A high-density multi-channel Ku-band radio frequency channel integrated micro module

By integrating a high-density multi-channel Ku-band radio frequency channel into a micro-module and employing three-dimensional heterogeneous integration technology, the integration density and flexibility issues of relay communication radio frequency channels are solved, achieving high-density miniaturization, electromagnetic compatibility, and signal isolation, thereby improving the performance of UAV relay communication micro-systems.

CN121530459BActive Publication Date: 2026-05-12NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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Patent Information

Application Number
CN202610048941.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2026-01-15
Publication Date
2026-05-12
Estimated Expiration
2046-01-15

AI Technical Summary

Technical Problem

Existing relay communication radio frequency channels cannot meet the needs of UAV relay communication microsystems in terms of integration density and flexibility, and there are problems of high-frequency signal leakage and coupling interference between adjacent units.

Method used

It adopts a high-density multi-channel Ku-band RF channel integrated micro-module, and through three-dimensional heterogeneous integration technology, it includes silicon-based packaging of four-channel transceiver front-end IP, transceiver frequency conversion IP and local oscillator IP. Combined with 3D heterogeneous multi-functional chip and on-chip low impedance grounding loop design, it achieves electromagnetic compatibility and signal isolation.

Benefits of technology

It achieves integrated sixteen-channel transceiver, improving integration density and electromagnetic compatibility, reducing chip area and noise interference, and enhancing signal transmission efficiency and system performance.

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Abstract

The application discloses a high-density multi-channel Ku-band radio frequency channel integrated micro module, and belongs to the technical field of radio frequency micro systems. The micro module adopts a three-dimensional stacking architecture, and comprises a four-channel transceiving front end IP, a transceiving frequency conversion IP, a local oscillator source IP and a high-density integrated PCB substrate, and the three IPs are silicon-based packages; a received input signal enters the four-channel transceiving front end IP, is subjected to amplitude and phase control, is transmitted to the transceiving frequency conversion IP through the high-density integrated PCB substrate, is subjected to radio frequency frequency gating filtering, is mixed and frequency-converted to an intermediate frequency output. A transmitted input signal enters the transceiving frequency conversion IP, is subjected to frequency mixing and up-conversion, is subjected to radio frequency frequency gating filtering, is transmitted to the four-channel transceiving front end IP through the high-density integrated PCB substrate, is subjected to amplitude and phase control, and is amplified and output through a power amplifier chip. The application adopts a chip preset grounding ring, a silicon substrate independent cavity and an IP shielding cavity, and solves the complex electromagnetic compatibility problem during communication.
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