Power dividing connector and communication equipment

Abstract

The invention relates to the technical field of wireless communication, in particular to a power dividing connector and communication equipment. The power dividing connector comprises an outer conductor which is provided with a hollow accommodating cavity; the inner conductor is arranged in the accommodating cavity, the inner conductor and the outer conductor are arranged at an interval, and gas is adopted between the inner conductor and the outer conductor as a medium; the inner conductor is provided with an input port and one or more output ports, the input port and the one or more output ports extend out of the containing cavity, and the output ports are arranged at intervals. According to the invention, low-loss transmission and power division functions can be realized.

Description

Technical Field

[0001] This application relates to the field of wireless communication technology, and in particular to a power divider connector and communication equipment. Background Technology

[0002] Base stations typically include components such as power dividers, antennas, and circuit boards. Among them, the power divider (also known as a power splitter) is responsible for distributing and combining the power of radio frequency or microwave signals.

[0003] Existing base stations often employ a Multiple Input Multiple Output (MIMO) scheme, which connects the antenna to a Hybrid Beamforming (HBF) system and uses microstrip line routing within the HBF system to implement the power divider function. Two important parameters of the power divider are loss and isolation.

[0004] However, on the one hand, microstrip lines have long trace lengths and large power supply network losses; on the other hand, microstrip power dividers are printed on printed circuit boards (PCBs), and due to the limited trace space on PCBs, there are coupling effects between microstrip lines, making it difficult to achieve the required isolation. Summary of the Invention

[0005] This application provides a power divider connector and a communication device. The power divider connector has an outer conductor and an inner conductor, which together form an air-like coaxial structure. This enables the power divider connector of this application to achieve power dividing function and has low power loss and high isolation when assembled with the circuit board of the communication device. The application is described below from multiple aspects, and the embodiments and beneficial effects of these aspects can be referred to each other.

[0006] The first aspect of this application provides a power divider connector. Specifically, the power divider connector includes: an outer conductor having a hollow receiving cavity;

[0007] An inner conductor is located within a cavity, and the inner conductor and outer conductor are spaced apart, with gas serving as the medium between the inner conductor and the outer conductor.

[0008] The inner conductor has an input port and one or more output ports, which extend out of the receiving cavity, wherein the multiple output ports are spaced apart.

[0009] Using the above technical solution, the power divider connector of this application embodiment has an outer conductor and an inner conductor, wherein the inner conductor has an input port and one or more output ports. Therefore, when the power divider connector is assembled on the circuit board of a communication device (described later), the input port of the inner conductor can receive one input signal energy from the circuit board and can output one output signal energy through one output port, or output multiple output signal energy through multiple output ports, to achieve the power dividing function. Exemplarily, the power divider connector of this application embodiment is assembled with the circuit board of a communication device using a tooling fixture (e.g., an automatic placement machine) to achieve the power dividing function in the communication device (e.g., a base station).

[0010] Furthermore, in this embodiment, the inner conductor of the power divider connector is disposed within the hollow cavity formed by the outer conductor, and the inner conductor is independent of the outer conductor, forming a channel using gas (e.g., air) as the medium. Exemplarily, the aforementioned independence of the inner conductor from the outer conductor means that no medium is filled between the inner and outer conductors; they are isolated by gas. Thus, by using gas as the medium between the inner and outer conductors, the low dielectric loss of the gas reduces the losses (e.g., feeder losses) of the power divider connector during signal energy transmission, thereby improving radiation efficiency.

[0011] Furthermore, compared to power dividers in the form of microstrip lines printed on a printed circuit board, the power divider connectors of this application embodiment are assembled to the circuit board via outer and inner conductors, rather than being printed on the circuit board, thus the layout space is not limited by the trace space of the circuit board. Therefore, the power divider connectors of this application embodiment have sufficient layout space, which can reduce the coupling effect between traces of the inner conductor and improve isolation.

[0012] In one possible implementation of the first aspect described above, the gas includes air.

[0013] Using the above technical solution, air is used as the medium between the inner conductor and the outer conductor. Since the dielectric constant of air is close to 1, it can reduce losses when transmitting signal energy.

[0014] Exemplaryally, this application embodiment does not limit the type of gas; any gas that meets the low dielectric loss requirement can be used as the medium between the inner and outer conductors. For example, within the sealed cavity formed by the outer conductor, this application embodiment can also use gases such as air, helium, argon, and nitrogen as the medium between the inner and outer conductors. The sealed cavity also serves to provide waterproofing and dustproofing, improving the stability and extending the service life of the power divider connector in this application embodiment.

[0015] In one possible implementation of the first aspect above, the outer conductor includes:

[0016] The first sidewall extends along the first direction;

[0017] The second sidewall extends along the first direction and along the second direction, the first sidewall and the second sidewall are spaced apart on opposite sides of the inner conductor, and the first direction and the second direction intersect.

[0018] The inner conductor extends along a first direction, and along a second direction, the distance between the inner conductor and the first sidewall is equal to the distance between the inner conductor and the second sidewall.

[0019] Using the above technical solution, in the embodiments of this application, the first sidewall and the second sidewall of the outer conductor are disposed on opposite sides of the inner conductor, and the distance between the first sidewall and the second sidewall and the inner conductor is equal, so that the inner conductor and the outer conductor form an air-like coaxial structure.

[0020] In one possible implementation of the first aspect described above, the outer conductor further includes:

[0021] A first connecting wall extends along a first direction and connects to a first side wall and a second side wall respectively. Along a third direction, the first connecting wall is spaced apart from the inner conductor. The first direction intersects the third direction, and the second direction intersects the third direction.

[0022] The first sidewall, the second sidewall, and the first connecting wall together define a receiving cavity, with the input port and one or more output ports extending through the first sidewall to protrude from the receiving cavity; or,

[0023] The input port and one or more output ports extend through the first connecting wall to protrude from the receiving cavity.

[0024] Using the above technical solution, the embodiments of this application form a semi-enclosed electromagnetic shielding structure (e.g., an electromagnetic shielding structure with its opening facing or away from the circuit board, or an electromagnetic shielding structure that surrounds the inner conductor 270°) through the first sidewall, the second sidewall, and the first connecting wall of the outer conductor, so that the inner conductor and the outer conductor of this application form a coaxial structure similar to air. Furthermore, the input port and output port of the inner conductor can extend out of the receiving cavity through the first sidewall and be electrically connected to the circuit board of the aforementioned communication device; or, the input port and output port of the inner conductor can also extend out of the receiving cavity through the first connecting wall and be electrically connected to the circuit board of the aforementioned communication device.

[0025] In one possible implementation of the first aspect described above, the first sidewall, the second sidewall, and the first connecting wall are integrally formed.

[0026] In one possible implementation of the first aspect described above, the outer conductor further includes:

[0027] The second connecting wall extends along the first direction and connects to the first side wall and the second side wall respectively. Along the third direction, the second connecting wall and the first connecting wall are spaced apart.

[0028] The first sidewall, the second sidewall, the first connecting wall, and the second connecting wall together define the receiving cavity. The input port and one or more output ports pass through the second connecting wall to extend out of the receiving cavity.

[0029] The input port and one or more output ports extend through the second connecting wall to protrude from the receiving cavity.

[0030] Using the above technical solution, the embodiments of this application form a closed electromagnetic shielding structure (e.g., an electromagnetic shielding structure surrounding the inner conductor 360°) through the first sidewall, second sidewall, first connecting wall, and second connecting wall of the outer conductor, so that the inner conductor and the outer conductor of this application embodiment together form an air-like coaxial structure. Furthermore, the input port and output port of the inner conductor can respectively extend through the second connecting wall into the receiving cavity and be electrically connected to the circuit board of the aforementioned communication device.

[0031] For example, the electromagnetic shielding structure formed by the outer conductor surrounding the inner conductor is not limited in the embodiments of this application, and can be selected according to design requirements. For example, the outer conductor can be a closed electromagnetic shielding structure that surrounds the inner conductor 360°, or it can be a semi-closed electromagnetic shielding structure that surrounds the inner conductor 270°, or it can be a closed electromagnetic shielding structure that surrounds the inner conductor 270° and forms a closed electromagnetic shielding structure together with the circuit board, etc., as long as the outer conductor can form a coaxial structure similar to air with the inner conductor.

[0032] In one possible implementation of the first aspect described above, the first connecting wall is integrally formed with the first sidewall, and the second connecting wall is integrally formed with the second sidewall.

[0033] In one possible implementation of the first aspect described above, the input port and one or more output ports are both made of an elastic material.

[0034] Using the above technical solution, the input and output ports of the inner conductor in this embodiment are made of elastic material and are elastic. When the input and output ports of the inner conductor are connected to the circuit board of the communication device (e.g., by wing-type welding and pressing), the inner conductor can be mounted on the circuit board. Furthermore, the elastic input and output ports can optimize the coplanarity of the traces between the power divider connector and the circuit board, avoid excessive spacing between the input and output ports and the circuit board, and prevent the occurrence of cold solder joints, thus ensuring the reliability of the soldering between the inner conductor and the circuit board.

[0035] In one possible implementation of the first aspect described above, the power divider connector further includes an inner conductor connector connected to the inner conductor and connected to the outer conductor.

[0036] In one possible implementation of the first aspect above, the outer conductor further includes an outer conductor connector, which is respectively disposed on the first sidewall and the second sidewall, and the outer conductor connector has a recess.

[0037] The inner conductor connector has a protrusion that is positioned opposite to the recess, and the protrusion and recess engage in a third direction.

[0038] In one possible implementation of the first aspect described above, the inner conductor connector is integrally injection molded from a plastic material with the inner conductor.

[0039] In one possible implementation of the first aspect described above, the outer conductor further includes a connection pin extending in a third direction for connection to an external circuit board, so that the outer conductor is mounted on the circuit board.

[0040] Using the above technical solution, the connection pins of the outer conductor in this application embodiment can extend into the circuit board of the communication device and be connected to the circuit board by soldering, so that the outer conductor can be mounted on the printed circuit board.

[0041] In one possible implementation of the first aspect above, the number of outer conductors includes multiple ones, with multiple inner conductors corresponding one-to-one with multiple outer conductors;

[0042] The power connector also includes conductive connectors, which connect adjacent outer conductors along the second direction.

[0043] It is understood that the outer conductor of the present application embodiment has a receiving cavity, and multiple inner conductors are correspondingly disposed in the receiving cavities of multiple outer conductors, thus forming multiple channels.

[0044] Using the above technical solution, the adjacent outer conductors of the power divider connector in this application embodiment are connected by conductive connectors, so that the connection between the multiple channels formed by the multiple outer conductors and the multiple inner conductors is more compact, realizing high-density integration of multiple channels, and realizing that the multiple channels share the same ground with the network in terms of electrical performance. Thus, the power divider connector in this application embodiment has the functions of reflow resistance (supporting reflow soldering process), low passive intermodulation distortion (PIM) and low resonance.

[0045] In one possible implementation of the first aspect described above, the power divider connector further includes an adsorption connector having a plane, the adsorption connector simultaneously connecting to a first connection wall of multiple outer conductors.

[0046] To facilitate the assembly of the power distributor connector and the circuit board in this embodiment of the present application, an adsorption connector is provided on the outer conductor and the adsorption connector is located on the side of the outer conductor away from the circuit board (e.g., the first connecting wall of the outer conductor). The plane of the adsorption connector serves as an adsorption surface. When the power distributor connector and the circuit board are assembled using tooling (e.g., soldered using an automatic pick-and-place machine), the plane of the adsorption connector in this embodiment of the present application can serve as the soldering adsorption surface of the automatic pick-and-place machine, thus supporting the adsorption and gripping function of the automatic pick-and-place machine.

[0047] In addition, when the power divider connector in this application embodiment has multiple outer conductors, the adsorption connector can simultaneously connect the first connecting wall of multiple outer conductors, so as to simultaneously grasp multiple outer conductors of the power divider connector through the adsorption connector and mount the multiple outer conductors together on the circuit board.

[0048] The second aspect of this application provides a communication device. Specifically, the communication device includes any one of the possible implementations of the first aspect described above, a power divider connector;

[0049] The outer conductor of the power divider connector is connected to the circuit board, and the output port and input port of the inner conductor of the power divider connector are electrically connected to the circuit board respectively.

[0050] The antenna is connected to the circuit board and electrically connected to the output port of the inner conductor via the circuit board.

[0051] Using the above technical solution, the power divider connector of this application embodiment is mounted on a circuit board. The outer conductor has a hollow receiving cavity, and the inner conductor is located inside the hollow receiving cavity. The inner conductor is electrically connected to the circuit board and the antenna through output and input ports extending out of the receiving cavity, respectively. Compared to the trace design of microstrip lines printed on a circuit board, where traces are limited to the plane of the circuit board and are long, the inner conductor of the power divider connector of this application embodiment is routed within the receiving cavity. This effectively utilizes the height space within the receiving cavity, saving trace layout space on the circuit board. It also reduces trace length, decreases losses (e.g., feeder losses), and improves radiation efficiency, thereby enhancing the stability and reliability of the communication equipment (e.g., a base station) of this application embodiment. Attached Figure Description

[0052] Figure 1 This is a schematic diagram of the structure of the communication device provided in the embodiments of this application;

[0053] Figure 2A This is a schematic diagram of the structure of a communication device in some implementation methods;

[0054] Figure 2B yes Figure 2A A partially enlarged schematic diagram of a Chinese communication device;

[0055] Figure 3 This is a schematic diagram of the communication device provided in the embodiments of this application;

[0056] Figure 4A This is a schematic diagram of the structure of a power divider connector provided in Embodiment 1 of this application;

[0057] Figure 4B This is a side view of a power divider connector provided in Embodiment 1 of this application;

[0058] Figure 5 This is a schematic diagram of the outer conductor and conductive connector of a power divider connector provided in Embodiment 1 of this application;

[0059] Figure 6A This is an exploded view of a power divider connector provided in Embodiment 1 of this application;

[0060] Figure 6B This is a simplified schematic diagram illustrating the connection relationship between a power divider connector and an antenna, provided in Embodiment 1 of this application.

[0061] Figure 6C This is a front view of a power divider connector provided in Embodiment 1 of this application;

[0062] Figure 7A This is a schematic diagram of the structure of a power divider connector provided in Embodiment 2 of this application;

[0063] Figure 7B This is a side view of a power divider connector provided in Embodiment 2 of this application;

[0064] Figure 7C This is a side exploded view of a power divider connector provided in Embodiment 2 of this application;

[0065] Figure 8A This is an exploded view of a power divider connector provided in Embodiment 2 of this application;

[0066] Figure 8B This is an exploded front view schematic diagram of a power divider connector provided in Embodiment 2 of this application;

[0067] Figure 8C This is a perspective view of the inner conductor connector of a power divider connector provided in Embodiment 2 of this application;

[0068] Figure 9A This is a schematic diagram of the structure of a power divider connector provided in Embodiment 3 of this application;

[0069] Figure 9B This is a side view of a power divider connector provided in Embodiment 3 of this application;

[0070] Figure 9C This is a side exploded view of a power divider connector provided in Embodiment 3 of this application;

[0071] Figure 10A This is an exploded view of a power divider connector provided in Embodiment 3 of this application;

[0072] Figure 10B This is an exploded front view schematic diagram of a power divider connector provided in Embodiment 3 of this application. Detailed Implementation

[0073] This application provides a power divider connector and a communication device. The power divider connector has an outer conductor and an inner conductor, which together form an air-like coaxial structure. This enables the power divider connector of this application to perform power dividing functions and has low power loss and high isolation when assembled with the circuit board of the communication device.

[0074] To facilitate the explanation of the technical solution of this application, before providing a detailed description of the power divider connector and communication device in the embodiments of this application, some concepts involved in this application will be explained first.

[0075] A power divider, also known as a power splitter, is a device that splits the energy of one input signal into two or more outputs of equal or unequal energy. It can also combine the energy of multiple signals into one output, and is also called a combiner.

[0076] Multiple Input Multiple Output (MM) is a wireless communication technology that improves communication performance and data transmission rate by using multiple antennas at the transmitting and receiving ends.

[0077] Hybrid Beamforming (HBF): Hybrid beamforming is a technology that transmits signals to wireless terminals in a concentrated and directional manner, which can comprehensively improve the signal quality received by wireless terminals and increase throughput.

[0078] Feed network loss: The feed network is an important component of a base station antenna, consisting of transmission lines and power dividers. The feed network connects the antenna ports and array elements, forming a path for radio frequency signal transmission and achieving functions such as impedance matching and amplitude and phase distribution. The insertion loss during its transmission process is the feed network loss.

[0079] Passive Intermodulation Distortion (PIM): In passive communication systems, due to the nonlinear characteristics of materials and structures, intermodulation distortion occurs when two or more frequencies of signals pass through the system simultaneously.

[0080] Shared network ground: Conductive objects connected together form an electrical network that serves as GND (ground wire or 0 wire).

[0081] The power divider connector provided in this application embodiment is applied to communication equipment. The communication equipment involved in this application embodiment may be, for example, an active antenna unit (AAU), a base station using massive MIMO technology, as well as smart cars, various Internet of Things (IoT) devices, including various smart home devices (such as smart meters and smart appliances) and smart city devices (such as security or monitoring equipment, smart road traffic facilities) and other terminals with wireless access capabilities.

[0082] This application does not impose any special restrictions on the specific form of the communication device described above. For ease of explanation, the following description takes a base station using Massive MIMO technology as an example.

[0083] Figure 1 A schematic diagram of the structure of a base station provided in an embodiment of this application is shown.

[0084] refer to Figure 1 The aforementioned base station 1 mainly includes: a printed circuit board (PCB) 10, a power divider connector 20, an antenna 30, and a frame 40.

[0085] Specifically, such as Figure 1 As shown, the circuit board 10, the power divider connector 20, and the antenna 30 can be disposed on different layers in the thickness direction of the base station 1. These layers can be parallel to each other, and the plane in which each layer is located can be called the XY plane. The direction perpendicular to the XY plane can be called the Z direction (i.e., the thickness direction). In other words, the circuit board 10, the antenna 30, and the power divider connector 20 can be distributed in layers in the Z direction.

[0086] The circuit board 10 is located between the antenna 30 and the power divider connector 20. It can be understood that the circuit board 10 can use hybrid beamforming (HBF) technology to electrically connect the antenna 30 and the power divider connector 20, and the power divider connector 20 can split the energy of one input signal from the circuit board 10 into one or more output signal energy and transmit them to the antenna 30 to achieve the power divider function.

[0087] For example, such as Figure 1 As shown, along the thickness direction (e.g.) Figure 1 (As shown in the Z-direction), the frame 40 is disposed on the upper side of the circuit board 10, and the frame 40 has an opening 41. The vibrators 31 of the two antennas 30 pass through the opening 41 and are connected to the circuit board 10. The power divider connector 20 is connected to the lower side of the circuit board 10. That is, the two antennas 30 and the power divider connector 20 are respectively mounted on opposite sides of the circuit board 10.

[0088] The number of antennas 30 is not limited in this application embodiment. The above embodiment shows two antennas 30 connected to the power divider connector 20 via the circuit board 10. For example, the number of antennas 30 could be one, in which case the power divider connector 20 would transmit one output signal energy to that single antenna 30; or, the number of antennas 30 could be three, four, five, six, seven, or more, in which case the power divider connector 20 would transmit multiple output signal energy to the multiple antennas 30. In other words, the number of multiple output signal energies output by the power divider connector 20 in this application embodiment corresponds to the number of antennas 30.

[0089] It is understood that the structure illustrated in the embodiments of this application does not constitute a specific limitation on base station 1. In other embodiments of this application, base station 1 may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements. For example, base station 1 may also include devices such as shielding covers, filters, and transceiver boards (TRx boards) (not shown in the figures).

[0090] With the development of technology, base stations with power splitting functions have been widely used. Base stations generally use microstrip line power splitters to realize the power splitting function of base stations.

[0091] The implementation of the microstrip line power divider described above will now be described in further detail with reference to the accompanying drawings.

[0092] Figure 2A A schematic diagram of a base station with a power divider in the form of a microstrip line is shown. Figure 2B It shows Figure 2A A partially enlarged schematic diagram of the microstrip structure.

[0093] like Figure 2A As shown, the base station 100 employs a microstrip line routing design on a circuit board 101 to print the microstrip line 102 on the circuit board 101, and to assemble the antenna 103's vibrator 1031 with the circuit board 101, so that the antenna 103's vibrator 1031 can be connected to the microstrip line 102 on the circuit board 101 through the circuit board 101. Figure 2B As shown, the microstrip line 102 has multiple traces 1021, which are curved due to the limited trace space on the circuit board. Thus, the microstrip line 102 printed on the circuit board 101 can perform power splitting function for the antenna 103.

[0094] Those skilled in the art will understand that the power dividing performance of a power divider is mainly determined by two important parameters (loss and isolation). However, in the microstrip line power divider described above, on the one hand, the trace length 1021 of the microstrip line 102 printed on the circuit board 101 is long and has high loss; on the other hand, due to the limitation of the trace space on the circuit board 101, the trace space of the microstrip line 102 on the circuit board 101 is compact, and the spacing between adjacent traces 1021 of the microstrip line 102 is short, resulting in coupling effects, which makes it difficult to achieve the required isolation.

[0095] To achieve low-loss transmission of electrical signals and power splitting function, this application provides a power splitting connector. The power splitting connector has an air-like coaxial structure formed by the outer and inner conductors, and the power splitting connector is mounted on the circuit board of the base station to achieve the power splitting function while ensuring low power supply loss and high isolation of the power splitting connector.

[0096] The specific structure of the power divider connector will be described in detail below with reference to the accompanying drawings. Embodiment 1 describes a power divider connector for a base station that uses an inverted U-shaped outer conductor to form a closed electromagnetic shielding structure together with the base station's circuit board. Specifically, in Embodiment 1, the opening of the semi-closed electromagnetic shielding structure formed by the outer conductor faces the circuit board. Embodiment 2 describes a power divider connector for a base station that uses a quadrilateral outer conductor to form a closed electromagnetic shielding structure. Embodiment 3 describes a power divider connector for a base station that uses a U-shaped outer conductor to form a semi-closed electromagnetic shielding structure. Specifically, in Embodiment 3, the opening of the semi-closed electromagnetic shielding structure formed by the outer conductor faces away from the base station's circuit board.

[0097] The power divider connector of the base station will be described below with reference to Embodiment 1, Embodiment 2 and Embodiment 3 respectively.

[0098] Example 1

[0099] Figure 3 A schematic diagram of the connection between the power divider connector and the base station provided in Embodiment 1 of this application is shown.

[0100] In this embodiment of the application, reference is made to Figure 3 The power splitter connector 20 is mounted on the circuit board 10.

[0101] Specifically, such as Figure 3 As shown, the outer conductor 21 is connected to the circuit board 10 and together with the circuit board 10 forms a closed electromagnetic shielding structure to accommodate the inner conductor 22. The output port and input port (not shown in the figure) of the inner conductor 22 are electrically connected to the circuit board 10 so that the vibrator 31 of the antenna 30 can be electrically connected to the output port of the inner conductor 22 through the circuit board 10. Exemplarily, the power divider connector 20 of this embodiment is assembled to the circuit board 10 through a tooling (e.g., an automatic placement machine). The circuit board 10 transmits the input signal energy to the input port of the inner conductor 22 and transmits one output signal energy through the circuit board 10 to the antenna 30.

[0102] Figure 4A A perspective view of the power divider connector provided in Embodiment 1 of this application is shown. Figure 4B A side view of the power divider connector provided in Embodiment 1 of this application is shown.

[0103] In this embodiment of the application, reference is made to Figure 4A and Figure 4B The power splitter 20 includes two outer conductors 21 and two inner conductors 22 corresponding to the two outer conductors 21 respectively. The two outer conductors 21 and their corresponding inner conductors 22 form two channels using air as the medium.

[0104] Specifically, such as Figure 4A and Figure 4B As shown, each outer conductor 21 includes a first direction (i.e., the length direction of the power divider connector 20, such as...) Figure 4A and Figure 4B The first sidewall 211 (also called the left sidewall), the second sidewall 212 (also called the right sidewall), and the first connecting wall 213 (also called the top wall) extend along the first direction X. The first sidewall 211, the second sidewall 212, and the first connecting wall 213 together define a hollow, rectangular-section receiving cavity 214. The receiving cavity 214 extends along the first direction X and its two ends in the first direction X are connected. However, the specific structure of the receiving cavity 214 is not limited in this embodiment. The shape and volume of the receiving cavity 214 are limited by the shape and height of the outer conductor 21. For example, the outer conductor 21 can also be a structure with a triangular, circular, or other polygonal cross-section, and the receiving cavity 214 correspondingly has a triangular, circular, or other polygonal cross-section.

[0105] It is understood that the accommodating cavity 214 formed by the outer conductor 21 in this embodiment can be either the non-sealed accommodating cavity 214 described above or a sealed accommodating cavity (not shown in the figure). Furthermore, this embodiment does not limit the type of gas used as the medium; any gas that meets the requirement of low dielectric loss can be used as the medium between the inner conductor 22 and the outer conductor 21 in this embodiment.

[0106] In the above embodiments, within the non-sealed cavity formed by the outer conductor 21 with its two ends open, air is used as the medium between the inner conductor 22 and the outer conductor 21. However, this is not a limitation; within the sealed cavity 214 formed by the outer conductor 21, air, helium, argon, nitrogen, or other gases can also be used as the medium between the inner conductor 22 and the outer conductor 21. The sealed cavity 214 also serves to provide waterproofing and dustproofing, thereby improving the stability and extending the service life of the power divider connector 20 in this embodiment.

[0107] For ease of explanation, the following description takes air as the medium between the inner conductor 22 and the outer conductor 21 within a non-sealed cavity 214 formed by the outer conductor 21.

[0108] For example, such as Figure 4B As shown, along the second direction (i.e., the width direction of the power divider connector, as...) Figure 4B As shown in the Y direction), the two outer conductors 21 are symmetrically arranged. The first sidewall 211 and the second sidewall 212 of each outer conductor 21 are spaced apart on opposite sides of the corresponding inner conductor 22, along a third direction (i.e., the width direction of the power divider connector, as shown in the Y direction). Figure 4B (As shown in the Z direction), the first connecting wall 213 of the outer conductor 21 is spaced apart from the corresponding inner conductor 22 and connected to the first side wall 211 and the second side wall 212 respectively to form a hollow inverted U-shaped structure. This semi-enclosed inverted U-shaped structure 270° surrounds the inner conductor 22, and the opening faces the circuit board 10. Furthermore, the first side wall 211 of both outer conductors 21 is connected to the circuit board 10, so that the two outer conductors 21 together form a 360° enclosed electromagnetic shielding structure surrounding the corresponding inner conductor 22. This ensures that each inner conductor 22 is air-isolated from the first side wall 211, the second side wall 212, and the first connecting wall 213 of the corresponding outer conductor 21. The first direction X (i.e., the length direction of the power divider connector 20) is perpendicular to the second direction Y (i.e., the width direction of the power divider connector 20), and the second direction Y is perpendicular to the third direction Z (i.e., the height direction of the power divider connector 20).

[0109] It is understood that when the power divider connector 20 of this application embodiment includes only an outer conductor 21 and a corresponding inner conductor 22, the first sidewall 211 and the second sidewall 212 of the outer conductor 21 will be connected to the circuit board 10 so that the first sidewall 211, the second sidewall 212 and the first connecting wall 213 of the outer conductor 21 together with the circuit board 10 form a closed electromagnetic shielding structure that surrounds the inner conductor 22 in 360°.

[0110] Exemplary, in this embodiment, the first sidewall 211, the second sidewall 212, and the first connecting wall 213 of the outer conductor 21 are integrally formed, and the first sidewall 211, the second sidewall 212, and the first connecting wall 213 of the outer conductor 21 are manufactured by mechanical bending. However, this embodiment does not limit the preparation method and materials of the outer conductor 21, as long as an electromagnetic shielding structure can be formed outside the inner conductor 22. For example, the outer conductor 21 in this embodiment can also be manufactured by profile forming or sheet metal stamping, and the outer conductor 21 in this embodiment is made of a metallic conductive material.

[0111] like Figure 4A and Figure 4B As shown, the power distributor connector 20 in this embodiment further includes an adsorption connector 23. The adsorption connector 23 is connected to the first connecting wall 213 of the outer conductor 21, has a plane 231, and extends along a first direction X. The plane 231 of the adsorption connector 23 can serve as an adsorption surface, allowing the power distributor connector 20 and the circuit board 10 to be assembled using tooling (e.g., soldering with an automatic placement machine). In this embodiment, the plane 231 of the adsorption connector 23 serves as the soldering adsorption surface of the automatic placement machine, supporting the adsorption and gripping function of the automatic placement machine. Exemplarily, the adsorption connector 23 in this embodiment is made of Mylar material.

[0112] For example, along the second direction (such as Figure 4A and Figure 6A (As shown in the Y direction), the adsorption connector 23 is located on the side of the outer conductor 21 away from the circuit board 10, and simultaneously connects the first connecting wall 213 of both outer conductors 21, so that the automatic placement machine can simultaneously pick up both outer conductors 21 of the power distributor connector 20, thereby mounting the two outer conductors 21 together on the circuit board 10. However, in this embodiment, the number of outer conductors 21 connected to the adsorption connector 23 is not limited; for example, it can also be connected to the first connecting wall 213 of only one outer conductor 21.

[0113] refer to Figure 5 and combined Figure 4B and Figure 6A The power divider connector 20 in this embodiment of the application also includes a conductive connector 24.

[0114] Specifically, such as Figure 5As shown, along the second direction (such as...) Figure 5 (As shown in the Y direction), the conductive connector 24 is attached between the two outer conductors 21 so that the two adjacent outer conductors 21 are connected by the conductive connector 24.

[0115] For example, in this embodiment, the conductive connector 24 is made of conductive adhesive. Adjacent outer conductors 21 are assembled using conductive adhesive via an adhesive bonding process to more compactly connect the multiple channels formed by the multiple outer conductors 21 and the multiple inner conductors 22 in the power distributor connector 20, achieving high-density integration and ensuring that the multiple channels (i.e., the multiple outer conductors 21 and their corresponding multiple inner conductors 22) share a common network and ground in terms of electrical performance. This allows the power distributor connector 20 to have reflow resistance (supporting reflow soldering processes), low passive intermodulation (PIM), and low resonance. However, this embodiment does not limit the material and structure of the conductive connector 24, as long as it can fix two adjacent outer conductors 21 together and make them electrically connected.

[0116] Continue to refer to Figure 4B The two inner conductors 22 are respectively disposed within the hollow receiving cavities 214 of the two outer conductors 21. Both inner conductors 22 extend along the first direction X. Each inner conductor 22 and its corresponding outer conductor 21 are spaced apart, and the distance D1 between each inner conductor 22 and the first sidewall 211 is equal to the distance D2 between the inner conductor 22 and the second sidewall 212, thus forming a near-air coaxial structure together with its corresponding outer conductor 21. Furthermore, air is used as the medium between each inner conductor 22 and its corresponding outer conductor 21 to isolate them. That is, there is no medium filling between each inner conductor 22 and its corresponding outer conductor 21.

[0117] For example, in this embodiment, the inner conductor 22 is a sheet metal part. However, this embodiment does not limit the shape and material of the inner conductor 22, as long as air is used as the medium between the inner conductor 22 and the outer conductor 21, and an air-like coaxial structure can be formed to transmit signal energy. For example, the inner conductor 22 in this embodiment can also be other shapes such as columnar. The inner conductor 22 in this embodiment is made of a metallic conductive material.

[0118] Therefore, in this embodiment, the first sidewall 211, the second sidewall 212, and the first connecting wall 213 of the outer conductor 21, together with the circuit board 10, form a closed electromagnetic shielding structure outside the inner conductor 22. The inner conductor 22 is independent of the outer conductor 21 and is housed within the hollow receiving cavity 214 of the outer conductor 21, thus forming a semi-closed air-like coaxial structure together with the outer conductor 21. It can be understood that, since the dielectric constant of air is close to 1, the air-like coaxial structure formed by the outer conductor 21 and the inner conductor 22 has the effect of reducing losses when transmitting signal energy.

[0119] It is understood that the number of outer conductors 21 and inner conductors 22 is not limited in the embodiments of this application, as long as the number of inner conductors 22 and outer conductors 21 can correspond to each other. For example, the number of outer conductors 21 in the embodiments of this application can be 1, 2, 3, 4, 5, 6, 7, 8 or more, and the number of inner conductors 22 can be 1, 2, 3, 4, 5, 6, 7, 8 or more.

[0120] For ease of explanation, the following explanation uses an outer conductor 21 and a corresponding inner conductor 22 (i.e., one of the two channels) as an example.

[0121] refer to Figure 6A and combined Figure 4B The inner conductor 22 in this embodiment has an input port 221 and a plurality of output ports 222.

[0122] For example, such as Figure 6A As shown, the inner conductor 22 has a first direction (e.g., Figure 6A Seven pins are spaced apart along the first direction X (as shown in the X direction). One pin serves as an input port 221 of the inner conductor 22, and the other six pins serve as six output ports 222 of the inner conductor 22. In other words, the inner conductor 22 of this embodiment includes one input port 221 and six output ports 222, which are spaced apart along the first direction X. Figure 4B As shown, each pin of the input port 221 and output port 222, which are the inner conductor 22, is along a third direction (e.g., Figure 4B and Figure 6A After extending the corresponding receiving cavity 214 (as shown in the Z direction), it extends towards the second direction (as shown in the Z direction). Figure 4B and Figure 6A (As shown in the Y direction) bend to electrically connect with circuit board 10.

[0123] Therefore, as Figure 6BAs shown, in operation (e.g., after the power divider connector 20 is assembled with the circuit board 10), the inner conductor 22 can divide one input signal energy from one input port 221 into six output signal energies corresponding to six output ports 222, and output them to six antennas 30 through the six output ports 222, so as to realize the power divider function of the power divider connector 20 of the base station 1 in this embodiment of the application.

[0124] In the above embodiments, each inner conductor 22 has one input port 221 and six output ports 222. However, the present application embodiments do not limit the number of output ports 222 of the inner conductor 22. For example, the number of output ports 222 of each inner conductor 22 in the present application embodiments can also be 1, 2, 3, 4, 5, 7, 8 or more.

[0125] For example, continue to refer to Figure 4B In this embodiment, both the input port 221 and the output port 222 are made of elastic material. In other words, the input port 221 and the output port 222 (i.e., the pins) of the inner conductor 22 are elastic. Thus, the elastic input port 221 and the output port 222 can optimize the coplanarity of the traces between the power divider connector 20 and the circuit board 10.

[0126] For example, such as Figure 4B As shown, when the input port 221 and output port 222 of the inner conductor are soldered to the circuit board 10 of the base station 1, the circuit board 10 is provided with solder 11 corresponding to the input port 221 and output port 222. Assuming that there is a deviation between the circuit board 10 and the power divider connector 20 in the third direction Z, there is a gap H between the pin of the left inner conductor 21 (i.e., the input port 221) and the solder 11. Since the pin of this embodiment is elastic, the pin of the left inner conductor 21 can be pressed down by welding crimping (e.g., wing-shaped welding crimping) so that the pin is connected to the solder 11, thereby allowing the inner conductor 22 to be mounted on the circuit board 10. This avoids the gap between the input port 221 and output port 222 and the circuit board 10 (e.g., the gap H between the pin and the solder 11) being too large, which would cause a cold solder joint, thus ensuring the reliability of the soldering between the inner conductor 22 and the circuit board 10.

[0127] In summary, on one hand, the power divider connector 20 of this application embodiment has an outer conductor 21 and an inner conductor 22, wherein the inner conductor 22 has an input port 221 and multiple output ports 222 (or one output port 222). Thus, when the power divider connector 20 is mounted on the circuit board 10 of the base station 1, the input port 221 of the inner conductor 22 can receive one input signal energy from the circuit board 10, and can output multiple output signal energies (or one output signal energy) through one or more output ports to realize the power dividing function.

[0128] Furthermore, in this embodiment, the inner conductor 22 of the power divider connector 20 is disposed within the hollow cavity 214 formed by the outer conductor 22, and the inner conductor 22 is independent of the outer conductor 21, so that air is used as the medium between the inner conductor 22 and the outer conductor 21. By utilizing the low dielectric loss of air, the loss of the power divider connector 20 in the process of transmitting signal energy (e.g., feeder loss) is reduced, and the radiation efficiency is improved.

[0129] Furthermore, compared to power dividers in the form of microstrip lines printed on a printed circuit board, the power divider connector 20 of this embodiment is assembled to the circuit board 10 via an outer conductor 21 and an inner conductor 22, rather than being printed on the circuit board 10. Therefore, its layout space is not limited by the trace space of the circuit board 10. Consequently, the power divider connector 20 of this application has ample layout space, reducing the coupling effect between traces of the inner conductor 22 to improve isolation, thereby enhancing the stability and reliability of the base station 1 in this embodiment.

[0130] refer to Figure 6C and combined Figure 6A The power divider connector 20 in this embodiment further includes an inner conductor connector 223, and the outer conductor 21 further includes an outer conductor connector 215. The inner conductor connector 223 is connected to the inner conductor 22.

[0131] Specifically, such as Figure 6A and Figure 6CAs shown, each outer conductor 21 has five outer conductor connectors 215, and each inner conductor 22 has five corresponding inner conductor connectors 223. Each outer conductor connector 215 is respectively disposed on the first sidewall 211 and the second sidewall 212 (not shown in the figure) of the outer conductor 21, and two outer conductor connectors 215 correspond to each other along the second direction Y. Exemplarily, each outer conductor connector 215 includes two corresponding recesses 2151 (one recess 2151 located on the first sidewall 211 is shown in the figure), and each inner conductor connector 223 has a pair of corresponding protrusions 2231. Along the second direction Y, each pair of protrusions 2231 is disposed on opposite sides of the corresponding inner conductor connector 223. Along the third direction Z, each pair of protrusions 2231 is respectively disposed opposite to the two recesses 2151 of each pair of conductor connectors 215, that is, the ten protrusions 2231 of the five inner conductor connectors 223 are respectively engaged with the corresponding recesses 2151. For example, each protrusion 2231 is inserted into a corresponding recess 2151 along the third direction Z and engaged with the recess 2151, so that the outer conductor 21 and the inner conductor 22 are connected through the outer conductor connector 215 and the inner conductor connector 223.

[0132] In addition, such as Figure 6A As shown, the conductive connector 24 between two adjacent outer conductors 21 is arranged to avoid the aforementioned inner conductor connector 223 and outer conductor connector 215, so as to avoid interference between the inner conductor connector 223 and the corresponding outer conductor connector 215, which would have an adverse effect on the connection between the inner conductor 22 and the outer conductor 21.

[0133] For example, such as Figure 6C As shown, in this embodiment, the inner conductor connector 223 is integrally injection molded from plastic material with the inner conductor 22 to ensure an insulated connection between the outer conductor 21 and the inner conductor 22. However, this embodiment does not limit the connection method between the inner conductor connector 223 and the inner conductor 22, as long as the inner conductor connector 223 and the inner conductor 22 can be connected. For example, the inner conductor connector 223 can also be installed on the inner conductor 22 by a snap-fit ​​method.

[0134] Furthermore, this application embodiment does not limit the number of inner conductor connectors 223 and outer conductor connectors 215, as long as the number of inner conductor connectors 223 and outer conductor connectors 215 corresponds to each other and can connect the outer conductor 21 and the inner conductor 22. For example, in this application embodiment, the number of outer conductor connectors 215 on each outer conductor 21 can be 2, 3, 4, 6, 7, 8 or more, and the number of inner conductor connectors 223 on each inner conductor 22 can be 2, 3, 4, 6, 7, 8 or more.

[0135] Continue to refer to Figure 6C and combined Figure 4B The outer conductor 21 in this embodiment of the application also includes a connection pin 216.

[0136] Specifically, such as Figure 6C As shown, the connection pin 216 is along a third direction (e.g.) Figure 6C Extending in the Z direction, each outer conductor 21 has four connection pins 216 on its first sidewall 211, and the four connection pins 216 extend along the first direction (as shown in the Z direction). Figure 6C (As shown in the X direction) spaced apart on the first sidewall 211 of each outer conductor 21. Figure 4B As shown, when the outer conductor 21 of the power divider connector 20 in this embodiment is mounted on the circuit board 10, the connection pin 216 of each outer conductor 21 is inserted into the circuit board 10 and connected to the circuit board 10 by soldering. Thus, both outer conductors 21 are connected to the circuit board 10 through the first sidewalls 211 on both sides of the second direction Y, enabling the two outer conductors 21 to be mounted on the circuit board 10 and together forming a 360° enclosed electromagnetic shielding structure surrounding the corresponding inner conductor 22. However, this embodiment does not limit the connection method between the connection pin 216 and the circuit board 10, as long as the connection pin 216 can be connected to the circuit board 10 so that the outer conductor 21 can be mounted on the circuit board 10. For example, the connection pin 216 can also be connected to the circuit board 10 by riveting.

[0137] Furthermore, this application embodiment does not limit the number and arrangement of the connection pins 216 for each outer conductor 21, such as... Figure 6C As shown, the first sidewall 211 of the outer conductor 21 is provided with four connection pins 216; however, it is not limited to this. It can be understood that when the power divider connector 20 of this embodiment includes only one outer conductor 21 and a corresponding inner conductor 22, the first sidewall 211 and the second sidewall 212 of the outer conductor 21 will both be connected to the circuit board 10. Then the connection pins 216 can also be provided on the second sidewall 212 of the outer conductor 21, and the number of connection pins 216 on the first sidewall 211 and the second sidewall 212 of the outer conductor 21 can also be 1, 2, 3, 5, 6, 7, 8 or more respectively.

[0138] In summary, the outer conductor 21 of the power divider connector 20 in Embodiment 1 of this application is a semi-enclosed electromagnetic shielding structure with its opening facing the circuit board 10. Thus, when the outer conductor 21 is assembled with the circuit board 10, the two together form a closed electromagnetic shielding structure surrounding the inner conductor 22, replacing the microstrip line form of the power divider printed on the printed circuit board, thereby realizing low-loss transmission of electrical signals and power division function in the base station 1.

[0139] Example 2

[0140] In this embodiment, the difference from Embodiment 1 is that the outer conductor 51 forms a quadrilateral closed electromagnetic shielding structure around the inner conductor 52. Furthermore, the remaining structure of the power divider connector 50 in this embodiment is the same as in Embodiment 1, such as the magnetic connector 23, the conductive connector 24, the connection pins 216 of the outer conductor 21, and the input port 221 and output port 222 of the inner conductor 22, etc., which will not be described in detail here.

[0141] It is understood that the number of outer conductors 51 and inner conductors 52 of the power divider connector 50 in this application embodiment may include one or more, and the outer conductors 51 may form a non-sealed or sealed receiving cavity.

[0142] For ease of explanation, the following description takes an example of an outer conductor 51 and a corresponding inner conductor 52 (i.e., a channel), with air used as the medium between the inner conductor 52 and the outer conductor 51 in a non-sealed cavity formed by the outer conductor 51.

[0143] Figure 7A A perspective view of the power divider connector provided in Embodiment 2 of this application is shown. Figure 7B A side view of the power divider connector provided in Embodiment 2 of this application is shown.

[0144] In this embodiment of the application, reference is made to Figure 7A and Figure 7B The power divider connector 50 includes an outer conductor 51 and an inner conductor 52.

[0145] Specifically, such as Figure 7A and Figure 7B As shown, the outer conductor 51 includes components along a first direction (e.g., Figure 7A and Figure 7B The first sidewall 511 (also called the left sidewall), the second sidewall 512 (also called the right sidewall), the first connecting wall 513 (also called the top wall), and the second connecting wall 514 (also called the bottom wall) extend along the first direction X. The first sidewall 511, the second sidewall 512, the first connecting wall 513, and the second connecting wall 514 together define a hollow, rectangular-section receiving cavity 515. The receiving cavity 515 extends along the first direction X and its two ends are connected in the first direction X. However, the specific structure of the receiving cavity 515 is not limited in this embodiment. The shape and volume of the receiving cavity 515 are limited by the shape and height of the outer conductor 51. For example, the outer conductor 51 can also be a structure with a triangular, circular, or other polygonal cross-section, and the receiving cavity 515 can correspondingly be a structure with a triangular, circular, or other polygonal cross-section.

[0146] For example, such as Figure 7B As shown, along the second direction (such as...) Figure 7B(As shown in the Y direction), the first sidewall 511 and the second sidewall 512 of the outer conductor 51 are spaced apart on opposite sides of the inner conductor 52, along a third direction (e.g., Figure 7B (As shown in the Z-direction), the first connecting wall 513 and the second connecting wall 514 of the outer conductor 51 are spaced apart on opposite sides of the inner conductor 52. Furthermore, the first connecting wall 513 is connected to the first side wall 511 and the second side wall 512, and the second connecting wall 514 is connected to the first side wall 511 and the second side wall 512, forming a hollow frame structure. This frame structure constitutes a closed electromagnetic shielding structure surrounding the inner conductor 52 360°, thereby isolating the inner conductor 52 from the first side wall 511, the second side wall 512, the first connecting wall 513, and the second connecting wall 514 of the outer conductor 51 through air.

[0147] For example, such as Figure 7C As shown, in this embodiment, the first connecting wall 513 of the outer conductor 51 is integrally formed with the first side wall 511, and the second connecting wall 514 is integrally formed with the second side wall 512. That is, the first connecting wall 513 and the first side wall 511 together form the outer wall of the receiving cavity 515 with an inverted L-shaped cross-section, and the second connecting wall 514 and the second side wall 512 together form the outer wall of the receiving cavity 515 with an L-shaped cross-section. Furthermore, in this embodiment, the first connecting wall 513 and the first side wall 511, as well as the second connecting wall 514 and the second side wall 512 of the outer conductor 51 are all manufactured by mechanical bending. However, this embodiment does not limit the manufacturing method and materials of the outer conductor 51, as long as a closed electromagnetic shielding structure can be formed outside the inner conductor 52. For example, the outer conductor 51 in this embodiment can also be manufactured by profile forming or sheet metal stamping, and the outer conductor 51 in this embodiment is made of a metallic conductive material.

[0148] Continue to refer to Figure 7B The inner conductor 52 is disposed within the hollow receiving cavity 515 of the outer conductor 51. The inner conductor 52 extends along the first direction X, and the inner conductor 52 and the outer conductor 51 are spaced apart. The distance D1 between the inner conductor 52 and the first sidewall 511 is equal to the distance D2 between the inner conductor 52 and the second sidewall 512. Furthermore, air is used as the medium between the inner conductor 52 and the outer conductor 51. Thus, the inner conductor 52 is independent of the outer conductor 51 and is housed within the hollow receiving cavity 515 of the outer conductor 51, so that the outer conductor 51 and the inner conductor 52 together form a fully enclosed air-like coaxial structure.

[0149] For example, in this embodiment, the inner conductor 52 is a sheet metal part. However, this embodiment does not limit the shape and material of the inner conductor 52, as long as air is used as the medium between the inner conductor 52 and the outer conductor 51, and an air-like coaxial structure can be formed to transmit signal energy. For example, the inner conductor 52 in this embodiment can also be other shapes such as columnar, and the inner conductor 52 in this embodiment is made of a metallic conductive material.

[0150] refer to Figure 8A and combined Figure 7A and Figure 7B In this embodiment, the inner conductor 52 has an input port 521 and a plurality of output ports 522. The second connecting wall 514 of the outer conductor 51 has a plurality of openings 516 corresponding to the input port 521 and the plurality of output ports 522 of the inner conductor 52.

[0151] For example, such as Figure 8A As shown, the inner conductor 52 has a first direction (e.g., Figure 8A The inner conductor 52 has seven pins spaced apart (as shown in the X direction). One pin serves as an input port 521 of the inner conductor 52, and the other six pins serve as six output ports 522 of the inner conductor 52. In other words, the inner conductor 52 of this embodiment includes one input port 521 and six output ports 522, which are spaced apart along the first direction X. The second connecting wall 514 of the outer conductor 51 has seven openings 516 corresponding to the seven pins (i.e., the input port 521 and the output ports 522) of the inner conductor 52. Figure 7A and Figure 7B As shown, the seven pins of the input port 521 and output port 522, which serve as the inner conductor 52, are respectively along a third direction (e.g., Figure 7A and Figure 7B (As shown in the Z direction) Passing through the corresponding opening 516 to extend the receiving cavity 515 and electrically connect it to the circuit board 10, thereby enabling the inner conductor 52 to be mounted on the circuit board 10 of the base station 1.

[0152] The number of openings 516 in this embodiment is not limited and can be selected according to the number of pins of the inner conductor 52. For example, the number of pins of the inner conductor 52 in this embodiment can be 1, 2, 3, 4, 5, 6, 8 or more, and the number of openings 516 in this embodiment can also be 1, 2, 3, 4, 5, 6, 8 or more.

[0153] refer to Figures 7C to 8C In this embodiment of the application, the inner conductor 52 further includes a plurality of inner conductor connectors 523, and the outer conductor 51 further includes a plurality of outer conductor connectors 517.

[0154] Specifically, such as Figure 7C and Figure 8A As shown, the inner conductor 52 has five inner conductor connectors 523, and the outer conductor 51 has five corresponding outer conductor connectors 517. Each outer conductor connector 517 is respectively disposed on the first sidewall 511 and the second sidewall 512 (not shown in the figure) of the outer conductor 51, and two outer conductor connectors 517 correspond to each other along the second direction Y. Exemplarily, each inner conductor connector 523 has a pair of corresponding protrusions 5231 along the second direction (e.g., ...). Figure 7C (As shown in the Y direction), each pair of protrusions 5231 is respectively provided on opposite sides of the corresponding inner conductor connector 523. Each outer conductor connector 517 includes two corresponding recesses 5171, and the two recesses 5171 are respectively provided on the first sidewall 511 and the second sidewall 512. Along the third direction Z, each pair of protrusions 5231 is respectively provided opposite to each pair of recesses 5171.

[0155] Furthermore, in this embodiment, the first connecting wall 513 and the first side wall 511 of the outer conductor 51 together form the outer wall of the receiving cavity 515 with an inverted L-shaped cross-section, and the second connecting wall 514 and the second side wall 512 together form the outer wall of the receiving cavity 515 with an L-shaped cross-section. For example, as... Figure 8B and Figure 8C As shown, in each pair of protrusions 5231, two protrusions 5231 are spaced apart along the third direction Z, and respectively face downward toward the recess 5171 of the second sidewall 512 and upward toward the recess 5171 of the first sidewall 511. When the first connecting wall 513 and the first sidewall 511 and the second connecting wall 514 and the second sidewall 512 are spliced ​​along the third direction Z to form an outer conductor 51 with a frame-shaped cross section, each pair of protrusions 5231 is inserted into the corresponding pair of recesses 5171 provided in the first sidewall 511 and the second sidewall 512 along the third direction Z, and engages with the corresponding pair of recesses 5171. This allows the first connecting wall 513 of the outer conductor 51 to connect with the second sidewall 512, and the second connecting wall 514 to connect with the first sidewall 511, together forming the outer wall of the receiving cavity 515.

[0156] This application embodiment does not limit the connection method between the first sidewall 511, the second sidewall 512, the first connecting wall 513, and the second connecting wall 514. For example, the first sidewall 511 and the first connecting wall 513, as well as the second sidewall 512 and the second connecting wall 514, can be connected by welding.

[0157] In summary, the outer conductor 51 of the power divider connector 50 in Embodiment 2 of this application (i.e., the first sidewall 511, the second sidewall 512, the first connecting wall 513 and the second connecting wall 514 of the outer conductor 51) forms a closed electromagnetic shielding structure that surrounds the inner conductor 52 360°, thereby replacing the microstrip power divider printed on the printed circuit board and realizing low-loss transmission of electrical signals and power division function in the base station 1.

[0158] Example 3

[0159] In this embodiment, the difference from Embodiment 1 is that the outer conductor 61 forms a U-shaped semi-enclosed electromagnetic shielding structure around the inner conductor 62, and the opening of this semi-enclosed electromagnetic shielding structure faces away from the circuit board 10. Furthermore, the remaining structure of the power divider connector 60 in this embodiment is the same as in Embodiment 1, such as the magnetic connector 23 and conductive connector 24 of the power divider connector 20, the connection pins 216 and outer conductor connector 217 of the outer conductor 21, and the input port 221 and output port 222 of the inner conductor 22, etc., which will not be described in detail here.

[0160] It is understood that the number of outer conductors 61 and inner conductors 62 of the power divider connector 60 in this application embodiment may include one or more, and the outer conductor 61 may form a non-sealed or sealed receiving cavity.

[0161] For ease of explanation, the following description takes an example of an outer conductor 61 and a corresponding inner conductor 62 (i.e., a channel), with air used as the medium between the inner conductor 62 and the outer conductor 61 in a non-sealed cavity formed by the outer conductor 61.

[0162] Figure 9A A perspective view of the power divider connector provided in Embodiment 3 of this application is shown. Figure 9B A side view of the power divider connector provided in Embodiment 3 of this application is shown.

[0163] In this embodiment of the application, reference is made to Figure 9A and Figure 9B The power divider connector 60 includes an outer conductor 61 and an inner conductor 62.

[0164] Specifically, such as Figure 9A and Figure 9B As shown, the outer conductor 61 includes components along a first direction (e.g., Figure 9A and Figure 9BThe first sidewall 611 (also called the left sidewall), the second sidewall 612 (also called the right sidewall), and the first connecting wall 613 (also called the bottom wall) extend along the first direction X. The first sidewall 611, the second sidewall 612, and the first connecting wall 613 together define a hollow, rectangular-section receiving cavity 614. The receiving cavity 614 extends along the first direction X and its two ends in the first direction X are open. However, the specific structure of the receiving cavity 614 is not limited in this embodiment. The shape and volume of the receiving cavity 614 are limited by the shape and height of the outer conductor 61. For example, the outer conductor 61 can also be a structure with a triangular, circular, or other polygonal cross-section, and the receiving cavity 614 correspondingly has a triangular, circular, or other polygonal cross-section.

[0165] For example, such as Figure 9B As shown, along the second direction (such as...) Figure 9B (As shown in the Y direction), the first sidewall 611 and the second sidewall 612 of the outer conductor 61 are spaced apart on opposite sides of the inner conductor 62, along a third direction (e.g., Figure 9B (As shown in the Z direction), the first connecting wall 613 of the outer conductor 61 is spaced apart from the inner conductor 62 and is connected to the first side wall 611 and the second side wall 612 respectively to form a hollow U-shaped structure. This semi-enclosed inverted U-shaped structure surrounds the inner conductor 62 at 270° and the opening is set away from the circuit board 10, so that the inner conductor 62 is isolated from the first side wall 611, the second side wall 612 and the first connecting wall 613 of the outer conductor 61 by air, forming a semi-enclosed electromagnetic shielding structure.

[0166] For example, such as Figure 9C As shown, in this embodiment, the first sidewall 611, the second sidewall 612, and the first connecting wall 613 of the outer conductor 61 are integrally formed. Furthermore, in this embodiment, the first sidewall 611, the second sidewall 612, and the first connecting wall 613 of the outer conductor 61 are manufactured by mechanical bending. However, this embodiment does not limit the manufacturing method of the outer conductor 61, as long as an electromagnetic shielding structure can be formed outside the inner conductor 62. For example, in this embodiment, the outer conductor 61 can also be manufactured by profile forming or sheet metal stamping, and in this embodiment, the outer conductor 61 is made of a metallic conductive material.

[0167] Continue to refer to Figure 9BThe inner conductor 62 is disposed within the hollow receiving cavity 614 of the outer conductor 61. The inner conductor 62 extends along the first direction X, and the inner conductor 62 and the outer conductor 61 are spaced apart. The distance D1 between the inner conductor 62 and the first sidewall 611 is equal to the distance D2 between the inner conductor 62 and the second sidewall 612. Air is used as the medium between the inner conductor 62 and the outer conductor 61. Thus, the inner conductor 62 is independent of the outer conductor 61 and is housed within the hollow receiving cavity 614 of the outer conductor 61, forming a semi-enclosed, air-like coaxial structure together with the outer conductor 61.

[0168] For example, the inner conductor 62 in this embodiment is a sheet metal part. However, this embodiment does not limit the shape and material of the inner conductor 62, as long as air is used as the medium between the inner conductor 62 and the outer conductor 61, and an air-like coaxial structure can be formed to transmit signal energy. For example, the inner conductor 62 in this embodiment can also be other shapes such as columnar, and the inner conductor 62 in this embodiment is made of a metallic conductive material.

[0169] refer to Figure 10A and combined Figure 9A and Figure 9B In this embodiment, the inner conductor 62 has an input port 621 and a plurality of output ports 622. The first connecting wall 613 of the outer conductor 61 has a plurality of openings 615 corresponding to the input port 621 and the plurality of output ports 622 of the inner conductor 62.

[0170] For example, such as Figure 10A As shown, the inner conductor 62 has a first direction (e.g., Figure 10A The inner conductor 62 has seven pins spaced apart (as shown in the X direction). One pin serves as an input port 621 of the inner conductor 62, and the other six pins serve as six output ports 622 of the inner conductor 62. In other words, the inner conductor 62 of this embodiment includes one input port 621 and six output ports 622, which are spaced apart along the first direction X. The first connecting wall 613 of the outer conductor 61 has seven openings 615 corresponding to the seven pins (i.e., input port 621 and output ports 622) of the inner conductor 62. Figure 9A and Figure 9B As shown, the seven pins of the input port 621 and output port 622, which serve as the inner conductor 62, are respectively along a third direction (e.g., Figure 9A and Figure 9B (As shown in the Z direction) Passing through the corresponding opening 615 to extend the receiving cavity 614 and electrically connect it to the circuit board 10, thereby enabling the inner conductor 62 to be mounted on the circuit board 10 of the base station 1.

[0171] The number of openings 615 in this embodiment is not limited and can be selected according to the number of pins of the inner conductor 62. For example, the number of pins of the inner conductor 62 in this embodiment can be 1, 2, 3, 4, 5, 6, 8 or more, and the number of openings 615 in this embodiment can also be 1, 2, 3, 4, 5, 6, 8 or more.

[0172] refer to Figure 10B and combined Figure 9C and Figure 10A In this embodiment of the application, the inner conductor 62 further includes a plurality of inner conductor connectors 623, and the outer conductor 61 further includes a plurality of outer conductor connectors 616.

[0173] Specifically, such as Figure 9C and Figure 10A As shown, the inner conductor 62 has five inner conductor connectors 623, and the outer conductor 61 has five corresponding outer conductor connectors 616. Each outer conductor connector 616 is respectively disposed on the first sidewall 611 and the second sidewall 612 (not shown in the figure) of the outer conductor 61, and two outer conductor connectors 616 correspond to each other along the second direction Y. Exemplarily, each inner conductor connector 623 has a pair of corresponding protrusions 6231 along the second direction (e.g., ...). Figure 9C (As shown in the Y direction), each pair of protrusions 6231 is respectively provided on opposite sides of the corresponding inner conductor connector 623. Each outer conductor connector 616 includes two corresponding recesses 6161, and the two recesses 6161 are respectively provided on the first sidewall 611 and the second sidewall 612. Along the third direction Z, each pair of protrusions 6231 is respectively provided opposite to each pair of recesses 6161.

[0174] Furthermore, in this embodiment, the first connecting wall 613 is connected to the first side wall 611 and the second side wall 612 to form an outer conductor 61 with a U-shaped cross-section. Exemplarily, each pair of protrusions 6231 are spaced apart along the third direction Z and face downwards toward a corresponding pair of recesses 6161. When the outer conductor 61 and the inner conductor 62 are connected along the third direction Z, a pair of protrusions 6231 of each inner conductor connector 523 are inserted into the corresponding pair of recesses 6161 along the third direction Z and engage with the corresponding pair of recesses 6161, thereby connecting the outer conductor 61 and the inner conductor 62 through the outer conductor connector 616 and the inner conductor connector 623.

[0175] In summary, the embodiments of this application form a closed electromagnetic shielding structure (or a semi-closed electromagnetic shielding structure) by having the outer conductor of the power divider connector surround the inner conductor and the circuit board. The inner conductor is placed inside the hollow cavity formed by the outer conductor and is independent of the outer conductor. Air is used as the medium between the inner and outer conductors to form a coaxial structure similar to air. This allows the power divider connector of the embodiments of this application to achieve power dividing function and have low power loss and high isolation when assembled with the circuit board of the communication equipment.

Claims

1. A power divider connector, characterized in that, include: The outer conductor has a hollow cavity for receiving the conductor. An inner conductor is disposed within the receiving cavity, and the inner conductor and the outer conductor are spaced apart, with gas serving as the medium between the inner conductor and the outer conductor; The inner conductor has an input port and one or more output ports, both of which extend out of the receiving cavity, wherein the plurality of output ports are spaced apart.

2. The power divider connector as described in claim 1, characterized in that, The gas includes air.

3. The power divider connector as described in claim 2, characterized in that, The outer conductor includes: The first sidewall extends along the first direction; The second sidewall extends along the first direction and along the second direction, the first sidewall and the second sidewall are spaced apart on opposite sides of the inner conductor, and the first direction and the second direction intersect. The inner conductor extends along the first direction, and along the second direction, the distance between the inner conductor and the first sidewall is equal to the distance between the inner conductor and the second sidewall.

4. The power divider connector as described in claim 3, characterized in that, The outer conductor also includes: A first connecting wall extends along the first direction and connects to both the first sidewall and the second sidewall. Along a third direction, the first connecting wall is spaced apart from the inner conductor. The first direction intersects the third direction, and the second direction also intersects the third direction. The first sidewall, the second sidewall, and the first connecting wall together define the receiving cavity, and the input port and the one or more output ports both extend through the first sidewall to protrude from the receiving cavity; or, The input port and the one or more output ports both pass through the first connecting wall to extend out of the receiving cavity.

5. The power divider connector as described in claim 4, characterized in that, The first sidewall, the second sidewall, and the first connecting wall are integrally formed.

6. The power divider connector as described in claim 4, characterized in that, The outer conductor also includes: The second connecting wall extends along the first direction and connects to the first side wall and the second side wall respectively. Along the third direction, the second connecting wall and the first connecting wall are spaced apart. The first sidewall, the second sidewall, the first connecting wall, and the second connecting wall together define the receiving cavity, and the input port and the one or more output ports both pass through the second connecting wall to extend out of the receiving cavity.

7. The power divider connector as described in claim 6, characterized in that, The first connecting wall is integrally formed with the first side wall, and the second connecting wall is integrally formed with the second side wall.

8. The power divider connector as described in any one of claims 1 to 7, characterized in that, The input port and the one or more output ports are both made of elastic material.

9. The power divider connector as described in any one of claims 1 to 8, characterized in that, The power divider connector also includes an inner conductor connector, which is connected to the inner conductor and to the outer conductor.

10. The power divider connector as described in claim 9, characterized in that, The outer conductor further includes an outer conductor connector, which is respectively disposed on the first sidewall and the second sidewall, and the outer conductor connector has a recess. The inner conductor connector has a protrusion that is disposed opposite to the recess, and the protrusion engages with the recess along a third direction.

11. The power divider connector as described in claim 9 or 10, characterized in that, The inner conductor connector is integrally injection molded from plastic material with the inner conductor.

12. The power divider connector as described in any one of claims 1 to 11, characterized in that, The outer conductor also includes a connection pin that extends in a third direction for connection to an external circuit board, so that the outer conductor is mounted on the circuit board.

13. The power divider connector as described in any one of claims 1 to 12, characterized in that, The number of outer conductors includes multiple ones, and each of the multiple inner conductors corresponds one-to-one with the multiple outer conductors; The power divider connector also includes a conductive connector, which connects two adjacent outer conductors along the second direction.

14. The power divider connector as described in claim 13, characterized in that, The power divider connector also includes an adsorption connector having a plane, which simultaneously connects to the first connecting walls of multiple outer conductors.

15. A communication device, characterized in that, include: The power divider connector according to any one of claims 1 to 14; The circuit board, wherein the outer conductor of the power divider connector is connected to the circuit board, and the output port and input port of the inner conductor of the power divider connector are electrically connected to the circuit board respectively; The antenna is connected to the circuit board and electrically connected to the output port of the inner conductor through the circuit board.

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