Testing equipment compatible with chip and wafer testing

Abstract

The invention discloses testing equipment compatible with chip and wafer testing, and relates to the technical field of semiconductor testing, the testing equipment comprises a material table, a testing table and a transfer device, the top of the material table is provided with a conveying mechanism and a material box mechanism, the conveying mechanism extends in the longitudinal direction, and the testing table is provided with a material box; the two sides of the top of the conveying mechanism in the longitudinal direction are a feeding and discharging side and a material taking and placing side respectively, the material box mechanism is arranged close to the feeding and discharging side, the material box mechanism is used for containing a material bin, and the material bin is used for containing a diaphragm capsule bearing a chip; the test bench comprises a rack, a test mechanism and a loading mechanism, the test mechanism and the loading mechanism are arranged on the rack, a first loading and unloading station, a test station and a second loading and unloading station are sequentially arranged on the rack in the longitudinal direction, and the test mechanism is arranged above the loading mechanism and corresponds to the position of the test station; the transfer device is arranged at the top of the material table and is close to the material taking and placing side, and the transfer device extends in the transverse direction and crosses the test table. The testing of chips and wafers can be compatible, and the flexibility and the universality are better.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor testing, in particular to a test equipment compatible with chip and wafer testing. BACKGROUND

[0002] In semiconductor testing, since the semiconductor chip is widely used, it is applied in various complex environments, so it must be tested before being put into use, and the chip is a semiconductor device cut from a wafer, so the wafer also needs to be tested before being cut into chips, so as to exclude wafers with low yield before cutting and save production resources. However, the current test equipment can only test one of the chip or the wafer, and the function is relatively single, and the versatility is poor. SUMMARY

[0003] The main purpose of the present application is to provide a test equipment compatible with chip and wafer testing, which aims to solve the technical problems of single function and poor versatility of the existing test equipment.

[0004] To achieve the above purpose, the present application provides a test equipment compatible with chip and wafer testing, which comprises: A material table, the top of the material table is provided with a conveying mechanism and a magazine mechanism, the conveying mechanism extends in the longitudinal direction, and the top of the conveying mechanism and the two sides in the longitudinal direction are respectively the feeding and discharging side and the taking and placing side, the magazine mechanism is arranged close to the feeding and discharging side, the magazine mechanism is used for placing a hopper, the hopper is used for placing a film box carrying chips, the magazine mechanism is used for moving the film box in the hopper to the conveying mechanism, the conveying mechanism is used for transferring the film box to the taking and placing side, and is also used for placing the film box on the taking and placing side back into the hopper; A test table, the test table is arranged on one side of the material table in the transverse direction, the test table comprises a rack, a test mechanism and a material carrying mechanism arranged on the rack, the rack is sequentially provided with a first feeding and discharging station, a test station and a second feeding and discharging station in the longitudinal direction, the material carrying mechanism can move between the test station and the first feeding and discharging station and between the test station and the second feeding and discharging station, and the test mechanism is arranged above the material carrying mechanism and corresponds to the position of the test station; A transfer device, the transfer device is arranged on the top of the material table and close to the taking and placing side, and extends in the transverse direction and across the test table; The transfer device is used to transfer the chips to be tested in the film box transferred to the second loading and unloading station, the carrying mechanism is used to receive the chips to be tested transferred to the second loading and unloading station by the transfer device or receive the wafer to be tested at the first loading and unloading station and transfer to the test station, and test the chips to be tested or the wafer to be tested at the test station by the test mechanism, the carrying mechanism is also used to transfer the tested wafer to the first loading and unloading station and transfer the tested chip to the second loading and unloading station, and the transfer device is also used to transfer the tested chip transferred to the second loading and unloading station to the film box at the loading and unloading side.

[0005] In an embodiment, the number of the magazine mechanism and the conveying mechanism is two, and the two conveying mechanisms are arranged in transverse direction, and the two conveying mechanisms are respectively a first conveying mechanism and a second conveying mechanism, and the two magazine mechanisms are respectively a first magazine mechanism and a second magazine mechanism. The first conveying mechanism is provided with a loading station and a taking station on the two sides in longitudinal direction, and the second conveying mechanism is provided with a unloading station and a placing station on the two sides in longitudinal direction, the first magazine mechanism is arranged corresponding to the loading station, and the second magazine mechanism is arranged corresponding to the unloading station. The first magazine mechanism is used to transfer the film box in the magazine to the loading station, and the first conveying mechanism is used to transfer the film box at the loading station to the taking station, the second magazine mechanism is used to transfer the film box in the magazine to the unloading station, and the second conveying mechanism is used to transfer the film box at the unloading station to the placing station, the transfer device is used to transfer the chips to be tested in the film box transferred to the taking station to the second loading and unloading station, and also used to transfer the tested chip to the film box at the placing station, and the second conveying mechanism is also used to transfer the film box with the tested chip at the placing station to the magazine on the second magazine mechanism.

[0006] In an embodiment, the magazine comprises two supporting plates arranged in transverse direction, and a loading space is formed between the two supporting plates, and the magazine is provided with an opening and an outlet on the two sides in longitudinal direction and communicating with the loading space. The opposite side of the two supporting plates is provided with a plurality of grooves arranged in vertical direction, and a placing area is formed between the two corresponding grooves on the two supporting plates, and a carrier disc is placed in the placing area, and the film box is placed on the carrier disc, and the carrier disc at the placing area is inserted into the corresponding two grooves and supported on the bottom groove wall of the grooves.

[0007] In an embodiment, a plurality of limiting areas are formed on the tray, each of the limiting areas is used for placing a film cartridge, an edge of the film cartridge is provided with a step with a step surface facing upward, a pressing piece is arranged on the tray near each of the limiting areas, and the pressing piece is in abutment with the step surface.

[0008] In an embodiment, a mounting plate is arranged on the top of the material table, each of the cartridge mechanisms comprises: a support plate arranged on the top of the mounting plate, a plurality of limiting blocks are arranged on the top of the support plate, and the limiting blocks enclose a limiting space, and the cartridge is placed in the limiting space; a lifting module arranged on the bottom of the mounting plate, the lifting module is used for driving the support plate to vertically lift relative to the mounting plate; a push rod assembly arranged on the top of the mounting plate and located on a side of the support plate away from the conveying mechanism, the push rod assembly is used for pushing the tray with the film cartridge from the outlet to the conveying mechanism.

[0009] In an embodiment, the lifting module comprises a lifting shaft and a driving assembly, the lifting shaft is vertically arranged in the support plate, the top of the lifting shaft is connected with the support plate, the driving assembly is connected with the bottom of the lifting shaft, and the driving assembly is used for driving the lifting shaft to lift to drive the cartridge to lift. The bottom of the support plate is further provided with a guide rod, the guide rod extends vertically, and the guide rod is slidably arranged in the mounting plate.

[0010] In an embodiment, the push rod assembly comprises a fixing seat, a first cylinder and a push rod, the fixing seat is mounted on the top of the mounting plate, the first cylinder is arranged on the top of the fixing seat, the push rod is connected with the first cylinder, and the first cylinder is used for driving the push rod to extend or retract towards the cartridge.

[0011] In an embodiment, the conveying mechanism comprises: a support leg mounted on the top of the material table; a conveying table supported on the top of the support leg, the conveying table extends longitudinally, and two sides of the conveying table in the longitudinal direction are the feeding and discharging side and the taking and placing side respectively, the top of the conveying table is provided with a chute extending longitudinally, the top of the chute is provided with a conveying belt, and the top of the conveying table is used for receiving the film cartridge on the feeding and discharging side and transferring the film cartridge to the taking and placing side through the conveying belt; A push disc assembly is arranged in the chute and corresponds to the feeding and discharging side, and comprises a second air cylinder and a push plate. The second air cylinder is used to drive the push plate to extend out of the chute, so as to push the film box located at the feeding and discharging side into the hopper.

[0012] In an embodiment, the object carrying mechanism comprises: A moving base is arranged on the frame. An object table is connected to the top of the moving base, and the moving base is used to drive the object table to move in the transverse and longitudinal directions, so that the object table can move between the first feeding and discharging station and the test station, and between the test station and the second feeding and discharging station. A chuck is arranged on the top of the object table, and the chuck is used to carry a chip.

[0013] In an embodiment, the transfer device comprises: A gantry is arranged with a slide rail extending in the transverse direction. A taking mechanism comprises a slide plate, a driving member and a suction accessory. The slide plate is in sliding connection with the slide rail. The driving member is arranged on the side of the slide plate away from the slide rail. The suction accessory is arranged at the bottom of the driving member. The driving member is used to drive the suction accessory to ascend and rotate. The suction accessory is used to adsorb a chip.

[0014] The test equipment compatible with chip and wafer test of the application, by setting conveying mechanism and magazine mechanism on the material table, the magazine mechanism is used for placing the hopper, the hopper is used for placing the film box bearing the chip, during the test, by placing the film box loaded with the chip to be tested in the hopper, and placing the hopper on the magazine mechanism, the magazine mechanism automatically moves the film box loaded with the chip to be tested to the conveying mechanism, through the conveying mechanism to the material taking and placing side, and through the transfer device to transfer the chip to be tested on the material taking and placing side to the second feeding and discharging station, the chip to be tested is received by the material carrying mechanism and transferred to the test station, and the test is carried out through the test mechanism, the tested chip is transferred back to the second feeding and discharging station through the material carrying mechanism, and the tested chip is transferred from the second feeding and discharging station to the film box on the material taking and placing side through the transfer device, and the film box is placed in the hopper through the conveying mechanism, realizing the automatic feeding and discharging and automatic test process of the chip. In addition, by setting the second feeding and discharging station, the wafer test can also be realized, the wafer to be tested is transferred to the second feeding and discharging station by artificial, and the wafer to be tested is transferred to the test station by the material carrying mechanism, the wafer to be tested is tested by the test mechanism, and the tested wafer is transferred to the second feeding and discharging station by the material carrying mechanism, and the tested wafer is taken out by artificial, realizing the semi-automatic test of the wafer. It can be seen that the test equipment of the application can be compatible with chip and wafer test, and has better flexibility and versatility. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only show some embodiments of the application, and other drawings can also be obtained by those skilled in the art without any creative effort based on the drawings shown.

[0016] Figure 1 The structural schematic diagram of the test equipment provided by an embodiment of the application is shown in the figure. Figure 2 The structural schematic diagram of the magazine mechanism and conveying mechanism in the test equipment provided by an embodiment of the application is shown in the figure. Figure 3 The structural schematic diagram of the magazine mechanism in the test equipment provided by an embodiment of the application is shown in the figure. Figure 2 The local enlarged view of A in the figure. Figure 4 The structural schematic diagram of the magazine mechanism in the test equipment provided by an embodiment of the application is shown in the figure. Figure 5 The structural schematic diagram of the magazine mechanism in the test equipment provided by an embodiment of the application is shown in the figure. Figure 6 The structural schematic diagram of the push rod assembly in the test equipment provided by an embodiment of the application is shown in the figure. Figure 7 Structure diagram of conveying mechanism in test equipment provided by an embodiment of the present application is shown in the figure; Figure 8 Structure diagram of push disc assembly in test equipment provided by an embodiment of the present application is shown in the figure; Figure 9 Part structure diagram of test table in test equipment provided by an embodiment of the present application is shown in the figure; Figure 10 Structure diagram of object table in test equipment provided by an embodiment of the present application is shown in the figure; Figure 11 Structure diagram of transfer device in test equipment provided by an embodiment of the present application is shown in the figure.

[0017] Explanation of reference numerals: 100, test equipment; 1, object table; 11, magazine mechanism; 11a, first magazine mechanism; 11b, second magazine mechanism; 111, support plate; 1111, limiting block; 112, lifting module; 1121, lifting shaft; 1122, driving assembly; 113, guide rod; 114, push rod assembly; 1141, fixed seat; 1142, first air cylinder; 1143, push rod; 12, conveying mechanism; 12a, first conveying mechanism; 12b, second conveying mechanism; 121, support leg; 122, conveying table; 1221, chute; 1222, conveying belt; 123, push disc assembly; 1231, second air cylinder; 1232, push plate; 13, magazine; 131, support plate; 1311, groove; 132, boxing space; 14, carrier disc; 141, film box; 142, box pressing elastic sheet; 15, mounting plate; 2, test table; 21, rack; 211, first feeding and discharging station; 212, second feeding and discharging station; 213, test station; 22, test mechanism; 23, object carrying mechanism; 231, movement base; 232, object table; 233, chuck; 2331, first adsorption hole; 2332, second adsorption hole; 24, shielding cabin; 241, through hole; 242, first cabin door; 25, identification mechanism; 251, support; 252, microscope; 3, transfer device; 31, gantry; 32, material taking mechanism; 321, sliding plate; 322, driving piece; 323, suction accessory.

[0018] The implementation, functional features and advantages of the present application will be further explained with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0019] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by a person of ordinary skill in the art without creative effort are within the scope of the present application.

[0020] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship, movement condition, etc. between components in a certain posture, and if the certain posture changes, the directional indications also change accordingly.

[0021] In addition, if the embodiments of the present application involve descriptions such as “first”, “second”, etc., the descriptions of “first”, “second”, etc. are only for description purposes, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by “first”, “second” can explicitly or implicitly include at least one of the features. In addition, “and / or” or “and / or” appearing throughout the text means that the three parallel schemes include A scheme, or B scheme, or A and B are satisfied at the same time. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of a person of ordinary skill in the art, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the scope of protection required by the present application.

[0022] The present application provides a test equipment 100 compatible with chip and wafer testing.

[0023] Please refer to Figure 1In an embodiment of the present application, the test equipment 100 compatible with the chip and wafer tests comprises a material table 1, a test table 2 and a transfer device 3. The top of the material table 1 is provided with a conveying mechanism 12 and a magazine mechanism 11. The conveying mechanism 12 extends longitudinally, and the top and both sides of the conveying mechanism 12 along the longitudinal direction are the loading and unloading side and the material taking and placing side, respectively. The magazine mechanism 11 is arranged close to the loading and unloading side, and the magazine mechanism 11 is used to place a magazine 13 thereon. The magazine 13 is used to place a film box 141 carrying chips. The magazine mechanism 11 is used to move the film box 141 in the magazine 13 to the conveying mechanism 12. The conveying mechanism 12 is used to transfer the film box 141 to the material taking and placing side, and is also used to place the film box 141 on the material taking and placing side back into the magazine 13. The test table 2 is arranged on one side of the material table 1 along the transverse direction. The test table 2 comprises a rack 21, a test mechanism 22 and a material carrying mechanism 23 arranged on the rack 21. The rack 21 is sequentially provided with a first loading and unloading station 211, a test station 213 and a second loading and unloading station 212 along the longitudinal direction. The material carrying mechanism 23 is movable between the test station 213 and the first loading and unloading station 211, and between the test station 213 and the second loading and unloading station 212. The test mechanism 22 is arranged above the material carrying mechanism 23 and corresponds to the position of the test station 213. The transfer device 3 is arranged on the top of the material table 1 and close to the material taking and placing side. The transfer device 3 extends along the transverse direction and across the test table 2.

[0024] The transfer device 3 is used to transfer the chips to be tested in the film box 141 transferred to the material taking and placing side to the second loading and unloading station 212. The material carrying mechanism 23 is used to receive the chips to be tested transferred by the transfer device 3 to the second loading and unloading station 212 at the second loading and unloading station 212, or receive the wafer to be tested at the first loading and unloading station 211 and transfer the wafer to be tested to the test station 213. The chips or wafer to be tested located at the test station 213 are tested by the test mechanism 22. The material carrying mechanism 23 is also used to transfer the tested wafer to the first loading and unloading station 211 and transfer the tested chips to the second loading and unloading station 212. The transfer device 3 is also used to transfer the tested chips transferred to the second loading and unloading station 212 to the film box 141 located at the material taking and placing side.

[0025] The test equipment 100 compatible with chip and wafer test of the application, by setting the conveying mechanism 12 and the magazine mechanism 11 on the material table 1, the magazine mechanism 11 is used for placing the hopper 13, the hopper 13 is used for placing the film box 141 bearing the chip, during the test, by placing the film box 141 loaded with the chip to be tested in the hopper 13, and placing the hopper 13 on the magazine mechanism 11, the magazine mechanism 11 automatically moves the film box 141 loaded with the chip to be tested to the conveying mechanism 12, and is conveyed to the material taking and placing side through the conveying mechanism 12, and the chip to be tested located at the material taking and placing side is transferred to the second material loading and unloading station 212 through the transfer device 3, the chip to be tested is received by the material carrying mechanism 23 and is transferred to the test station 213, and is tested through the test mechanism 22, the tested chip is transferred back to the second material loading and unloading station 212 through the material carrying mechanism 23, and the tested chip is transferred from the second material loading and unloading station 212 to the film box 141 located at the material taking and placing side through the transfer device 3, and the film box 141 is placed in the hopper 13 through the conveying mechanism 12, realizing the automatic material loading and unloading and automatic test process of the chip; in addition, by setting the second material loading and unloading station 212, the wafer test can also be realized, the wafer to be tested is transferred to the second material loading and unloading station 212 by artificial, and the wafer to be tested is transferred to the test station 213 through the material carrying mechanism 23, the wafer to be tested is tested through the test mechanism 22, and the tested wafer is transferred back to the second material loading and unloading station 212 through the material carrying mechanism 23, and the tested wafer is taken out by artificial, realizing the semi-automatic test of the wafer. It can be seen that the test equipment 100 of the application can be compatible with the test of the chip and the wafer, and the flexibility and the versatility are better.

[0026] It should be noted that the transverse direction, the longitudinal direction and the vertical direction in the embodiment are respectively Figure 1 left-right, front-rear and up-down directions in

[0027] Please refer to Figure 2 and Figure 4In an embodiment, the number of the magazine mechanisms 11 and the conveying mechanisms 12 is two, the two conveying mechanisms 12 are arranged in transverse direction, the two conveying mechanisms 12 are respectively a first conveying mechanism 12a and a second conveying mechanism 12b, and the two magazine mechanisms 11 are respectively a first magazine mechanism 11a and a second magazine mechanism 11b; the first conveying mechanism 12a is provided with an upper feeding station and a taking station on the two sides in longitudinal direction respectively, the second conveying mechanism 12b is provided with a lower feeding station and a discharging station on the two sides in longitudinal direction respectively, the first magazine mechanism 11a is arranged corresponding to the upper feeding station, and the second magazine mechanism 11b is arranged corresponding to the lower feeding station; the first magazine mechanism 11a is used for transferring the film box 141 in the magazine 13 thereon to the upper feeding station, the first conveying mechanism 12a is used for transferring the film box 141 in the upper feeding station to the taking station; the second magazine mechanism 11b is used for transferring the film box 141 in the magazine 13 thereon to the lower feeding station, and the second conveying mechanism 12b is used for transferring the film box 141 in the lower feeding station to the discharging station; the transferring device 3 is used for transferring the chip to be tested in the film box 141 transferred to the taking station to the second upper and lower feeding station 212, and is also used for transferring the tested chip to the film box 141 in the discharging station, and the second conveying mechanism 12b is also used for transferring the film box 141 with the tested chip in the discharging station to the magazine 13 on the second magazine mechanism 11b.

[0028] It can be understood that by arranging two conveying mechanisms 12 and two magazine mechanisms 11, one of the magazine mechanisms 11 is mainly used for placing the upper feeding magazine 13, the upper feeding magazine 13 is used for placing the film box 141 carrying the chip to be tested, and the other magazine is mainly used for placing the lower feeding magazine 13, the lower feeding magazine 13 is used for placing the tested chip. In the testing process, the magazine 13 full of the chip to be tested is placed on the first magazine mechanism 11a by hand, the magazine 13 with the empty film box 141 is placed on the second magazine mechanism 11b, the first magazine mechanism 11a transfers the film box 141 in the magazine 13 thereon to the first conveying mechanism 12a, and then the film box 141 is conveyed to the taking station by the first conveying mechanism 12a, the transferring device 3 transfers the chip to be tested in the taking station, after the testing is completed, the transferring device 3 transfers the tested chip to the discharging station and places the tested chip in the film box 141, when the film box 141 in the discharging station is full of the tested chip, the second conveying mechanism 12b transfers the film box 141 to the magazine 13 on the second magazine mechanism 11b; after all the film boxes 141 in the magazine 13 on the second magazine mechanism 11b are full of the tested chip, the magazine 13 is taken off from the second magazine mechanism 11b by hand.

[0029] It can be seen that by arranging two conveying mechanisms 12 and two magazine mechanisms 11, the feeding of the chips to be tested and the unloading of the tested chips can be performed synchronously and without interference, and after the tested chips are transferred to the unloading station by the transfer device 3, the chips to be tested can be immediately picked up at the feeding station, thereby reducing the waiting time of the transfer device 3 and improving the testing efficiency.

[0030] Please refer to Figure 5 In an embodiment, the magazine 13 includes two support plates 131 arranged in a transverse direction, and a loading space 132 is formed between the two support plates 131. The magazine 13 is provided with an opening and an outlet on both sides in a longitudinal direction, and the opening and the outlet are in communication with the loading space 132. Each of the two support plates 131 is provided with a plurality of grooves 1311 arranged in a vertical direction on the side opposite to the loading space 132. A placement area is formed between the two grooves 1311 on the two support plates 131, and a carrier plate 14 is placed in the placement area. The film magazine 141 is placed on the carrier plate 14, and the carrier plate 14 in the placement area extends into the corresponding two grooves 1311 in a transverse direction and is supported on the bottom groove wall of the grooves 1311.

[0031] It can be understood that the magazine 13 includes two support plates 131, and each of the two support plates 131 is provided with a groove 1311 on the side facing the loading space 132. Each groove 1311 extends in a longitudinal direction, and a placement area is formed between the two grooves 1311 arranged oppositely. The carrier plate 14 is placed in the placement area. The magazine mechanism 11 is used to transfer the carrier plate 14 on which the film magazine 141 is placed to the conveying mechanism 12, and the conveying mechanism 12 is also used to transfer the carrier plate 14 on which the film magazine 141 is placed to the magazine 13. By arranging a plurality of placement areas, a plurality of carrier plates 14 and a plurality of film magazines 141 can be placed in the magazine 13. During testing, more chips to be tested can be placed at one time, and each carrier plate 14 is independently placed in a vertical direction, which facilitates the magazine mechanism 11 to transfer a single carrier plate 14 to the conveying mechanism 12. When the carrier plate 14 is moved out of the loading space 132, the carrier plate 14 slides along the extension direction of the groove 1311. The groove 1311 has a guiding effect on the movement of the carrier plate 14, which ensures that the carrier plate 14 can be accurately transferred to the conveying mechanism 12.

[0032] Please refer to Figure 2 and Figure 3 In an embodiment, the carrier plate 14 is provided with a plurality of limiting areas, each of which is used to place a film magazine 141. The edge of the film magazine 141 is provided with a stepped surface with a step facing upward. The carrier plate 14 is provided with a magazine pressing spring 142 near each limiting area, and the magazine pressing spring 142 is in abutment with the stepped surface.

[0033] It can be understood that by forming a plurality of limiting areas on the carrier disc 14, each limiting area can place a film box 141, that is, a plurality of film boxes 141 can be placed on one carrier disc 14; and the edge of the film box 141 is provided with a step, when the film box 141 is placed in the limiting area, the step surface is abutted by the pressing box spring 142 arranged close to the limiting area, so as to limit the film box 141 in the limiting area, avoid the film box 141 from shaking and deviating during the transfer of the carrier disc 14, further avoid the chip in the film box 141 from shaking, and the reliability is better.

[0034] Please refer to Figure 4 In an embodiment, the top of the material table 1 is provided with a mounting plate 15, each material box mechanism 11 includes a support plate 111, a lifting module 112 and a push rod assembly 114; the support plate 111 is located on the top of the mounting plate 15, the top of the support plate 111 is provided with a plurality of limiting blocks 1111, and the plurality of limiting blocks 1111 enclose a limiting space, and the material bin 13 is placed in the limiting space; the lifting module 112 is arranged at the bottom of the mounting plate 15, and the lifting module 112 is used to drive the support plate 111 to vertically ascend and descend relative to the mounting plate 15; the push rod assembly 114 is arranged at the top of the mounting plate 15 and located on the side of the support plate 111 away from the conveying mechanism 12, and the push rod assembly 114 is used to push the carrier disc 14 at any of the placement areas from the outlet to the conveying mechanism 12.

[0035] It can be understood that the material box mechanism 11 includes the support plate 111, the lifting module 112 and the push rod assembly 114, and the limiting blocks 1111 are arranged on the top of the support plate 111, the limiting blocks 1111 enclose the limiting space for limiting the material bin 13, which can prevent the material bin 13 from shaking and deviating, and the lifting module 112 can drive the support plate 111 to ascend and descend, thereby driving the entire material bin 13 to ascend and descend, while the position of the push rod assembly 114 relative to the support plate 111 remains unchanged, so as to facilitate the push rod assembly 114 to push the carrier disc 14 at different positions in the material bin 13 to the conveying mechanism 12.

[0036] In an embodiment, the lifting module 112 includes a lifting shaft 1121 and a driving assembly 1122, the lifting shaft 1121 is vertically arranged and penetrates through the support plate 111, and the top of the lifting shaft 1121 is connected with the support plate 111, the driving assembly 1122 is connected with the bottom of the lifting shaft 1121, and the driving assembly 1122 is used to drive the lifting shaft 1121 to ascend and descend, so as to drive the material bin 13 to ascend and descend; the bottom of the support plate 111 is further provided with a guide rod 113, the guide rod 113 extends vertically, and the guide rod 113 slidably penetrates through the mounting plate 15.

[0037] It can be understood that the lifting module 112 includes a lifting shaft 1121 and a driving assembly 1122, the driving assembly 1122 drives the lifting shaft 1121 to lift, so as to drive the support plate 111 and the hopper 13 on the support plate 111 to lift, and the guide rod 113 is arranged at the bottom of the support plate 111, the guide rod 113 is slidably arranged on the mounting plate 15, and the guide rod 113 guides the support plate 111 during lifting of the support plate 111, so that the position of the support plate 111 is not deviated or shaken, and the reliability is better.

[0038] Specifically, the lifting module 112 can adopt an electric push rod device in the prior art, wherein the lifting shaft 1121 is a push rod in the electric push rod device, and the driving assembly 1122 is composed of a driving motor, a gear transmission mechanism and a lead screw, the driving motor provides power to drive the lead screw to lift through the gear transmission mechanism, so as to drive the push rod to lift through the lead screw.

[0039] Further, the number of guide rods 113 is multiple, and the multiple guide rods 113 are arranged around the mounting plate 15.

[0040] Please refer to Figure 6 In an embodiment, the push rod assembly 114 includes a fixed seat 1141, a first air cylinder 1142 and a push rod 1143, the fixed seat 1141 is installed on the top of the mounting plate 15, the first air cylinder 1142 is arranged on the top of the fixed seat 1141, and the push rod 1143 is connected with the first air cylinder 1142, and the first air cylinder 1142 is used to drive the push rod 1143 to extend or retract towards the hopper 13.

[0041] It can be understood that the push rod assembly 114 includes the fixed seat 1141, the first air cylinder 1142 and the push rod 1143, the first air cylinder 1142 is used to drive the push rod 1143 to extend towards the hopper 13, so as to push the carrier plate 14 corresponding to the position of the push rod 1143 in the hopper 13 out of the hopper 13. Specifically, the driving end of the first air cylinder 1142 is hinged with a connecting rod, and the other end of the connecting rod is hinged with a position between the two ends of the push rod 1143, one end of the push rod 1143 is connected with the cylinder body of the first air cylinder 1142, the connecting rod is rotated by moving the driving end relative to the cylinder body, so as to drive the other end of the push rod 1143 to extend or retract towards the hopper 13.

[0042] Please refer to Figure 7 and Figure 8In an embodiment, the conveying mechanism 12 comprises a support leg 121, a conveying table 122, and a push disc assembly 123. The support leg 121 is installed on the top of the material table 1. The conveying table 122 is supported on the top of the support leg 121. The conveying table 122 extends in the longitudinal direction. The conveying table 122 has an upper loading side and a loading and unloading side on both sides in the longitudinal direction. The top of the conveying table 122 is provided with a chute 1221 extending in the longitudinal direction. The top of the chute 1221 is provided with a conveying belt 1222. The top of the conveying table 122 is used to receive the film box 141 on the upper loading side and transfer it to the loading and unloading side through the conveying belt 1222. The push disc assembly 123 is arranged in the chute 1221 and corresponds to the upper loading side. The push disc assembly 123 comprises a second air cylinder 1231 and a push plate 1232. The second air cylinder 1231 is used to drive the push plate 1232 to extend out of the chute 1221 to push the film box 141 on the upper loading side into the hopper 13.

[0043] It can be understood that the conveying mechanism 12 comprises the support leg 121 and the conveying table 122. The support leg 121 is used to support the conveying table 122 at a certain height to match the height of the transfer device 3 and the hopper mechanism 11. The support leg 121 is also used to keep the conveying table 122 stable. By providing the chute 1221 on the top of the support table and the conveying belt 1222 on the top of the chute 1221, when the carrier disc 14 is placed on the support table, it is also supported on the conveying belt 1222, and then the carrier disc 14 is moved forward and backward by the conveying belt 1222. Furthermore, the push disc assembly 123 is arranged in the chute 1221 and corresponds to the position of the upper loading side. When the carrier disc 14 on the first conveying mechanism 12a is located at the loading station, the push plate 1232 is driven by the second air cylinder 1231 to extend out of the chute 1221 and move towards the hopper 13, so as to put the carrier disc 14 back into the hopper 13 on the first hopper mechanism 11a. When the carrier disc 14 on the second conveying mechanism 12b is located at the loading station, the push plate 1232 is driven by the second air cylinder 1231 in it to extend out of the chute 1221 and move towards the hopper 13, so as to put the carrier disc 14 back into the hopper 13 on the second hopper mechanism 11b.

[0044] Please refer to Figure 9 and Figure 10 In an embodiment, the carrier mechanism 23 comprises a moving base 231, a carrier table 232, and a chuck 233. The moving base 231 is arranged on the rack 21. The carrier table 232 is connected to the top of the moving base 231. The moving base 231 is used to drive the carrier table 232 to move in the transverse and longitudinal directions, so that the carrier table 232 can move between the first loading and unloading station 211 and the test station 213, and between the test station 213 and the second loading and unloading station 212. The chuck 233 is arranged on the top of the carrier table 232. The chuck 233 is used to carry the chip.

[0045] It can be understood that the movement base 231 drives the carrier 232 to move in the transverse and longitudinal directions, so that the carrier 232 can be flexibly switched between the second loading and unloading station 212 or the first loading and unloading station 211 and the test station 213, thereby realizing that the carrier 232 can automatically access the chip or wafer to be tested and move to the test station 213, and can also automatically move the tested wafer or chip to the first loading and unloading station 211 or the second loading and unloading station 212 and be picked up and transferred by the transfer device 3.

[0046] Specifically, the chuck 233 is provided with a first adsorption area and a second adsorption area, the second adsorption area is arranged at the middle position of the chuck, the first adsorption area is arranged around the second adsorption area, the first adsorption area is provided with a plurality of first adsorption holes 2331, and the second adsorption area is provided with a plurality of second adsorption holes 2332; the plurality of second adsorption holes 2332 are arranged in an array at the middle position of the chuck 233, and the plurality of second adsorption holes 2332 are mainly used for adsorbing chips; and the plurality of first adsorption holes 2331 are uniformly distributed at the outer periphery of the second adsorption area, and the plurality of first adsorption holes 2331 are used in cooperation with the plurality of second adsorption holes 2332 to adsorb wafers.

[0047] It should be noted that the first adsorption hole 2331 and the second adsorption hole 2332 control vacuum adsorption through independent air passages.

[0048] In an embodiment, the rack 21 is further provided with a shielding cabin 24 above the movement base 231, a shielding cavity is formed in the shielding cabin 24, the carrier 232 is arranged in the shielding cavity and connected with the movement base 231, and the probe test mechanism 22 is arranged at the top of the shielding cabin 24 and corresponds to the position of the test station 213; a through hole 241 in communication with the shielding cavity is formed at the top of the shielding cabin 24 and above the test station 213.

[0049] It can be understood that by arranging the carrier 232 in the shielding cavity, the shielding cavity provides a closed environment and a low-noise environment for the chip and the wafer during testing, thereby ensuring the accuracy of the test results; and the temperature test of the chip and the wafer can be further realized, the shielding cavity can effectively prevent the loss of cold or heat during low-temperature test and high-temperature test, so that a relatively stable environment is maintained inside the shielding cavity, and the test accuracy is improved.

[0050] Further, the probe test mechanism 22 includes a needle seat, a swing arm and a probe, the needle seat is installed at the top of the shielding cabin 24, the swing arm is arranged at one side of the needle seat close to the through hole 241, one end of the swing arm extends into the shielding cavity from the sliding groove 1221, and the probe is installed at the end of the swing arm extending into the shielding cavity; the needle seat is used to drive the swing arm to move along the sliding groove 1221 to drive the probe to move, and the probe is used to test the chip to be tested or the wafer to be tested located at the test station 213.

[0051] In an embodiment, the rack 21 is further provided with an identification mechanism 25, which comprises a support 251 connected with the rack 21 and a microscope 252 arranged on the support 251; the objective lens of the microscope 252 extends into the shielding cavity from the through hole 241 to identify the chip to be tested or the wafer to be tested located at the test station 213.

[0052] Further, a first entrance and exit communicating with the shielding cavity is arranged on the side of the shielding cabin 24 away from the transfer device 3, and a first cabin door 242 for opening or closing the entrance and exit is connected to the position corresponding to the first entrance and exit on the shielding cabin 24, and a first loading and unloading station 211 is formed at the first entrance and exit, and by opening the first cabin door 242, the object table 232 can be manually pulled out to the first loading and unloading station 211, and then the wafer to be tested is placed on the chuck 233 by manual operation. Further, a second entrance and exit communicating with the shielding cavity is arranged on the top of the shielding cabin 24 corresponding to the second loading and unloading station 212, and a second cabin door for opening or closing the second entrance and exit is connected to the position corresponding to the second entrance and exit on the shielding cabin 24.

[0053] Please refer to Figure 11 In an embodiment, the transfer device 3 comprises a gantry 31 and a material taking mechanism 32, the gantry 31 is provided with a slide rail extending in the transverse direction; the material taking mechanism 32 comprises a slide plate 321, a driving member 322 and a suction accessory 323, the slide plate 321 is in sliding connection with the slide rail, the driving member 322 is arranged on the side of the slide plate 321 away from the slide rail, and the suction accessory 323 is arranged on the bottom of the driving member 322; the driving member 322 is used to drive the suction accessory 323 to ascend and descend and rotate, and the suction accessory 323 is used to suck the chip.

[0054] Understandably, the slide rail extending in the transverse direction is arranged on the gantry 31, and the slide plate 321 of the material taking mechanism 32 is in sliding connection with the slide rail, so that the material taking mechanism 32 can move in the transverse direction between the loading table, the three-temperature probe test table 2 and the unloading table, the moving range is wide, and it is more flexible; the suction accessory 323 can ascend and descend and rotate under the driving action of the driving member 322, so that the chip can be flexibly sucked and placed, and the angle of the chip can be corrected according to the actual test requirement, the chip can be precisely positioned, and the accuracy of the test is ensured.

[0055] Specifically, the number of the suction accessories 323 is two, and the two suction accessories 323 are used to alternately suck the chip.

[0056] The above description is only an exemplary embodiment of the present application, and does not limit the protection scope of the present application, and any equivalent structural transformation made under the technical concept of the present application, or direct / indirect application in other related technical fields is included in the patent protection scope of the present application.

Claims

1. A test apparatus compatible with chip and wafer testing, characterized by, The test device comprises: a material table, a top of the material table is provided with a conveying mechanism and a magazine mechanism, the conveying mechanism extends in the longitudinal direction, and the top and both sides of the conveying mechanism in the longitudinal direction are a feeding side and a taking side respectively, the magazine mechanism is arranged close to the feeding side, the magazine mechanism is used for placing a bin, the bin is used for placing a film box carrying chips, the magazine mechanism is used for moving the film box in the bin to the conveying mechanism, and the conveying mechanism is used for transferring the film box to the taking side and is also used for placing the film box on the taking side back into the bin; a test table, the test table is arranged on one side of the material table in the transverse direction, the test table comprises a rack and a test mechanism and a carrying mechanism arranged on the rack, the rack is sequentially provided with a first feeding station, a test station and a second feeding station in the longitudinal direction, the carrying mechanism can move between the test station and the first feeding station and between the test station and the second feeding station, and the test mechanism is arranged above the carrying mechanism and corresponds to the position of the test station; a transfer device, the transfer device is arranged on the top of the material table and close to the taking side, and the transfer device extends in the transverse direction and across the test table; wherein the transfer device is used for transferring the chips to be tested in the film box transferred to the taking side to the second feeding station, the carrying mechanism is used for receiving the chips to be tested transferred by the transfer device to the second feeding station at the second feeding station or receiving a wafer to be tested at the first feeding station and transferring the wafer to be tested to the test station, and the test mechanism is used for testing the chips to be tested or the wafer to be tested at the test station, the carrying mechanism is also used for transferring the tested wafer to the first feeding station and transferring the tested chips to the second feeding station, and the transfer device is also used for transferring the tested chips transferred to the second feeding station to the film box at the taking side.

2. The test device compatible with chip and wafer testing according to claim 1, wherein: the number of the magazine mechanism and the conveying mechanism is two, two conveying mechanisms are arranged in the transverse direction, the two conveying mechanisms are a first conveying mechanism and a second conveying mechanism respectively, and two magazine mechanisms are a first magazine mechanism and a second magazine mechanism respectively; the first conveying mechanism is provided with a feeding station and a taking station on both sides in the longitudinal direction respectively, the second conveying mechanism is a feeding station and a taking station on both sides in the longitudinal direction respectively, the first magazine mechanism is arranged corresponding to the feeding station, and the second magazine mechanism is arranged corresponding to the feeding station. The first magazine mechanism is used to transfer the film cartridge in the magazine thereon to the upper feeding station, and the first conveying mechanism is used to transfer the film cartridge at the upper feeding station to the material taking station; the second magazine mechanism is used to transfer the film cartridge in the magazine thereon to the lower feeding station, and the second conveying mechanism is used to transfer the film cartridge at the lower feeding station to the material placing station; the transferring device is used to transfer the chip to be tested in the film cartridge transferred to the material taking station to the second upper and lower feeding station, and is also used to transfer the tested chip to the film cartridge at the material placing station, and the second conveying mechanism is also used to transfer the film cartridge with the tested chip placed at the material placing station to the magazine on the second magazine mechanism.

3. The test equipment compatible with chip and wafer test according to claim 1, characterized in that, the magazine comprises two support plates spaced apart in the lateral direction, and a cartridge space is formed between the two support plates, and the two sides of the magazine in the longitudinal direction form an opening and an outlet communicating with the cartridge space; the opposite side of each of the two support plates is provided with a plurality of vertical grooves, and a placing area is formed between the corresponding two grooves on the two support plates, and a carrier disc is placed in the placing area, and the film cartridge is placed on the carrier disc, and the two ends of the carrier disc in the placing area extend into the corresponding two grooves and are supported on the bottom groove walls of the grooves.

4. The test apparatus for compatible die and wafer testing of claim 3, wherein, a plurality of limiting areas are formed on the carrier disc, each of the limiting areas is used to place a film cartridge, the edge of the film cartridge is provided with a step with an upward step surface, and the position close to each of the limiting areas on the carrier disc is provided with a cartridge pressing spring, and the cartridge pressing spring abuts against the step surface.

5. The test apparatus for compatible die and wafer testing of claim 3, wherein, the top of the material table is provided with a mounting plate, and each of the magazine mechanisms comprises: a support plate located on the top of the mounting plate, the top of the support plate is provided with a plurality of limiting blocks, and a limiting space is surrounded by the plurality of limiting blocks, and the magazine is placed in the limiting space; a lifting module provided at the bottom of the mounting plate, the lifting module is used to drive the support plate to vertically lift relative to the mounting plate; a push rod assembly provided at the top of the mounting plate and located on the side of the support plate away from the conveying mechanism, the push rod assembly is used to push the carrier disc in any of the placing areas out of the outlet to the conveying mechanism.

6. The test equipment compatible with chip and wafer test according to claim 5, characterized in that, the lifting module comprises a lifting shaft and a driving assembly, the lifting shaft is vertically and liftably arranged in the support plate, the top of the lifting shaft is connected with the support plate, the driving assembly is connected with the bottom of the lifting shaft, and the driving assembly is used to drive the lifting shaft to lift to drive the magazine to lift; the bottom of the support plate is further provided with a guide rod, the guide rod extends in the vertical direction, and the guide rod is slidably arranged in the mounting plate.

7. The test apparatus for compatible die and wafer testing of claim 5, wherein, The push rod assembly comprises a fixing base, a first cylinder and a push rod, the fixing base is installed on the top of the mounting plate, the first cylinder is arranged on the top of the fixing base, and the push rod is connected with the first cylinder, and the first cylinder is used for driving the push rod to extend or retract towards the hopper.

8. The test apparatus for compatible die and wafer testing of any one of claims 1 to 7, wherein, The conveying mechanism comprises: Supporting legs installed on the top of the material table; A conveying table supported on the top of the supporting legs, the conveying table extends longitudinally, and the conveying table has the feeding and discharging side and the taking and placing side on the two longitudinal sides respectively, the top of the conveying table is provided with a chute extending longitudinally, the top of the chute is provided with a conveying belt, and the top of the conveying table is used for receiving the film box on the feeding and discharging side and transferring the film box to the taking and placing side through the conveying belt; A push disc assembly arranged in the chute and corresponding to the feeding and discharging side, the push disc assembly comprises a second cylinder and a push plate, and the second cylinder is used for driving the push plate to extend out of the chute to push the film box on the feeding and discharging side into the hopper.

9. The test apparatus for compatible die and wafer testing of any one of claims 1 to 7, wherein, The object carrying mechanism comprises: A movement base arranged on the rack; An object carrying table connected to the top of the movement base, the movement base is used for driving the object carrying table to move in the transverse and longitudinal directions, so that the object carrying table can move between the first feeding and discharging station and the test station, and between the test station and the second feeding and discharging station; A chuck arranged on the top of the object carrying table, the chuck is used for carrying a chip.

10. The test apparatus for compatible die and wafer testing of any one of claims 1 to 7, wherein, The transfer device comprises: A gantry provided with a slide rail extending in the transverse direction; A taking mechanism comprising a slide plate, a driving member and a suction accessory, the slide plate is in sliding connection with the slide rail, the driving member is arranged on the side of the slide plate away from the slide rail, and the suction accessory is arranged on the bottom of the driving member, the driving member is used for driving the suction accessory to ascend and descend and rotate, and the suction accessory is used for sucking a chip.

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