Immersion type shell for data center server rack

Abstract

The present invention relates to an immersion enclosure for a liquid-cooled device of a data center server rack, the immersion enclosure comprising a plurality of electronic components, some of the plurality of electronic components, referred to as heat-generating components, generating heat in use, the immersion enclosure comprising: a housing provided with a bottom and longitudinal walls, the housing defines an internal volume (V); the present invention relates to an immersion housing (100) comprising a housing (100) having an internal volume, and at least one heat-generating component arranged in the internal volume of the housing, the immersion housing further comprising a heat-transfer liquid wherein the heat-generating component is at least partially immersed in the heat-transfer liquid, the immersion housing comprising at least one acoustic generator (200), referred to as a vibrating element, the at least one sound wave generator is configured to generate a vibration field of the heat transfer liquid in an internal volume of the housing, referred to as a vibration area.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to European Patent Application No. 24306319, filed on August 2, 2024, entitled “IMMERSION CASE FOR DATACENTERSERVER RACK”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This technology relates to data center server rack cooling. Background Technology

[0004] Data centers are configured to house multiple server racks, which contain electronic equipment such as computer systems (e.g., server components), memory modules, etc., to process massive amounts of data in near real-time. During operation, the electronic equipment in the server racks generates a significant amount of heat, which must be dissipated to ensure the continuous and efficient operation of the electronic equipment. To address this heat generation issue, numerous cooling solutions have been implemented, including liquid cooling of heat-generating components by directly mounting liquid cooling blocks (often called liquid blocks or water block units) onto specific heat-generating parts.

[0005] While water-cooled blocks are highly efficient at cooling heat-generating components, implementing them in server racks typically requires a liquid distribution infrastructure to serve multiple server racks and the large number of electronic devices they house. Such liquid distribution infrastructure often necessitates relatively large and / or heavy piping configurations and high-capacity pumps to maintain the necessary fluid flow to supply water to the water-cooled blocks and meet the cooling needs of the numerous heat-generating components. It's important to understand that the cost of using such piping configurations and large pumps can be prohibitive in terms of initial investment and operating costs for data centers. These piping configurations and large pumps themselves occupy significant space, which can reduce productivity (e.g., the number of servers per unit area of ​​the data center floor).

[0006] Therefore, it is desirable to provide a liquid cooling device for data center server racks that can alleviate at least some of the problems associated with the high cost of traditional piping configurations and / or improve the efficiency of cooling solutions.

[0007] It is important to note that the topics discussed in the background section should not be assumed to be prior art simply because they are mentioned there. Similarly, the problems mentioned in the background section should not be interpreted as having been recognized by the prior art. Summary of the Invention

[0008] According to one aspect of the present technology, an immersion enclosure for a liquid-cooled device for a data center server rack is provided. The immersion enclosure includes a plurality of electronic components, some of which generate heat during use, and some of which are referred to as heat-generating components. The immersion enclosure includes: a housing having a bottom and longitudinal walls defining an internal volume; and at least one heat-generating component disposed within the internal volume of the housing. The immersion enclosure also includes a heat transfer liquid, wherein the heat-generating component is at least partially immersed in the heat transfer liquid. The immersion enclosure includes at least one acoustic wave generator, referred to as a vibrating element, configured to generate a vibration field of the heat transfer liquid within the internal volume of the housing, the internal volume being referred to as a vibration region.

[0009] Due to the vibration of the elements, the flow of the heat transfer fluid is locally altered, which helps to reduce the boundary layer and / or increase local turbulence in the fluid flow, thereby enhancing heat exchange between the heat transfer fluid and the heat-generating components, thus optimizing the efficiency of the immersion enclosure.

[0010] In some embodiments, the frequency of the vibrating element is between 30 Hz and 500 Hz, advantageously between 150 Hz and 300 Hz; and / or the frequency of the vibrating element is between 20 kHz and 50 kHz, advantageously 25 kHz; and / or the frequency of the vibrating element is between 0.8 MHz and 1.2 MHz, advantageously 1 MHz; and / or the frequency of the vibrating element is between 1.3 MHz and 1.7 MHz, advantageously 1.5 MHz; and / or the frequency of the vibrating element is between 1.8 MHz and 2.2 MHz, advantageously 2 MHz.

[0011] In some implementations, the vibrating element is arranged at the bottom of the housing or on the longitudinal wall of the housing.

[0012] In some embodiments, the vibrating element is configured such that the generated field has a principal direction that forms an angle between 0° and 90° with the longitudinal axis of the housing.

[0013] In some embodiments, the immersion housing includes at least a first vibrating element and a second vibrating element.

[0014] In some embodiments, the first vibrating element and the second vibrating element are configured such that the frequency of the first vibrating element is different from the frequency of the second vibrating element.

[0015] In some embodiments, the first vibrating element and the second vibrating element are configured such that the field generated by the first vibrating element presents a principal direction that forms a non-zero angle with the principal direction of the field generated by the second vibrating element.

[0016] In some implementations, the principal direction of the field generated by the first vibrating element is perpendicular to the principal direction of the field generated by the second vibrating element.

[0017] In some implementations, the acoustic power of the sound wave generator is between 50W and 200W, and advantageously, the acoustic power of the sound wave generator is 100W.

[0018] In some embodiments, the vibration zone includes at least a portion of at least one heating element, and / or the cooling coil of the immersion housing, and / or the water block of the immersion housing.

[0019] This disclosure also relates to a liquid-cooled apparatus for data center server racks, the liquid-cooled apparatus comprising:

[0020] A liquid cooling circuit configured to deliver cooling liquid;

[0021] Multiple server clusters, each of the multiple server clusters including multiple server components, each of the multiple server components including at least one liquid cooling unit, the at least one liquid cooling unit being configured to collect at least a portion of the heat energy generated by heat-generating components;

[0022] At least one heat exchanger, said at least one heat exchanger being fluidly connected to the liquid cooling units of a plurality of server clusters via a liquid cooling loop; and

[0023] A pump, fluidly connected to a heat exchanger via a liquid cooling circuit, is configured to deliver cooling liquid from the liquid cooling circuit.

[0024] The liquid-cooled device includes at least one immersion housing according to the preceding claims.

[0025] In some implementations, at least one switch is located on the back door of the rack hosting the server cluster.

[0026] In some implementations, at least one heat exchanger is configured to cool the airflow using a cooling liquid circulating in the heat exchange zone.

[0027] Each implementation of this technology possesses at least one of the aforementioned objectives and / or aspects, but not necessarily all of them. It should be understood that some aspects of this technology arising to achieve the aforementioned objectives may not satisfy those objectives, and / or may satisfy other objectives not specifically listed herein.

[0028] Additional and / or alternative features, aspects and advantages of the implementation of this technology will become apparent from the following description, the accompanying drawings and the appended claims. Attached Figure Description

[0029] To better understand this technology and its other aspects and further features, please refer to the following description taken in conjunction with the accompanying drawings, wherein:

[0030] Figure 1 A functional block diagram of a serialized liquid-cooled apparatus for a data center server rack according to some non-limiting embodiments of the present disclosure is shown.

[0031] Figure 2 The illustration shows a device equipped with multiple vibrating elements according to some non-limiting embodiments of the present disclosure. Figure 1 The immersion status of the device. Detailed Implementation

[0032] This disclosure presents various embodiments of a vibrating element for cooling heat-generating electronic components.

[0033] The examples and conditions described herein are primarily intended to aid the reader's understanding of the principles of this technology, rather than limiting its scope to the specific examples and conditions described herein. It will be understood that those skilled in the art can devise various arrangements that, while not explicitly described or shown herein, still embody the principles of this technology.

[0034] Furthermore, to aid understanding, the following description may depict a relatively simplified implementation of this technology. Those skilled in the art will understand that various implementations of this technology may involve greater complexity.

[0035] In some cases, examples that are considered helpful to modifications of the present technology may also be illustrated. This is done merely to aid understanding and is not intended to limit the scope of the present technology or to define its boundaries. These modifications are not exhaustive, and those skilled in the art can make other modifications while still remaining within the scope of the present technology. Furthermore, the absence of examples illustrating modifications should not be construed as impossibility of modification or as the description being the only way to implement that element of the present technology.

[0036] Furthermore, all statements herein describing the principles, aspects, and implementations of the technology, and specific examples thereof, are intended to cover both their structural and functional equivalents, whether they are currently known or will be developed in the future. Therefore, for example, those skilled in the art should understand that any block diagram herein represents a conceptual diagram of an exemplary system embodying the principles of the technology.

[0037] With this foundational knowledge in mind, we will now consider some non-limiting examples to illustrate the implementation of various inventive aspects of this disclosure.

[0038] Specifically, Figure 1 A functional block diagram of a server rack serialized liquid-cooled device 100 according to an embodiment of the present disclosure is depicted. As shown, the liquid-cooled device 100 includes a plurality of server clusters 110, 112...11M, which are connected in series in a fluid manner via a server rack liquid cooling circuit 150. The server rack liquid cooling circuit 150 is configured to deliver and facilitate the flow of coolant throughout the electronics of the server rack, and may be made of flexible materials (e.g., rubber, plastic, etc.), rigid materials (e.g., metal, PVC pipes, etc.), or any combination thereof. It is understood that the delivered liquid may include water, alcohol, or any suitable liquid capable of maintaining a sufficient cooling temperature.

[0039] Each of the server clusters 110, 112...11M includes multiple server components 110A-110N, 112A-112N...11MA-11MN arranged in parallel and / or serial manner. As described above, the server components 110A-110N, 112A-112N...11MA-11MN contain heat-generating electronic components.

[0040] Therefore, each of the parallel server components 110A-110N, 112A-112N...11MA-11MN includes at least one corresponding liquid cooling unit 110A1-110N1, 112A1-112N1...11MA1-11MN1, which are arranged in parallel or series for direct thermal contact liquid cooling of the heat-generating electronic components. That is, each of the liquid cooling units 110A1-110N1, 112A1-112N1...11MA1-11MN1 is configured as a liquid cooling heat dissipation conduit block, which is directly or indirectly thermally coupled to the heat-generating electronic components, such that the cooling liquid circulates through the internal liquid conduits of the liquid cooling units 110A1-110N1, 112A1-112N1...11MA1-11MN1 to absorb heat from the heat-generating electronic components and discharge the heated liquid.

[0041] Heat-generating components include, for example, the graphics processing unit (GPU) and / or the central processing unit (CPU). Other components include, for example, random access memory (RAM), hard disk drives, etc.

[0042] For example, each of the server clusters 110, 112...11M may include a first manifold that receives coolant during use and delivers the coolant to multiple liquid cooling units connected in parallel within the server cluster. A second manifold may be located downstream of the multiple liquid cooling units to receive coolant from the multiple liquid cooling units.

[0043] The liquid-cooled device 100 also includes at least one air-liquid heat exchanger (ALHEX). Figure 1 There are three air-liquid heat exchangers (ALHEX) 120, 122...12M.

[0044] exist Figure 1 In this design, each of the air-liquid heat exchangers (ALHEX) 120, 122...12M defines an internal fluid conduit that forms part of the cooling circuit 150. Therefore, each of the air-liquid heat exchangers (ALHEX) 120, 122...12M has an inlet and an outlet. During operation, coolant flows into the internal fluid conduit through the inlet and exits from the internal fluid conduit through the outlet.

[0045] exist Figure 1 In this system, the ALHEX 120, 122...12M units of the liquid-cooled unit 100 are fluidly connected in parallel. That is, the internal fluid pipes of the air-liquid heat exchangers (ALHEX) 120, 122...12M of the liquid-cooled unit 100 are fluidly connected in parallel. The ALHEX 120, 122...12M units of the liquid-cooled unit 100 are also fluidly connected to the server clusters 110, 112...11M via the liquid cooling circuit 150. The ALHEX 120, 122...12M are used to adequately air-cool the heated liquid received by the liquid cooling units 110A1-110N1, 112A1-112N1...11MA1-11MN1, so that it can be redirected back to the server clusters 110, 112...11M. The ALHEX 120, 122...12M can be configured in any suitable way to reduce the liquid temperature by supplying airflow, such as internal cooling coils, heat dissipation airflow fins, etc. The ALHEX 120, 122...12M can be installed, for example but not limited to, on the rear door of a rack hosting server clusters 110, 112...11M.

[0046] The liquid-cooled unit 100 also includes at least one pump 130 fluidly connected to the server rack liquid cooling circuit 150. The pump 130 is configured to receive coolant from ALHEX 120, 122...12M via the server rack liquid cooling circuit 150, and the pump 130 is used to force the necessary circulation flow of coolant through the server rack liquid cooling circuit 150 to service the liquid cooling units 110A1-110N1, 112A1-112N1...11MA1-11MN1 of the server cluster 110, 112...11M.

[0047] This disclosure is not limited to Figure 1 Configuration. For example, ALHEX 120, 122...12M heat exchangers can each be dedicated to their respective server clusters, rather than running in parallel with each other, and / or some server clusters can be serialized while others can be connected in parallel with each other.

[0048] Furthermore, it should be noted that ALHEX 120, 122…12M can play other roles in loop 150. Preferably, the cooling fluid flowing inside ALHEX 120, 122…12M is used to cool the airflow over the rack. Figure 1 In this process, the liquid in ALHEX 120, 122...12M is cooled by airflow.

[0049] The liquid-cooled device 100 is preferably equipped with an immersion housing that enhances the removal of heat generated by the heating element. Figure 2 The immersion housing is shown in detail in the figure, labeled 160.

[0050] from Figure 2 As can be seen, the immersion housing 160 includes a housing 162. The housing 162 includes a bottom 164 and a longitudinal wall 166 extending from the bottom 162 to the opening 168. The housing 162 may be, for example, cylindrical or parallelepiped in shape. The longitudinal axis A of the housing 162 is perpendicular to the bottom 164. The bottom 164 and the longitudinal wall 166 define the internal volume V of the immersion housing 160.

[0051] The immersion housing 160 includes at least one heating element. Figure 2 In this immersion enclosure 160, a motherboard 170 and a hard drive 172 are included. The immersion enclosure 160 also includes a cooling coil 174, preferably made of copper, whose serpentine shape increases heat transfer.

[0052] If from Figure 2 As can be seen, the cooling unit is located inside the immersion housing 160, and the cooling unit is referred to as the water block WB.

[0053] from Figure 2 It can be seen that the immersion housing 160 contains a heat transfer liquid L, which at least partially immerses the heating elements 170, 172, or Figure 2 Any heating components not mentioned herein, and coil 174. The heat transfer fluid is a non-conductive (from an electrical point of view) cooling fluid, such as an oil-based dielectric cooling fluid.

[0054] The immersion housing 160 includes at least one element 200 (referred to as a vibrating element) for generating a mechanical vibration field for the heat transfer fluid in the immersion housing 160, which will now be described in detail.

[0055] According to embodiments of this disclosure, the vibration element 200 is a sound wave generator, preferably an ultrasonic generator, such as an ultrasonic transducer.

[0056] This disclosure covers embodiments in which the immersion housing 160 is equipped with only one or more vibration elements 200. The vibration elements 200 may be the same or opposite, and may also be of different types depending on the degree of impact on the flow of the heat transfer fluid.

[0057] exist Figure 2 In this design, the immersion housing 160 is equipped with four vibrating elements 200-1 to 200-4. Each vibrating element 200 is configured to generate a vibration field VF at a given frequency f, which can cause localized changes in the flow of the heat transfer fluid, as will be described in detail later. Each vibration field VF exhibits a principal direction, which corresponds to the main direction of vibration propagation generated by the vibrating element 200. The arrow in the figure indicates this principal direction. The region in which vibration is generated in the heat transfer fluid flow is called the vibration region.

[0058] The vibrating element 200 may be located inside or outside the immersion housing, but in each case, each vibrating element 200 is positioned such that the vibration field VF affects the heat transfer fluid.

[0059] exist Figure 2 In this configuration, the first vibrating element 200-1 is positioned to generate a vibration field VF at the bottom 164 of the housing. Other vibrating elements 200-2, 200-3, and 200-4 are positioned to generate a vibration field VF near the longitudinal wall 166.

[0060] The vibration element can be positioned close to one or more heating components 170, 172 and / or coil 174. Figure 2 In the middle, vibration elements 200-1, 200-2 and 200-4 are close to hard disk drive 172, while vibration element 200-3 is close to water block WB.

[0061] This disclosure is not limited to Figure 2 The configuration shown. The immersion housing 160 may be equipped with fewer than four vibrating elements 200, or conversely, the immersion housing 160 may be equipped with more than one vibrating element 200. Furthermore, the immersion housing 160 may be equipped with more than one vibrating element on the bottom 164, and / or with more or fewer vibrating elements on the longitudinal wall 166. Additionally, in Figure 2 In this context, all principal directions lie on the same plane, but this disclosure also covers configurations where not all principal directions lie on the same plane.

[0062] It should be noted that the frequency of the vibrating element 200 can be between 10 Hz and 5 MHz, for example, between 30 Hz and 500 Hz; advantageously, the frequency of the vibrating element 200 can be between 100 Hz and 300 Hz; advantageously, the frequency of the vibrating element 200 can be between 150 Hz and 300 Hz; advantageously, the frequency of the vibrating element 200 can be between 50 Hz and 200 Hz, and / or between 20 kHz and 50 kHz; advantageously, the frequency of the vibrating element 200 can be 25 kHz; and / or, the vibrating element... The frequency of the vibrating element 200 can be between 0.8 MHz and 1.2 MHz. Advantageously, the frequency of the vibrating element 200 can be 1 MHz, and / or the frequency of the vibrating element 200 can be between 1.3 MHz and 1.7 MHz. Advantageously, the frequency of the vibrating element 200 can be 1.5 MHz, and / or the frequency of the vibrating element 200 can be between 1.8 MHz and 2.2 MHz. Advantageously, the frequency of the vibrating element 200 can be 2 MHz, and the frequency of the vibrating element 200 can be between 1.7 MHz and 2.5 MHz.

[0063] Preferably, the vibrating element 200 is an ultrasonic transducer.

[0064] As is well known, ultrasound is sound with frequencies ranging from 20 kHz to several gigahertz. When the frequency of the ultrasonic transducer 200 is between 20 kHz and 50 kHz (preferably 25 kHz), cavitation occurs, thereby reducing the boundary layer thickness and enhancing heat exchange between the heating elements 170, 172 and / or coil 174 within the immersion housing 160 and the heat transfer fluid. When the frequency of the ultrasonic transducer 200 is between 1.8 MHz and 2.2 MHz (preferably 2 MHz), acoustic flow is generated, thereby increasing local turbulence in the heat transfer fluid flow and enhancing heat exchange within the immersion housing 160. When the frequency of the ultrasonic transducer 200 is between 800 kHz and 1.8 MHz, advantageously between 800 kHz and 1.2 MHz, advantageously 1 MHz, a combination of cavitation and acoustic flow occurs, thereby enhancing heat exchange in the heat exchanger.

[0065] It should be noted that the Reynolds number of the heat transfer fluid can be between 500 and 10,000, preferably between 500 and 800, and more preferably between 900 and 5,000. The higher the Reynolds number, the smaller the influence of the ultrasonic transducer 200 on the fluid flow. Therefore, the Reynolds number of the liquid cooling device is preferably between 500 and 800.

[0066] The ultrasonic power of the ultrasonic transducer 200 ranges from 50W to 200W, with 100W being the most advantageous.

[0067] from Figure 2 It can be seen that the two ultrasonic transducers can be positioned such that the dominant direction of the field of the first transducer 200-1 forms an angle between 0° and 180° with the dominant direction of the field of the second transducer 200-2. The two ultrasonic transducers can be collinear (200-3, 200-4), perpendicular (200-1 and 200-3 or 200-4), or form an acute angle (200-1 and 200-2), depending on the degree of impact on the heat transfer fluid.

[0068] The two ultrasonic transducers may have the same frequency and ultrasonic power, or conversely, the two ultrasonic transducers may have different frequencies and / or ultrasonic powers. For example, the immersion housing 160 may include a first ultrasonic transducer and a second ultrasonic transducer with frequencies below 1 MHz, below 500 kHz, and below 100 kHz, and a third and a fourth ultrasonic transducer with frequencies between 1 MHz and 1.5 MHz or between 1.8 MHz and 2.5 MHz.

[0069] As previously described, by adjusting the number of vibration elements 200, their location, frequency and acoustic power, and relative orientation of the main directions of the vibration elements 200, the boundary layer is reduced and turbulence is increased, resulting in better heat transfer within the immersion housing 160.

[0070] In other words, the efficiency of the immersion housing 160 is improved when equipped with the vibrating element 200, thanks to optimized heat exchange between the heat transfer fluid and the components (e.g., by reducing the boundary layer and / or current). A configuration with multiple vibrating elements further improves heat exchange due to the synergistic effect generated when the vibrating elements have different frequencies and / or are positioned relative to each other. Another advantage is that the immersion housing 160 can be made more compact when heat exchange is optimized.

[0071] Preferably, the heat exchanger is located on the rear door of the rack used to host the server clusters 110, 112...11M, as already explained.

[0072] This disclosure is of particular interest, in that the coolant flowing inside the ALHEX 120, 122...12M can be used to cool the airflow in the rack.

[0073] The present invention is not limited to the embodiments shown. Specifically, the number of acoustic generators, the position of the acoustic generators on the inner or outer surface of the immersion housing, whether the acoustic generators are simply immersed in the dielectric fluid or fixed to any component inside the container, and the Reynolds number of the fluid, all these configurations depend on the desired cooling effect.

[0074] Modifications and improvements to the above-described implementation of this technology will be apparent to those skilled in the art. The above description is intended to be exemplary and not restrictive. Therefore, the scope of this technology is limited only by the scope of the appended claims.

Claims

1. An immersion enclosure for a liquid-cooled device for a data center server rack, the immersion enclosure comprising a plurality of electronic components, some of which generate heat during use, the electronic components being referred to as heat-generating components, the immersion enclosure comprising: A housing having a bottom and longitudinal walls, the housing defining an internal volume (V); The housing also includes at least one heating element disposed within the internal volume of the housing, and the immersion housing further includes a heat transfer fluid, wherein the heating element is at least partially immersed in the heat transfer fluid. The immersion housing includes at least one acoustic generator (200), which is referred to as a vibration element. The at least one acoustic generator is configured to generate a vibration field of the heat transfer liquid in the internal volume of the housing, which is referred to as a vibration region.

2. The immersion housing according to claim 1, wherein, The frequency of the vibrating element (200) is between 30 Hz and 500 Hz, advantageously, the frequency of the vibrating element (200) is between 150 Hz and 300 Hz; and / or the frequency of the vibrating element (200) is between 20 kHz and 50 kHz, advantageously, the frequency of the vibrating element (200) is 25 kHz; and / or the frequency of the vibrating element (200) is between 0.8 MHz and 1.2 MHz, advantageously, the frequency of the vibrating element (200) is 1 MHz; and / or the frequency of the vibrating element (200) is between 1.3 MHz and 1.7 MHz, advantageously, the frequency of the vibrating element (200) is 1.5 MHz; and / or the frequency of the vibrating element (200) is between 1.8 MHz and 2.2 MHz, advantageously, the frequency of the vibrating element (200) is 2 MHz.

3. The immersion housing according to claim 1 or 2, wherein, The vibrating element (200) is arranged at the bottom of the housing or at the longitudinal wall of the housing.

4. The immersion housing according to any one of the preceding claims, wherein, The vibrating element (200) is configured such that the generated field has a principal direction that forms an angle between 0° and 90° with the longitudinal axis of the housing.

5. The immersion housing according to any one of the preceding claims, wherein the immersion housing comprises at least a first vibration element (200-1) and a second vibration element (200-2).

6. The immersion housing according to the preceding claim, wherein, The first vibrating element (200-1) and the second vibrating element (200-2) are configured such that the frequency of the first vibrating element (200-1) is different from the frequency of the second vibrating element (200-2).

7. The immersion housing according to claim 5 or 6, wherein, The first vibrating element (200-1) and the second vibrating element (200-2) are configured such that the field generated by the first vibrating element (200-1) exhibits a principal direction that forms a non-zero angle with the principal direction of the field generated by the second vibrating element (200-2).

8. The immersion housing according to the preceding claim, wherein, The principal direction of the field generated by the first vibrating element (200-1) is perpendicular to the principal direction of the field generated by the second vibrating element (200-2).

9. The immersion housing according to any one of the preceding claims, wherein, The acoustic power of the sound wave generator is between 50W and 200W, and advantageously, the acoustic power of the sound wave generator is 100W.

10. The immersion housing according to any one of the preceding claims, wherein, The vibration zone includes at least a portion of the at least one heating element, and / or the cooling coil of the immersion housing, and / or the water block of the immersion housing.

11. A liquid-cooled device for a data center server rack, the liquid-cooled device comprising: A liquid cooling circuit configured to deliver cooling liquid; Multiple server clusters, each of the multiple server clusters including multiple server components, each of the multiple server components including at least one corresponding liquid cooling unit, at least one of the liquid cooling units being configured to collect at least a portion of the heat energy generated by the heat-generating components; At least one heat exchanger, the at least one heat exchanger being fluidly connected to the liquid cooling unit of the plurality of server clusters via the liquid cooling loop; and Pump (130), fluidly connected to the heat exchanger via the liquid cooling circuit, the pump being configured to deliver cooling liquid in the liquid cooling circuit. The liquid-cooled device includes at least one immersion housing as described in the preceding claims.

12. The liquid cooling device according to claim 11, wherein, The at least one switch is located on the back door of the rack that hosts the server cluster.

13. The liquid cooling device according to claim 11 or 12, wherein, The at least one heat exchanger is configured to cool the airflow using a cooling liquid circulating in the heat exchange zone.

Images