Intelligent cable bridge with active heat dissipation function

Abstract

The invention discloses an intelligent cable bridge with an active heat dissipation function, and the cable bridge comprises a cable trough frame, a plurality of cooling pipes are fixedly arranged on the inner wall of the bottom of the cable trough frame, the interior of each cooling pipe is filled with a phase-change material, the phase-change materials are acetone and Al2O3 nanoparticles, the side surface of the cable trough frame is provided with rectangular air inlets, and the rectangular air inlets are communicated with the cooling pipes. Two sliding rails are fixedly installed on the side wall of the cable groove frame and located on the two sides of the rectangular air inlet hole. The conical heat conduction groove collects cable heat to drive the piezoelectric film to generate power, electric energy is stored and then supplies power to the semiconductor cooler, the cooling fan and the electromagnet, and zero external energy heat dissipation is achieved. The acetone and Al2O3 nano-particle composite phase change material improves the heat capacity and the response speed, and cross overheating is avoided in combination with the spaced cable trough. The electromagnet linkage baffle automatically opens and closes the air inlet hole along with the temperature, gravity reset sealing is achieved, semiconductor refrigeration waste heat is returned to the power generation end, and the energy efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of intelligent active heat dissipation technology for cable trays, and in particular to an intelligent cable tray with active heat dissipation function. Background Technology

[0002] Cable trays, often simply called cable trays, are used to support and store cables, functioning as cable ducts. They are mostly made of metal, with traditional cable trays consisting of a metal tray body (aluminum alloy / galvanized steel) that relies on natural convection for heat dissipation. Some patented designs use perforated designs or additional heat dissipation fins, but these are all passive cooling cable trays. Passive cooling cannot handle the heat generated by high-load cables; simple fan solutions are energy-intensive and have disordered airflow, resulting in low heat dissipation efficiency.

[0003] Publication No. CN105490225B discloses a cable tray including a cable trough extending in a front-rear direction. The cable tray also includes a partition located inside the cable trough. The partition is rotatably disposed relative to the bottom plate of the cable trough about a rotation axis extending in the front-rear direction, so that the partition can switch between an unfolded position and a folded position. In the unfolded position, the partition is vertically disposed relative to the bottom plate to divide the internal space of the cable trough in the left-right direction. In the folded position, the partition is stacked on the bottom plate.

[0004] Existing cable trays use open designs or have added heat dissipation fins, which are passive heat dissipation trays. They have poor heat dissipation performance, cannot intelligently and actively dissipate heat, cannot cope with the heat generated by high-load cables, and affect the service life of the cables. Summary of the Invention

[0005] To overcome the shortcomings of existing technologies, this invention provides an intelligent cable tray with active heat dissipation function. Existing cable trays use open designs or add heat dissipation fins, which are passive heat dissipation trays. They have poor heat dissipation effect, cannot intelligently and actively dissipate heat, and cannot cope with the heat generated by high-load cables, thus affecting the service life of the cables.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0007] Intelligent cable trays with active heat dissipation function include:

[0008] The cable tray has multiple cooling tubes fixedly installed on the bottom inner wall. The interior of each cooling tube is filled with phase change material, which is acetone and Al2O3 nanoparticles. The side of the cable tray has a rectangular air inlet. Two slide rails are fixedly installed on the side wall of the cable tray, and the two slide rails are located on both sides of the rectangular air inlet.

[0009] Top cover, fitted and installed on top of the cable tray frame;

[0010] An active cooling mechanism is installed on the bottom inner wall of the top cover and located inside the cable tray.

[0011] The sealing baffle structure, in conjunction with two slide rails, is located at the position of the rectangular air inlet.

[0012] Preferably, the cable tray frame has protruding edges on both sides of the top, and the top cover has folded edge grooves on both sides of the bottom. The two protruding edges and the two folded edge grooves cooperate to connect the cable tray frame and the top cover.

[0013] Preferably, the spacing between the multiple cooling pipes is 3mm, and a cable discharge trough is formed between the multiple cooling pipes.

[0014] Preferably, the active heat dissipation mechanism includes an active heat dissipation box, which is fixedly installed on the bottom inner wall of the top groove cover. A conical heat conduction groove is provided inside the active heat dissipation box, with the large end of the conical heat conduction groove facing down and the small end facing up. A rectangular hole is opened at the top of the conical heat conduction groove, and a piezoelectric film generator is attached to the top of the rectangular hole. A conductive wire is connected to the piezoelectric film generator, and a battery module is connected to the conductive wire.

[0015] The conical heat-conducting groove has its large end facing down and its small end facing up, which facilitates heat collection and conduction to the piezoelectric film generator.

[0016] Preferably, the battery module includes a battery, an intelligent control chip, and a piezoelectric film generator that generates electricity and conducts it to the battery.

[0017] Preferably, a triangular block is fixedly installed at the bottom of the active heat dissipation box, and a double row of cooling fans is installed on the inclined surface of the triangular block. The double row of cooling fans is inclined downwards and used to blow air onto the cable at an inclined forward.

[0018] Preferably, a semiconductor cooler is embedded in the bottom of the active heat dissipation box. The cooling surface of the semiconductor cooler is located behind the dual-row cooling fans, and the heat dissipation surface of the semiconductor cooler is located inside the active heat dissipation box. A heat conduction box is provided inside the active heat dissipation box. The heat dissipation surface of the semiconductor cooler is located inside the heat conduction box. A heat conduction pipe is connected to the heat conduction box, and the outer end of the heat conduction pipe extends into the interior of the conical heat conduction groove.

[0019] Preferably, the outer end of the heat pipe is provided with a fitting slope, which fits against the slope of the conical heat-conducting groove.

[0020] Preferably, the sealing baffle structure includes a sealing baffle, the two sides of which are slidably connected to the inner walls of two slide rails, a fixing plate is fixedly installed on the top of the sealing baffle, an armature is fixedly installed on the top of the fixing plate, a rectangular plate is fixedly installed on the side of the active heat dissipation box, and an electromagnet is fixedly installed on the bottom of the rectangular plate, with the electromagnet cooperating with the armature.

[0021] Preferably, the entire cable tray is equipped with several active heat dissipation mechanisms, and the cable tray is equipped with several rectangular air inlets, sealing baffle structures, and other structures.

[0022] Compared with the prior art, the beneficial effects that this invention can achieve are:

[0023] 1. Self-powered heat recovery mechanism: The piezoelectric film generator directly converts the heat generated by the cable into electrical energy to power the system (stored through a battery module). The conical heat-conducting groove is designed with the larger end facing down to efficiently collect heat, while the smaller end faces up to conduct heat to the piezoelectric film, maximizing the heat-to-electric conversion efficiency.

[0024] 2. Phase change material and nanoparticle composite cooling: The cooling tube is filled with acetone and Al2O3 nanoparticles as phase change materials. When absorbing heat, a phase change (from solid to liquid) occurs, absorbing a large amount of latent heat. Al2O3 nanoparticles enhance thermal conductivity, and acetone provides a high phase change enthalpy. The combination improves heat capacity and response speed. At the same time, a mm spacing is reserved to form a cable discharge groove to avoid cable cross-piling.

[0025] 3. Semiconductor cooling and heat recovery closed-loop system: The cooling surface of the semiconductor cooler cools the airflow, while the heat from the heat dissipation surface is conducted back to the conical heat conduction groove through the heat conduction box and heat conduction pipe to assist in piezoelectric film power generation. This forms a "cooling-heat recovery" closed loop (the inclined surface ensures heat conduction efficiency), reducing heat waste. Combined with the inclined airflow of the dual-row cooling fans, it achieves directional airflow cooling.

[0026] 4. The deformation signal of the piezoelectric film generator controls the start and stop of the electromagnet and fan: power generation starts heat dissipation at high temperatures, and automatic power-off and reset at low temperatures. A sealing baffle combined with gravity achieves zero-energy sealing (the rectangular air inlet opens during heat dissipation and automatically closes after cooling), eliminating the need for additional sensors and reducing the failure rate.

[0027] 5. Multiple active cooling mechanisms work in conjunction with rectangular air intakes and a sealing baffle structure to cover the entire cable tray. The interlocking design of the raised edge and folded edge slots simplifies installation, supports scalable deployment, is suitable for high-density cable environments, and improves system flexibility and maintainability.

[0028] This invention utilizes a conical heat-conducting groove to collect heat from the cable, driving a piezoelectric membrane to generate electricity. The stored electrical energy then powers a semiconductor cooler, cooling fan, and electromagnet, achieving heat dissipation with zero external energy source. Acetone and Al2O3 nanoparticle composite phase change material enhances heat capacity and response speed, while the spaced cable grooves prevent cross-over overheating. An electromagnet-linked baffle automatically opens and closes the air inlet based on temperature, resetting and sealing it by gravity. Waste heat from the semiconductor cooling system is returned to the power generation end, improving energy efficiency. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the main structure of the present invention;

[0030] Figure 2 This is a side view of the structure of the present invention;

[0031] Figure 3 This is a partial bottom view of the structure of the present invention;

[0032] Figure 4 This is a structural schematic diagram of the cable tray frame, active heat dissipation mechanism, top tray cover and related parts of the present invention.

[0033] Figure 5 This is a bottom view of the cable tray frame, active heat dissipation mechanism, top cover and related parts of the present invention.

[0034] Figure 6 This is a side view of the cable tray, active heat dissipation mechanism, top cover and related parts of the present invention.

[0035] Figure 7 This is a schematic diagram of the cable tray, slide rail, rectangular air inlet, and cooling pipe of the present invention.

[0036] Figure 8 This is a schematic diagram of the active heat dissipation mechanism and related parts of the present invention;

[0037] Figure 9 This is a bottom view of the active heat dissipation mechanism and related components of the present invention.

[0038] Figure 10 This is a schematic diagram of the structure of the piezoelectric film generator, conductive wire, and battery module of the present invention;

[0039] Figure 11 This is a bottom view of the heat-conducting box, heat-conducting pipe, and fitting inclined surface of the present invention.

[0040] Figure 12 This is a schematic diagram of the cooling tube and phase change material of the present invention;

[0041] Figure 13 This is a schematic diagram of the sealing baffle structure of the present invention;

[0042] Figure 14 This is a bottom view of the active heat dissipation box, conical guide groove, double-row cooling fan, semiconductor cooler, sealing baffle structure, electromagnet, fixing plate and related parts of the present invention.

[0043] Among them: 1. Cable tray; 11. Raised edge; 12. Rectangular air inlet;

[0044] 2. Cooling tube; 21. Phase change material;

[0045] 3. Active heat dissipation mechanism; 31. Active heat dissipation box; 32. Conical heat conduction groove; 321. Rectangular hole; 33. Dual-row cooling fan; 331. Triangular block; 34. Semiconductor cooler; 35. Piezoelectric film generator; 351. Conductive wire; 352. Battery module; 36. Heat conduction box; 361. Heat conduction pipe; 362. Adhesive bevel; 37. Electromagnet; 371. Rectangular plate;

[0046] 4. Top groove cover; 41. Folded edge groove;

[0047] 5. Sealing baffle structure; 51. Sealing baffle; 52. Fixing plate; 53. Armature; 6. Slide rail. Detailed Implementation

[0048] To make the technical means, creative features, and achieved objectives and effects of this invention easier to understand, the invention is further described below with reference to specific embodiments. However, the following embodiments are merely preferred embodiments of this invention and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments described herein without creative effort are all within the protection scope of this invention. Unless otherwise specified, the experimental methods in the following embodiments are conventional methods, and the materials and reagents used in the following embodiments are commercially available unless otherwise specified.

[0049] Example 1

[0050] like Figures 1-14 As shown, the present invention provides an intelligent cable tray with active heat dissipation function, including a cable tray 1, an active heat dissipation mechanism 3, a top cover 4, and a sealing baffle structure 5. Multiple cooling pipes 2 are fixedly installed on the bottom inner wall of the cable tray 1. The interior of each cooling pipe 2 is filled with a phase change material 21, which is acetone and Al2O3 nanoparticles. A rectangular air inlet 12 is opened on the side of the cable tray 1. Two slide rails 6 are fixedly installed on the side wall of the cable tray 1. The two slide rails 6 are located on both sides of the rectangular air inlet 12. The top cover 4 is installed on the top of the cable tray 1. The active heat dissipation mechanism 3 is installed on the bottom inner wall of the top cover 4 and located inside the cable tray 1. The sealing baffle structure 5 cooperates with the two slide rails 6 and is located at the position of the rectangular air inlet 12.

[0051] Specifically, the cable tray 1 serves as the system base, supporting cables and heat dissipation components. It provides mechanical protection and a thermal management environment. Cooling pipes 2 are fixed to the bottom inner wall, and rectangular air inlets 12 are opened on the side for airflow exchange. A slide rail 6 is installed on the side wall to guide the movement of the sealing baffle. The top protruding edge 11 mates with the folded groove 41 of the top cover 4, enabling quick plug-in installation.

[0052] More specifically, cooling pipe 2 serves as a passive heat absorber and cable support, reducing the initial heat load. Multiple cooling pipes are fixed to the inner wall of the bottom of the cable tray 1, and are filled with phase change material 21 (acetone + Al2O3 nanoparticles). When the cable heats up, the material absorbs heat and undergoes a phase change (solid to liquid), storing thermal energy; the nanoparticles enhance heat conduction. A 3mm gap is reserved between the multiple cooling pipes to form a cable discharge channel, ensuring that the cables are arranged in a single layer and avoiding cross-over overheating.

[0053] like Figure 3 As shown in this embodiment, the top two sides of the cable tray frame 1 are provided with protruding edges 11, and the bottom sides of the top tray cover 4 are provided with folded edge grooves 41. The two protruding edges 11 and the two folded edge grooves 41 cooperate to connect the cable tray frame 1 and the top tray cover 4.

[0054] Specifically, the top cover 4 covers the top of the cable tray frame, installs the active cooling mechanism 3, and provides protection. It forms a closed space by engaging with the protruding edge 11 of the cable tray frame 1 via the folded groove 41. The active cooling box 31 is fixed to the bottom inner wall for centralized heat management.

[0055] like Figure 7 As shown, in this embodiment, the spacing between the multiple cooling pipes 2 is 3mm, and a cable discharge trough is formed between the multiple cooling pipes 2.

[0056] like Figures 4-10 As shown, in this embodiment, the active heat dissipation mechanism 3 includes an active heat dissipation box 31, which is fixedly installed on the bottom inner wall of the top groove cover 4. A conical heat conduction groove 32 is provided inside the active heat dissipation box 31. The larger end of the conical heat conduction groove 32 faces down and the smaller end faces up. A rectangular hole 321 is opened at the top of the conical heat conduction groove 32. A piezoelectric film power generation sheet 35 is attached to the top of the rectangular hole 321. A conductive wire 351 is connected to the piezoelectric film power generation sheet 35, and a battery module 352 is connected to the conductive wire 351. The conical heat conduction groove 32, with its larger end facing down and the smaller end facing up, facilitates heat collection and conduction to the position of the piezoelectric film power generation sheet 35. The battery module 352 includes a battery and an intelligent control chip. The piezoelectric film power generation sheet 35 generates electricity and conducts it to the battery.

[0057] Specifically, the active heat sink 31 houses the heat dissipation components and serves as the thermal management hub. It includes a fixed conical heat conduction channel 32, dual-row cooling fans 33, and a thermoelectric cooler 34. The internal design ensures concentrated heat conduction.

[0058] Conical heat-conducting groove 32: efficiently collects and conducts heat from the cable to the piezoelectric film generator 35. The larger end faces downward to collect the rising hot airflow within the groove frame, while the smaller end faces upward to conduct the heat to the piezoelectric film generator 35 through the rectangular hole 321. The conical design amplifies the thermal gradient.

[0059] The piezoelectric film generator 35 and battery module 352 convert thermal energy into electrical energy to power the system. Heat causes the piezoelectric film to deform and generate electricity, which is stored in the battery module 352 (containing a battery and a smart control chip) via conductive wire 351. The generated signal triggers the cooling system to start.

[0060] like Figure 9 As shown, in this embodiment, a triangular block 331 is fixedly installed at the bottom of the active heat dissipation box 31, and a double-row cooling fan 33 is installed on the inclined surface of the triangular block 331. The double-row cooling fan 33 is inclined downwards and is used to blow air forwards at an inclined angle onto the cable.

[0061] Specifically, the dual-row cooling fan 33 forces airflow for cooling, improving heat dissipation. It is installed on the sloping surface of the triangular block 331, blowing air downwards at an angle, covering the cable surface with airflow (the sloping design covers 30% more area than vertical airflow), and works in conjunction with the rectangular air intake 12 to introduce external cool air.

[0062] like Figures 4-11 As shown, in this embodiment, a semiconductor cooler 34 is embedded in the bottom of the active heat dissipation box 31. The cooling surface of the semiconductor cooler 34 is located behind the dual-row cooling fan 33, and the heat dissipation surface of the semiconductor cooler 34 is located inside the active heat dissipation box 31. A heat conduction box 36 is provided inside the active heat dissipation box 31. The heat dissipation surface of the semiconductor cooler 34 is located inside the heat conduction box 36. A heat conduction pipe 361 is connected to the heat conduction box 36. The outer end of the heat conduction pipe 361 extends into the interior of the conical heat conduction groove 32. The outer end of the heat conduction pipe 361 is provided with a fitting inclined surface 362, which fits against the inclined surface of the conical heat conduction groove 32.

[0063] Specifically, the semiconductor cooler 34 and the heat conduction system provide active cooling and heat recovery. The semiconductor cooler 34 is embedded in the heat sink, with the cooling surface located behind the fan to cool the airflow. Heat from the cooling surface is transferred to the heat conduction box 36 and then returned to the conical heat conduction groove 32 via the heat conduction pipe 361 (the inclined surface 362 ensures close contact). This forms an energy closed loop, reducing heat loss.

[0064] like Figure 13 , Figure 14 As shown, in this embodiment, the sealing baffle structure 5 includes a sealing baffle 51. The two sides of the sealing baffle 51 are slidably connected to the inner walls of the two slide rails 6. A fixing plate 52 is fixedly installed on the top of the sealing baffle 51. An armature 53 is fixedly installed on the top of the fixing plate 52. A rectangular plate 371 is fixedly installed on the side of the active heat dissipation box 31. An electromagnet 37 is fixedly installed on the bottom of the rectangular plate 371. The electromagnet 37 cooperates with the armature 53.

[0065] Specifically, the sealing baffle structure 5 intelligently controls the opening and closing of the air inlet to achieve energy-saving sealing. It includes a sealing baffle 51, a fixing plate 52, and an armature 53. The baffle is slidably connected to the slide rail 6; when the temperature is high, the electromagnet 37 is energized to attract the armature 53, lifting the baffle to open the rectangular air inlet 12; when the temperature is low, the power is cut off, and the baffle resets and seals under the action of gravity.

[0066] Electromagnet 37 and armature 53: Respond to temperature signals to drive the baffle movement. Electromagnet 37 is fixed on the rectangular plate 371 of the active heat dissipation box 31 and is powered by the battery module 352. It works in conjunction with the piezoelectric film generator 35 to achieve sensorless temperature control.

[0067] In this embodiment, several active heat dissipation mechanisms 3 are provided inside the entire cable tray, and several rectangular air inlets 12, sealing baffle structures 5, etc. are provided on the cable tray 1.

[0068] Operating Procedure: In use, the cable tray frame 1 is connected to the top cover 4 by the cooperation of two protruding edges 11 and two folded grooves 41. The whole assembly is then installed, and the cable is inserted into the cable tray frame 1. Multiple cooling pipes 2 are provided to support the cable. First, heat is absorbed by the phase change material 21 inside the cooling pipes 2. Second, a cable discharge groove is formed between the multiple cooling pipes 2 to avoid cross-discharge of cables. The heat generated by the cable is energized and enters through the conical heat conduction groove 32, and then exits through the rectangular hole 321. The conical shape of the conical heat conduction groove 32, with the large end facing down and the small end facing up, facilitates heat collection and conduction to the position of the piezoelectric film generator 35. The piezoelectric film generator 35 deforms and converts heat energy into electrical energy and stores it in the battery module 352. At the same time, the double-row cooling fan 33, the semiconductor cooler 34, and the electromagnet 37 are energized. The electromagnet 37 generates magnetism to attract the armature 53. The armature 53 drives the sealing baffle 5 through the fixing plate 52. 1. Slide upwards, the sealing baffle 51 moves away from the rectangular air inlet 12, opening the rectangular air inlet 12. When the dual-row cooling fan 33 is working, external air enters the interior of the cable tray 1 through the rectangular air inlet 12. The semiconductor cooler 34 works to cool the interior of the cable tray 1. The airflow enters the cooling surface of the semiconductor cooler 34 and then flows downwards at an angle to cool the cable. Combined with the cooling effect, the active heat dissipation effect is improved. The heat dissipated by the heat dissipation surface of the semiconductor cooler 34 is sent to the conical heat dissipation groove 32 through the heat conduction box 36 and the heat conduction pipe 361. The various active heat dissipation mechanisms 3, the rectangular air inlet 12, the sealing baffle structure 5, etc., work together to intelligently and actively cool the entire system. After the temperature drops, the piezoelectric film generator 35 resets and stops generating electricity. The dual-row cooling fan 33, the semiconductor cooler 34, and the electromagnet 37 stop working. The sealing baffle 51 resets under the action of gravity and seals the rectangular air inlet 12.

[0069] Specifically, in the passive stage: the cable heats up → the phase change material of the cooling pipe 2 absorbs heat → the heat is conducted to the conical heat conduction groove 32 → the piezoelectric film generator 35 deforms to generate electricity.

[0070] Active phase: The power generation signal starts the battery module 352 → the electromagnet 37 is energized and opens the baffle → the dual-row cooling fan 33 and the semiconductor cooler 34 work → the external airflow enters through the rectangular air inlet 12, is cooled and then blown towards the cable.

[0071] Reset phase: Temperature decreases → Piezoelectric diaphragm resets and stops generating electricity → System power off → Baffle blocks air inlet by gravity, semiconductor cooler stops.

[0072] Example 2

[0073] This embodiment is a further optimization based on Embodiment 1. The parts that are the same as those in the aforementioned technical solution will not be repeated here. Furthermore, in order to better realize the present invention, the following setting method is adopted: In this embodiment, a temperature sensor is provided at the bottom of the active heat dissipation box 31. The temperature sensor is located inside the cable tray 1 and connected to the intelligent control chip. The temperature sensor detects the temperature inside the cable tray 1.

[0074] Specifically, the battery module 352 is connected to an external power source to provide electrical energy. When the generated electricity is insufficient to achieve a cooling effect, and the temperature sensor still detects that the temperature is too high, it provides an active and continuous cooling function.

[0075] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A smart cable bridge with active heat dissipation function, characterized in that: The cable tray (1) is provided with a plurality of cooling pipes (2) fixedly arranged on the inner wall of the bottom of the cable tray (1), the interiors of the plurality of cooling pipes (2) are filled with phase change materials (21), the phase change materials (21) are acetone and Al2O3 nanoparticles, a rectangular air inlet hole (12) is formed in the side of the cable tray (1), two slide rails (6) are fixedly installed on the side wall of the cable tray (1) and located on the two sides of the rectangular air inlet hole (12); a top groove cover (4) is installed on the top of the cable tray (1); an active heat dissipation mechanism (3) is installed on the bottom inner wall of the top groove cover (4) and located in the interior of the cable tray (1); a sealing baffle structure (5) is matched with the two slide rails (6) and located at the position of the rectangular air inlet hole (12).

2. The intelligent cable bridge with active heat dissipation function according to claim 1, wherein: the top of the cable tray (1) is provided with two convex edges (11) on both sides, the bottom side of the two sides of the top groove cover (4) is provided with two folded edge grooves (41), and the two convex edges (11) are matched with the two folded edge grooves (41).

3. The intelligent cable bridge with active heat dissipation function according to claim 1, wherein: the reserved spacing between the plurality of cooling pipes (2) is 3 mm, and the plurality of cooling pipes (2) form cable discharge grooves.

4. The intelligent cable bridge with active heat dissipation function according to claim 3, wherein: the active heat dissipation mechanism (3) comprises an active heat dissipation box (31) fixedly installed on the bottom inner wall of the top groove cover (4), a conical heat conduction groove (32) is arranged in the active heat dissipation box (31), the large end of the conical heat conduction groove (32) faces downward, the small end faces upward, a rectangular hole (321) is formed in the top of the conical heat conduction groove (32), a piezoelectric film power generation sheet (35) is attached to the top of the rectangular hole (321), a conductive wire (351) is connected to the piezoelectric film power generation sheet (35), and a battery module (352) is connected to the conductive wire (351).

5. The intelligent cable bridge with active heat dissipation function according to claim 4, wherein: the battery module (352) comprises a battery and an intelligent control chip.

6. The intelligent cable bridge with active heat dissipation function according to claim 4, wherein: a triangular block (331) is fixedly installed at the bottom of the active heat dissipation box (31), a double-row heat dissipation fan (33) is installed on the inclined surface of the triangular block (331), and the double-row heat dissipation fan (33) is arranged to be inclined downward.

7. The intelligent cable bridge with active heat dissipation function according to claim 4, wherein: a semiconductor refrigerator (34) is embedded in the bottom of the active heat dissipation box (31), the refrigeration surface of the semiconductor refrigerator (34) is located at the rear side of the double-row heat dissipation fan (33), and the heat dissipation surface of the semiconductor refrigerator (34) is located at the inner side of the active heat dissipation box (31).

8. The intelligent cable bridge with active heat dissipation function according to claim 4, wherein: ​ The active heat dissipation box (31) is internally provided with a heat conduction box (36), the heat dissipation surface of the semiconductor refrigerator (34) is located inside the heat conduction box (36), the heat conduction box (36) is communicated with a heat conduction pipe (361), and the outer end of the heat conduction pipe (361) extends to the inside of the conical heat conduction groove (32).

9. The intelligent cable bridge with active heat dissipation function according to claim 8, characterized in that: The outer end of the heat conduction pipe (361) is provided with a fitting inclined surface (362), and the fitting inclined surface (362) is fitted with the inclined surface of the conical heat conduction groove (32).

10. The intelligent cable bridge with active heat dissipation function according to claim 4, characterized in that: The sealing baffle structure (5) comprises a sealing baffle (51), the two sides of the sealing baffle (51) are slidably connected with the inner walls of the two slide rails (6), the top of the sealing baffle (51) is fixedly installed with a fixed sheet (52), the top of the fixed sheet (52) is fixedly installed with an armature (53), the side of the active heat dissipation box (31) is fixedly installed with a rectangular sheet (371), the bottom of the rectangular sheet (371) is fixedly installed with an electromagnet (37), and the electromagnet (37) is matched with the armature (53).

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