Laser modification method and system for epoxy resin insulating layer of dry-type transformer

Abstract

The invention provides a dry-type transformer epoxy resin insulating layer laser modification method and system, and the method comprises the steps: determining the thickness of a to-be-degraded epoxy resin insulating layer in a workpiece, and determining the configuration parameter value of a to-be-used laser and the specification of a to-be-used field lens according to the thickness and the thermosetting property of epoxy resin; and according to the set scanning path parameter value, focusing the focus of laser generated based on a laser device and a field lens to be used on the surface of the workpiece for scribing, putting the scribed workpiece into a pre-prepared epoxy resin degradation solution, and respectively recovering metal in the winding structure and degraded epoxy resin. According to the method and the system, laser scribing can be implemented in a customized manner according to different epoxy resin formulas or application scenes by adjusting laser and laser parameter treatment modes, so that a porous structure is generated in a heat affected zone of a scribed surface, the contact area with a chemical solvent is increased, and the degradation reaction is more sufficient.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser application, and more particularly, to a laser modification method and system for epoxy resin insulation layer of dry-type transformer. BACKGROUND

[0002] The dry-type transformer is a kind of transformer working under high-voltage insulation medium, which does not need oil as insulation medium compared with oil-immersed transformer, and has higher safety and environmental protection. The dry-type transformer has a wide application in the field of power transmission and distribution, especially in urban power distribution system and power supply in special environment. The dry-type transformer gradually becomes the mainstream product in the power system due to its oil-free design, non-pollution, fire and explosion prevention, low noise and other advantages.

[0003] The dry-type transformer will inevitably be affected by the external environment during long-term operation, especially the aging and performance degradation of materials. This phenomenon will affect the service life of the equipment, and even may cause safety hazards. There are some difficult-to-handle components in the dry-type transformer, such as the epoxy resin insulation material on the surface of the main body of the dry-type transformer, which has strong adhesion with the winding and internal metal wire of the main body of the dry-type transformer, and is difficult to be degraded, which will lead to the difficulty in recycling the abandoned dry-type transformer, causing waste of resources and environmental pollution. Therefore, the retirement and treatment of the dry-type transformer has become a big problem in the current power equipment management. How to effectively degrade and treat the abandoned or aged dry-type transformer has become an environmental protection problem to be solved.

[0004] In order to solve the recycling of the dry-type transformer winding, the general method is to use mechanical crushing, which can physically destroy the epoxy resin relatively quickly and recycle the internal metal wire, but this method is dangerous to operate, and the crushed epoxy resin is generally not treated and directly discarded, which has a certain impact on the environment. Another method is direct incineration, which will produce a large amount of harmful substances, causing secondary pollution. Another method is chemical dissolution, but this method has high cost and low efficiency. In summary, the current treatment of the epoxy resin of the dry-type transformer winding has the problems of large pollution, high cost of degradation solution and low efficiency. SUMMARY

[0005] In order to solve the technical problems of large pollution, high cost of degradation solution and low efficiency in the treatment of the epoxy resin of the dry-type transformer winding in the prior art, the present application provides a laser modification method and system for epoxy resin insulation layer of dry-type transformer.

[0006] According to an aspect of the present application, the present application provides a laser modification method for epoxy resin insulation layer of dry-type transformer, comprising:

[0007] determining a thickness of the epoxy resin insulation layer to be degraded in the workpiece, wherein the workpiece comprises a winding structure inside a retired dry-type transformer and an epoxy resin insulation layer to be degraded covering the winding structure, and the epoxy resin of the epoxy resin insulation layer to be degraded has a thermosetting property;

[0008] determining a configuration parameter value of a laser to be used according to the thickness and the thermosetting property based on a first configuration parameter table, wherein the first configuration parameter table is a data table reflecting a mapping relationship between the thickness and the thermosetting property of the epoxy resin insulation layer and a value range of a configuration parameter of the laser, and the configuration parameter comprises a laser power, an output wavelength, a pulse width, a repetition frequency and a scanning speed;

[0009] determining a specification of a field lens to be used according to the thickness based on a second configuration parameter table, wherein the second configuration parameter table is a data table reflecting a mapping relationship between the thickness of the epoxy resin insulation layer and the specification of the field lens;

[0010] focusing a focal point of laser generated based on the laser to be used and the field lens to be used on a surface of the workpiece according to a set scanning path parameter value to perform scribing, wherein the scanning path parameter comprises a scanning mode and a spacing between adjacent scribing lines;

[0011] placing the workpiece after the scribing into a pre-configured epoxy resin degradation solution to recover the metal in the winding structure and the degraded epoxy resin respectively.

[0012] According to another aspect of the present application, the present application provides a dry-type transformer epoxy resin insulation layer laser modification system, the system comprising:

[0013] a thickness determination module configured to determine a thickness of the epoxy resin insulation layer to be degraded in the workpiece, wherein the workpiece comprises a winding structure inside a retired dry-type transformer and an epoxy resin insulation layer to be degraded covering the winding structure, and the epoxy resin of the epoxy resin insulation layer to be degraded has a thermosetting property;

[0014] a first parameter module configured to determine a configuration parameter value of a laser to be used according to the thickness and the thermosetting property based on a first configuration parameter table, wherein the first configuration parameter table is a data table reflecting a mapping relationship between the thickness and the thermosetting property of the epoxy resin insulation layer and a value range of a configuration parameter of the laser, and the configuration parameter comprises a laser power, an output wavelength, a pulse width, a repetition frequency and a scanning speed;

[0015] a second parameter module configured to determine a specification of a field lens to be used according to the thickness based on a second configuration parameter table, wherein the second configuration parameter table is a data table reflecting a mapping relationship between the thickness of the epoxy resin insulation layer and the specification of the field lens;

[0016] a laser scribing module for scribing on the surface of the workpiece according to the set values of the scanning path parameters, wherein the scanning path parameters include a scanning mode and a spacing between adjacent scribing lines, and wherein the laser scribing module is configured to focus a laser generated by a laser device and a field lens on the surface of the workpiece according to the set values of the scanning path parameters;

[0017] a product recovery module for placing the scribed workpiece into a pre-configured epoxy resin degradation solution to recover the metal in the winding structure and the degraded epoxy resin, respectively.

[0018] According to yet another aspect of the present application, a computer readable storage medium is provided, the storage medium storing a computer program which, when executed by a processor, implements the method of any one of the above aspects of the present application.

[0019] According to yet another aspect of the present application, an electronic device is provided, the electronic device comprising: a processor; a memory for storing instructions executable by the processor; and the processor configured to read the executable instructions from the memory and execute the instructions to implement the method of any one of the above aspects of the present application.

[0020] The laser modification method and system for the epoxy resin insulation layer of the dry-type transformer according to the present application includes determining the thickness of the epoxy resin insulation layer to be degraded in the workpiece, determining the configuration parameter values of the laser to be used based on a self-defined first configuration parameter table according to the thickness and the thermosetting property of the epoxy resin, determining the specifications of the field lens to be used based on a self-defined second configuration parameter table according to the thickness, scribing on the surface of the workpiece according to the set values of the scanning path parameters, placing the scribed workpiece into a pre-configured epoxy resin degradation solution, and recovering the metal in the winding structure and the degraded epoxy resin, respectively. The method and system can realize the reconstruction of the surface structure of the material by adjusting the laser and the laser parameters (such as wavelength, power, and scanning path) and the processing mode of the field lens, have high process flexibility and adaptability, and can customize the laser scribing scheme according to different epoxy resin formulations or application scenarios. The laser scribing will generate a porous structure and micro-cracks in the heat-affected zone of the scribed surface, and the profile of the laser scribing and these phenomena can increase the contact area with the chemical solvent, thereby further increasing the contact surface and making the degradation reaction more sufficient. BRIEF DESCRIPTION OF DRAWINGS

[0021] The exemplary embodiments of the present application can be more completely understood in reference to the following drawings:

[0022] Figure 1 a flowchart of the laser modification method for the epoxy resin insulation layer of the dry-type transformer according to the preferred embodiment of the present application;

[0023] Figure 2 A schematic diagram of a laser scanning track according to a preferred embodiment of the present application;

[0024] Figure 3 A schematic diagram of a laser modification system for epoxy insulation layer of dry-type transformer according to a preferred embodiment of the present application;

[0025] Figure 4 A schematic diagram of an electronic device according to a preferred embodiment of the present application. DETAILED DESCRIPTION

[0026] Reference will now be made to the exemplary embodiments of the present application with reference to the accompanying drawings, however, the present application can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and fully convey the scope of the application to those skilled in the art. The terminology used in the description of the exemplary embodiments presented herein is not intended to be limiting in scope, but is intended to be illustrative of the present application. Identical elements are numbered alike in the various drawings.

[0027] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0028] Exemplary method

[0029] Figure 1 A flow chart of a laser modification method for epoxy insulation layer of dry-type transformer according to a preferred embodiment of the present application. As shown in Figure 1 the laser modification method for epoxy insulation layer of dry-type transformer according to the preferred embodiment starts from step 101.

[0030] In step 101, the thickness of the epoxy insulation layer to be degraded in the workpiece is determined, wherein the workpiece comprises a winding structure inside a retired dry-type transformer and the epoxy insulation layer to be degraded covering the winding structure, and the epoxy resin of the epoxy insulation layer to be degraded is thermosetting.

[0031] Preferably, before determining the thickness of the epoxy insulation layer to be degraded in the workpiece, the method further comprises:

[0032] disassembling the shell of the retired dry-type transformer to obtain the workpiece;

[0033] cleaning the epoxy insulation layer to be degraded on the surface of the workpiece to remove surface contaminants.

[0034] In this preferred embodiment, the cleaning process mainly includes removing contaminants such as dust, oil stains, and other impurities to ensure the laser-treated area is clean and to improve the efficiency of laser energy action on the substrate. For decommissioned cylindrical dry-type transformers, after dismantling and cleaning, the thickness of the epoxy resin insulation layer to be degraded is measured to be 10 mm.

[0035] Preferably, before disassembling the casing of the decommissioned dry-type transformer and obtaining the workpiece, the method further includes establishing a first configuration parameter table according to a first configuration rule and establishing a second configuration parameter table according to a second configuration rule, wherein:

[0036] The first configuration rule includes:

[0037] The ablation efficiency of epoxy resin insulation layer is determined based on its thermosetting properties.

[0038] The output wavelength of the laser is determined based on the relationship between ablation efficiency and laser output wavelength.

[0039] The greater the thickness of the epoxy resin insulating layer, the greater the power of the laser.

[0040] The laser pulse width range is 200-500ns, the repetition frequency is 200-800kHz, and the scanning speed is 100-300mm / s;

[0041] The second configuration rule is that the greater the thickness of the epoxy resin insulation layer, the smaller the focal length of the field lens.

[0042] In step 102, based on the custom first configuration parameter table, the configuration parameter values ​​of the laser to be used are determined according to the thickness and the thermosetting property. The first configuration parameter table is a data table that reflects the mapping relationship between the thickness and thermosetting property of the epoxy resin insulation layer and the range of configuration parameter values ​​of the laser. The configuration parameters include laser power, output wavelength, pulse width, repetition frequency and scanning speed.

[0043] In step 103, based on the custom second configuration parameter table, the specifications of the field lens to be used are determined according to the thickness, wherein the second configuration parameter table is a data table reflecting the mapping relationship between the thickness of the epoxy resin insulation layer and the specifications of the field lens.

[0044] In this preferred embodiment, the average thickness of the epoxy resin is 10.0 mm. Checking its ablation efficiency, it was confirmed that 1064 nm has a high ablation efficiency. Based on the mapping relationship in the custom first configuration parameter table, a YAG nanosecond pulsed laser with an output wavelength of 1064 nm is selected. Further, the pulsed laser power is 500 W, the pulse width is set to 500 ns, the repetition frequency is 330 kHz, and the field lens specification is F254.

[0045] In step 104, according to the set scanning path parameter values, the laser generated by the laser to be used and the field lens is focused on the surface of the workpiece for scribing. The scanning path parameters include the scanning mode and the spacing between adjacent scanning lines.

[0046] In this preferred embodiment, the scanning mode is set to spiral, the spacing between two adjacent scanning lines is 10mm, and the scanning speed is 200mm / s.

[0047] Preferably, the laser focal point of the laser to be used is focused on the surface of the workpiece for scribing, including:

[0048] During the first scribing, the scribing depth on the workpiece surface was recorded;

[0049] The number of scratches at the same location is calculated based on the scratch depth and the thickness.

[0050] The workpiece is repeatedly scratched along a set scratching direction according to the number of scratches until the metal substrate is reached.

[0051] Adjust the laser position sequentially, and repeatedly scratch each remaining unscratched area according to the stated number of scratches until the metal substrate is reached.

[0052] Preferably, the number of scratches at the same location is calculated based on the scratch depth and the thickness, and the calculation formula is as follows:

[0053]

[0054] In the formula, T, H, and D represent the number of scratches, the thickness of the epoxy resin insulation layer to be degraded, and the number of scratches, respectively. Round up a real number.

[0055] In this preferred embodiment, after the first laser scan, the scratch depth is measured to be 0.8 mm. Therefore, according to the scratch count calculation formula, 13 repeated scans are required to penetrate the entire insulating layer and reach the metal substrate, thereby preventing energy waste.

[0056] Preferably, the scanning mode is spiral, and a laser is used to scribble a mesh pattern on the surface of the workpiece.

[0057] Preferably, while focusing the laser of the laser to be used on the surface of the workpiece for scribing, argon gas is introduced to blow away the products generated during the scribing process.

[0058] In this preferred embodiment, in order to improve heat conduction efficiency and reduce carbonization outside the laser heat-affected zone, argon gas with a flow rate of 2.5 MPa is used for auxiliary purging.

[0059] Figure 2 This is a schematic diagram of a laser scanning trajectory according to a preferred embodiment of the present invention. Figure 2 As shown, when the scanning mode is set to spiral, the laser marks on the workpiece surface are spiral-shaped. After scanning, the workpiece surface exhibits a uniform and regular mesh structure, with obvious local cracks and micropores. This structure facilitates the penetration of the solution and the reaction in the subsequent chemical degradation steps.

[0060] In step 105, the workpiece after scribing is placed into a pre-prepared epoxy resin degradation solution to recover the metal and the degraded epoxy resin from the winding structure.

[0061] In this preferred embodiment, the treated workpiece is placed in a laboratory-prepared epoxy resin degradation solution for degradation. During the process, it was observed that the resin in the treated area was significantly peeled off, and the copper wires within the windings could be completely precipitated and recovered. Compared to the previously untreated dry-type transformer, the degradation efficiency can be increased by 200%.

[0062] The laser modification method for the epoxy resin insulation layer of dry transformers described in this preferred embodiment achieves material surface structure reconstruction by adjusting the laser and laser parameters (such as wavelength, power, and scanning path), as well as the field lens processing method. It has high process flexibility and adaptability, and the laser scribing scheme can be customized according to different epoxy resin formulations or application scenarios. Laser scribing will generate a porous structure and microcrack phenomenon in the heat-affected zone of the scribing surface. The contour of laser scribing and these phenomena can increase the contact area with chemical solvents, thereby further increasing the contact surface and making the degradation reaction more complete.

[0063] Exemplary system

[0064] Figure 3 This is a schematic diagram of a laser modification system for the epoxy resin insulation layer of a dry-type transformer according to a preferred embodiment of the present invention. Figure 3 As shown, the laser modification system 300 for the epoxy resin insulation layer of a dry-type transformer according to this preferred embodiment includes:

[0065] Thickness determination module 301 is used to determine the thickness of the epoxy resin insulation layer to be degraded in the workpiece, wherein the workpiece includes the winding structure inside the decommissioned dry-type transformer and the epoxy resin insulation layer to be degraded covering the winding structure, and the epoxy resin of the epoxy resin insulation layer to be degraded has thermosetting properties.

[0066] The first parameter module 302 is used to determine the configuration parameter values ​​of the laser to be used based on the thickness and the thermosetting property according to a custom first configuration parameter table. The first configuration parameter table is a data table that reflects the mapping relationship between the thickness and thermosetting property of the epoxy resin insulation layer and the range of configuration parameter values ​​of the laser. The configuration parameters include laser power, output wavelength, pulse width, repetition frequency and scanning speed.

[0067] The second parameter module 303 is used to determine the specifications of the field lens to be used based on the thickness according to the custom second configuration parameter table, wherein the second configuration parameter table is a data table reflecting the mapping relationship between the thickness of the epoxy resin insulation layer and the specifications of the field lens.

[0068] The laser scribing module 304 is used to scribing the surface of the workpiece by focusing the laser generated by the laser to be used and the field lens on the workpiece according to the set scanning path parameter values, wherein the scanning path parameters include the scanning mode and the spacing between adjacent scanning lines.

[0069] Product recycling module 305 is used to place the workpiece after it has been scratched into a pre-prepared epoxy resin degradation solution to recover the metal and the degraded epoxy resin in the winding structure.

[0070] Preferably, the system further includes a cleaning module for:

[0071] The casing of the decommissioned dry-type transformer was disassembled to obtain the workpiece;

[0072] The epoxy resin insulation layer on the surface of the workpiece is cleaned to remove surface contaminants.

[0073] Preferably, the system further includes a parameter table establishment module, used to establish the first configuration parameter table according to a first configuration rule, and to establish the second configuration parameter table according to a second configuration rule, wherein:

[0074] The first configuration rule includes:

[0075] The ablation efficiency of epoxy resin insulation layer is determined based on its thermosetting properties.

[0076] The output wavelength of the laser is determined based on the relationship between ablation efficiency and laser output wavelength.

[0077] The greater the thickness of the epoxy resin insulating layer, the greater the power of the laser.

[0078] The laser pulse width range is 200-500ns, the repetition frequency is 200-800kHz, and the scanning speed is 100-300mm / s;

[0079] The second configuration rule is that the greater the thickness of the epoxy resin insulation layer, the smaller the focal length of the field lens.

[0080] Preferably, the laser scribing module 304 focuses the laser focal point of the laser to be used onto the workpiece surface for scribing, including:

[0081] During the first scribing, the scribing depth on the workpiece surface was recorded;

[0082] The number of scratches at the same location is calculated based on the scratch depth and the thickness.

[0083] The workpiece is repeatedly scratched along a set scratching direction according to the number of scratches until the metal substrate is reached.

[0084] Adjust the laser position sequentially, and repeatedly scratch each remaining unscratched area according to the stated number of scratches until the metal substrate is reached.

[0085] Preferably, the laser scribing module 304 calculates the number of scribing operations on the same location based on the scribing depth and the thickness, using the following formula:

[0086]

[0087] In the formula, T, H, and D represent the number of scratches, the thickness of the epoxy resin insulation layer to be degraded, and the number of scratches, respectively. Round up a real number.

[0088] Preferably, the laser scribing module uses a spiral scanning mode to scribble a mesh pattern on the surface of the workpiece using a laser.

[0089] Preferably, the laser scribing module 304 focuses the laser of the laser to be used on the surface of the workpiece for scribing, while introducing auxiliary gas argon to blow away the products generated during the scribing process.

[0090] The laser modification system for epoxy resin insulation layer of dry transformers described in this preferred embodiment and the laser modification method for epoxy resin insulation layer of dry transformers determine the thickness of the epoxy resin insulation layer to be degraded in the workpiece, determine the configuration parameters of the laser to be used and the field lens specifications based on the thickness and the thermosetting properties of the epoxy resin, focus the laser generated by the laser to be used and the field lens on the surface of the workpiece for scribing, and finally place the scribed workpiece into a pre-prepared epoxy resin degradation solution to recover the metal in the winding structure and the degraded epoxy resin, respectively. The steps are the same, and the technical effects achieved are also the same, so they will not be described again here.

[0091] Exemplary electronic device

[0092] Figure 4This is a schematic diagram of the structure of an electronic device according to a preferred embodiment of the present invention. Figure 4 As shown, the electronic device includes one or more processors 401 and memory 402.

[0093] The processor 401 may be a central processing unit (CPU) or other form of processing unit with data processing and / or instruction execution capabilities, and may control other components in the electronic device to perform desired functions.

[0094] The memory 402 may include one or more computer program products, which may include various forms of computer-readable storage media, such as volatile memory and / or non-volatile memory. The volatile memory may include, for example, random access memory (RAM) and / or cache memory. The non-volatile memory may include, for example, read-only memory (ROM), hard disk, flash memory, etc. One or more computer program instructions may be stored on the computer-readable storage medium, and the processor 401 may execute the program instructions to implement the laser modification method for the epoxy resin insulation layer of dry transformers of the various embodiments disclosed above, and / or other desired functions. In one example, the electronic device may also include an input device 403 and an output device 404, these components being interconnected via a bus system and / or other forms of connection mechanisms (not shown).

[0095] In addition, the input device 403 may also include, for example, a keyboard, a mouse, etc.

[0096] The output device 404 can output various information to the outside. The output device 404 may include, for example, a display, a speaker, a printer, and a communication network and its connected remote output devices, etc.

[0097] Of course, for the sake of simplicity, Figure 4 Only some of the components of the electronic device relevant to this disclosure are shown, omitting components such as buses, input / output interfaces, etc. In addition, the electronic device may include any other suitable components depending on the specific application.

[0098] Exemplary computer program product and computer readable storage medium

[0099] In addition to the methods and apparatus described above, embodiments of this disclosure may also be computer program products comprising computer program instructions that, when executed by a processor, cause the processor to perform the steps in the laser modification method for the epoxy resin insulation layer of a dry transformer according to various embodiments of this disclosure as described in the "Exemplary Methods" section above.

[0100] The computer program product can be written in any combination of one or more programming languages ​​to perform the operations of the embodiments of this disclosure. The programming languages ​​include object-oriented programming languages ​​such as Java and C++, as well as conventional procedural programming languages ​​such as C or similar languages. The program code can be executed entirely on a user's computing device, partially on a user's computing device, as a standalone software package, partially on a user's computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0101] Furthermore, embodiments of this disclosure may also be computer-readable storage media storing computer program instructions that, when executed by a processor, cause the processor to perform the steps in the laser modification method for the epoxy resin insulation layer of a dry transformer according to various embodiments of this disclosure as described in the "Exemplary Methods" section above.

[0102] The computer-readable storage medium may be any combination of one or more readable media. A readable medium may be a readable signal medium or a readable storage medium. A readable storage medium may, for example, include, but is not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatuses, or devices, or any combination thereof. More specific examples of readable storage media (a non-exhaustive list) include: electrical connections having one or more wires, portable disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0103] The basic principles of this disclosure have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this disclosure are merely examples and not limitations, and should not be considered as essential features of each embodiment of this disclosure. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the scope of this disclosure to the necessity of employing the aforementioned specific details for implementation.

[0104] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For system embodiments, since they largely correspond to method embodiments, the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.

[0105] The block diagrams of devices, apparatuses, devices, and systems disclosed herein are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0106] The apparatus and methods of this disclosure may be implemented in many ways. For example, they may be implemented by software, hardware, firmware, or any combination of software, hardware, and firmware. The above-described order of steps for the methods is for illustrative purposes only, and the steps of the methods of this disclosure are not limited to the order specifically described above unless otherwise specifically stated. Furthermore, in some embodiments, this disclosure may also be implemented as a program recorded on a recording medium, the program including machine-readable instructions for implementing the methods according to this disclosure. Thus, this disclosure also covers recording media storing programs for performing the methods according to this disclosure.

[0107] It should also be noted that in the apparatus, devices, and methods of this disclosure, the components or steps are decomposable and / or recombinable. Such decomposition and / or recombination should be considered equivalent to the present disclosure. The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this disclosure. Therefore, this disclosure is not intended to be limited to the aspects shown herein, but rather to be carried out within the widest scope consistent with the principles and novel features disclosed herein.

[0108] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this disclosure to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations therein.

Claims

1. A method of laser modification of an epoxy insulation layer of a dry-type transformer, characterized in that, The method comprises: determining the thickness of the epoxy resin insulation layer to be degraded in the workpiece, wherein the workpiece comprises a winding structure inside a retired dry-type transformer and an epoxy resin insulation layer to be degraded covering the winding structure, and the epoxy resin of the epoxy resin insulation layer to be degraded has thermosetting property; based on a self-defined first configuration parameter table, determining the configuration parameter value of the laser to be used according to the thickness and the thermosetting property, wherein the first configuration parameter table is a data table reflecting the mapping relationship between the thickness and the thermosetting property of the epoxy resin insulation layer and the value range of the configuration parameter of the laser, and the configuration parameter comprises laser power, output wavelength, pulse width, repetition frequency and scanning speed; based on a self-defined second configuration parameter table, determining the specification of the field lens to be used according to the thickness, wherein the second configuration parameter table is a data table reflecting the mapping relationship between the thickness of the epoxy resin insulation layer and the specification of the field lens; according to the set scanning path parameter value, focusing the focal point of the laser generated based on the laser to be used and the field lens on the surface of the workpiece to perform scribing, wherein the scanning path parameter comprises a scanning mode and a spacing between adjacent scribing lines; placing the workpiece after scribing in a pre-configured epoxy resin degradation solution to recover the metal in the winding structure and the degraded epoxy resin respectively.

2. The method of claim 1, wherein, Before determining the thickness of the epoxy resin insulation layer to be degraded in the workpiece, further comprising: disassembling the shell of the retired dry-type transformer to obtain the workpiece; cleaning the epoxy resin insulation layer to be degraded on the surface of the workpiece to remove surface contaminants.

3. The method of claim 2, wherein, Before disassembling the shell of the retired dry-type transformer to obtain the workpiece, further comprising establishing the first configuration parameter table according to a first configuration rule and establishing the second configuration parameter table according to a second configuration rule, wherein: the first configuration rule comprises: determining the ablation efficiency of the epoxy resin insulation layer based on the thermosetting property thereof; determining the output wavelength of the laser according to the relationship between the ablation efficiency and the output wavelength of the laser; the greater the thickness value of the epoxy resin insulation layer, the greater the power of the laser; the pulse width interval of the laser is 200-500 ns, the repetition frequency is 200-800 kHz, and the scanning speed is 100-300 mm / s; the second configuration rule is that the greater the thickness value of the epoxy resin insulation layer, the smaller the focal length of the field lens.

4. The method of claim 1, wherein, focusing the laser focal point of the laser to be used on the surface of the workpiece to perform scribing, comprising: recording the scribing depth of the workpiece surface scribed by the laser in the first scribing; calculating the scribing times of the same position according to the scribing depth and the thickness; repeatedly scribing in the set scribing direction according to the scribing times until the metal substrate of the workpiece is reached; adjusting the laser position in turn and repeatedly scribing in the set scribing direction according to the scribing times until the metal substrate is reached.

5. The method of claim 4, wherein, The calculation formula for calculating the scribing times of the same position according to the scribing depth and the thickness is: In the formula, T, H and D are respectively the number of scribes, the thickness of the epoxy resin insulation layer to be degraded and the number of scribes, is rounded up to the nearest integer.

6. The method of claim 4, wherein, the scanning mode is spiral, and the workpiece surface is scribed in a mesh shape by the laser.

7. The method of claim 4, wherein, While focusing the laser focal point of the laser to be used on the surface of the workpiece to perform scribing, an auxiliary gas argon is introduced to blow away the generated substances in the scribing process.

8. A system for laser modification of an epoxy insulation layer of a dry-type transformer, characterized by The system comprises: a thickness determination module configured to determine a thickness of the epoxy resin insulation layer to be degraded in a workpiece, wherein the workpiece comprises a winding structure inside a decommissioned dry-type transformer and an epoxy resin insulation layer to be degraded covering the winding structure, and the epoxy resin of the epoxy resin insulation layer to be degraded is thermosetting; a first parameter module configured to determine a configuration parameter value of a laser to be used based on a self-defined first configuration parameter table according to the thickness and the thermosetting, wherein the first configuration parameter table is a data table reflecting a mapping relationship between the thickness and the thermosetting of the epoxy resin insulation layer and a range of values of a configuration parameter of the laser, and the configuration parameter comprises a laser power, an output wavelength, a pulse width, a repetition frequency and a scanning speed; a second parameter module configured to determine a specification of a field lens to be used based on a self-defined second configuration parameter table according to the thickness, wherein the second configuration parameter table is a data table reflecting a mapping relationship between the thickness of the epoxy resin insulation layer and the specification of the field lens; a laser scribing module configured to scribe a surface of the workpiece by focusing a focal point of laser generated based on the laser to be used and the field lens according to a set scanning path parameter value, wherein the scanning path parameter comprises a scanning mode and a spacing between adjacent strip scanning lines; a product recycling module configured to place the workpiece after scribing into a pre-configured epoxy resin degradation solution to recycle a metal in the winding structure and the degraded epoxy resin respectively.

9. A computer readable storage medium having stored thereon a computer program, characterized in that, The program is executed by a processor to implement the steps of the method of any one of claims 1-7.

10. An electronic device, comprising: Comprise: a processor; a memory for storing executable instructions of the processor; the processor is configured to read the executable instructions from the memory and execute the instructions to implement the method of any one of claims 1-7.

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