Ultrahigh-density server case system based on liquid cooling heat dissipation

Abstract

The invention discloses an ultrahigh-density server case system based on liquid cooling heat dissipation, and relates to the technical field of server cases. A track mounting piece is fixedly arranged on the inner wall of the mainframe box, the track mounting piece is specifically composed of a track fixedly mounted on the inner wall of the mainframe box and a supporting plate mounted on the track, absolute parallelism of an optical transmission interface is ensured through a magnetic force self-adaptive attaching technology, a high-speed and wear-free free space optical path is established, and the optical transmission interface is more stable. The cold plate and the chip can be actively pressed, tight heat conduction is achieved, the flow of cooling liquid is dynamically adjusted according to the real-time load and temperature, accurate on-demand heat dissipation is achieved, the cold plate can be automatically separated from the chip, operation safety is guaranteed, standby energy consumption of a system is effectively reduced, and therefore the operation and maintenance efficiency, reliability and the energy efficiency level of the data center are overall improved.

Description

Technical Field

[0001] This invention relates to the field of server chassis technology, specifically an ultra-high density server chassis system based on liquid cooling. Background Technology

[0002] With the explosive growth in demand for cloud computing, artificial intelligence, and high-performance computing, data centers are developing towards ultra-high density and ultra-large scale. However, traditional server architectures face three core bottlenecks in the process of increasing computing density: heat dissipation efficiency, energy consumption, and interconnect bandwidth. In terms of heat dissipation, traditional air cooling has approached its physical limits, while existing liquid cooling technology is more efficient, but its complex piping connection and maintenance process is cumbersome, making it difficult to achieve fast and non-destructive hot-swapping, which seriously restricts the efficiency of operation and maintenance. In terms of electrical interconnection, wired connections that rely on physical connectors not only become a bottleneck for data transmission rates, but their mechanical wear also affects the reliability of long-term connections. Furthermore, a large number of cables occupy valuable space, hindering further increases in device density. In addition, fixed heat dissipation structures cannot be dynamically adjusted according to the actual heat generated by the chip, resulting in a significant waste of cooling energy under low load. Summary of the Invention

[0003] Therefore, in order to overcome the above-mentioned shortcomings, the present invention provides an ultra-high density server chassis system based on liquid cooling.

[0004] This invention is implemented as follows: a liquid-cooled ultra-high-density server chassis system is constructed, the device including a main chassis; a rail mounting component is fixedly installed on the inner wall of the main chassis, and the rail mounting component specifically consists of a rail fixedly installed on the inner wall of the main chassis and a support plate installed on the rail; the server chassis is fixedly installed on the support plate of the rail mounting component; a control system is fixedly installed on the main chassis cabinet door by bolts; The inner wall of the main unit chassis is fixedly installed with bolts, and the inner wall of the main unit chassis is covered with connecting pipes for liquid cooling; the side of the server chassis is fixedly installed with a liquid cooling assembly with bolts, and the side connecting pipes of the liquid cooling assembly are fixedly installed with a flow guiding assembly; the side of the liquid cooling assembly is fitted with a fixed transmission component that has the function of data transmission. The movable transmission component includes a fixed base plate that is bolted to the inner wall of the main unit chassis; an adjustment component is movably mounted on the side of the fixed base plate, and the adjustment component is specifically composed of a universal ball joint and a compression spring; a floating base plate is fixedly mounted on the side of the universal ball joint of the adjustment component; a coil array is fixedly mounted on the square groove on the inner side of the floating base plate, and an array of photoelectric transmitters with data transmission function is fixedly mounted on the inner wall of the coil array; a tapered guide groove is formed on the side of the floating base plate.

[0005] Preferably, the liquid cooling assembly includes a fixed cold plate that is bolted to the side of the server chassis; an array of flexible heat exchange tubes is laid on the side of the fixed cold plate; the side of the flexible heat exchange tubes is fixedly connected to the internal flow channel of the displacement cold plate; and the displacement cold plate is slidably disposed inside the limiting frame.

[0006] Preferably, the side of the displacement cold plate and the fixed cold plate are connected by a heat insulation cylinder, and the heat insulation cylinder is provided with an electromagnetic spring with a reset function; the side of the displacement cold plate is arrayed with micro needle fins with heat conduction function.

[0007] Preferably, the fixed transmission component includes a heat-insulating substrate fixedly installed on the side of the fixed cold plate; an annular permanent magnet is fixedly disposed on the inner frame wall of the heat-insulating substrate, and a lens array is fixedly disposed inside the annular permanent magnet; and a guide post is inserted and fixedly installed on the side of the heat-insulating substrate.

[0008] Preferably, the flow guiding assembly includes a quick connector that is plugged into and fixed to a connecting pipe on the inner wall of the main unit housing; the quick connector is fixedly disposed at the inlet and outlet of the U-shaped pipe, and the U-shaped pipe is fixedly disposed inside the protective housing.

[0009] Preferably, a sensor with data acquisition function is inserted and fixed on the top side of the U-shaped tube; photoelectric sensors with data acquisition function are provided on both sides inside the protective housing.

[0010] Preferably, the displacement cold plate slides within the limiting frame by energizing and de-energizing the electromagnetic spring, thereby controlling the contact or separation of the micro-needle fins from the electrical components inside the server chassis.

[0011] Preferably, the tapered guide groove of the movable transmission component cooperates with the guide post of the fixed transmission component to guide the floating base plate to achieve initial positioning and alignment with the fixed transmission component when the server chassis is pushed into the host chassis.

[0012] Preferably, the flexible heat exchange tube is interconnected with the flow channel inside the displacement cold plate to form a closed liquid cooling circulation loop.

[0013] Preferably, the quick connector of the flow guide assembly is connected to the connecting pipe circulation loop on the inner wall of the main unit; the sensor is used to monitor the temperature and / or pressure data of the coolant flowing through the loop in real time and transmit the data to the control system.

[0014] The present invention has the following advantages: The present invention provides an ultra-high-density server chassis system based on liquid cooling, which has the following improvements compared to similar devices: The present invention discloses an ultra-high-density server chassis system based on liquid cooling. Through magnetic adaptive bonding technology, it ensures the absolute parallelism of the optical transmission interface, establishes a high-speed, wear-free free-space optical path, actively presses the cold plate and chip together to achieve tight heat conduction, and dynamically adjusts the coolant flow rate according to real-time load and temperature to achieve precise on-demand heat dissipation. The cold plate can automatically separate from the chip, which not only ensures operational safety but also effectively reduces system standby power consumption, thereby improving the overall operation and maintenance efficiency, reliability, and energy efficiency of the data center. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the isometric structure of the server chassis and moving transmission components of the present invention; Figure 3 This is a schematic diagram of the structure of the active transmission component of the present invention; Figure 4 This is a schematic diagram of the server chassis, flow guiding component, and fixed transmission component of the present invention; Figure 5 This is a schematic diagram of the server chassis and liquid cooling assembly from the left side of the axis of view of the present invention; Figure 6 This is an exploded structural diagram of the liquid cooling component of the present invention; Figure 7 This is an exploded structural diagram of the flow guiding component of the present invention; Figure 8 This is the invention Figure 4 Enlarged structural diagram at point A in the middle.

[0016] The components include: main unit chassis-1, track mounting component-2, server chassis-3, control system-4, movable transmission component-5, liquid cooling assembly-6, flow guiding assembly-7, fixed transmission component-8, floating base plate-51, coil array-52, photoelectric transmitter array-53, tapered guide groove-54, adjustment component-55, fixed base plate-56, fixed cold plate-61, flexible heat exchange tube-62, displacement cold plate-63, limiting frame-64, heat insulation cylinder-65, electromagnetic spring-66, micro needle fin-67, quick connector-71, loop tube-72, protective shell-73, sensor-74, photoelectric sensor-75, heat insulation base plate-81, ring permanent magnet-82, lens array-83, and guide post-84. Detailed Implementation

[0017] The following is in conjunction with the appendix Figures 1-8The principles and features of the present invention are described below. The examples given are for illustrative purposes only and are not intended to limit the scope of the invention. The invention is described more specifically in the following paragraphs by way of example with reference to the accompanying drawings. It should be noted that the drawings are in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the invention.

[0018] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0019] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. The embodiments of this invention will now be described according to its overall structure.

[0020] Example 1:

[0021] Please see Figures 1-8 This invention discloses an ultra-high-density server chassis system based on liquid cooling, comprising a main chassis 1; a track mounting component 2 is fixedly disposed on the inner wall of the main chassis 1, and the track mounting component 2 specifically consists of a track fixedly disposed on the inner wall of the main chassis 1 and a support plate disposed on the track; a server chassis 3 is fixedly disposed on the support plate of the track mounting component 2; a control system 4 is fixedly disposed on the door of the main chassis 1 by bolts; a movable transmission component 5 is fixedly disposed on the inner wall of the main chassis 1 by bolts, and a connecting pipe for liquid cooling is laid on the inner wall of the main chassis 1; a liquid cooling component 6 is fixedly disposed on the side of the server chassis 3 by bolts, and a flow guiding component 7 is fixedly disposed on the connecting pipe on the side of the liquid cooling component 6; a fixed transmission component 8 with data transmission function is fixedly disposed on the side of the liquid cooling component 6.

[0022] The movable transmission component 5 includes a fixed base plate 56 that is bolted to the inner wall of the host chassis 1; an adjusting component 55 is movably mounted on the side of the fixed base plate 56, and the adjusting component 55 is specifically composed of a universal ball joint and a compression spring; a floating base plate 51 is fixedly mounted on the side of the universal ball joint of the adjusting component 55; a coil array 52 is fixedly mounted on the square groove on the inner side of the floating base plate 51, and an optical transmitter array 53 with data transmission function is fixedly mounted on the inner side wall of the coil array 52; a tapered guide groove 54 is provided on the side of the floating base plate 51; the tapered guide groove 54 of the movable transmission component 5 cooperates with the guide post 84 of the fixed transmission component 8 to guide the floating base plate 51 and the fixed transmission component 8 to achieve initial positioning and alignment when the server chassis 3 is pushed into the host chassis 1.

[0023] The liquid cooling assembly 6 includes a fixed cold plate 61 bolted to the side of the server chassis 3; an array of flexible heat exchange tubes 62 are laid on the side of the fixed cold plate 61; the side of the flexible heat exchange tubes 62 is fixedly connected to the internal flow channel of the displacement cold plate 63; the displacement cold plate 63 is slidably disposed inside the limiting frame 64; the side of the displacement cold plate 63 and the fixed cold plate 61 are connected by a heat insulation cylinder 65, and an electromagnetic spring 66 with a reset function is provided inside the heat insulation cylinder 65; micro-needle fins 67 with heat conduction function are arrayed on the side of the displacement cold plate 63; the displacement cold plate 63 slides within the limiting frame 64 by energizing and de-energizing the electromagnetic spring 66, thereby controlling the contact or separation of the micro-needle fins 67 with the electrical components inside the server chassis 3; the flexible heat exchange tubes 62 and the internal flow channel of the displacement cold plate 63 are interconnected to form a closed liquid cooling loop.

[0024] The fixed transmission component 8 includes a heat-insulating substrate 81 fixedly installed on the side of the fixed cold plate 61; an annular permanent magnet 82 is fixedly disposed on the inner frame wall of the heat-insulating substrate 81, and a lens array 83 is fixedly disposed on the inner side of the annular permanent magnet 82; and a guide post 84 is inserted and fixedly installed on the side of the heat-insulating substrate 81.

[0025] Example 2:

[0026] Please see Figures 1-8 The present invention discloses an ultra-high density server chassis system based on liquid cooling. Compared with Embodiment 1, this embodiment further includes: a flow guiding component 7 comprising a quick connector 71 inserted and fixed to a connecting pipe on the inner wall of the main chassis 1; the quick connector 71 is fixedly disposed at the inlet and outlet of a loop pipe 72, and the loop pipe 72 is fixedly disposed inside a protective housing 73; a sensor 74 with data acquisition function is inserted and fixedly disposed on the top side of the loop pipe 72; photoelectric sensors 75 with data acquisition function are disposed on both sides inside the protective housing 73; the quick connector 71 of the flow guiding component 7 is connected to the circulation loop of the connecting pipe on the inner wall of the main chassis 1; the sensor 74 is used to monitor the temperature and / or pressure data of the coolant flowing through the loop pipe 72 in real time and transmit the data to the control system 4.

[0027] The working principle of the above-mentioned ultra-high-density server chassis system based on liquid cooling is as follows: First, when using this device, place it in the work area, and then connect it to an external power source to provide the power required for its operation. Second, the operator pushes the server chassis 3 into the host chassis 1 along the track mounting piece 2. Here, the operator needs to connect and lock the quick connector 71 to the pre-installed liquid cooling pipeline system inside the host chassis 1 to form a closed coolant circulation loop. At the same time, through the guide post 84 of the fixed transmission piece 8 fixed on the liquid cooling component 6, it begins to slide into the conical guide groove 54 of the movable transmission piece 5 fixed on the host chassis 1, completing the primary positioning and correcting the positional deviation between the server node and the host chassis with millimeter-level accuracy. Third, after the server chassis 3 completes its initial positioning, the annular permanent magnet 82 on the fixed transmission component 8 and the coil array 52 on the floating substrate 51 enter the effective magnetic path. By supplying power to the coil array 52, a strong attractive force is generated on the floating substrate 51. Under the action of magnetic force, the floating substrate 51 will overcome the compression spring resistance of the adjustment component 55 and generate adaptive small displacement and deflection, ensuring that its surface is absolutely parallel and in contact with the surface of the fixed transmission component 8. When the coil array 52 and the annular permanent magnet 82 are tightly in contact, the lens array 83 and the photoelectric transmitter array 53 form extremely short and precisely aligned free space optical paths, completing and realizing the simultaneous establishment of high-speed data optical transmission and power supply, without any physical contact points or cable plugging and unplugging throughout the process. Fourth, the control system 4 then powers the electromagnetic spring 66. The thrust generated by the electromagnetic spring 66 pushes the displacement cold plate 63 to slide into the server within the limiting frame 64, causing the microfins 67 on its surface to be tightly pressed onto the main heat-generating components such as the CPU and GPU. This allows the heat from the heat-generating components to pass through the microfins 67, the displacement cold plate 63, the flexible heat exchange tube 62, and the fixed cold plate 61, ultimately entering the flow guide assembly 7 for heat detection. The heat is then carried away by the material pipe on the inner wall of the main unit chassis 1. The sensor 74 monitors the temperature and pressure of the coolant in real time, and the photoelectric sensor 75 may be used to confirm whether the displacement cold plate is in place. Based on this data and the server load, the control system 4 dynamically adjusts the flow rate and velocity of the coolant to achieve precise heat dissipation. When the server needs maintenance or is under extremely low load, the control system 4 can cut off the power to the electromagnetic spring 66. The spring returns to its original position, and the displacement cold plate 63, carrying the microfins 67, separates from the heat-generating components, facilitating safe hot-swapping or reducing system energy consumption.

[0028] This invention provides an improved ultra-high-density server chassis system based on liquid cooling. Through magnetic adaptive bonding technology, it ensures the absolute parallelism of the optical transmission interface, establishes a high-speed, wear-free free-space optical path, actively presses the cold plate and chip together to achieve tight heat conduction, and dynamically adjusts the coolant flow rate according to real-time load and temperature to achieve precise on-demand heat dissipation. The cold plate can automatically separate from the chip, ensuring operational safety and effectively reducing system standby power consumption, thereby improving the overall operation and maintenance efficiency, reliability, and energy efficiency of the data center.

[0029] The above description shows and illustrates the basic principles, main features, and advantages of the present invention. Standard parts used in the present invention can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts, and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.

[0030] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A liquid-cooled ultra-high density server chassis system, comprising a main chassis (1); a rail mounting component (2) is fixedly installed on the inner wall of the main chassis (1), and the rail mounting component (2) specifically consists of a rail fixedly installed on the inner wall of the main chassis (1) and a support plate installed on the rail; a server chassis (3) is fixedly installed on the support plate of the rail mounting component (2); a control system (4) is fixedly installed on the cabinet door of the main chassis (1) by bolts. Its features are: The main unit (1) is fixedly mounted with a movable transmission component (5) by bolts on the inner wall, and the main unit (1) is also covered with a connecting pipe for liquid cooling; the server chassis (3) is fixedly mounted with a liquid cooling component (6) by bolts on the side, and the liquid cooling component (6) is fixedly mounted with a flow guiding component (7) on the side connecting pipe; the liquid cooling component (6) is fixedly mounted with a fixed transmission component (8) that has the function of data transmission on the side. The movable transmission component (5) includes a fixed base plate (56) that is fixedly mounted on the inner wall of the main unit housing (1) by bolts; an adjustment component (55) is movably mounted on the side of the fixed base plate (56), and the adjustment component (55) is specifically composed of a universal ball joint and a compression spring; a floating base plate (51) is fixedly mounted on the side of the universal ball joint of the adjustment component (55); a coil array (52) is fixedly mounted on the square groove inside the floating base plate (51), and an optical transmitter array (53) with data transmission function is fixedly mounted on the inner wall of the coil array (52); a tapered guide groove (54) is opened on the side of the floating base plate (51).

2. The ultra-high density server chassis system based on liquid cooling according to claim 1, characterized in that: The liquid cooling assembly (6) includes a fixed cold plate (61) that is fixedly installed on the side of the server chassis (3) by bolts; the side of the fixed cold plate (61) is covered with an array of flexible heat exchange tubes (62); the side of the flexible heat exchange tubes (62) is fixedly connected to the internal flow channel of the displacement cold plate (63); the displacement cold plate (63) is slidably disposed inside the limiting frame (64).

3. The ultra-high density server chassis system based on liquid cooling according to claim 2, characterized in that: The side of the displacement cold plate (63) and the fixed cold plate (61) are connected by a heat insulation cylinder (65), and an electromagnetic spring (66) with a reset function is provided inside the heat insulation cylinder (65); the side of the displacement cold plate (63) is arrayed with micro needle fins (67) with heat conduction function.

4. The ultra-high density server chassis system based on liquid cooling according to claim 3, characterized in that: The fixed transmission component (8) includes a heat-insulating substrate (81) fixedly installed on the side of the fixed cold plate (61); an annular permanent magnet (82) is fixedly arranged on the inner frame wall of the heat-insulating substrate (81), and a lens array (83) is fixedly arranged on the inner side of the annular permanent magnet (82); a guide post (84) is inserted and fixedly installed on the side of the heat-insulating substrate (81).

5. The ultra-high density server chassis system based on liquid cooling according to claim 4, characterized in that: The flow guiding assembly (7) includes a quick connector (71) that is plugged into and fixed on the connecting pipe on the inner wall of the main unit (1); the quick connector (71) is fixedly installed at the inlet and outlet of the loop pipe (72), and the loop pipe (72) is fixedly installed inside the protective housing (73).

6. The ultra-high density server chassis system based on liquid cooling according to claim 5, characterized in that: A sensor (74) with data acquisition function is inserted and fixed on the top side of the U-shaped tube (72); photoelectric sensors (75) with data acquisition function are provided on both sides inside the protective shell (73).

7. The ultra-high density server chassis system based on liquid cooling according to claim 6, characterized in that: The displacement cold plate (63) slides within the limiting frame (64) by energizing and de-energizing the electromagnetic spring (66), thereby controlling the contact or separation between the micro-needle fin (67) and the electrical components inside the server chassis (3).

8. The ultra-high density server chassis system based on liquid cooling according to claim 7, characterized in that: The tapered guide groove (54) of the movable transmission component (5) cooperates with the guide post (84) of the fixed transmission component (8) to guide the floating base plate (51) and the fixed transmission component (8) to achieve initial positioning and alignment when the server chassis (3) is pushed into the host chassis (1).

9. The ultra-high density server chassis system based on liquid cooling according to claim 8, characterized in that: The flexible heat exchange tube (62) is interconnected with the flow channel inside the displacement cold plate (63), forming a closed liquid cooling loop.

10. The ultra-high density server chassis system based on liquid cooling according to claim 9, characterized in that: The quick connector (71) of the flow guide assembly (7) is connected to the connecting pipe circulation loop on the inner wall of the main unit (1); the sensor (74) is used to monitor the temperature and / or pressure data of the coolant flowing through the loop pipe (72) in real time and transmit the data to the control system (4).

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