Design optimization evaluation system and method for indirect cooling type thin-film capacitor shell

Abstract

The invention discloses an indirect cooling type thin film capacitor shell design optimization evaluation system and method. Comprising an inversion brick shell and internal architecture design module, an inversion brick shell topological optimization and thermal simulation verification module, an inversion brick shell fine design and conjugate heat transfer simulation verification module and an inversion brick shell scheme optimization and optimal design shaping module. The method comprises the following steps: carrying out main body design on an inversion brick shell, establishing a topological optimization model of the inversion brick shell, designing an actual structure of the inversion brick shell, carrying out fine design, generating a plurality of groups of differentiated inversion brick shell design schemes, carrying out scheme comparison and screening by balancing three core indexes of thermal performance, weight and cost, and determining an optimal design scheme.

Description

Technical Field

[0001] This invention relates to the field of design, manufacturing and evaluation technology of new energy vehicle components, specifically to a design optimization and evaluation system and method for an indirect-cooled thin-film capacitor housing. Background Technology

[0002] Driven by the global energy transition and the "dual carbon" goal, the new energy vehicle industry is developing rapidly. As a key component of the inverter in the electric drive system, the thin film capacitor undertakes important functions such as DC support, filtering and voltage regulation. Its performance stability directly affects the efficiency and reliability of the electric drive system.

[0003] As electric drive systems for new energy vehicles evolve towards higher power density and miniaturization, the heat flux density of thin-film capacitors has increased significantly. Against this backdrop, indirect cooling technology, due to its ability to adapt to integrated structural layouts, has become one of the main heat dissipation techniques for thin-film capacitors within a certain power range. Currently, the industry's design for indirect cooling thin-film capacitor heat sink housings mainly revolves around "meeting compact space installation requirements" and "basic heat dissipation needs." Thermal simulation technology has been initially applied to the design verification stage, but the overall technical system is still primarily driven by traditional experience. In terms of technological development, the industry has recognized the problems of long indirect cooling paths and difficulty in thermal resistance control under high power density conditions. It has begun to explore the application of technologies such as topology optimization and multiphysics simulation in heat sink housing design, while simultaneously striving to build a comprehensive performance evaluation framework encompassing "thermal resistance control - structural design - conjugate heat transfer" to adapt to the rapid development pace of new energy vehicles and achieve the goals of cost reduction, efficiency improvement, and increased power density of electric drive systems. However, existing technologies still have significant shortcomings in design process coordination, simulation accuracy, and adaptability to industry trends, and a mature technical solution capable of supporting high integration requirements has not yet been formed.

[0004] Current technologies for indirect cooling film capacitor heat sinks are insufficient to meet the high integration and high power density requirements of new energy vehicle electric drive systems, specifically exhibiting the following three core shortcomings:

[0005] (1) Weak ability to adapt to industry trends

[0006] The new energy vehicle industry places stringent demands on the integration, power density, and reliability of electric drive systems, correspondingly setting higher standards for the miniaturization, high-temperature resistance, and heat dissipation efficiency of film capacitors. Current technologies lack precise thermal resistance control solutions for high power density scenarios and cannot optimize heat dissipation paths through scientific design. This makes it difficult to stabilize the operating temperature of film capacitors within a safe range, failing to support increased power density in electric drive systems and ensuring long-term reliability of the drive unit. Furthermore, a systematic design framework adapted to industry development trends has not yet been established, resulting in a significant gap between current technology and the goals of powertrain miniaturization and lightweighting.

[0007] (2) The design process lacks closed-loop iteration and scientific collaboration.

[0008] On the one hand, existing designs rely heavily on manual experience and do not employ structured design methods based on steady-state heat conduction and topology optimization. This leads to frequent rework during the detailed design phase, resulting in low R&D efficiency and significant redundancy in the design results. This is detrimental to product lightweighting and cannot effectively improve the power density of electric drives. On the other hand, the design process has not built a closed-loop system centered on "meeting basic heat dissipation requirements." From initial architecture planning to final application implementation, there is a lack of a scientific iterative mechanism of "topology optimization - multiple rounds of simulation verification - design correction." The various stages (such as architecture planning, topology optimization, and detailed design) are severely disconnected, resulting in long design iteration cycles. This makes it difficult to adapt to the rapid R&D pace of new energy vehicles and has significant shortcomings in assisting the integration and modular design of thin-film capacitors.

[0009] (3) Insufficient synergy of thermal management technologies and limitations in simulation accuracy

[0010] At the level of technological collaboration, existing technologies do not fully integrate advanced thermal management methods such as active cooling and multiphysics simulation. They cannot improve heat dissipation efficiency through precise structural optimization, making it difficult to ensure the stable operation of thin-film capacitors and providing effective support for improving the overall performance of electric drive systems and reducing vehicle energy consumption. Regarding simulation accuracy, thermal simulations often remain at the level of single-physics field analysis, failing to fully couple multiple physics fields such as "heat-structure-contact thermal resistance." The lack of systematic conjugate heat transfer simulation makes it impossible to accurately reflect heat dissipation performance under actual operating conditions, leading to increased design redundancy. This affects the final heat dissipation reliability and hinders the achievement of product cost reduction and lightweighting goals, making it difficult to support the design requirements of an efficient thermal management system. Summary of the Invention

[0011] The purpose of this invention is to address the shortcomings of the aforementioned background technology and provide an indirect cooling thin-film capacitor housing design optimization and evaluation system and method. This solves the technical problem in the prior art where structural optimization efficiency is low and it is impossible to guarantee obtaining the optimal lightweight structure that meets the capacitor temperature rise test boundary.

[0012] To achieve this objective, firstly, the indirect-cooled thin-film capacitor housing design optimization and evaluation system of this invention includes an inverter brick housing initial architecture construction and topology optimization modeling module, an inverter brick housing topology optimization and thermal simulation verification module, an inverter brick housing refined design and conjugate heat transfer simulation verification module, and an inverter brick housing scheme optimization and optimal design finalization module. The inverter brick housing initial architecture construction and topology optimization modeling module is used to determine the main dimensions, material type, and installation interface of the inverter brick housing, and to model the design area and non-design area of ​​the inverter brick housing within a preset design space, completing the internal spatial architecture and heat source distribution planning of the inverter brick housing to meet design requirements including insulation withstand voltage and electromagnetic compatibility. The inverter brick housing topology optimization and thermal simulation verification module is used to establish an inverter brick housing topology optimization model and define empirical parameters, and to judge whether the topology optimization model of the inverter brick housing meets the standards by evaluating the temperature rise of the capacitor core, and output... The system generates a topology optimization model of the compliant inverter brick shell, performs actual structural design of the inverter brick shell based on the topology optimization model, evaluates the temperature rise of the capacitor core by thermal simulation of individual capacitors, determines whether the actual inverter brick shell structure meets the standards, and outputs the actual inverter brick shell structure. The inverter brick shell fine design and conjugate heat transfer simulation verification module is used to carry out fine design of the inverter brick shell structure based on the actual inverter brick shell structure, constructs a multi-physics field coupled conjugate heat transfer model, evaluates the temperature rise of the capacitor core through simulation calculation, determines whether the current fine design of the inverter brick shell meets the performance requirements, and outputs a fine inverter brick shell structure that meets the performance requirements. The inverter brick shell scheme optimization and optimal design finalization module is used to generate multiple sets of differentiated inverter brick shell design schemes for the inverter brick shell, compares and selects schemes by balancing the three core indicators of thermal performance, weight and cost, and determines the optimal design scheme.

[0013] Furthermore, the inverter brick housing and internal architecture design module includes an initial thin-film capacitor housing architecture design module and a basic structure design and topology optimization module. The initial thin-film capacitor housing architecture design module is used to carry out the initial architecture design of the inverter brick housing, determine the main dimensions of the inverter brick housing, the appropriate material types, and various installation interfaces. The basic structure design and topology optimization module is used to carry out basic structural design of the design area and non-design area of ​​the inverter brick housing, plan the spatial architecture inside the inverter brick housing, clarify the distribution location of heat sources and heat dissipation adaptation space, and implement design requirements including insulation withstand voltage and electromagnetic compatibility, focusing on electrical safety and electromagnetic compatibility requirements.

[0014] Furthermore, the inverter brick housing topology optimization and thermal simulation verification module includes an inverter brick housing topology optimization conceptual design and temperature rise verification module, and an inverter brick housing actual design and thermal simulation verification module. The inverter brick housing topology optimization conceptual design and temperature rise verification module is used to establish a topology optimization model with the minimum thermal resistance of the heat dissipation path as the control objective and define empirical parameters. It determines whether the current topology optimization conceptual design meets the requirements by calculating the temperature rise of the capacitor core. If the temperature rise result does not meet the requirements, the topology optimization conceptual design is iteratively optimized until the temperature rise requirement of the capacitor core is met. The inverter brick housing actual design and thermal simulation verification module is used to complete the design of the actual inverter brick housing based on the topology optimization conceptual design of the inverter brick housing. Based on the actual inverter brick housing, thermal simulation is performed on the individual capacitors. The actual inverter brick housing temperature rise is calculated to determine whether the current actual inverter brick housing meets the requirements. If the temperature rise result does not meet the requirements, the actual inverter brick housing is iteratively optimized until the temperature rise requirement of the capacitor core is met.

[0015] Furthermore, the inverter brick shell fine-tuning design and conjugate heat transfer simulation verification module includes a thin-film capacitor heat dissipation shell fine-tuning design module and a thin-film capacitor fine-tuning structure conjugate heat transfer simulation and verification module. The thin-film capacitor heat dissipation shell fine-tuning design module is used to carry out fine-tuning design work on the inverter brick shell based on the actual inverter brick shell structure, including dimensional chain and tolerance design, fine-tuning optimization of heat dissipation structure, and process design adapted to actual manufacturing. The thin-film capacitor fine-tuning structure conjugate heat transfer simulation and verification module is used to construct a multi-physics field coupled conjugate heat transfer model based on the completed fine-tuning design inverter brick shell structure, obtain key data including the temperature distribution of the capacitor core through simulation calculation, and use the capacitor core temperature rise calculation result as the core evaluation index to verify whether the current fine-tuning design of the inverter brick shell meets the thermal performance requirements. If it does not meet the requirements, the fine-tuning design of the inverter brick shell is iteratively optimized to output a fine-tuning design of the inverter brick shell that meets the thermal performance requirements.

[0016] Furthermore, the method of establishing a topology optimization model with the minimum thermal resistance of the heat dissipation path as the control objective and defining empirical parameters, and judging whether the current topology optimization conceptual design meets the requirements by calculating the temperature rise of the capacitor core; if the temperature rise result does not meet the requirements, the topology optimization conceptual design is iteratively optimized until the temperature rise requirement of the capacitor core is met, including: modeling the design space of the inverter brick shell, constructing a topology optimization mathematical model with the minimum thermal resistance of the heat dissipation path as the objective function, where the thermal resistance includes contact thermal resistance and shell thermal conductivity; setting constraints including volume fraction and heat flux density, inputting material parameters including the thermal conductivity of the inverter brick shell and the equivalent thermal resistance of air, defining empirical parameters including the contact thermal resistance between the capacitor core and the inverter brick shell, running the topology optimization algorithm iteratively to obtain the topology of the inverter brick shell with the optimal material distribution, extracting the optimized heat dissipation path, calculating the total thermal resistance according to the series and parallel thermal resistance formula, if the total thermal resistance is not greater than the set threshold, the inverter brick shell topology optimization model meets the basic heat dissipation requirements; otherwise, adjusting the volume fraction and iteratively optimizing again, outputting an inverter brick shell topology optimization model that meets the basic heat dissipation requirements.

[0017] Furthermore, the topology optimization conceptual design based on the inverter brick shell completes the design of the actual inverter brick shell. Based on the actual inverter brick shell, thermal simulation is performed on the individual capacitors. The temperature rise of the capacitor core is calculated to determine whether the current actual inverter brick shell meets the requirements. If the temperature rise result does not meet the requirements, the actual inverter brick shell is iteratively optimized until the temperature rise requirement of the capacitor core is met. The method includes: converting the material distribution of the inverter brick shell output by topology optimization into a manufacturable conceptual design shell geometry model, supplementing process features including fillets and draft angles, and standardized interfaces including threaded holes and positioning grooves to form the actual inverter brick shell; based on the actual inverter brick shell, a thin-film capacitor thermal simulation model is established, setting boundary conditions including the heating power of the capacitor core, ambient temperature, and heat transfer coefficient of the indirect cooling surface, calculating the maximum temperature of the capacitor core, and if the maximum temperature of the capacitor core meets the preset requirements, the current actual inverter brick shell meets the requirements; otherwise, the conceptual design of the inverter brick shell is adjusted and the thermal simulation verification of the thin-film capacitor is performed to output an actual inverter brick shell that meets the temperature rise requirement of the capacitor core.

[0018] Furthermore, based on the actual inverter brick shell structure, a refined structural design is carried out on the inverter brick shell, including dimensional chain and tolerance design, refined optimization of the heat dissipation structure, and process design adapted to actual manufacturing. This method includes: defining key dimensional tolerances, including the capacitor core mounting cavity and the spacing of the heat dissipation fins, in the dimensional chain and tolerance design of the actual inverter brick shell structure; establishing a dimensional chain model based on dimensional chain theory; and ensuring through tolerance analysis that the contact gap between the capacitor core and the inverter brick shell does not exceed a set value; optimizing the heat dissipation fin cross-section from rectangular to trapezoidal; adding auxiliary heat dissipation columns in the hot spot area of ​​the capacitor core to enhance local heat conduction; designing a process-adaptive structure including die-casting draft angle and machining chamfers; selecting the material of the inverter brick shell; designing the surface treatment process of the inverter brick shell; and clarifying the heat-conducting interface material.

[0019] Furthermore, based on the refined design of the inverter brick shell structure, a multi-physics coupled conjugate heat transfer model is constructed. Key data, including the temperature distribution of the capacitor core, are obtained through simulation calculations. The calculated temperature rise of the capacitor core is used as the core evaluation index to verify whether the refined design of the inverter brick shell meets the thermal performance requirements. If not, the refined design of the inverter brick shell is iteratively optimized to output a refined design inverter brick shell that meets the thermal performance requirements. This method includes: an electro-thermal coupling model of the capacitor core based on the refined design of the inverter brick shell structure and simulating the actual working heat distribution according to Joule's law; and the definition of indirect cooling. The dielectric model uses simulation software to construct a conjugate heat transfer model, setting simulation parameters including the heating power of the capacitor core, the temperature of the indirect cooling medium, and the flow rate of the indirect cooling medium. Based on the conjugate heat transfer theory, the solid domain heat conduction equation and the fluid domain convection heat transfer equation are solved to calculate the temperature field of the capacitor core, the temperature distribution of the inverter brick shell, and the heat flow transfer path. If the highest temperature of the capacitor core and the maximum thermal stress of the inverter brick shell both meet the requirements, it is determined that the current refined design of the inverter brick shell meets the thermal performance requirements. Otherwise, the refined design of the inverter brick shell structure is adjusted and the conjugate heat transfer model is simulated to output a refined design of the inverter brick shell that meets the thermal performance requirements.

[0020] Secondly, this invention provides a method for optimizing and evaluating the design of an indirect-cooled thin-film capacitor casing, comprising the following steps:

[0021] Determine the main dimensions, material type, and installation interfaces of the inverter brick housing; model the design and non-design areas of the inverter brick housing within the preset design space, and complete the internal spatial structure and heat source distribution planning of the inverter brick housing; meet the design requirements including insulation withstand voltage and electromagnetic compatibility.

[0022] A topology optimization model of the inverter brick housing is established and empirical parameters are defined. The topology optimization model of the inverter brick housing is judged to meet the standard by evaluating the temperature rise of the capacitor core. The topology optimization model of the inverter brick housing that meets the standard is output. Based on the topology optimization model of the inverter brick housing that meets the standard, the actual structural design of the inverter brick housing is carried out. The temperature rise of the capacitor core is evaluated by thermal simulation of the individual capacitors to determine whether the actual inverter brick housing structure meets the standard. The actual inverter brick housing structure is output.

[0023] Based on the actual inverter brick shell structure, we carry out the refined design of the inverter brick shell structure, construct a multi-physics field coupled conjugate heat transfer model, evaluate the temperature rise of the capacitor core through simulation calculation, determine whether the current refined design of the inverter brick shell meets the performance requirements, and output a refined inverter brick shell structure that meets the performance requirements.

[0024] For inverter brick shells, multiple sets of differentiated inverter brick shell design schemes are generated. The schemes are compared and screened by balancing three core indicators: thermal performance, weight and cost, to determine the optimal design scheme.

[0025] Thirdly, the present invention provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the above-described method.

[0026] Fourthly, the present invention provides an electronic device, including a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other through the communication bus; the memory is used to store computer programs; and the processor is used to implement the method described in the second aspect when executing the program stored in the memory.

[0027] Fifthly, the present invention provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the method described in the second aspect.

[0028] The beneficial effects of this invention are:

[0029] I. Accurately match industry trends to support the high integration and high reliability requirements of electric drive systems:

[0030] In response to the trend of electric drive systems for new energy vehicles evolving towards higher power density and miniaturization, this invention constructs a design model with the goal of "minimizing thermal resistance of the heat dissipation path" through topology optimization. This precisely controls the thermal resistance of the indirect cooling path (e.g., by optimizing the distribution of housing materials and the layout of heat dissipation fins to reduce heat conduction loss), ensuring that the operating temperature of the thin-film capacitor remains stable within a safe range. This design not only meets the performance requirements of miniaturization and high-temperature resistance of thin-film capacitors but also provides crucial support for improving the power density of electric drive systems. Simultaneously, it ensures the long-term reliability of the drive unit, effectively aligning with the industry goals of "capacity reduction, weight reduction, and efficiency improvement" in powertrains, and filling the gap in compatibility between existing technologies and the demands for high integration.

[0031] II. Construct a scientific closed-loop iterative process to improve design efficiency and lightweight design:

[0032] Breaking away from the traditional experience-driven and disconnected design model, this invention establishes a closed-loop system covering the entire process from "initial architecture construction → topology optimization and thermal simulation verification → refined design and conjugate heat transfer verification → scheme optimization and finalization." Through a scientific iterative mechanism of "multi-round simulation verification – design correction," the core configuration is locked in advance during the topology optimization stage, reducing the frequency of rework in the detailed design stage. Simultaneously, relying on topology optimization algorithms to remove structural redundancy (such as optimizing material distribution in non-fluid regions), lightweighting of the casing is achieved while ensuring heat dissipation performance. This process effectively shortens the design iteration cycle, adapts to the rapid R&D pace of new energy vehicles, addresses the shortcomings of existing technologies such as "excessive design redundancy and low R&D efficiency," and facilitates the implementation of integrated and modular designs for thin-film capacitors.

[0033] III. Strengthen the synergy of thermal management technologies to improve simulation accuracy and heat dissipation reliability

[0034] At the level of technological synergy, this invention fully integrates active cooling technology with multiphysics simulation methods. Through refined design and optimization of the heat dissipation structure (such as trapezoidal heat dissipation fins and auxiliary heat dissipation columns in hotspot areas), it combines conjugate heat transfer simulation to construct a coupled "heat-structure-contact thermal resistance" model, accurately reproducing the heat exchange process under actual operating conditions (such as dynamic temperature rise of the capacitor core and temperature field distribution of the casing). Compared to traditional single-physics simulation, this model can more accurately quantify heat dissipation efficiency and temperature uniformity, providing high-precision data support for structural optimization. Simultaneously, by optimizing the heat dissipation path and improving heat exchange efficiency, it ensures the core functions of the thin-film capacitor in "stabilizing the bus voltage and reducing voltage fluctuations," thereby contributing to the overall performance improvement of the electric drive system and the reduction of vehicle energy consumption. This solves the problems of poor heat dissipation reliability and excessive design redundancy caused by insufficient thermal management coordination and limited simulation accuracy in existing technologies.

[0035] IV. Balancing multiple indicators to promote engineering implementation and cost optimization

[0036] This invention compares multiple schemes in the final design stage, balancing three core indicators: thermal performance (such as core temperature rise and heat dissipation efficiency), weight (lightweight requirements), and cost (material cost and manufacturing cost), to select the optimal design scheme and freeze the design. The final standardized design scheme can be directly integrated into the manufacturing process (such as adapting structural details to die casting and machining processes), reducing the conversion cost from design to mass production. At the same time, through lightweight design and process optimization, it reduces the overall R&D and manufacturing costs, providing a feasible technical solution for the engineering application of indirect-cooled thin-film capacitor shells and promoting their large-scale application in new energy vehicle electric drive systems. Attached Figure Description

[0037] To more clearly illustrate the technical solutions of the embodiments disclosed in this invention, the accompanying drawings of the embodiments will be briefly described below. These drawings are for illustrative purposes only and are not intended to limit the scope of protection of this invention.

[0038] Figure 1 This is a schematic diagram of the module connections of the indirect cooling thin-film capacitor housing design optimization and evaluation system in this invention;

[0039] Figure 2 This is a schematic diagram showing the sub-module connections of the initial architecture construction and topology optimization modeling module for the inverter brick shell in this invention;

[0040] Figure 3 This is a schematic diagram of the sub-module connections of the inverter brick shell topology optimization and thermal simulation verification module in this invention;

[0041] Figure 4 This is a schematic diagram of the sub-module connection of the inverter brick shell fine design and conjugate heat transfer simulation verification module in this invention;

[0042] Figure 5 This is a flowchart illustrating the design optimization and evaluation of the indirect-cooled thin-film capacitor housing in this invention.

[0043] Figure 6 This is a three-dimensional view of the initial architecture of the thin-film capacitor in this invention;

[0044] Figure 7 This is an initial three-dimensional view of the topology optimization of the inverter brick shell in this invention;

[0045] The module comprises: 1—Initial architecture construction and topology optimization modeling of inverter brick shell (1.1—Initial thin-film capacitor shell architecture design module, 1.2—Basic structure design and topology optimization module); 2—Topology optimization and thermal simulation verification module for inverter brick shell (2.1—Conceptual design and temperature rise verification module for inverter brick shell topology optimization, 2.2—Actual design and thermal simulation verification module for inverter brick shell); 3—Refined design and conjugate heat transfer simulation verification module for inverter brick shell (3.1—Refined design module for thin-film capacitor heat dissipation shell, 3.2—Refined structure conjugate heat transfer simulation and verification module for thin-film capacitor); 4—Optimization and optimal design finalization module for inverter brick shell.

[0046] 100—Non-designed area of ​​inverter brick bracket; 101—Designed area of ​​inverter brick bracket; 102—Positive busbar; 103—Negative busbar; 104—Indirect water cooling outlet; 105—Indirect water cooling inlet; 106—Capacitor core; 107—Epoxy resin; 108—Insulating paper. Detailed Implementation

[0047] The technical solutions (including preferred technical solutions) of the present invention will be further described in detail below with reference to the accompanying drawings and by way of listing some optional embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0048] Example 1

[0049] like Figure 1 As shown, the present invention provides a design optimization and evaluation system for an indirect-cooled thin-film capacitor housing, including an inverter brick housing initial architecture construction and topology optimization modeling module 1, an inverter brick housing topology optimization and thermal simulation verification module 2, an inverter brick housing refined design and conjugate heat transfer simulation verification module 3, and an inverter brick housing scheme optimization and optimal design finalization module 4.

[0050] like Figure 2As shown, the inverter brick housing initial architecture construction and topology optimization modeling module 1 is used to determine the main dimensions, material type, and installation interfaces of the inverter brick housing; it models the design area and non-design area of ​​the inverter brick housing within a preset design space, completing the internal spatial architecture and heat source distribution planning of the inverter brick housing; and meeting design requirements including insulation withstand voltage and electromagnetic compatibility. Specifically, the inverter brick housing initial architecture construction and topology optimization modeling module 1 includes an initial thin-film capacitor housing architecture design module 1.1 and a basic structure design and topology optimization module 1.2. The initial thin-film capacitor housing architecture design module 1.1 is used to carry out the initial architecture design of the inverter brick housing, determining the main dimensions of the inverter brick housing, suitable material types, and various installation interfaces. The basic structure design and topology optimization module 1.2 is used to carry out the basic structural design of the design area and non-design area of ​​the inverter brick housing, plan the spatial architecture inside the inverter brick housing, clarify the distribution location of heat sources and heat dissipation adaptation space; and implement design requirements including insulation withstand voltage and electromagnetic compatibility, focusing on electrical safety and electromagnetic compatibility requirements.

[0051] like Figure 3 As shown, the inverter brick housing topology optimization and thermal simulation verification module 2 is used to establish an inverter brick housing topology optimization model and define empirical parameters. It evaluates the temperature rise of the capacitor core to determine whether the inverter brick housing topology optimization model meets the standards, outputs a qualified inverter brick housing topology optimization model, and performs actual structural design of the inverter brick housing based on the qualified model. It also performs thermal simulation on individual capacitors to evaluate the temperature rise of the capacitor core, determines whether the actual inverter brick housing structure meets the standards, and outputs the actual inverter brick housing structure. Specifically, the inverter brick housing topology optimization and thermal simulation verification module 2 includes an inverter brick housing topology optimization conceptual design and temperature rise verification module 2.1, and an inverter brick housing actual design and thermal simulation verification module 2.2. The inverter brick housing topology optimization conceptual design and temperature rise verification module 2.1 is used to establish a topology optimization model with the minimum thermal resistance of the heat dissipation path as the control objective and define empirical parameters. It determines whether the current topology optimization conceptual design meets the requirements by calculating the temperature rise of the capacitor core. If the temperature rise result does not meet the requirements, the topology optimization conceptual design is iteratively optimized until the temperature rise requirement of the capacitor core is met. The inverter brick housing actual design and thermal simulation verification module 2.2 is used to complete the actual inverter brick housing design based on the topology optimization conceptual design. Based on the actual inverter brick housing, thermal simulation is performed on individual capacitors. It determines whether the current actual inverter brick housing meets the requirements by calculating the temperature rise of the capacitor core. If the temperature rise result does not meet the requirements, the actual inverter brick housing is iteratively optimized until the temperature rise requirement of the capacitor core is met.

[0052] like Figure 4As shown, the inverter brick shell fine-tuning design and conjugate heat transfer simulation verification module 3 is used to carry out fine-tuning design of the inverter brick shell structure based on the actual inverter brick shell structure, construct a multi-physics coupled conjugate heat transfer model, evaluate the temperature rise of the capacitor core through simulation calculation, determine whether the current fine-tuning design of the inverter brick shell meets the performance requirements, and output a fine-tuning inverter brick shell structure that meets the performance requirements. Specifically, the inverter brick shell fine-tuning design and conjugate heat transfer simulation verification module 3 includes a thin-film capacitor heat dissipation shell fine-tuning design module 3.1 and a thin-film capacitor fine-tuning structure conjugate heat transfer simulation and verification module 3.2. The thin-film capacitor heat dissipation shell fine-tuning design module 3.1 is used to carry out fine-tuning design of the inverter brick shell structure based on the actual inverter brick shell structure, including dimensional chain and tolerance design, fine-tuning optimization of the heat dissipation structure, and process design adapted to actual manufacturing. The thin-film capacitor refined structure conjugate heat transfer simulation and verification module 3.2 is used to construct a multi-physics field coupled conjugate heat transfer model based on the refined design of the inverter brick shell structure. Through simulation calculation, key data including the temperature distribution of the capacitor core are obtained. The calculation results of the temperature rise of the capacitor core are used as the core evaluation index to verify whether the current refined design of the inverter brick shell meets the thermal performance requirements. If it does not meet the requirements, the refined design of the inverter brick shell is iteratively optimized to output a refined design of the inverter brick shell that meets the thermal performance requirements.

[0053] The inverter brick housing scheme optimization and optimal design finalization module 4 is used to generate multiple sets of differentiated inverter brick housing design schemes. By balancing the three core indicators of thermal performance, weight and cost, the schemes are compared and screened to determine the optimal design scheme.

[0054] Example 2

[0055] like Figure 5-7 As shown, this invention provides a method for design optimization and evaluation of indirect-cooled thin-film capacitor housings, comprising the following steps:

[0056] G411, building the initial thin-film capacitor housing architecture design;

[0057] (1) Requirements Analysis and Input:

[0058] Based on the installation space requirements (such as inverter module size and layout constraints), interface requirements (electrical connections and mechanical mounting interfaces), and power ratings (corresponding to capacitor heating power, such as P = 10W-100W) of the thin-film capacitors in the electric drive system of new energy vehicles, the boundary conditions for the housing design are clearly defined. According to basic thermal principles, heat flow Φ = P (ignoring energy storage, the heating power equals the heat dissipation under steady-state conditions), the subsequent heat dissipation housing design must ensure smooth heat dissipation. For example, in an 800V electric drive system, the thin-film capacitor needs to be integrated into the V... spaceWithin a space of 200mm×150mm×80mm, under a certain heat generation power under rated and peak operating conditions, the shell structure is designed accordingly.

[0059] (2) Architecture design output:

[0060] like Figure 6 As shown in Figure 7, the initial shell structure is built using 3D modeling software, defining the shell's external dimensions, installation references (such as bolt hole positions and locating pins), and the core cavity structure (reserving a contact gap d between the core and the shell, and planning the area for filling the thermal interface material). According to Fourier's law of thermal conductivity: 3D thermal conduction: In 3D space, the vector form of Fourier's law of thermal conductivity is q = −k∇T, where q is the heat flux density vector, describing the magnitude and direction of the heat flux; ∇T is the temperature gradient vector, and in a Cartesian coordinate system, ∇T = ∂T / ∂x i + ∂T / ∂y j + ∂T / ∂=, where i, j, and k are the unit vectors in the x, y, and z directions, respectively.

[0061] The thermal conductivity of subsequent contact gaps will affect the overall thermal resistance. An initial 3D model of the shell is output as the basic framework for topology optimization.

[0062] G412, topology optimization design, modeling the designed and non-designed regions of the heat sink housing in a given space:

[0063] (1) Design space division

[0064] Based on the initial architecture, the "design area" (optimizable structures such as heat dissipation fins, shell wall thickness, etc., including the bottom and side wall heat dissipation areas of the shell) and the "non-design area" (unchangeable critical structures such as electrical interface sockets, sealing grooves, and mounting bosses) are defined. For example, the bottom S of the shell... design = The 150mm×100mm area is set as the design area, and the 20mm area around the electrical interface socket is set as the non-design area.

[0065] (2) Modeling and constraint definition

[0066] like Figure 7 As shown, in the topology optimization software, the initial shell model is imported, the design region is discretized using solid elements, and the non-design region is defined as a rigid constraint.

[0067] Set the optimization goal: Minimum thermal resistance R of the heat dissipation path. th ;

[0068] Constraints: Volume fraction f = V / V0, V ≤ 50% (V is the optimized design region volume, V0 is the initial volume), ensuring lightweight design; Heat flux density constraint q = AΦ ≤ 10. 5 W / m2 (To avoid localized overheating), complete the modeling of both the design and non-design areas.

[0069] G413 establishes a topology optimization model and defines empirical parameters with the minimum thermal resistance of the heat dissipation path as the control objective, and verifies the basic heat dissipation performance.

[0070] (1) Model building is based on design space modeling, and a topology optimization mathematical model is constructed:

[0071] Objective function: minR th The thermal resistance R th The thermal network method can be used to calculate, for indirect cooling paths, the contact thermal resistance R. contact Thermal resistance R of the casing cond Wait, R cond =L / kA (L is the length of the heat conduction path, k is the thermal conductivity of the shell material, and A is the heat conduction area).

[0072] Constraints: V0 / V ≤ 30%, heat flux density constraint q ≤ 10 5 W / m 2 .

[0073] Input material parameters such as the thermal conductivity of the aluminum alloy shell k=98W / (m⋅K) and the equivalent thermal resistance of air R. air =0.1K / W, define empirical parameters (such as the thermal resistance R between the core and the shell). contact =0.02K / W, based on actual assembly process, according to the contact thermal resistance theory R contact =hA1, where h is the contact heat transfer coefficient, which is related to surface roughness, contact pressure, etc., and is subject to correction.

[0074] (2) Optimization and verification

[0075] Run a topology optimization algorithm (such as the variable density method) iteratively to obtain the topology with the optimal material distribution. Extract the optimized heat dissipation path and calculate the total thermal resistance R according to the series and parallel thermal resistance formula. th =R contact +∑R cond ,i(R cond (where i is the thermal resistance of each section of the shell), if R th ≤0.5K / W (The threshold is set according to the capacitor's temperature resistance requirements, such as the highest core temperature T) max Ambient temperature T amb Then the thermal resistance must satisfy R th ≤T max -T amb (The specific threshold is adjusted according to the operating conditions) to determine if the basic heat dissipation requirements are met; otherwise, adjust the volume fraction, etc., and iterate and optimize again.

[0076] G414: Based on the geometric output concept design of topology optimization results, the actual capacitor heat dissipation housing structure design was completed and verified.

[0077] (1) Conceptual design transformation

[0078] The material distribution output from topology optimization (such as the orientation of heat dissipation fins and the distribution of shell wall thickness) is transformed into a manufacturable geometric model. This is supplemented with process features (such as fillets and draft angles) and standardized interfaces (such as threaded holes and locating slots) to form a conceptual shell design. For example, the optimized heat dissipation fins, which are distributed radially, are transformed into a trapezoidal fin structure with a width w = 5mm and a height h = 8mm. Based on the convection heat transfer formula Φ = hA(T... s -T f） (h is the convective heat transfer coefficient, A is the heat transfer area, T) s T is the wall temperature. f (This refers to the fluid temperature), and the convective heat dissipation can be increased by increasing the area of ​​the heat dissipation fins.

[0079] (2) Thermal simulation verification

[0080] Based on the conceptual shell design, a thermal simulation model of the thin-film capacitor was established (using CFD software such as Fluent). Boundary conditions were set: core heating power, ambient temperature, and heat transfer coefficient of the indirect cooling surface (simulating coolant / air indirect heat transfer, determined according to Newton's law of cooling). The maximum core temperature T was calculated. max If the value does not exceed the set value, it is determined that the basic heat dissipation requirements are met; otherwise, the conceptual design is adjusted (such as increasing the density of heat dissipation fins, optimizing the fin direction, and changing the influence of the convection heat transfer area A on the heat dissipation), and the simulation is repeated for verification.

[0081] G415, based on the detailed design phase of the housing, the heat dissipation housing is designed in detail;

[0082] (1) Dimension chain and tolerance design

[0083] Define key dimensional tolerances (such as core mounting cavity dimensional tolerance ±0.1mm, heat dissipation fin spacing tolerance ±0.2mm) to ensure assembly accuracy and fit with the heat dissipation surface. Based on dimensional chain theory, establish a dimensional chain model T. total =∑Ti(T) total For the total tolerance, T i (For the tolerances of each component ring), verify the impact of cumulative tolerances on heat dissipation performance (e.g., through tolerance analysis, ensure that the contact gap d between the core and the shell is ≤0.2mm, guarantee the performance of the thermal interface, and the contact thermal resistance R). contact (Varies with gap).

[0084] (2) Refinement of heat dissipation structure: Optimize the cross-sectional shape of heat dissipation fins, such as changing from rectangle to trapezoid, consider draft angle, improve rigidity and heat dissipation area, and add local reinforcement structures in limited space (such as adding auxiliary heat dissipation pillars in the hot spot area of ​​the core to increase local heat conduction path). Design manufacturing process-adaptive structures (such as draft angle of 3°~5° for die casting process and chamfer C0.5 for machining process).

[0085] (3) Materials and surface treatment: Select the shell material (such as die-cast aluminum alloy ADC12, whose thermal conductivity k affects the thermal resistance), design the surface treatment process (such as anodizing, which improves the surface thermal conductivity and corrosion resistance and changes the surface heat transfer characteristics), and specify the thermal interface material, such as thermal grease, whose thermal conductivity k = 3W / (m·K) affects the contact thermal resistance.

[0086] G416, based on detailed three-dimensional structural conjugate heat transfer simulation calculations, verifies the basic heat dissipation requirements:

[0087] (1) Construction of the conjugate heat transfer model:

[0088] Integrating the detailed design of the shell 3D model, the capacitor core heating model (electrothermal coupling, simulating the actual working heat distribution according to Joule's law Q=I²R), and the indirect cooling medium model (such as coolant flow channels / air domains, defining flow velocity v and temperature T) f A conjugate heat transfer model of "thermal-solid-fluid" was constructed (using multiphysics simulation software).

[0089] (2) Simulation and verification:

[0090] Simulation parameters are set as follows: core heating power (spatial distribution consistent with actual operating conditions, obtained through electro-thermal coupling calculation), indirect cooling medium temperature T. f The flow velocity is v = 1 m / s. Based on the conjugate heat transfer theory, the heat conduction equation in the solid domain is solved simultaneously.

[0091] The first term ρc p ∂T / ∂t is the transient term, reflecting the rate of change of temperature with time; ρ is density; c p It is the specific heat capacity at constant pressure, where T is temperature and t is time;

[0092] The second term ∇⋅(−k∇T) is the conduction term (a thermal conductivity term that reflects the diffusion effect of heat conduction, where k is thermal conductivity and ∇ is the gradient operator).

[0093] Wherein, q′ on the right is the heat source term (heat generation rate per unit volume, such as Joule heat, external heat source, etc.).

[0094] Using the convective heat transfer equations in the fluid domain, calculate the core temperature field, shell temperature distribution, and heat transfer paths. If the highest core temperature T...max Maximum thermal stress σ of the shell max If the allowable stress of the material is less than or equal to the allowable stress (e.g., 150 MPa for aluminum alloy, based on the theory of material mechanical strength), the basic heat dissipation requirements are met; otherwise, backtrack to G415 to adjust the detailed design (e.g., optimize the layout of the heat dissipation fins, increase the flow rate of the cooling medium, and change the convective heat transfer coefficient h to affect the heat dissipation), and re-simulate.

[0095] G417, the design optimization of the indirect cooling capacitor heatsink housing is complete:

[0096] Multiple Scheme Generation and Evaluation:

[0097] Based on the design validated by G416, multiple differentiated schemes are generated by adjusting the density of heat dissipation fins (e.g., a ±10% change to alter the convective heat transfer area), materials (e.g., replacing with magnesium alloy to change the thermal conductivity k and affect thermal resistance), and cooling medium parameters (e.g., flow velocity ±0.2m / s to alter the convective heat transfer coefficient h).

[0098] (2) Multi-objective optimization decision-making and establishment of an evaluation index system:

[0099] Thermal performance: maximum core temperature, temperature uniformity (temperature difference ΔT, based on thermal and capacitance performance)

[0100] Lightweighting: Shell mass (target reduction of 10%–20%, calculated based on material density and volume)

[0101] Manufacturing costs: process complexity and material costs (calculated based on processing time and material prices).

[0102] By using a weighted scoring method (thermal performance weight 0.6, lightweighting weight 0.2, cost weight 0.2), the optimal overall solution is selected, the design is frozen, and the final 3D model, engineering drawings, and simulation report are output.

[0103] Example 3

[0104] The present invention provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the method described in Embodiment 2.

[0105] Example 4

[0106] This invention provides an electronic device, including a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other through the communication bus; the memory is used to store computer programs; and the processor, when executing the program stored in the memory, implements the indirect cooling thin-film capacitor housing design optimization and evaluation method described in Embodiment 2.

[0107] The processor can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components.

[0108] The memory may include random access memory (RAM) or non-volatile memory (NVM), such as at least one disk storage device.

[0109] Memory can be volatile memory, such as random-access memory (RAM); memory can also be non-volatile memory, such as read-only memory, flash memory, hard disk drive (HDD), or solid-state drive (SSD); or memory can be any other medium capable of carrying or storing desired program code in the form of instructions or data structures, and accessible by a computer, but is not limited thereto. Memory can be a combination of the above-mentioned types of memory.

[0110] Example 5

[0111] The present invention provides a computer-readable storage medium storing a computer program, which, when executed by a processor, is described as described in Embodiment 2.

[0112] This invention can be implemented wholly or partially through software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented wholly or partially in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this invention are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line DSL) or wireless (e.g., infrared, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., Solid State Disk SSD), etc.

[0113] It should be noted that the above description of the technical solutions is exemplary, and this specification may be embodied in different forms and should not be construed as limiting it to the technical solutions set forth herein. Rather, providing these descriptions will make the disclosure of this invention thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. Furthermore, the technical solutions of this invention are defined only by the scope of the claims. When using the terms "comprising," "having," and "including" as described in this specification, there may also be another part or other parts, and the terms used are generally singular but may also represent plural forms.

[0114] Finally, it should be noted that the above embodiments are merely representative examples of the present invention. Obviously, the present invention is not limited to the above embodiments and many variations are possible. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention should be considered within the protection scope of the present invention.

Claims

1. A design optimization and evaluation system for an indirect-cooled thin-film capacitor casing, characterized in that: It includes the following modules: initial architecture building and topology optimization modeling module for inverter brick shell (1), topology optimization and thermal simulation verification module for inverter brick shell (2), refined design and conjugate heat transfer simulation verification module for inverter brick shell (3), and scheme optimization and optimal design finalization module for inverter brick shell (4). The inverter brick shell initial architecture construction and topology optimization modeling module (1) is used to determine the main body size, material type and installation interface of the inverter brick shell; to model the design area and non-design area of ​​the inverter brick shell in the preset design space, and to complete the internal space architecture and heat source distribution planning of the inverter brick shell; to meet the design requirements including insulation withstand voltage and electromagnetic compatibility. The topology optimization and thermal simulation verification module (2) of the inverter brick housing is used to establish the topology optimization model of the inverter brick housing and define empirical parameters. It evaluates the temperature rise of the capacitor core to determine whether the topology optimization model of the inverter brick housing meets the standard, outputs the topology optimization model of the inverter brick housing that meets the standard, and designs the actual structure of the inverter brick housing based on the topology optimization model of the inverter brick housing. It performs thermal simulation on the capacitor cells to evaluate the temperature rise of the capacitor core, determines whether the actual inverter brick housing structure meets the standard, and outputs the actual inverter brick housing structure. The inverter brick shell fine design and conjugate heat transfer simulation verification module (3) is used to carry out the fine design of the inverter brick shell structure based on the actual inverter brick shell structure, construct a multi-physics field coupled conjugate heat transfer model, evaluate the temperature rise of the capacitor core through simulation calculation, determine whether the current fine design of the inverter brick shell meets the performance requirements, and output a fine inverter brick shell structure that meets the performance requirements. The inverter brick shell scheme optimization and optimal design finalization module (4) is used to generate multiple sets of differentiated inverter brick shell design schemes for inverter brick shells. The schemes are compared and screened by balancing the three core indicators of thermal performance, weight and cost to determine the optimal design scheme.

2. The indirect cooling thin-film capacitor housing design optimization and evaluation system as described in claim 1, characterized in that: The inverter brick housing and internal architecture design module (1) includes an initial thin-film capacitor housing architecture design module (1.1) and a basic structure design and topology optimization module (1.2). The initial thin-film capacitor housing architecture design module (1.1) is used to carry out the initial architecture design of the inverter brick housing, and to determine the main dimensions of the inverter brick housing, the appropriate material types and various installation interfaces; The basic structural design and topology optimization module (1.2) is used to carry out basic structural design for the design area and non-design area of ​​the inverter brick shell, plan the spatial architecture inside the inverter brick shell, and clarify the distribution location of heat sources and heat dissipation adaptation space. To ensure electrical safety and electromagnetic compatibility, design requirements, including insulation withstand voltage and electromagnetic compatibility, must be implemented.

3. The indirect cooling thin-film capacitor housing design optimization and evaluation system as described in claim 1, characterized in that: The inverter brick shell topology optimization and thermal simulation verification module (2) includes an inverter brick shell topology optimization conceptual design and temperature rise verification module (2.1), and an inverter brick shell actual design and thermal simulation verification module (2.2). The inverter brick housing topology optimization concept design and temperature rise verification module (2.1) is used to establish a topology optimization model with the minimum thermal resistance of the heat dissipation path as the control objective and define empirical parameters. It judges whether the current topology optimization concept design meets the requirements by calculating the temperature rise of the capacitor core. If the temperature rise result does not meet the requirements, it continues to iterate and optimize the topology optimization concept design until the temperature rise requirement of the capacitor core is met. The inverter brick housing actual design and thermal simulation verification module (2.2) is used for topology optimization concept design based on the inverter brick housing, to complete the design of the actual inverter brick housing, and to carry out thermal simulation of individual capacitors based on the actual inverter brick housing. The actual inverter brick housing is judged to meet the requirements by calculating the temperature rise of the capacitor core. If the temperature rise result does not meet the requirements, the actual inverter brick housing will be iteratively optimized until the temperature rise requirement of the capacitor core is met.

4. The indirect cooling thin-film capacitor housing design optimization and evaluation system as described in claim 1, characterized in that: The inverter brick shell fine design and conjugate heat transfer simulation verification module (3) includes a thin film capacitor heat dissipation shell fine design module (3.1) and a thin film capacitor fine structure conjugate heat transfer simulation and verification module (3.2). The thin-film capacitor heat dissipation housing fine design module (3.1) is used to carry out the structural fine design work of the inverter brick housing based on the actual inverter brick housing structure, including dimensional chain and tolerance design, fine optimization of heat dissipation structure, and process design adapted to actual manufacturing. The thin-film capacitor refined structure conjugate heat transfer simulation and verification module (3.2) is used to construct a multi-physics field coupled conjugate heat transfer model based on the refined design of the inverter brick shell structure. It obtains key data including the temperature distribution of the capacitor core through simulation calculation, and uses the temperature rise calculation result of the capacitor core as the core evaluation index to verify whether the current refined design of the inverter brick shell meets the thermal performance requirements. If it does not meet the requirements, it iterative optimization of the refined design of the inverter brick shell is performed to output a refined design of the inverter brick shell that meets the thermal performance requirements.

5. The indirect cooling thin-film capacitor housing design optimization and evaluation system as described in claim 3, characterized in that: The topology optimization model is established with the minimum thermal resistance of the heat dissipation path as the control objective, and empirical parameters are defined. The current topology optimization conceptual design is judged to meet the requirements by calculating the temperature rise of the capacitor core. If the temperature rise result does not meet the requirements, the topology optimization conceptual design is iteratively optimized until the temperature rise requirement of the capacitor core is met. This method includes: modeling the design space based on the inverter brick shell, constructing a topology optimization mathematical model with the minimum thermal resistance of the heat dissipation path as the objective function, where the thermal resistance includes contact thermal resistance and shell thermal conductivity thermal resistance, setting constraints including volume fraction and heat flux density, inputting material parameters including the thermal conductivity of the inverter brick shell and the equivalent thermal resistance of air, defining empirical parameters including the contact thermal resistance between the capacitor core and the inverter brick shell, running the topology optimization algorithm iteratively to obtain the topology of the inverter brick shell with the optimal material distribution, extracting the optimized heat dissipation path, calculating the total thermal resistance according to the series and parallel thermal resistance formula, if the total thermal resistance is not greater than the set threshold, the inverter brick shell topology optimization model meets the basic heat dissipation requirements; otherwise, the volume fraction is adjusted and iterative optimization is repeated to output the inverter brick shell topology optimization model that meets the basic heat dissipation requirements.

6. The indirect cooling thin-film capacitor housing design optimization and evaluation system as described in claim 3, characterized in that: The topology optimization concept design based on the inverter brick shell completes the design of the actual inverter brick shell. Based on the actual inverter brick shell, thermal simulation is carried out on the individual capacitors. The temperature rise of the capacitor core is calculated to determine whether the current actual inverter brick shell meets the requirements. If the temperature rise result does not meet the requirements, the actual inverter brick shell is iteratively optimized until the temperature rise requirement of the capacitor core is met. This method includes: converting the material distribution of the inverter brick shell output by topology optimization into a manufacturable conceptual design shell geometry model, supplementing process features including fillets and draft angles, and standardized interfaces including threaded holes and positioning slots to form the actual inverter brick shell; based on the actual inverter brick shell, establishing a thin-film capacitor thermal simulation model, setting boundary conditions including capacitor core heating power, ambient temperature, and heat transfer coefficient of indirect cooling surface, calculating the maximum temperature of the capacitor core; if the maximum temperature of the capacitor core meets the preset requirements, the current actual inverter brick shell meets the requirements; otherwise, adjusting the conceptual design of the inverter brick shell and performing thermal simulation verification of the thin-film capacitor, outputting an actual inverter brick shell that meets the temperature rise requirement of the capacitor core.

7. The indirect-cooling thin-film capacitor housing design optimization and evaluation system as described in claim 4, characterized in that: The method for conducting refined structural design of the inverter brick shell based on the actual inverter brick shell structure, including dimensional chain and tolerance design, refined optimization of heat dissipation structure, and process design adapted to actual manufacturing, includes: defining key dimensional tolerances, including the capacitor core mounting cavity and the spacing of heat dissipation fins, in the dimensional chain and tolerance design of the actual inverter brick shell structure; establishing a dimensional chain model based on dimensional chain theory; ensuring through tolerance analysis that the contact gap between the capacitor core and the inverter brick shell does not exceed a set value; optimizing the cross-section of the heat dissipation fins from rectangular to trapezoidal; adding auxiliary heat dissipation columns in the hot spot area of ​​the capacitor core to enhance local heat conduction; designing process-adaptive structures, including die-casting demolding draft angle and machining chamfer; selecting the material of the inverter brick shell; designing the surface treatment process of the inverter brick shell; and clarifying the heat conduction interface material.

8. The indirect cooling thin-film capacitor housing design optimization and evaluation system as described in claim 4, characterized in that: The method described above, based on the refined design of the inverter brick shell structure, constructs a multi-physics coupled conjugate heat transfer model. Through simulation calculations, key data, including the temperature distribution of the capacitor core, are obtained. Using the calculated temperature rise of the capacitor core as the core evaluation index, the method verifies whether the refined design of the inverter brick shell meets the thermal performance requirements. If not, the refined design of the inverter brick shell is iteratively optimized to output a refined design inverter brick shell that meets the thermal performance requirements. This method includes: an electro-thermal coupling model of the capacitor core based on the refined design of the inverter brick shell structure and simulating the actual heat distribution during operation according to Joule's law; and defining an indirect cooling medium model. The model employs simulation software to construct a conjugate heat transfer model, setting simulation parameters including the heating power of the capacitor core, the temperature of the indirect cooling medium, and the flow rate of the indirect cooling medium. Based on the conjugate heat transfer theory, the solid domain heat conduction equation and the fluid domain convection heat transfer equation are solved to calculate the temperature field of the capacitor core, the temperature distribution of the inverter brick shell, and the heat flow transfer path. If the highest temperature of the capacitor core and the maximum thermal stress of the inverter brick shell both meet the requirements, it is determined that the current refined design of the inverter brick shell meets the thermal performance requirements. Otherwise, the refined design of the inverter brick shell structure is adjusted and the conjugate heat transfer model is simulated again to output a refined design of the inverter brick shell that meets the thermal performance requirements.

9. A method for optimizing and evaluating the design of an indirect-cooled thin-film capacitor housing based on the indirect-cooled thin-film capacitor housing design optimization and evaluation system according to any one of claims 1-8, characterized in that: It includes the following steps: Determine the main dimensions, material type, and installation interfaces of the inverter brick housing; within the preset design space, model the design area and non-design area of ​​the inverter brick housing to complete the internal spatial structure and heat source distribution planning of the inverter brick housing; meet the design requirements including insulation withstand voltage and electromagnetic compatibility. Establish a topology optimization model for the inverter brick housing and define empirical parameters. By evaluating the temperature rise of the capacitor core, determine whether the topology optimization model for the inverter brick housing meets the standards, and output the topology optimization model for the inverter brick housing that meets the standards. Based on the topology optimization model of the qualified inverter brick shell, the actual structural design of the inverter brick shell is carried out. Thermal simulation is performed on the individual capacitors to evaluate the temperature rise of the capacitor core, determine whether the actual inverter brick shell structure meets the standards, and output the actual inverter brick shell structure. Based on the actual inverter brick shell structure, we carry out the refined design of the inverter brick shell structure, construct a multi-physics field coupled conjugate heat transfer model, evaluate the temperature rise of the capacitor core through simulation calculation, determine whether the current refined design of the inverter brick shell meets the performance requirements, and output a refined inverter brick shell structure that meets the performance requirements. For inverter brick shells, multiple differentiated inverter brick shell design schemes are generated. By balancing the three core indicators of thermal performance, weight and cost, the schemes are compared and screened to determine the optimal design scheme.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method of claim 9.

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