to the outside of the tester 10, and repeat the above steps.

[0105] The embodiment adopts the mode that the first test platform 20 and the second test platform 30 alternately enter the tester 10, reduces the loading waiting time, and the tester 10 alternately tests the DUT 200 on the first test platform 20 and the second test platform 30, and is always in the test state, so that the test efficiency of the chip is improved.

[0106] Figure 7 is a schematic flow chart of a chip test method according to another embodiment of the present application. As shown in Figure 7 Before step S100, the following steps are further included:

[0107] Step S10, in response to the control instruction of loading, control the two carrier disc components 614 of the first conveying device 61 to alternately move to the second loading and unloading device 80 to sequentially receive the DUT 200 adsorbed by the second loading and unloading suction member 82 from the loading machine 71;

[0108] Step S20, control the two carrier disc components 614 of the first conveying device 61 to alternately move along the corresponding third slide rail 612 to the corresponding first loading and unloading device 40, so that the first loading and unloading suction member 42 of the two first loading and unloading devices 40 respectively adsorbs the DUT 200 on the corresponding carrier disc component 614;

[0109] Step S30, control the first loading and unloading suction member 42 of the two first loading and unloading devices 40 to move along the corresponding first slide rail 41 to convey the DUT 200 to the corresponding first test platform 20 or second test platform 30.

[0110] The embodiment conveys the DUT 200 by the two carrier disc components 614 alternately, compared with the technical solution that only one carrier disc component 614 is arranged, the loading efficiency of the DUT 200 can be improved, so that the test efficiency is further improved.

[0111] In some embodiments, after step S30, the following steps are further included:

[0112] Step S40, control the two visual correction mechanisms 50 to respectively adjust the positions of the DUT 200 on the first test platform 20 and the second test platform 30.

[0113] Since the measured chip 200 can move during the conveying process, the position of the measured chip 200 can change, so the embodiment adjusts the position of the measured chip 200 before the measured chip 200 is tested, so that the situation that the measured chip 200 is not accurately tested due to the change of the position can be avoided, and the accuracy of the test of the measured chip 200 can be improved.

[0114] Figure 8 is a schematic flow chart of a chip testing method according to still another embodiment of the present application. As shown in Figure 8 the schematic flow chart further comprises the following steps:

[0115] In step S610, in response to the control instruction of the unloading, the two tray components 614 of the second conveying device 62 are controlled to alternately move to the corresponding second unloading device 80 to receive the tested measured chips 200 adsorbed by the corresponding first unloading adsorption member 43.

[0116] In step S620, the two tray components 614 of the second conveying device 62 are controlled to alternately move to the second unloading device 80, so that the second unloading adsorption member 83 of the second unloading device 80 adsorbs the tested measured chips 200 on the two tray components 614 in turn.

[0117] In step S630, the second adsorption component is controlled to move along the corresponding second sliding rail 81 to convey the tested measured chips 200 to the unloading machine 72.

[0118] The embodiment conveys the tested measured chips 200 by the two tray components 614 alternately, compared with the technical solution of arranging only one tray component 614, the unloading efficiency of the measured chips 200 can be improved, so that the test efficiency is further improved.

[0119] At this point, those skilled in the art should recognize that although the present application has been shown and described in detail with respect to a number of exemplary embodiments, many other variations and modifications can be determined or deduced directly from the disclosure of the present application in accordance with the principles of the present application without departing from the spirit and scope of the present application. Therefore, the scope of the present application should be understood and recognized as covering all these other variations or modifications.

Claims

1. A chip testing device, characterized in that, include: A test machine is used to perform functional tests on the chip under test. A first test stage is disposed on one side of the test machine, and at least one chip to be tested is placed on it. The first test stage is configured to move in a controlled manner along the front-back direction of the chip test equipment. The second test stage is disposed on the side of the test machine away from the first test stage, and at least one of the chips under test is placed on it. The second test stage is configured to move in a controlled manner along the front-back direction. The first test stage and the second test stage are configured to move alternately into the test machine, so that the test machine alternately performs functional tests on the chip under test on the first test stage and the second test stage.

2. The chip testing equipment according to claim 1, characterized in that, It also includes two first loading and unloading devices; One of the first loading and unloading devices is located on the side of the first test platform away from the test machine, and is used to transport the chip under test to the first test platform and remove the chip under test that has completed the test from the first test platform. Another of the first loading and unloading devices is located on the side of the second test platform away from the test machine, and is used to transport the chip under test to the second test platform and remove the chip under test that has completed the test from the second test platform.

3. The chip testing equipment according to claim 2, characterized in that, Each of the first loading and unloading devices includes: The first slide rail extends laterally along the chip testing equipment; At least one first loading adsorption element and at least one first unloading adsorption element are slidably connected to the first slide rail. The first loading adsorption element is used to adsorb the chip under test and transport the chip under test to the corresponding first test stage or second test stage. The first unloading adsorption element is used to adsorb and remove the chip under test that has completed the test on the corresponding first test stage or second test stage.

4. The chip testing equipment according to claim 3, characterized in that, Also includes: Two vision correction mechanisms are provided, each of which corresponds to one of the first loading and unloading devices and is slidably connected to the first slide rail of the corresponding first loading and unloading device. The vision correction mechanism is used to adjust the position of the chip under test placed on the corresponding first test stage or second test stage.

5. The chip testing equipment according to any one of claims 2-4, characterized in that, Also includes: The first transport device and the second transport device are both arranged along the front-back direction and are located on both sides of the transverse direction of the test machine. The first transport device and the second transport device are both used to transport the chip under test in the front-back direction. The first loading and unloading device is configured to pick up the chip under test from the first transport device and transport the chip under test after the test is completed to the second transport device.

6. The chip testing equipment according to claim 5, characterized in that, Also includes: A loading machine is located at the front end of the chip testing equipment and close to the first conveying device, and is used to load the chip to be tested. A feeding machine is arranged parallel to the feeding machine and close to the second conveying device, and is used to feed the tested chip after the test has been completed; The second loading and unloading device includes a second slide rail arranged laterally along the chip testing equipment, at least one second loading adsorption component, and at least one second unloading adsorption component. The second loading adsorption component and the second unloading adsorption component are slidably connected to the second slide rail. The second loading adsorption component is used to transport the chip under test on the loading machine to the first transport device, and the second unloading adsorption component is used to transport the chip under test that has completed testing on the second transport device to the unloading machine.

7. The chip testing equipment according to claim 6, characterized in that, Both the first and second conveying devices include: Two parallel third slide rails; Two tray components, each of which is movably connected to one of the third slide rails and corresponds to one of the first loading and unloading devices, wherein each tray component has a tray body for placing the chip under test; The two carrier disk components are configured to move alternately to the second loading / unloading device to receive the chip under test and transport the chip under test to the corresponding first loading / unloading device.

8. The chip testing equipment according to claim 7, characterized in that, Each of the aforementioned carrier disk components also includes: The fourth slide rail is arranged longitudinally and is slidably connected to the corresponding third slide rail, and the tray component is slidably connected to the fourth slide rail vertically; The disk bodies of the two disk components are configured to move in a plane at different heights.

9. The chip testing equipment according to claim 6, characterized in that, Also includes: A first detection device is disposed between the feeder and the first conveying device. The second feeder adsorption component is configured to convey the chip under test on the feeder to the first detection device, so that the first detection device can perform visual inspection on the chip under test and convey the qualified chip under test to the first conveying device. A second detection device is disposed between the unloading machine and the second conveying device. The second unloading adsorption component is configured to transport the tested chip that has completed the test from the second conveying device to the second detection device, so that the second detection device performs visual inspection on the tested chip that has completed the test and transports the tested chip that has passed the inspection to the unloading machine.

10. The chip testing equipment according to claim 9, characterized in that, Also includes: A waste disposal device is disposed between the feeder and the unfeeder. The second feed adsorption member and the second unfeed adsorption member are further configured to transport the tested chip that fails the test to the waste disposal device.

11. A test method applied to the chip test equipment as described in any one of claims 1-10, characterized in that, Includes the following steps: In response to a test control command, the first test platform is moved into the test machine; The test machine is controlled to perform functional tests on the chip under test on the first test platform; After the chip under test completes the test, the first test stage is moved to the outside of the test machine. Control the second test platform to move into the test machine; The test machine is controlled to perform functional tests on the chip under test on the second test platform; After the chip under test completes the test, the second test stage is moved to the outside of the test machine, and the above steps are repeated.

12. The test method according to claim 11, characterized in that, In response to a test control command, the step of controlling the first test platform to move into the test machine further includes the following steps: In response to the control command for receiving materials, the two tray components of the first conveying device are controlled to move alternately to the second loading and unloading device to receive the tested chip adsorbed by the second loading adsorption component from the loading machine in sequence. The two carrier components of the first conveying device are controlled to move alternately along the corresponding third slide rail to the corresponding first loading and unloading device, so that the first loading adsorption components of the two first loading and unloading devices adsorb the chip under test on the corresponding carrier component respectively. The first loading and unloading devices are controlled to move along the corresponding first slide rails to transport the chip under test to the corresponding first test stage or second test stage.

13. The test method according to claim 12, characterized in that, The step of controlling the first feeding and adsorption component to move along the corresponding first slide rail to transport the chip under test to the corresponding first test stage or second test stage further includes the following steps: Two vision correction mechanisms are controlled to adjust the position of the chip under test on the first test stage and the second test stage, respectively.

14. The test method according to claim 13, characterized in that, It also includes the following steps: In response to the control command for unloading, the two tray components of the second conveying device are controlled to move alternately to the corresponding second unloading device to receive the tested chip that has completed the test and adsorbed by the corresponding first unloading adsorption component. The two carrier components of the second conveying device are controlled to move alternately to the second loading and unloading device, so that the second unloading adsorption element of the second loading and unloading device sequentially adsorbs the tested chip that has been tested on the two carrier components; The second feeding adsorption component is controlled to move along the corresponding second slide rail to transport the tested chip to the feeding machine after the test is completed.

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