Wafer Map display method, computer equipment, medium and product

Abstract

The invention discloses a wafer Map graph display method, computer equipment, a medium and a product, and relates to the technical field of graph visualization. By implementing the method, the computer equipment establishes the wafer Die data list in the memory and draws the drawing board bitmap, so that resource consumption caused by establishing an independent UI control for each Die in the wafer is avoided. When the Die state changes, fixed-point pixel modification only needs to be carried out in the memory, modification within a certain time is accumulated through the delay timer, and then unified submission and display are carried out, so that the burden of a UI thread is greatly reduced. According to the implementation mode based on the bitmap, even in a scene of tens of thousands of Die, occupation of system resources is still controllable, and interface response is smooth and fluent. Meanwhile, due to the design of the delay timer, the real-time performance of display is guaranteed, and too frequent interface refreshing is avoided.

Description

Technical Field

[0001] This application relates to the field of graphic visualization technology, and in particular to a wafer map display method, computer equipment, medium and product. Background Technology

[0002] In the semiconductor industry, wafers are the fundamental material for integrated circuit manufacturing. Electrical or optical parameters are tested on each die within the wafer to evaluate its performance and yield. To intuitively monitor the testing process and analyze the results, a graphical interface called a wafer map is typically used. The wafer map displays the status of all dies on the wafer (such as "pass," "fail," "untested," etc.) in real-time or near real-time using a two-dimensional matrix or circular layout, and distinguishes them using different colors or symbols.

[0003] In related technologies, the wafer map display method involves first placing a grid or table on the interface as a container, then creating an independent UI control (such as a color block or label) for each die in the wafer, and filling it into the container one by one. The status of each die (such as "pass", "fail", "untested", etc.) is displayed by directly modifying the color or symbol of its corresponding UI control.

[0004] However, the fundamental flaw of this method lies in its drastic performance degradation when the number of chips reaches tens of thousands. This is because each UI control is a resource-intensive object, and creating and managing tens of thousands of controls consumes a massive amount of memory and system handles. More seriously, frequently updating a large number of independent controls during high-speed testing places a huge burden on the UI thread, ultimately leading to sluggish program response, interface refresh stuttering, or even freezing, making it difficult to meet the high-speed, real-time display requirements of modern wafer inspection. Summary of the Invention

[0005] This application provides a wafer map display method, computer device, medium, and product for improving the real-time performance and resource utilization of wafer map display in large-scale die scenarios.

[0006] In a first aspect, this application provides a wafer map display method applied to a computer device. The method includes: establishing a wafer die data list in memory, the wafer die data list including multiple wafer die data units, the wafer die data units being used to record the logical coordinates, detection identifiers, and detection results of a single die in the wafer; determining the pixel area corresponding to the wafer die data unit based on the logical coordinates, determining the pixel color corresponding to the wafer die data unit based on the detection identifier and detection result, drawing a canvas bitmap in memory according to the pixel area and pixel color, the canvas bitmap being used to store real-time status display information of the wafer dies; when a change in the detection identifier and / or detection result of any wafer die data unit is detected, performing fixed-point pixel modification on the canvas bitmap in memory and resetting a delay timer of a preset duration, the fixed-point pixel modification including updating the pixel color corresponding to the wafer die data unit whose detection identifier and / or detection result has changed; and submitting the canvas bitmap with accumulated fixed-point pixel modifications within the preset duration to a display device to display the wafer map when the delay timer expires.

[0007] By adopting the above technical solution, the computer device establishes a list of wafer dies in memory and draws a canvas bitmap, avoiding the resource consumption of creating independent UI controls for each die in the wafer. When the die state changes, only fixed-point pixel modifications need to be made in memory, and the modifications are accumulated over a certain period of time through a delay timer before being submitted for display, greatly reducing the burden on the UI thread. This bitmap-based implementation ensures that even in scenarios with tens of thousands of dies, system resource consumption remains controllable, and the interface response is smooth and fluid. At the same time, the design of the delay timer ensures both real-time display and avoids excessively frequent interface refreshes.

[0008] In conjunction with some embodiments of the first aspect, in some embodiments, a wafer die data list is established in memory. The wafer die data list includes multiple wafer die data units, which are used to record the logical coordinates, detection identifiers, and detection results of a single die in the wafer. Specifically, this includes: acquiring wafer physical information and wafer detection data; the wafer physical information includes the wafer die layout and the wafer center die; the wafer detection data includes the detection identifiers and detection results of each die in the wafer; establishing a coordinate system with the wafer center die as the origin, the direction of the wafer positioning slot as the positive y-axis, and the direction perpendicular to the positive y-axis and to the right as the positive x-axis; calculating the logical coordinates of each die in the wafer based on the wafer die layout and the coordinate system; and storing the logical coordinates, detection identifiers, and detection results corresponding to each die in the wafer in memory to obtain multiple wafer die data units to establish the wafer die data list.

[0009] By adopting the above technical solution, the computer equipment establishes a coordinate system with the wafer center die as the origin, the direction of the wafer positioning slot as the positive y-axis, and the direction perpendicular to the positive y-axis and to the right as the positive x-axis. This allows wafers of different sizes and layouts to be organized and displayed in the same way. This standardized data structure design can flexibly adapt to various wafer types, improving code reusability and maintainability. Furthermore, the introduction of logical coordinates provides a reliable mathematical foundation for subsequent functions such as pixel mapping and region selection.

[0010] In conjunction with some embodiments of the first aspect, in some embodiments, based on logical coordinates, the pixel region corresponding to the wafer die data unit is determined; based on the detection identifier and detection result, the pixel color corresponding to the wafer die data unit is determined; according to the pixel region and pixel color, a canvas bitmap is drawn in memory. The canvas bitmap is used to store the real-time status display information of the wafer die. Specifically, this includes: loading a pixel size, pixel spacing, and pixel color mapping table, the pixel color mapping table including the correspondence between the combination of detection identifier and detection result and the pixel color; determining the X-axis range and Y-axis range based on logical coordinates, and calculating the canvas size based on the pixel size and pixel spacing; creating a blank canvas in memory based on the canvas size; traversing each wafer die data unit, determining the pixel region of the wafer die data unit on the blank canvas according to the corresponding logical coordinates, pixel size, and pixel spacing; looking up the corresponding pixel color in the pixel color mapping table according to the detection identifier and detection result of the wafer die data unit; and filling the pixel region with the pixel color to obtain the canvas bitmap.

[0011] By adopting the above technical solution, the computer device achieves precise positioning by calculating the canvas size and the pixel area of ​​the wafer die data unit on the blank canvas; the display style is uniformly managed through a pixel color mapping table, allowing for flexible configuration of the die's display effect and supporting different combinations of detection markers and results. This method of creating a blank canvas in memory and filling pixels one by one avoids the performance overhead of repeatedly creating UI controls. The entire drawing process adopts a batch processing approach, ensuring both the uniformity and aesthetics of the display effect while achieving efficient memory usage and processing performance.

[0012] In conjunction with some embodiments of the first aspect, in some embodiments, when a change in the detection identifier and / or detection result of any wafer die data unit is detected, a fixed-point pixel modification is performed on the drawing board bitmap in memory, and a delay timer of a preset duration is reset. The fixed-point pixel modification includes updating the pixel color corresponding to the wafer die data unit whose detection identifier and / or detection result has changed. Specifically, this includes: receiving one or more die status update messages, which include the logical coordinates of a single die in the wafer whose detection identifier and / or detection result has changed; determining a pixel update area based on the logical coordinates of the single die in the wafer whose detection identifier and / or detection result has changed; searching for the corresponding updated pixel color in the pixel color mapping table based on the changed detection identifier and / or detection result; filling the pixel update area with the updated pixel color to complete the fixed-point pixel modification; and resetting the delay timer of the preset duration.

[0013] By adopting the above technical solution, the computer device receives Die state update information and directly performs fixed-point pixel modifications in memory, avoiding the overhead of redrawing the entire canvas bitmap. Simultaneously, the computer device uses a delay timer to merge multiple updates within a short period, effectively reducing the frequency of UI refreshes. This method is suitable for high-speed detection scenarios where a large number of Die states may change rapidly. Combining fixed-point pixel modification and delayed submission ensures real-time display while significantly reducing system resource consumption, thus enabling smooth data updates and providing a seamless visual effect.

[0014] In conjunction with some embodiments of the first aspect, in some embodiments, after the step of submitting the canvas bitmap with the cumulative fixed-point pixel modification within a preset time period to the display device to display the wafer map when the delay timer ends, the method further includes: responding to the user's click operation, determining the target pixel area based on the user's click position; positioning the floating selection box to the target pixel area, and displaying the target logical coordinates, target detection identifier, and target detection result of the target wafer die data unit in the floating selection box, wherein the floating selection box is used to provide a display of the selection status of the wafer die.

[0015] By adopting the above technical solution, when a user clicks, the computer device can accurately locate the target pixel area and display the target logical coordinates, target detection identifier, and target detection result of the target wafer die data unit. This real-time interactive method allows users to intuitively understand the state of any die in the wafer, effectively improving the efficiency of data analysis and problem localization. At the same time, the floating selection box enhances the user experience without affecting the basic display of the canvas bitmap, ensuring the overall performance of the interface.

[0016] In conjunction with some embodiments of the first aspect, in some embodiments, after positioning the floating selection box to the target pixel area and displaying the target logical coordinates, target detection identifier, and target detection result of the target wafer die data unit in the floating selection box, the method further includes: in response to a user's display mode switching command, switching the display mode of the wafer map between grid mode and solid mode; and keeping the position and display content of the floating selection box unchanged when switching display modes.

[0017] By adopting the above technical solution, the display needs in different scenarios are met, allowing for flexible switching between grid mode and entity mode. Grid mode is suitable for precise positioning and data comparison, while entity mode provides a more intuitive overall distribution view. Maintaining the position and displayed content of the floating selection box during mode switching ensures the continuity of user operation and avoids the hassle of repeated selections. This multi-mode display support greatly enhances the system's usability and better meets the visualization needs of different users in different work scenarios.

[0018] In conjunction with some embodiments of the first aspect, in some embodiments, after the step of submitting the canvas bitmap modified by fixed-point pixels accumulated within a preset time period to the display device to display the wafer map when the delay timer ends, the method further includes: in response to the user's drag operation, determining a polygon selection area based on the user's drag start position and drag end position; identifying all wafer die data units within the polygon selection area, counting the number of detection markers and detection results in all wafer die data units to generate a statistical result pop-up window, the statistical result pop-up window displaying the total number of wafer dies and the distribution of the number of detection markers and detection results within the polygon selection area.

[0019] By employing the above technical solution, users can drag and drop to define a region of interest (polygonal selection area). The computer device can automatically identify all dies within the region of interest (polygonal selection area) and generate statistical information. The statistical results pop-up clearly displays the total number of dies within the polygonal selection area and the distribution of various states, providing strong support for yield analysis and quality control. This flexible region selection and real-time statistical function enables users to quickly discover and analyze abnormal distribution patterns on wafers, significantly improving the efficiency and accuracy of data analysis.

[0020] In a second aspect, embodiments of this application provide a computer device comprising: one or more processors and a memory; the memory is coupled to the one or more processors and is used to store computer program code, the computer program code including computer instructions, wherein the one or more processors invoke the computer instructions to cause the computer device to perform the method described in the first aspect and any possible implementation thereof.

[0021] Thirdly, embodiments of this application provide a computer program product containing instructions that, when the computer program product is run on a computer device, cause the computer device to perform the method described in the first aspect and any possible implementation thereof.

[0022] Fourthly, embodiments of this application provide a computer-readable storage medium including instructions that, when executed on a computer device, cause the computer device to perform the method described in the first aspect and any possible implementation thereof.

[0023] It is understood that the computer device provided in the second aspect, the computer program product provided in the third aspect, and the computer storage medium provided in the fourth aspect are all used to execute the methods provided in the embodiments of this application. Therefore, the beneficial effects they can achieve can be referred to the beneficial effects in the corresponding methods, and will not be repeated here.

[0024] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages: 1. By adopting the above technical solution, the computer device establishes a list of wafer dies in memory and draws a canvas bitmap, avoiding the resource consumption of creating independent UI controls for each die in the wafer. When the die state changes, only fixed-point pixel modifications need to be made in memory, and the modifications are accumulated over a certain period of time through a delay timer before being submitted for display, greatly reducing the burden on the UI thread. This bitmap-based implementation ensures that even in scenarios with tens of thousands of dies, system resource consumption remains controllable, and the interface response is smooth and fluid. At the same time, the design of the delay timer ensures both real-time display and avoids excessively frequent interface refreshes.

[0025] 2. By adopting the above technical solution, the computer device receives Die state update information and directly performs fixed-point pixel modifications in memory, avoiding the overhead of redrawing the entire canvas bitmap. Simultaneously, the computer device uses a delay timer to merge multiple updates within a short period, effectively reducing the frequency of UI refreshes. This method is suitable for high-speed detection scenarios where a large number of Die states may change rapidly. Combining fixed-point pixel modification and delayed submission ensures real-time display while significantly reducing system resource consumption, thus enabling smooth data updates and providing a seamless visual effect.

[0026] 3. By adopting the above technical solution, the display needs in different scenarios are met, allowing for flexible switching between grid mode and entity mode. Grid mode is suitable for precise positioning and data comparison, while entity mode provides a more intuitive overall distribution view. Maintaining the position and displayed content of the floating selection box during mode switching ensures the continuity of user operation and avoids the hassle of repeated selections. This multi-mode display support greatly enhances the system's practicality and better meets the visualization needs of different users in different work scenarios. Attached Figure Description

[0027] Figure 1 This is a schematic flowchart of a wafer map display method in an embodiment of this application; Figure 2 This is another schematic flowchart of the wafer map display method in the embodiments of this application; Figure 3 This is a schematic diagram of the physical device structure of a computer device in an embodiment of this application. Detailed Implementation

[0028] The terminology used in the following embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification of this application, the singular expressions “a,” “an,” “the,” “the,” and “this” are intended to include the plural expressions as well, unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in this application refers to any or all possible combinations including one or more of the listed items.

[0029] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature, and in the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0030] The following describes the process of the method provided in this implementation. Please refer to [link / reference]. Figure 1 This is a flowchart illustrating a wafer map display method in an embodiment of this application.

[0031] S101. Create a wafer die data list in memory. The wafer die data list includes multiple wafer die data units. The wafer die data units are used to record the logical coordinates, detection identifiers, and detection results of a single die in the wafer. In this context, a wafer refers to a circular silicon substrate used in semiconductor manufacturing, serving as the fundamental material for integrated circuit production. Its diameter is typically 8 inches or 12 inches. A die is a single, independent chip unit formed on a wafer through processes such as photolithography and etching; a single wafer usually contains hundreds to tens of thousands of dies. A wafer die data list is a data structure stored in memory, used to orderly store multiple wafer die data units. A wafer die data unit represents a single record in the wafer die data list. Logical coordinates refer to the row and column coordinate values ​​describing the die's position in a standardized coordinate system. Detection flags indicate whether a die has been detected, such as "detected" or "not detected." Detection results refer to the test judgment of the die, such as "passed" or "failed." Memory refers to the random access memory of a computer device, used for temporary storage of programs and data.

[0032] Specifically, first, the computer acquires the wafer's physical information, including the wafer die layout and the center die. Then, the computer establishes a coordinate system with the center die as the origin, the direction of the wafer positioning slot as the positive y-axis, and the direction perpendicular to the positive y-axis and to the right as the positive x-axis. Next, the computer calculates the row and column offset of each die relative to the center die, obtaining its logical coordinates. Simultaneously, the computer acquires the detection identifier and detection result for each die through a detection device. Finally, the computer packages the logical coordinates, detection identifier, and detection result of each die into a wafer die data unit and stores them sequentially into a wafer die data list in memory, completing the initialization of the data structure.

[0033] Optionally, in general, a wafer die data list is established in memory. This list includes multiple wafer die data units, each recording the logical coordinates, detection identifiers, and detection results of a single die within the wafer. This can be achieved in the following ways, without limitation: Obtain wafer physical information and wafer detection data. The wafer physical information includes the wafer die layout and the center die. The wafer detection data includes the detection identifiers and detection results of each die within the wafer. Establish a coordinate system with the center die as the origin, the direction of the wafer positioning slot as the positive y-axis, and the direction perpendicular to the positive y-axis and to the right as the positive x-axis. Calculate the logical coordinates of each die within the wafer based on the wafer die layout and the coordinate system. Store the logical coordinates, detection identifiers, and detection results corresponding to each die within the wafer in memory to obtain multiple wafer die data units, thus establishing the wafer die data list.

[0034] Assume there is an 8-inch wafer with its dies arranged in a rectangular array, with the following data: Wafer physical information: The wafer die layout is a rectangular array of 15 rows × 15 columns; The center die of the wafer is located in row 8 and column 8; The wafer positioning slot is located on the top of the wafer; Wafer inspection data (partial display): Die in row 8, column 8: Detected, passed; Die in row 8, column 9: Detected, failed; Die in row 7, column 8: Undetected, unknown; ... (1) Establish a coordinate system: Origin: The center of the wafer corresponds to the origin (0, 0); Positive Y-axis direction: towards the wafer positioning slot (i.e., upward, because the wafer positioning slot is on the top of the wafer); Positive X-axis direction: perpendicular to the Y-axis to the right; (2) Calculate the logical coordinates of each die (partially shown): Die in row 8, column 8 → (0, 0) / / Origin Die in row 8, column 9 → (1, 0) / / one cell to the right of the origin. Die in row 7 and column 8 → (0, 1) / / One cell above the origin (towards the wafer positioning slot) ... (3) Store the wafer die data list (partial display): Wafer Die Data List = [{Logical coordinates: (0, 0); Detection flag: "Detected"; Detection result: "Passed"}, {Logical coordinates: (1, 0); Detection flag: "Detected"; Detection result: "Failed"}, {Logical coordinates: (0, 1); Detection flag: "Not Detected"; Detection result: "Unknown"}...] S102. Based on logical coordinates, determine the pixel area corresponding to the wafer die data unit. Based on the detection identifier and detection result, determine the pixel color corresponding to the wafer die data unit. According to the pixel area and pixel color, draw a drawing board bitmap in memory. The drawing board bitmap is used to save the real-time status display information of the wafer die. Among them, the pixel area refers to the pre-display area corresponding to the die; the pixel color refers to the pre-display color used to represent the state of the die; the canvas bitmap refers to the bitmap data stored in memory for pre-display; and the real-time status display information refers to the visualization information of the status of all dies on the wafer at the current moment.

[0035] Specifically, first, the computer device loads the pre-display parameter configuration, including pixel size, pixel pitch, and pixel color map. Second, the computer device scans the logical coordinates of all dies in the wafer die data list to determine the horizontal and vertical range of the entire pre-display area. Then, based on the horizontal and vertical range of the pre-display area, combined with the pixel size and pixel pitch, the computer device calculates and creates a blank bitmap of appropriate size in memory. Next, the computer device traverses each wafer die data unit, converting its logical coordinates into pixel areas of the pre-display area. Based on the die's detection identifier and detection result, the computer device looks up the corresponding display color in the pixel color map and fills the corresponding pixel area in the blank bitmap with that color, ultimately generating a complete canvas bitmap containing real-time status display information for all dies in the wafer.

[0036] Optionally, generally, based on logical coordinates, the pixel region corresponding to the wafer die data unit is determined; based on the detection identifier and detection result, the pixel color corresponding to the wafer die data unit is determined; and based on the pixel region and pixel color, a canvas bitmap is drawn in memory. The canvas bitmap is used to store the real-time status display information of the wafer die and can be implemented in the following ways, without limitation: Load the pixel size, pixel spacing, and pixel color mapping table, which includes the correspondence between the combination of detection identifier and detection result and the pixel color; determine the X-axis range and Y-axis range based on logical coordinates, and calculate the canvas size based on the pixel size and pixel spacing; create a blank canvas in memory based on the canvas size; traverse each wafer die data unit, and determine the pixel region of the wafer die data unit on the blank canvas based on the corresponding logical coordinates, pixel size, and pixel spacing; look up the corresponding pixel color in the pixel color mapping table based on the detection identifier and detection result of the wafer die data unit; fill the pixel region with the pixel color to obtain the canvas bitmap.

[0037] The following is an example of a pixel color mapping representation: Test labels: "Tested" and "Passed" are both in green. Detection indicators: "Detected" and "Failed" are indicated in red. Detection labels: "Not detected" and "Detection result: Unknown" are both grayed out. ... S103. When the detection identifier and / or detection result of any wafer die data unit changes, perform fixed-point pixel modification on the drawing board bitmap in memory and reset the delay timer of the preset duration. The fixed-point pixel modification includes updating the pixel color corresponding to the wafer die data unit whose detection identifier and / or detection result has changed. Among them, fixed-point pixel modification refers to the operation of updating the color of pixels in a specific pixel area of ​​the canvas bitmap only; delay timer refers to a program component used to time and trigger an event after a specified time; preset duration refers to a pre-configured time interval, usually tens to hundreds of milliseconds; reset means restoring the delay timer's time value to its initial state; change of detection flag means that Die changes from "not detected" to "detected"; change of detection result means that Die's test judgment changes from one state to another, such as from "unknown" to "pass" or "fail".

[0038] Specifically, the computer device starts an event listening thread to receive Die status updates from the detection device in real time. When a change is detected in the detection identifier or result of a Die, the computer device first calculates the corresponding pixel area in the canvas bitmap based on the logical coordinates of the Die as the pixel update area. Then, based on the changed detection identifier and / or detection result, it looks up the corresponding updated pixel color in the pixel color map and directly modifies the canvas bitmap accordingly, without redrawing the entire canvas bitmap. After each fixed-point pixel modification, the computer device resets the delay timer to a preset duration (e.g., 200 milliseconds). If new Die status updates are received during the delay timer's countdown, the computer device accumulates these updates but does not refresh the display immediately, only resetting the delay timer. This mechanism can merge multiple updates within a short period of time, avoiding excessively frequent display refreshes.

[0039] Optionally, under normal circumstances, when a change is detected in the detection identifier and / or detection result of any wafer die data unit, a fixed-point pixel modification is performed on the drawing board bitmap in memory, and a delay timer of a preset duration is reset. The fixed-point pixel modification, including updating the pixel color corresponding to the wafer die data unit whose detection identifier and / or detection result has changed, can be implemented in the following ways, without limitation: receiving one or more die status update messages, which include the logical coordinates of a single die in the wafer whose detection identifier and / or detection result has changed; determining the pixel update area based on the logical coordinates of the single die in the wafer whose detection identifier and / or detection result has changed; looking up the corresponding updated pixel color in the pixel color mapping table based on the changed detection identifier and / or detection result; filling the pixel update area with the updated pixel color to complete the fixed-point pixel modification; and resetting the delay timer of the preset duration.

[0040] S104. When the delay timer ends, submit the canvas bitmap with the accumulated fixed-point pixel modifications within the preset time to the display device to display the wafer map.

[0041] Among them, the end of the delay timer indicates that the waiting time has elapsed; accumulation refers to all pixel modifications collected during the waiting time; the canvas bitmap refers to memory bitmap data containing the latest die state information; the display device refers to the hardware device used to display the image, such as a monitor; submission indicates that the canvas bitmap is transferred to the display device for display; and the wafer map refers to a visual graphic that intuitively shows the distribution of all die states on the wafer.

[0042] Specifically, when the delay timer expires and no new state update triggers a reset, the computer device submits the current canvas bitmap in memory to the display device. The display device is responsible for converting the canvas bitmap into actual screen display content and refreshing the display device to show the latest wafer map. During the submission process, the display device's resolution and refresh characteristics are considered to ensure clear and smooth image display. This delayed submission mechanism ensures both timely display and avoids excessively frequent refresh operations, maintaining good display performance even in scenarios with frequent state updates.

[0043] By adopting the above technical solution, the computer device establishes a list of wafer dies in memory and draws a canvas bitmap, avoiding the resource consumption of creating independent UI controls for each die in the wafer. When the die state changes, only fixed-point pixel modifications need to be made in memory, and the modifications are accumulated over a certain period of time through a delay timer before being submitted for display, greatly reducing the burden on the UI thread. This bitmap-based implementation ensures that even in scenarios with tens of thousands of dies, system resource consumption remains controllable, and the interface response is smooth and fluid. At the same time, the design of the delay timer ensures both real-time display and avoids excessively frequent interface refreshes.

[0044] The following provides a more detailed description of the process of the method provided in this implementation. Please refer to [link / reference]. Figure 2 This is another flowchart illustrating the wafer map display method in this application embodiment.

[0045] The following steps may or may not be performed after step S104; this is not a limitation here: S201. In response to the user's click operation, determine the target pixel area based on the user's click position.

[0046] Among them, the user's click operation refers to the click action performed by the user on the wafer map using input devices such as mouse and touch screen; the click position refers to the position of the mouse pointer or touch point on the wafer map when the user performs the click operation; the target pixel area refers to the pixel area occupied by the wafer die corresponding to the click position in the drawing board bitmap.

[0047] Specifically, when the computer device detects a user clicking on the wafer map, it obtains the click location. Then, the computer device converts the click location into relative coordinates in the drawing bitmap. Next, the computer device scans the wafer die data list, comparing the pixel area range of each die to find the target pixel area containing the relative coordinates. This precise coordinate mapping mechanism ensures that users can accurately select any die for viewing and analysis.

[0048] S202. Position the floating selection box to the target pixel area, and display the target logical coordinates, target detection identifier, and target detection result of the target wafer die data unit in the floating selection box. The floating selection box is used to provide the selection status display of the wafer die.

[0049] Among them, the floating selection box refers to a movable semi-transparent information display box used to highlight the currently selected die; the target wafer die data unit represents the data record corresponding to the selected die; the target logical coordinates refer to the position of the selected die in the coordinate system; the target detection identifier refers to the detection status of the selected die; the target detection result refers to the specific test judgment of the selected die; and the selection status display is used to provide the user with detailed information about the currently selected die.

[0050] Specifically, after determining the target pixel area, the computer device first calculates the display position of the floating selection box, typically positioning it directly above or to the right of the target pixel area to avoid obscuring the display of other dies. Then, the computer device retrieves the target logical coordinates, target detection identifier, and target detection result of the target wafer die data unit from the wafer die data list. Next, the computer device creates a floating selection box, displaying the target logical coordinates (e.g., "X: 5, Y: 3"), the target detection identifier (e.g., "Detected"), and the target detection result (e.g., "Passed") sequentially. The floating selection box uses a semi-transparent effect to ensure it does not completely obscure the wafer map below, while highlighting the currently selected die for easy information viewing and analysis by the user.

[0051] S203. In response to the user's display mode switching command, switch the display mode of the wafer map between grid mode and solid mode.

[0052] Among them, the display mode switching command indicates the command to change the display mode triggered by the user through interface buttons, shortcut keys or menu items; grid mode refers to the mode in which grid lines are displayed between dies when displaying wafer dies, which is used for precise positioning and comparative analysis; solid mode refers to the mode in which grid lines are hidden and only the die body is displayed when displaying wafer dies, which is used for overall distribution observation; display mode switching refers to the process of switching between these two display modes.

[0053] Specifically, when the computer device receives a display mode switching command triggered by the user, it first identifies the current display mode. If the current mode is grid mode, the computer device will recalculate the canvas bitmap, removing the grid line spacing between dies to make adjacent dies closely connected, forming a solid mode display effect. If the current mode is solid mode, the computer device will add a grid line spacing of a preset width (usually 1-2 pixels) between dies when recalculating the canvas bitmap, restoring the grid mode display effect. During the mode switching process, the computer device keeps the relative position and display color of each die unchanged, only adjusting the display spacing between dies and the visibility of grid lines to ensure the continuity and smoothness of the display mode switching.

[0054] S204. When switching display modes, keep the position and content of the floating selection box unchanged.

[0055] Here, switching display modes refers to the process of switching between grid mode and solid mode; the position of the floating selection box indicates the display coordinates of the floating selection box on the screen; the displayed content refers to the detailed information of the target wafer die data unit displayed in the floating selection box, including the target logical coordinates, target detection identifier, and target detection results.

[0056] Specifically, during the display mode switching process, the computer device saves the screen coordinates of the currently selected floating box and all the information displayed within it. Then, the computer device performs the display mode switching operation, updating the display effect of the canvas bitmap. Finally, the computer device re-overlays the floating selected box onto the saved screen coordinates, maintaining the displayed information unchanged. This mechanism ensures that users do not lose the information of the currently selected die when switching display modes, allowing them to continue analyzing the selected die in different display modes, improving operational continuity and user experience. For example, if a user selects a die in grid mode and is viewing its details, after switching to solid mode, the die's selection status and detailed information remain clearly visible, facilitating continuous observation and analysis.

[0057] S205. In response to the user's drag operation, determine the polygon selection area based on the user's drag start position and drag end position.

[0058] Among them, drag operation refers to the continuous action of the user pressing and moving on the wafer map with a mouse or touch screen; drag start position refers to the screen coordinate point when the user starts dragging; drag end position refers to the screen coordinate point when the user releases the drag; polygon selection area refers to the closed area formed by the drag trajectory, which is used to select multiple dies for batch analysis.

[0059] Specifically, when the computer device detects that a user presses the mouse or touchscreen on the wafer map, it begins recording the starting position of the drag trajectory. During the dragging process, the computer device captures key coordinate points along the drag path in real time and draws a preview line of the trajectory on the drawing board bitmap. When the user releases the mouse or finger, the computer device records the ending position of the drag trajectory and automatically connects the starting and ending positions to form a closed polygonal region. The computer device uses a semi-transparent effect to highlight this polygonal selection area, allowing the user to intuitively see the selection range. This free-drawing selection method allows users to flexibly select areas of arbitrary shapes for analysis.

[0060] S206. Identify all wafer die data units within the polygonal selection area, count the number of detection markers and detection results in all wafer die data units, and generate a statistical result pop-up window. The statistical result pop-up window displays the total number of wafer dies and the distribution of the number of detection markers and detection results within the polygonal selection area.

[0061] Among them, "all wafer die data units" refers to the data records of all dies located within the polygon selection area; "the number of detection identifiers and detection results" represents the dies quantity statistics for various detection state combinations; "statistical result pop-up" refers to an independent window used to display statistical information; "total number of wafer dies" represents the total number of dies within the polygon selection area; and "quantity distribution" refers to the number of dies and their proportion in different detection states.

[0062] Specifically, after determining the polygonal selection area, the computer device uses a geometric algorithm to determine whether the center point of each wafer die data unit is located within the polygonal selection area. Then, the computer device creates a statistical table to classify and count the dies within the polygonal selection area according to different combinations of detection identifiers and detection results. Finally, the computer device creates a statistical results pop-up window, displaying the total number of dies within the polygonal selection area (e.g., "Total Selected: 1000"), as well as detailed statistical information on various detection statuses (e.g., "Detected and Passed: 800 (80%)", "Detected and Failed: 150 (15%)", "Not Detected: 50 (5%)"). This statistical analysis function helps users quickly understand the yield distribution of the selected area, providing important reference for quality control and problem diagnosis. The statistical results pop-up window allows users to drag its position and can be closed at any time via a close button, providing a flexible interaction method.

[0063] The computer device in the embodiments of this invention is described below from the perspective of hardware processing. Please refer to [link / reference needed]. Figure 3 This is a schematic diagram of the physical device structure of a computer device in an embodiment of this application.

[0064] It should be noted that, Figure 3 The structure of the computer device shown is merely an example and should not impose any limitation on the functionality and scope of use of the embodiments of the present invention.

[0065] like Figure 3 As shown, the computer device includes a CPU 301, which can perform various appropriate actions and processes according to a program stored in the read-only memory ROM 302 or a program loaded from the storage section 308 into the random access memory RAM 303, such as performing the methods described in the above embodiments. The RAM 303 also stores various programs and data required for system operation. The CPU 301, ROM 302, and RAM 303 are interconnected via a bus 304. An I / O interface 305 is also connected to the bus 304.

[0066] The following components are connected to I / O interface 305: input section 306 including audio input devices, push-button switches, etc.; output section 307 including a liquid crystal display (LCD) and audio output devices, indicator lights, etc.; storage section 308 including a hard disk, etc.; and communication section 309 including a network interface card such as a LAN (Local Area Network) card, modem, etc. Communication section 309 performs communication processing via a network such as the Internet. Drive 310 is also connected to I / O interface 305 as needed. Removable media 311, such as a disk, optical disk, magneto-optical disk, semiconductor memory, etc., are installed on drive 310 as needed so that computer programs read from them can be installed into storage section 308 as needed.

[0067] In particular, according to embodiments of the present invention, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments of the present invention include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing computer programs for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via communication section 309, and / or installed from removable medium 311. When the computer program is executed by CPU 301, it performs the various functions defined in the present invention.

[0068] It should be noted that specific examples of computer-readable storage media may include, but are not limited to: electrical connections having one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM), flash memory, optical fiber, portable compact disc read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this invention, a computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0069] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention. Each block in a flowchart or block diagram may represent a module, program segment, or portion of code, which contains one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those shown in the drawings.

[0070] Specifically, the computer device in this embodiment includes a processor and a memory. The memory stores a computer program, and when the computer program is executed by the processor, it implements the wafer map display method provided in the above embodiment.

[0071] In another aspect, the present invention also provides a computer-readable storage medium, which may be included in the computer device described in the above embodiments; or it may exist independently and not assembled into the computer device. The storage medium carries one or more computer programs that, when executed by a processor of the computer device, cause the computer device to implement the wafer map display method provided in the above embodiments.

[0072] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

[0073] As used in the above embodiments, depending on the context, the term "when..." can be interpreted as meaning "if...", "after...", "in response to determining...", or "in response to detecting...". Similarly, depending on the context, the phrase "when determining..." or "if (the stated condition or event) is interpreted as meaning "if determining...", "in response to determining...", "when (the stated condition or event) is detected", or "in response to detecting (the stated condition or event)".

[0074] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. This program can be stored in a computer-readable storage medium, and when executed, it can include the processes described in the above method embodiments. The aforementioned storage medium includes various media capable of storing program code, such as ROM or random access memory (RAM), magnetic disks, or optical disks.

Claims

1. A method for displaying a wafer map, characterized in that, Applied to a computer device, the method includes: A wafer die data list is created in memory. The wafer die data list includes multiple wafer die data units. The wafer die data units are used to record the logical coordinates, detection identifiers, and detection results of a single die in the wafer. Based on the logical coordinates, the pixel area corresponding to the wafer die data unit is determined. Based on the detection identifier and the detection result, the pixel color corresponding to the wafer die data unit is determined. According to the pixel area and the pixel color, a drawing board bitmap is drawn in memory. The drawing board bitmap is used to store the real-time status display information of the wafer die. When a change is detected in the detection identifier and / or detection result of any wafer die data unit, a fixed-point pixel modification is performed on the drawing board bitmap in memory and a delay timer of a preset duration is reset. The fixed-point pixel modification includes updating the pixel color corresponding to the wafer die data unit whose detection identifier and / or detection result has changed. When the delay timer ends, the canvas bitmap modified by the fixed-point pixels accumulated within the preset time period is submitted to the display device to display the wafer map.

2. The method according to claim 1, characterized in that, The step of establishing a wafer die data list in memory, wherein the wafer die data list includes multiple wafer die data units, and the wafer die data units are used to record the logical coordinates, detection identifiers, and detection results of a single die in the wafer, specifically including: The wafer physical information and wafer inspection data are obtained. The wafer physical information includes wafer die layout and wafer center die. The wafer inspection data includes the inspection identifier and inspection result of each die in the wafer. A coordinate system is established with the wafer center Die as the origin, the direction of the wafer positioning groove as the positive y-axis, and the direction perpendicular to the positive y-axis and to the right as the positive x-axis. Based on the wafer die layout and the coordinate system, calculate the logical coordinates of each die in the wafer; The logical coordinates, detection identifiers, and detection results corresponding to each die in the wafer are stored in memory to obtain the multiple wafer die data units, thereby establishing the wafer die data list.

3. The method according to claim 1, characterized in that, Based on the logical coordinates, the pixel region corresponding to the wafer die data unit is determined; based on the detection identifier and the detection result, the pixel color corresponding to the wafer die data unit is determined; and based on the pixel region and the pixel color, a canvas bitmap is drawn in memory. The canvas bitmap is used to store the real-time status display information of the wafer die, specifically including: Load the pixel size, pixel spacing, and pixel color mapping table, wherein the pixel color mapping table includes the correspondence between the combination of detection identifiers and detection results and the pixel colors; Based on the logical coordinates, determine the X-axis range and Y-axis range, and calculate the canvas size by combining the pixel size and the pixel spacing; Based on the canvas size, create a blank canvas in memory; Traverse each wafer die data unit and determine the pixel area of ​​the wafer die data unit on the blank canvas according to the corresponding logical coordinates, the pixel size and the pixel spacing; Based on the detection identifier and detection result of the wafer die data unit, the corresponding pixel color is found in the pixel color mapping table; The pixel area is filled with the color of the pixel to obtain the canvas bitmap.

4. The method according to claim 3, characterized in that, When a change is detected in the detection identifier and / or detection result of any wafer die data unit, a fixed-point pixel modification is performed on the drawing board bitmap in memory, and a preset delay timer is reset. The fixed-point pixel modification includes updating the pixel color corresponding to the wafer die data unit whose detection identifier and / or detection result has changed, specifically including: Receive one or more Die status update messages, wherein the Die status update messages include the logical coordinates of a single Die in a wafer where the detection identifier and / or detection result has changed; The pixel update region is determined based on the logical coordinates of a single die in the wafer where the detection identifier and / or detection result have changed; the corresponding updated pixel color is found in the pixel color mapping table based on the changed detection identifier and / or detection result. The pixel update area is filled with the updated pixel color to complete the fixed-point pixel modification. Reset the preset delay timer.

5. The method according to claim 1, characterized in that, After the step of submitting the canvas bitmap modified by the fixed-point pixels accumulated within the preset time period to the display device to display the wafer map at the end of the delay timer, the method further includes: In response to a user's click action, the target pixel area is determined based on the user's click location; The floating selection box is positioned to the target pixel area, and the target logical coordinates, target detection identifier, and target detection result of the target wafer die data unit are displayed in the floating selection box. The floating selection box is used to provide the selection status display of the wafer die.

6. The method according to claim 5, characterized in that, After the steps of positioning the floating selection box to the target pixel area and displaying the target logical coordinates, target detection identifier, and target detection result of the target wafer die data unit in the floating selection box, the method further includes: In response to the user's display mode switching command, the display mode of the wafer map is switched between grid mode and solid mode; When switching display modes, the position and content of the floating selection box remain unchanged.

7. The method according to claim 1, characterized in that, After the step of submitting the canvas bitmap modified by the fixed-point pixels accumulated within the preset time period to the display device to display the wafer map at the end of the delay timer, the method further includes: In response to the user's dragging action, the polygon selection area is determined based on the user's drag start position and drag end position; Identify all wafer die data units within the polygonal selection area, count the number of detection markers and detection results in all wafer die data units, and generate a statistical result pop-up window. The statistical result pop-up window displays the total number of wafer dies and the distribution of the number of detection markers and detection results within the polygonal selection area.

8. A computer device, characterized in that, The computer device includes: one or more processors and a memory; the memory is coupled to the one or more processors, the memory is used to store computer program code, the computer program code including computer instructions, and the one or more processors call the computer instructions to cause the computer device to perform the method as described in any one of claims 1-7.

9. A computer-readable storage medium comprising instructions, characterized in that, When the instructions are executed on a computer device, the computer device performs the method as described in any one of claims 1-7.

10. A computer program product, characterized in that, When the computer program product is run on a computer device, the computer device performs the method as described in any one of claims 1-7.

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