Silica particle and preparation method thereof, polishing solution, carrier and adsorption material

Abstract

The invention discloses silicon dioxide particles and a preparation method thereof, a polishing solution, a carrier and an adsorption material, and belongs to the field of non-spherical silicon dioxide. Wherein the silicon dioxide particles comprise silicon dioxide and polyether amine located on at least part of the surface of the silicon dioxide; the microtopography of the silicon dioxide particles is ellipsoid, and the surfaces of the silicon dioxide particles are provided with protruding structures. Compared with the prior art, the silicon dioxide particles with the special microtopography are provided, the microtopography of the silicon dioxide particles is ellipsoid, and the surfaces of the silicon dioxide particles are provided with the protruding structures, so that the polishing efficiency can be improved; meanwhile, polyether amine is introduced to the surfaces of the silicon dioxide particles, the lubricating and buffering effects can be achieved, scratches generated in the polishing process of the wafer are reduced, and the quality of the wafer is improved. Besides, polyether amine can be removed from the silicon dioxide particles by means of roasting and the like to form aspheric silicon dioxide particles with porous structures, and the aspheric silicon dioxide particles are further applied to the fields of carrier materials, adsorption materials and the like and are wide in application.

Description

Technical Field

[0001] This application belongs to the field of non-spherical silica, specifically relating to a silica particle and its preparation method, polishing slurry, carrier, and adsorption material. Background Technology

[0002] In semiconductor manufacturing processes, chemical mechanical polishing (CMP) is a crucial step in achieving global planarization, and it has wide applications in shallow trench isolation (STI), interlayer dielectric (ILD), and advanced packaging. Silica, with its moderate hardness and excellent dispersion stability, has become one of the commonly used abrasives in the field of chemical mechanical polishing.

[0003] Currently, most colloidal silica particles prepared using classic methods such as the Stöber process and its improved versions are spherical. Although spherical silica particles have advantages such as mature preparation processes, narrow particle size distribution, and good colloidal stability, they have gradually revealed many limitations in chemical mechanical polishing applications. For example, the contact area between spherical silica particles and wafers is small, and the movement is mostly rolling friction, resulting in a low polishing rate.

[0004] To overcome the performance bottlenecks of spherical abrasives, researchers have recently explored the feasibility of using anisotropic non-spherical silica particles as chemical mechanical polishing (CMP) abrasives. Research shows that non-spherical abrasive particles can undergo both rolling and sliding friction on wafer surfaces, enhancing the interaction between the abrasive particles and the wafer and effectively improving the polishing rate. However, existing methods for preparing non-spherical silica particles still have some drawbacks. For example, US Patent US005221497A uses metal ions as inducing agents to prepare non-spherical silica particles, but this method leaves a large amount of residual metal ions in the product, which can easily cause metal ion contamination during subsequent polishing, limiting the use of this type of product. In addition, some researchers have used surfactants, such as cetyltrimethylammonium bromide (CTAB) and polyethylene oxide-polypropylene oxide-polyethylene oxide triblock copolymer (P123), as structure directing agents. However, this method is mostly used for controlling mesoporous structures, with limited morphology control, and the subsequent removal of the structure directing agent is also a problem. Summary of the Invention

[0005] This application aims to at least partially address one of the technical problems in related technologies. Therefore, the purpose of this application is to provide silica particles and their preparation method, polishing slurry, carrier, and adsorbent material. Compared to existing technologies, this application provides silica particles with a special microstructure, characterized by elliptical shapes and a raised surface structure, which is beneficial for improving polishing efficiency. Simultaneously, the introduction of polyetheramine onto the surface of the silica particles provides lubrication and buffering, reducing scratches generated on the wafer during polishing and improving wafer quality. Furthermore, the silica particles provided in this application can be further processed by calcination or other methods to remove the polyetheramine, forming porous, non-spherical silica particles, which can then be applied in carrier materials and adsorbent materials, among other fields, with wide-ranging applications.

[0006] The first aspect of this application discloses a silica particle. According to an embodiment of this application, the silica particle comprises: Silicon dioxide; And polyetheramine located on at least a portion of the surface of the silica; The silica particles have an elliptical microstructure and a raised surface.

[0007] Compared with the prior art, the silica particles of the above embodiments of this application provide silica particles with a special microstructure, which are elliptical in shape and have a raised structure on the surface, which is beneficial to improving polishing efficiency. At the same time, the introduction of polyetheramine on the surface of the silica particles can play a lubricating and buffering role, reduce the scratches generated by the wafer during the polishing process, and improve the quality of the wafer.

[0008] In addition, the silica particles according to the above embodiments of this application may also have the following additional technical features: In some embodiments of this application, the general chemical formula of the polyetheramine is as follows: H2N-(CH2CH2O)x-(CH2CH(CH3)O)y–CH2CH2NH2, where x+y=5-50; The number-average molecular weight of the polyetheramine is 200-3000 g / mol.

[0009] In some embodiments of this application, the length of the protrusion structure is less than 5 nm; And / or, the ratio of the major axis to the minor axis of the elliptic is 1.2-2.8.

[0010] In some embodiments of this application, the particle size of the silica particles is 50-200 nm; And / or, the polydispersity index (PDI) of the silica particles is <0.15.

[0011] The second aspect of this application provides a method for preparing silica particles as described in any one of the first aspects above. According to an embodiment of this application, the method for preparing the silica particles includes the following steps: Polyetheramine is dissolved in a water-alcohol mixed solvent to obtain a polyetheramine solution; Under continuous stirring, silicon source is added dropwise to the polyetheramine solution within 12-72 hours to react and obtain the silicon dioxide particles; The polyetheramine acts as a structure directing agent and catalyst, and the molar ratio of the polyetheramine to the silicon source is (0.001-0.5):1.

[0012] The method for preparing silica particles described in the above embodiments of this application, based on the preparation of silica through silane hydrolysis-condensation reaction, for the first time utilizes polyetheramine as a structure directing agent and catalyst to prepare silica particles with the aforementioned special microstructure. Specifically: on the one hand, the amino groups of the polyetheramine molecule provide basic sites to catalyze the reaction, acting as a catalyst; simultaneously, the steric hindrance generated by its flexible polyether backbone in solution and the local microenvironmental differences formed by the hydrophobic segments on the polyetheramine cause anisotropic growth of silica, regulating and inducing the formation of the aforementioned non-spherical silica particles with the special morphological structure, thus acting as a structure directing agent.

[0013] In addition, the method for preparing silica particles according to the above embodiments of this application may also have the following additional technical features: In some embodiments of this application, the reaction temperature is 20-60°C.

[0014] In some embodiments of this application, the silicon source includes at least one selected from tetraethoxysilane, tetramethoxysilane, tetrapropoxysilane, tetrabutoxysilane, and orthosilicic acid; And / or, the polyetheramine includes at least one of polyetheramine D230, polyetheramine D400 and polyetheramine D2000; And / or, the water-alcohol mixed solvent is composed of an alcohol solvent and water in a mass ratio of (1-5):1, wherein the alcohol solvent includes at least one of methanol, ethanol, isopropanol and n-propanol.

[0015] A third aspect of this application discloses a polishing slurry. According to an embodiment of this application, the polishing slurry comprises silicon dioxide particles as described in any one of the first aspects, or silicon dioxide particles prepared using the method described in any one of the second aspects. This significantly improves the polishing effect and other performance characteristics of the polishing slurry on wafers.

[0016] A fourth aspect of this application discloses a carrier. According to an embodiment of this application, the carrier is obtained by calcining silica particles as described in the first aspect or silica particles prepared using the method described in the second aspect. This yields a carrier with a special morphological structure, which can improve its surface area, etc.

[0017] The fifth aspect of this application discloses an adsorbent material. According to an embodiment of this application, the adsorbent material is obtained by calcining silica particles as described in the first aspect or silica particles prepared using the method described in the second aspect. This yields an adsorbent material with a special morphological structure, which can increase its surface area, etc.

[0018] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0019] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a microscopic morphology diagram of the silica particles provided in Example 1 of this application.

[0020] Figure 2 The image shows the microstructure of the silica particles provided in Comparative Example 1 of this application.

[0021] Figure 3 The image shows the microstructure of the silica particles provided in Comparative Example 2 of this application. Detailed Implementation

[0022] The embodiments of this application are described in detail below, and the embodiments described below with reference to the accompanying drawings are merely exemplary and intended to explain this application, and should not be construed as limiting this application.

[0023] The first aspect of this application discloses a silica particle. According to an embodiment of this application, the silica particle comprises: Silicon dioxide; And polyetheramine located on at least a portion of the surface of the silica; The silica particles have an elliptical microstructure and a raised surface.

[0024] Compared to the prior art, the silica particles in the above embodiments of this application provide silica particles with a special microstructure, such as... Figure 1As shown, its microstructure is elliptical and has a raised structure on the surface, which is beneficial to improving polishing efficiency. At the same time, the introduction of polyetheramine on the surface of silica particles can play a role in lubrication and buffering, reducing the scratches generated by the wafer during the polishing process and improving the quality of the wafer.

[0025] In this application, the aforementioned polyetheramine is a type of polymer with a polyether as the main chain and an amino group (-NH2) at the end. Its core structure consists of polyether segments (such as polyethylene glycol, polypropylene glycol, or ethylene glycol / propylene glycol copolymers) and terminal amino groups, with methylene chains connected by ether bonds (-O-) to form a flexible main chain. Specifically, it may include commercially available D-series products such as D230, D400, and D2000.

[0026] In this application, the aforementioned protruding structure specifically refers to silicon dioxide particles that are protruding on the elliptical microscopic surface of the silicon dioxide particles as a whole, and may also be referred to as bumps or protruding structures.

[0027] In addition, the silica particles according to the above embodiments of this application may also have the following additional technical features: According to some specific embodiments of this application, the general chemical formula of the polyetheramine is as follows: H2N-(CH2CH2O)x-(CH2CH(CH3)O)y–CH2CH2NH2, where x+y=5-50, and the value of "x+y" can be 5, 10, 15, 20, 30, 40, 50, etc.

[0028] According to some specific embodiments of this application, the number average molecular weight of the polyetheramine is 200-3000 g / mol, for example, it can be 200 g / mol, 230 g / mol, 2000 g / mol, etc.

[0029] According to some specific embodiments of this application, the length of the protrusion structure is less than 5 nm, for example, it can be 2 nm, 3 nm, etc.; and / or, the ratio of the major axis to the minor axis of the elliptic is 1.2-2.8, for example, it can be 1.5, 1.7, 2.0, 2.1, 2.3, 2.5, 2.8 or any of the above values; and / or, the particle size of the silica particles is 50-200 nm, for example, it can be 50 nm, 65 nm, 70 nm, 80 nm, 100 nm, 120 nm, 150 nm, 180 nm, 200 nm or any of the above values; and / or, the polydispersity index (PDI) of the silica particles is <0.15, for example, it can be 0.12, 0.10, 0.80, 0.50, etc. The silica particles provided in this application, by having the aforementioned characteristics such as protruding structure, ratio of long axis to short axis, and particle size parameters, are beneficial to improving the polishing effect of the polishing slurry and thus improving the surface quality of the polished wafer.

[0030] The second aspect of this application provides a method for preparing silica particles as described in any one of the first aspects above. According to an embodiment of this application, the method for preparing the silica particles includes the following steps: Polyetheramine is dissolved in a water-alcohol mixed solvent to obtain a polyetheramine solution; Under continuous stirring, silicon source is added dropwise to the polyetheramine solution within 12-72 hours to react and obtain the silicon dioxide particles; The polyetheramine acts as a structure directing agent and catalyst, and the molar ratio of the polyetheramine to the silicon source is (0.001-0.5):1.

[0031] The method for preparing silica particles described in the above embodiments of this application, based on the preparation of silica through silane hydrolysis-condensation reaction, for the first time utilizes polyetheramine as a structure directing agent and catalyst to prepare silica particles with the aforementioned special microstructure. Specifically: on the one hand, the amino groups of the polyetheramine molecule provide basic sites to catalyze the reaction, acting as a catalyst; simultaneously, the steric hindrance generated by its flexible polyether backbone in solution and the local microenvironmental differences formed by the hydrophobic segments on the polyetheramine cause anisotropic growth of silica, regulating and inducing the formation of the aforementioned non-spherical silica particles with the special morphological structure, thus acting as a structure directing agent.

[0032] Meanwhile, the main reactions involved in the above preparation method of this application are as follows: In the reaction system, the polyetheramine is partially protonated to form protonated polyetheramine (R-NH3). + A system in which ) coexists with unprotonated polyetheramine (R-NH2); the amino group in the unprotonated polyetheramine catalyzes the hydrolysis and condensation reaction of silane: Si(OR)4+H2O → Si(OH)4→ Si-O-Si.

[0033] The molar ratio of polyetheramine to silicon source in this application is (0.001-0.5):1, for example, it can be 0.001:1, 0.005:1, 0.008:1, 0.01:1, 0.05:1, 0.08:1, 0.1:1, 0.15:1, 0.2:1, 0.2:1, 0.4:1, 0.5:1, or any range between the above values. If the molar ratio of polyetheramine to silicon source in this application is too small (i.e., the amount of polyetheramine is too small), it cannot play an effective catalytic and morphology control role, resulting in the failure to successfully prepare silica particles with the above-mentioned special microstructure; at the same time, if the molar ratio of polyetheramine to silicon source is too large (i.e., the amount of polyetheramine is too large), it will inhibit the formation of silica network, and ultimately it will be impossible to form particulate silica.

[0034] The specific addition time of the silicon source described in this application can be 12h, 18h, 24h, 30h, 48h, 72h, or any range between the above values, preferably 24h. This application uses a slow addition method (preferably at a constant rate) to add the silicon source to the mixed solution for reaction, and prepares silicon dioxide particles by adding the silicon source while reacting, which is beneficial for forming silicon dioxide particles with the above-mentioned special microstructure.

[0035] In addition, the method for preparing silica particles according to the above embodiments of this application may also have the following additional technical features: According to some specific embodiments of this application, the reaction temperature is 20-60°C, for example, it can be 20°C, 25°C, 30°C, 45°C, 60°C or any range between the above values.

[0036] According to some specific embodiments of this application, the silicon source includes at least one selected from tetraethoxysilane, tetramethoxysilane, tetrapropoxysilane, tetrabutoxysilane, and orthosilicic acid. This application does not specifically limit the silicon source material; the examples provided are merely illustrative. Other suitable silane compounds can be adaptively selected as silicon sources based on the disclosures in the art. Furthermore, the molar concentration of the silicon source can be 0.1-2.5 mol / L (e.g., 0.1 mol / L, 0.3 mol / L, 0.5 mol / L, 0.8 mol / L, 1.0 mol / L, 1.2 mol / L, 1.5 mol / L, 1.8 mol / L, 2.0 mol / L, 2.5 mol / L, etc.), preferably 0.5-1.5 mol / L.

[0037] According to some specific embodiments of this application, the polyetheramine is preferably a polyetheramine with a number average molecular weight of 200-3000 g / mol, and may specifically include commercially available products such as polyetheramine D230, polyetheramine D400 and polyetheramine D2000; D230 is preferred.

[0038] According to some specific embodiments of this application, the water-alcohol mixed solvent is composed of an alcohol solvent and water in a mass ratio of (1-5):1 (the mass ratio of alcohol solvent to water can be 1:1, 1.8:1, 2.5:1, 3:1, 4:1, etc.), and the alcohol solvent includes at least one of methanol, ethanol, isopropanol and n-propanol; preferably ethanol.

[0039] A third aspect of this application discloses a polishing slurry. According to an embodiment of this application, the polishing slurry comprises silicon dioxide particles as described in any one of the first aspects, or silicon dioxide particles prepared using the method described in any one of the second aspects. This significantly improves the polishing effect and other performance characteristics of the polishing slurry on wafers.

[0040] A fourth aspect of this application discloses a carrier. According to an embodiment of this application, the carrier is obtained by calcining silica particles as described in any one of the first aspects or silica particles prepared using the method described in any one of the second aspects. This yields a carrier with a special morphological structure, which can improve its surface area, etc. For example, silica particles can be calcined in an air atmosphere at 400-600℃ (e.g., 400℃, 500℃, 600℃, etc.) for 2-6 hours (e.g., 2 hours, 3 hours, 5 hours, etc.) to remove polyetheramine, forming a mesoporous structure and obtaining a specific surface area greater than 200 m². 2 / g of porous silica particles can be used as a carrier for further applications.

[0041] The fifth aspect of this application discloses an adsorbent material. According to an embodiment of this application, the adsorbent material is obtained by calcining silica particles as described in any one of the first aspects or silica particles prepared using the method described in any one of the second aspects. This yields an adsorbent material with a special morphological structure, which can increase its surface area, etc. For example, silica particles can be calcined in an air atmosphere at 400-600℃ (e.g., 400℃, 500℃, 600℃, etc.) for 2-6 hours (e.g., 2 hours, 3 hours, 5 hours, etc.) to remove polyetheramine, form a mesoporous structure, and obtain a specific surface area greater than 200 m². 2 / g of porous silica particles can be further used as an adsorbent material.

[0042] The embodiments of this application are described in detail below. It should be noted that the embodiments described below are exemplary and are only used to explain this application, and should not be construed as limiting this application. In addition, unless otherwise specified, all reagents used in the following embodiments are commercially available or can be synthesized according to the methods described herein or known methods. For reaction conditions not listed, they are also readily available to those skilled in the art.

[0043] Example 1 This embodiment provides a silica particle comprising silica and a polyetheramine located on at least a portion of the surface of the silica.

[0044] The preparation method of the above-mentioned silica particles includes the following steps: 0.04 mol / L of polyetheramine (specifically polyetheramine D230) was added to a mixed solvent consisting of ethanol and water in a mass ratio of 3:1. Subsequently, at a temperature of 40°C and a rotation speed of 300 rpm, 0.8 mol / L of silicon source (specifically tetraethoxysilane, TEOS; the molar ratio of polyetheramine to silicon source was 0.05:1) was added dropwise to the reaction system over a period of 24 h.

[0045] Example 2 This embodiment provides silica particles and their preparation method, which differ from Embodiment 1 only in that: (1) The polyetheramine was adjusted to polyetheramine D400.

[0046] Example 3 This embodiment provides silica particles and their preparation method, which differ from Embodiment 1 only in that: (1) The polyetheramine was adjusted to polyetheramine D2000.

[0047] Example 4 This embodiment provides silica particles and their preparation method, which differ from Embodiment 1 only in that: (1) The molar ratio of polyetheramine to silicon source is 0.01:1.

[0048] Example 5 This embodiment provides silica particles and their preparation method, which differ from Embodiment 1 only in that: (1) The molar ratio of polyetheramine to silicon source is 0.1:1.

[0049] Example 6 This embodiment provides silica particles and their preparation method, which differ from Embodiment 1 only in that: (1) The molar ratio of polyetheramine to silicon source is 0.1:1; (2) The polyetheramine is D400.

[0050] Example 7 This embodiment provides a silica particle comprising silica and a polyetheramine located on at least a portion of the surface of the silica.

[0051] The preparation method of the above-mentioned silica particles includes the following steps: 0.024 mol / L of polyetheramine (specifically polyetheramine D230) was added to a mixed solvent consisting of methanol and water in a mass ratio of 3:1. Subsequently, at a temperature of 40°C and a rotation speed of 300 rpm, 0.8 mol / L of silicon source (specifically tetramethoxysilane, TMOS; the molar ratio of polyetheramine to silicon source was 0.05:1) was added dropwise to the reaction system over a period of 24 h.

[0052] Example 8 This embodiment provides a silica particle comprising silica and a polyetheramine located on at least a portion of the surface of the silica.

[0053] The preparation method of the above-mentioned silica particles includes the following steps: 0.04 mol / L of polyetheramine (specifically polyetheramine D230) was added to a mixed solvent consisting of isopropanol and water in a mass ratio of 3:1. Subsequently, 0.8 mol / L of silicon source (specifically tetrapropoxysilane, TPOS; the molar ratio of polyetheramine to silicon source was 0.05:1) was added dropwise to the reaction system at a temperature of 40°C and a rotation speed of 300 rpm for 24 h.

[0054] Example 9 This embodiment provides silica particles, and the preparation method includes the following steps: 0.008 mol / L of polyetheramine (specifically polyetheramine D400) was added to a mixed solvent consisting of ethanol and water in a mass ratio of 3:1. Subsequently, 0.8 mol / L of silicon source (specifically TEOS; the molar ratio of polyetheramine to silicon source was 0.01:1) was added dropwise to the reaction system at a temperature of 40°C and a rotation speed of 300 rpm for 24 h.

[0055] The silica particles were centrifuged and then dried in a forced-air drying oven at 60°C. They were then calcined at 500°C for 4 hours in air to obtain the calcined product – porous silica particles.

[0056] Comparative Example 1 This comparative example provides silica particles and their preparation method, which differ from Example 1 only in that: (1) Replace the polyetheramine in Example 1 with 0.5 mol / L ammonia.

[0057] Comparative Example 2 This comparative example provides silica particles and their preparation method, which differ from Example 2 only in that: (1) Replace the polyetheramine in Example 1 with 0.04 mol / L ethylenediamine.

[0058] Comparative Example 3 This comparative example provides silica particles and their preparation method, which differ from Example 1 only in that: (1) Adjust the molar ratio of polyetheramine and silicon source in Example 1 to 0.8:1.

[0059] In this comparative example, no particulate silica was formed.

[0060] Comparative Example 4 This comparative example provides silica particles and their preparation method, which differ from Example 1 only in that: (1) Adjust the silicon source addition time in Example 1 to 4h.

[0061] The comparative example did not ultimately form silica particles with the same special microstructure as Example 1. After being left for a period of time, some particles settled, and the PDI of the obtained silica particles was >0.15, which could not meet the requirements for use as polishing abrasive.

[0062] Test Example 1 This test example characterizes the microstructure and physicochemical parameters of the silica particles obtained in Examples 1, 9 and Comparative Examples 1-2. The microstructure was characterized using scanning electron microscopy (SEM), and the particle size was measured using a nanoparticle size analyzer (dynamic light scattering method).

[0063] The test results are shown below: Depend on Figure 1 It can be seen that the silica particles provided in Example 1 of this application have a particle size of 98.83 nm and a PDI index of 0.121, and their microstructure is an ellipsoidal non-spherical shape with a major axis of 160 nm, a minor axis of 90 nm, and a major axis to minor axis ratio of 1.8; at the same time, the surface of the silica particles is distributed with protrusions with a length of less than 5 nm.

[0064] The silica particles (before calcination) provided in Example 9 of this application have a particle size of 95.66 nm and a PDI index of 0.130. Their microstructure is an ellipsoidal, non-spherical shape, and the surface is distributed with protrusions less than 5 nm in length and mesoporous structures (most probable pore size of 4.54 nm). BET testing shows a specific surface area of ​​218 m². 2 / g.

[0065] Depend on Figure 2 It can be seen that the silica particles provided in Comparative Example 1 of this application have a particle size of 85.38 nm and a conventional spherical morphology.

[0066] Depend on Figure 3 It can be seen that the silica particles provided in Comparative Example 2 of this application have a particle size of 100.85 nm and a conventional spherical morphology.

[0067] Test Example 2 In this test example, the silica particles obtained in the above examples and comparative examples were used as abrasives to prepare a polishing slurry (the silica particle solid content was diluted to 1 wt.% with deionized water and the pH was adjusted to 10 with ammonia water to obtain the polishing slurry) for wafer polishing. The specific polishing conditions included: 1) Polishing pad: polyurethane; 2) Polishing pressure: 2 psi; 3) Wafer: 4-inch silicon wafer; 4) Grinding head speed: 57 rpm; 5) Grinding disc speed: 63 rpm; 6) Polishing slurry flow rate: 200 mL / min; 7) Polishing time: 2 min; 8) Cleaning after polishing: rinsing with deionized water for 1 min.

[0068] Performance testing methods: 1. Wafer surface roughness Ra detection: AFM (Atomic Force Microscopy) detection.

[0069] 2. Wafer Polishing Removal Rate Calculation: Weigh the silicon wafers before and after polishing, and calculate the removal rate using the following formula ( ): Where Δm is the difference in silicon wafer quality before and after polishing; ρ is the silicon wafer density; S is the silicon wafer surface area; and T is the polishing time.

[0070] The test results are shown in Table 1.

[0071] Table 1

[0072] As shown in Table 1: Examples 1-8 show silica particles prepared using polyetheramine as a catalyst, exhibiting superior overall performance compared to Comparative Example 1 (ammonia) and Comparative Example 2 (ethylenediamine): higher MRR and lower Ra. The fundamental reason lies in the fact that polyetheramine possesses long-chain ether groups and amino groups, which act as morphology guiding agents during the sol-gel process, inducing the formation of cocoon-like particles and surface-protruding nanostructures. This unique morphology significantly enhances the shearing action between the abrasive particles and the wafer surface during polishing, thereby improving material removal efficiency. While ammonia and ethylenediamine contain amino groups, their short molecular chains result in randomly spherical silica particles, limiting the polishing rate. Furthermore, the long-chain structure of polyetheramine, after leaving residue on the particle surface, allows its ether oxygen groups and amino groups to synergistically form a dynamic lubricating film, reducing hard contact and frictional damage at the polishing interface. This ensures high material removal rates while reducing surface roughness.

[0073] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0074] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A type of silica particles, characterized in that, include: Silicon dioxide; And polyetheramine located on at least a portion of the surface of the silica; The silica particles have an elliptical microstructure and a raised surface.

2. The silica particles according to claim 1, characterized in that, The general chemical formula of the polyetheramine is as follows: H2N-(CH2CH2O)x-(CH2CH(CH3)O)y–CH2CH2NH2, where x+y=5-50; The number-average molecular weight of the polyetheramine is 200-3000 g / mol.

3. The silica particles according to claim 1, characterized in that, The length of the protrusion structure is less than 5 nm; And / or, the ratio of the major axis to the minor axis of the elliptic is 1.2-2.

8.

4. The silica particles according to claim 1, characterized in that, The silica particles have a particle size of 50-200 nm; And / or, the polydispersity index (PDI) of the silica particles is <0.

15.

5. A method for preparing silica particles according to any one of claims 1 to 4, characterized in that, Includes the following steps: Polyetheramine is dissolved in a water-alcohol mixed solvent to obtain a polyetheramine solution; Under continuous stirring, silicon source is added dropwise to the polyetheramine solution within 12-72 hours to react and obtain the silicon dioxide particles; The polyetheramine acts as a structure directing agent and catalyst, and the molar ratio of the polyetheramine to the silicon source is (0.001-0.5):

1.

6. The method for preparing silica particles according to claim 5, characterized in that, The reaction temperature is 20-60℃.

7. The method for preparing silica particles according to claim 5, characterized in that, The silicon source includes at least one of tetraethoxysilane, tetramethoxysilane, tetrapropoxysilane, tetrabutoxysilane, and orthosilicic acid; And / or, the polyetheramine includes at least one of polyetheramine D230, polyetheramine D400 and polyetheramine D2000; And / or, the water-alcohol mixed solvent is composed of an alcohol solvent and water in a mass ratio of (1-5):1, wherein the alcohol solvent includes at least one of methanol, ethanol, isopropanol and n-propanol.

8. A polishing liquid, characterized in that, The polishing fluid includes silica particles according to any one of claims 1 to 4 or silica particles prepared by the method for preparing silica particles according to any one of claims 5 to 7.

9. A carrier, characterized in that, The carrier is obtained by calcining the silica particles according to any one of claims 1 to 4 or the silica particles prepared by the method according to any one of claims 5 to 7.

10. An adsorbent material, characterized in that, The adsorbent material is obtained by calcining silica particles according to any one of claims 1 to 4 or silica particles prepared by the method of any one of claims 5 to 7.

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