Piezoelectric driving device manufacturing method and piezoelectric driving device
By preparing piezoelectric ceramic slurry and designing alternating stacked functional regions of green ceramic strips, the miniaturization problem of array piezoelectric actuators was solved, achieving high integration and diverse array configurations, making them suitable for a wider range of engineering applications.
Patent Information
- Application Number
- CN202511765842.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-27
- Publication Date
- 2026-03-17
AI Technical Summary
Existing array piezoelectric actuators are difficult to miniaturize, which limits their promotion and use in space-constrained applications.
By employing processes such as preparing piezoelectric ceramic slurry, casting, laser drilling, lamination, cutting and sintering, a high-density array structure is formed. Combined with the design of alternating functional and non-functional green ceramic strips, the piezoelectric actuator is manufactured.
It achieves high integration and diverse array configuration design of piezoelectric actuators, reduces operating voltage requirements, and is applicable to a wider range of engineering fields.
Smart Images
Figure CN121692995A_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of piezoelectric actuator technology, and more specifically, relates to a method for manufacturing a piezoelectric actuator and a piezoelectric actuator. Background Technology
[0002] Existing array piezoelectric actuators typically consist of multiple independent piezoelectric actuator units arranged in a specific pattern to achieve collaborative operation or multi-degree-of-freedom control. These actuators are widely used in fields requiring high displacement accuracy and response speed, such as precision positioning, micro-displacement control, ultrasonic vibration, and optical focusing.
[0003] However, due to limitations imposed by material properties, structural design, and manufacturing processes, the size of individual piezoelectric actuators has approached the limits of miniaturization. When constructing array structures, to ensure performance consistency among driving units, reliability of electrical connections, and mechanical stability of the overall structure, it is often necessary to reserve certain gaps between units and configure corresponding wiring, support, and packaging structures. This further increases the size and complexity of the entire array actuator. Therefore, most current array piezoelectric actuators, while pursuing high performance and multifunctionality, struggle to achieve overall structural miniaturization, thus limiting their promotion and use in space-constrained applications, such as portable devices, microrobots, and implantable medical instruments. This size constraint not only affects the overall integration and design flexibility of the device but also, to some extent, restricts the application potential of piezoelectric drive technology in a wider range of engineering fields. Summary of the Invention
[0004] The purpose of this application is to provide a method for manufacturing a piezoelectric actuator and a piezoelectric actuator in order to solve the technical problem of difficulty in miniaturizing the overall structure in the prior art.
[0005] To achieve the above objectives, the technical solution adopted in this application is as follows: A method for manufacturing a piezoelectric actuator is provided, comprising the following steps: Prepare piezoelectric ceramic slurry and cast it to obtain a green ceramic tape of the first preset thickness; Drill holes in the green ceramic strip according to a set pattern; the drilled area is the electrode pre-reserved area. Inner electrodes are printed on the perforated green ceramic strip, and then the green ceramic strips are stacked layer by layer to the second preset thickness. The stacked green ceramic strips are pressed into a block green body through isostatic pressing. The piezoelectric driver chip unit is formed by cutting the piezoelectric green block into individual green blocks along the surface cutting lines, and then removing the glue and sintering the green blocks. The sintered piezoelectric driver chip unit is ground to the specified shape and size; Grooves are cut into the polished piezoelectric driver chip cells to form rectangular or ring arrays; Terminal electrodes are coated on the opposite two end faces of the piezoelectric driver chip cells that form an array; The piezoelectric actuator chip unit with coated end electrodes is soldered to the circuit board and electrically connected to the circuit board; Power is applied to the circuit board to polarize the piezoelectric driver chip unit; The polarized piezoelectric actuator is coated with insulating adhesive and then cured.
[0006] As a further improvement to the above technical solution: Optionally, the holes punched according to the set pattern include a first elongated hole and a second elongated hole that are parallel to each other and spaced apart, and the first elongated hole and the second elongated hole are alternately arranged in sequence along a first direction; One end of the first elongated hole intersects with the first side of the green ceramic belt, and the other end of the first elongated hole is spaced apart from the second side opposite to the first side. One end of the second elongated hole intersects with the second side, and the other end of the second elongated hole is spaced apart from the first side.
[0007] Optionally, the stacked green ceramic strips include functional area green ceramic strips and non-functional area green ceramic strips stacked alternately. The functional area green ceramic strips include a first elongated hole and a second elongated hole, and the non-functional area green ceramic strips include a first elongated hole or a second elongated hole. After the internal electrodes are printed, the internal electrodes located in the first elongated hole or the second elongated hole of the non-functional area green ceramic strip are electrically connected to the internal electrodes located in the corresponding first elongated hole or the second elongated hole of the functional area green ceramic strip.
[0008] Optionally, the interval between the first elongated hole and the second elongated hole on the green ceramic strip of the functional area is in the range of 50μm-60μm; The spacing between each of the first elongated holes or each of the second elongated holes on the non-functional green ceramic strip is in the range of 100μm-120μm.
[0009] Optionally, the holes punched according to the set pattern include first annular holes and second annular holes that are concentric and spaced apart. When there are multiple first annular holes and second annular holes, the first annular holes and second annular holes are alternately nested in the radial direction.
[0010] The stacked green ceramic strips include functional area green ceramic strips and non-functional area green ceramic strips stacked alternately. The functional area green ceramic strips include a first annular hole and a second annular hole, and the non-functional area green ceramic strips include either a first annular hole or a second annular hole. After the internal electrodes are printed, the internal electrodes located in the first annular hole or the second annular hole of the non-functional area green ceramic strip are electrically connected to the internal electrodes located in the corresponding first annular hole or the second annular hole of the functional area green ceramic strip.
[0011] Optionally, the radial spacing between the first annular hole and the second annular hole on the green ceramic belt of the functional area ranges from 50μm to 60μm; The radial spacing between each of the first annular holes or each of the second annular holes on the non-functional green ceramic belt ranges from 100μm to 120μm.
[0012] Optionally, the circuit board includes a pad portion and a flexible conductor portion. The pad portion corresponds to and is electrically connected to the rectangular or annular array after slotting on the piezoelectric driver chip unit. One end of the flexible conductor portion is connected to the pad portion, and the other end is used to connect to an external circuit.
[0013] Optionally, the thickness of the green body formed by pressing the stacked green ceramic strips using an isostatic pressing process ranges from 5mm to 12mm.
[0014] This application also provides a piezoelectric actuator, which is manufactured by the above-described method for manufacturing a piezoelectric actuator. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0016] Figure 1 A cross-sectional view of the first type of piezoelectric driver chip unit provided in this application; Figure 2 A schematic diagram of the circuit structure of the first type of circuit board provided in this application; Figure 3 A cross-sectional view of the second type of piezoelectric driver chip unit provided in this application; Figure 4 A schematic diagram of the circuit structure of the second type of circuit board provided in this application; The following are the labeling elements in the figure: 1. Piezoelectric driver chip unit; 2. Circuit board; 21. Solder pad section; 22. Flexible wire section. Detailed Implementation
[0017] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.
[0018] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0019] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.
[0020] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0021] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0022] Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of the present invention.
[0023] In the following description, suffixes such as "module," "part," "component," or "unit" are used only for the purpose of illustrative purposes and have no specific meaning in themselves. Therefore, they can be used interchangeably.
[0024] The present invention will now be described in further detail with reference to specific embodiments and accompanying drawings.
[0025] The d31 mode of piezoelectric actuators operates based on the transverse piezoelectric effect. Its electric field direction is perpendicular to the deformation direction, generating stretching vibrations in a direction parallel to the XY plane, thus exciting Lamb waves or horizontal shear waves. This type of wave mode is suitable for structural health monitoring, effectively identifying damage morphologies such as cracks, delamination, and corrosion within materials. Simultaneously, this mode combines driving and sensing functions, and can achieve multi-channel coordinated driving and vibration energy harvesting through array integration.
[0026] This application provides a method for manufacturing a d31 mode array piezoelectric actuator, specifically including the following steps: First, a slurry casting process is carried out, which involves preparing a piezoelectric ceramic slurry according to a preset formula and process parameters, and then forming it into a green ceramic tape with a first preset thickness through a casting process. Subsequently, laser drilling is performed, using a laser drilling machine to process through holes in the green ceramic strip according to a preset pattern. This through hole area is used for the subsequent placement of internal electrodes. Next, the printing and stacking process is carried out. The printing process is used to fill the internal electrode material on the perforated green ceramic strip. Then, the multi-layer green ceramic strips are stacked in a set order to the second preset thickness using a stacking equipment. Finally, the stacked structure is pressed into an integral green block using an isostatic pressing process. Then, the cutting, debinding and sintering stages are carried out. The piezoelectric driver chip unit is separated into independent green units along the preset cutting line, and then debinding is carried out and sintering is carried out in a high-temperature furnace. After sintering, the chip units are ground to achieve the specified shape and size accuracy. Subsequently, the array is cut and processed, and a rectangular or ring array structure is formed on the chip unit through a grooving process. It can be processed into piezoelectric drive arrays of different sizes such as 36 units, 64 units or 128 units according to actual needs. Next, silver coating and silver burning steps are performed. Silver paste is coated on the two opposite end faces of the array structure as end electrodes, and then sintered at a set temperature to solidify it. The chip unit with the terminal electrode processed is then soldered to the circuit board to achieve a reliable electrical connection; then a polarization voltage is applied to the soldered device to give the piezoelectric material the required piezoelectric properties. Finally, an insulating adhesive layer is coated on the device surface and cured to complete the overall encapsulation.
[0027] This manufacturing method enables high-density array processing, which helps improve device integration, reduce operating voltage requirements, and support diverse array configuration designs.
[0028] In one specific embodiment of this application, the pattern used in the laser drilling step includes multiple elongated through holes extending along a specific direction. Specifically, the pattern includes first and second elongated holes arranged parallel to each other and spaced apart, alternating sequentially along a first direction. One end of the first elongated hole extends to connect with a first side of the green ceramic tape, forming an open structure, while its other end terminates near a second side opposite to the first side, maintaining a predetermined distance from the second side. Correspondingly, one end of the second elongated hole extends to connect with the second side, while its other end terminates near the first side, spaced a certain distance from the first side. Through this alternating open and closed end structure design, a staggered internal electrode layout can be formed in the subsequent electrode printing process, laying a structural foundation for effective circuit connection and electric field distribution after multilayer lamination.
[0029] In one specific embodiment of this application, in the multilayer structure formed by the lamination process, the green ceramic tapes are divided into two types: functional green ceramic tapes and non-functional green ceramic tapes, which are alternately stacked during the lamination process. The functional green ceramic tapes are provided with both a first elongated hole and a second elongated hole; while the non-functional green ceramic tapes only contain one of the first or second elongated holes. After the internal electrode printing process is completed, the internal electrode located in the first or second elongated hole in the non-functional green ceramic tape will form an electrical connection with the corresponding internal electrode in the first or second elongated hole on the adjacent functional green ceramic tape. Through this alternating stacking and partitioned electrode design, a continuous and directionally distributed internal electrode pathway can be constructed in three-dimensional space, thereby achieving the desired effect after sintering. Figure 1 The square piezoelectric chip unit shown internally implements the application of electric field and polarization control in a specific direction, providing a structural basis for the driving and sensing functions of the final device in d31 mode.
[0030] In one specific embodiment of this application, the center-to-center distance between the first and second elongated holes on the functional area green ceramic strip is controlled within the range of 50 to 60 micrometers. This spacing design helps to form a dense and regular electrode distribution within a limited area, thereby ensuring that the piezoelectric unit has a uniform electric field distribution and reliable driving performance after polarization. On the non-functional area green ceramic strip, only a single type of elongated hole is arranged, and the center-to-center distance between adjacent elongated holes of the same type is set between 100 and 120 micrometers. This relatively loose interval can meet the requirements of structural strength and process forming, and can also form a complete three-dimensional internal electrode connection network together with the electrodes of the functional area green ceramic strip through alternating stacking with the non-functional area green ceramic strip.
[0031] In another specific embodiment of this application, the pattern used in the laser drilling step includes an annular through-hole structure. Specifically, the pattern includes a first annular hole and a second annular hole processed on the green ceramic tape, which are concentric rings spaced apart from each other. When a multi-ring array needs to be constructed, the first and second annular holes are arranged alternately and nested in the radial direction to form a concentric annular electrode layout expanding from the center to the periphery. This alternately nested annular hole structure is intended to facilitate subsequent fabrication such as... Figure 3 The ring array piezoelectric actuator shown lays the foundation for enabling it to generate the desired ring wave front under specific vibration modes.
[0032] In one specific embodiment of this application, the green ceramic tape used for the laminated structure is configured into two types: functional area green ceramic tape and non-functional area green ceramic tape, and the two are alternately stacked during the lamination process. The functional area green ceramic tape includes both a first annular hole and a second annular hole; while the non-functional area green ceramic tape includes only one of the first or second annular holes. After the internal electrode is filled using a printing process, the internal electrode located in the first or second annular hole of the non-functional area green ceramic tape will form an electrical connection with the corresponding internal electrode in the first or second annular hole on the adjacent functional area green ceramic tape. This alternating stacking and partitioned electrode configuration allows for the establishment of a radially alternating three-dimensional electrode network inside the finally sintered annular array piezoelectric device, thereby providing the structural possibility of applying radial or circumferential electric fields in the annular region to meet the functional requirements of generating specific vibration modes such as radial or circumferential vibration.
[0033] In one specific embodiment of this application, the radial spacing between the first and second annular holes on the functional green ceramic belt, i.e., the radial distance between two adjacent rings, is controlled within the range of 50 to 60 micrometers. This helps to form a high-density electrode distribution within the annular region, ensuring that the piezoelectric body can obtain a sufficiently strong driving electric field in the radial direction and achieve uniform strain output. Conversely, the non-functional green ceramic belt is equipped with only a single type of annular hole, and the radial spacing between two adjacent first annular holes or two adjacent second annular holes is set between 100 and 120 micrometers. This relatively large spacing not only allows for dimensional shrinkage during the stacking and sintering process of the green body, ensuring the dimensional accuracy and mechanical reliability of the structure after forming, but also, through alternating combinations with the functional green ceramic belts, constitutes a complete internal electrode system suitable for annular array structures.
[0034] like Figure 2 and Figure 4 As shown in a specific embodiment of this application, the circuit board used includes a pad portion and a flexible conductor portion. The pad portion establishes corresponding connections with each unit of the rectangular or ring array formed by slotting on the piezoelectric driver chip unit through a soldering process, thereby achieving reliable electrical interconnection. One end of the flexible conductor portion is integrated and connected to the pad portion, while the other end extends out, serving as the external electrical interface for the entire device, used to connect with external control circuits or signal processing systems. This circuit board design, which integrates rigid pads and flexible conductors, ensures the stability of the array unit electrode connection points and alleviates the stress caused by vibration or thermal expansion during device operation through the flexible portion, improving connection reliability and facilitating device installation and integration.
[0035] In one specific embodiment of this application, the thickness of the green block formed by pressing the stacked green ceramic strips by isostatic pressing ranges from 5mm to 12mm.
[0036] This application also provides a piezoelectric actuator, which is manufactured using the manufacturing method described in any of the foregoing embodiments. Since the device is integrally formed by the above method, it has a three-dimensional electrode connection structure formed by alternating layers of functional and non-functional green ceramic strips and filling with internal electrodes. Therefore, it inherits the various technical advantages brought by this method, such as high-density array integration, diverse array configuration capabilities, and lower operating voltage requirements.
[0037] In manufacturing the first piezoelectric actuator, a slurry casting process is first performed. Piezoelectric ceramic powder with a specific formulation is selected as raw material and prepared into a uniform slurry according to preset proportions and process parameters. This slurry is then cast into a green ceramic strip with a thickness between 10 and 20 micrometers using a casting process. Next, a laser drilling process is initiated, where laser drilling equipment precisely drills holes in the green ceramic strip. The width of the processed through-holes is controlled between 5 and 10 micrometers. Specifically, the green ceramic strip used in the functional areas is processed with interdigitated electrode patterns, with the center-to-center spacing between adjacent holes set to 50 to 60 micrometers. The green ceramic strip used in the non-functional areas is processed with corresponding patterns for electrode lead-out, with the center-to-center spacing between adjacent holes set to 100 to 120 micrometers.
[0038] Next, the printing and lamination process is performed. First, silver paste is printed onto the perforated green ceramic strips to form internal electrodes. The functional green ceramic strips form complete interdigitated electrode structures, while the non-functional green ceramic strips form corresponding lead-out electrode structures. After filling, the green ceramic strips are alternately laminated in the order of non-functional green ceramic strips, functional green ceramic strips, and non-functional green ceramic strips again. The total number of non-functional green ceramic strip layers is approximately 30 to 100, and the total number of functional green ceramic strip layers is approximately 400 to 1000. After lamination, the entire structure is pressed using an isostatic pressing process to form a dense block green body with a total thickness of approximately 5 to 12 millimeters.
[0039] The green body is then cut along pre-defined lines into individual green body units, each approximately 16 mm x 16 mm in size. After cutting, the green body enters the debinding and sintering stage. The green body is placed in a debinding furnace to remove the organic binder, and then transferred to a sintering furnace for high-temperature sintering. This allows the internal electrode silver material and the piezoelectric ceramic to be co-fired at high temperatures, ultimately forming a dense ceramic chip with a thickness of approximately 4.5 mm to 10 mm after sintering.
[0040] After sintering, the chip undergoes grinding, using precision grinding equipment to process its six surfaces to achieve the preset dimensional accuracy and surface flatness requirements. Next, a grooving process is performed, using a dicing machine to precisely cut grooves on the chip surface according to a preset pattern. This can be used to create a 36-unit rectangular array, or further fabricate array structures with 64, 128, or even more units, depending on the actual application requirements.
[0041] Next, the silver coating and burning steps are performed. Silver paste is coated onto the upper and lower main surfaces of the slotted array piezoelectric actuator as end electrodes, and sintering is carried out under specific temperature conditions to ensure a firm bond. Subsequently, soldering assembly is performed, where the pad areas of the specially designed rigid-flex circuit board are soldered to the corresponding silver layer electrodes on the actuator surface. Adjacent rigid circuit board areas are interconnected through flexible circuit sections. This design can effectively eliminate the stress effects on the circuit connections caused by vibration or deformation during product operation.
[0042] After welding, the device undergoes polarization treatment by placing it in insulating oil and applying a DC high-voltage electric field, causing the piezoelectric ceramic material to achieve directional polarization along a predetermined direction. Finally, it is insulated and encapsulated by spraying an insulating adhesive layer onto the entire polarized array piezoelectric driver and curing it, leaving only the terminal electrode lead-out areas intact, in order to achieve electrical insulation and environmental protection for the device.
[0043] In manufacturing the second type of piezoelectric actuator, the first step is a slurry casting process. Piezoelectric ceramic powder with a specific formulation is selected as raw material and prepared into a uniform slurry according to preset proportions and process parameters. This slurry is then cast into a green ceramic strip with a thickness between 10 and 20 micrometers using a casting process. Following this, a laser drilling process is performed, using laser drilling equipment to precisely drill holes in the green ceramic strip. The width of the processed through-holes is controlled between 5 and 10 micrometers. Specifically, the green ceramic strip used in the functional area is processed with a ring-shaped hole pattern, with the circumferential spacing between adjacent concentric ring channels set to 50 to 60 micrometers. The green ceramic strip used in the non-functional area is processed with a corresponding ring pattern for electrode lead-out, with the circumferential spacing between adjacent concentric ring channels set to 100 to 120 micrometers.
[0044] Next, the printing and lamination process is carried out. First, silver paste is printed and filled onto the perforated green ceramic strip to form internal electrodes. The functional green ceramic strips form a ring-shaped electrode structure, while the non-functional green ceramic strips form corresponding ring-shaped lead-out electrode structures. After filling, the green ceramic strips in the non-functional areas are alternately laminated in the following order: non-functional green ceramic strips, functional green ceramic strips, and non-functional green ceramic strips again. The total number of non-functional green ceramic strip layers is approximately 30 to 100, and the total number of functional green ceramic strip layers is approximately 400 to 1000. After lamination, the entire structure is pressed using an isostatic pressing process to form a dense cylindrical green block with a total thickness of approximately 5 to 12 millimeters.
[0045] The green body is then laser-cut, dividing it into individual green body units along a pre-defined path using laser thermal cutting technology. Each green body unit has a diameter of approximately φ16 mm. After cutting, the green body enters the debinding and sintering stage. The green body is placed in a debinding furnace to remove the organic binder, and then transferred to a sintering furnace for high-temperature sintering. This allows the internal electrode silver material and the piezoelectric ceramic to be co-fired at high temperatures, ultimately forming a dense ceramic chip with a thickness of approximately 4.5 mm to 10 mm after sintering.
[0046] After sintering, the chip undergoes grinding. Precision grinding equipment is used to process the upper and lower end faces of its cylinder to achieve the preset dimensional accuracy and parallelism requirements. Following this, a chamfering and rounding process is performed, using an external cylindrical grinder to refine the outer surface of the cylinder to achieve the specified diameter and roundness accuracy.
[0047] Next, a laser grooving process is carried out, in which a laser cutting machine is used to precisely cut and groove the chip surface according to a preset pattern. Depending on the actual application requirements, it can be processed into a 32-unit ring array, or further fabricated into an array structure with 40 units, 48 units or even more units.
[0048] The subsequent silver coating and firing steps involve coating the upper and lower end faces of the slotted array piezoelectric actuator with silver paste as end electrodes, and then sintering them at a specific temperature to ensure a firm bond. Next, soldering assembly is performed, where the pad areas of the specially designed array-type rigid-flex circuit board are soldered to the corresponding silver layer electrodes on the actuator surface. Adjacent rigid circuit board areas are interconnected via flexible circuitry; this design effectively eliminates the stress effects on the circuit connections caused by vibration or deformation during operation.
[0049] After welding, the device undergoes polarization treatment by placing it in silicone oil and applying a DC high-voltage electric field to directionally polarize the piezoelectric ceramic material along a predetermined direction. Finally, insulating encapsulation is performed by spraying an insulating adhesive layer onto the entire polarized array piezoelectric driver and curing it, leaving only the terminal electrode lead-out areas intact to achieve electrical insulation and protection for the device.
[0050] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A method of manufacturing a piezoelectric drive device, characterized by, The method comprises the following steps: preparing a piezoelectric ceramic slurry, and casting the slurry into a green ceramic tape with a first preset thickness; punching holes in the green ceramic tape according to a preset pattern, the punched holes being electrode reserved areas; printing inner electrodes on the green ceramic tape after the holes are punched, and stacking the green ceramic tape layer by layer to a second preset thickness; pressing the stacked green ceramic tape into a green compact by an isostatic pressing process; cutting the green compact into individual green compacts according to surface cutting lines, and then performing degreasing and sintering on the green compacts to sinter piezoelectric driver chip units; grinding the sintered piezoelectric driver chip units to a specified shape and size; slotting the ground piezoelectric driver chip units to form a rectangular or ring array; coating end electrodes on opposite end faces of the piezoelectric driver chip units of the array; soldering the piezoelectric driver chip units coated with the end electrodes to a circuit board, and forming an electrical connection between the piezoelectric driver chip units and the circuit board; polarizing the piezoelectric driver chip units (1) by supplying power to the circuit board; and solidifying and forming the polarized piezoelectric driver into a final product after coating the piezoelectric driver with insulating glue.
2. The method of manufacturing a piezoelectric drive device according to claim 1, wherein The holes punched according to the preset pattern include first long holes and second long holes arranged in parallel and spaced apart, and the first long holes and the second long holes are arranged alternately along a first direction. One end of the first long hole intersects a first side edge of the green ceramic tape, and the other end of the first long hole is arranged spaced apart from a second side edge opposite to the first side edge. One end of the second long hole intersects the second side edge, and the other end of the second long hole is arranged spaced apart from the first side edge.
3. The method of manufacturing a piezoelectric drive device according to claim 2, wherein The green ceramic tapes stacked layer by layer include functional area green ceramic tapes and non-functional area green ceramic tapes stacked alternately, the functional area green ceramic tapes include the first long holes and the second long holes, and the non-functional area green ceramic tapes include the first long holes or the second long holes; after the inner electrodes are printed, the inner electrodes in the first long holes or the second long holes of the non-functional area green ceramic tapes are electrically connected to the inner electrodes in the corresponding first long holes or the second long holes of the functional area green ceramic tapes.
4. The method of manufacturing a piezoelectric drive device according to claim 3, wherein The interval distance between the first long hole and the second long hole on the functional area green ceramic tape ranges from 50 μm to 60 μm. The interval distance between each first long hole or each second long hole on the non-functional area green ceramic tape ranges from 100 μm to 120 μm.
5. The method of manufacturing a piezoelectric drive device according to claim 1, wherein The holes punched according to the preset pattern include first ring holes and second ring holes arranged concentrically and spaced apart, and when the number of the first ring holes and the second ring holes is multiple, the first ring holes and the second ring holes are arranged alternately and nested along a radial direction.
6. The method of manufacturing a piezoelectric drive device according to claim 5, wherein The green ceramic tapes stacked layer by layer include functional area green ceramic tapes and non-functional area green ceramic tapes stacked alternately, the functional area green ceramic tapes include the first ring holes and the second ring holes, and the non-functional area green ceramic tapes include the first ring holes or the second ring holes; after the inner electrodes are printed, the inner electrodes in the first ring holes or the second ring holes of the non-functional area green ceramic tapes are electrically connected to the inner electrodes in the corresponding first ring holes or the second ring holes of the functional area green ceramic tapes.
7. The method of manufacturing a piezoelectric drive device according to claim 6, wherein The radial interval distance between the first ring hole and the second ring hole on the functional area green ceramic tape ranges from 50 μm to 60 μm. The radial interval distance between each of the first annular holes or each of the second annular holes on the non-functional area green ceramic tape ranges from 100 μm to 120 μm.
8. The method of manufacturing a piezoelectric drive device according to any one of claims 1 to 7, wherein The circuit board (2) comprises a pad portion (21) and a flexible lead portion (22), the pad portion (21) corresponds to the rectangular or annular array after slotting on the piezoelectric driver chip unit (1) and is electrically connected, one end of the flexible lead portion (22) is connected to the pad portion (21), and the other end is used for connecting with an external circuit.
9. The method of manufacturing a piezoelectric drive device according to any one of claims 1 to 7, wherein The thickness of the bar green body formed by pressing the laminated green ceramic tape through an isostatic pressing process ranges from 5 mm to 12 mm.
10. A piezoelectric drive device characterized by comprising: The piezoelectric driving device is manufactured by the method for manufacturing the piezoelectric driving device according to any one of claims 1 to 9.