Adhesive film for chip carrier plate and preparation method of stacked film

Abstract

The invention discloses an adhesive film for a chip carrier plate. A glue solution of the adhesive film comprises epoxy resin, thermoplastic resin, a flexibilizer, a curing agent, an inorganic filler, modified nano crystalline cellulose, a flatting agent, an anti-settling agent and a solvent, the inorganic filler comprises coupling agent modified silicon dioxide and organic phosphonic acid doped polyaniline modified zirconium oxide; the organic phosphonic acid doped polyaniline modified zirconium oxide is 2-hydroxyphosphoryl acetic acid doped polyaniline modified zirconium oxide; the modified nano crystalline cellulose is modified by carboxymethylated nano cellulose through octadecyl trimethyl ammonium chloride. Organic phosphonic acid doped polyaniline modified zirconium oxide and coupling agent modified silicon dioxide are compounded, and modified nano crystalline cellulose is uniformly dispersed in an adhesive film to form a compact adhesive film, so that the expansion coefficient of the obtained adhesive film is small, and the water vapor barrier property is improved; the adhesive force with the carrier plate is good in application, and the reliability of the carrier plate is improved; the film surface of the obtained adhesive film is uniform and flat, and manufacturing of a fine circuit and a carrier plate with a smaller aperture is facilitated.

Description

Technical Field

[0001] This invention relates to the field of electronic adhesive technology, specifically to an adhesive film for chip carriers and a method for preparing the deposition film. Background Technology

[0002] Epoxy resins are widely used in various fields, including electrical and electronic materials and film materials, due to their excellent adhesion, flexibility, heat resistance, reagent resistance, insulation, and curing reactivity. In recent years, the miniaturization and high performance of information devices have been rapidly developing, leading to higher performance requirements for materials used in electronic components than ever before. In particular, epoxy resin compositions used in electrical and electronic components require thinner substrates.

[0003] However, epoxy resin molecules contain highly polar hydroxyl groups and ether bonds, which easily form hydrogen bonds with water molecules, resulting in a high moisture absorption rate. If multiple layers are used, including a barrier layer, achieving thinner profiles is difficult, the process is complex, and repeated high-temperature curing negatively impacts the performance of the composite film. Summary of the Invention

[0004] One of the objectives of this invention is to overcome the deficiencies in the prior art and provide an adhesive film for chip carriers. This film is formed by compounding organophosphonic acid-doped polyaniline-modified zirconium oxide with coupling agent-modified silica, and uniformly dispersing modified nanocrystalline cellulose in the film to form a dense film. The resulting film has a small coefficient of thermal expansion and improved moisture barrier properties. Furthermore, it exhibits good adhesion to the carrier in application, enhancing the reliability of the carrier. The resulting film has a uniform and smooth surface, which is also more conducive to the fabrication of carriers with fine lines and smaller apertures.

[0005] To achieve the above-mentioned process effects, the technical solution of the present invention is as follows: an adhesive film for chip carriers, wherein the adhesive liquid of the adhesive film includes epoxy resin, thermoplastic resin, toughening agent, curing agent, inorganic filler, modified nanocrystalline cellulose, leveling agent, anti-settling agent and solvent; The inorganic filler includes coupling agent-modified silica and organophosphonic acid-doped polyaniline-modified zirconium oxide; The organophosphonic acid-doped polyaniline-modified zirconium oxide is made of 2-hydroxyphosphonoacetic acid-doped polyaniline-modified zirconium oxide; The modified nanocrystalline cellulose is made by modifying carboxymethylated nanocellulose with octadecyltrimethylammonium chloride.

[0006] A preferred technical solution is that, by weight, the adhesive solution of the film comprises 20-40 parts epoxy resin, 5-10 parts thermoplastic resin, 10-20 parts toughening agent, 0.5-2 parts curing agent, 60-90 parts inorganic filler, 5-10 parts modified nanocrystalline cellulose, 0.5-3 parts leveling agent, 0.5-2 parts anti-settling agent, and 40-100 parts solvent. Further, by weight, the adhesive solution of the film comprises 25-35 parts epoxy resin, 5-10 parts thermoplastic resin, 10-20 parts toughening agent, 0.5-2 parts curing agent, 65-85 parts inorganic filler, 7-10 parts modified nanocrystalline cellulose, 0.5-3 parts leveling agent, 0.5-2 parts anti-settling agent, and 45-100 parts solvent. Furthermore, by weight, the adhesive solution of the film includes 28-35 parts epoxy resin, 6-10 parts thermoplastic resin, 12-18 parts toughening agent, 0.5-2 parts curing agent, 70-80 parts inorganic filler, 7-10 parts modified nanocrystalline cellulose, 0.5-2.5 parts leveling agent, 0.5-2 parts anti-settling agent, and 50-100 parts solvent.

[0007] A preferred technical solution is that the epoxy resin comprises naphthalene ring epoxy resin and o-cresol formaldehyde epoxy resin in a mass ratio of (1~10):1.

[0008] A preferred technical solution is that the thermoplastic resin includes any one or a combination of at least two of the following: phenoxy resin, polyvinyl acetal resin, polyolefin resin, polybutadiene resin, polyimide resin, polyamide-imide resin, polyether-imide resin, polysulfone resin, polyethersulfone resin, polyphenylene ether resin, polycarbonate resin, polyetheretherketone resin, polyester resin, and acrylic resin; and the toughening agent is epoxy-modified nitrile rubber or core-shell rubber.

[0009] A preferred technical solution is that the curing agent includes a phenolic curing agent and a latent curing agent, the mass ratio of the phenolic curing agent to the latent curing agent is (8~10):1, and the latent curing agent includes dicyandiamide and dicyandiamide accelerator in a mass ratio of 2:1.

[0010] The preferred technical solution is that the mass ratio of coupling agent-modified silica and organophosphonic acid-doped polyaniline-modified zirconium oxide in the inorganic filler is (4~10):1.

[0011] A preferred technical solution is that the modifier of the coupling agent modified silica is γ-glycidoxypropyltrimethoxysilane or γ-aminopropyltriethoxysilane.

[0012] The preferred technical solution is as follows: the modified nanocrystalline cellulose is prepared by first dissolving the fiber raw material in sodium hydroxide solution, then heating it and adding a mixed solution of sodium chloroacetate, water and ethanol for dissolution and dilution. After the reaction is kept at a constant temperature, the raw material is washed to obtain preliminary carboxymethylated nanocellulose. Next, the preliminary carboxymethylated nanocellulose is dissolved in deionized water and ammonium persulfate is added. The mixture is heated to carry out an oxidation reaction to obtain carboxymethylated nanocellulose. Then, octadecyltrimethylammonium chloride is dissolved in ethanol and added to react with the carboxymethylated nanocellulose.

[0013] The second objective of this invention is to overcome the deficiencies in the prior art and provide a method for preparing a deposited film, comprising the following steps: S1: The adhesive solution for preparing release film and adhesive film, and BOPP cover film; S2: Apply adhesive liquid to the surface of the release film and dry it to form an uncured adhesive film; S3: Then heat and bond the adhesive film with the BOPP cover film to obtain a stacked film; The drying temperature is set in zones from 50 to 120°C. The temperature for heating and bonding is 80~100℃; The solvent for the adhesive solution is butanone and / or ethyl acetate.

[0014] The preferred technical solution is that the thickness of the adhesive film is 5~50μm, the thickness of the release film is 25~100μm, and the thickness of the BOPP cover film is 15~50μm.

[0015] The advantages and beneficial effects of this invention are as follows: By combining organophosphonic acid-doped polyaniline-modified zirconium oxide with coupling agent-modified silica, the resulting inorganic filler not only optimizes the expansion coefficient of the adhesive film but also forms a dense film that improves water vapor barrier properties. Furthermore, the uniform dispersion of modified nanocrystalline cellulose within the film further enhances its water vapor barrier properties and improves the adhesion between the film and the subsequent substrate, thus increasing the reliability of the substrate. The resulting film has a uniform and smooth surface, which is also more conducive to the fabrication of substrates with fine circuitry and smaller apertures. Detailed Implementation

[0016] The specific embodiments of the present invention will be further described below with reference to examples. These examples are only used to more clearly illustrate the technical solutions of the present invention and should not be construed as limiting the scope of protection of the present invention.

[0017] Inorganic packing In subsequent applications with copper and aluminum foil, sufficient inorganic fillers need to be added to the adhesive to reduce the coefficient of thermal expansion of the deposited film. However, to improve the dispersibility of the inorganic fillers in the adhesive and form a dense film, the inorganic fillers include coupling agent-modified silica and organophosphonic acid-doped polyaniline-modified zirconium oxide. Furthermore, the mass ratio of coupling agent-modified silica to organophosphonic acid-doped polyaniline-modified zirconium oxide in the inorganic fillers is (4~10):1. The coupling agent modifies silica by adding 3% to 5% γ-glycidoxypropyltrimethoxysilane or γ-aminopropyltriethoxysilane to the silica. The modified silica surface contains amino or epoxy groups. The amino groups can react with the epoxy groups of the epoxy resin, while the epoxy groups can participate in curing and cross-linking.

[0018] In organophosphonic acid-doped polyaniline-modified zirconia, 2-hydroxyphosphonoacetic acid (2-hydroxyphosphonoacetic acid) adheres to the polyaniline surface via electrostatic adsorption, while the phosphate groups on 2-hydroxyphosphonoacetic acid adhere to the zirconia surface via Lewis acid-base chemisorption. Furthermore, the protonated hydroxyl groups on the zirconia surface provide active sites for interaction with the aniline monomer. Since 2-hydroxyphosphonoacetic acid contains carboxyl groups, it reacts with the epoxy groups of the epoxy resin through the action of dicyandiamide and a dicyandiamide accelerator. The interaction between the mixed modified material and zirconia not only improves the compatibility between the filler and the epoxy resin but also, through chemical cross-linking, ensures the uniform distribution of the modified zirconia within the epoxy resin, thereby improving the film density and water vapor barrier properties. The phosphate group on 2-hydroxyphosphonoacetic acid chelates with the metal ions of copper foil (release film) to form an insoluble chelate, and its hydroxyl group forms hydrogen bonds with the hydroxyl group on the surface of the release film, thereby improving corrosion resistance and adhesion to the release film; the amino group of polyaniline can also covalently bond with the hydroxyl group on the surface of the release film, which also improves the adhesion to the release film.

[0019] Preparation of organophosphonic acid-doped polyaniline-modified zirconium oxide: 500 mL of 1 mol / L 2-hydroxyphosphonic acid was dissolved in 2.5 g of zirconium oxide nanoparticles, followed by the dropwise addition of 9.3 g of aniline monomer. Separately, 0.23 g of ammonium persulfate was dissolved in 500 mL of 1 mol / L 2-hydroxyphosphonic acid and added to the reaction solution. The reaction was maintained at a low temperature below 10°C to effectively slow down the formation of polyaniline chains and prevent excessive molecular weight leading to aggregation. The mixture was then filtered, washed, and dried to obtain the product.

[0020] Modified nanocrystalline cellulose Modified nanocrystalline cellulose is derived from carboxymethylated nanocellulose modified with octadecyltrimethylammonium chloride. The addition of carboxylated fibers enhances the intermolecular forces in epoxy resin films, resulting in a denser film. Furthermore, carboxylated cellulose exhibits corrosion-inhibiting capabilities similar to corrosion inhibitors. The partial carboxyl group reaction between octadecyltrimethylammonium chloride and the carboxymethylated nanocellulose gives the modified nanocrystalline cellulose both carboxyl reactive groups, increasing the crosslinking density of the film, and hydrophobic groups, improving its dispersibility in epoxy resins.

[0021] Specifically, S11: First, the fiber raw material (bleached leaf pulp) is degraded by passing it through a sodium hydroxide solution (sodium hydroxide and ethanol are mixed in a mass ratio of 1:20). After heating to 79°C, a mixed solution of sodium chloroacetate, water, and ethanol is added for dissolution and dilution. Sodium chloroacetate and water are mixed in a mass ratio of 1:1, and the addition of ethanol adjusts the concentration of the fiber raw material in the reaction solution to 5%. The mass ratio of fiber raw material, sodium hydroxide, and sodium chloroacetate in the reaction solution is 1:0.6:1.2. After the reaction is kept at a certain temperature, the mixture is washed to obtain preliminary carboxymethylated nanocellulose. S12: Next, 20g of the preliminary carboxymethylated nanocellulose is dissolved in deionized water, and ammonium persulfate is added to ensure that the concentration of ammonium persulfate is 0.6mol / L. The mixture is heated to 70°C for oxidation reaction for 40min to obtain carboxymethylated nanocellulose. S13: Then, 10g of octadecyltrimethylammonium chloride is dissolved in 2L of ethanol and stirred evenly at 45°C. 100g of carboxymethylated nanocellulose is added to react, and then the mixture is washed and freeze-dried.

[0022] The combination of steps S11 and S12 improves the efficiency of fiber carboxymethylation, shortens the modification time, and results in high fiber crystallinity (70%~76%). It converts the -COONa groups of the initially carboxymethylated nanocellulose into -COOH groups, and oxidizes more unetherified -OH groups on the cellulose carbon chains into -COOH groups. Fibers with -COOH groups on their surface improve the thermal stability of the film. The -COOH groups also react with the epoxy groups of the epoxy resin via dicyandiamide and a dicyandiamide accelerator, further improving the film's density and reducing water vapor permeability. Step S13 further modifies and improves the compatibility of the modified nanocrystalline cellulose in the epoxy resin and enhances its hydrophobicity, thereby optimizing the barrier and anti-corrosion properties of the film.

[0023] Preparation of stacked films An adhesive is applied to the surface of the release film and dried to form an uncured adhesive film. The adhesive film is then heated and bonded to the BOPP cover film to obtain a stacked film consisting of the release film, adhesive film, and cover film.

[0024] BOPP cover film is a non-polar, highly crystalline material with extremely low water vapor permeability, making it one of the best water-blocking films among common plastic films. This effectively prevents it from absorbing moisture from the environment during storage and transportation. The surface of the BOPP cover film is very smooth. During the lamination process with the adhesive film, when this surface faces the hot plate or steel plate of the press, the smooth surface helps with even heating and facilitates demolding, preventing it from sticking to the press.

[0025] When using the stacked film, first peel off the release film to expose the highly clean and active adhesive surface, and precisely align and bond it with the first copper or aluminum foil. Then, with the BOPP cover film side up, place it in the press for the first stage of pre-pressing. The presence of the BOPP film at this stage prevents the adhesive film from being contaminated or damaged during positioning and pre-pressing. Before or initially before the final pressing, the BOPP cover film needs to be peeled off again, and then the second copper or aluminum foil is stacked on top for complete vacuum hot pressing.

[0026] raw material The naphthalene ring epoxy resin used is from DIC Corporation, model: HP5000, HP6000, HP4032, HP4700, HP4710. The o-cresol formaldehyde epoxy resin is from Nan Ya Plastics, model: NPCN701, NPCN702, NPCN703, NPCN-704. The polyvinyl acetal resin used is from Sekisui Chemicals Co., Ltd. of Japan, and is one of the following models: KS-1, KS-3, KS-5Z, KS-23Z, BL-1, BL-10BL-S. The phenolic curing agent used is from Chun-Ying Chemical Industry Co., Ltd., model number: PS-4271, PS-6200, PS-4360, PS-6362, PS-4326. The toughening agent used is from Guodu Chemical, specifically one of the following models: KR-170, KR-207, KR-309, KR-450, KR-818, KR-909, or KR-627.

[0027] Example 1

[0028] By weight, the adhesive solution for the chip carrier film includes 30 parts epoxy resin, 7 parts thermoplastic resin, 15 parts toughening agent, 1 part curing agent, 75 parts inorganic filler, 8 parts modified nanocrystalline cellulose, 2 parts leveling agent, 1.5 parts anti-settling agent, and 70 parts solvent.

[0029] The epoxy resin comprises naphthalene-based epoxy resin (DIC Corporation HP5000) and o-cresylformaldehyde epoxy resin (Nanya Plastics NPCN701) in a mass ratio of 5:1. The thermoplastic resin is polyvinyl alcohol acetal resin (Sekisui Chemicals Co., Ltd. KS-1). The toughening agent is epoxy-modified nitrile rubber. The inorganic fillers include γ-aminopropyltriethoxysilane-modified silica and organophosphonic acid-doped polyaniline-modified zirconium oxide in a mass ratio of 8:1. The modified nanocrystalline cellulose is prepared by the above method. The curing agent comprises phenolic curing agent (Kun-ei Chemical Industry Co., Ltd. PS-4271) in a mass ratio of 9:1 and a latent curing agent, the latent curing agent comprising dicyandiamide (99% purity, analytical grade) and dicyandiamide accelerator (Complex High-Tech Materials (Shanghai) Co., Ltd. HUA-5050) in a mass ratio of 2:1. The solvent is ethyl acetate.

[0030] The method for preparing a deposited film includes the following steps: S1: The adhesive solution for preparing release film and adhesive film, and BOPP cover film; S2: Apply adhesive to the surface of the release film and dry it to form an uncured film. The drying zones are set with temperatures of 50℃, 70℃, 90℃, 110℃, 120℃, and 90℃ respectively. The drying chamber is 24 meters long and the film conveying speed is 10 cm / min.

[0031] S3: Then heat and bond the adhesive film and BOPP cover film together at a temperature of 80℃ to obtain the stacked film.

[0032] The thickness of the adhesive film is 25μm, the thickness of the release film is 50μm, and the thickness of the BOPP cover film is 30μm.

[0033] Example 2

[0034] Example 2 is based on Example 1, except that, by weight, the adhesive solution for the chip carrier film includes 30 parts epoxy resin, 7 parts thermoplastic resin, 15 parts toughening agent, 1 part curing agent, 75 parts inorganic filler, 2 parts modified nanocrystalline cellulose, 2 parts leveling agent, 1.5 parts anti-settling agent, and 70 parts solvent. The process remains unchanged.

[0035] Example 3

[0036] Example 3 is based on Example 1, except that, by weight, the adhesive solution for the chip carrier film includes 30 parts epoxy resin, 7 parts thermoplastic resin, 15 parts toughening agent, 1 part curing agent, 75 parts inorganic filler, 15 parts modified nanocrystalline cellulose, 2 parts leveling agent, 1.5 parts anti-settling agent, and 70 parts solvent. The process remains unchanged.

[0037] Example 4

[0038] Example 4 is based on Example 1, except that, by weight, the adhesive solution for the chip carrier film includes 30 parts epoxy resin, 2 parts thermoplastic resin, 15 parts toughening agent, 1 part curing agent, 75 parts inorganic filler, 8 parts modified nanocrystalline cellulose, 2 parts leveling agent, 1.5 parts anti-settling agent, and 70 parts solvent. The process remains unchanged.

[0039] Example 5

[0040] Example 5 is based on Example 1, except that, by weight, the adhesive solution for the chip carrier film includes 30 parts epoxy resin, 7 parts thermoplastic resin, 15 parts toughening agent, 1 part curing agent, 100 parts inorganic filler, 8 parts modified nanocrystalline cellulose, 2 parts leveling agent, 1.5 parts anti-settling agent, and 70 parts solvent. The process remains unchanged.

[0041] Example 6

[0042] Example 6 is based on Example 1, except that step S12 is not included in the preparation of the modified nanocrystalline cellulose. The nanocrystalline cellulose only undergoes preliminary carboxymethylation and reacts with octadecyltrimethylammonium chloride. The process remains unchanged.

[0043] Example 7

[0044] Example 7 is based on Example 1, except that the mass ratio of coupling agent-modified silica and organophosphonic acid-doped polyaniline-modified zirconium oxide in the inorganic filler is 4:1, while other components and processes remain unchanged.

[0045] Comparative Example 1 Comparative Example 1 is based on Example 1, except that the inorganic filler is only silica modified with coupling agent, while other components and processes remain unchanged.

[0046] Comparative Example 2 Comparative Example 2 is based on Example 1, except that the adhesive solution of the film does not include modified nanocrystalline cellulose, while other components and processes remain unchanged.

[0047] Performance testing of the examples and comparative samples: 1. Peel strength: Press both sides of the adhesive film with copper foil and bake at 200℃ for 90 minutes. Cut the sample into 250mm long * 10mm wide pieces. Use double-sided tape to attach the copper foil side of the sample to the aluminum plate. Use a universal testing machine to stretch the sample at a 90° angle and test the peel strength between the copper foil and the adhesive film at a speed of 50mm / min.

[0048] 2. Coefficient of thermal expansion: The adhesive film was baked and cured at 200℃ for 90 minutes. The sample was cut into 8mm long * 4mm wide pieces and tested with a Discovery TMA450 thermomechanical analyzer. The heating rate was 8℃ / min, from 30℃ to 300℃. The average coefficient of thermal expansion from 30℃ to 300℃ was calculated.

[0049] 3. Elongation and modulus: The film was baked and cured at 200℃ for 90 minutes. The sample was cut into 100mm long and 10mm wide pieces and tested with a universal testing machine.

[0050] 4. Water vapor barrier properties: The water vapor barrier properties of the film were evaluated using a water vapor transmission rate tester (Labthink, W3-031, China) at 38℃ and 90% relative humidity.

[0051] The performance test results of the examples and comparative examples are as follows:

[0052] Standard requirement: Peel strength of ≥0.5 kgf / cm.

[0053] Compared to Example 1, Example 4 shows a reduction in the content of thermoplastic resin in the adhesive solution, resulting in decreased toughness and reduced ability to buffer and release internal stress during heat deformation. The warpage test (where the adhesive film and silicon wafer are molded into a 300mm diameter, 400µm thick disc, cured at 125°C for 10 minutes, then the mold is opened, and the wafer is placed in an oven at 150°C for 1 hour for further curing, at which point the degree of wafer warpage is tested) fails the test.

[0054] Compared to Example 1, Example 6 shows that the nanocellulose only undergoes preliminary carboxymethylation, resulting in poor crystallinity and a reduction in carboxyl groups. This is detrimental to its reaction with octadecyltrimethylammonium chloride, negatively impacting its dispersibility in the adhesive solution. Furthermore, the crosslinking density with epoxy is reduced, negatively affecting its water vapor barrier properties.

[0055] Compared to Example 1, Example 7 showed improved peel strength and optimized moisture barrier properties of the adhesive film, but also increased production costs.

[0056] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A film for chip carrier boards, characterized in that, The adhesive solution of the film includes epoxy resin, thermoplastic resin, toughening agent, curing agent, inorganic filler, modified nanocrystalline cellulose, leveling agent, anti-settling agent and solvent; The inorganic filler includes coupling agent-modified silica and organophosphonic acid-doped polyaniline-modified zirconium oxide; The organophosphonic acid-doped polyaniline-modified zirconium oxide is made of 2-hydroxyphosphonoacetic acid-doped polyaniline-modified zirconium oxide; The modified nanocrystalline cellulose is made by modifying carboxymethylated nanocellulose with octadecyltrimethylammonium chloride.

2. The adhesive film for chip carriers according to claim 1, characterized in that, By weight, the adhesive solution of the film comprises 20-40 parts epoxy resin, 5-10 parts thermoplastic resin, 10-20 parts toughening agent, 0.5-2 parts curing agent, 60-90 parts inorganic filler, 5-10 parts modified nanocrystalline cellulose, 0.5-3 parts leveling agent, 0.5-2 parts anti-settling agent, and 40-100 parts solvent.

3. The adhesive film for chip carriers according to claim 1 or 2, characterized in that, The epoxy resin comprises naphthalene ring epoxy resin and o-cresol formaldehyde epoxy resin in a mass ratio of (1~10):

1.

4. The adhesive film for chip carriers according to claim 1 or 2, characterized in that, The thermoplastic resin includes any one or a combination of at least two of the following: phenoxy resin, polyvinyl acetal resin, polyolefin resin, polybutadiene resin, polyimide resin, polyamide-imide resin, polyether-imide resin, polysulfone resin, polyethersulfone resin, polyphenylene ether resin, polycarbonate resin, polyetheretherketone resin, polyester resin, and acrylic resin; the toughening agent is epoxy-modified nitrile rubber or core-shell rubber.

5. The adhesive film for chip carriers according to claim 2, characterized in that, The curing agent includes a phenolic curing agent and a latent curing agent, wherein the mass ratio of the phenolic curing agent to the latent curing agent is (8~10):1, and the latent curing agent includes dicyandiamide and dicyandiamide accelerator in a mass ratio of 2:

1.

6. The adhesive film for chip carriers according to claim 1 or 2, characterized in that, The mass ratio of coupling agent-modified silica and organophosphonic acid-doped polyaniline-modified zirconium oxide in the inorganic filler is (4~10):

1.

7. The adhesive film for chip carriers according to claim 6, characterized in that, The modifier for the coupling agent-modified silica is γ-glycidoxypropyltrimethoxysilane or γ-aminopropyltriethoxysilane.

8. The adhesive film for chip carriers according to claim 1 or 2, characterized in that, The preparation of the modified nanocrystalline cellulose is as follows: First, the fiber raw material is decomposed by sodium hydroxide solution, and after heating, a mixed solution of sodium chloroacetate, water and ethanol is added for dissolution and dilution. After the reaction is kept at a constant temperature, the raw material is washed to obtain preliminary carboxymethylated nanocellulose. Then, the preliminary carboxymethylated nanocellulose is dissolved in deionized water, and ammonium persulfate is added. The mixture is heated to carry out an oxidation reaction to obtain carboxymethylated nanocellulose. Then, octadecyltrimethylammonium chloride is dissolved in ethanol and added to react with the carboxymethylated nanocellulose.

9. A method for preparing a deposited film, characterized in that, Includes the following steps: S1: The adhesive solution for preparing release film and adhesive film, and BOPP cover film; S2: Apply adhesive liquid to the surface of the release film and dry it to form an uncured adhesive film; S3: Then heat and bond the adhesive film with the BOPP cover film to obtain a stacked film; The drying temperature is set in zones from 50 to 120°C. The temperature for heating and bonding is 80~100℃; The solvent for the adhesive solution is butanone and / or ethyl acetate.

10. The method for preparing a deposited film according to claim 9, characterized in that, The thickness of the adhesive film is 5~50μm, the thickness of the release film is 25~100μm, and the thickness of the BOPP cover film is 15~50μm.

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