Circuit package and electronic device

Abstract

The invention provides a circuit packaging part and electronic equipment. The circuit packaging part comprises a circuit board, a CPU, an adapter and a DDR SDRAM. The circuit board comprises a first surface and a second surface, and the first surface and the second surface are opposite in the first direction; the first surface is concavely provided with a first accommodating groove, and the second surface is concavely provided with a second accommodating groove; the first accommodating groove and the second accommodating groove are opposite and communicated in the first direction; the adapter is arranged in the first accommodating groove, the DDR SDRAM is arranged in the second accommodating groove, and the adapter and the DDR SDRAM are fixedly and electrically connected along the first direction; in the first direction, a part of the CPU is stacked on the first surface, and the CPU is fixedly and electrically connected with the circuit board; the other part of the CPU is opposite to the first containing groove, the other part of the CPU is stacked on the adapter, and the CPU is fixedly and electrically connected with the adapter. The circuit package is relatively low in thickness, relatively low in cost and relatively high in memory efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board packaging, in particular to a circuit package and an electronic device. BACKGROUND

[0002] With the increasing demand for lightness, thinness and miniaturization of electronic products, the functional requirements of electronic products are also increasing. However, the functional requirements and the lightness and thinness are in great conflict. One of the conflict points is the improvement of the memory frequency of the electronic product and the lightness and thinness design of the main circuit board. In the current electronic product, if the high memory frequency requirement of the electronic product is met, the thickness of the main circuit board is relatively thick, thereby affecting the lightness and thinness design of the electronic product.

[0003] At present, while improving the memory frequency of the electronic product, how to balance the lightness and thinness of the electronic product has become a problem to be solved in the industry. SUMMARY

[0004] The present application provides a circuit package and an electronic device, the thickness of the circuit package is relatively low, and the memory efficiency is relatively high.

[0005] The first aspect of the present application provides a circuit package, comprising: a circuit board, a central processing unit, an adapter and a double rate synchronous dynamic random access memory. The adapter can be LGA. The circuit package can be applied to an electronic device, and the circuit board can be the mainboard of the electronic device. The electronic device can include a keyboard, the keyboard is connected to the central processing unit, a user can operate the keyboard to generate an operation signal, and the central processing unit can process the operation signal.

[0006] The circuit board includes a first surface and a second surface, and the first surface and the second surface are opposite along a first direction. The first surface is recessed with a first accommodating groove, and the second surface is recessed with a second accommodating groove. The first accommodating groove and the second accommodating groove are opposite and connected along the first direction. The first direction is the thickness direction of the circuit package.

[0007] The adapter is arranged in the first accommodating groove, and the double rate synchronous dynamic random access memory is arranged in the second accommodating groove. The adapter and the double rate synchronous dynamic random access memory are fixedly connected and electrically connected along the first direction. A part of the central processing unit is laminated on the first surface along the first direction, and the central processing unit is fixedly connected and electrically connected with the circuit board. Another part of the central processing unit is opposite to the first accommodating groove, and the other part of the central processing unit is laminated on the adapter, and the central processing unit is fixedly connected and electrically connected with the adapter.

[0008] In the present application, the adapter is arranged in the first accommodating groove, and the double-rate synchronous dynamic random access memory is arranged in the second accommodating groove, that is, the adapter and the DDR SDRAM are both embedded in the circuit board. Compared with the scheme in the related art that the adapter and the double-rate synchronous dynamic random access memory are sequentially stacked on the surface of the circuit board, the thickness of the circuit package is greatly reduced, which is beneficial to the lightweight design of the electronic device.

[0009] In addition, in the present application, the central processing unit is connected with the adapter and the double-rate synchronous dynamic random access memory, and the signal of the central processing unit can be transmitted to the double-rate synchronous dynamic random access memory through the adapter. Compared with the related art that the signal of the central processing unit needs to be transmitted to the double-rate synchronous dynamic random access memory through the circuit board and the adapter, in the present application, the signal of the central processing unit can be transmitted to the double-rate synchronous dynamic random access memory without passing through the circuit board, which greatly improves the signal transmission rate.

[0010] In addition, in the present application, the double-rate synchronous dynamic random access memory is connected with the central processing unit through the adapter, and can not be limited by the density of the solder joints, so that a double-rate synchronous dynamic random access memory with a larger storage capacity can be selected, and a smaller number of double-rate synchronous dynamic random access memories can meet the demand for a larger storage capacity, thereby reducing the cost. For example, the storage capacity of two double-rate synchronous dynamic random access memories connected with the central processing unit through the adapter is approximately the same as the storage capacity of four double-rate synchronous dynamic random access memories directly connected with the circuit board in the related art.

[0011] In some embodiments, along the first direction, a first solder joint is arranged between the central processing unit and the adapter, and a second solder joint is arranged between the adapter and the double-rate synchronous dynamic random access memory. The central processing unit and the adapter are fixedly connected and electrically connected through the first solder joint. The adapter and the double-rate synchronous dynamic random access memory are fixedly connected and electrically connected through the second solder joint. The first solder joint is used to realize the fixed connection and electrical connection of the central processing unit and the adapter, without the need to arrange two components to realize the fixed connection and electrical connection respectively, thereby reducing the number of parts. The second solder joint is used to realize the fixed connection and electrical connection of the adapter and the double-rate synchronous dynamic random access memory, without the need to arrange two components to realize the fixed connection and electrical connection respectively, thereby reducing the number of parts.

[0012] In some embodiments, the signal of the central processing unit is transmitted to the double-rate synchronous dynamic random access memory through the first solder joint, the adapter and the second solder joint in sequence. Specifically, the signal of the central processing unit sequentially passes through the first solder joint, the circuit layer of the adapter, the second solder joint, and then is transmitted to the double-rate synchronous dynamic random access memory, without passing through the circuit layer of the circuit board in the transmission process, so that the transmission path of the signal is shorter, and the transmission rate of the signal can be improved.

[0013] In some embodiments, along the first direction, a first support is arranged between the central processor and the circuit board, a second support is arranged between the central processor and the adapter, and a third support is arranged between the adapter and the bottom surface of the first accommodating groove. Along the first direction, the second support and the third support at least partially overlap in the projection of the adapter.

[0014] The first support and the second support balance the central processor, and the third support makes the adapter flush with the surface of the double-rate synchronous dynamic random access memory and the first surface.

[0015] In some embodiments, the melting points of the first support, the second support and the third support are all greater than the melting point of the first solder joint, and the melting points of the first support, the second support and the third support are all greater than the melting point of the second solder joint. In this way, the first support, the second support and the third support can be prevented from melting during the soldering process.

[0016] In some embodiments, along the first direction, a first adhesive is arranged between the central processor and the circuit board, and between the central processor and the adapter. The first adhesive fills the gap between two adjacent first solder joints, fills the gap between two adjacent second solder joints, and fills the gap between an adjacent first solder joint and a second solder joint. The first adhesive can protect the first solder joint and prevent the first solder joint from breaking, thereby increasing the reliability of the connection between the central processor and the adapter.

[0017] In some embodiments, along the first direction, a third solder joint is arranged between the central processor and the circuit board, and the central processor and the circuit board are fixedly connected and electrically connected through the third solder joint. The first adhesive also fills the gap between two adjacent third solder joints. The first adhesive can protect the third solder joint and prevent the third solder joint from breaking, thereby increasing the reliability of the connection between the central processor and the circuit board.

[0018] In some embodiments, along the first direction, a second adhesive is arranged between the adapter and the double-rate synchronous dynamic random access memory, and the second adhesive fills the gap between two adjacent second solder joints. The second adhesive can protect the second solder joint and prevent the second solder joint from breaking, thereby increasing the reliability of the connection between the adapter and the double-rate synchronous dynamic random access memory.

[0019] In some embodiments, along the first direction, a fourth solder joint is arranged between the adapter and the bottom surface of the first accommodating groove, and the adapter and the bottom surface of the first accommodating groove are fixedly connected through the fourth solder joint. The fourth solder joint serves to fix the adapter and the circuit board, so that the adapter and the circuit board are reliably connected.

[0020] In some embodiments, a third adhesive is provided between the adapter and the bottom surface of the first receiving slot in the first direction, and the third adhesive fills the gap between the two adjacent fourth solder joints. The third adhesive can protect the fourth solder joints from breaking, thereby increasing the reliability of the connection between the adapter and the circuit board.

[0021] In some embodiments, a first gap is provided between the side surface of the adapter and the side surface of the first receiving slot. The circuit package further comprises a first shielding member fixed to the first surface and the surface of the adapter, and the first shielding member covers the first gap. The first shielding member can prevent signal leakage from the top surface of the DDR.

[0022] In some embodiments, the circuit package further comprises a second shielding member fixed to the second surface, and the second shielding member covers the opening of the second receiving slot. The second shielding member can prevent short circuit between the circuit package and the keyboard. That is, the second shielding member serves a dual purpose of preventing signal leakage from the DDR and preventing short circuit.

[0023] In some embodiments, the circuit package further comprises a third shielding member fixed to the first surface, and the third shielding member surrounds the CPU. The third shielding member has a footprint on the first surface that surrounds the footprint of the CPU on the first surface. The third shielding member can prevent signal leakage from the CPU.

[0024] In some embodiments, the circuit package further comprises a first reinforcing member fixed to the first surface, and the first reinforcing member surrounds the CPU and the adapter, and the first reinforcing member has a footprint on the first surface that surrounds the footprints of the CPU and the adapter on the first surface. The first reinforcing member can increase the structural strength of the circuit board, thereby preventing the structural strength of the circuit board from being reduced due to the provision of the first and second receiving slots.

[0025] In some embodiments, the circuit package further comprises a second reinforcing member fixed to the second surface, and the second reinforcing member covers the opening of the second receiving slot. The second reinforcing member can be laminated between the second surface of the circuit board and the second shielding member, and the second reinforcing member can be adhered or soldered to the second surface of the circuit board. Alternatively, the second reinforcing member can be laminated on the side of the second shielding member that faces away from the second surface of the circuit board. The second reinforcing member can increase the structural strength of the circuit board, thereby reducing the board-level strain of the circuit board.

[0026] The second aspect of the present application provides an electronic device comprising: a housing and any one of the circuit packages of the first aspect of the present application, wherein the circuit package is disposed inside the housing. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background art, the drawings needed to be used in the embodiments of the present application or the background art will be described below.

[0028] Figure 1 is a structural schematic diagram of an electronic device provided by an embodiment of the present application.

[0029] Figure 2 is a top view of a circuit package provided by an embodiment of the present application.

[0030] Figure 3 is a bottom view of the circuit package provided by an embodiment of the present application.

[0031] Figure 4 is a sectional view of the circuit package shown in Figure 2 .

[0032] Figure 5 is a partial structural schematic diagram of the sectional view of the circuit package shown in Figure 4 .

[0033] Figure 6 is a top view of a circuit package in the related art.

[0034] Figure 7 is a side view of the circuit package shown in Figure 6 .

[0035] Figure 8 is a sectional view of a circuit package provided by another embodiment of the present application.

[0036] Figure 9 is a partial structural schematic diagram of the sectional view of the circuit package shown in Figure 8 .

[0037] Figure 10 is a sectional view of a circuit package provided by yet another embodiment of the present application.

[0038] Figure 11 is a structural schematic diagram of a process of disposing a first adhesive and a second adhesive in a circuit package provided by yet another embodiment of the present application.

[0039] Figure 12 is a structural schematic diagram of a process of disposing a third adhesive in a circuit package provided by yet another embodiment of the present application.

[0040] Related art: 1-circuit package, 2-DDR SDRAM, 3-CPU, 4-circuit board, 5-adapter.

[0041] The application: 1000-electronic device, 1100-display screen, 1200-rotation mechanism, 1300-main body, 1310-housing, 1320-keyboard, 100-circuit package, 110-circuit board, 111-first surface, 112-second surface, 113-first accommodating groove, 114-second accommodating groove, 115-circuit layer, 116-insulating layer, 117-protective layer, 118-first gap, 119-second gap, 120-CPU, 130-DDR SDRAM, 140-adapter, 141-filter capacitor, 150-first shielding member, 151-second shielding member, 152-third shielding member, 160-heat dissipation member, 170-first welding spot, 171-second welding spot, 172-third welding spot, 173-fourth welding spot, 180-first supporting member, 181-second supporting member, 182-third supporting member, 190-first adhesive, 191-second adhesive, 192-third adhesive, 200-first reinforcing member, 210-second reinforcing member, 300-pressing hammer tool. DETAILED DESCRIPTION

[0042] The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0043] The embodiments of the present application provide an electronic device 1000, which includes but is not limited to a cellphone, a notebook computer, a tablet personal computer, a personal digital assistant, a wearable device, a mobile device, a desktop computer, etc. In some embodiments, the electronic device 1000 is taken as a notebook computer for example.

[0044] Please refer to Figure 1 , Figure 1 is a structural schematic diagram of the electronic device 1000 provided by the embodiments of the present application.

[0045] In the embodiments, the electronic device 1000 includes a display screen 1100, a rotation mechanism 1200 and a main body 1300, the display screen 1100 is connected with the main body 1300 through the rotation mechanism 1200, the display screen 1100 can be opened or closed relative to the main body 1300, when the display screen 1100 is opened relative to the main body 1300, the display screen 1100 forms a certain angle with the main body 1300, the electronic device 1000 can be used by a user, when the display screen 1100 is closed relative to the main body 1300, the electronic device 1000 is in a standby or shutdown state, so as to be conveniently stored.

[0046] In this embodiment, the display screen 1100 can be a flexible display screen or a rigid display screen, and the display screen can have a touch function. Specifically, the display screen 1100 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a quantum dot light-emitting diode (QLED) display screen, or the like.

[0047] The display screen 1100 includes a display surface and an appearance surface that are opposite to each other. When the display screen 1100 is closed relative to the main body 1300, the display surface is attached to the main body 1300, and the appearance surface is exposed to be in a visible state. When the display screen 1100 is opened relative to the main body 1300, the display surface is in a visible state, which is convenient for a user to observe and operate.

[0048] The rotating mechanism 1200 can be a hinge, which is connected between the display screen 1100 and the main body 1300, and is equivalent to a rotating structure between the display screen 1100 and the main body 1300, so as to realize relative free rotation and relative folding of the display screen 1100 and the main body 1300. Specifically, the rotating mechanism 1200 includes two connected hinges, one of which is connected to the display screen 1100, and the other of which is connected to the main body 1300. Alternatively, the rotating mechanism 1200 includes one hinge, which extends from one side of the electronic device 1000 to the other side. The rotating mechanism 1200 can also be two connected and relatively rotatable rotating shafts, one of which is rotatably connected to the display screen 1100, and the other of which is rotatably connected to the main body 1300, so as to realize relative rotation of the display screen 1100 and the main body 1300.

[0049] The main body 1300 includes a shell 1310, a keyboard 1320, and a circuit package 100. The keyboard 1320 is mounted on the shell 1310, and the keyboard 1320 is exposed relative to the shell 1310, so as to be convenient for a user to operate the keyboard 1320. The circuit package 100 is mounted in the interior of the shell 1310.

[0050] Reference Figure 2 and Figure 3 , Figure 2is a top view of the circuit package 100 provided by an embodiment of the present application, Figure 3 is a bottom view of the circuit package 100 provided by an embodiment of the present application. The circuit package 100 comprises a circuit board 110 and a first device disposed on the circuit board 110. The first device comprises a central processing unit (CPU) 120, a double data rate synchronous dynamic random access memory (DDR SDRAM) 130, an adapter 140, a first shielding member 150, a second shielding member 151, a third shielding member 152, and a heat dissipation member 160, etc. A keyboard 1320 is electrically connected to the CPU 120, and a user can operate the keyboard 1320 to generate an operation signal, which can be processed by the CPU 120. The keyboard 1320 can be a virtual keyboard of a touch screen type, or a mechanical keyboard.

[0051] The CPU 120 and the DDR SDRAM 130 are electrically connected through the adapter 140, which can be a land grid array (LGA). The CPU 120, the adapter 140, and the DDR SDRAM 130 are all in the shape of a rectangular plate, and in other embodiments, the CPU 120, the adapter 140, and the DDR SDRAM 130 can be in the shape of a triangle, an ellipse, or a circle, etc.

[0052] In this embodiment, there are two DDR SDRAMs 130. In other embodiments, there can be one, three, four, or five DDR SDRAMs 130, etc.

[0053] Reference Figure 4 , Figure 4 is Figure 2 is a sectional view of the circuit package shown in Figure 4 For ease of description, the thickness direction of the circuit package 100 is defined as the Z-axis direction, as shown in Figure 2 The terms "top", "bottom", "upper", "lower", etc. used in the description of the circuit package 100 are mainly based on the display orientation of the circuit package 100 in the accompanying drawings, and are described as "top" and "upper" towards the positive direction of the Z-axis, and "bottom" and "lower" towards the negative direction of the Z-axis, which does not limit the orientation of the circuit package 100 in the actual application scenario. In this application, the first direction refers to the Z-axis direction.

[0054] The circuit board 110 comprises a first surface 111 and a second surface 112, which are opposite along the Z-axis direction. The circuit board 110 is provided with a first accommodating groove 113 and a second accommodating groove 114, the first accommodating groove 113 is concave on the first surface 111. The first accommodating groove 113 is used for accommodating the adapter 140, and the shape of the first accommodating groove 113 is the same as that of the adapter 140.

[0055] The second accommodating groove 114 is concave on the second surface 112, and the second accommodating groove 114 penetrates the first groove bottom surface. The first accommodating groove 113 and the second accommodating groove 114 are opposite and communicate along the Z-axis direction. The second accommodating groove 114 is used for accommodating the DDR SDRAM 130, and the shape of the second accommodating groove 114 is the same as that of the DDR SDRAM 130.

[0056] The adapter 140 is arranged in the first accommodating groove 113, and the DDR SDRAM 130 is arranged in the second accommodating groove 114. Along the first direction, the adapter 140 and the DDR SDRAM 130 are fixedly connected and electrically connected. Part of the CPU 120 is laminated on the first surface 111 along the first direction. The CPU 120 is fixedly connected and electrically connected with the circuit board 110. Another part of the CPU 120 is opposite to the first accommodating groove 113, and the other part of the CPU 120 is laminated on the adapter 140. The CPU 120 is fixedly connected and electrically connected with the adapter 140. The part of the upper surface of the adapter 140 which is not laminated with the CPU 120 is provided with a filter capacitor.

[0057] Part of the CPU 120 is laminated on the first surface 111, and another part of the CPU 120 is laminated on the adapter. It means that the projection of the CPU 120 and the adapter 140 on the first surface 111 of the circuit board 110 at least partially coincides along the Z-axis direction.

[0058] Continuing to refer to Figure 4The first welding point 170 is arranged between the CPU 120 and the adapter 140, and in particular, the first welding point 170 is arranged between the lower surface of the CPU 120 and the upper surface of the adapter 140, and the lower surface of the CPU 120 and the upper surface of the adapter 140 are welded and fixed through the first welding point 170. The first welding point 170 can not only fixedly connect the CPU 120 and the adapter 140, but also electrically connect the CPU 120 and the adapter 140. That is, the first welding point 170 can be used as an electric connection line, so that the signal of the CPU 120 can be transmitted to the adapter 140 through the first welding point 170. The first welding point 170 is used to fixedly connect and electrically connect the CPU 120 and the adapter 140, and two components are not needed to respectively achieve the fixed connection and the electrical connection, so that the number of parts can be reduced.

[0059] The third welding point 172 is arranged between the lower surface of the CPU 120 and the first surface 111, and the lower surface of the CPU 120 and the first surface 111 are welded and fixed through the third welding point 172. The third welding point 172 can not only fixedly connect the CPU 120 and the circuit board 110, but also electrically connect the CPU 120 and the circuit board 110. That is, the third welding point 172 can be used as an electric connection line, so that the signal of the CPU 120 can be transmitted to the circuit board 110 through the third welding point 172. The third welding point 172 is used to fixedly connect and electrically connect the CPU 120 and the circuit board 110, and two components are not needed to respectively achieve the fixed connection and the electrical connection, so that the number of parts can be reduced.

[0060] Continuing to refer to Figure 4 The second welding point 171 is arranged between the adapter 140 and the DDR SDRAM 130. In particular, the second welding point 171 is arranged between the lower surface of the adapter 140 and the upper surface of the DDR SDRAM 130, and the lower surface of the adapter 140 and the upper surface of the DDR SDRAM 130 are welded and fixed through the second welding point 171. The second welding point 171 can not only reliably connect the adapter 140 and the DDR SDRAM 130, but also electrically connect the adapter 140 and the DDR SDRAM 130. That is, the second welding point 171 can be used as an electric connection line, so that the signal of the adapter 140 can be transmitted to the DDR SDRAM 130 through the second welding point 171. The second welding point 171 is used to fixedly connect and electrically connect the adapter 140 and the DDR SDRAM 130, and two components are not needed to respectively achieve the fixed connection and the electrical connection, so that the number of parts can be reduced.

[0061] The fourth soldering point 173 is provided between the lower surface of the adapter 140 and the bottom surface of the first slot, and the lower surface of the adapter 140 and the bottom surface of the first slot are fixed by the fourth soldering point 173. The fourth soldering point 173 can be a ground (GND) or a dummy pin, and the fourth soldering point 173 only serves a fixing function to reliably connect the adapter 140 and the circuit board 110.

[0062] The first soldering point 170 and the third soldering point 172 can be tin paste, and the first soldering point 170 and the third soldering point 172 can be formed by steel mesh printing tin. The second soldering point 171 and the fourth soldering point 173 can be formed by point coating tin paste by a tin spraying device.

[0063] In the Z-axis direction, the upper surface of the adapter 140 is flush with the first surface 111, the DDR is completely located in the second accommodating slot 114, and the lower surface of the DDR has a gap with the first surface 111. In other embodiments, the lower surface of the DDR can be flush with the first surface 111.

[0064] Continuing to refer to Figure 4 The first shielding member 150 can be a Mylar sheet made of aluminum foil. The first shielding member 150 is laminated to the first surface 111 and the upper surface of the adapter 140, and covers the first gap between the side surface of the adapter 140 and the slot side surface of the first accommodating slot 113. The first shielding member 150 can prevent signal leakage from the upper surface of the DDR. The first shielding member 150 can be bonded or soldered to the first surface 111 of the circuit board 110 and the upper surface of the adapter 140.

[0065] The second shielding member 151 can be a Mylar sheet made of aluminum foil. The second shielding member 151 is laminated to the second surface 112 of the circuit board 110 and covers the opening of the second accommodating slot 114. The second shielding member 151 can prevent signal leakage from the lower surface of the DDR SDRAM 130. The second shielding member 151 can be bonded or soldered to the second surface 112 of the circuit board 110. The second shielding member 151 covers the entire second surface 112, and the second shielding member 151 can prevent short circuiting between the circuit package 100 and the keyboard 1320. That is, the second shielding member 151 serves a dual function of preventing signal leakage of the DDR SDRAM 130 and preventing short circuiting.

[0066] The third shielding member 152 can be electrically conductive foam. The third shielding member 152 is disposed on the first surface 111 of the circuit board 110 and the upper surface of the adapter 140, and surrounds the CPU 120. In other words, the orthographic projection of the third shielding member 152 on the first surface 111 surrounds the orthographic projection of the CPU 120 on the first surface 111. The third shielding member 152 can prevent signal leakage of the CPU 120. The third shielding member 152 can be bonded to the first surface 111 of the circuit board 110 and the upper surface of the adapter 140.

[0067] With continued reference to Figure 4 , the heat dissipation member 160 is stacked on the upper surface of the CPU 120 along the Z-axis direction, and the heat dissipation member 160 is connected to the third shielding member 152. There is a gap between the heat dissipation member 160 and the upper surface of the CPU 120. The heat dissipation member 160 can be a heat pipe, and is used to dissipate heat of the CPU 120 to prevent the CPU 120 from overheating and being damaged.

[0068] In some embodiments, with reference to Figure 5 , Figure 5 is Figure 4 is a partial structural schematic diagram of a cross-sectional view of the circuit package 100 shown in FIG. 1. The circuit board 110 includes circuit layers 115, insulating layers 116, and protective layers 117. The circuit layers 115 can be copper layers, the insulating layers 116 can be made of polypropylene (PP), and the protective layers 117 can be green oil, which functions as a solder mask. Both the circuit layers 115 and the insulating layers 116 are multiple. Along the Z-axis direction, the insulating layers 116 and the circuit layers 115 are alternately stacked. The protective layers 117 are disposed on the topmost insulating layer 116 and the bottommost insulating layer 116. Specifically, the circuit board 110 includes 12 circuit layers 115, 13 insulating layers 116, and 2 protective layers 117. From top to bottom, the 12 circuit layers are a first circuit layer, a second circuit layer,..., and a twelfth circuit layer, and the 13 insulating layers are a first insulating layer, a second insulating layer,..., and a thirteenth insulating layer.

[0069] The first accommodating groove 113 penetrates the topmost protective layer 117, the first to sixth circuit layers, and the first to seventh insulating layers, and the upper surface of the eighth circuit layer is the groove bottom surface of the first accommodating groove 113. The second accommodating groove 114 penetrates the bottommost protective layer, the seventh to twelfth circuit layers, and the eighth to thirteenth insulating layers.

[0070] And, the thickness H1 of the circuit board 110 is about 1.17 mm, the thickness H2 of the adapter 140 is about 0.45 mm, the thickness H3 of the DDR SDRAM 130 is about 0.51 mm, the thickness H4 of the second solder joint 171 and the fourth solder joint 173 is about 0.2 mm, and the thickness H5 of the filter capacitor is about 0.35 mm. The height of the gap L1 between the lower surface of the DDR and the first surface 111 is about 0.06 mm.

[0071] In a related art, the DDR SDRAM 130 with a smaller solder joint pitch density and a higher rate is used, and the DDR SDRAM 130 is soldered to the upper surface of the circuit board 110 through the solder joint. However, the smaller solder joint pitch density means that the storage capacity of the DDR SDRAM 130 is smaller. In order to meet the demand for storage capacity, four or more DDR SDRAMs 130 need to be arranged to meet the demand for storage capacity. The demand for the number of DDR SDRAMs 130 increases, resulting in a higher cost of the electronic device 1000.

[0072] To solve the above problems, with reference to Figure 6 and Figure 7 , Figure 6 is a top view of the circuit package 1 in the related art, Figure 7 is Figure 6 a side view of the circuit package 1 shown in FIG. 1. In the related art, the DDR SDRAM 2 with a larger solder joint pitch density, a larger storage capacity, and a higher rate is used. At this time, two DDR SDRAMs 2 are needed to meet the demand for storage capacity. However, this type of DDR SDRAM 2 cannot be directly soldered and fixed to the circuit board 4 due to the line limitation of the circuit board 4. Instead, the adapter 5 is needed to be electrically connected to the circuit board 4.

[0073] Specifically, in the related art, the CPU 3 and the adapter 5 are both fixed to the upper surface of the circuit board 4 through solder joints, and the CPU 3 and the adapter 5 are spaced apart from each other, and the DDR SDRAM 2 is fixed to the upper surface of the adapter 5 through solder joints. In this technical solution, the solder joints between the adapter 5 and the circuit board 4, the adapter 5, the solder joints between the adapter 5 and the DDR SDRAM 2, and the DDR SDRAM 2 are sequentially stacked on the upper surface of the circuit board 4, the thickness of the solder joints between the adapter 5 and the circuit board 4 is 0.2 mm, the thickness of the adapter 5 is 0.45 mm, the thickness of the solder joints between the adapter 5 and the DDR SDRAM 2 is 0.15 mm, and the thickness of the DDR SDRAM 2 is 0.56 mm. The total height from the upper surface of the DDR SDRAM 2 to the upper surface of the circuit board 4 is 0.2+0.45+0.15+0.56=1.36 mm. This results in a relatively thick thickness of the circuit package 1, which is not conducive to the thin and light design of the electronic device 1000.

[0074] In addition, in the related art, the DDR signal of the CPU 3 sequentially passes through the solder joints between the CPU 3 and the circuit board 4, the circuit layer of the circuit board 4, the solder joints between the adapter 5 and the circuit board 4, the circuit layer of the adapter 5, and the circuit layer between the adapter 5 and the DDR SDRAM 2, and is finally transmitted to the DDR SDRAM 2. Moreover, the DDR signal of the CPU 3 needs to pass through about four layers of circuit layers of the circuit board 4 for transmission, and this transmission path causes the rate of signal transmission to decrease.

[0075] In the embodiment, the adapter 140 and the DDR SDRAM 130 are embedded in the circuit board 110, and only the filter capacitor on the adapter 140 protrudes relative to the upper surface of the circuit board 110, and the thickness of the filter capacitor is 0.35 mm. Therefore, compared with the above-mentioned related art, the thickness of the circuit package 100 in the embodiment is 1.36-0.35=1.01 mm. In other words, in the embodiment, the thickness of the circuit package 100 is reduced, which is conducive to the thinning of the entire electronic device 1000.

[0076] Furthermore, in this embodiment, the DDR signal from the CPU 120 sequentially passes through the first solder joint 170, the circuit layer of the adapter 140, and the second solder joint 171 before being transmitted to the DDR SDRAM 130. Therefore, in this embodiment, the DDR signal does not need to pass through the circuit layer of the circuit board 110 to reach the DDR SDRAM 130, thus significantly improving the signal transmission rate to 8400 megabits per second (MT / s). Moreover, in this embodiment, the DDR SDRAM 130 is connected to the CPU 120 via the adapter 140, which is not limited by solder joint density. This allows for the selection of DDR SDRAM 130s with larger storage capacities, and a smaller number of DDR SDRAM 130s can meet the larger storage capacity requirements, reducing costs. For example, the storage capacity of two DDR SDRAM 130s connected to the CPU 120 via the adapter 140 is approximately the same as the storage capacity of four DDR SDRAMs directly connected to the circuit board in related technologies.

[0077] refer to Figure 8 and Figure 9 , Figure 8 This is a cross-sectional view of the circuit package 100 provided in other embodiments of this application. Figure 9 yes Figure 8 A partial structural schematic diagram of a cross-sectional view of the circuit package 100 shown. Figure 8 and Figure 9 In the circuit package 100 shown, a first support member 180 is provided between the lower surface of the CPU 120 and the first surface 111 of the circuit board 110, and a second support member 181 is provided between the lower surface of the CPU 120 and the upper surface of the adapter 140. Specifically, the CPU 120 is rectangular, therefore the lower surface of the CPU 120 has four corner areas. The first support member 180 is provided between two of these corner areas and the first surface 111 of the circuit board 110, and the second support member 181 is provided between the other two corner areas and the upper surface of the adapter 140. Both the first support member 180 and the second support member 181 can be copper balls, and both can have a thickness of 0.25 mm. In other embodiments, the first support member 180 and the second support member 181 can also be steel balls, and their shapes can be cuboids, ellipsoids, triangular prisms, or other shapes.

[0078] A third support member 182 is provided between the lower surface of the adapter 140 and the bottom surface of the first receiving groove 113. The third support member 182 can be made of nickel silver and is in the shape of a rectangular thin sheet. There can be multiple third support members 182, where "multiple" means two or more. The thickness of the third support member 182 is the same as the thickness of the second welding point 171, and the thickness of the third support member 182 can be 0.2 mm. In other embodiments, the third support member 182 can be made of materials such as copper or steel, and the shape of the third support member 182 can be spherical, ellipsoidal, or triangular, or other shapes. There can also be only one third support member 182.

[0079] Along the Z-axis, the projections of a portion of the first support member 180 and a portion of the third support member 182 onto the upper surface of the adapter 140 at least partially overlap. Specifically, the two first support members 180 located on the right side of the lower surface of the CPU 120 respectively form two first projections on the upper surface of the adapter 140, and the two third support members 182 respectively form two second projections on the upper surface of the adapter 140, with the two second projections respectively covering the two first projections.

[0080] The third support 182 prevents a break between the adapter 140 and the circuit board 110, ensuring that the upper surface of the adapter 140 is flush with the first surface 111 of the circuit board 110. The first support 180 and the third support 182 ensure the balance of the CPU 120 and prevent the CPU 120 from tilting.

[0081] If the CPU 120 is tilted, a cold solder joint may occur at the higher end of the CPU 120 when soldering it to the circuit board 110. This cold solder joint can cause an open circuit between the components on the CPU 120 and the circuit board 110. At the lower end of the CPU 120, adjacent solder paste may stick together, leading to a short circuit between two components on the CPU 120. In this embodiment, the CPU 120 is not tilted, avoiding open circuits and short circuits, thus improving the reliability of the CPU 120.

[0082] When assembling the circuit package 100, after the DDR SDRAM 130, adapter 140, CPU 120, first solder joint 170, second solder joint 171, third solder joint 172 and fourth solder joint 173 are all arranged, the upper surface of the CPU 120 is pressed together using a pressure hammer fixture 300. Along the Z-axis direction, the contact point between the pressure hammer fixture 300 and the upper surface of the CPU 120 is opposite to the first support member 180. That is, the orthographic projection of the first support member 180 on the upper surface of the CPU 120 is located in the area where the upper surface of the CPU 120 contacts the pressure hammer fixture 300. Then, a force of 10 Newtons (N) is applied to the CPU 120 by the pressure hammer fixture 300 to ensure that there is no gap between the adapter 140 and the circuit board 110, and to ensure the balance of the CPU 120.

[0083] Then, welding begins. Specifically, the first solder joint 170, the second solder joint 171, the third solder joint 172, and the fourth solder joint 173 are heated so that they melt and then cool, allowing them to connect to the corresponding components. Throughout the welding process, the pressure hammer fixture 300 continuously applies force to the CPU 120 to ensure that after welding, the upper surface of the adapter 140 is flush with the first surface 111 of the circuit board 110, and that the CPU 120 remains balanced and does not tilt.

[0084] It is understood that the melting point of the first support member 180 is higher than that of the first weld point 170, the second weld point 171, the third weld point 172, and the fourth weld point 173. The melting point of the second support member 181 is higher than that of the first weld point 170, the second weld point 171, the third weld point 172, and the fourth weld point 173, and the melting point of the third support member 182 is higher than that of the first weld point 170, the second weld point 171, the third weld point 172, and the fourth weld point 173, in order to prevent the first support member 180, the second support member 181, and the third support member 182 from melting during the welding process.

[0085] refer to Figure 10 , Figure 10This is a cross-sectional view of the circuit package 100 provided in some embodiments of this application. Along the Z-axis, a first adhesive 190 is provided between the CPU 120 and the circuit board 110, and between the CPU 120 and the adapter 140. Specifically, the first adhesive 190 is provided between the lower surface of the CPU 120 and the first surface 111, and between the lower surface of the CPU 120 and the upper surface of the adapter 140. The first adhesive 190 fills the gaps between two adjacent first solder joints 170, the gaps between two adjacent third solder joints 172, and the gaps between adjacent first solder joints 170 and third solder joints 172. Since the junction temperature wall of the CPU 120 is 105 degrees Celsius, the first adhesive 190 needs to be an adhesive with a low coefficient of thermal expansion to prevent stress cracking of the solder joints. The first adhesive 190 can be an underfill adhesive. The first adhesive 190 can protect the first solder joint 170 and the third solder joint 172, prevent the first solder joint 170 and the third solder joint 172 from breaking, thereby increasing the reliability of the connection between the CPU 120 and the circuit board 110, and increasing the reliability of the connection between the CPU 120 and the adapter 140.

[0086] In this embodiment, a first adhesive 190 is provided in part or all of the area between the CPU 120 and the circuit board 110. A first adhesive 190 is also provided in part or all of the area between the CPU 120 and the adapter 140.

[0087] refer to Figure 11 , Figure 11 This is a schematic diagram illustrating the process of applying a first adhesive 190 and a second adhesive 191 to the circuit package 100 provided in some embodiments of this application. When applying the first adhesive 190, liquid adhesive can be placed from any three sides around the CPU 120, such as... Figure 11 As shown by the solid arrow, the liquid adhesive can flow between the lower surface of CPU 120 and the first surface 111, and between the lower surface of CPU 120 and the upper surface of adapter 140.

[0088] refer to Figure 10 Along the Z-axis, a second adhesive 191 is provided between the adapter 140 and the DDR SDRAM 130. Specifically, the second adhesive 191 is provided between the lower surface of the adapter 140 and the upper surface of the DDR SDRAM 130, filling the gap between two adjacent second solder joints 171. The second adhesive 191 can protect the second solder joints 171, preventing them from breaking, thereby increasing the reliability of the connection between the adapter 140 and the DDR SDRAM 130. Specifically, a second gap 119 is provided between the side of the DDR SDRAM 130 and the side of the second receiving groove 114, allowing liquid adhesive to be placed into the three sides of the second gap 119, such as...Figure 11 As shown by the dashed arrow, liquid adhesive flows between the lower surface of the adapter 140 and the upper surface of the DDR SDRAM 130 to form a second adhesive 191. It can be understood that the second adhesive 191 can also be provided within the second gap 119 to further increase the reliability of the connection between the adapter 140 and the DDR SDRAM 130.

[0089] In this embodiment, because the DDR SDRAM 130 is relatively small, the second adhesive 191 can be applied to the four corner areas between the lower surface of the adapter 140 and the upper surface of the DDR SDRAM 130. In other embodiments, the second adhesive 191 is applied to the entire area between the lower surface of the adapter 140 and the upper surface of the DDR SDRAM 130 to increase the bonding stability of the DDR SDRAM 130.

[0090] refer to Figure 10 Along the Z-axis, a third adhesive 192 is provided between the adapter 140 and the bottom surface of the first receiving groove 113. Specifically, the third adhesive 192 is provided between the lower surface of the adapter 140 and the bottom surface of the first receiving groove 113, and fills the gap between two adjacent fourth solder points 173. The third adhesive 192 can protect the fourth solder points 173, prevent the fourth solder points 173 from breaking, and thus increase the reliability of the connection between the adapter 140 and the circuit board 110. The third adhesive 192 can be an edge bond or a UV adhesive.

[0091] In this embodiment, the entire area between the lower surface of the adapter 140 and the bottom surface of the first receiving groove 113 is provided with a third adhesive 192. Specifically, refer to... Figure 12 , Figure 12 This is a schematic diagram of the process structure for setting the third adhesive 192 in the circuit package 100 according to some embodiments of this application. A first gap 118 is provided between the side of the adapter 140 and the side of the first receiving groove 113, into which liquid adhesive can be placed, such as... Figure 12 As shown by the solid lines, liquid adhesive flows between the lower surface of the adapter 140 and the bottom surface of the first receiving groove 113 to form a third adhesive 192. It is understood that the third adhesive 192 can also be provided within the first gap 118 to further increase the reliability of the connection between the adapter 140 and the circuit board 110. In other embodiments, for example, the third adhesive 192 can be provided in the four corner areas.

[0092] refer to Figure 10 and Figure 11The first surface 111 of the circuit board 110 is further provided with a first reinforcing member 200, which can be made of steel sheet. The first reinforcing member 200 is a closed rectangular ring, surrounding the CPU 120 and the adapter 140. Here, surrounding means that the projections of the CPU 120 and the adapter 140 on the first surface 111 are completely within the range of the first reinforcing member 200. In other embodiments, the first reinforcing member 200 can be other shapes such as a circular ring. The first reinforcing member 200 can also be a non-closed ring. Specifically, the first reinforcing member 200 can include multiple reinforcing segments arranged in a ring at intervals to surround the CPU 120 and the adapter 140. The first reinforcing member 200 can be welded or bonded to the circuit board 110. The first reinforcing member 200 can increase the structural strength of the circuit board 110 and prevent the strength of the circuit board 110 from decreasing due to the setting of the first receiving groove 113 and the second receiving groove 114.

[0093] refer to Figure 10 and Figure 12 The second surface 112 of the circuit board 110 is further provided with a second reinforcing member 210, which covers the opening of the second receiving groove 114. The second reinforcing member 210 can be made of steel sheet. The second reinforcing member 210 can increase the structural strength of the circuit board 110 and reduce the board-level strain of the circuit board 110.

[0094] Figure 10 The circuit package shown may also include a second shield, wherein a second reinforcement 210 is stacked between the second surface 112 of the circuit board 110 and the second shield 151, and the second reinforcement 210 may be bonded or soldered to the second surface 112 of the circuit board 110. In other embodiments, the second reinforcement 210 may also be stacked on the side of the second shield 151 opposite to the second surface 112 of the circuit board 110.

[0095] The above are merely some embodiments and implementation methods of this application. The scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A circuit package, characterized in that, include: Circuit board, central processing unit, adapter, and double-rate synchronous dynamic random access memory; The circuit board includes a first surface and a second surface, which are opposite to each other along a first direction; the first surface is recessed with a first receiving groove, and the second surface is recessed with a second receiving groove. Along the first direction, the first receiving groove and the second receiving groove are opposite to each other and connected; the first direction is the thickness direction of the circuit package. The adapter is disposed in the first receiving slot, and the Double Data Rate Synchronous Dynamic Random Access Memory (DRAM) is disposed in the second receiving slot. Along the first direction, the adapter and the DRAM are fixedly connected and electrically connected. Along the first direction, a portion of the central processing unit (CPU) is stacked on the first surface, and the CPU is fixedly connected and electrically connected to the circuit board. Another portion of the CPU is opposite to the first receiving slot, and the other portion of the CPU is stacked on the adapter. The CPU is fixedly connected and electrically connected to the adapter.

2. The circuit package according to claim 1, characterized in that, Along the first direction, a first solder joint is provided between the central processing unit and the adapter, and a second solder joint is provided between the adapter and the double data rate synchronous dynamic random access memory; the central processing unit and the adapter are fixedly connected and electrically connected through the first solder joint; the adapter and the double data rate synchronous dynamic random access memory are fixedly connected and electrically connected through the second solder joint.

3. The circuit package according to claim 2, characterized in that, The signals from the central processing unit are transmitted sequentially through the first solder joint, the adapter, and the second solder joint to the double-rate synchronous dynamic random access memory.

4. The circuit package according to claim 2, characterized in that, Along the first direction, a first support member is provided between the central processing unit and the circuit board, a second support member is provided between the central processing unit and the adapter, and a third support member is provided between the adapter and the bottom surface of the first receiving slot; along the first direction, the projection of the second support member onto the adapter and the projection of the third support member onto the adapter at least partially overlap. The first and second supports keep the central processing unit balanced, and the third support makes the adapter flush with the first surface, away from the surface of the double-rate synchronous dynamic random access memory.

5. The circuit package according to claim 4, characterized in that, The melting points of the first support member, the second support member, and the third support member are all greater than the melting point of the first weld point.

6. The circuit package according to claim 2, characterized in that, Along the first direction, a first adhesive is provided between the central processing unit and the circuit board, and between the central processing unit and the adapter. The first adhesive fills the gap between two adjacent first solder joints, the first adhesive fills the gap between two adjacent second solder joints, and the first adhesive fills the gap between adjacent first solder joints and second solder joints.

7. The circuit package according to claim 6, characterized in that, Along the first direction, a third solder joint is provided between the central processing unit and the circuit board, and the central processing unit and the circuit board are fixedly connected and electrically connected through the third solder joint; the first adhesive also fills the gap between two adjacent third solder joints.

8. The circuit package according to claim 2, characterized in that, Along the first direction, a second adhesive is provided between the adapter and the double rate synchronous dynamic random access memory, the second adhesive filling the gap between two adjacent second solder joints.

9. The circuit package according to any one of claims 1 to 8, characterized in that, Along the first direction, a fourth welding point is provided between the adapter and the bottom surface of the first receiving groove, and the adapter and the bottom surface of the first receiving groove are fixedly connected by the fourth welding point.

10. The circuit package according to claim 9, characterized in that, Along the first direction, a third adhesive is provided between the adapter and the bottom surface of the first receiving groove, and the third adhesive fills the gap between two adjacent fourth welding points.

11. The circuit package according to any one of claims 1 to 8, characterized in that, A first gap exists between the side of the adapter and the side of the first receiving groove; the circuit package further includes a first shield, which is fixed to the first surface and the surface of the adapter, and covers the first gap.

12. The circuit package according to any one of claims 1 to 8, characterized in that, The circuit package further includes a second shield, which is fixed to the second surface and covers the opening of the second receiving groove.

13. The circuit package according to any one of claims 1 to 8, characterized in that, The circuit package further includes a third shielding element, which is fixed to the first surface, and the orthographic projection of the third shielding element on the first surface surrounds the orthographic projection of the central processing unit on the first surface.

14. The circuit package according to any one of claims 1 to 8, characterized in that, The circuit package further includes a first reinforcing member, which is fixed to the first surface, and the orthographic projection of the first reinforcing member on the first surface surrounds the orthographic projections of the central processing unit and the adapter on the first surface.

15. The circuit package according to any one of claims 1 to 8, characterized in that, The circuit package further includes a second reinforcing member, which is fixed to the second surface and covers the opening of the second receiving groove.

16. An electronic device, characterized in that, include: The housing and the circuit package according to any one of claims 1 to 15, wherein the circuit package is disposed inside the housing.

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