System and method for testing reliability of electronic component

Abstract

The invention discloses a reliability test system and method for an electronic component. The test system comprises a control part, a closed cabin body, a dynamic pressure balancing device, a pressure detection part and a pressure adjusting part. First environment liquid is contained in the closed cabin body; the dynamic pressure balancing device is detachably arranged in the closed cabin body and comprises a cavity for accommodating second environment liquid; and the pressure balance part is fixedly connected with one side of the cavity. The pressure detection part is connected with the closed cabin and the control part, detects current pressure information of the closed cabin and transmits the current pressure information to the control part, and the control part generates a pressure control signal according to the current pressure information and preset target pressure information; one end of the pressure adjusting part is connected with the control part, the other end of the pressure adjusting part is communicated with the closed cabin, and the pressure adjusting part responds to the pressure control signal and controls the pressure of the first environment liquid in the closed cabin; the pressure balancing part adjusts the pressure of the second environment liquid according to the pressure of the first environment liquid.

Description

Technical Field

[0001] This application relates to the field of electronic component reliability testing technology, and more specifically, to a reliability testing system and method for electronic components. Background Technology

[0002] With the development of deep-sea exploration technology, the requirements for the adaptability of full-ocean-depth electronic equipment to high-voltage environments are becoming increasingly stringent. Oil-filled electronic components, thanks to the pressure resistance and corrosion resistance of insulating oil, have become core components of deep-sea equipment.

[0003] The existing reliability testing method for oil-filled electronic components is the high-voltage oil immersion test, which involves immersing the component in insulating oil and applying a rated pressure (usually less than 20 MPa).

[0004] However, the inventors of this application have discovered that current testing methods do not fully consider the unique failure mechanisms of oil-filled structures under high-pressure environments in the deep sea. For example, fatigue failure caused by high pressure and pressure cycling, insulation performance degradation caused by high-pressure oil leakage at the sealing interface, oil-material compatibility failure (such as the reaction of insulating oil with metal electrodes / rubber seals to generate precipitates or corrosion products), or degradation of the physicochemical properties of the oil medium (decreased dielectric strength, abnormal viscosity changes, etc.).

[0005] Furthermore, current testing methods are all implemented after the entire system is assembled. If components fail during full-ocean-depth service, significant costs will be incurred. For example, the cost of a single repair could exceed $500,000 (including ship relocation), and the mission interruption period could be ≥6 months, or the risk of failure of critical exploration missions could increase by 60%.

[0006] The content of the background section is merely technology known to the public and does not necessarily represent existing technology in the field. Summary of the Invention

[0007] According to one aspect of this application, a reliability testing system for electronic components is provided. The testing system includes a control unit, a sealed chamber, a dynamic pressure balancing device, a pressure detection unit, and a pressure regulating unit. The sealed chamber contains a first ambient liquid. The dynamic pressure balancing device is detachably disposed within the sealed chamber and may include a cavity and a pressure balancing unit. The cavity contains a second ambient liquid. The pressure balancing unit is fixedly connected to one side of the cavity. The pressure detection unit is connected to the sealed chamber and to the control unit. When the electronic component is placed in the cavity, the pressure detection unit detects the current pressure information of the sealed chamber and transmits it to the control unit, so that the control unit generates a pressure control signal based on the current pressure information and a preset target pressure information. One end of the pressure regulating unit is connected to the control unit, and the other end is connected to the sealed chamber. The pressure regulating unit responds to the pressure control signal and controls the pressure of the first ambient liquid in the sealed chamber. The pressure balancing unit adjusts the pressure of the second ambient liquid according to the pressure of the first ambient liquid, so that the pressure on the electronic component conforms to the preset target pressure information.

[0008] According to some embodiments of this application, the testing system further includes a temperature control device. One end of the temperature control device is connected to the cavity, and the other end is connected to the control unit. When the electronic component is placed in the cavity, the temperature control device detects the current temperature information of the cavity. The control unit generates a temperature control signal based on the current temperature information and a preset target temperature information. The temperature control device also responds to the temperature control signal to control the temperature of the cavity so that the temperature experienced by the electronic component conforms to the preset target temperature information.

[0009] According to some embodiments of this application, the pressure regulating unit includes a hydraulic pump, a first hydraulic valve, and a second hydraulic valve. The hydraulic pump pumps a first ambient liquid into a sealed chamber; the first hydraulic valve is connected to a control unit, and connects the sealed chamber and the hydraulic pump to control the flow channel between the hydraulic pump and the sealed chamber. The first hydraulic valve controls the flow rate of the first ambient liquid in response to a pressure increase control signal from the control unit; one end of the second hydraulic valve is connected to the sealed chamber, and the other end is connected to the control unit. The second hydraulic valve controls the flow rate of the first ambient liquid in response to a pressure relief control signal from the control unit.

[0010] According to some embodiments of this application, the pressure detection unit includes a first pressure detection unit and a second pressure detection unit. The first pressure detection unit is disposed inside the sealed chamber to detect current pressure information; the second pressure detection unit is connected to the sealed chamber to calibrate the current pressure information.

[0011] According to some embodiments of this application, the dynamic pressure balancing device further includes a watertight connector and a watertight connector cable. The watertight connector is located on the other side of the cavity and is electrically connected to the electronic components when the electronic components are placed in the cavity; one end of the watertight connector cable is connected to the watertight connector, and the other end is a lead-out end.

[0012] According to some embodiments of this application, the dynamic pressure balancing device further includes a sealing end cap, a handle, and a seal. The sealing end cap is fixedly and sealed to the other side of the cavity, and the sealing end cap has a threaded hole; the handle is disposed on one side of the sealing end cap; the seal is detachably connected to the threaded hole to seal the threaded hole.

[0013] According to some embodiments of this application, the testing system further includes an electrical testing unit. The lead end of a watertight connecting cable of the electrical testing unit is connected to test the electrical parameters of the electronic components.

[0014] According to some embodiments of this application, the testing system further includes an insulation testing unit. The insulation testing unit is connected to the lead-out end of a watertight connection cable to test the insulation resistance parameters of the electronic components.

[0015] According to another aspect of this application, a reliability testing method for electronic components is provided. The testing method is executed by a testing system, which includes a control unit, a dynamic pressure balancing device, a pressure detection unit, and a pressure regulating unit. The dynamic pressure balancing device includes a cavity and a pressure balancing unit. The testing method includes performing a step of applying a preset static pressure to the electronic component. The step of applying the preset static pressure to the electronic component includes: with the electronic component placed in the cavity, the pressure detection unit detects first current pressure information of the sealed chamber; the control unit generates a first pressure control signal based on the first current pressure information and preset first target pressure information; the pressure regulating unit controls the pressure of a first ambient liquid in the sealed chamber in response to the first pressure control signal; and the pressure balancing unit adjusts the pressure of a second ambient liquid based on the pressure of the first ambient liquid, so that the pressure on the electronic component conforms to the preset first target pressure.

[0016] According to some embodiments of this application, the testing method further includes: performing a step of applying a preset dynamic impact pressure to an electronic component according to a first preset quantity; the step of applying the preset dynamic impact pressure to the electronic component includes: when the electronic component is placed in the cavity, a pressure detection unit detects second current pressure information of the sealed chamber; a control unit generates a second pressure control signal based on the second current pressure information and preset second target pressure information; a pressure regulation unit controls the pressure of a first ambient liquid in the sealed chamber in response to the second pressure control signal; and a pressure balancing unit adjusts the pressure of a second ambient liquid based on the pressure of the first ambient liquid so that the pressure on the electronic component conforms to the preset second target pressure information.

[0017] According to some embodiments of this application, the testing system further includes a temperature control device; the testing method further includes: performing steps of applying a preset temperature and a preset impact pressure to the electronic component according to a second preset quantity; the steps of applying the preset temperature and preset impact pressure to the electronic component include: when the electronic component is placed in the cavity, the pressure detection unit detects the current pressure information of the sealed chamber as third current pressure information, and the temperature control device detects the current temperature information of the dynamic pressure balancing device; the control unit generates a third pressure control signal based on the third current pressure information and a preset third target pressure information, and generates a temperature control signal based on the current temperature information and the preset target temperature information; the pressure regulation unit controls the pressure of the first ambient liquid in the sealed chamber in response to the third pressure control signal; the pressure balancing unit adjusts the pressure of the second ambient liquid based on the pressure of the first ambient liquid, so that the pressure on the electronic component conforms to the preset third target pressure information; the temperature control device controls the temperature of the electronic component in response to the temperature control signal, so that the temperature on the electronic component conforms to the preset target temperature information.

[0018] According to some embodiments of this application, the test system further includes an electrical test section; the test method further includes: with the electronic component placed inside the cavity, the electrical test section tests the electrical parameters of the electronic component.

[0019] According to some embodiments of this application, the test system further includes an insulation test section; the test method further includes: with the electronic component placed inside the cavity, the insulation test section tests the insulation resistance parameter of the electronic component.

[0020] Through the above embodiments, the technical solution of this application can accommodate electronic components in a cavity, regulate the pressure inside the sealed chamber through a pressure regulating unit, and balance the pressure outside and inside the cavity through a pressure balancing unit, so that the pressure on the electronic components conforms to the preset target pressure information.

[0021] The testing system described in this application can simulate pressure in a full ocean depth environment and test and screen for the unique failure mechanisms of oil-filled electronic components that may occur under the high pressure environment of the deep sea. Furthermore, this testing system allows oil-filled electronic components to be tested before installation, avoiding the problem of failure of oil-filled electronic components during full ocean depth service. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 A schematic diagram of the structure of a test system according to an embodiment of this application is shown; Figure 2 A schematic diagram of the structure of a dynamic pressure balancing device according to an embodiment of this application is shown; Figure 3 This diagram shows a cross-sectional view of a dynamic pressure balancing device according to an embodiment of the present application. Figure 4 Another cross-sectional structural schematic diagram of a dynamic pressure balancing device according to an embodiment of this application is shown; Figure 5 A flowchart illustrating a test method 1000 according to an embodiment of this application is shown; Figure 6 A flowchart illustrating step S100 according to an embodiment of this application is shown; Figure 7 A flowchart illustrating step S200 according to an embodiment of this application is shown; Figure 8 A flowchart illustrating step S300 according to an embodiment of this application is shown; Figure 9 This diagram illustrates a pressure curve of a preset first target pressure according to an embodiment of the present application. Figure 10 A schematic diagram of a pressure curve for a preset second target pressure and a schematic diagram of a temperature curve for preset target temperature information are shown according to an embodiment of this application. Figure 11 The diagram shows the deformation rate curves of the same batch of oil-filled capacitors after a pressure cycle shock test according to an embodiment of this application.

[0024] Explanation of reference numerals in the attached figures: Test system 100; Control unit 110; sealed chamber 120; dynamic pressure balancing device 130; pressure detection unit 140; pressure regulating unit 150; temperature control device 160; electrical testing unit 170; insulation testing unit 180.

[0025] Cavity 131; Pressure balance part 132; Watertight connector 133; Watertight connector cable 134; Sealed end cap 135; Handle 136; Seal 137; Threaded hole 138; Protective structure 139.

[0026] First pressure detection unit 141; second pressure detection unit 142.

[0027] Hydraulic pump 151; first hydraulic valve 152; second hydraulic valve 153.

[0028] Electronic components 20. Detailed Implementation

[0029] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this application will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted.

[0030] The described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a full understanding of embodiments of this disclosure. However, those skilled in the art will recognize that the technical solutions of this disclosure can be practiced without one or more of these specific details, or other methods, components, materials, devices, etc. In these cases, well-known structures, methods, devices, implementations, materials, or operations will not be shown or described in detail.

[0031] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.

[0032] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order.

[0033] The technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0034] The English terms used in this application, their full English names, and their corresponding Chinese definitions are as follows: NAS 5 is a cleanliness level in NAS 1638 (Cleanliness requirements for hydraulic system components, established by National Aerospace Standards), meaning that the number of particulate matter allowed in 100 ml of oil sample is extremely low. Specifically, in NAS 5 clean fluid, a maximum of only 180 particles larger than 50 μm are allowed per 100 ml. Larger contaminants larger than 100 μm are allowed only 32.

[0035] SEM stands for Scanning Electron Microscope.

[0036] EDS stands for Energy Dispersive Spectroscopy.

[0037] GC, Gas Chromatography.

[0038] RH stands for Relative Humidity.

[0039] PCB, Printed Circuit Board.

[0040] According to one aspect of this application, a reliability testing system 100 for an electronic component 20 is provided. See also Figure 1 The test system 100 includes a control unit 110, a sealed chamber 120, a dynamic pressure balancing device 130, a pressure detection unit 140, and a pressure regulating unit 150.

[0041] According to the example embodiment, the control unit 110 can be a microcontroller. A first ambient liquid is contained within the sealed chamber 120. The first ambient liquid can be a liquid from the application environment of the electronic component 20, for example, seawater or lake water.

[0042] The dynamic pressure balancing device 130 is detachably installed in the sealed chamber 120, and the volume of the dynamic pressure balancing device 130 can be adjusted according to the volume of the electronic components 20. See also Figure 2 The dynamic pressure balancing device 130 may include a cavity 131 and a pressure balancing section 132.

[0043] Cavity 131 contains a second ambient liquid. Electronic component 20 can be placed inside cavity 131. Electronic component 20 is in contact with the second ambient liquid. For example, electronic component 20 can be oil-filled. The second ambient liquid can be an oil (e.g., insulating oil).

[0044] The pressure balancing part 132 is fixedly connected to one side of the cavity 131. A sealed space is formed between the pressure balancing part 132 and the cavity 131. For example, the pressure balancing part 132 can be an oil bladder. The oil bladder contains a second environment liquid and can serve as a pressure transmission element. It is made of nitrile rubber (elongation ≥ 200%) and can deform in real time to balance the pressure inside and outside the oil bladder, thus balancing the pressure of the liquid inside and outside the cavity 131 and eliminating pressure gradient distortion.

[0045] The pressure detection unit 140 is connected to the sealed chamber 120 and the control unit 110. When the electronic component 20 is placed in the cavity 131, the pressure detection unit 140 detects the current pressure information of the sealed chamber 120 and transmits it to the control unit 110, so that the control unit 110 generates a pressure control signal based on the current pressure information and the preset target pressure information.

[0046] For example, the pressure detection unit 140 can be a pressure sensor. With the electronic component 20 placed in the cavity 131, the pressure sensor can detect the current pressure information of the sealed chamber 120 and send the current pressure information to the microcontroller. The microcontroller generates a pressure control signal based on the current pressure information and preset target pressure information.

[0047] According to the example embodiment, one end of the pressure regulating unit 150 is connected to the control unit 110, and the other end of the pressure regulating unit 150 is connected to the sealed chamber. The pressure regulating unit 150 responds to a pressure control signal to control the pressure of the first ambient liquid in the sealed chamber 120.

[0048] For example, the pressure regulating unit 150 may include a hydraulic valve and a hydraulic pump 151. The hydraulic pump 151 may pump the first ambient liquid into the sealed chamber 120 through the hydraulic valve, and the hydraulic valve may control the flow rate of the first ambient liquid. The hydraulic valve may also control the flow rate at which the first ambient liquid is discharged from the sealed chamber 120.

[0049] The pressure balancing unit 132 adjusts the pressure of the second ambient liquid according to the pressure of the first ambient liquid so that the pressure on the electronic component 20 conforms to the preset target pressure information.

[0050] For example, when the pressure of the first ambient liquid inside the sealed chamber 120 changes, the oil bladder will expand and contract in accordance with the pressure change of the first ambient liquid. Due to the incompressibility of the oil (second ambient liquid), the pressure inside the cavity 131 and the pressure inside the sealed chamber 120 are kept in real time balanced. The pressure regulating unit 150 can adjust the pressure of the first ambient liquid to a preset target pressure information, thereby making the pressure on the electronic component 20 conform to the preset target pressure information through the adjustment of the pressure balancing unit 132.

[0051] According to the example embodiment, the process of placing the oil-filled electronic component 20 in the cavity 131 can be as follows: Oil-filled electronic components 20 can be pre-treated, for example, by using a nitrogen purging + fibrous cleaning process, purging the cavity 131 with dry nitrogen (dew point ≤ -40℃), and removing residues with a fibrous cloth to ensure oil cleanliness NAS 5 level.

[0052] The oil-filled electronic components to be tested are numbered and then installed into cavity 131, with the electrical interface brought out.

[0053] Vacuum oil injection is performed on cavity 131. The cavity 131 is evacuated to -0.08 MPa and maintained for 15 minutes to expel gas. Low-speed oil injection (secondary ambient liquid) (flow rate ≤ 1 / 3Q) is used. max To suppress turbulence, the vent is slightly opened to allow air bubbles to be expelled in real time, ensuring that the residual liquid air bubbles are <0.01mL.

[0054] Through the above embodiments, the technical solution of this application can accommodate electronic components in a cavity, regulate the pressure inside the sealed chamber through a pressure regulating unit, and balance the pressure outside and inside the cavity through a pressure balancing unit, so that the pressure on the electronic components conforms to the preset target pressure information.

[0055] The testing system described in this application can simulate the pressure of a full ocean depth environment and test and screen for the unique failure mechanisms of oil-filled electronic components that may occur under the high pressure environment of the deep sea. Furthermore, the testing system allows the oil-filled electronic components 20 to be tested before installation, avoiding the problem of failure of oil-filled electronic components during full ocean depth service.

[0056] The inventors of this application have discovered that the current accelerated aging test method for materials involves aging for 1000 hours at 85°C / 85%RH and monitoring changes in the oil acid value (standard IEC 60296). However, this method does not incorporate the effect of a high-pressure-temperature coupling field, which actually accelerates the formation rate of metal electrode precipitates by 3-5 times in the actual deep-sea environment.

[0057] Optionally, see Figure 1 The testing system 100 also includes a temperature control device 160. One end of the temperature control device 160 is connected to the cavity 131, and the other end of the temperature control device 160 is connected to the control unit 110. When the electronic component 20 is placed in the cavity 131, the temperature control device 160 detects the current temperature information of the cavity 131.

[0058] For example, the sealed chamber 120 may include a watertight connector (e.g., the watertight connector may specifically include a first watertight connector base and a first watertight connector cable). The temperature control device 160 can be electrically connected to the cavity 131 through the watertight connector of the sealed chamber 120.

[0059] The control unit 110 generates a temperature control signal based on the current temperature information and the preset target temperature information. The temperature control device 160 also responds to the temperature control signal to control the temperature of the cavity 131 so that the temperature of the electronic component 20 meets the preset target temperature.

[0060] The temperature control device may include a heater, a cooler, and a temperature sensor. Heating can be controlled by the control unit 110 to heat the heater, and cooling can be controlled by the control unit 110 to cool the cooler. The temperature sensor can detect the current temperature information of the cavity 131.

[0061] For example, the microcontroller controls the switch of the temperature control device 160 and collects temperature data in real time to keep the temperature in the dynamic pressure balancing device 130 consistent with the set temperature value.

[0062] Through the above embodiments, the technology of this application can also control the temperature inside the cavity in real time through a temperature control device, thereby achieving precise pressure control of electronic components while simultaneously achieving precise temperature control, and enabling precise control of electronic components under multiple stress couplings.

[0063] The technical solution of this application can test and screen for defects caused by accelerated formation rate of metal electrode precipitates in oil-filled electronic components under the combined action of high voltage-temperature coupling field.

[0064] Optionally, see Figure 1 The pressure regulating unit 150 includes a hydraulic pump 151, a first hydraulic valve 152, and a second hydraulic valve 153.

[0065] According to an example embodiment, hydraulic pump 151 pumps a first ambient liquid into a sealed chamber 120.

[0066] The first hydraulic valve 152 is connected to the control unit 110. The first hydraulic valve 152 is connected to the sealed chamber 120 and the hydraulic pump 151 to control the flow channel between the hydraulic pump 151 and the sealed chamber 120. The first hydraulic valve 152 responds to the pressure boosting control signal from the control unit 110 to control the flow rate of the first ambient liquid.

[0067] The pressurization control signal can be generated based on the current pressure information and the preset target pressure information. The control unit 110 can control the pressure inside the sealed chamber 120 and the pressurization rate through the first hydraulic valve 152, so that the electronic components 20 can simulate different underwater depths and different diving speeds.

[0068] For example, the first hydraulic valve 152 can be a proportional pressure regulating solenoid valve. The microcontroller can adjust the opening width of the proportional pressure regulating solenoid valve through a PID control algorithm, thereby controlling the output of the hydraulic pump 151.

[0069] One end of the second hydraulic valve 153 is connected to the sealed chamber, and the other end of the second hydraulic valve 153 is connected to the control unit 110. The second hydraulic valve 153 responds to the pressure relief control signal from the control unit 110 to control the flow rate of the first ambient liquid.

[0070] The pressure relief control signal can be generated based on the current pressure information and the preset target pressure information. The control unit 110 can control the pressure and pressure relief rate inside the sealed chamber 120 through the second hydraulic valve 153, so that the electronic components 20 can simulate different underwater depths and different surfacing speeds. For example, the second hydraulic valve 153 can be a proportional pressure regulating solenoid valve. The microcontroller can adjust the opening width of the proportional pressure regulating solenoid valve through a PID control algorithm, thereby controlling the rate at which the first ambient liquid flows out of the sealed chamber 120.

[0071] Through the above embodiments, the technical solution of this application can control the pressure and pressurization speed inside the sealed chamber through the first hydraulic valve, and control the pressure and depressurization speed inside the sealed chamber through the second hydraulic valve, so that the electronic components can simulate different underwater depths, different diving speeds and different surfacing speeds.

[0072] Optionally, see Figure 1 The pressure detection unit 140 includes a first pressure detection unit 141 and a second pressure detection unit 142.

[0073] The first pressure detection unit 141 is disposed inside the sealed chamber 120 to detect the current pressure information. The second pressure detection unit 142 is connected to the sealed chamber 120 to calibrate the current pressure information. For example, the first pressure detection unit 141 (pressure sensor) can be disposed inside the sealed chamber 120. The second pressure detection unit 142 can be a pressure gauge, disposed outside the sealed chamber 120, and can calibrate the current pressure information measured by the first pressure detection unit 141.

[0074] Optionally, see Figures 2-4 The dynamic pressure balancing device 130 also includes a watertight connector 133 and a watertight connector cable 134.

[0075] A watertight connector 133 is located on the other side of the cavity 131. When the electronic component 20 is placed in the cavity 131, the watertight connector 133 is electrically connected to the electronic component 20. One end of the watertight connector cable 134 is connected to the watertight connector 133, and the other end of the watertight connector cable 134 is a lead-out end.

[0076] For example, the watertight connector 133 can electrically connect the oil-filled electronic component 20. The watertight connector cable 134 can be connected to the first watertight connector through the sealed compartment 120, and the first watertight connector of the sealed compartment 120 is connected to the first watertight connector cable of the sealed compartment 120, thereby allowing the electrical signals of the oil-filled electronic component 20 to be extracted.

[0077] Through the above embodiments, the technical solution of this application can lead out the electrical signals of electronic components through watertight connectors and watertight cables, so that the electrical parameters of electronic components can be tested simultaneously during the temperature and pressure control of electronic components.

[0078] Optionally, see Figures 2-4 The dynamic pressure balancing device 130 also includes a sealed end cap 135, a handle 136, and a seal 137.

[0079] The sealing end cap is sealed and fixedly connected to the other side of the cavity 131. The end face of the sealing cap is fitted with a fluororubber gasket. After being compressed, the fluororubber gasket forms a secondary sealing surface, thereby radially sealing the dynamic pressure balancing device 130.

[0080] The sealing end cap has a threaded hole 138. The threaded hole 138 can be an oil filling port and an oil outlet port, through which the secondary environment liquid flows into or out of the cavity 131.

[0081] The handle 136 is located on one side of the sealing end cap 135. The handle 136 is fixedly connected to the sealing end cap, which facilitates the installation and removal of the dynamic pressure balancing device 130.

[0082] The seal 137 is detachably connected to the threaded hole 138 to seal the threaded hole 138. For example, the seal 137 can be a sealing bolt, which engages with an O-ring. The bolt preload causes the O-ring to expand and fill the thread gap of the sealing bolt, thereby axially sealing the dynamic pressure balancing device 130. Actual measurement data shows that the helium leakage rate of the dynamic pressure balancing device 130 of this application is ≤1×10⁻⁶ at 132 MPa. -12 Pa·m 3 / s.

[0083] Through the above embodiments, the technical solution of this application can seal the dynamic pressure balancing device through the sealing end cap and sealing element, which can meet the needs of the full ocean depth environment.

[0084] Optionally, see Figures 2-4 The dynamic pressure balancing device 130 also includes a protective structure 139, which can be arranged around the pressure balancing part 132 and is fixedly connected to the cavity 131. For example, the protective structure 139 can be a titanium alloy mesh to prevent external mechanical stress from damaging the oil bladder, while allowing the oil bladder to expand and contract freely.

[0085] Optionally, see Figure 1 The test system 100 also includes an electrical test unit 170. The electrical test unit 170 is connected to the lead-out end of the watertight connection cable 134 to test the electrical parameters of the electronic component 20.

[0086] The electrical testing unit 170 can be a device for measuring the electrical parameters of the oil-filled electronic component 20. For example, the electrical testing unit 170 can be a communication stability testing device (such as an oscilloscope, logic analyzer, etc.). The electrical testing unit 170 can test the electrical parameters of the electronic component 20 simultaneously during temperature and pressure control. The electrical testing unit 170 can achieve electrical connection with the electronic component 20 through a first watertight connection cable connected to the sealed chamber 120, thereby testing the electrical parameters.

[0087] The inventors of this application have discovered that the current test method for dielectric performance testing is to apply 2.5 times the rated voltage for 1 minute (standard GB / T 1695-2005), but it does not take into account the bubble ionization effect caused by the high voltage environment (the breakdown voltage of 0.1 mm bubbles in insulating oil decreases by 70% at 100 MPa).

[0088] Optionally, see Figure 1 The test system 100 also includes an insulation test unit 180. The insulation test unit 180 is connected to the lead-out end of the watertight connecting cable 134 to test the insulation resistance parameters of the electronic component 20. The insulation test unit 180 can test the insulation resistance parameters of the electronic component 20 simultaneously during temperature and voltage control.

[0089] For example, the insulation test section 180 can be connected to the electronic component 20 via a first watertight connection cable to the sealed chamber 120, thereby obtaining the insulation resistance parameter.

[0090] Through the above embodiments, the technical solution of this application can test and screen for defects caused by bubble ionization effects that may exist in oil-filled electronic components under high pressure by simultaneously testing the insulation resistance parameters of the electronic components during the temperature and pressure control process.

[0091] According to another aspect of this application, a reliability testing method 1000 for electronic components is provided. The testing method 1000 is performed by the testing system described above. The testing system includes a control unit, a dynamic pressure balancing device, a pressure detection unit, and a pressure regulating unit. The dynamic pressure balancing device includes a cavity and a pressure balancing unit. The structure of the testing system has been described above and will not be repeated here.

[0092] See Figure 5 Test method 1000 may include step S100.

[0093] Step S100 involves applying a preset static pressure to the electronic component. See also... Figure 6 Step S100 may include steps S110-S140.

[0094] In step S110, with the electronic components placed inside the cavity, the pressure detection unit detects the first current pressure information of the sealed chamber.

[0095] According to an example embodiment, the first current pressure information can be the current pressure inside the sealed chamber when static pressure is applied to the electronic components.

[0096] In step S120, the control unit generates a first pressure control signal based on the first current pressure information and the preset first target pressure information.

[0097] According to the example embodiment, the preset first target pressure information can be a preset static target pressure, pressure increase rate, pressure release rate, and pressure holding time, which can be set according to the full ocean depth environment in which the electronic components are used. For example, Figure 9 As shown, the preset first target pressure can be set to 132 MPa, which can cover the testing requirements of the entire ocean depth environment. During the pressurization process, the pressurization rate is 20±5 MPa / h in the range of 0-100 MPa, and 32±5 MPa / h in the range of 100 MPa-132 MPa. The pressure holding time at 132 MPa is 12 hours. The depressurization rate is 32±5 MPa / h in the range of 132 MPa-100 MPa, and 20±5 MPa / h in the range of 100 MPa-0 MPa.

[0098] The control unit can generate a first pressure control signal for increasing pressure, decreasing pressure, or maintaining pressure based on the first current pressure information and the preset first target pressure information.

[0099] In step S130, the pressure regulating unit responds to the first pressure control signal and controls the pressure of the first ambient liquid in the sealed chamber.

[0100] According to an example embodiment, the pressure regulating unit can control the pressure of the first ambient liquid in the sealed chamber based on the first pressure control signal. For example, the first hydraulic valve can control its opening width in response to the pressure increase signal of the first pressure control signal, thereby controlling the output of the hydraulic pump.

[0101] The second hydraulic valve can respond to the pressure relief signal of the first pressure control signal to control the opening width, thereby controlling the speed at which the first ambient liquid flows out of the sealed chamber.

[0102] In step S140, the pressure balancing unit adjusts the pressure of the second ambient liquid according to the pressure of the first ambient liquid so that the pressure on the electronic components meets the preset first target pressure.

[0103] According to the example embodiment, when the pressure of the first ambient liquid in the sealed chamber changes, the oil bladder expands and contracts in response to the pressure change of the first ambient liquid. Due to the incompressibility of the oil (second ambient liquid), the pressure inside the cavity remains in real-time balance with the pressure inside the sealed chamber. The pressure regulating unit can adjust the pressure of the first ambient liquid to a preset target pressure information, thereby ensuring that the pressure on the electronic components conforms to the preset first target pressure information through the adjustment of the pressure balancing unit.

[0104] After step S100, the oil-filled electronic components can be inspected for oil seepage into the component, which could cause electrical parameter drift, short circuit, or complete failure of the integrated circuit / connector / capacitor. The physical structure of the oil-filled electronic components can also be checked for permanent deformation, such as cracking of ceramic packages, bulging of plastic packages, denting of the aluminum shell of aluminum electrolytic capacitors, and PCB bending. Furthermore, the bonding wires (such as gold wires or aluminum wires) inside the oil-filled electronic components or the external pins can be checked for breakage due to stress.

[0105] Through the above embodiments, the technical solution of this application can accommodate electronic components in a cavity, regulate the pressure inside the sealed chamber through a pressure regulating unit, and balance the pressure outside and inside the cavity through a pressure balancing unit, so that the pressure on the electronic components conforms to preset target pressure information. The technical solution of this application can apply a preset static pressure to the electronic components based on preset first target pressure information.

[0106] The testing technology proposed in this application can simulate the pressure of a full ocean depth environment and test and screen for the unique failure mechanisms of oil-filled electronic components that may occur under the high pressure environment of the deep sea. Furthermore, the testing system of this application allows for the testing of oil-filled electronic components before installation, avoiding the problem of failure of oil-filled electronic components during full ocean depth service.

[0107] Optionally, see Figure 5 The test method 1000 may include step S200. Step S200 may be executed after step S100 or before step S100, and this application is not limited to this. As an embodiment, step S200 may also be executed alone.

[0108] Step S200 is to apply a preset dynamic impact pressure to the electronic components according to the first preset quantity.

[0109] According to an example embodiment, the first preset number can be the number of times a preset dynamic impact pressure is applied to the electronic component. For example, the first preset number can be at least 5 times.

[0110] See Figure 7 Step S200 may include steps S210-S240.

[0111] In step S210, with the electronic components placed inside the cavity, the pressure detection unit detects the second current pressure information of the sealed chamber.

[0112] According to an example embodiment, the second current pressure information can be the current pressure inside the sealed chamber when a preset dynamic impact pressure is applied to the electronic components.

[0113] In step S220, the control unit generates a second pressure control signal based on the second current pressure information and the preset second target pressure information.

[0114] According to the example embodiment, the preset second target pressure information can be a preset dynamic impact pressure, pressure rise rate, pressure release rate, and pressure holding time, which can be set according to the full-ocean-depth environment in which the electronic components are used. For example, Figure 10 The solid line in the curves shows that the preset second target pressure can be set to 132 MPa, which can cover the testing requirements of the entire ocean depth environment. During the pressurization process, the pressurization rate in the range of 0-132 MPa is 55 ± 5 MPa / h. The holding time at 132 MPa is 9.6 hours. The depressurization rate in the range of 132 MPa-0 MPa is 55 ± 5 MPa / h. The holding time at 0 MPa is 9.6 hours.

[0115] The control unit can generate a second pressure control signal for increasing pressure, decreasing pressure, or maintaining pressure based on the second current pressure information and the preset second target pressure information.

[0116] In step S230, the pressure regulating unit responds to the second pressure control signal and controls the pressure of the first ambient liquid in the sealed chamber.

[0117] According to an example embodiment, the pressure regulating unit can control the pressure of the first ambient liquid in the sealed chamber based on the second pressure control signal. For example, the first hydraulic valve can control its opening width in response to the pressure increase signal of the second pressure control signal, thereby controlling the output of the hydraulic pump.

[0118] The second hydraulic valve can respond to the pressure relief signal of the second pressure control signal to control the opening width, thereby controlling the speed at which the first ambient liquid flows out of the sealed chamber.

[0119] In step S240, the pressure balancing unit adjusts the pressure of the second ambient liquid according to the pressure of the first ambient liquid so that the pressure on the electronic components conforms to the preset second target pressure information.

[0120] According to the example embodiment, when the pressure of the first ambient liquid in the sealed chamber changes, the oil bladder expands and contracts in response to the pressure change of the first ambient liquid. Due to the incompressibility of the oil (second ambient liquid), the pressure inside the cavity remains in real-time balance with the pressure inside the sealed chamber. The pressure regulating unit can adjust the pressure of the first ambient liquid to a preset target pressure information, thereby ensuring that the pressure on the electronic components conforms to the preset second target pressure information through the adjustment of the pressure balancing unit.

[0121] Through the above embodiments, the technical solution of this application can apply a first preset number of preset dynamic impact pressures, i.e., cyclic pressure impacts, to electronic components by using preset second target pressure information.

[0122] Optionally, the testing system also includes a temperature control device. See [link / reference] Figure 5 The test method 1000 may include step S300. Step S300 may be executed after step S200 or before step S200, and this application is not limited to this. As an embodiment, step S300 may also be executed alone.

[0123] Step S300 involves applying a preset temperature and a preset impact pressure to the electronic components according to the second preset quantity.

[0124] According to an example embodiment, the second preset quantity can be the number of times a preset temperature and a preset impact pressure are applied to the electronic component. For example, the second preset quantity can be at least 5 times.

[0125] See Figure 8 Step S300 may include steps S310-S350.

[0126] In step S310, with the electronic components placed inside the cavity, the pressure detection unit detects the third current pressure information of the sealed chamber, and the temperature control device detects the current temperature information of the dynamic pressure balancing device.

[0127] According to an example embodiment, the first current pressure information can be the current pressure inside a sealed chamber under the condition of applying a preset temperature and a preset impact pressure to electronic components.

[0128] The current temperature information can be the current temperature inside the sealed chamber under the condition of applying a preset temperature and a preset impact pressure to the electronic components.

[0129] In step S320, the control unit generates a third pressure control signal based on the third current pressure information and the preset third target pressure information, and generates a temperature control signal based on the current temperature information and the preset target temperature information.

[0130] According to the example embodiment, the preset third target pressure information can be preset impact pressure, pressure rise rate, pressure release rate, and pressure holding time, which can be set according to the full-ocean-depth environment in which the electronic components are used. For example, Figure 10 As shown, the preset third target pressure information can be the same as the preset second target pressure information. The preset third target pressure information can be set to 132 MPa, which can cover the testing requirements of the entire ocean depth environment. During the pressurization process, the pressurization rate in the range of 0-132 MPa is 55±5 MPa / h. The holding time at 132 MPa is 9.6 hours. The depressurization rate in the range of 132 MPa-0 MPa is 55±5 MPa / h. The holding time at 0 MPa is 9.6 hours.

[0131] The control unit can generate a third pressure control signal to increase, decrease, or maintain pressure based on the third current pressure information and the preset third target pressure information.

[0132] The preset target temperature information can include the preset target temperature, heating rate, cooling rate, and holding time. For example, ... Figure 10 As shown, the preset target temperature information can be set to -40℃ to 80℃. The heating rate from -40℃ to 80℃ is 20℃ / h, and the holding time at 80℃ is 8.4h. The cooling rate from 80℃ to -40℃ is 12.5℃ / h, and the holding time at -40℃ is 0h.

[0133] The control unit can generate temperature control signals for heating, cooling, or heat preservation based on the current temperature information and the preset target temperature information.

[0134] In step S330, the pressure regulating unit responds to the third pressure control signal and controls the pressure of the first ambient liquid in the sealed chamber.

[0135] According to an example embodiment, the pressure regulating unit can control the pressure of the first ambient liquid in the sealed chamber based on a third pressure control signal. For example, the first hydraulic valve can control its opening width in response to a pressure increase signal from the second pressure control signal, thereby controlling the output of the hydraulic pump.

[0136] The second hydraulic valve can respond to the pressure relief signal of the third pressure control signal to control the opening width, thereby controlling the speed at which the first ambient liquid flows out of the sealed chamber.

[0137] In step S340, the pressure balancing unit adjusts the pressure of the second ambient liquid according to the pressure of the first ambient liquid so that the pressure on the electronic components conforms to the preset third target pressure information.

[0138] According to the example embodiment, when the pressure of the first ambient liquid in the sealed chamber changes, the oil bladder expands and contracts in response to the pressure change of the first ambient liquid. Due to the incompressibility of the oil (second ambient liquid), the pressure inside the cavity remains in real-time balance with the pressure inside the sealed chamber. The pressure regulating unit can adjust the pressure of the first ambient liquid to a preset target pressure information, thereby, through the adjustment of the pressure balancing unit, ensuring that the pressure on the electronic components conforms to a preset third target pressure information.

[0139] In step S350, the temperature control device responds to the temperature control signal and controls the temperature of the electronic component so that the temperature of the electronic component conforms to the preset target temperature information.

[0140] According to the example embodiment, the temperature control device can control the heating, cooling or heat preservation of electronic components based on the temperature control signal, so that the temperature of the electronic components meets the preset target temperature information.

[0141] In step S300, temperature load and pressure load can be applied to the oil-filled electronic component at the same time, so that the oil-filled structure and sealing material of the oil-filled electronic component can be verified for structural reliability and material reliability under pressure-temperature cyclic impact.

[0142] After step S300, the electronic components can be removed and disassembled for analysis. Disassembly and analysis may include microscopic analysis of the electronic components, gas chromatography analysis, etc.

[0143] For example, oil-filled electronic components can be disassembled and analyzed. Material-level microscopic analysis (SEM / EDS) can be performed on the oil-filled structure and sealing materials. By observing the crack morphology of the sealing material (such as fluororubber) and analyzing the corrosion products on the surface of the metal parts (such as Cu2S → sulfur corrosion), the failure type of the oil-filled electronic components can be determined. Common failure modes include: circumferential cracks in the sealing ring, discharge marks on the winding surface, hardening and cracking of the fluororubber sealing ring at high temperature, and long-term electrochemical corrosion on the edge of the capacitor aluminum foil.

[0144] Oil-filled electronic components are classified for reliability based on material-level microscopic analysis results, with material compatibility as the screening criterion. For example, after accelerated aging under multi-stress (pressure-temperature) coupling, disassembly analysis revealed that the packaging materials / sealants / marking inks of electronic components reacted chemically with the oil-filling medium. Another example is the discovery of bubbles and partial discharges after accelerated aging under multi-stress (pressure-temperature) coupling. If residual bubbles remain during the oil-filling process, they will be severely compressed under external pressure, but their dielectric strength is far lower than that of oil and solid insulation. Under a high-voltage electric field, these bubbles will first undergo partial discharge; prolonged discharge will erode the insulating material, creating carbonization channels, ultimately leading to overall breakdown.

[0145] Gas chromatography (GC) analysis was performed on the oily material after disassembly of oil-filled electronic components. The oil-filled electronic components were classified for reliability based on the GC analysis results: the screening criterion was an oil acid value ≤ 0.1 mg KOH / g. If, after undergoing accelerated aging under multi-stress coupling, the disassembly analysis revealed an oil acid value > 0.1 mg KOH / g, the oil-filled electronic component was deemed unqualified.

[0146] The reliability of oil-filled electronic components is classified according to the compression ratio of the sealing ring: the sealing ring after being disassembled and subjected to accelerated aging under multi-stress coupling is compared with the standard specification. The screening threshold is deformation rate <= 20%. If the compression ratio of the sealing ring of the oil-filled electronic component after multi-stress coupling test is > 20%, the compression ratio test of the oil-filled electronic component is unqualified.

[0147] The technology of this application can also control the temperature inside the cavity in real time through a temperature control device, so as to achieve precise pressure control of electronic components and precise temperature control at the same time, and can perform precise control of electronic components with multi-stress coupling.

[0148] The technical solution of this application can test and screen for defects caused by the accelerated formation rate of metal electrode precipitates in oil-filled electronic components under the combined action of a high-voltage-temperature coupling field.

[0149] Optionally, the testing system may also include an electrical testing section. See also Figure 5 The test method 1000 also includes step S400. Step S400 can be executed simultaneously with step S100, step S200 or step S300.

[0150] In step S400, with the electronic component placed inside the cavity, the electrical testing unit tests the electrical parameters of the electronic component.

[0151] According to an example embodiment, the electrical testing unit can be a device for measuring the electrical parameters of oil-filled electronic components. The electrical testing unit can simultaneously test the electrical parameters of electronic components while applying a preset static pressure, a preset dynamic impact pressure, and a preset temperature and preset impact pressure.

[0152] For example, step S500 can be executed synchronously with step S200, and the electrical parameters (e.g., communication stability parameters) of the oil-filled electronic components are tested simultaneously while the oil-filled electronic components are subjected to a first preset number of preset dynamic impact pressures.

[0153] Optionally, the test system also includes an insulation test section. See [link to documentation]. Figure 5 The test method 1000 also includes step S500. Step S500 can be executed simultaneously with step S100, step S200 or step S300.

[0154] In step S500, with the electronic component placed inside the cavity, the insulation test section tests the insulation resistance parameter of the electronic component.

[0155] The insulation testing unit can simultaneously test the insulation resistance parameters of electronic components under preset static pressure, preset dynamic impact pressure, and preset temperature and preset impact pressure.

[0156] For example, step S500 can be executed synchronously with step S200, simultaneously testing the insulation resistance parameters of the oil-filled electronic components under a first preset number of preset dynamic impact pressures. A second reliability classification can be performed on the oil-filled electronic components based on changes in insulation resistance and electrical performance parameters: the insulation resistance screening threshold is 1 megohm. If the insulation resistance value of an oil-filled electronic component is <1 megohm, then the insulation performance of the electronic component is unqualified.

[0157] As an example, the testing method of this application is illustrated below using a batch of 130 oil-filled electronic components as an example. For example, the electronic components may include crystal oscillators, power modules, finished PCBs, ceramic capacitors, inductors, connector housings, and electrical connectors with sealing rings.

[0158] S1 Pretreatment and Vacuum Oil Injection Nitrogen gas was used to purge the cavity (-0.08MPa, 15min) to remove residual gas and ensure that the cavity cleanliness reached NAS5 level; insulating oil (model VG-100) was slowly injected at ≤1 / 3 of the rated flow rate, and zero-bubble filling was achieved by opening the exhaust port slightly (residual amount <0.01mL).

[0159] S2 Static Overpressure Sealing Verification The microcontroller controlled the proportional valve to step up the pressure to 132MPa (5MPa / min step). After holding the pressure for 12 hours, it was found that the ceramic structure of the crystal oscillator had been permanently deformed and could not start oscillating normally after being powered on. It was judged to be unqualified.

[0160] S3 Pressure Cyclic Shock Test Apply 5 cycles of dynamic load (pressure load changes can be as follows) Figure 10 As shown in the figure, among the electronic components in the same batch, the permeability of the sample inductor decreased and the dielectric constant of the sample ceramic capacitor changed, resulting in a change in capacitance.

[0161] S4 Multi-Stress Coupling Aging Test After pressure-temperature co-loading (the pressure load and temperature load can vary, as shown in...) Figure 10As shown in the figure, the plastic shell of the connector reacts chemically with the insulating oil, causing the plastic shell to swell and resulting in connector failure.

[0162] S5 sealing ring deformation rate test After pressure-temperature co-loading (the pressure load and temperature load can vary, as shown below) Figure 10 As shown), Figure 11 As shown, the sample sealing ring deformed by 26.5% (>10% threshold), and low-temperature cracks were observed in the fluororubber using SEM.

[0163] Using the aforementioned reliability testing method, the reliability classification of these 130 oil-filled electronic components resulted in the elimination of 5 failed components. This effectively identifies electronic components that may exhibit specific failure modes under high pressure in the deep sea.

[0164] Finally, it should be noted that the above description is merely a preferred embodiment of this application and is not intended to limit this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions of the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A system for testing the reliability of electronic components, characterized by include: Control Department; A sealed chamber containing a first ambient liquid; A dynamic pressure balancing device, detachably installed within the sealed chamber, includes: The cavity contains a secondary environment liquid; A pressure balancing section is fixedly connected to one side of the cavity; A pressure detection unit is connected to the sealed chamber and the control unit. When the electronic components are placed in the chamber, the pressure detection unit detects the current pressure information of the sealed chamber and transmits it to the control unit, so that the control unit generates a pressure control signal based on the current pressure information and the preset target pressure information. The pressure regulating unit is connected at one end to the control unit and at the other end to the sealed chamber. The pressure regulating unit responds to the pressure control signal and controls the pressure of the first ambient liquid in the sealed chamber. The pressure balancing unit adjusts the pressure of the second ambient liquid according to the pressure of the first ambient liquid, so that the pressure on the electronic component conforms to the preset target pressure information.

2. The test system of claim 1, wherein, The testing system also includes: A temperature control device, one end of which is connected to the cavity and the other end of which is connected to the control unit, detects the current temperature information of the cavity when the electronic components are placed in the cavity; The control unit generates a temperature control signal based on the current temperature information and the preset target temperature information; The temperature control device also responds to the temperature control signal to control the temperature of the cavity so that the temperature of the electronic components conforms to the preset target temperature information.

3. The test system of claim 1, wherein, The pressure regulating unit includes: A hydraulic pump is used to pump the first ambient liquid into the sealed chamber. A first hydraulic valve is connected to the control unit. The first hydraulic valve is connected to the sealed chamber and the hydraulic pump to control the flow channel between the hydraulic pump and the sealed chamber. The first hydraulic valve responds to a pressure boosting control signal from the control unit to control the flow rate of the first ambient liquid. The second hydraulic valve is connected at one end to the sealed chamber and at the other end to the control unit. The second hydraulic valve responds to the pressure relief control signal from the control unit to control the flow rate of the first ambient liquid.

4. The test system of claim 1, wherein, The pressure detection unit includes: The first pressure detection unit is located inside the sealed chamber to detect the current pressure information; The second pressure detection unit is connected to the sealed chamber to calibrate the current pressure information.

5. The test system of claim 1, wherein, The dynamic pressure balancing device also includes: A watertight connector is disposed on the other side of the cavity, and when the electronic component is placed in the cavity, the watertight connector is electrically connected to the electronic component; The watertight connecting cable has one end connected to the watertight connecting seat and the other end as an outlet.

6. The test system of claim 5, wherein, The dynamic pressure balancing device also includes: A sealing end cap is fixedly and sealed to the other side of the cavity, and the sealing end cap has a threaded hole. A handle is located on one side of the sealed end cap; A seal is detachably connected to a threaded hole to seal the threaded hole.

7. The test system of claim 5, wherein, The testing system also includes: The electrical testing section is connected to the lead-out end of the watertight connection cable to test the electrical parameters of the electronic components.

8. The testing system according to claim 5, characterized in that, The testing system also includes: An insulation testing section is connected to the lead-out end of the watertight connecting cable to test the insulation resistance parameters of the electronic components.

9. A reliability testing method for electronic components, characterized in that, The test method is executed by a test system, which includes a control unit, a dynamic pressure balancing device, a pressure detection unit, and a pressure regulation unit. The dynamic pressure balancing device includes a cavity and a pressure balancing unit. The testing method includes: Performing the step of applying a preset static pressure to electronic components includes: When the electronic components are placed inside the cavity, the pressure detection unit detects the first current pressure information of the sealed chamber; The control unit generates a first pressure control signal based on the first current pressure information and the preset first target pressure information; The pressure regulating unit responds to the first pressure control signal and controls the pressure of the first ambient liquid in the sealed chamber. The pressure balancing unit adjusts the pressure of the second ambient liquid according to the pressure of the first ambient liquid, so that the pressure on the electronic component meets the preset first target pressure.

10. The test method according to claim 9, characterized in that, The testing method also includes: The step of applying a preset dynamic impact pressure to the electronic component is performed according to a first preset quantity; The step of applying a preset dynamic impact pressure to the electronic component includes: When the electronic components are placed inside the cavity, the pressure detection unit detects the second current pressure information of the sealed chamber; The control unit generates a second pressure control signal based on the second current pressure information and the preset second target pressure information; The pressure regulating unit responds to the second pressure control signal and controls the pressure of the first ambient liquid in the sealed chamber; The pressure balancing unit adjusts the pressure of the second ambient liquid according to the pressure of the first ambient liquid, so that the pressure on the electronic component conforms to the preset second target pressure information.

11. The test method according to claim 9, characterized in that, The testing system also includes a temperature control device; The testing method also includes: The steps of applying a preset temperature and a preset impact pressure to the electronic components are performed according to the second preset quantity; The steps of applying a preset temperature and a preset impact pressure to the electronic component include: When the electronic components are placed inside the cavity, the pressure detection unit detects the third current pressure information of the sealed chamber, and the temperature control device detects the current temperature information of the dynamic pressure balancing device. The control unit generates a third pressure control signal based on the third current pressure information and the preset third target pressure information, and generates a temperature control signal based on the current temperature information and the preset target temperature information. The pressure regulating unit responds to the third pressure control signal and controls the pressure of the first ambient liquid in the sealed chamber. The pressure balancing unit adjusts the pressure of the second ambient liquid according to the pressure of the first ambient liquid, so that the pressure on the electronic component conforms to the preset third target pressure information. The temperature control device responds to the temperature control signal and controls the temperature of the electronic component so that the temperature of the electronic component conforms to the preset target temperature information.

12. The test method according to claim 10, characterized in that, The testing system also includes an electrical testing unit; The testing method also includes: When the electronic component is placed inside the cavity, the electrical testing unit tests the electrical parameters of the electronic component.

13. The test method according to claim 10, characterized in that, The testing system also includes an insulation testing unit; The testing method also includes: When the electronic component is placed inside the cavity, the insulation test section tests the insulation resistance parameter of the electronic component.

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