Rapid cooling device and method for heat-conducting structural adhesive

Abstract

The rapid cooling device comprises a cooling box body, air curtain isolation systems are arranged at the two ends of the cooling box body, and the interior of the cooling box body is sequentially divided into a pre-cooling area, a deep cooling area and a uniform temperature area in the material conveying direction; the pre-cooling area is provided with a first cooling unit, the first cooling unit comprises a compressed air source and a plurality of vortex tube coolers communicated with the compressed air source, and the output ends of the vortex tube coolers are provided with nozzles used for spraying cold air to materials; the deep cooling area is provided with a second cooling unit, the second cooling unit comprises a liquid nitrogen supply source and a plurality of atomizing nozzles communicated with the liquid nitrogen supply source, and the second cooling unit is used for spraying low-temperature atomizing media to materials. The efficient, uniform and stable cooling of the heat-conducting structural adhesive is realized, and the product performance and batch consistency are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of polymer material processing equipment, in particular to a rapid cooling device and method for heat-conducting structural adhesive. BACKGROUND

[0002] Heat-conducting structural adhesive is a special adhesive with high-strength bonding performance and high-efficiency heat management capability. After curing, it can form a tough adhesive layer, like traditional structural adhesive, to withstand large mechanical stress and be used for bonding various substrates. Its core feature is that it is filled with high-thermal-conductivity functional fillers (such as boron nitride, aluminum oxide, aluminum nitride, etc.) inside, thereby building a channel for heat transfer, so that the adhesive layer can effectively transfer heat from the heating element to the heat dissipation component while achieving structural fixation, reducing the interface thermal resistance. Therefore, it is widely used in fields that require both mechanical fixation and heat dissipation, such as electronic component bonding and packaging, LED lighting, new energy vehicle battery management system, power device heat dissipation, etc.

[0003] Under the trend of electronic device integration and miniaturization, the efficiency and quality of the curing and cooling process of heat-conducting structural adhesive, as a key heat management material, directly determine the heat conduction performance and structural stability of the device. Currently, the cooling devices for heat-conducting structural adhesive in the industry mostly use single cooling methods (such as pure air cooling or direct liquid nitrogen cooling), which have certain technical bottlenecks: first, the cooling efficiency and uniformity are difficult to balance. Traditional air cooling is gentle but slow in cooling rate, which cannot meet the high-tact production demand, while direct liquid nitrogen cooling easily causes "hot spots" in the adhesive due to large local temperature difference, leading to stress concentration and further cracking, delamination, etc. Second, there is a lack of fine control of the cooling process. The existing devices cannot dynamically adjust the cooling parameters according to the characteristics (such as viscosity, thermal expansion coefficient) of different types of heat-conducting structural adhesive, and the material after cooling is prone to residual internal stress due to large temperature gradient, affecting the subsequent assembly precision. Third, the cooling area is poorly isolated from the external environment, and the exchange of cold and hot air causes temperature fluctuations in the box, further exacerbating the uneven cooling problem. At the same time, traditional cooling methods do not consider optimizing the internal heat conduction efficiency of the adhesive through auxiliary means, and lack effective uniform temperature regulation mechanism in the later cooling stage, making it difficult to accurately and stably control the overall temperature of the material within the target range, resulting in poor batch consistency of the product and failing to meet the stringent requirements of high-end electronic devices on the performance of heat-conducting structural adhesive.

[0004] Therefore, a rapid cooling device and method for heat-conducting structural adhesive are proposed to solve the problems mentioned above. SUMMARY

[0005] The application aims to provide a rapid cooling device and method for heat-conducting structural glue, so as to solve the problem that the traditional cooling technology for heat-conducting structural glue cannot meet the requirements of high-tact production and product consistency due to low efficiency, poor uniformity, extensive regulation and control, and insufficient environmental isolation under the background of high integration of electronic devices.

[0006] To achieve the above-mentioned purpose, the application provides the following technical scheme: a rapid cooling device for heat-conducting structural glue, comprising a cooling box body, wherein both ends of the cooling box body are provided with a wind curtain isolation system, and the inside of the cooling box body is divided into a pre-cooling zone, a deep cooling zone and a temperature equalization zone along the material conveying direction in sequence; The pre-cooling zone is provided with a first cooling unit, the first cooling unit comprises a compressed air source and a plurality of vortex tube coolers in communication with the compressed air source, and the output end of the vortex tube coolers is provided with a nozzle for spraying cold air to the material; The deep cooling zone is provided with a second cooling unit, the second cooling unit comprises a liquid nitrogen supply source and a plurality of atomizing nozzles in communication with the liquid nitrogen supply source, and is used for spraying low-temperature atomizing medium to the material, the deep cooling zone is further provided with an ultrasonic auxiliary unit, the ultrasonic auxiliary unit comprises at least one ultrasonic transducer, and the ultrasonic transducer is arranged near the atomizing nozzle and used for applying ultrasonic waves to the material; The temperature equalization zone is provided with a temperature equalization unit, the temperature equalization unit comprises at least one semiconductor temperature control plate, and the semiconductor temperature control plate is embedded with a temperature sensor; The inside of the cooling box body further comprises a conveying mechanism penetrating through the pre-cooling zone, the deep cooling zone and the temperature equalization zone, and a central control system for controlling the cooperative work of the first cooling unit, the second cooling unit, the ultrasonic auxiliary unit, the temperature equalization unit and the conveying mechanism, and the central control system is configured to dynamically adjust the working state of each unit and the movement rhythm of the conveying mechanism according to the preset cooling curve and the feedback signal of the temperature sensor.

[0007] Preferably, the conveying mechanism comprises a conveying belt and a servo driving system for driving the conveying belt to make intermittent motion, and the central control system is electrically connected with the servo driving system to control the residence time of the material in each zone.

[0008] Preferably, the angle between the spraying direction of the nozzle and the surface of the conveying belt is 30°-60°.

[0009] Preferably, the ultrasonic transducers in the ultrasonic auxiliary unit are multiple and arrayed on one side of the atomizing nozzle, and the working frequency range of the ultrasonic transducers is 20kHz-100kHz.

[0010] Preferably, the central control system is electrically connected to the ultrasonic auxiliary unit and is configured to: start, stop and / or adjust the power and duration of the ultrasonic transducer according to a preset cooling curve or temperature feedback in the cryogenic zone.

[0011] Preferably, the temperature equalization unit comprises multiple semiconductor temperature control boards, which are distributed at the bottom of the temperature equalization zone. The central control system is configured to use a PID algorithm to independently control the temperature of each semiconductor temperature control board based on the feedback signals from the distributed temperature sensors, so that the temperature gradient within the temperature equalization zone is less than 2℃ / m.

[0012] Preferably, there are multiple vortex tube coolers, which are connected to the compressed air source via a compressed air pipeline; there are multiple nozzles, which are evenly distributed along the axial direction of the vortex tube cooler.

[0013] Preferably, the liquid nitrogen supply source includes a liquid nitrogen storage tank and a cryogenic delivery pump, and the number of atomizing nozzles is multiple and connected to the cryogenic delivery pump through a cryogenic medium pipeline, with the atomizing nozzles distributed in an array.

[0014] A method for rapid cooling of a thermally conductive structural adhesive using the apparatus described in any one of claims 1-8, comprising the following steps: S1: Set the cooling curve parameters for a specific thermally conductive structural adhesive through the central control system; S2: Start the device, the air curtain isolation system works, and isolates the internal environment of the cooling box from the external environment; S3: The servo drive system drives the conveyor belt to send the material into the pre-cooling zone. The central control system controls the operation of the compressed air source and the vortex tube cooler to initially cool the material through the nozzle. S4: The material is intermittently conveyed to the cryogenic zone. The central control system controls the cryogenic delivery pump and atomizing nozzle to start, spraying atomized liquid nitrogen onto the material surface for deep and rapid cooling. At the same time, the ultrasonic auxiliary unit is activated, using ultrasonic waves generated by the ultrasonic transducer to act on the workpiece, breaking the hot spots inside the colloid and achieving temperature field homogenization. S5: The cryogenically cooled material is conveyed to the temperature equalization zone. The central control system dynamically adjusts the temperature of the semiconductor temperature control board through a PID algorithm based on the feedback from the embedded temperature sensor, performs precise temperature equalization on the material, eliminates internal stress, and makes the overall temperature drop uniformly to the target temperature. S6: After cooling, the material is conveyed out of the cooling chamber via a conveyor belt.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: This rapid cooling device and method for thermally conductive structural adhesive achieves efficient, uniform, and stable cooling of the thermally conductive structural adhesive through a three-stage graded cooling structure, dynamic control of a central control system, and multiple optimization designs, thereby improving product performance and batch consistency. The specific details are as follows: Firstly, this device achieves dual optimization of efficiency and uniformity through a three-stage cooling structure consisting of a pre-cooling zone, a cryogenic zone, and a homogenization zone, combined with multi-unit collaborative operation. In the pre-cooling zone, multiple vortex tube coolers driven by a compressed air source spray cold air onto the material through nozzles evenly distributed along the axial direction. The nozzles are angled at 30°-60° to the conveyor belt surface, which quickly removes initial heat from the material surface, achieving gentle preliminary cooling and avoiding the temperature shock caused by direct cryogenic cooling. The evenly distributed nozzles also ensure synchronous temperature changes across all areas of the material during pre-cooling. Upon entering the cryogenic zone, a liquid nitrogen supply source sprays a low-temperature atomized medium through an array of atomizing nozzles. Combined with an array of ultrasonic transducers in the 20kHz-100kHz frequency range, the ultrasonic waves effectively break up the "hot spots" formed inside the colloid due to rapid cooling. This process promotes uniform heat transfer within the colloid, solving the problems of excessive local temperature differences and stress concentration that easily occur with traditional liquid nitrogen direct cooling. While achieving rapid deep cooling (meeting the efficiency requirements of high-cycle production), it ensures the uniformity of the internal temperature field of the colloid. Finally, when the material enters the uniform temperature zone, the distributed semiconductor temperature control boards, under the control of the central control system's PID algorithm, independently adjust the temperature based on feedback from embedded temperature sensors, ensuring that the temperature gradient within the uniform temperature zone is less than 2℃ / m. This further eliminates any small temperature differences that may remain from the previous cooling process, preventing defects such as cracking and delamination of the colloid due to uneven temperature, thus achieving an organic unity of "efficient cooling" and "uniform stability". Secondly, this device constructs a cooling system that can be dynamically adjusted throughout the entire process through deep linkage between the central control system and various functional units. The central control system can preset personalized cooling curves based on the characteristics of specific thermally conductive structural adhesives and receive signals from temperature sensors in each area in real time to dynamically adjust the working status of each unit: In the pre-cooling zone, the output pressure of the compressed air source and the working power of the vortex tube cooler can be adjusted to change the intensity and temperature of the cold air jet, adapting to different needs such as slow pre-cooling for low-viscosity adhesives and rapid initial cooling for high-viscosity adhesives; In the cryogenic zone, the central control system can start, stop, and adjust the power and action time of the ultrasonic transducer based on the preset cooling curve or real-time temperature feedback from the cryogenic zone. For example, for adhesives with a large coefficient of thermal expansion, the ultrasonic power can be increased and the action time extended to enhance the "hot spot" elimination effect. At the same time, the output flow rate of the cryogenic delivery pump can be adjusted to control the amount of atomized liquid nitrogen sprayed, balancing the cooling rate and the stability of the adhesive; In the conveying stage, the servo drive system drives the conveyor belt to move intermittently. The central control system controls the servo drive system to precisely adjust the residence time of the material in the pre-cooling zone, cryogenic zone, and uniform temperature zone. For example, for adhesives with high hardness and slow thermal conductivity after curing, the residence time in the cryogenic zone and uniform temperature zone can be extended to ensure sufficient cooling. This precise control capability allows the device to flexibly adapt to the cooling requirements of different types of thermally conductive structural adhesives, solving the problem of poor adaptability caused by the "one-size-fits-all" cooling mode of traditional devices. Finally, this device achieves optimization through multiple design improvements. On one hand, the air curtain isolation system at both ends of the cooling chamber can quickly form a stable air curtain barrier after the device is started, completely isolating the internal environment of the cooling chamber from the outside, effectively preventing the exchange of hot and cold air between the inside and outside of the chamber, and avoiding interference from external ambient temperature changes on the temperature stability of the pre-cooling zone, cryogenic zone, and homogenization zone. This provides a stable environmental foundation for the precise execution of cooling curves in each zone. On the other hand, the semiconductor temperature control board in the homogenization zone uses a PID algorithm for independent temperature control. This not only controls the temperature gradient within the zone to a very small range (less than 2℃ / m), but also guides the overall temperature of the material to slowly and uniformly drop to the target temperature through precise temperature regulation. During this process, the internal stress generated by temperature differences within the colloid is gradually released, solving the problem of residual internal stress caused by the lack of effective homogenization control in the later stages of cooling in traditional cooling methods. The combination of a stable internal cooling environment and an effective internal stress relief mechanism ensures that thermally conductive structural adhesives from the same batch and different batches maintain consistent performance (thermal conductivity and structural stability) after cooling, significantly improving product batch consistency and meeting the stringent and stable performance requirements of high-end electronic devices for thermally conductive structural adhesives. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 For the present invention Figure 1A schematic diagram of the front cross-section structure; Figure 3 For the present invention Figure 2 Another perspective structural diagram.

[0017] In the diagram: 1. Cooling chamber; 2. Air curtain isolation system; 3. Pre-cooling zone; 301. Compressed air source; 302. Compressed air pipeline; 303. Vortex tube cooler; 304. Nozzle; 4. Cryogenic zone; 401. Liquid nitrogen storage tank; 402. Cryogenic transfer pump; 403. Cryogenic medium pipeline; 404. Atomizing nozzle; 405. Ultrasonic transducer; 5. Temperature equalization zone; 501. Semiconductor temperature control board; 6. Conveyor belt; 7. Central control system. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] Please see Figures 1-3 The present invention provides a technical solution: a rapid cooling device and method for thermally conductive structural adhesive, which aims to achieve efficient and uniform cooling of the thermally conductive structural adhesive from a high temperature state to a target cooling temperature, while avoiding internal stress or performance degradation caused by improper cooling rate. The main body of the device is a cooling chamber 1, which is made of stainless steel with excellent thermal insulation properties. The inner wall of the chamber is lined with a 50mm thick layer of centrifugal glass wool insulation to reduce the loss of internal cold energy to the outside. Both ends of the cooling chamber 1 are equipped with an air curtain isolation system 2. This system consists of a high-speed centrifugal fan, an air distribution plate, and a temperature compensation module. When in operation, it can form a continuous "air curtain" to effectively block the convection exchange between the low-temperature environment inside the cooling chamber 1 and the ambient temperature air outside, thus maintaining the stability of the temperature field inside the chamber. The interior of the cooling chamber 1 is divided into three functional zones along the material conveying direction (from the input end to the output end): a pre-cooling zone 3, a deep-cooling zone 4, and a temperature equalization zone 5. These zones are separated by removable insulated partitions. The bottom of the partitions has pre-drilled channels adapted to the conveying mechanism, ensuring smooth material passage while minimizing temperature interference between zones. The chamber also houses a conveying mechanism running through the three functional zones and a central control system 7 for coordinating the operation of all components, forming a complete automated cooling process. The core function of the pre-cooling zone 3 is to initially cool down the high-temperature materials (usually workpieces coated with thermally conductive structural adhesive, with an initial temperature of approximately 80-120℃) that have just entered the device. This prevents the adhesive from cracking due to excessive temperature difference when directly entering the cryogenic zone, and also "pre-cools" the materials for subsequent cryogenic processes, improving overall cooling efficiency. The first cooling unit configured in this zone includes a compressed air source 301, compressed air pipelines 302, vortex tube coolers 303, and nozzles 304. The compressed air source 301 is a screw air compressor with a rated discharge pressure of 0.8MPa and a discharge volume of 1.2m³ / min. The output compressed air is transported to multiple vortex tube coolers 303 via compressed air pipelines 302 (DN25 diameter, made of 304 stainless steel). In this embodiment, there are three vortex tube coolers 303 arranged along the material conveying direction. Their working principle is to divide the airflow into cold flow and hot flow through the vortex effect of compressed air in the tube. The temperature of the cold flow can be reduced by 40-60°C compared with the inlet air temperature, while the hot flow is discharged outside the cooling box 1 through a dedicated exhaust pipe. Each vortex tube cooler 303 has three nozzles 304 connected to its output end. The nozzles 304 are evenly distributed along the axial direction of the vortex tube cooler 303 with a spacing of 150 mm. The angle between the spray direction of the nozzles 304 and the surface of the conveyor belt 6 is set to 45°. This angle has been optimized through fluid simulation to ensure that the cold air evenly covers the material surface and avoids cooling dead zones. During operation, the central control system 7 can adjust the output pressure of the compressed air source 301 according to the initial temperature of the material, thereby controlling the intensity of the cold air spray from the nozzles 304. Typically, the outlet material temperature of the precooling zone 3 is controlled at 30-40℃. Deep cryogenic zone 4 is the core area for achieving rapid cooling of the thermally conductive structural adhesive. Through the synergistic effect of low-temperature atomizing medium and ultrasonic assistance, the material temperature is reduced to the target low-temperature range (usually -20 to 0℃) in a short time, while ensuring uniform temperature inside the adhesive. The second cooling unit consists of a liquid nitrogen supply source, a cryogenic medium pipeline 403, and an atomizing nozzle 404. The liquid nitrogen supply source includes a liquid nitrogen storage tank 401 (500L capacity, 0.8MPa operating pressure, equipped with a pressure relief valve and level gauge) and a cryogenic transfer pump 402 (flow rate adjustable from 0.5-2L / min, with variable frequency speed control). The cryogenic medium pipeline 403 uses cryogenic-resistant stainless steel tubing (material 0Cr18Ni9Ti) with an outer polyurethane insulation layer to prevent violent vaporization of the liquid nitrogen during transport due to heat absorption. Nine atomizing nozzles 404 are arranged in a 3×3 matrix array at the top of the cryogenic zone 4. Each nozzle has an atomization angle of 60°, and the spray volume can be precisely adjusted by the frequency of the cryogenic delivery pump 402. During operation, liquid nitrogen is pressurized by the cryogenic delivery pump 402 and then delivered to the atomizing nozzles 404 through the cryogenic medium pipeline 403. It is atomized into tiny droplets with a diameter of 5-10μm and sprayed evenly onto the material surface, utilizing the latent heat of phase change of liquid nitrogen to achieve rapid cooling. To address the issue of a "temperature gradient" between the material surface and interior during cryogenic processes, cryogenic zone 4 is also equipped with an ultrasonic auxiliary unit. This unit includes three ultrasonic transducers 405 (operating frequency 50kHz, within the 20kHz-100kHz range defined in claim 4), and each ultrasonic transducer 405 corresponds to a set of atomizing nozzles 404, ensuring that the ultrasonic waves can cover the area affected by the atomizing medium. The ultrasonic transducer 405 is electrically connected to the central control system 7. The system can automatically start and stop the ultrasonic transducer 405 and adjust its power (adjustment range 50-300W) and duration based on a preset cooling curve or feedback signals from temperature sensors (located inside the chamber wall, with an accuracy of ±0.5℃) in the cryogenic zone 4. During operation, ultrasonic waves are transmitted to the material surface through a medium (a mixture of atomized liquid nitrogen and air), causing intense vibration of the molecules within the colloid, breaking up localized "hot spots" (areas with higher temperatures), and achieving rapid homogenization of the temperature field, keeping the temperature difference between the inside and outside of the material within 5℃. The function of temperature equalization zone 5 is to perform "fine temperature adjustment" on the material after deep cooling, eliminate the internal stress caused by rapid deep cooling, and make the overall temperature of the material stably drop to the target cooling temperature (such as 25℃±2℃), so as to provide a stable temperature basis for subsequent processing or testing. The temperature equalization unit configured in this area includes two semiconductor temperature control boards 501, distributed at the bottom of the temperature equalization zone 5. Each temperature control board measures 300mm × 200mm and embeds a high-precision platinum resistance temperature sensor (accuracy ±0.1℃). The semiconductor temperature control board 501 operates based on the Peltier effect, combining heating and cooling functions, with a temperature adjustment range of 10-40℃ and a temperature control accuracy of ±0.3℃. The central control system 7 uses a PID (proportional-integral-derivative) algorithm to control the semiconductor temperature control board 501. It collects temperature signals from different locations within the uniform temperature zone 5 in real time using distributed temperature sensors. After algorithmic calculation, it independently adjusts the operating state (cooling power, heating power, or shutdown) of each semiconductor temperature control board 501. For example, when the temperature in a certain area is lower than the target value, the corresponding semiconductor temperature control board 501 starts the heating mode; when the temperature is higher than the target value, it starts the cooling mode, ultimately ensuring that the temperature gradient within the uniform temperature zone 5 is less than 2℃ / m (compliant with the limitation of claim 6), ensuring a uniform overall temperature of the material. The conveying mechanism includes a conveyor belt 6 and a servo drive system. The conveyor belt 6 is made of polytetrafluoroethylene (PTFE) material that is resistant to high and low temperatures (it can work continuously in environments ranging from -50 to 200℃), with a width of 800mm and anti-slip textures on its surface to prevent material deviation during conveying. The servo drive system consists of a servo motor (rated power 1.5kW), a gearbox, and a position encoder, and is electrically connected to the central control system 7, enabling intermittent movement of the conveyor belt 6. The central control system 7, based on preset cooling process parameters, controls the servo drive system to adjust the movement rhythm of the conveyor belt 6, i.e., setting the residence time of the material in the pre-cooling zone 3, the deep-cooling zone 4, and the uniform temperature zone 5 (e.g., 3 minutes in the pre-cooling zone, 5 minutes in the deep-cooling zone, and 4 minutes in the uniform temperature zone), ensuring that the cooling process in each zone is fully completed. A position encoder provides real-time feedback on the running position of the conveyor belt 6, enabling precise material positioning and preventing transmission errors from affecting the cooling effect. The central control system 7 is the "brain" of the entire device. It uses a PLC (Programmable Logic Controller, model S7-1200) as the core control unit and is equipped with a 7-inch touch screen as the human-machine interface. Operators can set cooling curve parameters (such as target temperature of each area, material residence time, cooling rate, etc.), start / stop the device, and view real-time operating data (such as temperature of each area, equipment working status, etc.) and fault alarm information through the touch screen. The core function of the system is to dynamically adjust the working status of each unit: on the one hand, it receives feedback signals from temperature sensors in the precooling zone 3, the cryogenic zone 4, and the uniform temperature zone 5, and compares them with the preset cooling curve; on the other hand, it outputs control commands based on the comparison results to adjust the pressure of the compressed air source 301, the start and stop of the vortex tube cooler 303, the flow rate of the cryogenic delivery pump 402, the power of the ultrasonic transducer 405, the temperature of the semiconductor temperature control board 501, and the movement rhythm of the conveyor belt 6, so as to ensure that the entire cooling process strictly follows the preset process and achieves "intelligent and precise" control. The following describes in detail a rapid cooling method for a certain type of thermally conductive structural adhesive (used in new energy vehicle battery modules, adhesive thickness 2mm, initial curing temperature 100℃, target cooling temperature 25℃±2℃) using the aforementioned device. The specific steps are as follows: S1: Set cooling curve parameters Operators input cooling profile parameters for this type of thermally conductive structural adhesive via the touchscreen of the central control system 7. Pre-cooling zone 3: inlet temperature 100℃, outlet target temperature 35℃, material residence time 3min, compressed air source 301 output pressure 0.6MPa; Cryogenic Zone 4: Inlet temperature 35℃, outlet target temperature 0℃, material residence time 5min, cryogenic conveying pump 402 flow rate 1.2L / min, ultrasonic transducer 405 working frequency 50kHz, power 200W, start-up time is 10s after the material enters the cryogenic zone, and it continues to act until the material leaves the cryogenic zone. Temperature uniform zone 5: target temperature 25℃, temperature gradient ≤2℃ / m, material residence time 4min, PID control parameters (proportional coefficient P=20, integral time I=10s, derivative time D=5s). Once the parameters are set, the central control system 7 automatically stores the process plan, which can be directly called up for subsequent materials of the same type without the need for repeated settings. S2: Activate the air curtain isolation system 2 The operator clicks the "Start" button on the touchscreen. The central control system 7 first controls the air curtain isolation system 2 at both ends of the cooling box 1: the high-speed centrifugal fan starts, and the air is rectified by the flow equalization plate to form a uniform air curtain with a wind speed of 8m / s. At the same time, the temperature compensation module adjusts the air curtain temperature according to the initial temperature inside the box (room temperature 25℃) to keep the temperature difference between the air curtain and the initial temperature inside the box within 5℃, so as to avoid drastic disturbance to the temperature inside the box when the air curtain starts. After the air curtain has been running stably for 30 seconds, the central control system 7 determines that the device is ready for material entry and issues a "Ready" signal. S3: Pre-cooling zone 3 - Initial cooling The workpiece (a battery module measuring 500mm × 300mm × 50mm) coated with this type of thermally conductive structural adhesive is placed at the input end of conveyor belt 6. The servo drive system is activated under the command of the central control system 7, driving conveyor belt 6 to feed the material into pre-cooling zone 3 at a speed of 0.2m / s. When the material reaches the detection position (positioned by a photoelectric sensor) in pre-cooling zone 3, conveyor belt 6 stops moving, and the material begins to stay in pre-cooling zone 3. Simultaneously, the central control system 7 activates the compressed air source 301, outputting compressed air at a pressure of 0.6 MPa, which is then delivered to the three vortex tube coolers 303 via the compressed air pipeline 302. After the vortex tube coolers 303 activate, they separate the compressed air into a cold stream (temperature approximately -10°C) and a hot stream (temperature approximately 60°C). The cold stream is sprayed onto the material surface at a 45° angle through nozzles 304. Within a 3-minute residence time, the material temperature gradually decreases from 100°C to 35°C, achieving the pre-cooling target. Upon completion of pre-cooling, the photoelectric sensor sends a "material ready" signal, and the central control system 7 instructs the servo drive system to activate, with the conveyor belt 6 transporting the material to the cryogenic zone 4. S4: Deep Cooling Zone 4 - Rapid Cooling Once the material enters the cryogenic zone 4 and reaches the designated position (positioned by another set of photoelectric sensors), the conveyor belt 6 stops moving again. The central control system 7 simultaneously activates the second cooling unit and the ultrasonic auxiliary unit. The cryogenic transfer pump 402 is started, and the liquid nitrogen in the liquid nitrogen storage tank 401 is extracted at a flow rate of 1.2L / min. It is then transported to 9 atomizing nozzles 404 through the cryogenic medium pipeline 403. The liquid nitrogen is atomized into tiny droplets and sprayed evenly onto the surface of the material. The material temperature drops rapidly by utilizing the heat absorption of liquid nitrogen vaporization (latent heat of vaporization of about 200kJ / kg). Ten seconds after the material enters the cryogenic zone (at which point the surface temperature of the material has dropped to about 15°C), the central control system 7 activates three ultrasonic transducers 405 to apply ultrasonic waves to the material at a frequency of 50kHz and a power of 200W, thereby promoting rapid homogenization of the internal temperature of the colloid. During the 5-minute residence time, the material temperature dropped from 35℃ to 0℃, and the temperature difference between the inside and outside of the material remained stable within 3℃ as detected by the temperature sensor in the cryogenic zone 4, with no localized overcooling. After cryogenic treatment was completed, the conveyor belt 6 started, transporting the material to the equalization zone 5. S5: Temperature equalization processing in the uniform temperature zone 5 After the material enters the equalization zone 5, the conveyor belt 6 stops, and the central control system 7 activates the temperature equalization unit: temperature sensors embedded in two semiconductor temperature control boards 501 collect temperature signals of the material and the equalization zone 5 in real time and transmit the data to the central control system 7. The system calculates the data using a PID algorithm. If the temperature of a certain area is below 25℃ (e.g., 23℃), the corresponding semiconductor temperature control board 501 is controlled to start the heating mode with an output power of 50W; if the temperature of a certain area is above 25℃ (e.g., 27℃), the cooling mode is started with an output power of 80W. During the 4-minute dwell time, the temperature gradient in the uniform temperature zone 5 was stabilized at 1.5℃ / m through dynamic adjustment of the semiconductor temperature control plate 501. The overall temperature of the material was eventually uniformly reduced to 25℃±1℃, and the internal stress inside the colloid was effectively released through temperature equalization treatment (subsequent testing showed that the warpage of the colloid was ≤0.1mm / m). S6: Material Output After the temperature equalization process is completed, the central control system 7 instructs the servo drive system to start, and the conveyor belt 6 delivers the cooled material out of the cooling chamber 1, thus ending the entire cooling process. Operators can collect the material at the output end for subsequent performance testing or assembly processes. Simultaneously, the central control system 7 automatically stores all data from this cooling process (such as temperature change curves for each area, equipment operating parameters, etc.) for easy subsequent process optimization or quality traceability.

[0020] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A rapid cooling device for heat conductive structural adhesive, comprising a cooling box (1), characterized in that, The cooling box (1) is provided with a wind curtain isolation system (2) at both ends, and the inside is divided into a pre-cooling area (3), a deep cooling area (4) and a temperature equalization area (5) in sequence along the material conveying direction. The pre-cooling area (3) is provided with a first cooling unit, the first cooling unit comprises a compressed air source (301) and a plurality of vortex tube coolers (303) in communication with the compressed air source (301), and the output end of the vortex tube cooler (303) is provided with a nozzle (304) for spraying cold air to the material. The deep cooling area (4) is provided with a second cooling unit, the second cooling unit comprises a liquid nitrogen supply source and a plurality of atomizing nozzles (404) in communication with the liquid nitrogen supply source, for spraying low-temperature atomizing medium to the material, and the deep cooling area (4) is also provided with an ultrasonic auxiliary unit, the ultrasonic auxiliary unit comprises at least one ultrasonic transducer (405), the ultrasonic transducer (405) is arranged near the atomizing nozzle (404), for applying ultrasonic waves to the material. The temperature equalization area (5) is provided with a temperature equalization unit, the temperature equalization unit comprises at least one semiconductor temperature control plate (501), and the semiconductor temperature control plate (501) is embedded with a temperature sensor. The cooling box (1) further comprises a conveying mechanism penetrating through the pre-cooling area (3), the deep cooling area (4) and the temperature equalization area (5), and a central control system (7) for controlling the first cooling unit, the second cooling unit, the ultrasonic auxiliary unit, the temperature equalization unit and the conveying mechanism to work cooperatively, the central control system (7) is configured to dynamically adjust the working state of each unit and the motion rhythm of the conveying mechanism according to a preset cooling curve and the feedback signal of the temperature sensor.

2. The rapid cooling device of the heat-conductive structural adhesive according to claim 1, characterized in that: The conveying mechanism comprises a conveying belt (6) and a servo drive system for driving the conveying belt (6) to make intermittent motion, and the central control system (7) is electrically connected with the servo drive system to control the residence time of the material in each area.

3. The rapid cooling device of a heat-conductive structural adhesive according to claim 2, characterized in that: The angle between the spraying direction of the nozzle (304) and the surface of the conveying belt (6) is 30°-60°.

4. The rapid cooling device of the heat-conductive structural adhesive according to claim 1, characterized in that: The ultrasonic transducers (405) in the ultrasonic auxiliary unit are multiple and arrayed on one side of the atomizing nozzle (404), and the working frequency range of the ultrasonic transducer (405) is 20kHz-100kHz.

5. The rapid cooling device of the heat-conductive structural adhesive according to claim 1, characterized in that: The central control system (7) is electrically connected with the ultrasonic auxiliary unit, and is configured to start, stop and / or adjust the power and action time of the ultrasonic transducer (405) according to the preset cooling curve or the temperature feedback in the deep cooling area (4).

6. The rapid cooling device of a heat-conductive structural adhesive according to claim 1, wherein: The semiconductor temperature control plates (501) in the temperature equalization unit are multiple and distributed at the bottom of the temperature equalization area (5), and the central control system (7) is configured to independently control the temperature of each semiconductor temperature control plate (501) according to the feedback signal of the distributed temperature sensor by using a PID algorithm, so that the temperature gradient in the temperature equalization area (5) is less than 2℃ / m.

7. The rapid cooling device of a heat-conductive structural adhesive according to claim 1, wherein: The number of the vortex tube coolers (303) is multiple, and the vortex tube coolers (303) are connected with the compressed air source (301) through a compressed air pipeline (302); the number of the nozzles (304) is multiple, and the nozzles (304) are uniformly distributed along the axial direction of the vortex tube coolers (303).

8. The rapid cooling device of a heat-conductive structural adhesive according to claim 1, wherein: The liquid nitrogen supply source comprises a liquid nitrogen storage tank (401) and a low-temperature delivery pump (402), the number of the atomizing nozzles (404) is multiple, and the atomizing nozzles (404) are connected with the low-temperature delivery pump (402) through a low-temperature medium pipeline (403), and the atomizing nozzles (404) are arrayed.

9. A rapid cooling method using the heat conductive structural adhesive device according to any one of claims 1 to 8, characterized by, The method comprises the following steps: S1: setting the cooling curve parameters of the specific heat-conducting structural adhesive through the central control system (7); S2: starting the device, and working the air curtain isolation system (2) to isolate the internal environment of the cooling box (1) from the outside; S3: driving the conveying belt (6) to send the material into the pre-cooling area (3) through the servo drive system, and controlling the compressed air source (301) and the vortex tube coolers (303) to work through the central control system (7), so as to preliminarily cool the material through the nozzles (304); S4: intermittently conveying the material to the cryogenic area (4), and starting the low-temperature delivery pump (402) and the atomizing nozzles (404) to spray atomized liquid nitrogen to the surface of the material to perform deep and rapid cooling through the central control system (7); simultaneously, starting the ultrasonic auxiliary unit, and using the ultrasonic waves generated by the ultrasonic transducer (405) to act on the workpiece to break the hot spots in the colloid, so as to realize temperature field homogenization; S5: conveying the material cooled in the cryogenic area (4) to the temperature equalization area (5), and dynamically adjusting the temperature of the semiconductor temperature control plate (501) through the PID algorithm according to the feedback of the embedded temperature sensor through the central control system (7), so as to accurately balance the temperature of the material, eliminate internal stress, and uniformly reduce the overall temperature to the target temperature; S6: conveying the material cooled in the temperature equalization area (5) out of the cooling box (1) through the conveying belt (6).

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