Glass encapsulation slurry as well as preparation method and application thereof

By optimizing the glass powder formula and utilizing a glass glaze layer composed of silicon dioxide, boron oxide, alkali metals, and alkaline earth metal oxides, the problems of insufficient corrosion resistance and chemical stability during medium- and low-temperature sintering have been solved, enabling its widespread application in electronic components.

CN121470796APending Publication Date: 2026-02-06QIANYU ELECTRONIC MATERIALS (SHENZHEN) CO LTD
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Patent Information

Application Number
CN202511574668.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-10-31
Publication Date
2026-02-06

AI Technical Summary

Technical Problem

Existing glass glazes have poor corrosion resistance during low- and medium-temperature sintering, which cannot meet the requirements of electroplating for electronic components, and their chemical stability is insufficient.

Method used

A specific glass powder formulation is used, including silica and boron oxide as network forgings, alkali metal oxides as network modifiers, alkaline earth metal oxides as auxiliary network modifiers, zirconium oxide as a stabilizer and cerium oxide as a clarifying agent. By adjusting the glass network structure and composition, the chemical stability and corrosion resistance are improved.

Benefits of technology

A dense glass glaze layer sintered at 600℃ was achieved, which is resistant to corrosion by chemical plating solutions and has high chemical stability, thus expanding its application scope in electronic components.

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Abstract

The invention discloses glass encapsulation slurry and a preparation method and application thereof, and belongs to the technical field of encapsulation slurry, the glass encapsulation slurry comprises the following components by mass: 60-70% of glass powder, 20-25% of a solvent, 6-12% of resin, 0.5-2% of a leveling agent, and 0.5-2% of a dispersant; the glass powder comprises the following components in percentage by mass: 51-66% of silicon oxide, 10-15% of boron oxide, 6-15% of alkaline earth metal oxide, 11-18% of alkali metal oxide, 1-3% of a stabilizer and 1-3% of a clarifying agent; the alkali metal oxide comprises lithium oxide and sodium oxide in a mass ratio of (1-3): (10-15); the alkaline earth metal oxide comprises barium oxide and calcium oxide in a mass ratio of (5-10): (1-5); the stabilizer comprises zirconium oxide; the clarifying agent comprises cerium oxide. The glass encapsulation slurry has a wide use window in the application field of electronic components.
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Description

Technical Field

[0001] This invention relates to the field of encapsulation slurry technology, specifically to a glass encapsulation slurry, its preparation method, and its application. Background Technology

[0002] Glass is commonly used as a protective glaze layer for electronic components. Due to the complexity of the circuits, electronic components have certain requirements for the sintering temperature of glass glaze. Glass glazes sintered at medium and low temperatures (around 600℃) have a wider range of applications.

[0003] Electronic components typically require electroplating to process circuitry, which places demands on the glass enamel layer to resist corrosion from electroplating solutions. Generally, the softening point of glass is positively correlated with the chemical stability of glass powder; the lower the softening point, the worse the corrosion resistance of the glass. Dense glass enamel sintered at 600℃ has a relatively low softening point, and this type of glass generally has poor corrosion resistance.

[0004] Therefore, this application is submitted. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a glass encapsulation slurry, its preparation method and application. The glass encapsulation slurry has the characteristics of medium-temperature sintering and densification, and can resist corrosion by chemical plating solution. It has a low sintering temperature and high chemical stability, which gives the glass glaze a wide application window in the field of electronic components.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A glass encapsulation slurry comprises the following components in weight percentage: 60-70% glass powder, 20-25% solvent, 6-12% resin, 0.5-2% leveling agent, and 0.5-2% dispersant; The glass powder comprises the following components by mass percentage: 51-66% silicon dioxide, 10-15% boron oxide, 6-15% alkaline earth metal oxides, 11-18% alkali metal oxides, 1-3% stabilizer, and 1-3% clarifying agent. The alkali metal oxide comprises lithium oxide and sodium oxide in a mass ratio of (1~3):(10~15); The alkaline earth metal oxide comprises barium oxide and calcium oxide in a mass ratio of (5~10):(1~5); The stabilizer includes zirconium oxide; The clarifying agent includes cerium oxide.

[0007] The glass powder of this invention uses silicon dioxide and boron oxide as the network forging body, and alkali metal oxides (lithium oxide and sodium oxide) as network modifiers. Silicon dioxide serves as the main network forging body, while lithium oxide and sodium oxide are used together as the main network modifiers. The two alkali metals, lithium oxide and sodium oxide, are used in combination to form a "mixed alkali" effect, resulting in significantly higher chemical stability than glass using only a single alkali metal oxide as a network modifier. Alkali earth metal oxides (barium oxide and calcium oxide) serve as auxiliary network modifiers. Calcium oxide and barium oxide, as divalent metal oxides, suppress alkali metals in the glass composition, stabilizing alkali metal ions that are unstable and easily migrate within the glass structure, thus significantly improving the chemical stability of the glass. The molar fraction of boron oxide is close to the molar fraction of free oxygen provided by the metal oxides. The added boron oxide can consume as much of the "free oxygen" provided by the metal oxides as possible, transforming boron trigonal [BO3] into boron-oxygen tetrahedron [BO4] in the glass system, repairing the originally broken network structure, and improving the chemical stability of the glass while ensuring a low softening point. Zirconia, as a stabilizer, is a high-valence, small-ionic-radius network additive with a strong aggregation effect, which can significantly improve the stability of glass. Cerium oxide, as a clarifying agent, helps to remove glass bubbles and promotes the clarity and transparency of the glass glaze. At the same time, cerium oxide can improve the wettability of glass and help the sintering and leveling of the glass glaze. Under the combined action of the raw materials, the glass powder of this invention has the properties of dense sintering at a medium temperature of 600℃ and resistance to corrosion by chemical plating solutions. It also has a low sintering temperature and high chemical stability, giving the glass glaze a wide application window in the field of electronic components.

[0008] As a preferred embodiment of the present invention, it comprises the following components in weight percentage: 55.5~64% silicon dioxide, 12.5~14.5% boron oxide, 7~11% alkaline earth metal oxide, 13~15% alkali metal oxide, 1.5~2% stabilizer, and 1.5~2.5% clarifying agent.

[0009] In a preferred embodiment of the present invention, the alkaline earth metal oxide comprises barium oxide and calcium oxide in a mass ratio of (6~8):(1~3).

[0010] In a preferred embodiment of the present invention, the alkali metal oxide comprises lithium oxide and sodium oxide in a mass ratio of (1~2):(12~13).

[0011] As a preferred embodiment of the present invention, the solvent comprises terpineol and diethylene glycol butyl ether in a mass ratio of (0.5~5):1. Such solvents have excellent compatibility with the glass system of the present invention, effectively improving the flowability and stability of glass powder and further enhancing the chemical plating resistance.

[0012] In a preferred embodiment of the present invention, the solvent comprises terpineol and diethylene glycol butyl ether in a mass ratio of (1.4~2):1.

[0013] In a preferred embodiment of the present invention, the resin comprises a first ethyl cellulose and a second ethyl cellulose in a mass ratio of 1:(0.5~2); The viscosity of a 5% solution of the first ethyl cellulose at 25°C is 18-22 mPa·s, and the solution comprises toluene and isopropanol in a volume ratio of 80:20. The viscosity of a 5% solution of the second ethyl cellulose at 25°C is 180-220 mPa·s, and the solution comprises toluene and isopropanol in a volume ratio of 80:20.

[0014] This invention uses two resins with different viscosities, which can improve the fluidity and thixotropy of the slurry, improve the coating and leveling effect of the slurry, improve the resolution of the encapsulation slurry, and improve the adhesion effect. This helps to improve the mechanical strength of the glass powder after sintering and prevent it from falling off.

[0015] In a preferred embodiment of the present invention, the leveling agent is an acrylate leveling agent; The dispersant is a polyphosphate dispersant.

[0016] This invention also provides a method for preparing a glass encapsulation slurry, comprising the following steps: Silicon oxide, boron oxide, alkaline earth metal oxide, alkali metal oxide, stabilizer, and clarifying agent are mixed evenly and melted at 1100~1300℃ for 1~3h. The molten slurry is then water-quenched, dried, and ball-milled to obtain glass powder. Solvent, resin, leveling agent, and dispersant are mixed evenly to obtain an organic carrier; The organic carrier and glass powder are mixed evenly to obtain the glass encapsulation slurry.

[0017] This invention also provides an application of a glass encapsulation paste in the preparation of electronic components.

[0018] The beneficial effects of this invention are as follows: The glass powder of this invention uses silicon dioxide and boron oxide as the network forging body of the glass, and alkali metal oxides (lithium oxide and sodium oxide) as network modifiers. Silicon dioxide serves as the main network forging body, and alkali metals lithium oxide and sodium oxide are used together as the main network modifiers. The two alkali metals, lithium oxide and sodium oxide, are used in combination to form a "mixed alkali" effect, resulting in significantly higher chemical stability than glass using only a single alkali metal oxide as a network modifier. Alkaline earth metal oxides (barium oxide and calcium oxide) serve as auxiliary network modifiers, with calcium oxide and barium oxide acting as divalent metals. As an oxide, boron oxide suppresses alkali metals in glass composition, stabilizing alkali metal ions that are unstable and prone to migration within the glass structure, thus significantly improving the chemical stability of the glass. The molar fraction of boron oxide is close to the molar fraction of free oxygen provided by the metal oxide, and the added boron oxide can consume as much of the "free oxygen" provided by the metal oxide as possible. In the glass system, boron trigonal [BO3] is transformed into boron-oxygen tetrahedron [BO4], which repairs the originally broken network structure, thereby improving the chemical stability of the glass while ensuring a low softening point. Zirconia, as a stabilizer, is a high-valence, small-ionic-radius network additive with a strong aggregation effect, which can significantly improve the stability of glass. Cerium oxide, as a clarifying agent, helps to remove glass bubbles and promotes the clarity and transparency of the glass glaze. At the same time, cerium oxide can improve the wettability of glass and help the sintering and leveling of the glass glaze. Under the combined action of the raw materials, the glass powder of this invention has the properties of dense sintering at a medium temperature of 600℃ and resistance to corrosion by chemical plating solutions. It also has a low sintering temperature and high chemical stability, giving the glass glaze a wide application window in the field of electronic components. Attached Figure Description

[0019] Figure 1 This is a SEM image of the glass powder from Example 1.

[0020] Figure 2 The image shows the result of the chemical resistance plating test in Example 1.

[0021] Figure 3 The image shows the result of the chemical resistance test in Comparative Example 1. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] In this application, the technical features described in an open-ended manner include both closed technical solutions consisting of the listed features and open technical solutions that include the listed features.

[0024] In this application, numerical ranges are referred to as continuous unless otherwise specified, and include the minimum and maximum values ​​of the range, as well as every value between the minimum and maximum values. Furthermore, when the range refers to integers, it includes every integer between the minimum and maximum values ​​of the range. Additionally, when multiple ranges are provided to describe a feature or characteristic, the ranges may be merged. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all subranges to which they are incorporated.

[0025] In this application, there are no particular restrictions on the specific dispersion and mixing methods.

[0026] Unless otherwise specified, all components, raw materials, or instruments used in the embodiments and comparative examples of this invention are commercially available, and the same type of components and raw materials are used in each parallel experiment.

[0027] Ethylcellulose-1: The viscosity at 25°C is 18~22 mPa·s. The solution comprises toluene and isopropanol in a volume ratio of 80:20. Maclean's reagent, E809017.

[0028] Ethylcellulose-2: The viscosity at 25°C is 180~220 mPa·s. The solution comprises toluene and isopropanol in a volume ratio of 80:20. Maclean's reagent, E809020.

[0029] Ethylcellulose-3: The viscosity at 25°C is 3~7 mPa·s, and the solution comprises toluene and isopropanol in a volume ratio of 80:20, Maclean's reagent, E809014.

[0030] Ethylcellulose-4: The viscosity at 25°C is 45~55 mPa·s. The solution comprises toluene and isopropanol in a volume ratio of 80:20. Maclean's reagent, E809018.

[0031] Ethyl cellulose-5: The viscosity at 25°C is 270~330 mPa·s. The solution comprises toluene and isopropanol in a volume ratio of 80:20. Maclean's reagent, E809021.

[0032] The following embodiments are provided to facilitate understanding of the invention. These embodiments are not intended to limit the scope of the claims.

[0033] Example 1 A glass encapsulation slurry comprises the following components by weight percentage: 65% glass powder, 24% solvent, 9% resin, 1% leveling agent, and 1% dispersant.

[0034] The glass powder comprises the following components by mass percentage: 55.5% silicon oxide, 14.5% boron oxide, 8% barium oxide, 3% calcium oxide, 2% lithium oxide, 13% sodium oxide, 1.5% zirconium oxide (stabilizer), and 2.5% cerium oxide (clarifying agent).

[0035] The solvent comprises terpineol and diethylene glycol butyl ether in a mass ratio of 2:1.

[0036] The resin comprises ethyl cellulose-1 and second ethyl cellulose-2 in a mass ratio of 1:2.

[0037] The leveling agent is an acrylate leveling agent, BYK3500.

[0038] The dispersant is a polyphosphate dispersant, BYK110.

[0039] The preparation method of the glass encapsulation slurry includes the following steps: Silica, boron oxide, calcium oxide, barium oxide, lithium oxide, sodium oxide, zirconium oxide, and cerium oxide were mixed evenly and melted at 1200℃ for 2 hours. The molten slurry was then water-quenched and dried. The dried glass floc was transferred to a zirconium oxide planetary ball mill jar for pulverization. The zirconium balls used were 500g of 20mm diameter zirconium balls and 500g of 10mm diameter zirconium balls. 300ml of anhydrous ethanol was used as the milling fluid. The milling was carried out for 4 hours, filtered through a 60-mesh sieve, and the pulverized glass powder was dried at 60℃. The dried coarse powder was transferred to a ball mill jar for secondary fine milling. The secondary milling used 500g of 5mm and 3mm diameter zirconium balls, 300ml of anhydrous ethanol as the milling fluid, and a rotation speed of 300 rpm for 7 hours to ensure that the D50 particle size of the glass powder was controlled at around 1.0±0.1μm. The pulverized glass was then dried at 60℃. The resulting glass powder was obtained. SEM image is shown below. Figure 1 As shown.

[0040] Solvent, resin, leveling agent, and dispersant are mixed evenly to obtain an organic carrier; The organic carrier and glass powder are mixed evenly and then ground by three rollers to obtain the glass encapsulation slurry.

[0041] Example 2 The difference between Example 2 and Example 1 is that the ratio of glass powder is different, but everything else is the same.

[0042] The glass powder described in this embodiment comprises the following components by mass percentage: 64% silicon oxide, 12.5% ​​boron oxide, 6% barium oxide, 1% calcium oxide, 1% lithium oxide, 12% sodium oxide, 2% zirconium oxide, and 1.5% cerium oxide.

[0043] Example 3 The difference between Example 3 and Example 1 is that the ratio of glass powder is different, but everything else is the same.

[0044] The glass powder described in this embodiment comprises the following components by mass percentage: 51% silicon oxide, 10% boron oxide, 10% barium oxide, 5% calcium oxide, 3% lithium oxide, 15% sodium oxide, 3% zirconium oxide, and 3% cerium oxide.

[0045] Example 4 The difference between Example 4 and Example 1 is that the ratio of glass powder is different, but everything else is the same.

[0046] The glass powder described in this embodiment comprises the following components by mass percentage: 66% silicon oxide, 15% boron oxide, 5% barium oxide, 1% calcium oxide, 1% lithium oxide, 10% sodium oxide, 1% zirconium oxide, and 1% cerium oxide.

[0047] Example 5 Example 5 differs from Example 1 in that the solvent composition is different, but everything else is the same.

[0048] The solvent in this embodiment includes terpineol and diethylene glycol butyl ether in a mass ratio of 1.4:1.

[0049] Example 6 The difference between Example 6 and Example 1 is that the solvent composition is different, but everything else is the same.

[0050] The solvent in this embodiment includes terpineol and diethylene glycol butyl ether in a mass ratio of 0.5:1.

[0051] Example 7 The difference between Example 7 and Example 1 is that the solvent composition is different, but everything else is the same.

[0052] The solvent in this embodiment includes terpineol and diethylene glycol butyl ether in a mass ratio of 5:1.

[0053] Example 8 The difference between Example 8 and Example 1 is that the resin is different, but everything else is the same.

[0054] The resin in this embodiment includes ethyl cellulose-1 and second ethyl cellulose-3 in a mass ratio of 1:2.

[0055] Example 9 The difference between Example 9 and Example 1 is that the resin is different, but everything else is the same.

[0056] The resin in this embodiment includes ethyl cellulose-2 and second ethyl cellulose-5 in a mass ratio of 1:2.

[0057] Example 10 The difference between Example 10 and Example 1 is that the resin is different, but everything else is the same.

[0058] The resin described in this embodiment includes ethyl cellulose-1.

[0059] Example 11 The difference between Example 11 and Example 1 is that the resin is different, but everything else is the same.

[0060] The resin described in this embodiment includes ethyl cellulose-2.

[0061] Example 12 The difference between Example 12 and Example 1 is that the resin is different, but everything else is the same.

[0062] The resin described in this embodiment includes ethyl cellulose-3.

[0063] Comparative Example 1 The difference between Comparative Example 1 and Example 1 is that the ratio of glass powder is different (not within the scope of this invention), but everything else is the same.

[0064] The glass powder described in this comparative example comprises the following components by mass percentage: 40% silicon oxide, 12% boron oxide, 15% barium oxide, 8% calcium oxide, 4% lithium oxide, 20% sodium oxide, 0.5% zirconium oxide, and 0.5% cerium oxide.

[0065] Comparative Example 2 The difference between Comparative Example 2 and Example 1 is that the ratio of glass powder is different (not within the scope of this invention), but everything else is the same.

[0066] The glass powder described in this comparative example comprises the following components by mass percentage: silicon oxide 74%, boron oxide 5%, barium oxide 5%, calcium oxide 0.5%, lithium oxide 0.5%, sodium oxide 8%, zirconium oxide 4%, and cerium oxide 4%.

[0067] Comparative Example 3 The difference between Comparative Example 3 and Example 1 is that the alkaline earth metal oxide is a single barium oxide, while everything else is the same.

[0068] The glass powder described in this comparative example comprises the following components by mass percentage: 55.5% silicon oxide, 14.5% boron oxide, 11% barium oxide, 2% lithium oxide, 13% sodium oxide, 1.5% zirconium oxide (stabilizer), and 2.5% cerium oxide (clarifying agent).

[0069] Comparative Example 4 The difference between Comparative Example 4 and Example 1 is that the alkaline earth metal oxide is a single calcium oxide, while everything else is the same.

[0070] The glass powder described in this comparative example comprises the following components by mass percentage: 55.5% silicon oxide, 14.5% boron oxide, 11% calcium oxide, 2% lithium oxide, 13% sodium oxide, 1.5% zirconium oxide (stabilizer), and 2.5% cerium oxide (clarifying agent).

[0071] Comparative Example 5 The difference between Comparative Example 5 and Example 1 is that barium oxide and calcium oxide are replaced with equal amounts of alkaline earth metal oxide magnesium oxide, while all other aspects are the same.

[0072] The glass powder described in this comparative example comprises the following components by mass percentage: 55.5% silicon oxide, 14.5% boron oxide, 11% magnesium oxide, 2% lithium oxide, 13% sodium oxide, 1.5% zirconium oxide (stabilizer), and 2.5% cerium oxide (clarifying agent).

[0073] Comparative Example 6 The difference between Comparative Example 6 and Example 1 is that the amount of boron oxide used is not within the scope of this invention (it is made up with silicon oxide), but everything else is the same.

[0074] The glass powder described in this comparative example comprises the following components by mass percentage: 65% silicon oxide, 5% boron oxide, 8% barium oxide, 3% calcium oxide, 2% lithium oxide, 13% sodium oxide, 1.5% zirconium oxide (stabilizer), and 2.5% cerium oxide (clarifying agent).

[0075] Comparative Example 7 The difference between Comparative Example 7 and Example 1 is that the amount of boron oxide used is not within the scope of this invention (it is made up with silicon oxide), but everything else is the same.

[0076] The glass powder described in this comparative example comprises the following components by mass percentage: 50% silicon oxide, 20% boron oxide, 8% barium oxide, 3% calcium oxide, 2% lithium oxide, 13% sodium oxide, 1.5% zirconium oxide (stabilizer), and 2.5% cerium oxide (clarifying agent).

[0077] Comparative Example 8 The difference between Comparative Example 8 and Example 1 is that equal amounts of aluminum oxide are used to replace the alkali metal oxides (lithium oxide and sodium oxide), while everything else is the same.

[0078] The glass powder described in the comparative example comprises the following components by mass percentage: 55.5% silicon dioxide, 14.5% boron oxide, 8% barium oxide, 3% calcium oxide, 15% aluminum oxide, 1.5% zirconium oxide (stabilizer), and 2.5% cerium oxide (clarifying agent).

[0079] Test case Glass encapsulation paste was printed onto an alumina ceramic substrate and held at 600℃ for 1 hour to form a dense glass glaze with a thickness of 10 micrometers on the alumina. The glass glaze layer sintered on the alumina substrate was washed three times with deionized water, dried at 80℃, and the overall weight was measured and recorded. The glass glaze substrate was then immersed in a 5% nickel sulfate and nickel acetate plating solution for 30 minutes, removed, and washed three times with deionized water. It was then washed three times with anhydrous ethanol, dried at 60℃, and the weight was measured and recorded. The surface gloss of the proportional glaze was observed to see if there was any change (wherein, the glaze images before and after the test in Example 1 are shown respectively). Figure 2 , 3 As shown in the figure, observe the edge of the glaze layer under a 10x microscope to see if there is any peeling or flaking. If the test passes, it is recorded as no abnormality (OK); if the test fails, it is recorded as abnormal (NG).

[0080] Table 1 As can be seen from Table 1, the encapsulation paste of the present invention has the properties of being densely sintered at a medium temperature of 600℃ while being resistant to corrosion by chemical plating solutions. It also has a low sintering temperature and high chemical stability, which gives the glass glaze a wide application window in the field of electronic components.

[0081] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A glass encapsulation paste, characterized in that, It includes the following components by weight percentage: 60-70% glass powder, 20-25% solvent, 6-12% resin, 0.5-2% leveling agent, and 0.5-2% dispersant; The glass powder comprises the following components by mass percentage: 51-66% silicon dioxide, 10-15% boron oxide, 6-15% alkaline earth metal oxides, 11-18% alkali metal oxides, 1-3% stabilizer, and 1-3% clarifying agent. The alkali metal oxide comprises lithium oxide and sodium oxide in a mass ratio of (1~3):(10~15); The alkaline earth metal oxide comprises barium oxide and calcium oxide in a mass ratio of (5~10):(1~5); The stabilizer includes zirconium oxide; The clarifying agent includes cerium oxide.

2. The glass encapsulation slurry according to claim 1, characterized in that, It includes the following components by weight percentage: 55.5~64% silicon dioxide, 12.5~14.5% boron oxide, 7~11% alkaline earth metal oxides, 13~15% alkali metal oxides, 1.5~2% stabilizer, and 1.5~2.5% clarifying agent.

3. The glass encapsulation slurry according to claim 2, characterized in that, The alkaline earth metal oxide comprises barium oxide and calcium oxide in a mass ratio of (6~8):(1~3).

4. The glass encapsulation slurry according to claim 2, characterized in that, The alkali metal oxide comprises lithium oxide and sodium oxide in a mass ratio of (1~2):(12~13).

5. The glass encapsulation slurry according to claim 1, characterized in that, The solvent comprises terpineol and diethylene glycol butyl ether in a mass ratio of (0.5~5):

1.

6. The glass encapsulation slurry according to claim 1, characterized in that, The solvent comprises terpineol and diethylene glycol butyl ether in a mass ratio of (1.4~2):

1.

7. The glass encapsulation slurry according to claim 1, characterized in that, The resin comprises first ethyl cellulose and second ethyl cellulose in a mass ratio of 1:(0.5~2); The viscosity of a 5% solution of the first ethyl cellulose at 25°C is 18-22 mPa·s, and the solution comprises toluene and isopropanol in a volume ratio of 80:

20. The viscosity of a 5% solution of the second ethyl cellulose at 25°C is 180-220 mPa·s, and the solution comprises toluene and isopropanol in a volume ratio of 80:

20.

8. The glass encapsulation slurry according to claim 1, characterized in that, The leveling agent is an acrylate leveling agent; The dispersant is a polyphosphate dispersant.

9. The method for preparing the glass encapsulation slurry according to any one of claims 1 to 8, characterized in that, Includes the following steps: Silicon oxide, boron oxide, alkaline earth metal oxide, alkali metal oxide, stabilizer, and clarifying agent are mixed evenly and melted at 1100~1300℃ for 1~3h. The molten slurry is then water-quenched, dried, and ball-milled to obtain glass powder. Solvent, resin, leveling agent, and dispersant are mixed evenly to obtain an organic carrier; The organic carrier and glass powder are mixed evenly to obtain the glass encapsulation slurry.

10. The application of the glass encapsulation paste according to any one of claims 1 to 8 in the preparation of electronic components.