A polishing apparatus and a polishing method for a silicon carbide wafer

By designing an automated silicon carbide wafer polishing device, the automatic fixing and simultaneous polishing of both sides of the silicon carbide wafers were achieved, solving the problem of inconvenience caused by the need for manual flipping of traditional devices, and improving processing efficiency and stability.

CN121624973BActive Publication Date: 2026-04-28QINGDAO JINHUIYUAN ELECTRONICS CO LTD
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Patent Information

Application Number
CN202610148130.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2026-02-03
Publication Date
2026-04-28
Estimated Expiration
2046-02-03

AI Technical Summary

Technical Problem

Traditional silicon carbide wafer polishing equipment can only polish the bottom surface, requiring manual flipping, which is inconvenient and time-consuming, affecting processing efficiency.

Method used

A silicon carbide wafer polishing device was designed, comprising a support assembly and a clamping assembly. It utilizes a precision cylinder and an electric push rod to automatically fix and flip the silicon carbide wafer. Combined with the synchronous rotation of the polishing ring and the polishing disc, it achieves simultaneous polishing of both sides. The polishing slurry is treated by a spraying device and a filtration system.

Benefits of technology

It enables automated fixing and flipping of silicon carbide wafers, improves polishing efficiency, reduces manual operation time, ensures polishing uniformity and stability, and simplifies the loading and unloading process.

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Abstract

This invention relates to the field of silicon carbide wafer polishing technology, and discloses a silicon carbide wafer polishing apparatus and method, including a control cabinet. A transparent glass panel is fixedly connected to the surface of the control cabinet, and a cabinet door is hinged to the surface of the control cabinet. A drain valve is connected to the lower surface of the control cabinet, and a fixing component is installed inside the control cabinet. The fixing component includes a precision cylinder, the top of which is fixedly connected to the inner wall of the control cabinet, and a fixing ring is fixedly connected to the lower surface of the precision cylinder. The invention utilizes an electric actuator to push a protective frame upwards. As the protective frame moves, it pushes the polishing ring upwards, providing sufficient space between the polishing ring and the polishing disc for the operator to load and unload the silicon carbide wafer. The operator can then install the silicon carbide wafer inside the fixing component, using the fixing component to secure the silicon carbide wafer and improving the convenience of loading and unloading the silicon carbide wafer.
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